A PCB board soldering tin cooling device

Abstract

The present invention discloses a soldering tin cooling device for a PCB board, comprising a housing; a wind collecting hood is fixedly connected to the top of the housing; a diversion pipe is communicated with the top of the wind collecting hood; a baffle is fixedly connected to the middle of the housing, and a porous support is fixedly connected to the top of the baffle; a surrounding heat dissipation pipe is arranged inside the porous support, and two ends of the heat dissipation pipe are respectively communicated with a liquid supply pipe and a return pipe; by relying on the wind collecting hood to introduce the low-temperature air flow outside into the housing and act on the PCB board from top to bottom, the air flow in contact with the PCB board and carrying heat is guided by the fan blades arranged on both sides, so that the air flow is discharged from both sides of the housing. At the same time, in order to enhance the heat dissipation effect on the PCB board, the simultaneously arranged heat dissipation pipe, liquid supply pipe and return pipe can cooperate with air cooling for synchronous heat dissipation, accelerate the heat exchange efficiency of the PCB board, and achieve effective cooling.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and specifically, it is a soldering tin cooling device for PCB boards. Background Art

[0002] PCB boards are important components in the electronics industry. The processing of PCB boards involves soldering processes. After soldering the PCB boards, it is necessary to wait for them to cool down before subsequent processing can be carried out.

[0003] In the prior art, such as a soldering tin cooling device for PCB boards with the patent number CN202210889400.7, it includes a housing, a cooling table, and a heat dissipation component. A water storage tank with a return water pipe connected to the top is provided on the left side of the housing. The cooling table is arranged at the bottom inside the housing and directly below the air inlet opened at the top of the housing for placing the soldered PCB boards. The heat dissipation component is directly opposite to the air outlet opened on the right side of the housing; a first fan is installed at the air inlet; the inside of the cooling table is hollow, with a water inlet pipe provided at its left end and a water outlet pipe provided at its right end. The water inlet pipe is communicated with the bottom of the water storage tank, and the water outlet pipe is communicated with the return water pipe through the heat dissipation component. A circulation pump is installed on the return water pipe;

[0004] In this device, a combination of a fan and a water pipe is used for cooling. Although it has a cooling effect, in this device, for the longitudinally arranged fan, while cooling the PCB board, it is easy to cause air flow disorder, which is not conducive to the cooling treatment of the PCB board; at the same time, for the group of horizontally arranged fans in this device, the air flow existing inside the housing cannot be effectively discharged, which exacerbates the air flow disorder inside the housing. Therefore, it is actually not conducive to the cooling processing of the PCB board.

[0005] Therefore, in view of the above problems, a soldering tin cooling device for PCB boards is proposed. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art and solve at least one of the above problems, the present invention provides a soldering tin cooling device for PCB boards.

[0007] A soldering tin cooling device for PCB boards includes a housing; a wind collecting cover is fixedly connected to the top of the housing; a diversion pipe is communicated with the top of the wind collecting cover; a baffle is fixedly connected to the middle of the housing, and a porous support is fixedly connected to the top of the baffle; a surrounding heat dissipation pipe is arranged inside the porous support, and both ends of the heat dissipation pipe are respectively communicated with a liquid supply pipe and a return pipe; the end of the liquid supply pipe far away from the heat dissipation pipe is communicated with a water tank, and the end of the return pipe far away from the heat dissipation pipe is communicated with the other end of the water tank; the water tank is arranged inside the housing and below the baffle; both ends of the housing are rotatably connected with fan blades through a first support; the middle of the return pipe is arranged outside the housing and is directed at one side of the fan blades.

[0008] Preferably, a blowing part is provided at the inner top of the housing, and three air grooves are formed in the blowing part; the two side air grooves are inclined towards both sides, and the middle air groove is vertically downward; an air cavity is formed at the top of the air groove, and the air cavity is communicated with the air collecting hood.

