Method and device for manufacturing three-dimensional object

Abstract

Provided are a method and apparatus for manufacturing a three-dimensional object that can alleviate the limitations of a curable resin used when manufacturing a three-dimensional object having an electronic device using a stacking molding method. The method for manufacturing a three-dimensional object disclosed herein includes the following steps: a first molding step, using a stacking molding method, molding a mounted object having a mounting portion for mounting an electronic device using a first curable resin; a second molding step, using a stacking molding method, molding a resin layer using a second curable resin, molding a conductor using a fluid containing metal particles, and molding an electronic device having a conductor in the resin layer; and an installation step, installing the electronic device on the mounting portion of the mounted object.

Description

Technical Field

[0001] The present invention relates to a method and a device for manufacturing a three-dimensional object using a layered modeling method. Background Art

[0002] In the past, a technique for manufacturing a three-dimensional object having a conductor by a stacking molding method has been developed. For example, in the method for manufacturing a three-dimensional object of the following patent document 1, first, after a UV curable composition is ejected from an inkjet printer, UV is irradiated onto the ejected UV curable composition to cure it. Next, a conductive metal ink composition is ejected from the inkjet printer onto the surface of the cured UV curable composition, and the ejected conductive metal ink composition is heated to mold a conductive trace.

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2020-015311 Summary of the invention

[0005] Problems to be solved by the invention

[0006] In the technology described in the above-mentioned patent document 1, a three-dimensional object having a conductor is manufactured. However, when a conductor such as a conductive trace is molded, there are sometimes restrictions on the molding, which is different from general molding. Specifically, there is a problem that the physical properties of the UV curable composition (such as ultraviolet curing resin) are restricted in consideration of the influence on the electrical characteristics of the conductive trace.

[0007] The present disclosure has been made in view of the above circumstances, and an object is to provide a method and apparatus for manufacturing a three-dimensional object that can alleviate the limitation of the curable resin used when manufacturing a three-dimensional object having an electronic device using a layered molding method.

[0008] Means for solving problems

[0009] In order to solve the above-mentioned problems, the present invention discloses a method for manufacturing a three-dimensional shaped object, which is a method for manufacturing a three-dimensional shaped object on which an electronic device is installed. The manufacturing method of the above-mentioned three-dimensional shaped object includes the following steps: a first modeling step, using a stacking modeling method, using a first curable resin to shape the above-mentioned object to be installed having a mounting portion for mounting the above-mentioned electronic device; a second modeling step, using a stacking modeling method, using a second curable resin to shape a resin layer, using a fluid containing metal particles to shape a conductor, and shaping the above-mentioned electronic device having the above-mentioned conductor in the above-mentioned resin layer; and an installation step, installing the above-mentioned electronic device on the above-mentioned mounting portion of the above-mentioned object to be installed.

[0010] It should be noted that the content of the present disclosure is not limited to being implemented as a method for manufacturing a three-dimensional object, and can be implemented in various ways. For example, the content of the present disclosure is also beneficial even if it is implemented as a manufacturing device for manufacturing a three-dimensional object.

[0011] Effects of the Invention

[0012] According to the manufacturing method of the three-dimensional shaped object and the manufacturing device for manufacturing the three-dimensional shaped object disclosed in the present invention, the electronic device is pre-shaped in the second shaping process and installed on the object to be installed that was shaped in another first shaping process. In other words, the object to be installed in the electronic device can be manufactured in a process different from the electronic device. Therefore, there is no restriction on the physical properties required of the second curable resin used in the second shaping process for the first curable resin used in the first manufacturing process. The restriction on the physical properties required of the first curable resin can be relaxed, and the freedom to select the first curable resin is increased. In addition, since the freedom to select the first curable resin is increased, the manufacturing cost of manufacturing the three-dimensional shaped object can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a plan view schematically showing a state in which the electronic device manufacturing apparatus according to the first embodiment is viewed from above.

[0014] Figure 2 is a block diagram showing a control device.

[0015] Figure 3 is a block diagram showing a control device.

[0016] Figure 4 This is a diagram showing a molded object manufactured using an electronic device manufacturing apparatus.

[0017] Figure 5 2 is a diagram showing an electronic device manufactured on a base member.

[0018] Figure 6 It is a figure which shows the difference of the shaping|molding method of the 1st shaping|molding unit and the 2nd shaping|molding unit in each embodiment.

[0019] Figure 7 It is a flowchart showing the manufacturing process of a molded object.

[0020] Figure 8 It is a figure which shows the manufacturing process of a sculptured object.

[0021] Fig. 9 It is a figure which shows the manufacturing process of 2nd Embodiment. DETAILED DESCRIPTION

[0022] (1. Structure of electronic device manufacturing apparatus)

[0023] Hereinafter, a first embodiment of the present disclosure will be described with reference to the attached drawings. Figure 1 While explaining in detail. Figure 1 1 is a schematic top view showing a state when the electronic device manufacturing apparatus 10 of this embodiment is viewed from above. Figure 1 As shown, the electronic device manufacturing device 10 includes: a conveying device 20, a first molding unit 22, a second molding unit 23, an assembly unit 24, an assembly unit 25, a scanning unit 26 and a control device 27 (see Figure 2 , Figure 3 ). The conveying device 20, the first molding unit 22, the second molding unit 23, the assembly unit 24, the assembly unit 25, and the scanning unit 26 are arranged on the base 28 of the electronic device manufacturing device 10. The base 28 is roughly rectangular in a plan view. In the following description, the length direction of the base 28 is referred to as the X-axis direction, the width direction of the base 28 is referred to as the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction is referred to as the Z-axis direction.

[0024] The electronic device manufacturing device (hereinafter referred to as manufacturing device) 10 is a device for manufacturing a molded object obtained by mounting an electronic device manufactured by the second molding unit 23 and the assembly unit 24 on an object to be mounted molded by the first molding unit 22. Figure 4 As shown in FIG. 1 , a manufacturing device 10 manufactures a modeled object 13 in which an electronic device 12 is built into a human-shaped object to be mounted. In the following description, as an example, the modeled object manufactured is described. Figure 4 The case of the shaped object 13 shown will be described.

[0025] first, Figure 1 The transport device 20 shown in the figure has an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slide 36. The X-axis slide rail 34 is arranged on the base 28 in a manner extending along the X-axis direction. The X-axis slide 36 is held by the X-axis slide rail 34 in a manner that allows it to slide in the X-axis direction. The X-axis slide mechanism 30 has an electromagnetic motor 38 (see Figure 2 ), the X-axis slide 36 is moved to any position in the X-axis direction by driving the electromagnetic motor 38.

