Multi-chip package structure and method of fabricating the same

Abstract

The application relates to the chip packaging technical field, in particular to a multi-chip packaging structure and a manufacturing method thereof, a substrate, the upper surface of the substrate is provided with a wiring layer; a support body is arranged on the substrate, the support body comprises at least two support surfaces, and the two support surfaces are arranged at a certain angle with each other; a flexible circuit board is fixed on the at least two support surfaces, and at least one end of the flexible circuit board extends to be electrically connected with the substrate; a plurality of chips are arranged on each support surface, and the chips are electrically connected with the flexible circuit board; and a protection structure covers the substrate and the plurality of chips.

Claims

1. A multi-chip packaging structure, characterized in that, include: A substrate, wherein a wiring layer is provided on the upper surface of the substrate; A support body is disposed on the substrate. The support body includes at least two support surfaces, which are arranged at a certain angle to each other. The support body is made of metal and is a hollow cavity, which is sealed with a cooling medium. A flexible circuit board is fixed to at least two of the support surfaces and at least one end of the flexible circuit board extends to be electrically connected to the substrate. Multiple chips, with at least one chip disposed on each support surface and the chips electrically connected to the flexible circuit board; as well as A protective structure covers the substrate and the plurality of chips.

2. The multi-chip packaging structure according to claim 1, characterized in that, The two opposite ends of the support are located outside the protective structure.

3. The multi-chip packaging structure according to claim 2, characterized in that, The protective structure is a metal shell or an encapsulating colloid.

4. The multi-chip packaging structure according to claim 1, characterized in that, The cross-section of the support is trapezoidal, triangular, or polygonal.

5. The multi-chip packaging structure according to claim 1, characterized in that, The flexible circuit board extends to its opposite ends and is fixed to the substrate.

6. The multi-chip packaging structure according to any one of claims 1-5, characterized in that, The lower surface of the substrate is provided with solder balls for wiring, and the solder balls of the substrate are connected to the wiring on the substrate through the internal circuitry of the substrate.

7. A method for fabricating a multi-chip package structure, characterized in that, include: A substrate is provided, wherein a wiring layer is disposed on the upper surface of the substrate; A flexible circuit board and multiple chips are provided, and the multiple chips are mounted on a preset position on the flexible circuit board; A support body is provided, the support body including at least two support surfaces, the two support surfaces being arranged at a certain angle to each other; the support body is made of metal and is a hollow cavity, the hollow cavity being sealed with a cooling medium, the flexible circuit board with the chip mounted is fixed on the support body and the flexible circuit board is electrically connected to the substrate, the chips on adjacent support surfaces are not coplanar; as well as A protective structure is provided to cover the substrate and the chip.

8. The method for fabricating a multi-chip package structure according to claim 7, characterized in that, The two opposite ends of the support are located outside the protective structure.

Images