Silicon wafer edge grinder

Abstract

The application discloses a silicon wafer edge grinding machine, and relates to the technical field of wafer processing. The application discloses a silicon wafer edge grinding machine, and relates to the technical field of wafer processing.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer processing, and more particularly relates to a silicon wafer edge grinding machine. Background Art

[0002] In the manufacturing process of some integrated circuits, it is necessary to grind and trim the edges of silicon wafers. Common silicon wafers are generally round, commonly known as wafers, and there are edge grinding equipment for wafers in the existing technology.

[0003] For example, CN111482865A discloses a wafer polishing device, in which the first shaft of the vacuum chuck shaft mechanism carries and drives the wafer to rotate, the pressing member of the pressing mechanism abuts against the wafer to press it against the first shaft, the positioning member of the positioning mechanism can perform secondary positioning on the wafer before the pressing mechanism performs the pressing operation, and the grinder of the grinding mechanism can move along the axial and radial directions of the first shaft; the wafer rotates under the drive of the first shaft, and the grinder moves along the radial direction of the first shaft to contact the edge of the wafer, thereby achieving edge grinding. It can be seen that this grinding device is suitable for edge grinding of round silicon wafers;

[0004] However, silicon wafers also come in square shapes, and some processes have related square products. Grinding equipment similar to the above cannot perform edge grinding on square silicon wafers. In practice, if two grinding equipment are to be set up for round silicon wafers and square silicon wafers respectively, the cost is relatively high. In addition, the output of square silicon wafers is relatively small, which will lead to low utilization of the grinding equipment used to grind square silicon wafers. Summary of the Invention

[0005] The main purpose of the present invention is to provide a silicon wafer edge grinding machine, which optimizes the driving module of the grinding device to make the equipment compatible with edge grinding of round silicon wafers and square silicon wafers.

[0006] According to a first aspect of the present invention, a silicon wafer edge grinding machine is provided, comprising a frame and a vacuum suction cup shaft mechanism, a clamping device, a positioning device and a grinding device arranged on the frame, wherein the vacuum suction cup shaft mechanism comprises a main shaft for carrying and driving the silicon wafer to rotate, the positioning device comprises a baffle located on the side of the main shaft and capable of moving close to or away from the main shaft, the clamping device presses the silicon wafer onto the main shaft, the grinding device comprises a grinding head located on the side of the main shaft, and the grinding device further comprises a first grinding drive module for driving the grinding head to move along the Z-axis direction, a second grinding drive module for driving the grinding head to move along the Y-axis direction, and a third grinding drive module for driving the grinding head to move along the X-axis direction.

[0007] In the above-mentioned silicon wafer edge grinding machine, the first grinding drive module, the second grinding drive module and the third grinding drive module are all linear modules.

[0008] In the above-mentioned silicon wafer edge grinding machine, the baffles are two arranged circumferentially around the main shaft;

[0009] The positioning device includes a positioning drive module corresponding to each baffle, and the positioning drive module drives the baffle to move linearly; the moving direction of one baffle is the X-axis direction, and the moving direction of the other baffle is the Y-axis direction.

[0010] In the above-mentioned silicon wafer edge grinding machine, a fixed block corresponding to the baffle is fixed on the frame, and the baffle is slidably fitted on the fixed block;

[0011] A top block is fixed on the fixed block, an adjusting screw is threadedly connected to the baffle, the adjusting screw is located on the side of the top block facing away from the main shaft, and the moving direction of the baffle is parallel to the axial direction of the adjusting screw provided on the baffle;

[0012] One end of the adjusting screw rod facing the top block is a touch end, and the touch end is used to contact the top block. The moving distance of the baffle is changed by adjusting the distance between the touch end and the top block.

[0013] In the above-mentioned silicon wafer edge grinding machine, the pressing device includes a pressing shaft, a base fixed to the frame, and a first pressing drive module provided on the base for driving the pressing shaft to rise and fall, and the pressing shaft is coaxially arranged with the main shaft;

[0014] The lower end of the pressing shaft is connected to a universal joint, and the end of the universal joint away from the pressing shaft is provided with an elastic pressing portion.

[0015] In the above-mentioned silicon wafer edge grinding machine, a mounting plate is slidably connected to the base, the mounting plate is connected to the first clamping drive module and the clamping shaft, and a first limiting portion is provided on the base. The first limiting portion is located below the mounting plate and is used to limit the downward movement of the mounting plate. The height of the first limiting portion is adjustable.