[0026] In addition, the Y-axis sliding mechanism 32 includes a Y-axis slide rail 41 and a stage 43. The Y-axis slide rail 41 is arranged on the base 28 in a manner extending along the Y-axis direction. One end of the Y-axis slide rail 41 is connected to the X-axis slide member 36. Therefore, the Y-axis slide rail 41 can move in the X-axis direction. The stage 43 is held by the Y-axis slide rail 41 in a manner that allows it to slide in the Y-axis direction. The Y-axis sliding mechanism 32 includes an electromagnetic motor 39 (see Figure 2), the stage 43 is moved to any position in the Y-axis direction by driving the electromagnetic motor 39. Thus, the stage 43 is moved to any position on the base 28 by driving the X-axis sliding mechanism 30 and the Y-axis sliding mechanism 32.

[0027] The stage 43 includes a base 51, a holding device 52, and a lifting device 53. The base 51 is formed in a flat plate shape, and a base member 55 is placed on the upper surface. The holding device 52 is provided on both sides of the base 51 in the X-axis direction. The holding device 52 holds the base member 55 fixedly relative to the base 51 by clamping both edges of the base member 55 placed on the base 51 in the X-axis direction. In addition, the lifting device 53 is arranged below the base 51 to lift and lower the base 51 in the Z-axis direction.

[0028] The first molding unit 22 is a molding unit that molds the object 11 (see FIG. 1 ) on a base member 55 placed on a base 51. Figure 4 ) is a unit for modeling, comprising a first printing unit 61, a curing unit 62, a second printing unit 63 and a removing unit 64. The first printing unit 61 is a unit for modeling by, for example, an inkjet method, and ejects ultraviolet curing resin from an inkjet head onto a base member 55 placed on a base 51. Ultraviolet curing resin is a resin that is cured by irradiation with ultraviolet rays. It should be noted that the method by which the first printing unit 61 ejects the ultraviolet curing resin may be, for example, a piezoelectric method using a piezoelectric element, or a thermal method by heating the resin to generate bubbles and ejecting it from a plurality of nozzles.

[0029] The curing section 62 has a flattening device 67 (see Figure 2 ) and irradiation device 68 (refer to Figure 2 ). The flattening device 67 flattens the upper surface of the ultraviolet curing resin ejected onto the base member 55 by the first printing unit 61. The flattening device 67, for example, flattens the surface of the ultraviolet curing resin while scraping off excess resin using a roller or a scraper, thereby making the thickness of the ultraviolet curing resin uniform. In addition, the irradiation device 68 includes a mercury lamp or an LED as a light source, and irradiates ultraviolet light to the ultraviolet curing resin ejected onto the base member 55. As a result, the ultraviolet curing resin ejected onto the base member 55 is cured, and a resin layer can be formed.

[0030] The second printing unit 63 is a device that ejects the supporting material onto the base member 55 by inkjet method, for example, to form the supporting member 15 of the object to be mounted 11 (see FIG. 1 ). Figure 4) is a device for shaping. As the supporting material, for example, a material that can be dissolved by a specific liquid such as water or medicine (a wax-based material or a resin-based material, etc.) can be used. Alternatively, as the supporting material, a material that melts by heat can be used. In addition, as the supporting material, a material that cures by irradiating light such as ultraviolet rays, a material that cures by applying heat, a material that cures naturally over time after being ejected, etc. can be used. For example, by ejecting an ultraviolet curing resin along a portion of the supporting member 15 obtained by curing the supporting material and curing it, it is possible to shape the object to be mounted 11 along the shape of the supporting member 15 (see Figure 4 ). In addition, the support member 15 can be removed from the integrated body of the support member 15 and the mounted object 11 by using a drug or the like to shape a shape having an overhanging portion (for example, Figure 4 The object to be installed 11 is a part of the arm, etc.

[0031] The second printing section 63, like the first printing section 61, may be a structure that ejects the supporting material by a piezoelectric method using a piezoelectric element, or may be a structure that ejects the supporting material by a thermal method. In addition, the printing device that ejects the ultraviolet curing resin, the supporting material, the metal ink described later, the conductive resin paste, etc. is not limited to an inkjet head having a plurality of nozzles, and may be, for example, a dispenser having one nozzle. In addition, the first molding unit 22 may use the same inkjet head as an inkjet head that ejects the ultraviolet curing resin and an inkjet head that ejects the supporting material, and switch the ejected curable viscous fluid. The same is true for the metal ink and conductive resin paste described later.

[0032] In addition, the removal unit 64 is a unit that removes the support 15 formed by the second printing unit 63. For example, when the support 15 is a material that dissolves in water, the removal unit 64 includes a robot arm that immerses the formed object 13 with the support 15 formed on the stage 43 into a water tank or a nozzle device that wipes water on the support 15. In addition, for example, when the support 15 is a material that melts by heat, the removal unit 64 may also be a structure that includes a heater or a microwave generating device that applies heat to the support 15. Therefore, the structure of the removal unit 64 is appropriately changed according to the type of the support material.

[0033] Figure 5 The electronic device 12 is shown manufactured on the base member 55. Figure 5As shown, the manufacturing device 10 of this embodiment manufactures the electronic device 12 on the peeling film 85 in a state where a peeling film 85 that can be peeled off by heat is attached to the upper surface of the base member 55. The peeling film 85 is a member that is peeled off from the base member 55 by being heated to a predetermined temperature or higher, for example. By peeling the peeling film 85 off from the base member 55, the electronic device 12 can be separated from the base member 55. It should be noted that the method of separating the base member 55 from the electronic device 12 is not limited to the method of using the peeling film 85. For example, a peeling film 85 may be arranged between the base member 55 and the electronic device 12. Figure 4 The support member 15 shown is separated by melting / dissolving the support member 15. Alternatively, the electronic device 12 may be directly manufactured on the base member 55 without using a separate component such as a release film 85.

[0034] like Figure 5 As shown, the electronic device 12 has an electronic component 81 mounted on a circuit board 83 . Figure 1 The second molding unit 23 is a unit for molding the circuit board 83, and includes a third printing section 71, a curing section 72, a fourth printing section 73, and a firing section 74. In the following description, the description of the same contents as the first molding unit 22 is appropriately omitted.