[0009] Preferably, air guiding plates with the same inclination are fixedly connected to the bottoms of the two side air grooves, and diversion fins are fixedly connected to the air guiding plates; the lengths of the two side diversion fins are smaller than the length of the middle diversion fin.

[0010] Preferably, through holes are further formed at both ends of the housing, and the through holes are arranged corresponding to the fan blades; a dust-proof cover is fixedly connected to the outside of the housing corresponding to the through holes.

[0011] Preferably, a cover plate is embedded and connected to one side of the housing, and an observation groove is formed in the middle of the cover plate; the inner baffle of the housing is of an L-shaped structure; two inserting rods are fixedly connected to the side of the baffle facing the cover plate, and holes are formed in the cover plate corresponding to the inserting rods; the inserting rods are in plug-in fit with the holes.

[0012] Preferably, the inside of the porous bracket is hollow, and the heat dissipation pipes inside the porous bracket are arranged in an S-shaped surrounding manner; the heat dissipation pipes are composed of two independent pipes, and the inlets and outlets of the two independent pipes are respectively communicated with the liquid supply pipe and the return pipe.

[0013] Preferably, the middle part of the return pipe is located outside the housing, and the middle part of the return pipe is arranged in an S-shaped structure and is arranged corresponding to the fan blades.

[0014] Preferably, a plurality of flow guiding plates are sequentially arranged in the water tank from top to bottom, and the plurality of flow guiding plates are arranged alternately and inclined downward; the return pipe is communicated with the upper part of the water tank, and the liquid supply pipe is communicated with the bottom of the water tank.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. The present invention relies on the air collecting hood to introduce the external low-temperature air flow into the housing and act on the PCB board from top to bottom. The air flow contacting the PCB board and carrying heat is guided by the fan blades arranged on both sides, so that it is discharged from both sides of the housing. At the same time, in order to enhance the heat dissipation effect of the PCB board, the heat dissipation pipes, the liquid supply pipe and the return pipe arranged at the same time can cooperate with the air cooling for synchronous heat dissipation, accelerate the heat exchange efficiency of the PCB board, and achieve effective cooling.

[0017] 2. The present invention is configured such that the air ducts on both sides are inclined, while the air duct in the middle is vertically downward. Therefore, when the air ducts are used for air diversion, the introduced low-temperature air flow can be blown in multiple directions, and thus multiple locations on the PCB board can be cooled synchronously. Moreover, since the two air ducts are arranged in an inclined manner, when the vertically downward air flow contacts the PCB board, the air flow moving towards both sides can just merge with the inclined air flow and is discharged from the housing through the fan blades, avoiding the air flow disorder inside the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 The first three-dimensional view of an embodiment of the present invention;

[0020] Figure 2 The side view of an embodiment of the present invention;

[0021] Figure 3 The first sectional three-dimensional view of an embodiment of the present invention;

[0022] Figure 4 The second sectional three-dimensional view of an embodiment of the present invention;

[0023] Figure 5 The second three-dimensional view of an embodiment of the present invention;

[0024] Figure 6 The three-dimensional view of the water tank and the porous bracket in an embodiment of the present invention;

[0025] Figure 7 The three-dimensional view of the water tank and the heat dissipation pipeline in an embodiment of the present invention;

