Detection device and detection method

Abstract

The application discloses a detection device and a detection method. The detection device comprises a substrate including a first end and a second end arranged oppositely, wherein the first end includes a plurality of first pads, the first pads are electrically connected with a circuit board, the circuit board includes a flash memory chip; the second end includes a plurality of second pads, the second pads are electrically connected with a display panel; the first pads and the second pads are electrically connected one by one through signal lines; a side of the signal lines away from the substrate includes a plurality of detection points, the detection points at least include a flash memory detection point and a voltage detection point; in a direction perpendicular to a plane where the display panel is located, the detection points and the signal lines at least partially overlap. The application can realize detection on a circuit board functional defect, and improve the yield of the circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, more particularly, to a detection device and a detection method. BACKGROUND

[0002] With the development of electronic technology, display panel manufacturing is also becoming mature, and the display panel provided by the prior art includes a liquid crystal display panel, an organic light emitting display panel, a plasma display panel, etc. As a current light emitting device, an organic light emitting diode has been increasingly applied to high-performance display, and an OLED display panel has many excellent characteristics such as self-luminescence, wide viewing angle, fast response speed, high contrast, wide color gamut, low energy consumption, thin panel, rich colors, flexible display, wide working temperature range, etc., and is therefore known as the next-generation "star" flat panel display technology. The OLED display panel includes an anode and a cathode, and a hole transport layer, an organic light emitting layer and an electron transport layer arranged between the anode and the cathode, the anode provides hole injection, the cathode provides electron injection, and under the driving of an external voltage, holes and electrons injected from the cathode and the anode recombine in the organic light emitting layer to form an electron-hole pair (i.e. an exciton) at a bound energy level, the exciton radiatively de-excites to emit a photon, and visible light is generated.

[0003] Mura refers to in-plane brightness non-uniformity of a display panel, which causes various trace phenomena. The cause of Mura is that, due to the fact that the light emitting material of the light emitting device in the display panel is made of etc., when the same voltage is provided for the light emitting device, different currents are generated, and the difference in brightness of different light emitting devices is reflected, the greater the difference, the more serious the Mura, and the smaller the difference, the smaller the Mura. At present, in view of this problem, compensation can be performed by Demura, the brightness of a pixel point is corrected by a gray scale compensation manner, and then the Mura phenomenon is improved. Usually, the gamma value and the Demura data are stored in a flash memory chip, and when Demura compensation is performed, the display driving chip of the display panel retrieves compensation data from the flash memory chip, and the flash memory chip is bound on a circuit board, but the size of the circuit board is too small, and there is no position to set a detection point. If the flash memory chip has a defective piece or the flash memory chip has a functional defect, it cannot be detected, and the display module cannot be normally displayed.

[0004] Therefore, it is urgent to provide a detection device and a detection method capable of detecting whether a flash memory chip has a defective piece or the flash memory chip has a functional defect. SUMMARY

[0005] Therefore, the present application provides a detection device and a detection method for detecting whether a flash memory chip has a defective piece or the flash memory chip has a functional defect.

[0006] In one aspect, the present application discloses a detection device, comprising a substrate, the substrate comprising a first end and a second end arranged oppositely, wherein,

[0007] The first end comprises a plurality of first pads, and the first pads are electrically connected with a circuit board;

[0008] The second end comprises a plurality of second pads, and the second pads are electrically connected with a display panel;

[0009] The first pads and the second pads are electrically connected one by one through signal lines;

[0010] The signal lines away from the substrate side comprise a plurality of detection points, and the detection points at least comprise a flash memory detection point and a voltage detection point;

[0011] In a direction perpendicular to a plane where the display panel is located, the detection points and the signal lines at least partially overlap.

[0012] In another aspect, the present application further discloses a detection method of a detection device, the detection device being electrically connected with a circuit board and a display panel respectively, the detection device comprising a plurality of detection points, the detection points at least comprising a serial peripheral interface, a flash memory detection point and a voltage detection point, and the circuit board comprising a flash memory chip;

[0013] The detection method comprises:

[0014] A binding step, comprising binding the circuit board and the detection device, and simultaneously binding the display panel and the detection device;

[0015] A code burning step, comprising burning a first code and a second code into the flash memory chip through the detection points, the first code comprising a gamma value code and an optical compensation value code, and the second code comprising a voltage code, the voltage code comprising a chip working voltage code and a display panel working voltage code;

[0016] A detection step, comprising signal transmission between the circuit board and the display panel, external power supply of the detection device, detection of the detection points, and detection that a difference between a detection code and the first code and the second code is within a preset range, and that the flash memory chip reads and writes normally.