[0035] like Figure 5 As shown in FIG. 1 , the circuit board 83 includes, for example, an insulating layer 87, wirings 89 arranged on each layer of the insulating layer 87, through holes 91 connecting the wirings 89 of each layer to each other, and connection terminals 93 connecting the electronic element 81 to the wirings 89. The third printing unit 71 is, for example, a device that ejects ultraviolet curing resin onto the base member 55 by inkjet method. The curing unit 72 includes a flattening device 101 (see FIG. 1 ) that flattens the ultraviolet curing resin ejected from the third printing unit 71. Figure 2 ) and an irradiation device 103 (see Figure 2 The second molding unit 23 molds the insulating layer 87 on the base member 55 by repeatedly performing the ejection of the third printing unit 71 , the flattening of the flattening device 101 , and the curing of the irradiation device 103 .

[0036] The fourth printing unit 73 is a device that ejects metal ink onto the base member 55, the layers of the insulating layer 87, the holes for through-holes formed in the layers of the insulating layer 87, the surface of the insulating layer 87, etc., by means of an inkjet head. The metal ink referred to here is, for example, a material obtained by dispersing nano-sized metal (silver, etc.) particles in a solvent as a main component and solidified by firing with heat. The metal ink contains, for example, metal nanoparticles with a size of several hundred nanometers or less. The surface of the metal nanoparticles is coated with a dispersant, for example, and aggregation in the solvent is suppressed.

[0037] In addition, the fourth printing unit 73 is a device that uses a dispenser (not shown) to spray conductive resin paste onto the surface of the insulating layer 87, the wiring 89, etc. The conductive resin paste is, for example, a paste in which metal particles (silver, etc.) of micrometer size are dispersed in a resin adhesive that is cured by heating. The metal particles are, for example, in the form of flakes. The adhesive contains, for example, an epoxy resin as a main component. The conductive resin paste is cured by applying heat, so that the resin shrinks and the flake-shaped metal particles dispersed in the resin come into contact with each other. As a result, the conductive resin paste exhibits conductivity.

[0038] The conductive paste is heated to cure the adhesive (resin, etc.), and the sheet metal is cured in a state of contact with each other. On the other hand, in the metal ink, for example, the metal nanoparticles are fused together by heating to form an integrated metal, and the conductivity becomes higher than the state where the metal nanoparticles are just in contact with each other. In addition, the conductor formed by the conductive resin paste has a lower conductivity than the conductor formed by the metal ink, but on the other hand, the adhesion is strong due to the curing of the resin, and the adhesion is excellent. Therefore, the manufacturing device 10, for example, shapes the conductor that meets the purpose by separately using the metal ink with high conductivity and the conductive resin paste with high adhesion. The manufacturing device 10, for example, uses the conductive resin paste for the connection terminal 93 that requires adhesion, and uses the metal ink for the wiring 89 and the through hole 91 that require conductivity.

[0039] It should be noted that the fourth printing unit 73 may also use methods other than inkjet heads and dispensers to eject and apply the metal ink and the conductive resin paste. The types of metals contained in the metal ink and the conductive resin paste are not limited to silver, and may also be copper, gold, etc., or may be multiple types. In addition, the third printing unit 71 may also be a structure that uses only one of the metal ink and the conductive resin paste.

[0040] The firing section 74 is, for example, a device that uses an infrared heater to heat the metal ink or conductive resin paste ejected from the fourth printing section 73. The metal ink or conductive resin paste is fired by applying heat from the infrared heater to form wiring 89, etc. The firing mentioned here is, for example, the following phenomenon: by applying heat to the metal ink, the solvent is vaporized and the protective film of the metal nanoparticles, that is, the dispersant, is decomposed, etc., and the conductivity becomes higher by the contact or fusion of the metal nanoparticles. Alternatively, firing is the following phenomenon: by applying heat to the conductive resin paste, the resin is shrunk, and the flaky metal particles dispersed in the resin are contacted and fixed with each other. It should be noted that the device for heating the metal ink or conductive resin paste is not limited to the infrared heater. For example, the manufacturing device 10 can also be equipped with an infrared lamp, a laser irradiation device, or an electric furnace that heats the metal ink or conductive resin paste by placing it in the furnace.

[0041] The mounting unit 24 is a unit for placing the electronic components 81 on the base member 55 placed on the base 51, and includes a supply unit 105 and a mounting unit 106. The supply unit 105 includes a plurality of tape feeders 107 (see FIG. 1 ) for feeding the electronic components braided one by one. Figure 3 ), supplying electronic components 81 at each supply position. The electronic components 81 are, for example, sensor components such as temperature sensors. It should be noted that the supply unit 105 is not limited to a device that supplies electronic components 81 from a tape feeder 107, but may also be a tray-type supply device that picks up electronic components 81 from a tray and supplies them.

[0042] The mounting section 106 has a mounting head 108 (see Figure 3 ) and mobile device 109 (refer to Figure 3 ). The mounting head 108 has a suction nozzle for sucking and holding the electronic component 81. In addition, the moving device 109 moves the mounting head 108 between the supply position of the tape feeder 107 and the base component 55 placed on the base 51. Thus, the mounting section 106 uses the mounting head 108 to hold the electronic component 81, and places the electronic component 81 held by the mounting head 108 on the base component 55.

[0043] The assembly unit 25 is a device for attaching the mounting portion 11A (see Figure 4 ) is a device for mounting the electronic device 12. The assembly unit 25, for example, includes a robot arm 111 for holding the electronic device 12. The assembly unit 25, for example, uses the robot arm 111 to hold the electronic device 12 manufactured on the base member 55 by the second molding unit 23 and the assembly unit 24 and removes it from the base member 55. In addition, the assembly unit 25 uses the robot arm 111 to hold the electronic device 12 and mount it on the object 11.

[0044] The scanning unit 26 is a device for generating 3D data. The scanning unit 26 includes, for example, a movable camera, and captures the electronic device 12 from the X-axis direction, the Y-axis direction, and the Z-axis direction. The manufacturing device 10 generates 3D data 112 of the electronic device 12 based on the captured data captured by the scanning unit 26, and stores the data in the storage device 119 of the manufacturing device 10 (see Figure 3 ). It should be noted that the method for generating the 3D data 112 is not limited to the method of photographing using a camera, and other methods such as infrared scanning may also be used. In addition, the object for generating the 3D data 112 is not limited to the electronic device 12, and may also be the mounted object 11. In addition, the manufacturing device 10 may also use the photographing data of the scanning unit 26 for purposes other than the generation of the 3D data 112. For example, the manufacturing device 10 may also perform an inspection of the modeling object 13 based on the photographing data of the scanning unit 26.

[0045] Next, the structure of the control device 27 of the manufacturing device 10 will be described. Figure 2 and Figure 3 As shown, the control device 27 includes: a controller 117, a plurality of drive circuits 118 and a storage device 119. The plurality of drive circuits 118 are connected to the electromagnetic motors 38, 39, the holding device 52, the lifting device 53, the first molding unit 22, the second molding unit 23, the assembly unit 24, the assembly unit 25, and the scanning unit 26.