[0026] In the figures: 1, housing; 11, cover plate; 12, observation slot; 13, bracket; 14, fan blade; 15, air supply part; 16, air guiding plate; 17, flow dividing fin; 18, baffle; 19, air duct; 2, air collecting hood; 21, guiding pipe; 3, dust-proof cover; 4, water tank; 41, guiding plate; 51, liquid supply pipe; 52, return pipe; 53, heat dissipation pipeline; 6, porous bracket. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] Please refer to Figures 1-7 As shown, a solder cooling device for a PCB board includes a housing 1, an air collecting hood 2, a baffle 18, a porous bracket 6, a heat dissipation pipe 53, a liquid supply pipe 51, a return pipe 52, a water tank 4 and a fan blade 14; a air collecting hood 2 is fixedly connected to the top of the housing 1; a diversion pipe 21 is connected to the top of the air collecting hood 2; wherein, the diversion pipe 21 is connected to an external fan, and the external low-temperature air flow can be introduced into the housing 1 through the diversion pipe 21 and further act on the PCB board arranged on the porous bracket 6 to realize cooling after soldering, which belongs to air cooling; a baffle 18 is fixedly connected to the middle of the housing 1, and a porous bracket 6 is fixedly connected to the top of the baffle 18; a surrounding heat dissipation pipe 53 is arranged inside the porous bracket 6, and the two ends of the heat dissipation pipe 53 are respectively connected to a liquid supply pipe 51 and a return pipe 52; one end of the liquid supply pipe 51 away from the heat dissipation pipe 53 is connected to the water tank 4, and one end of the return pipe 52 away from the heat dissipation pipe 53 is connected to the other end of the water tank 4; the water tank 4 is filled with coolant or water in advance, and the water or coolant in the water tank 4 is sent into the heat dissipation pipe 53 by using a circulation pump in cooperation with the liquid supply pipe 51. By using the pores on the porous bracket 6, the high heat after soldering of the PCB board can be transferred to the coolant or water in the heat dissipation pipe 53 to realize heat exchange and improve the cooling effect. The return pipe 52 is used to carry the water or coolant with heat and perform long-term natural cooling through the surrounding part outside the housing 1, and finally be introduced into the water tank 4 for further cooling for subsequent use, which belongs to liquid cooling; the water tank 4 is arranged inside the housing 1 and is located below the baffle 18; the two ends of the housing 1 are rotatably connected to a fan blade 14 through a first bracket 13; the middle of the return pipe 52 is arranged outside the housing 1 and is aimed at one side of the fan blade 14; after the air flow introduced into the housing 1 by the air collecting hood 2 contacts the PCB board, it will move to both sides. Therefore, two fan blades 14 are arranged to effectively guide the high-temperature hot air flow inside the housing 1 and avoid the problem of air flow disorder inside the housing 1, thereby improving the cooling efficiency of the PCB board.

[0029] Specifically, in the prior art, a fan and a water pipe are combined for cooling. Although the cooling effect is achieved, in this device, for the longitudinally arranged fan, while cooling the PCB board, it is likely to cause air flow disorder, which is not conducive to the cooling process of the PCB board. At the same time, in this device, a set of laterally arranged fans cannot effectively discharge the air flow existing inside the housing, which exacerbates the air flow disorder inside the housing. Therefore, it is actually not conducive to the cooling process of the PCB board.

[0030] In this device, the air collecting hood 2 is relied on to introduce the external low-temperature air flow into the housing 1 and act on the PCB board from top to bottom. The air flow that contacts the PCB board and carries heat is guided by the fan blades 14 arranged on both sides, so that it is discharged from both sides of the housing 1 out of the box. At the same time, in order to enhance the heat dissipation effect of the PCB board, the heat dissipation pipes 53, the liquid supply pipe 51 and the return pipe 52 arranged simultaneously can cooperate with the air cooling for synchronous heat dissipation, accelerate the heat exchange efficiency of the PCB board, and achieve effective cooling. When in use, the soldered PCB board is placed on the porous support 6. Subsequently, the external low-temperature air flow is introduced into the housing 1 through the dust collecting hood and the diversion pipe 21 by an external fan and directly acts on the PCB board to achieve air cooling of the PCB board. The air flow after contacting the PCB board will move to both sides. Therefore, two fan blades 14 are arranged to effectively guide the high-temperature hot air flow inside the housing 1 and avoid the problem of air flow disorder inside the housing 1, improving the cooling efficiency of the PCB board. At the same time, while air cooling the PCB board, the circulation pump located in the middle of the liquid supply pipe 51 is also started synchronously, and the cooling liquid at the bottom of the water tank 4 is filled into the heat dissipation pipe 53 through the liquid supply pipe 51. By the movement of the cooling liquid in the heat dissipation pipe 53, heat transfer with the PCB board can be carried out. Using the pores on the porous support 6, the high heat generated after soldering the PCB board can be transferred to the cooling liquid or water in the heat dissipation pipe 53 to achieve heat exchange and improve the cooling effect. The return pipe 52 is used to carry the water or cooling liquid carrying heat and is naturally cooled for a long time through the surrounding part outside the housing 1, and finally introduced into the water tank 4 for further cooling for subsequent use.

