A drilling device for circuit board production

By designing a support mechanism and a mold mechanism in coordination, it provides all-round support and precise drilling, solving the cracking problem caused by insufficient support in the circuit board drilling device, and improving the yield and processing accuracy of circuit boards.

CN116442321BActive Publication Date: 2026-01-30HUANGSHI WING HING LUNG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202310413225.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-18
Publication Date
2026-01-30
Estimated Expiration
2043-04-18

AI Technical Summary

Technical Problem

Existing PCB drilling equipment provides insufficient support for PCBs, which can cause cracks to easily form on brittle PCBs during the drilling process, affecting the yield rate.

Method used

A drilling device for circuit board production, comprising a support mechanism and a mold mechanism, is designed. The support mechanism provides all-round support through the cooperation of the base and the bottom and top molds of the mold mechanism, ensuring uniform stress on the circuit board. The detachable design facilitates mold replacement, and fasteners are used to fix the bottom mold to prevent shaking. It is combined with a drilling machine for precise drilling.

Benefits of technology

It improves the yield rate of circuit boards, ensures that the punched points are not easily broken by pressure, has higher processing accuracy, is stable and reliable, and facilitates mold replacement and device maintenance.

✦ Generated by Eureka AI based on patent content.

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    Figure CN116442321B_ABST
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Abstract

This invention relates to the field of circuit board manufacturing technology and discloses a drilling device for circuit board production. The device includes a processing table, a support mechanism on top of the processing table, a mold mechanism above the support mechanism, and a drilling machine above the processing table. The support mechanism includes a base, an adjusting component at the bottom of the base, a positioning groove at the top of the base, and a fastener at the top of the positioning groove. The mold mechanism includes a bottom mold, a positioning block fixedly connected to the bottom of the bottom mold, a bottom mold cavity at the top of the bottom mold, a hole at the bottom of the bottom mold cavity, a top mold at the top of the bottom mold cavity, a hole at the outer wall of the top mold, and a cleaning component on one side of the bottom mold. This drilling device for circuit board production, due to the all-around support of the bottom mold cavity, results in more even stress on the circuit board, reducing the likelihood of pressure-induced breakage at the drilling points, thereby significantly improving the yield rate of the circuit board.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board production, in particular to a punching device for circuit board production. BACKGROUND

[0002] PCB (Printed Circuit Board), also known as printed wiring board, is an important electronic component, which is the support of electronic components and the carrier of electrical connection between electronic components.

[0003] When the circuit board is installed, it is fixedly connected with the screw hole of the predetermined component by a screw, so that the punching operation of the circuit board needs to be performed during production. However, the existing punching device has insufficient overall support for the circuit board. Since the circuit board material is brittle, defective products with cracks are prone to occur in the flow punching. Therefore, a punching device for circuit board production is proposed to solve the problems mentioned in the background. SUMMARY

[0004] The present application aims to provide a punching device for circuit board production to solve the problems mentioned in the background.

[0005] In order to solve the above technical problems, the present application provides the following technical scheme: a punching device for circuit board production, comprising a processing table, a supporting mechanism is arranged on the top of the processing table, a mold mechanism is arranged above the supporting mechanism, and a drilling machine is arranged above the processing table.

[0006] The supporting mechanism comprises a base, an adjusting piece is arranged at the bottom of the base, a positioning groove is formed at the top of the base, and a fastener is arranged at the top of the positioning groove.

[0007] The mold mechanism comprises a bottom mold, a positioning block is fixedly connected to the bottom of the bottom mold, a bottom mold cavity is formed at the top of the bottom mold, a hole site one is formed at the inner bottom of the bottom mold cavity, a top mold is arranged at the top of the bottom mold cavity, a hole site two is formed on the outer side wall of the top mold, and a cleaning piece is arranged on one side of the bottom mold.

[0008] Preferably, the adjusting piece comprises a sliding groove one formed on the top of the processing table, a lead screw is movably connected inside the sliding groove one, a sliding block is screwed on the outer side wall of the lead screw, and the top of the sliding block is fixedly connected with the bottom of the base.