[0017] Compared with the prior art, the detection device and the detection method provided by the present application at least achieve the following beneficial effects:

[0018] The application provides a detection device, which is electrically connected with a circuit board and a display panel as an intermediate switching structure, and comprises a substrate, the substrate comprises a first end and a second end, the first end comprises a first solder pad, the second end comprises a second solder pad, the first solder pad and the second solder pad are electrically connected in one-to-one correspondence through a signal line, the first solder pad is electrically connected with the circuit board, and the second solder pad is electrically connected with the display panel; a detection point is arranged on a side of the signal line away from the substrate, and the detection point and the signal line at least partially overlap in a direction perpendicular to a plane where the substrate is located, so that the detection point does not need to be arranged on the circuit board, and the problem that the detection point cannot be arranged due to the small area of the circuit board is solved; in the application, the detection point and the signal line at least partially overlap in the direction perpendicular to the plane where the substrate is located, and the detection can be realized by only penetrating the detection point and the signal line with a probe to electrically connect them, so that the detection method is simple and easy to operate; the detection point at least comprises a flash memory detection point and a voltage detection point, whether the flash memory chip in the circuit board is normally assembled is detected by detecting a first code required by the flash memory chip in a read-write process and a voltage code required by the flash memory chip for normal work, and whether the flash memory chip has a functional defect can also be detected.

[0019] Of course, any product implementing the present application does not necessarily need to achieve all the technical effects described above.

[0020] Other features of the present application, and their advantages, will become apparent from the following detailed description of exemplary embodiments of the application with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0022] Figure 1 is a planar structural schematic view of a detection device provided by the application;

[0023] Figure 2 is a split structural schematic view of a detection device provided by the application;

[0024] Figure 3 is Figure 2 is a sectional view in the A-A' direction of the application;

[0025] Figure 4 is Figure 1 is a sectional view in the B-B' direction of the application;

[0026] Figure 5 is Figure 1 is another sectional view in the B-B' direction of the application;

[0027] Figure 6 is a planar structural schematic view of another detection device provided by the application;

[0028] Figure 7 is a disassembled structure diagram of another detection device provided by the present application;

[0029] Figure 8 is a flow chart of a detection method of a detection device provided by the present application;

[0030] Figure 9 is a flow chart of a detection method of another detection device provided by the present application;

[0031] Figure 10 is a plan structure diagram of another detection device provided by the present application;

[0032] Figure 11 is a flow chart of a detection method of another detection device provided by the present application;

[0033] Figure 12 is a plan structure diagram of another detection device provided by the present application. DETAILED DESCRIPTION

[0034] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions, and numerical values set forth in these embodiments are not limiting to the scope of the present application unless specifically stated otherwise.

[0035] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the scope of the application its application or uses.

[0036] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and apparatus can be considered as part of the description of the present application.

[0037] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments can have different values.

[0038] It should be noted that like reference numerals and letters refer to like items in the following drawings, and thus, once an item is defined in one drawing, it need not be discussed further in subsequent drawings.

[0039] In view of the fact that the size of the circuit board in the related art is too small, there is no position to set a detection point to detect the flash memory chip, and if the flash memory chip has a defective part or the flash memory chip has a functional defect, it cannot be detected, resulting in the display module being unable to display normally, the present application provides a detection device to solve this problem.

[0040] Referring toFigure 1 、 Figure 2 and Figure 3 , Figure 1 is a schematic diagram of a planar structure of a detection device provided by the present application, Figure 2 is a schematic diagram of a split structure of a detection device provided by the present application, Figure 3 is Figure 2 A-A' direction. As shown in Figures 1 to 3 , the present application provides a detection device 100, comprising a substrate 1000, the substrate 1000 comprising a first end and a second end arranged oppositely, the first end comprising a plurality of first pads 10, the first pads 10 being electrically connected with a circuit board 200, the circuit board 200 comprising a flash memory chip 2001; the second end comprising a plurality of second pads 20, the second pads 20 being electrically connected with a display panel 300; the first pads 10 and the second pads 20 being electrically connected one by one through a signal line 30; the signal line 30 comprising a plurality of detection points 40 on the side away from the substrate 1000, the detection points 40 comprising at least a flash memory detection point 401 and a voltage detection point 402; in the direction perpendicular to the plane where the substrate 1000 is located, the detection points 40 at least partially overlap with the signal line 30.

[0041] Specifically, the display panel 300 can be a liquid crystal display panel, an organic self-luminous display panel, or a micro light-emitting diode display panel, which is not limited here, Figure 1 and Figure 2 only an organic self-luminous display panel with a substrate 1000 of flexible material is taken as an example for illustrative description. The display panel 300 comprises a display area AA and a non-display area BB at least partially surrounding the display area AA, Figure 1 and Figure 2 only a case where the non-display area BB completely surrounds the display area AA is taken as an example, and the non-display area BB can also partially surround the display area AA, for example, a water-drop screen, which is not limited here.

[0042] It can be understood that the display panel 300 is bound with a display driving chip 60 (Display Driver IC, referred to as "DDIC" for short), which is one of the main control elements of the display panel 300, also known as the "brain" of the display panel 300, and its main function is to send driving signals and data to the display panel 300 in the form of electrical signals, and through the control of screen brightness and color, image information such as letters, pictures, etc. can be presented on the screen.