[0031] As an implementation manner of the present invention, an air supply part 15 is provided at the inner top of the housing 1, and three air grooves 19 are formed in the air supply part 15; the air supply part 15 and the air grooves 19 are provided to distribute the low-temperature air flow introduced by the air collecting hood 2 and the diversion pipe 21, so as to prevent the introduced air flow from concentrating on a single point on the PCB board; the two side air grooves 19 are inclined towards both sides, and the middle air groove 19 is vertically downward; the tops of the air grooves 19 converge into an air cavity, and the air cavity is communicated with the air collecting hood 2; in order to improve the synchronous cooling of multiple places on the PCB board by the introduced low-temperature air flow, the two side air grooves 19 are inclined, and at the same time the middle air groove 19 is vertically downward. Therefore, when the air grooves 19 divert the air flow, the introduced low-temperature air flow can be blown in multiple directions, so as to synchronously cool multiple places on the PCB board. And because the two air grooves 19 are inclined, when the vertically downward air flow contacts the PCB board, the air flow moving towards both sides can just merge with the obliquely blown air flow and is discharged from the housing 1 through the fan blades 14, avoiding the air flow disorder in the housing 1.

[0032] As an implementation manner of the present invention, air guiding plates 16 with the same inclination degree are fixedly connected to the bottoms of the two side air grooves 19, and diversion fins 17 are fixedly connected to the air guiding plates 16; by arranging the air guiding plates 16 at the bottoms of the air grooves 19, when the low-temperature air flow is introduced into the housing 1 through the two side inclined air grooves 19, it can prevent the air flow passing through the two side inclined air grooves 19 from colliding with the vertically downward air flow in the middle and generating disorder; the lengths of the two side diversion fins 17 are less than the length of the middle diversion fin 17; at the same time, by arranging the diversion fins 17 on the air guiding plates 16, the air flow passing through the two side inclined air grooves 19 can be further diverted, so as to expand towards both sides of the PCB board, thereby achieving the synchronous cooling of the whole PCB board.

[0033] As an implementation manner of the present invention, through holes are further formed at both ends of the housing 1, and the through holes are arranged corresponding to the fan blades 14; a dust-proof cover 3 is fixedly connected to the outside of the housing 1 corresponding to the through holes; the dust-proof cover 3 arranged outside the housing 1 can prevent external dust from entering the housing 1 when the fan blades 14 export the heat-containing air flow to the outside.

[0034] As an implementation manner of the present invention, a cover plate 11 is also embedded and connected to one side of the housing 1, and an observation groove 12 is formed in the middle of the cover plate 11; the baffle 18 in the housing 1 is arranged in an L-shaped structure; by arranging the baffle 18 in an L-shaped structure, the insertion rod on its side facing the cover plate 11 can also cooperate with the hole on the cover plate 11, so as to achieve the purpose of fixing the cover plate 11 on the housing 1. At the same time, the observation groove 12 can observe the PCB board cooled inside the housing 1 to avoid overcooling; two insertion rods are fixedly connected to the side of the baffle 18 facing the cover plate 11, and holes are formed in the cover plate 11 corresponding to the insertion rods; the insertion rods are inserted and matched with the holes.