[0009] Preferably, the sliding block is slidingly connected with the sliding groove one, and one end of the lead screw penetrates through the side wall of the sliding groove one and is fixedly connected with a knob one.

[0010] Rotating knob one, knob one drives the screw rod to rotate, the screw rod drives the sliding block to rotate, the sliding block slides in the sliding groove one with the base, so that the base can be dislocated with the drilling machine, facilitating the maintenance of the device.

[0011] Preferably, the base is a replaceable component, and the positioning block and the positioning groove are mutually engaged.

[0012] Due to different specifications of the circuit board, the hole positions are also different during processing. In order to facilitate the replacement of the template, the bottom die and the base are designed to be detachable, facilitating the replacement of the bottom die.

[0013] Preferably, the fastener comprises a sliding groove two opened at the top of the base, a bidirectional screw rod movably connected inside the sliding groove two, and two clamping blocks movably connected on the outer side wall of the bidirectional screw rod.

[0014] The clamping groove is opened at two opposite side edges of the bottom die, and the clamping blocks on both sides are clamped and fastened.

[0015] Preferably, the fastener further comprises two clamping grooves opened at the bottom of the bottom die, the clamping blocks are matched with the clamping grooves, and one end of the bidirectional screw rod penetrates through the side wall of the sliding groove two and is fixedly connected with a knob two.

[0016] Rotating the knob two, the knob two drives the bidirectional screw rod to rotate, and the bidirectional screw rod drives the two clamping blocks to move towards each other, thereby clamping the clamping groove from both sides, and the bottom die is fastened on the top of the base, so that the bottom die will not shake.

[0017] Preferably, the top die is matched with the bottom die cavity, and the hole position one is matched with the hole position two.

[0018] Preferably, the cleaning member comprises a cleaning notch opened at one side of the top of the bottom die cavity, and the cleaning member further comprises a waste box arranged on one side of the base, and the waste box is arranged on the same side of the cleaning notch.

[0019] Preferably, one side of the top die is fixedly connected with a mounting strip, and the mounting strip is matched with the cleaning notch.

[0020] Compared with the prior art, the present application has the following beneficial effects:

[0021] Firstly, the circuit board is placed in the bottom die cavity, then the top die is covered on the circuit board, at this time, the mounting strip is clamped and positioned with the cleaning notch, then the drilling machine is used to punch the circuit board through the hole position one and the hole position two. Due to the all-round support of the bottom die cavity, the stress on the circuit board is more uniform, and the punching point is not easy to break under pressure, thereby greatly improving the yield of the circuit board.

[0022] Second, the application selects a suitable bottom die, inserts the bottom die on the positioning groove on the top of the base through the positioning block on the bottom, then rotates knob two, knob two drives the bidirectional screw rod to rotate, the bidirectional screw rod drives the two clamping blocks to move towards each other, thereby clamping the clamping groove from both sides, thereby fastening the bottom die on the top of the base, so that the bottom die does not shake, and when processing the circuit board, it is more stable and reliable, and the processing precision is higher. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is an appearance structure schematic diagram of the application;

[0024] Figure 2 It is a top structure schematic diagram of the application;

[0025] Figure 3 It is a top structure schematic diagram of the application;

[0026] Figure 4 It is a bottom die structure schematic diagram of the application;

[0027] Figure 5 It is a Figure 3 enlarged structure schematic diagram of A in the application;

[0028] Figure 6 It is a sectional surface structure schematic diagram of the adjusting piece of the application;

[0029] Figure 7 It is a sectional surface structure schematic diagram of the fastener of the application.

[0030] Wherein: 1, processing table; 2, supporting mechanism; 201, base; 202, adjusting piece; 2021, sliding groove one; 2022, screw rod; 2023, sliding block; 2024, knob one; 203, positioning groove; 204, fastener; 2041, sliding groove two; 2042, bidirectional screw rod; 2043, clamping block; 2044, clamping groove; 2045, knob two; 3, die mechanism; 301, bottom die; 302, positioning block; 303, bottom die cavity; 304, hole one; 305, top die; 306, hole two; 307, cleaning piece; 3071, cleaning notch; 3072, waste box; 308, mounting strip; 4, drilling machine. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the application.