[0016] In the above-mentioned silicon wafer edge grinding machine, the first limiting part includes a first limiting screw, which is threadedly connected to the base, the axis of the first limiting screw is parallel to the axis of the clamping shaft, and the upper end of the first limiting screw is used to contact the mounting plate.

[0017] In the above-mentioned silicon wafer edge grinding machine, a second limiting portion is provided on the base, and the second limiting portion is located above the mounting plate and is used to limit the mounting plate from moving upward.

[0018] In the above-mentioned silicon wafer edge grinding machine, the second limiting part includes a second limiting screw, which is threadedly connected to the base, the axis of the second limiting screw is parallel to the axis of the clamping shaft, and the lower end of the second limiting screw is used to contact the mounting plate.

[0019] In the above-mentioned silicon wafer edge grinding machine, a second pressing drive module is provided on the mounting plate, the pressing shaft is connected to the output end of the second pressing drive module, and the second pressing drive module drives the pressing shaft to move up and down;

[0020] The stroke of the first pressing driving module is greater than the stroke of the second pressing driving module.

[0021] One of the above technical solutions of the present invention has at least one of the following advantages or beneficial effects:

[0022] In the present invention, the grinding head can move along the Z-axis direction under the drive of the first grinding drive module, can move along the Y-axis direction under the drive of the second grinding drive module, and can move along the X-axis direction under the drive of the third grinding drive module, so that the grinding head is more flexible. Even if a square silicon wafer is encountered, the grinding head can grind the side of the square silicon wafer with the cooperation of the second grinding drive module and the third grinding drive module, and then with the rotation of the main shaft, the four sides of the square silicon wafer can be grinded in turn. Based on this, the edge grinding machine can be compatible with the grinding of round silicon wafers and square silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0024] Figure 1 is a schematic structural diagram of a first embodiment of the present invention;

[0025] Figure 2 is a schematic structural diagram of a positioning device according to a first embodiment of the present invention;

[0026] Figure 3 is another structural schematic diagram of the positioning device according to the first embodiment of the present invention;

[0027] Figure 4 The first embodiment of the present invention Figure 3 A partial enlarged view of A;

[0028] Figure 5 is a top view of the positioning device of the first embodiment of the present invention when in use;

[0029] Figure 6 is a schematic structural diagram of a pressing device according to a first embodiment of the present invention;

[0030] Figure 7 is a left side view of the pressing device of the first embodiment of the present invention;

[0031] Figure 8 is a right side view of the pressing device of the first embodiment of the present invention;

[0032] Figure 9 is a schematic structural diagram of a grinding device according to a first embodiment of the present invention;

[0033] Figure 10 2 is a schematic structural diagram of a grinding head according to a first embodiment of the present invention.

[0034] Among them, the figure numbers of the figures are:

[0035] 1. Frame;

[0036] 2. Vacuum suction cup shaft mechanism; 21. Spindle;

[0037] 3. Clamping device; 31. Clamping shaft; 313. Universal joint; 32. Base; 33. First clamping drive module; 34. Mounting plate; 35. Second guide rail assembly; 36. Second clamping drive module; 37. First limiter; 38. First buffer; 39. Second limiter; 40. Second buffer;

[0038] 4. Positioning device; 41. Baffle; 411. First plate; 412. Second plate; 413. Threaded hole; 414. Through hole; 42. Positioning drive module; 43. Fixing block; 44. Top block; 45. Adjusting screw; 46. First guide rail assembly;

[0039] 5. Grinding device; 51. Grinding head; 511. Rotary drive motor; 512. Grinding wheel; 513. Machine head fixed seat; 514. Machine head movable seat; 515. Cooling water pipe; 52. First grinding drive module; 53. Second grinding drive module; 54. Third grinding drive module. DETAILED DESCRIPTION

[0040] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0041] The following disclosure provides many different embodiments or examples for implementing different solutions of the present invention.