[0043] The detection device 100 comprises a substrate 1000, a first pad 10 and a second pad 20 are arranged on one side of the substrate 1000, and a signal line 30 is arranged between the first pad 10 and the second pad 20. It can be understood that the first pad 10, the signal line 30 and the second pad 20 are in the same layer. On the one hand, the first pad 10 and the signal line 30 are in the same layer, and at the same time, the second pad 20 and the signal line 30 are in the same layer. Compared with the first pad 10 and the signal line 30 distributed in different layers and needing a via to realize electrical connection, and the second pad 20 and the signal line 30 distributed in different layers and needing a via to realize electrical connection, the thickness of the detection device 100 is reduced, and the difficulty of manufacturing the detection device 100 is also reduced.

[0044] In some optional embodiments, the first pad 10, the signal line 30 and the second pad 20 can be of the same metal material, Figures 1 to 3 In the above embodiment, different patterns are filled in the first pad 10, the signal line 30 and the second pad 20, which are only used for distinguishing and illustrating, and are not used for limiting the materials. The first pad 10, the signal line 30 and the second pad 20 can be of the same metal material, so that the manufacturing difficulty is reduced. In the same process, the first pad 10, the signal line 30 and the second pad 20 can be formed by only patterning the metal layer. For example, a metal layer is formed on one side of the substrate 1000, and the first pad 10, the signal line 30 and the second pad 20 are formed by patterning, exposure and development. Of course, the manufacturing process of the first pad 10, the signal line 30 and the second pad 20 is not limited here. As long as the first pad 10, the signal line 30 and the second pad 20 which can transmit signals can be formed on one side of the substrate 1000.

[0045] It should be noted that the signal line 30 is different according to the different signals to be transmitted. Of course, the signals transmitted can also be indicated by the width of the signal line 30, or the signals transmitted can be indicated by marking the signal line 30. The arrangement and wiring of the signal line 30 are not limited in the present application.

[0046] Of course, the insulating layer 1001 also needs to be manufactured on the side of the signal line 30 away from the substrate 1000, Figure 3 In the above embodiment, the insulating layer 1001 is not patterned. The insulating layer 1001 can ensure safety and prevent electric leakage caused by touching the signal line 30 during use, thereby preventing the detection voltage from being inaccurate.

[0047] In some optional embodiments, silicon nitride or silicon oxide can be used to manufacture the insulating layer 1001. Silicon nitride or silicon oxide is a transparent material, which will not affect the arrangement of the detection point 40 on the side of the signal line 30 away from the substrate 1000, so as to ensure that the detection point 40 and the signal line 30 at least partially overlap in the orthogonal projection of the substrate 1000.

[0048] The side of the signal line 30 away from the substrate 1000 in the embodiment includes a plurality of detection points 40, the detection points 40 at least include a flash memory detection point 401 and a voltage detection point 402, in the direction perpendicular to the plane where the substrate 1000 is located, the detection points 40 at least partially overlap with the signal line 30, here the detection points 40 refer to the connecting holes where the probes (not shown in the figure) are penetrated through the insulating layer 1001 and stuck on the signal line 30 in the detection process, such as Figure 3 The opening hole penetrated through the insulating layer 1001, of course, the position of the detection points 40 on the signal line 30 is not specifically limited here, as long as it can ensure that the detection points 40 at least partially overlap with the signal line 30 in the direction perpendicular to the plane where the substrate 1000 is located, when the detection is carried out, the probes are penetrated through the opening hole of the insulating layer 1001 and are electrically connected with the signal line 30, that is, the electrical signal on the signal line 30 can be read. The detection points 40 in the embodiment include the flash memory detection point 401 and the voltage detection point 402, the flash memory chip 2001 cannot be detected in the related art, so the flash memory detection point 401 is not included in the detection points 40 generally. Compared with the related art, the flash memory detection point 401 is added in the embodiment, so that the voltage and the signal in the flash memory chip 2001 can be detected at the same time, and the detection is more comprehensive.

[0049] The detection device 100 in the embodiment is electrically connected with the circuit board 200 and the display panel 300 respectively, when the flash memory chip 2001 in the circuit board 200 is powered, the signal in the flash memory chip 2001 is transmitted to the signal line 30 through the first pad 10, and then is transmitted to the second pad 20 through the signal line 30, in the transmission process, the probes are penetrated into the detection points 40 and are electrically connected with the signal line 30, the signal on the signal line 30 can be read through the software in the computer, if the difference between the read signal and the preset signal is large, it indicates that the flash memory chip 2001 is abnormal in function, if the probes are penetrated into the detection points 40 and are electrically connected with the signal line 30 and no data can be read, it indicates that the flash memory chip 2001 is abnormal in part and has no signal output.