[0035] As an embodiment of the present invention, the interior of the porous support 6 is hollow, and the heat dissipation pipes 53 inside the porous support 6 are arranged in an S-shaped loop; the heat dissipation pipes 53 are composed of two independent pipes, and the inlets and outlets of the two independent pipes are respectively communicated with the liquid supply pipe 51 and the return pipe 52; wherein, the two independent pipes inside the heat dissipation pipes 53 are symmetrically arranged, and both of the two independent pipes are communicated with a liquid supply pipe 51, so that when the cooling liquid is fed into the liquid supply pipe 51, it can be simultaneously filled into the two independent pipes, and discharged synchronously through the outlets of the independent pipes, and finally gathered in the return pipe 52.

[0036] As an embodiment of the present invention, the middle part of the return pipe 52 is located outside the housing 1, and the middle part of the return pipe 52 is arranged in an S-shaped structure and corresponds to the fan blades 14; a part of the middle part of the return pipe 52 is set as an S-shaped structure, and as shown in the attached Figure 7 figure, the return pipe 52 located outside is facing a group of fan blades 14, which can play a certain cooling effect by cooperating with a longer flow distance when the fan blades 14 discharge air flow to the outside.

[0037] As an embodiment of the present invention, a plurality of flow guide plates 41 are sequentially arranged in the water tank 4 from top to bottom, and the plurality of flow guide plates 41 are alternately arranged and inclined downward; the return pipe 52 is communicated with the upper part of the water tank 4, and the liquid supply pipe 51 is communicated with the bottom of the water tank 4; since the density of hot water is lower than that of cold water, when cold water and hot water are mixed, the cold water will sink downward. By using the plurality of alternately arranged flow guide plates 41, the cold water can be guided to the bottom of the water tank 4, while the hot water continues to float on the surface layer of the water tank 4. Until the temperature drops, it will be deposited at the bottom of the water tank 4 by the flow guide plates 41. The setting of the flow guide plates 41 can increase the flow time of the heat-containing cooling liquid introduced into the water tank 4, thereby achieving a cooling effect and being beneficial to the circulation use of the cooling liquid.

[0038] Working principle: In the prior art, although a fan and a water pipe are combined for cooling, which has a cooling effect, in this device, for the longitudinally arranged fan, while cooling the PCB board, it is easy to cause air flow disorder, which is not conducive to the cooling treatment of the PCB board; at the same time, for a group of laterally arranged fans in this device, the air flow existing inside the housing cannot be effectively discharged, which exacerbates the air flow disorder inside the housing, so it is actually not conducive to the cooling process of the PCB board.

[0039] In this device, the air collecting hood 2 is relied on to introduce the external low-temperature air flow into the housing 1 and act on the PCB board from top to bottom. The air flow that contacts the PCB board and carries heat is guided by the fan blades 14 arranged on both sides, so that it is discharged from both sides of the housing 1 out of the box. At the same time, in order to enhance the heat dissipation effect of the PCB board, the heat dissipation pipes 53, the liquid supply pipe 51 and the return pipe 52 arranged at the same time can cooperate with air cooling for synchronous heat dissipation, accelerate the heat exchange efficiency of the PCB board, and achieve effective cooling. When in use, the soldered PCB board is placed on the porous bracket 6. Subsequently, the external low-temperature air flow is introduced into the housing 1 through the dust collecting hood and the diversion pipe 21 by an external fan and directly acts on the PCB board to achieve air cooling of the PCB board. The air flow after contacting the PCB board will move to both sides. Therefore, two fan blades 14 are arranged to effectively guide the high-temperature air flow in the housing 1 and avoid the problem of air flow disorder inside the housing 1, improving the cooling efficiency of the PCB board. At the same time, while air cooling the PCB board, the circulation pump located in the middle of the liquid supply pipe 51 is also started synchronously, and the cooling liquid at the bottom of the water tank 4 is filled into the heat dissipation pipe 53 through the liquid supply pipe 51. By the movement of the cooling liquid in the heat dissipation pipe 53, heat transfer with the PCB board can be carried out. The high heat after soldering the PCB board can be transferred to the cooling liquid or water in the heat dissipation pipe 53 by using the pores on the porous bracket 6 to achieve heat exchange and improve the cooling effect. The return pipe 52 is used to carry the water or cooling liquid with heat and is naturally cooled for a long time through the surrounding part outside the housing 1, and finally introduced into the water tank 4 for further cooling for subsequent use.