[0042] Reference Figures 1 to 10 As shown, in one embodiment of the present invention, a silicon wafer edge grinding machine includes a frame 1 and a vacuum suction cup shaft mechanism 2, a pressing device 3, a positioning device 4 and a grinding device 5 arranged on the frame 1;

[0043] The vacuum suction cup shaft mechanism 2 includes a main shaft 21, which is provided with a negative pressure chamber and a rotating air guide device. The free end of the main shaft 21 is provided with an elastic contact component. The silicon wafer is placed on the contact component of the main shaft 21. The negative pressure chamber and the rotating air guide device are used to allow the main shaft 21 to adsorb the silicon wafer, and then the motor is used to drive the main shaft 21 to rotate, thereby driving the silicon wafer to rotate. The specific structure of the vacuum suction cup shaft mechanism 2 can be referred to patent CN211828704U, and this embodiment will not be repeated here; in this embodiment, the axial direction of the main shaft 21 is the Z-axis direction.

[0044] Reference Figures 2 to 5 The positioning device 4 includes a baffle 41 and a positioning drive module 42 corresponding to the baffle 41. The positioning drive module 42 drives the baffle 41 to move linearly. There are two baffles 41 arranged circumferentially around the main shaft 21. The movement direction of one baffle 41 is the X-axis direction, and the movement direction of the other baffle 41 is the Y-axis direction.

[0045] If the positioning drive module 42 drives the baffle 41 to approach the spindle 21, the baffle 41 is in an extended state after it is in place; if the positioning drive module 42 drives the baffle 41 away from the spindle 21, the baffle 41 is in a retracted state after it is in place;

[0046] Before polishing, when the baffle 41 is in the extended state, the distance from the position where the baffle 41 contacts the silicon wafer to the axis of the spindle 21 is set according to the size of the silicon wafer; before placing the silicon wafer, the baffle 41 is first in the retracted state. After placing the silicon wafer, the baffle 41 moves under the drive of the positioning drive module 42, gradually approaching the spindle 21, so that the baffle 41 tends to be extended. After the baffle 41 contacts the outer wall of the silicon wafer, it will push the silicon wafer to move. When both baffles 41 are in the extended state, the distance is determined at this time, and the silicon wafer is just coaxial with the spindle 21, completing the positioning, and then both baffles 41 will retract; one baffle 41 is positioned in the X-axis direction and the other is positioned in the Y-axis direction, which can be suitable for positioning round silicon wafers and square silicon wafers.

[0047] In this embodiment, a fixing block 43 corresponding to the baffle 41 is fixed to the frame 1, and the baffle 41 is slidably fitted on the fixing block 43; a top block 44 is fixed to the fixing block 43, and an adjusting screw 45 is threadedly connected to the baffle 41. The adjusting screw 45 is located on the side of the top block 44 facing away from the main shaft 21, and the moving direction of the baffle 41 is parallel to the axial direction of the adjusting screw 45 provided on the baffle 41; the end of the adjusting screw 45 facing the top block 44 is a contact end, which is used to contact the top block 44;

[0048] The positioning drive module 42 drives the baffle 41 to extend, and the adjusting screw 45 is located on the baffle 41 and moves with the baffle 41. When the contact end of the adjusting screw 45 is pressed against the top block 44, the baffle 41 stops moving. At this time, the baffle 41 is in the extended state, and the distance from the position where the baffle 41 contacts the silicon wafer to the axis of the spindle 21 is the preset distance.

[0049] Based on this, it can be seen that when the baffle 41 is in the retracted state, the distance between the contact end of the adjusting screw 45 and the top block 44 is the moving distance of the baffle 41. By adjusting the distance between the contact end and the top block 44, the moving distance of the baffle 41 can be changed, thereby changing the preset distance.

[0050] In practice, before polishing the same batch of silicon wafers, one of the silicon wafers in this batch can be used to determine the preset distance; the silicon wafer is placed on the main shaft 21, and then the adjusting screw 45 is adjusted to set the preset distance until the baffle 41 is in the extended state, and the silicon wafer can be coaxial with the main shaft 21, and it is determined that the preset distance is appropriate. Then, there is no need to adjust the adjusting screw 45 for this batch of silicon wafers, and the positioning device 4 can be directly used.

[0051] In this embodiment, a fixed sleeve corresponding to the adjusting screw 45 is provided on the baffle 41, and a movable sleeve is rotatably provided on the fixed sleeve. The adjusting screw 45 is inserted in the fixed sleeve, and an adjusting nut matching the adjusting screw 45 is provided in the movable sleeve. The adjusting nut can be rotated by rotating the movable sleeve, and the adjusting nut then drives the adjusting screw 45 to extend and retract, allowing the adjusting screw 45 to move along its axial direction; the connection structure of the adjusting screw 45 is similar to that of a micrometer. Using a higher-precision adjusting screw 45 can achieve precise adjustment, making the preset distance more accurate and the positioning effect better.