[0046] The controller 117 includes a CPU, ROM, RAM, etc., and is mainly a computer, and is connected to a plurality of drive circuits 118. The storage device 119 includes a RAM, ROM, a hard disk, etc., and is used to store the above-mentioned 3D data 112. In addition, the storage device 119 stores a control program 113 and design data 114. The control program 113 is a program for controlling the manufacturing device 10. The controller 117 can control the operation of the conveying device 20, the first molding unit 22, etc. by executing the control program 113 using the CPU. In the following description, the controller 117 executing the control program 113 to control each device is sometimes referred to as a "device". For example, "the controller 117 moves the carrier 43" means "the controller 117 uses the CPU to execute the control program 113, controls the operation of the conveying device 20 via the drive circuit 118, and moves the carrier 43 through the operation of the conveying device 20".

[0047] The design data 114 is 3D data of each layer obtained by slicing the finished object 13 (electronic device 12 or mounted object 11). The controller 117 determines the ejection position of the ultraviolet curing resin based on the design data 114 of the storage device 119, and shapes the object 13. In addition, the controller 117 determines the layer and position of the electronic component 81 based on the design data 114, and mounts the electronic component 81 on the circuit board 83.

[0048] (2. Differences in Modeling Methods between the First Modeling Unit 22 and the Second Modeling Unit 23)

[0049] As described above, the manufacturing apparatus 10 of the present embodiment shapes the circuit board 83 using the second shaping unit 23, and shapes the object 11 to be mounted on the electronic device 12 in the first shaping unit 22. When shaping conductors such as the wiring 89, the through hole 91, and the connection terminal 93, there are limitations on shaping.

[0050] Specifically, Figure 6 The difference between the molding methods of the first molding unit 22 and the second molding unit 23 of each embodiment is shown. For example, the ultraviolet curing resin used in the third printing unit 71 has lower wettability with respect to the conductor than the ultraviolet curing resin used in the first printing unit 61. The wettability mentioned here refers to, for example, the affinity of the liquid on the surface of the solid. And, if the wettability becomes higher, the affinity becomes better, and the liquid becomes easy to spread on the surface of the solid. On the other hand, if the wettability becomes lower, the affinity becomes worse, and the liquid becomes difficult to spread on the surface of the solid. If the wettability of the ultraviolet curing resin is high, the ultraviolet curing resin sprayed onto the wiring 89, the through hole 91, the connection terminal 93, etc. may spread beyond the position specified by the design data 114. As a result, the conductivity of the wiring 89 is reduced, and the electrical characteristics may be reduced. Therefore, as the ultraviolet curing resin used in the third printing unit 71, a resin with lower wettability is used. As a result, the spreading of the ultraviolet curing resin can be suppressed and molding can be performed in a shape closer to the design data 114, and the electrical characteristics of the conductor can be improved.

[0051] In addition, for example, the linear expansion coefficient of the ultraviolet curing resin used in the third printing section 71 of the second molding unit 23 is smaller than the linear expansion coefficient of the ultraviolet curing resin used in the first printing section 61 of the first molding unit 22. In the manufacture of the wiring 89 or the connection terminal 93, when the metal ink or the conductive resin paste is fired, heat is also applied to the insulating layer 87 under the metal ink or the like. The insulating layer 87 expands according to the linear expansion coefficient of the ultraviolet curing resin constituting the insulating layer 87 by being heated. Due to the expansion of the insulating layer 87, a part of the wiring 89 or the like formed on the insulating layer 87 may bulge or break. Therefore, for example, as the ultraviolet curing resin used in the third printing section 71, a resin with a smaller linear expansion coefficient is used. Alternatively, for example, as the ultraviolet curing resin used in the third printing section 71, a resin having a glass transition point higher than the heating temperature when fired by the firing section 74 may be used. As a result, the expansion of the insulating layer 87 during firing can be suppressed, and the rupture of the wiring 89 or the like can be suppressed.

[0052] In addition, for example, the ultraviolet curing resin used in the third printing unit 71 has a higher adhesion to the conductor than the ultraviolet curing resin used in the first printing unit 61. The adhesion mentioned here, for example, indicates the degree of adhesion of the ultraviolet curing resin to the conductor. For example, the adhesion is the degree of adhesion to the conductor just after the discharge when the ultraviolet curing resin droplets are sprayed on the conductor such as the wiring 89. In this case, for example, the adhesion can be evaluated by the adhesion for a predetermined time after the discharge. Alternatively, the adhesion is the degree of adhesion of the insulating layer 87 to the conductor after the ultraviolet curing resin droplets are sprayed on the conductor and cured. In this case, for example, the adhesion can be evaluated by the adhesion for a predetermined time after the curing by ultraviolet rays. In addition, the adhesion can also be evaluated by the adhesion of the metal ink and the conductive resin paste to the insulating layer 87. That is, the adhesion disclosed in the present invention is the degree of adhesion between the ultraviolet curing resin (insulating layer 87) and the metal ink and the conductive resin paste (conductor).

[0053] If an ultraviolet curing resin with low adhesion is used, the conductor disposed on the insulating layer 87 or the conductor disposed in the insulating layer 87 may be peeled off from the insulating layer 87. As a result, there is a possibility that a gap is formed in a part of the circuit substrate 83, and there is a possibility that a part of the circuit substrate 83 is peeled off. Therefore, as the ultraviolet curing resin used for the third printing unit 71, a resin with higher adhesion is used. As a result, the adhesion between the conductor and the insulating layer 87 can be improved, and the peeling of the conductor or the insulating layer 87 can be suppressed.

[0054] On the other hand, as the ultraviolet curing resin used in the first printing unit 61, various resins can be widely used without setting the restrictions of the linear expansion coefficient, glass transition point, wettability, adhesion, etc. as described above. The lower the linear expansion coefficient, the higher the glass transition point, the lower the wettability, the higher the adhesion, etc., the higher the price of the ultraviolet curing resin that can be used. If an ultraviolet curing resin with a low linear expansion coefficient is used for the entire shaped object 13, the manufacturing cost of the shaped object 13 will increase. Therefore, the manufacturing device 10 of this embodiment uses ultraviolet curing resins with different physical properties as ultraviolet curing resins used in the first molding unit 22 and the second molding unit 23.