[0032] Please refer to Figures 1-7

[0033] Embodiment one

[0034] The embodiment is a specific embodiment of a punching device for circuit board production

[0035] A punching device for circuit board production, comprising a processing table 1, the top of the processing table 1 is provided with a supporting mechanism 2, the upper side of the supporting mechanism 2 is provided with a mold mechanism 3, and the upper side of the processing table 1 is provided with a drilling machine 4.

[0036] The supporting mechanism 2 comprises a base 201, the bottom of the base 201 is provided with an adjusting part 202, the top of the base 201 is provided with a positioning groove 203, and the top of the positioning groove 203 is provided with a fastener 204.

[0037] The mold mechanism 3 comprises a bottom die 301, the bottom of the bottom die 301 is fixedly connected with a positioning block 302, the top of the bottom die 301 is provided with a bottom die cavity 303, the inner bottom of the bottom die cavity 303 is provided with a hole position one 304, the top of the bottom die cavity 303 is provided with a top die 305, the outer side wall of the top die 305 is provided with a hole position two 306, and one side of the bottom die 301 is provided with a cleaning part 307.

[0038] According to the above technical scheme, since the specifications of the circuit board are different, different molds need to be replaced to adapt to the circuit board, the appropriate bottom die 301 is selected, the bottom die 301 is inserted on the positioning groove 203 on the top of the base 201 through the positioning block 302 at the bottom, then the knob two 2045 is rotated, the knob two 2045 drives the bidirectional lead screw 2042 to rotate, the bidirectional lead screw 2042 drives the two clamping blocks 2043 to move towards each other, so as to clamp the clamping groove 2044 from both sides, thereby fastening the bottom die 301 on the top of the base 201, so that the bottom die 301 will not shake, and the processing of the circuit board is more stable and reliable, and the processing precision is higher.

[0039] The circuit board is placed in the bottom die cavity 303, then the top die 305 is covered on the circuit board, at this time, the installation strip 308 is clamped and positioned with the cleaning notch 3071, then the drilling machine 4 is used to punch the circuit board through the hole position one 304 and the hole position two 306, since the bottom die cavity 303 provides all-around support, the circuit board is more evenly stressed, and the punching point is not easy to break under pressure, thereby greatly improving the yield of the circuit board, and the internal circuit connection of the drilling machine 4 is prior art, and the working principle is common knowledge of workers in the field, which will not be described here.

[0040] Specifically, the adjusting part 202 comprises a sliding groove one 2021 opened in the top of the processing table 1, a lead screw 2022 movably connected in the sliding groove one 2021, a sliding block 2023 screwed on the outer side wall of the lead screw 2022, and the top of the sliding block 2023 is fixedly connected with the bottom of the base 201.

[0041] Specifically, the sliding block 2023 is in sliding connection with the sliding groove 2021, and one end of the lead screw 2022 penetrates through the side wall of the sliding groove 2021 and is fixedly connected with the knob 2024.

[0042] Through the above technical scheme, the knob 2024 is rotated, the knob 2024 drives the lead screw 2022 to rotate, the lead screw 2022 drives the sliding block 2023 to rotate, and the sliding block 2023 slides with the base 201 in the sliding groove 2021, so that the base 201 can be dislocated with the drilling machine 4, and the device is convenient for maintenance and maintenance.

[0043] Specifically, the base 201 is a replaceable component, and the positioning block 302 is in mutual engagement with the positioning groove 203.

[0044] Through the above technical scheme, since the specifications of the circuit board are different, the hole positions are also different during processing. In order to facilitate the replacement of the template, the bottom die 301 and the base 201 are designed to be detachable, which facilitates the replacement of the bottom die 301 and is convenient and fast.

[0045] Specifically, the fastener 204 includes a sliding groove 2041 formed at the top of the base 201, a bidirectional lead screw 2042 movably connected in the sliding groove 2041, and two clamping blocks 2043 movably connected to the outer side wall of the bidirectional lead screw 2042.