[0052] In this embodiment, a first guide rail assembly 46 is provided on the fixing block 43 , and the baffle 41 is slidably connected to the first guide rail assembly 46 .

[0053] In this embodiment, the baffle 41 includes a first plate 411 and a second plate 412 arranged in sequence along its moving direction. The first plate 411 is detachably fixed to the second plate 412. The first plate 411 is used to contact the silicon wafer, and the second plate 412 is connected to the first guide rail assembly 46.

[0054] The positioning drive module 42 is a cylinder, which is fixed on the fixed block 43. A connecting plate is provided on the second plate 412. The piston rod of the cylinder is fixedly connected to the connecting plate. Driven by an external air source, the cylinder allows the piston rod to extend and retract, thereby allowing the second plate 412 to slide. The second plate 412 then brings the first plate 411 closer to or away from the main shaft 21.

[0055] In some other embodiments, the positioning drive module 42 may be an electric cylinder or a hydraulic cylinder.

[0056] In this embodiment, a plurality of threaded holes 413 are arranged at intervals on the first plate 411 along the moving direction of the baffle 41, and a plurality of through holes 414 are arranged at intervals on the second plate 412 along the moving direction of the baffle 41. Bolts are passed through the through holes 414 and threadedly connected to the threaded holes 413 to fix the first plate 411 to the second plate 412; the through holes 414 and the threaded holes 413 at different positions cooperate to change the position of the first plate 411 on the second plate 412, so that the first plate 411 is closer to the main shaft 21 or farther away from the main shaft 21; this adjustment is suitable for the positioning of silicon wafers of different sizes, and the preset distance that needs to be adjusted is relatively large, while the adjusting screw 45 is suitable for fine-tuning in a small range, such as adjusting the preset distance of silicon wafers of the same specification but different batches.

[0057] In some other embodiments, the first plate 411 can be connected to the second plate 412 by snapping, and the position of the first plate 411 on the second plate 412 can be adjusted by setting different snapping positions; or, the first plate 411 can be connected to the second plate 412 by magnetic attraction, and the position of the first plate 411 on the second plate 412 can be controlled by setting different adsorption positions.

[0058] In this embodiment, the first plate 411 includes a horizontal section and a vertical section constructed in an L shape, the threaded hole 413 is set on the horizontal section, and the vertical section is located at the end of the horizontal section facing the main shaft 21; the vertical section has a larger area, which is convenient for contact with the silicon wafer.

[0059] Reference Figures 6 to 8 The pressing device 3 includes a pressing shaft 31, a base 32 fixed to the frame 1, and a first pressing drive module 33 provided on the base 32 for driving the pressing shaft 31 to move up and down. The pressing shaft 31 is coaxially arranged with the main shaft 21. The lower end of the pressing shaft 31 is connected to a universal joint 313, and the end of the universal joint 313 away from the pressing shaft 31 has an elastic pressing portion.

[0060] When the silicon wafer needs to be pressed, the pressing shaft 31 descends under the drive of the first pressing drive module 33, and the universal joint 313 moves down synchronously with the pressing shaft 31, and the elastic pressing part of the universal joint 313 can be pressed onto the silicon wafer; based on the characteristics of the universal joint 313, the pressing of the elastic pressing part will not interfere with the rotation of the silicon wafer, and the silicon wafer can rotate with the main shaft 21 without separating from the main shaft 21, and the elastic pressing part has elastic properties, and will not scratch the surface of the silicon wafer when pressing, and will not produce pressing marks on the surface of the silicon wafer; because it is a universal joint 313, after the elastic pressing part presses the silicon wafer, the silicon wafer can be slightly shaken, and when the silicon wafer is impacted by the grinding wheel 512, it can be slightly shaken to buffer, thereby reducing the chance of the silicon wafer edge being broken.

[0061] The universal joint 313 is a ball head universal joint, which includes a steering head and an outer sleeve. One end of the steering head is fixedly connected to the clamping shaft 31, and the other end of the steering head is a ball head. A spherical inner cavity is provided in the outer sleeve, and the spherical inner cavity cooperates with the ball head to enable the outer sleeve to rotate and shake; the elastic body pressing part can be set on the outer sleeve, or the outer sleeve can directly serve as the elastic body pressing part.

[0062] In this embodiment, the elastic pressing portion is a wear-resistant silicone pressing portion.