[0050] Compared with the related art, the detection device 100 in the embodiment has at least the following beneficial effects:

[0051] The application provides a detection device 100, which is electrically connected with a circuit board 200 and a display panel 300 as an intermediate adapter structure, and comprises a substrate 1000, wherein the substrate 1000 comprises a first end and a second end, the first end comprises a first pad 10, the second end comprises a second pad 20, the first pad 10 and the second pad 20 are electrically connected one by one through a signal line 30, the first pad 10 is electrically connected with the circuit board 200, the second pad 20 is electrically connected with the display panel 300, a detection point 40 is arranged on a side of the signal line 30 away from the substrate 1000, and the detection point 40 and the signal line 30 at least partially overlap in a direction perpendicular to a plane where the substrate 1000 is located, so that the detection point 40 does not need to be arranged on the circuit board 200, and the problem that the detection point 40 cannot be arranged due to the small area of the circuit board 200 is solved; in the application, the detection point 40 and the signal line 30 at least partially overlap in the direction perpendicular to the plane where the substrate 1000 is located, and when detection is performed, the detection can be realized by only electrically connecting the probe with the signal line 30 through the detection point 40, the detection method is simple and easy to operate, when power is supplied to a flash memory chip 2001 in the circuit board 200, the signal in the flash memory chip 2001 is transmitted to the signal line 30 through the first pad 10, and then transmitted to the second pad 20 through the signal line 30, in the transmission process, the probe is inserted into the detection point 40 to be electrically connected with the signal line 30, and the signal on the signal line 30 can be read out through software in a computer, if the difference between the read signal and a preset signal is large, it indicates that the flash memory chip 2001 is abnormally functional, and if the probe cannot read data by being inserted into the detection point 40 to be electrically connected with the signal line 30, it indicates that the flash memory chip 2001 is abnormally manufactured and has no signal output; the detection point 40 at least comprises a flash memory detection point 401 and a voltage detection point 402, the flash memory chip 2001 is detected whether to be normally manufactured by detecting a first code required in a read-write process of the flash memory chip 2001 and a voltage code required for normal work of the flash memory chip 2001, and whether the flash memory chip 2001 has a functional defect can also be detected.

[0052] In some optional embodiments, continuing to refer to Figure 1 and Figure 2 , the first code in the flash memory chip 2001 comprises a gamma value code and an optical compensation value code.

[0053] In the embodiment, the gamma value and the optical compensation value are integrated into one code and burned into the flash memory chip 2001, and the code can be directly called from the flash memory chip 2001 when the display panel 300 displays.

[0054] Specifically, Gamma is an important index of the display panel 300. Currently, Gamma 2.2 meeting the linear perception of the human eye to brightness is taken as the product specification of the display panel 300, that is, the display screen meeting Gamma 2.2±0.2 can be considered as a qualified product. However, the display panel 300 needs to go through multiple process technologies, and the fluctuation brought by each process inevitably leads to Gamma not in the range of 2.2±0.2, so the display panel 300 needs to be gamma debugged to ensure that the gamma of the display panel 300 remains in the range of 2.2±0.2. The gamma debugging adopts the way of multiple debugging of each Gamma binding point gray scale, comparison of brightness to determine the binding point value meeting Gamma 2.2±0.2, to realize keeping the gamma of the display screen in the range of 2.2±0.2. Optionally, an automatic device is carried to search for the best binding point voltage of each gamma binding point using the point-by-point voltage increasing or decreasing way to automatically search for the best binding point voltage, that is, for each gamma binding point, the current brightness is compared with the target brightness to determine the debugging direction, and then the V-T curve (transmittance and applied voltage relationship curve) is used to debug the binding point voltage of each gamma binding point one by one, which is stored in the flash memory chip 2001 after debugging. The gamma value code in the present application is the relationship between brightness and binding point voltage.

[0055] Mura refers to the in-plane brightness non-uniformity of the display panel 300, causing various trace phenomena. The cause of Mura is that, due to the material made of sub-pixels in the display panel 300 and other reasons, when the same voltage is provided for the sub-pixels, the generated current is different, which is reflected in the brightness difference of different sub-pixels. The greater the difference, the more serious the Mura, and the smaller the difference, the smaller the Mura. Demura can be used for compensation, and the brightness of the pixel points is corrected through the way of gray scale compensation, thereby improving the Mura phenomenon. Gray scale compensation is to improve the brightness uniformity by changing the gray scale of the pixel. The process of Demura is to shoot the Mura condition of the gray scale picture through the camera. The input image is a single gray scale picture. According to the brightness of the center area of the panel, some algorithms are used to extract and correct Mura, so as to increase a certain gray scale compensation value for the pixels in the dark area, and reduce a certain gray scale compensation value for the pixels in the bright area, to realize the improvement of Mura phenomenon. The compensation value of all pixels, that is, the optical compensation value code, is made into a Demura table and stored in the flash memory chip 2001. The Demura table is retrieved from the flash memory chip 2001.

[0056] In the embodiment, the first code is included in the flash memory chip 2001, the first code includes a gamma value code and an optical compensation value code, when the flash memory chip 2001 in the circuit board 200 is powered, the first code in the flash memory chip 2001 is transmitted to the signal line 30 through the first pad 10, and then transmitted to the second pad 20 through the signal line 30, in the transmission process, the probe is inserted into the detection point 40 and electrically connected with the signal line 30, and the detection code on the signal line 30 can be read through the software in the computer, if the difference between the read detection code and the preset first code is large, it indicates that the flash memory chip 2001 is abnormal in function, if the probe is inserted into the detection code and electrically connected with the signal line 30, and no data is read, it indicates that the flash memory chip 2001 is abnormal in assembly, and no signal is output, by detecting the first code required by the flash memory chip 2001 in the reading and writing process, whether the flash memory chip 2001 in the circuit board 200 is normally assembled can be detected, and whether the flash memory chip 2001 has a functional defect can also be detected.