[0055] Therefore, the ultraviolet curing resin used for the electronic device 12 of the present embodiment (an example of the second curing resin disclosed in the present invention) satisfies the conditions of lower wettability with respect to conductors such as wiring 89 and connecting terminals 93 compared to the ultraviolet curing resin used for the modeling of the object 11 (an example of the first curing resin disclosed in the present invention), lower linear expansion coefficient than the ultraviolet curing resin used for the electronic device 12, and higher adhesion than the ultraviolet curing resin used for the electronic device 12.

[0056] When ultraviolet curing resin is sprayed onto a conductor molded using metal ink or conductive resin paste, the conductivity of the conductor may be deteriorated due to the spreading of the ultraviolet curing resin. Therefore, in order to suppress the spreading to a position closer than the design data 114, a lower wettability is required for the ultraviolet curing resin used in the electronic device 12. In addition, if the insulating layer 87 expands when the metal ink is heated, the conductor may be cracked or cut. In addition, if the ultraviolet curing resin has low adhesion to the conductor, the conductor may be peeled off from the insulating layer 87. Therefore, a lower linear expansion coefficient and higher adhesion are required for the ultraviolet curing resin used in the electronic device 12. As described later, by separating the manufacturing process of the circuit substrate 83 from the manufacturing process of the mounted object 11, the above-mentioned restrictions on the ultraviolet curing resin used for the mounted object 11 can be alleviated.

[0057] It should be noted that the ultraviolet curing resin used for the electronic device 12 may be an ultraviolet curing resin that satisfies at least one of the above three conditions, or may not satisfy any of the three conditions. For example, the ultraviolet curing resin used for the object to be mounted 11 may be a resin that satisfies the conditions of easier color change or faster molding speed than the ultraviolet curing resin used for the electronic device 12. Therefore, the ultraviolet curing resin used for the object to be mounted 11 has a high degree of freedom in selection because the object to be mounted 11 is a general resin molding and does not have a conductor or electronic component 81.

[0058] In addition, as described above, in the molding of the conductor such as the wiring 89, the temperature of the metal ink etc. rises during the firing process by the firing section 74. As a result, if the conductor is fired while being supported by the support 15, the support 15 may melt. In such a case, there is a restriction that the support 15 cannot be used in the molding of the second molding unit 23. Therefore, in the manufacturing device 10 of the present embodiment, the support 15 is not used in the molding of the second molding unit 23, and the support 15 is used in the molding of the first molding unit 22. Thus, it is possible to manufacture a molded object 13 in which the conductor is molded by the stacking molding method while molding the overhanging portion etc. using the support 15.

[0059] (3. Operation of the manufacturing device)

[0060] Next, Figure 4 The manufacturing process of the modeled object 13 having the electronic device 12 mounted thereon will be described. Figure 7 1 is a flow chart showing the manufacturing process of the molded object 13. It should be noted that Figure 7 The contents and order of each step of the manufacturing process shown are examples. In addition, the design data 114 of the storage device 119, for example, is set with 3D data of each layer obtained by slicing the finished object 13. The controller 117 executes the control program 113 by using the CPU and controls the first molding unit 22 based on the design data 114. Figure 7 Controls shown.

[0061] First, in Figure 7 In step (hereinafter abbreviated as S) 11, the controller 117 executes the manufacture of the electronic device 12. After the base component 55 is installed on the base 51 of the carrier 43, the controller 117 manufactures the electronic device 12 on the base component 55 while moving the carrier 43. The controller 117 controls the conveying device 20 to move the carrier 43 toward the second molding unit 23 and the assembly unit 24. The second molding unit 23 ejects ultraviolet curing resin from the third printing section 71 based on the control of the controller 117, and molds the insulating layer 87 by curing it using the curing section 72. In addition, during the process of molding the insulating layer 87, the second molding unit 23 ejects metal ink or conductive resin paste from the fourth printing section 73 and burns it using the burning section 74, thereby molding conductors such as wiring 89. As Figure 5 As shown, the controller 117 shapes the circuit board 83 on the release film 85 attached to the base member 55. It should be noted that the attachment of the release film 85 can be performed manually by a person or by the robot arm 111 of the assembly unit 25.

[0062] In addition, the assembly unit 24 assembles the electronic component 81 in the molding of the circuit substrate 83. The controller 117 assembles the electronic component 81 by using the assembly unit 24 after the conductive resin paste is ejected from the fourth printing unit 73 based on the design data 114, for example, in accordance with the position of the connection terminal 93. Figure 5 As shown, the controller 117 controls the mounting section 106 to mount the electronic component 81 so that the terminal 82 of the electronic component 81 is connected to the wiring 89 via the connecting terminal 93. After mounting the electronic component 81, the controller 117 uses the firing section 74 to fire the conductive resin paste to shape the connecting terminal 93, and then mounts the electronic component 81 on the circuit board 83. The controller 117 manufactures the electronic component 81 while appropriately performing the above-mentioned steps. Figure 5 An electronic device 12 is shown.

[0063] After the controller 117 completes the manufacture of the electronic device 12 in S11, the controller 117 moves the stage 43 toward the scanning unit 26 to scan the manufactured electronic device 12 (S13). The controller 117 uses the scanning unit 26 to photograph the electronic device 12 manufactured on the base member 55. The controller 117 generates 3D data 112 of the electronic device 12 based on the photographing data of the scanning unit 26, and stores it in the storage device 119 (S13).

[0064] Here, in the stacking molding, the size or shape of the molded object actually molded may be different from the design data 114 due to the expansion or contraction of the medium used in the molding, such as the ultraviolet curing resin. For example, the molded object actually molded may expand or contract by several tens of μm compared to the design data 114. When an error occurs in the size or shape of the electronic device 12, when the electronic device 12 is mounted on the mounting portion 11A of the mounted object 11, an undesirable condition may occur, such as interference between the electronic device 12 and the mounting portion 11A or a gap may be formed between the electronic device 12 and the inner wall of the mounting portion 11A.

[0065] After executing S13, the controller 117 corrects the size and shape of the mounting portion 11A in the design data 114 based on the 3D data 112 generated in S13 (S15). Thus, the design data 114 of the mounting portion 11A can be corrected to match the size and shape of the electronic device 12 actually manufactured, that is, to correct the error in the shape. For example, the controller 117 corrects the value of the shape position of the mounting portion 11A in the design data 114, the ejection amount, etc., so that the mounting portion 11A is in accordance with the shape of the 3D data 112 (S15).