[0063] In this embodiment, a mounting plate 34 is slidably connected to the base 32, and a second guide rail assembly 35 is provided on the base 32. The mounting plate 34 and the second guide rail assembly 35 are slidably matched; the output end of the first clamping drive module 33 is connected to the mounting plate 34, thereby driving the mounting plate 34 to move up and down; a second clamping drive module 36 is provided on the mounting plate 34, and the clamping shaft 31 is connected to the output end of the second clamping drive module 36. The second clamping drive module 36 drives the clamping shaft 31 to move up and down; the stroke of the first clamping drive module 33 is greater than the stroke of the second clamping drive module 36;

[0064] That is to say, the first clamping drive module 33 has a large stroke and a fast speed. The main purpose of the first clamping drive module 33 is to make the clamping shaft 31 close to the silicon wafer, but will not let the elastic pressing part contact the silicon wafer; while the second clamping drive module 36 has a small stroke and a slow speed. The second clamping drive module 36 will let the elastic pressing part contact the silicon wafer and clamp it, so as to avoid the silicon wafer from being subjected to strong impact.

[0065] In this embodiment, the first pressing driving module 33 and the second pressing driving module 36 are both cylinders.

[0066] In some other embodiments, the first pressing drive module 33 and the second pressing drive module 36 may also be electric cylinders or hydraulic cylinders.

[0067] In this embodiment, a first stopper 37 is provided on the base 32. The first stopper 37 is located below the mounting plate 34 and is used to limit the downward movement of the mounting plate 34. The height of the first stopper 37 is adjustable. When the mounting plate 34 moves downward and contacts the first stopper 37, it stops moving. By adjusting the height of the first stopper 37, the downward movement distance of the mounting plate 34 can be adjusted, thereby changing the downward movement distance of the elastic pressing portion. In addition, the elastic pressing portion has elastic properties, so the pressing force of the elastic pressing portion when pressing the silicon wafer can be changed, so that silicon wafers of different thicknesses can be accommodated.

[0068] The first limiting portion 37 includes a first limiting screw, which is threadedly connected to the base 32. The axis of the first limiting screw is parallel to the axis of the pressing shaft 31. The upper end of the first limiting screw is used to contact the mounting plate 34. When the mounting plate 34 moves downward and touches the upper end of the first limiting screw, it stops moving. By rotating the first limiting screw, the height of the upper end of the first limiting screw can be adjusted, thereby changing the downward movement distance of the mounting plate 34.

[0069] In addition, a first buffer 38 is provided on the base 32, and the first buffer 38 is located below the mounting plate 34; when the first buffer 38 is not pressurized, the upper end of the first buffer 38 is higher than the upper end of the first limit screw, and the distance between the upper end of the first buffer 38 and the upper end of the first limit screw is less than the stroke of the first buffer 38; when the mounting plate 34 moves downward, it will first touch the upper end of the first buffer 38, slowing down the descending speed, and then pressing against the upper end of the first limit screw, and the mounting plate 34 will not violently collide with the first limit screw.

[0070] In this embodiment, a second limiting portion 39 is provided on the base 32 , and the second limiting portion 39 is located above the mounting plate 34 ;

[0071] The second limiting portion 39 includes a second limiting screw, which is threadedly connected to the base 32. The axis of the second limiting screw is parallel to the axis of the pressing shaft 31, and the lower end of the second limiting screw is used to contact the mounting plate 34. When the mounting plate 34 moves upward and touches the lower end of the second limiting screw, it stops moving. By rotating the second limiting screw, the height of the lower end of the second limiting screw can be adjusted, thereby changing the upward limit of the mounting plate 34. The upper end of the first limiting screw cooperates with the lower end of the second limiting screw to limit the movement range of the mounting plate 34, which can prevent the slider of the second guide rail assembly 35 from directly hitting the base 32.

[0072] Similarly, a second buffer 40 is provided on the base 32, and the second buffer 40 is located above the mounting plate 34; when the second buffer 40 is not under pressure, the lower end of the second buffer 40 is lower than the lower end of the second limit screw, and the distance between the lower end of the second buffer 40 and the lower end of the second limit screw is less than the stroke of the second buffer 40; when the mounting plate 34 moves upward, it will first touch the lower end of the second buffer 40, slow down the rising speed, and then press against the lower end of the second limit screw, and the mounting plate 34 will not violently collide with the second limit screw.