[0057] In some optional embodiments, continuing to refer to Figure 1 and Figure 2 , the second code is included in the flash memory chip 2001, the second code includes a voltage code, the voltage code includes a chip working voltage code and a display panel 300 working voltage code.

[0058] It can be understood that the voltage code is also stored in the flash memory chip 2001, which is optionally the working voltage code of the flash memory chip 2001 and the working voltage code of the display panel 300, for example, AVDD, PVDD, PVEE, and the voltage code is optionally packaged and stored in the flash memory chip 2001, and the voltage value is provided when testing.

[0059] In some optional embodiments, continuing to refer to Figure 1 and Figure 2 , the detection point 40 further includes a serial peripheral interface SPI or an integrated circuit bus I2C interface.

[0060] In the embodiment, the serial peripheral interface SPI or the integrated circuit bus I2C interface, for example, includes a digital serial interface (SDI, SDIO2, SDIO3), a clock signal interface (SCK), a chip select line interface (CS), a data object interface (SDO), and the like, which are not limited here.

[0061] The SPI protocol completes communication through data exchange, SPI is a high-speed, full-duplex, synchronous communication bus, and only occupies four lines on the pin of the flash memory chip 2001, saves the pin of the flash memory chip 2001, at the same time saves space for the layout of the circuit board 200, and provides convenience.

[0062] The I2C (Inter-Integrated Circuit) interface is used to connect microcontrollers and their peripheral devices.

[0063] In some alternative embodiments, refer to Figure 4 , Figure 4 yes Figure 1 A cross-sectional view along the B-B' direction is shown. The circuit board 200 includes a third pad 70, and the first pad 10 is electrically connected to the third pad 70 in a one-to-one correspondence. The display panel 300 includes a fourth pad 80, and the second pad 20 is electrically connected to the fourth pad 80 in a one-to-one correspondence.

[0064] Figure 4 The display panel 300 is not pattern-filled. Understandably, for ease of inspection, the first pad 10 and the second pad 20 of the inspection device 100 are oriented toward the side away from the light-emitting surface K1 of the display panel 300, while the display panel 300 is mounted upside down on the inspection device 100, that is, the light-emitting surface K1 of the display panel 300 faces the substrate 1000, and the circuit board 200 is also mounted upside down on the inspection device 100.

[0065] The circuit board 200 is provided with a third pad 70, and the display panel 300 is provided with a fourth pad 80. When the signal of the flash memory chip 2001 in the circuit board 200 is transmitted to the display panel 300, the third pad 70 is first electrically connected to the first pad 10 in a one-to-one correspondence. The signal of the third pad 70 is transmitted to the first pad 10 of the detection device 100, and then transmitted to the second pad 20 of the detection device 100 through the signal line 30. The second pad 20 is electrically connected to the fourth pad 80 in a one-to-one correspondence. The signal is then transmitted from the second pad 20 to the fourth pad 80 and into the display panel 300. In this embodiment, the circuit board 200 includes a third pad 70, and the first pad 10 is electrically connected to the third pad 70 in a one-to-one correspondence. The display panel 300 includes a fourth pad 80, and the second pad 20 is electrically connected to the fourth pad 80 in a one-to-one correspondence. This constitutes a complete signal transmission path, so that the signal of the circuit board 200 can be completely transmitted to the display panel 300.

[0066] In some alternative embodiments, refer to Figure 5 , Figure 5 yes Figure 1 Another cross-sectional view along the B-B' direction shows that the first pad 10 and the third pad 70 are electrically connected by the first conductive adhesive 901; the second pad 20 and the fourth pad 80 are electrically connected by the second conductive adhesive 902.

[0067] Specifically, the detection device 100 is bound with the display panel 300, and the circuit board 200 is bound with the detection device 100. Optionally, the display panel 300 has alignment marks, and the detection device 100 also has alignment marks. After the alignment marks on the detection device 100 are matched with the alignment marks on the display panel 300, the first conductive adhesive 901 is arranged between the first pad 10 and the third pad 70. The display panel 300 and the detection device 100 are pressed together by a pressing head, so that the first pad 10 and the third pad 70 are bonded and conductive. Similarly, after the alignment marks on the detection device 100 are matched with the alignment marks on the circuit board 200, the second conductive adhesive 902 is arranged between the second pad 20 and the fourth pad 80. The circuit board 200 and the detection device 100 are pressed together by a pressing head, so that the second pad 20 and the fourth pad 80 are bonded and conductive.

[0068] In some optional embodiments, the first conductive adhesive 901 and the second conductive adhesive 902 are both anisotropic conductive adhesives. The anisotropic conductive adhesives have fluidity when not bound. After the pressing head is pressed, the conductive particles in the anisotropic conductive adhesives are broken, so that the anisotropic conductive adhesives have conductivity. After binding, the anisotropic conductive adhesives are solidified, and play a role of conductive bonding.