[0046] Through the above technical scheme, the clamping grooves 2044 are formed at two opposite side edges of the bottom die 301, and the clamping blocks 2043 are clamped tightly on both sides.

[0047] Specifically, the fastener 204 further includes two clamping grooves 2044 formed at the bottom of the bottom die 301, the clamping blocks 2043 are matched with the clamping grooves 2044, and one end of the bidirectional lead screw 2042 penetrates through the side wall of the sliding groove 2041 and is fixedly connected with a knob 2045.

[0048] Through the above technical scheme, the knob 2045 is rotated, the knob 2045 drives the bidirectional lead screw 2042 to rotate, the bidirectional lead screw 2042 drives the two clamping blocks 2043 to move towards each other, thereby clamping the clamping grooves 2044 from both sides, and the bottom die 301 is fastened on the top of the base 201, so that the bottom die 301 will not shake.

[0049] Specifically, the top die 305 is matched with the bottom die cavity 303, and the hole position 304 is matched with the hole position 306.

[0050] Through the above technical scheme, the top die 305 and the bottom die cavity 303 are matched with the two side hole positions, so that the circuit board punching is more accurate.

[0051] Specifically, the cleaning piece 307 includes a cleaning notch 3071 opened on one side of the top of the bottom die cavity 303, and the cleaning piece 307 further includes a waste box 3072 arranged on one side of the base 201, which is arranged on the same side of the cleaning notch 3071.

[0052] Through the above technical solution, after the circuit board is punched, there will be some circuit board debris, therefore, after punching, the debris can be swept into the waste box 3072 through the side of the cleaning notch 3071 by the anti-static brush, which is clean and tidy.

[0053] Specifically, one side of the top die 305 is fixedly connected with a mounting strip 308, which is matched with the cleaning notch 3071.

[0054] Through the above technical solution, the mounting strip 308 is an extension piece, which facilitates the taking of the top die 305, and is convenient and fast.

[0055] Embodiment two

[0056] This embodiment is a specific embodiment of a supporting mechanism 2 of a punching device for circuit board production

[0057] A supporting mechanism 2 of a punching device for circuit board production, comprising a base 201, the bottom of the base 201 is provided with an adjusting piece 202, the top of the base 201 is provided with a positioning groove 203, and the top of the positioning groove 203 is provided with a fastener 204.

[0058] Embodiment three

[0059] This embodiment is a specific embodiment of a mold mechanism 3 of a punching device for circuit board production

[0060] A mold mechanism 3 of a punching device for circuit board production, comprising a bottom die 301, the bottom of the bottom die 301 is fixedly connected with a positioning block 302, the top of the bottom die 301 is provided with a bottom die cavity 303, the inner bottom of the bottom die cavity 303 is provided with a hole position one 304, the top of the bottom die cavity 303 is provided with a top die 305, the outer side wall of the top die 305 is provided with a hole position two 306, and one side of the bottom die 301 is provided with a cleaning piece 307.

[0061] Embodiment four

[0062] This embodiment is a specific embodiment of a fastener 204 of a punching device for circuit board production

[0063] The fastener 204 of the punching device for the circuit board production comprises a sliding groove two 2041 formed in the top of the base 201, a bidirectional screw rod 2042 movably connected in the sliding groove two 2041, two clamping blocks 2043 movably connected on the outer side wall of the bidirectional screw rod 2042, two clamping grooves 2044 formed in the bottom of the bottom die 301, the clamping blocks 2043 matched with the clamping grooves 2044, and one end of the bidirectional screw rod 2042 penetrating through the side wall of the sliding groove two 2041 and fixedly connected with a knob two 2045.

[0064] In use, the proper bottom die 301 is selected, the bottom die 301 is inserted on the positioning groove 203 on the top of the base 201 through the positioning block 302 on the bottom, then the knob two 2045 is rotated, the knob two 2045 drives the bidirectional screw rod 2042 to rotate, the bidirectional screw rod 2042 drives the two clamping blocks 2043 to move towards each other, thereby clamping the clamping grooves 2044 from both sides, so that the bottom die 301 is fastened on the top of the base 201, and the bottom die 301 will not shake, and the circuit board is more stable and reliable in processing, and the processing precision is higher.