[0066] It should be noted that, similar to the shape of the electronic device 12, the ultraviolet curing resin may also expand or contract in the shape of the object 11 to be mounted. Therefore, the controller 117 may also correct the design data 114 of the object 11 to be mounted based on the design error of the object 11 itself. For example, the controller 117 may correct the design data 114 of the object 11 to be mounted by an amount equal to the amount of expansion or contraction of the electronic device 12, that is, the error in the shape of the electronic device 12. For example, in the case where the electronic device 12 expands by 10 μm compared to the design data 114, it can be assumed that the mounting portion 11A also expands by 10 μm, and the hole of the mounting portion 11A is enlarged by 20 μm. That is, it can be assumed that the mounting portion 11A also expands in the same manner as the electronic device 12 and the shape of the mounting portion 11A is corrected by twice the amount.

[0067] Alternatively, the controller 117 may shape the object 11 and scan it in the same manner as the electronic device 12, generate 3D data 112 of the object 11, and correct the design data 114. Alternatively, the controller 117 may scan the electronic device 12 and correct the design data 114 of the electronic device 12 to be manufactured next. Alternatively, the controller 117 may shape the object 11 and scan the object 11, and correct the design data 114 of the electronic device 12 without scanning the electronic device 12.

[0068] After executing S15, the controller 117 moves the carrier 43 toward the first molding unit 22 and starts molding the object 11 to be mounted (S17). For example, the controller 117 moves the carrier 43 on which the electronic device 12 is molded toward the firing section 74, and uses the firing section 74 to apply heat to the peeling film 85 to peel it off. The controller 117 moves the carrier 43 toward the assembly unit 25, removes the electronic device 12 and the peeling film 85 from the base component 55, and arranges the removed electronic device 12 on a workbench (not shown) or the like of the assembly unit 25. The controller 117 molds the object 11 to be mounted on the base component 55 after the peeling film 85 and the electronic device 12 are removed. It should be noted that the controller 117 can also release the fixing of the holding device 52, remove the base component 55 on which the electronic device 12 is mounted from the carrier 43, install a new base component 55 on the carrier 43, and mold the object 11 to be mounted.

[0069] Figure 8 FIG. 1 shows the molding process of the molding object 13. Figure 8As shown, the controller 117 controls the second printing unit 63, for example, to eject the supporting material 122 from the inkjet head 121 of the second printing unit 63 onto the base member 55, and solidifies the supporting material 122 to shape the supporting member 15. A mold for shaping the object 11 to be mounted is formed on the supporting member 15. Next, the controller 117 ejects the ultraviolet curing resin 126 from the inkjet head 125 of the first printing unit 61 onto the supporting member 15. The ultraviolet curing resin 126 is, for example, a resin having a higher linear expansion coefficient, a resin having a higher wettability, or a resin having a lower adhesion than the ultraviolet curing resin used to shape the insulating layer 87 of the above-mentioned object 13. The controller 117 repeatedly executes the ejection of the ultraviolet curing resin 126 by the first printing unit 61 and the solidification of the ultraviolet curing resin 126 by the solidification unit 62 to shape the object 11 to be mounted.

[0070] On the other hand, Figure 7 As shown, after the controller 117 executes S17 and starts shaping the object 11, it determines whether the shaping of the mounting portion 11A is completed (S19). The controller 117 continues shaping the object 11 until the shaping of the mounting portion 11A is completed (S19: No). When the shaping of the mounting portion 11A is completed (S19: Yes), the controller 117 interrupts shaping the object 11 (S21).

[0071] Therefore, the controller 117 scans the electronic device 12 manufactured in S11 and generates 3D data 112 (S13) of the electronic device 12. Then, the controller 117 corrects the shape of the mounting portion 11A in the design data 114 of the object 11 to be mounted based on the generated 3D data 112, and shapes the object 11 to be mounted based on the corrected design data 114 (S17).

[0072] When the stacking modeling method is used for modeling, there will be errors in shape or size between the design data 114 and the actually modeled modeled object 13. Therefore, the shape of the mounting portion 11A of the design data 114 is corrected based on the 3D data 112 obtained by scanning the actually modeled electronic device 12. As a result, the shape of the mounting portion 11A can be made to match the shape of the actually modeled electronic device 12, and the electronic device 12 can be mounted on the mounting portion 11A without interfering with the mounting portion 11A.

[0073] The controller 117 moves the stage 43 toward the assembly unit 25 to perform the operation of mounting the electronic device 12 on the mounting portion 11A (S23). Figure 8As shown, the controller 117 controls the robot arm 111 of the assembly unit 25 to install the electronic device 12 manufactured in S11 into the installation portion 11A. For example, after the robot arm 111 adsorbs the electronic device 12 using a suction nozzle and arranges it in the installation portion 11A, the robot arm 111 presses the electronic device 12 into the installation portion 11A through the arm to perform the installation of the electronic device 12.

[0074] After the controller 117 completes the installation of the electronic device 12 in S23, the stage 43 moves toward the first molding unit 22 again to restart the molding of the object 11 to be installed (S25). Figure 8 As shown, for example, the controller 117 ejects ultraviolet curing resin 126 from the inkjet 125 of the first printing unit 61 onto the electronic device 12 mounted on the mounting portion 11A and cures it. The controller 117 executes the molding by the first molding unit 22 until the molding of the mounted object 11 is completed (S25).

[0075] When the modeling of the mounted object 11 is completed, the controller 117 moves the stage 43 to the removal unit 64 to remove the support member 15 (S27). For example, the removal unit 64 puts the modeling object 13 and the support member 15 completed on the base member 55 into a water tank or a chemical tank to remove the support member 15. In this way, the modeling object 13 with the electronic device 12 mounted thereon can be manufactured.

[0076] It should be noted that the above-mentioned manufacturing method is an example. For example, the manufacturing device 10 may also include two conveying devices 20 to simultaneously manufacture the electronic device 12 and the object to be mounted 11. In addition, the manufacturing device 10 may scan the electronic device 12 each time the object 13 is manufactured, or may use the design data 114 to shape the object 11 (mounting portion 11A) to be subsequently shaped after correcting the design data 114 once based on the 3D data 112.

[0077] (4. Second Embodiment)

[0078] In addition, in the first embodiment, the first molding unit 22 and the second molding unit 23 both use the inkjet method as the stacking molding method, but the present invention is not limited thereto. For example, as the stacking molding method, it is possible to use a laser molding method (SLA), a hot melt lamination method (FDM), a powder sintering laminated molding method (SLS), etc. In the following description, as a second embodiment, a case where a pull-down laser molding method is used in the first molding unit 22 is described (refer to Figure 6 ).