[0040] In the description of this specification, the descriptions referring to the terms "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0041] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A solder cooling device for a PCB board, characterized in that: It includes a housing (1); a wind collecting hood (2) is fixedly connected to the top of the housing (1); a guide pipe (21) is connected to the top of the wind collecting hood (2) in communication; a baffle (18) is fixedly connected to the middle of the housing (1), and a porous support (6) is fixedly connected to the top of the baffle (18); a surrounding heat dissipation pipe (53) is arranged inside the porous support (6), and both ends of the heat dissipation pipe (53) are respectively connected to a liquid supply pipe (51) and a return pipe (52) in communication; one end of the liquid supply pipe (51) away from the heat dissipation pipe (53) is connected to a water tank (4) in communication, and one end of the return pipe (52) away from the heat dissipation pipe (53) is connected to the other end of the water tank (4); the water tank (4) is arranged inside the housing (1) and is located below the baffle (18); both ends of the housing (1) are rotatably connected with fan blades (14) through a first support (13); the middle part of the return pipe (52) is arranged outside the housing (1) and is aimed at one side of the fan blade (14). An air supply part (15) is provided at the inner top of the housing (1), and three air grooves (19) are opened in the air supply part (15); the two side air grooves (19) are inclined towards both sides, and the middle air groove (19) is vertically downward; an air cavity is gathered at the top of the air groove (19), and the air cavity is communicated with the wind collecting hood (2). Air guiding plates (16) with the same inclination are fixedly connected to the bottoms of the two side air grooves (19), and flow dividing fins (17) are fixedly connected to the air guiding plates (16); the lengths of the two side flow dividing fins (17) are smaller than the length of the middle flow dividing fin (17). A plurality of flow guiding plates (41) are sequentially arranged in the water tank (4) from top to bottom, and the plurality of flow guiding plates (41) are arranged alternately and inclined downward; the return pipe (52) is connected to the upper part of the water tank (4), and the liquid supply pipe (51) is connected to the bottom of the water tank (4).

2. The solder cooling device for a PCB board according to claim 1, characterized in that: Through holes are further opened at both ends of the housing (1), and the through holes are arranged corresponding to the fan blades (14); a dust-proof cover (3) is fixedly connected to the outside of the housing (1) corresponding to the through holes.

3. The solder cooling device for a PCB board according to claim 2, wherein: A cover plate (11) is further embedded and connected to one side of the housing (1), and an observation groove (12) is opened in the middle of the cover plate (11); the baffle (18) inside the housing (1) is of an L-shaped structure; two inserting rods are fixedly connected to the side of the baffle (18) facing the cover plate (11), and holes are opened in the cover plate (11) corresponding to the inserting rods; the inserting rods are in plug-in fit with the holes.

4. A PCB board soldering tin cooling device according to claim 3, characterized in that: The inside of the porous support (6) is hollow, and the heat dissipation pipe (53) inside the porous support (6) is arranged in an S-shaped surrounding manner; the heat dissipation pipe (53) is composed of two independent pipes, and the inlets and outlets of the two independent pipes are respectively connected to the liquid supply pipe (51) and the return pipe (52) in communication.

5. A PCB board soldering tin cooling device according to claim 4, characterized in that: The middle part of the return pipe (52) is located outside the housing (1), and the middle part of the return pipe (52) is arranged in an S-shaped structure and is arranged corresponding to the fan blade (14).

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