[0065] The circuit board is placed in the bottom die cavity 303, then the top die 305 is covered on the circuit board, at the moment, the installation strip 308 is clamped and positioned with the cleaning notch 3071, then the circuit board is punched through the hole one 304 and the hole two 306 by the drilling machine 4, because of the all-around support of the bottom die cavity 303, the circuit board is more uniform in stress, and the punching point is not prone to be broken under pressure.

[0066] Although the embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and changes can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A punching device for a circuit board production, comprising a processing table (1), characterized in that: The top of the processing table (1) is provided with a supporting mechanism (2), the upper side of the supporting mechanism (2) is provided with a mold mechanism (3), and the upper side of the processing table (1) is provided with a drilling machine (4). The supporting mechanism (2) comprises a base (201), the bottom of the base (201) is provided with an adjusting part (202), the top of the base (201) is provided with a positioning groove (203), and the top of the positioning groove (203) is provided with a fastening part (204). The mold mechanism (3) comprises a bottom die (301), the bottom of the bottom die (301) is fixedly connected with a positioning block (302), the top of the bottom die (301) is provided with a bottom die cavity (303), the inner bottom of the bottom die cavity (303) is provided with a first hole position (304), the top of the bottom die cavity (303) is provided with a top die (305), the outer side wall of the top die (305) is provided with a second hole position (306), and one side of the bottom die (301) is provided with a cleaning part (307).

2. The punching device for manufacturing a circuit board according to claim 1, wherein: The adjusting part (202) comprises a sliding groove (2021) formed in the top of the processing table (1), the inside of the sliding groove (2021) is movably connected with a lead screw (2022), the outer side wall of the lead screw (2022) is rotatably connected with a sliding block (2023), and the top of the sliding block (2023) is fixedly connected with the bottom of the base (201).

3. The punching device for manufacturing a circuit board according to claim 2, wherein: The sliding block (2023) is slidably connected with the sliding groove (2021), and one end of the lead screw (2022) penetrates through the side wall of the sliding groove (2021) and is fixedly connected with a knob (2024).

4. The perforating device for manufacturing a circuit board according to claim 1, wherein: The base (201) is a replaceable component, and the positioning block (302) and the positioning groove (203) are matched with each other.

5. The perforating device for manufacturing a circuit board according to claim 1, wherein: The fastening part (204) comprises a sliding groove (2041) formed in the top of the base (201), the inside of the sliding groove (2041) is movably connected with a bidirectional lead screw (2042), and the outer side wall of the bidirectional lead screw (2042) is movably connected with two clamping blocks (2043).

6. The punching device for manufacturing a circuit board according to claim 5, wherein: The fastening part (204) further comprises two clamping grooves (2044) formed in the bottom of the bottom die (301), the clamping blocks (2043) are matched with the clamping grooves (2044), and one end of the bidirectional lead screw (2042) penetrates through the side wall of the sliding groove (2041) and is fixedly connected with a knob (2045).

7. The punching device for manufacturing a circuit board according to claim 1, wherein: The top die (305) is matched with the bottom die cavity (303), and the first hole position (304) is matched with the second hole position (306).

8. The punching device for manufacturing a circuit board according to claim 1, wherein: The cleaning part (307) comprises a cleaning notch (3071) formed in one side of the top of the bottom die cavity (303), and further comprises a waste box (3072) arranged on one side of the base (201), wherein the waste box (3072) is arranged on the same side of the cleaning notch (3071).

9. The punching device for manufacturing a circuit board according to claim 8, wherein: One side of the top die (305) is fixedly connected with a mounting strip (308), and the mounting strip (308) is matched with the cleaning notch (3071).

Citation Information

Patent Citations

  • Substrate drilling device and control method thereof

    CN105722323A

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    CN203650611U