[0079] Fig. 9 FIG. 2 shows a manufacturing process of the shaped object 13 of the second embodiment. The structure of the shaped object 13 of the second embodiment is the same as that of the shaped object 13 of the first embodiment. Fig. 9 As shown, in the second embodiment, for example, the base member 55 is lowered in a bath 133 in which a liquid ultraviolet curing resin 131 is stored, while the object 11 is molded. In the bath 133, for example, a lifting device 135 is provided for placing and lifting the base member 55. The controller 117 irradiates ultraviolet rays from an exposure device 137 to the ultraviolet curing resin 131 in the bath 133 to cure it. The exposure device 137 includes, for example, a light source, a polygon mirror, a reflector, etc., and can irradiate ultraviolet rays to any position of the ultraviolet curing resin 131 stored in the bath 133.

[0080] After the controller 117 uses the second printing unit 63 to shape the support member 15 on the base member 55, the controller 117 arranges the base member 55 with the support member 15 to the lifting device 135. It should be noted that the operation of arranging the base member 55 to the lifting device 135 can be performed by a person through manual operation, or the controller 117 can be performed using a robot arm, etc. After the controller 117 installs the base member 55 on the lifting device 135, each time the controller 117 controls the exposure device 137 to cure a layer of ultraviolet curing resin 131, the controller 117 controls the lifting device 135 to lower the base member 55, and stacks the cured ultraviolet curing resin 131 to shape the object to be installed (S31). The controller 117 continues the curing operation based on the exposure device 137 and the lowering operation based on the lifting device 135 until the molding of the mounting portion 11A is completed. It should be noted that, similar to the first embodiment described above, the controller 117 may correct the design data 114 of the mounting portion 11A based on the 3D data 112 obtained by scanning the electronic device 12 that is preliminarily modeled.

[0081] When the shaping of the mounting portion 11A is completed, the controller 117 interrupts the shaping operation of the mounted object 11 and installs the electronic device 12 to the mounting portion 11A (S33). The operation of installing the electronic device 12 can be performed manually by a person, or it can be performed by using a robot arm 111, etc. as in the first embodiment. In addition, when the installation operation of the electronic device 12 is completed, the controller 117 restarts the curing operation based on the exposure device 137 and performs the shaping of the mounted object 11 to the end (S35). Even when such a light shaping method is used, by dividing the shaping process of the mounted object 11 and the shaping process of the electronic device 12, the restrictions on the physical properties required of the ultraviolet curing resin 131 accumulated in the bath 133 can be alleviated.

[0082] Therefore, in the above-mentioned embodiments, in the molding of the object 11, the molding is temporarily suspended at the stage of molding the mounting portion 11A, and after the electronic device 12 is mounted on the mounting portion 11A, the molding of the remaining portion of the object 11 is restarted. In this way, the portion (the object 11) other than the electronic device 12 in the molding object 13 can be molded in one molding process. The generation of the design data 114 of the object 11 and the molding of the object 11 can be carried out relatively easily.

[0083] Furthermore, when the modeling of the object 11 is completed, the electronic device 12 is covered with the ultraviolet curing resin 126, 131, and the electronic device 12 is built in and fixed to the object 11. Thus, the modeled object 13 for fixing the electronic device 12 to the object 11 can be manufactured while relieving the restriction on the ultraviolet curing resin for modeling the object 11.

[0084] In addition, in the shaping of the object 11 to be mounted, the support 15 is used, and the object 11 to be mounted is shaped while the support 15 is used to support the shaped object obtained by curing the ultraviolet curing resin 126, 131. Some of the support 15 will melt at the heating temperature for firing the metal ink or the like. Therefore, if the electronic device 12 is to be directly shaped on the mounting portion 11A of the object 11 to be mounted, the support 15 may melt during firing. As a result, the shape of the object 11 to be mounted that can be shaped may be limited. In contrast, by separating the shaping process of the object 11 to be mounted and the shaping process of the electronic device 12, the object 11 to be mounted can be shaped while the support 15 is used, and the degree of freedom of the shape of the object 11 to be mounted can be increased.

[0085] Incidentally, in each of the above-mentioned embodiments, the electronic device manufacturing device 10 is an example of a manufacturing device. The molded object 13 is an example of a three-dimensional molded object. The first molding unit 22 is an example of a first molding device. The second molding unit 23 is an example of a second molding device. The assembly unit 25 is an example of a mounting device. The insulating layer 87 is an example of a resin layer. The wiring 89, the through hole 91, and the connecting terminal 93 are examples of conductors. The ultraviolet curable resin 126 and 131 are examples of a first curable resin. S11 is an example of a second molding process. S17 and S25 are examples of a first molding process. S23 is an example of a mounting process. Metal ink and conductive resin paste are examples of fluids containing metal particles. S13 is an example of a 3D data generation process.

[0086] As described above, according to each of the above-mentioned embodiments, the following effects are achieved.

[0087] The controller 117 of the embodiment shapes the insulating layer 87 using ultraviolet curing resin having different physical properties from the ultraviolet curing resins 126 and 131, and shapes the wiring 89 and the like using metal ink or conductive resin paste, thereby shaping the electronic device 12 (S11). In addition, the controller 117 shapes the object 11 having the mounting portion 11A using the ultraviolet curing resins 126 and 131 (S17, S25, S31, S35). Furthermore, the controller 117 mounts the electronic device 12 on the mounting portion 11A of the object 11 (S23).

[0088] Thus, the electronic device 12 is molded in S11 and mounted on the mounted object 11 molded in another process (S17, S25). In other words, the mounted object 11 on which the electronic device 12 is mounted can be molded in a process different from that of the electronic device 12. Therefore, the ultraviolet curing resins 126 and 131 used in S17 and the like are not subject to restrictions on the physical properties required of the ultraviolet curing resins used in S11. The restrictions on the physical properties required of the ultraviolet curing resins 126 and 131 can be relaxed, and the degree of freedom in selecting the ultraviolet curing resins 126 and 131 is increased. In addition, since the degree of freedom in selecting the ultraviolet curing resins 126 and 131 is increased, the manufacturing cost of manufacturing the molded object 13 can be suppressed.

[0089] (5. Others)

[0090] It should be noted that the present disclosure is not limited to the above-described embodiments, and can be implemented in various forms after various changes and improvements are made based on the knowledge of those skilled in the art.

[0091] For example, the structure of the manufacturing device 10 described above is an example. The molding device for molding the object 11 and the manufacturing device for manufacturing the electronic device 12 may be different devices. In addition, the manufacturing device 10 may also be provided with a conveying device for manufacturing the electronic device 12 independently of the stage 43 (conveying device 20) for molding the object 11. Furthermore, the manufacturing device 10 may also perform operations such as molding the object 11 and the electronic device 12 on separate stages 43 in parallel.