[0073] In this embodiment, the first buffer 38 and the second buffer 40 are both spring buffers.

[0074] Reference Figure 9 and Figure 10 The grinding device 5 includes a grinding head 51 located on the side of the main shaft 21, a first grinding drive module 52 that drives the grinding head 51 to move along the Z-axis direction, a second grinding drive module 53 that drives the grinding head 51 to move along the Y-axis direction, and a third grinding drive module 54 that drives the grinding head 51 to move along the X-axis direction; the grinding head 51 includes a base, a rotary drive motor 511 provided on the base, and a grinding wheel 512 provided on the motor shaft of the rotary drive motor 511; the grinding wheel 512 can rotate under the drive of the rotary drive motor 511, and the grinding wheel 512 performs a grinding operation after contacting the edge of the silicon wafer;

[0075] The grinding wheel 512 can move in three directions, which is more flexible. Even if it encounters a square silicon wafer, the grinding wheel 512 can grind the side of the square silicon wafer with the cooperation of the second grinding drive module 53 and the third grinding drive module 54. Then, with the rotation of the main shaft 21, the four sides of the square silicon wafer can be grinded in turn. Based on this, the edge grinding machine can be compatible with the grinding of round silicon wafers and square silicon wafers.

[0076] In this embodiment, the X-axis direction and the Y-axis direction are parallel to the radial direction of the main axis 21;

[0077] When the silicon wafer is square, the external manipulator places the square silicon wafer on the main shaft 21, and the two baffles 41 extend out and contact the two adjacent sides of the square silicon wafer to position the square silicon wafer. After the positioning is completed, the main shaft 21 absorbs the square silicon wafer, and the elastic body pressing part presses the square silicon wafer. Then the baffle 41 will retract to avoid affecting the rotation of the square silicon wafer; the length and width directions of the positioned square silicon wafer are in the X-axis direction and the Y-axis direction respectively. The grinding wheel 512 first approaches the square silicon wafer under the drive of the third grinding drive module 54 until it contacts the side of the square silicon wafer for grinding. Then, the grinding wheel 512 is driven by the second grinding drive module 53. It moves along the length direction of the side of the square silicon wafer to grind the entire side; at the same time, the grinding wheel 512 moves back and forth along the Z-axis direction under the drive of the first grinding drive module 52 to balance the wear of the outer peripheral surface of the grinding wheel 512 and ensure the grinding accuracy. The up and down movement of the grinding wheel 512 will cause the square silicon wafer to be subjected to axial force, and the setting of the universal joint 313 allows the square silicon wafer to be slightly tilted up and down, cushioning the impact caused by the up and down movement of the grinding wheel 512 and reducing the chance of the edge of the square silicon wafer being broken; after completing the grinding of one side, the square silicon wafer changes its orientation under the rotation of the main shaft 21 and grinds the other side, thereby completing the edge grinding of the square silicon wafer.

[0078] When the silicon wafer is circular, the positioning and pressing steps are the same, but the grinding steps are different: the grinding wheel 512 is first driven by the third grinding drive module 54 to approach the circular silicon wafer until it contacts the outer periphery of the circular silicon wafer for grinding. Then, the grinding wheel 512 is driven by the first grinding drive module 52 to reciprocate along the Z-axis direction, and the spindle 21 will continue to rotate with the circular silicon wafer to complete the edge grinding of the running silicon wafer; since the initial grinding amount is large, the wear on the grinding wheel 512 is also relatively large. Since the grinding wheel 512 can move in three directions, the initial contact position of the grinding wheel 512 and the circular silicon wafer can be changed, thereby extending the service life of the grinding wheel 512.

[0079] In this embodiment, the first polishing drive module 52, the second polishing drive module 53 and the third polishing drive module 54 are all linear modules; more specifically, the linear modules are ball screw linear modules;

[0080] The base body is arranged on the first grinding drive module 52. Under the drive of the first grinding drive module 52, the base body moves up and down, thereby driving the grinding wheel 512 to move along the Z-axis direction; the first grinding drive module 52 is arranged on the second grinding drive module 53. Under the drive of the second grinding drive module 53, the entire first grinding drive module 52 can move along the Y-axis direction, thereby allowing the grinding wheel 512 to move along the Y-axis direction; the second grinding drive module 53 is arranged on the third grinding drive module 54. Under the drive of the third grinding drive module 54, the entire second grinding drive module 53 can move along the X-axis direction, thereby allowing the grinding wheel 512 to move along the X-axis direction.