[0069] In some optional embodiments, continuing to refer to Figure 3 , Figure 4 and Figure 5 , the substrate 1000 includes a rigid substrate 1000 or a flexible substrate 1000.

[0070] The substrate 1000 of the detection device 100 can be a rigid substrate 1000, for example, a glass substrate 1000. The glass substrate 1000 is transparent, and the first pad 10 and the second pad 20 arranged on the rigid substrate 1000 are easy to be captured when bound, which is beneficial to binding. In addition, the glass substrate 1000 has rigidity and is suitable for long-term use.

[0071] The substrate 1000 of the detection device 100 can also be a flexible substrate 1000, for example, polyimide. The material of the circuit board 200 is also usually polyimide material, such as the circuit board 200 in the embodiment. The substrate 1000 of the detection device 100 and the circuit board 200 adopt the same material, which is easy to obtain. On the other hand, polyimide has the characteristics of high temperature resistance, which can reach more than 400℃, and the long-term use temperature range is-200-300℃. In this way, the detection device 100 also has high temperature resistance. In addition, polyimide has high insulation performance, and a plurality of first pads 10, a plurality of second pads 20 and a plurality of signal lines 30 are formed on the polyimide. Due to the high insulation performance of polyimide, signal crosstalk will not be caused.

[0072] In some optional embodiments, referring toFigure 6 and Figure 7 , Figure 6 is a planar structure schematic diagram of still another detection device provided by the present application, Figure 7 is a split structure schematic diagram of still another detection device provided by the present application, the detection device 100 further comprises a power supply chip 50, which provides voltage for the detection device 100.

[0073] Figure 6 and Figure 7 It is shown in the detection device 100 that the power supply chip 50 is bound, and optionally, the power supply chip 50 is located on the same side of the substrate 1000 as the first bonding pad 10, the second bonding pad 20 and the signal line 30, so as to facilitate wiring. The power supply chip 50 in the embodiment can provide the three voltage signals AVDD, PVDD and PVEE for the display panel 300, so that a device for providing the three voltage signals AVDD, PVDD and PVEE is no longer needed, and the detection device 100 can provide voltage signals.

[0074] Based on the same inventive idea, the present application further provides a detection method of a detection device, the detection device 100 being the detection device 100 of any one of the embodiments in the above Figures 1 to 7 The detection device 100 is electrically connected with the circuit board 200 and the display panel 300, respectively, and the detection device 100 comprises a plurality of detection points 40, the detection points 40 at least comprising a serial peripheral interface, a flash detection point 401 and a voltage detection point 402, the circuit board 200 comprising a flash chip 2001; refer to Figure 8 , Figure 8 is a flow chart of a detection method of a detection device provided by the present application, the detection method comprising the following steps:

[0075] S1, a binding step, comprising binding the circuit board 200 and the detection device 100, and simultaneously binding the display panel 300 and the detection device 100;

[0076] S2, a code burning step, comprising burning a first code and a second code into the flash chip 2001 through the detection points 40, the first code comprising a gamma value code and an optical compensation value code, and the second code comprising a voltage code, the voltage code comprising a chip working voltage code and a display panel 300 working voltage code;

[0077] S3, a detection step, comprising signal transmission between the circuit board 200 and the display panel 300, external connection of the detection device 100, detection by the detection points 40 that a difference between the detection code and the first code and the second code is within a preset range, and normal reading and writing of the flash chip 2001.

[0078] Specifically, in step S1, the circuit board 200 and the detection device 100 need to be bound, and the display panel 300 and the detection device 100 are simultaneously bound, in combination withFigure 1 、 Figure 2 and Figure 5 , the display panel 300 has alignment marks, of course, the detection device 100 also has alignment marks, after matching the alignment marks on the detection device 100 with the alignment marks on the display panel 300, the first conductive glue 901 is arranged between the first pad 10 and the third pad 70, and the optional first conductive glue 901 is anisotropic conductive glue, and the anisotropic conductive glue is pressed by the pressure head, so that the conductive particles in the anisotropic conductive glue are broken, so that the first pad 10 and the third pad 70 are bonded and conductive, and the binding of the display panel 300 and the detection device 100 is completed; similarly, after matching the alignment marks on the detection device 100 with the alignment marks on the circuit board 200, the second conductive glue 902 is arranged between the second pad 20 and the fourth pad 80, and the optional second conductive glue 902 is also anisotropic conductive glue, and the anisotropic conductive glue is pressed by the pressure head, so that the conductive particles in the anisotropic conductive glue are broken, so that the second pad 20 and the fourth pad 80 are bonded and conductive, and the binding of the circuit board 200 and the detection device 100 is completed.

[0079] S2, the code burning step, the first code and the second code are burned into the flash memory chip 2001 through the detection point 40, and the detection point 40 can be a serial peripheral interface SPI or an integrated circuit bus I2C interface, and the first code and the second code are the initial version code. The gamma value code and the optical compensation value code are integrated into one code, which is written into the flash memory chip 2001 through the serial peripheral interface SPI. Of course, the chip operating voltage code and the display panel 300 operating voltage code can also be written into the flash memory chip 2001, and the chip here refers to the flash memory chip 2001.