[0092] Alternatively, the electronic device 12 may be mounted on the mounting object 11 manually by a person.

[0093] Figure 4 The structure of the shaped object 13 shown is an example. For example, the mounted object 11 may be in a shape other than a human figure. The shaped object 13 may include two or more electronic devices 12. The electronic device 12 may not include the electronic element 81.

[0094] In addition, the manufacturing device 10 may be configured to include one of the curing unit 62 and the curing unit 72. That is, the manufacturing device 10 may be configured to include only one device that can be shared. For example, when the support 15 is melted by heat, the manufacturing device 10 may melt the support 15 using the sintering unit 74. In this case, the manufacturing device 10 may not include the removing unit 64.

[0095] The ultraviolet curable resin of the first printing portion 61 and the ultraviolet curable resin of the third printing portion 71 may be ultraviolet curable resins having the same physical properties.

[0096] In the above-described embodiment, an ultraviolet curing resin that is cured by ultraviolet irradiation is used, but various curable resins such as a thermosetting resin that is cured by heat may be used.

[0097] In addition, the three-dimensional layered molding method in the present disclosure is not limited to the inkjet method and the stereo lithography method (SL), and other methods such as the fused deposition molding method (FDM) can be used.

[0098] Description of Reference Numerals

[0099] 10 electronic device manufacturing device (manufacturing device), 11 mounted object, 11A mounting portion, 12 electronic device, 13 molded object (three-dimensional molded object), 15 support, 22 first molding unit (first molding device), 23 second molding unit (second molding device), 25 assembling unit (mounting device), 87 insulating layer (resin layer), 89 wiring (conductor), 91 through hole (conductor), 93 connecting terminal (conductor), 112 3D data, 114 design data, 126, 131 ultraviolet curing resin (first curing resin).

Claims

1. A method for manufacturing a three-dimensional object, wherein an electronic device is mounted on an object to be mounted, the method comprising the following steps: A first shaping step of shaping the object having a mounting portion for mounting the electronic device using a first curable resin using a lamination shaping method; A second molding step, using a lamination molding method, molding the resin layer with a second curable resin, molding the conductor with a fluid containing metal particles, and molding the electronic device having the conductor in the resin layer; and The installation step includes installing the electronic device on the installation portion of the object to be installed. The second curable resin in the second molding process satisfies at least one of the following conditions: a condition that the wettability to the conductor is lower than that of the first curable resin in the first molding process, a condition that the linear expansion coefficient is lower than that of the first curable resin, and a condition that the adhesion to the conductor is higher than that of the first curable resin.

2. The method for manufacturing a three-dimensional object according to claim 1, wherein: In the first shaping step, shaping is temporarily suspended at a stage where the mounting portion is shaped, and shaping of the remaining portion of the object to be mounted is resumed after the mounting step is performed to mount the electronic device on the mounting portion.

3. The method for manufacturing a three-dimensional object according to claim 2, wherein: In the first molding step, at the stage where the first molding step is completed, the electronic device is covered with the first curable resin to fix the electronic device to the mounted object.

4. The method for producing a three-dimensional object according to any one of claims 1 to 3, wherein: In the first shaping step, the object to be attached is shaped using a support, while the shaped object obtained by curing the first curable resin is supported by the support.

5. A method for manufacturing a three-dimensional object, wherein the method comprises mounting an electronic device on an object to be mounted, the method comprising the following steps: A first shaping step of shaping the object having a mounting portion for mounting the electronic device using a first curable resin using a lamination shaping method; A second molding step, using a lamination molding method, molding the resin layer with a second curable resin, molding the conductor with a fluid containing metal particles, and molding the electronic device having the conductor in the resin layer; and The installation step includes installing the electronic device on the installation portion of the object to be installed. The method for manufacturing a three-dimensional object includes a 3D data generation step of scanning the electronic device formed in the second forming step to generate 3D data of the electronic device, In the first modeling step, the shape of the mounting portion in the design data of the mounting object is corrected based on the 3D data generated in the 3D data generating step, and the mounting object is modeled based on the design data.

6. The method for manufacturing a three-dimensional object according to claim 5, wherein: In the first shaping step, shaping is temporarily suspended at a stage where the mounting portion is shaped, and shaping of the remaining portion of the object to be mounted is resumed after the mounting step is performed to mount the electronic device on the mounting portion.

7. The method for manufacturing a three-dimensional object according to claim 6, wherein: In the first molding step, at the stage where the first molding step is completed, the electronic device is covered with the first curable resin to fix the electronic device to the mounted object.

8. The method for producing a three-dimensional object according to any one of claims 5 to 7, wherein: In the first shaping step, the object to be attached is shaped using a support, while the shaped object obtained by curing the first curable resin is supported by the support.

9. The method for manufacturing a three-dimensional object according to claim 8, wherein: The second curable resin in the second molding process satisfies at least one of the following conditions: a condition that the wettability to the conductor is lower than that of the first curable resin in the first molding process, a condition that the linear expansion coefficient is lower than that of the first curable resin, and a condition that the adhesion to the conductor is higher than that of the first curable resin.

10. A manufacturing device for manufacturing a three-dimensional object having an electronic device mounted on an object to be mounted, the manufacturing device comprising: A first molding device that uses a lamination molding method to mold the object having a mounting portion for mounting the electronic device using a first curable resin; A second molding device, using a stacking molding method, molding the resin layer with a second curable resin, molding the conductor with a fluid containing metal particles, and molding the electronic device having the conductor in the resin layer; and A mounting device is used to mount the electronic device on the mounting portion of the object to be mounted. The second curable resin in the second molding device satisfies at least one of the following conditions: a condition that the wettability to the conductor is lower than that of the first curable resin in the first molding device, a condition that the linear expansion coefficient is lower than that of the first curable resin, and a condition that the adhesion to the conductor is higher than that of the first curable resin.

11. A manufacturing device for manufacturing a three-dimensional object having an electronic device mounted on an object to be mounted, the manufacturing device comprising: A first molding device that uses a lamination molding method to mold the object having a mounting portion for mounting the electronic device using a first curable resin; A second molding device, using a stacking molding method, molding the resin layer with a second curable resin, molding the conductor with a fluid containing metal particles, and molding the electronic device having the conductor in the resin layer; and A mounting device is used to mount the electronic device on the mounting portion of the object to be mounted. The manufacturing device further includes a scanning unit for scanning the electronic device formed by the second forming device to generate 3D data of the electronic device. In the first modeling device, the shape of the mounting portion in the design data of the mounting object is corrected based on the 3D data generated by the scanning unit, and the mounting object is modeled based on the design data.

Images