[0081] In this embodiment, the base body includes a head fixing base 513 and a head movable base 514. The head fixing base 513 is connected to the first grinding drive module 52. The head movable base 514 is hinged on the head fixing base 513 so that the head movable base 514 can be flipped upward. The rotary drive motor 511 is fixed to the head movable base 514. When the grinding wheel 512 needs to be replaced, the head movable base 514 can be flipped to allow the grinding wheel 512 to be tilted for easy replacement. In normal grinding operations, the head movable base 514 can be locked to the head fixing base 513 using fasteners such as pins and bolts to prevent the grinding wheel 512 from shaking during grinding.

[0082] At the same time, a cooling water pipe 515 can be provided on the movable seat 514 of the machine head. During grinding, the cooling water pipe 515 can spray coolant to cool the grinding wheel 512 and prevent dust generated during grinding from flying.

[0083] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A silicon wafer edge grinding machine, comprising a frame and a vacuum suction cup shaft mechanism, a clamping device, a positioning device, and a grinding device arranged on the frame, wherein the vacuum suction cup shaft mechanism comprises a main shaft for carrying and driving the silicon wafer to rotate, the positioning device comprises a baffle located on the side of the main shaft and capable of moving toward or away from the main shaft, the clamping device presses the silicon wafer against the main shaft, and the grinding device comprises a grinding head located on the side of the main shaft, characterized in that: The polishing device further includes a first polishing drive module for driving the polishing head to move along the Z-axis direction, a second polishing drive module for driving the polishing head to move along the Y-axis direction, and a third polishing drive module for driving the polishing head to move along the X-axis direction; There are two baffles arranged circumferentially around the main shaft; The positioning device includes a positioning drive module corresponding to each baffle, and the positioning drive module drives the baffle to move linearly; the movement direction of one baffle is the X-axis direction, and the movement direction of the other baffle is the Y-axis direction; The frame is fixed with fixed blocks corresponding to the baffles one by one, and the baffles are slidably fitted on the fixed blocks; A top block is fixed on the fixed block, an adjusting screw is threadedly connected to the baffle, the adjusting screw is located on the side of the top block facing away from the main shaft, and the moving direction of the baffle is parallel to the axial direction of the adjusting screw provided on the baffle; The end of the adjusting screw facing the top block is a touch end, and the touch end is used to contact the top block. The moving distance of the baffle is changed by adjusting the distance between the touch end and the top block. The clamping device includes a clamping shaft, a base fixed on the frame, and a first clamping drive module arranged on the base for driving the clamping shaft to rise and fall, and the clamping shaft is coaxially arranged with the main shaft; The lower end of the pressing shaft is connected to a universal joint, and the end of the universal joint away from the pressing shaft is provided with an elastic pressing portion.

2. The silicon wafer edge grinding machine according to claim 1, characterized in that: The first polishing drive module, the second polishing drive module and the third polishing drive module are all linear modules.

3. The silicon wafer edge grinding machine according to claim 1, characterized in that: A mounting plate is slidably connected to the base, and the mounting plate is connected to the first clamping drive module and the clamping shaft. A first limiting portion is provided on the base, and the first limiting portion is located below the mounting plate and is used to limit the downward movement of the mounting plate. The height of the first limiting portion is adjustable.

4. The silicon wafer edge grinding machine according to claim 3, characterized in that: The first limiting portion includes a first limiting screw, which is threadedly connected to the base. The axis of the first limiting screw is parallel to the axis of the pressing shaft, and the upper end of the first limiting screw is used to contact the mounting plate.

5. The silicon wafer edge grinding machine according to claim 3, characterized in that: The base is provided with a second limiting portion, which is located above the mounting plate and is used to limit the mounting plate from moving upward.

6. The silicon wafer edge grinding machine according to claim 5, characterized in that: The second limiting portion includes a second limiting screw, which is threadedly connected to the base. The axis of the second limiting screw is parallel to the axis of the pressing shaft, and the lower end of the second limiting screw is used to contact the mounting plate.

7. The silicon wafer edge grinding machine according to claim 3, characterized in that: A second pressing drive module is provided on the mounting plate, the pressing shaft is connected to the output end of the second pressing drive module, and the second pressing drive module drives the pressing shaft to move up and down; The stroke of the first pressing driving module is greater than the stroke of the second pressing driving module.

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