[0080] In the S3 detection step, after the detection device 100 is connected with the power supply, the detection device 100 starts to work, the probe connected to the computer is inserted into the detection point 40, and the detection code can be detected. The processor in the computer compares the detection code with the first code and the second code, and when the difference between the detection code and the first code and the second code is within the preset range, the flash memory chip 2001 reads and writes normally. It should be noted that the difference here considers that the signal line 30 itself has resistance in the signal transmission process, which will cause the signal to fluctuate, as long as the difference between the detection code and the first code and the second code is not large, it means that the flash memory chip 2001 reads and writes normally. Of course, if the difference between the detected detection code and the preset first code is large, it indicates that the flash memory chip 2001 is functionally abnormal.

[0081] In this embodiment, the first code is included in the flash memory chip 2001, the first code includes a gamma value code and an optical compensation value code, when the flash memory chip 2001 in the circuit board 200 is powered, the first code in the flash memory chip 2001 is transmitted to the signal line 30 through the first pad 10, and then transmitted to the second pad 20 through the signal line 30, in the transmission process, the probe is inserted into the detection point 40 and electrically connected with the signal line 30, and the detection code on the signal line 30 can be read out through the software in the computer, if the difference between the read detection code and the preset first code is large, it indicates that the flash memory chip 2001 is abnormal in function, if the probe is inserted into the detection code and electrically connected with the signal line 30, and no data is read out, it indicates that the flash memory chip 2001 is abnormal in assembly, and no signal is output, by detecting the first code required by the flash memory chip 2001 in the reading and writing process, whether the flash memory chip 2001 in the circuit board 200 is normally assembled can be detected, and whether the flash memory chip 2001 has a functional defect can also be detected.

[0082] In some optional embodiments, referring to Figure 9 and Figure 10 , Figure 9 is a flow chart of a detection method of the detection device provided by the application, Figure 10 is a planar structure schematic diagram of the detection device provided by the application, and the detection device 100 further includes a power supply chip 50;

[0083] In the S1 binding step, the circuit board 200 is connected with the first connector 400, and the first connector 400 and the power supply chip 50 provide voltage for the display panel 300;

[0084] The S3 detection step further includes: lighting the display panel 300, if the display panel 300 emits light, the flash memory chip 2001 is normal in reading and writing.

[0085] It should be noted that the circuit board 200 is connected with the first connector 400, and the first connector 400 and the power supply chip 50 provide voltage for the display panel 300, the first connector 400 is used as a switching device for connecting the circuit board 200 with an external power supply, which can ensure that the voltage provided by the external power supply provides power for the first connector 400, so as to ensure that the circuit board 200 can work, and then provide voltage for the display panel 300, of course, the voltage provided by the power supply chip 50 is the three voltage signals of AVDD, PVDD and PVEE, and the first connector 400 provides the three voltage signals of IOVCC, VDD and DVDD.

[0086] It can be understood that the signal output from the flash memory chip 2001 can display a picture in the display panel 300, that is, the display panel 300 can normally emit light, which indicates that the flash memory chip 2001 is normal in reading and writing.

[0087] In some alternative embodiments, referring to Figure 11 and Figure 12 , Figure 11 is a flow chart of a detection method of the detection device provided by the present application, Figure 12 is a plan view of another detection device provided by the present application, the detection device 100 further comprises a power supply chip 50;

[0088] In the binding step S1, the detection device 100 is connected to the second connector 500, and the second connector 500 and the power supply chip 50 provide voltage for the display panel 300.

[0089] In the detection step S3, if the display panel 300 does not emit light, it is detected by the detection point 40 that the flash memory chip 2001 cannot write the first code or the second code, or it is detected by the detection point 40 that the difference between the detection code read by the flash memory chip 2001 and the first code and the second code is not within the preset range, indicating that the flash memory chip 2001 has defects or the flash memory chip 2001 has abnormal assembly.

[0090] It should be noted that the detection device 100 is connected to the second connector 500, and the second connector 500 and the power supply chip 50 provide voltage for the display panel 300. The second connector 500 serves as a switching device for connecting the detection device 100 to an external power supply, which can ensure that the voltage provided by the external power supply provides power for the second connector 500, ensuring that the circuit board 200 can work, thereby providing voltage to the display panel 300. Of course, the voltage provided by the power supply chip 50 is the three voltage signals AVDD, PVDD and PVEE, and the external power supply provided by the second connector 500 is the three voltage signals IOVCC, VDD and DVDD.

[0091] In the process of lighting the display panel 300, if the display panel 300 does not emit light, there may be two reasons. On the one hand, the flash memory chip 2001 has abnormal assembly, and at this time the detection point 40 detects that the flash memory chip 2001 cannot write the first code or the second code. On the other hand, the difference between the detection code read by the flash memory chip 2001 and the first code and the second code is not within the preset range, and the signal input to the display panel 300 is not enough to drive the display panel 300 to emit light, and at this time the flash memory chip 2001 may have defects.

[0092] In this embodiment, by lighting the display panel 300, if the display panel 300 does not emit light, the detection point 40 detects that the flash memory chip 2001 cannot write the first code or the second code, or the difference between the detection code read by the flash memory chip 2001 and the first code and the second code is not within the preset range, which can detect that the flash memory chip 2001 in the circuit board 200 has defects or the flash memory chip 2001 has abnormal assembly.

[0093] The detection device and the detection method provided by the application have at least the following beneficial effects:

[0094] The detection device is electrically connected to the circuit board and the display panel as an intermediate adapter, and comprises a substrate including a first end and a second end, the first end including a first solder pad, and the second end including a second solder pad, the first solder pad and the second solder pad being electrically connected one by one through a signal line, the first solder pad being electrically connected to the circuit board, and the second solder pad being electrically connected to the display panel, the detection point being arranged on a side of the signal line away from the substrate, and the detection point and the signal line being at least partially overlapped in a direction perpendicular to a plane where the substrate is located, so that the detection point does not need to be arranged on the circuit board, and the problem of no space for arranging the detection point due to the small area of the circuit board is solved; in the application, the detection point and the signal line are at least partially overlapped in the direction perpendicular to the plane where the substrate is located, and the detection can be realized by only penetrating the detection point and the signal line with a probe to electrically connect them during the detection, so that the detection method is simple and easy to operate; the detection point at least includes a flash memory detection point and a voltage detection point, and whether the flash memory chip in the circuit board is normally manufactured is detected by detecting a first code required by the flash memory chip during reading and writing and a voltage code required by the flash memory chip for normal operation, and whether the flash memory chip has a functional defect can also be detected.

[0095] Although some specific embodiments of the application have been described in detail above, those skilled in the art should understand that the above examples are only for illustration, and are not intended to limit the scope of the application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.

Claims

1. A detection device, characterized in that, The substrate includes a first end and a second end arranged oppositely, wherein, The first end includes a plurality of first pads electrically connected with a circuit board, and the circuit board includes a flash memory chip; The second end includes a plurality of second pads electrically connected with a display panel; The first pads and the second pads are electrically connected one by one through signal lines; The signal lines away from one side of the substrate include a plurality of detection points, and the detection points include at least a flash memory detection point and a voltage detection point; In a direction perpendicular to a plane in which the substrate is located, the detection points at least partially overlap the signal lines.

2. The detection device of claim 1, wherein, The flash memory chip includes a first code, and the first code includes a gamma value code and an optical compensation value code.

3. The detection device of claim 1, wherein, The flash memory chip includes a second code, and the second code includes a voltage code, and the voltage code includes a chip working voltage code and a display panel working voltage code.

4. The detection device of claim 1, wherein, The detection points further include a serial peripheral interface (SPI) or an integrated circuit bus (I2C) interface.

5. The detection device of claim 1, wherein, The circuit board includes third pads, and the first pads are electrically connected one by one with the third pads; the display panel includes fourth pads, and the second pads are electrically connected one by one with the fourth pads.

6. The detection device of claim 5, wherein, The first pads and the third pads are electrically connected through first conductive glue; and the second pads and the fourth pads are electrically connected through second conductive glue.

7. The detection device of claim 1, wherein, The substrate includes a rigid substrate or a flexible substrate.

8. The detection device of claim 1, wherein, The detection device further includes a power supply chip to provide voltage for the detection device.

9. A detection method of a detection device, characterized by, The detection device is electrically connected with a circuit board and a display panel, respectively, and includes a plurality of detection points, and the detection points include at least a serial peripheral interface, a flash memory detection point, and a voltage detection point, and the circuit board includes a flash memory chip; The detection method includes: a binding step, including binding the circuit board and the detection device, and simultaneously binding the display panel and the detection device; a code burning step, including burning a first code and a second code into the flash memory chip through the detection points, the first code including a gamma value code and an optical compensation value code, and the second code including a voltage code, and the voltage code including a chip working voltage code and a display panel working voltage code; a detection step, including signal transmission between the circuit board and the display panel, the detection device being externally connected with a power supply, and the detection points detecting that a difference between a detection code and the first code and the second code is within a preset range, and the flash memory chip being read and written normally.

10. The detection method of the detection device according to claim 9, characterized in that, The detection device further includes a power supply chip; In the binding step, the circuit board is connected with a first connector, and the first connector and the power supply chip provide voltage for the display panel; The detection step further includes: lighting up the display panel, and if the display panel emits light, the flash memory chip is read and written normally.

11. The detection method of the detection device according to claim 9, characterized in that, The detection device further includes a power supply chip; In the binding step, the detection device is connected with a second connector, and the second connector and the power supply chip provide voltage for the display panel; The detecting step further comprises: if the display panel does not emit light, detecting, by the detecting point, that the flash memory chip cannot write the first code or the second code, or detecting, by the detecting point, that a difference between the detection code read by the flash memory chip and the first code and the second code is not within a preset range, so that the flash memory chip has a defect or the flash memory chip is abnormally assembled.

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