Circuit board film tearing and cutting device

Abstract

The application discloses a circuit board film tearing and cutting device, which comprises a circuit board feeding device, a tape sticking module, a film tearing module and a cutting device. The tape sticking module is used for connecting adjacent films on the surface of the circuit board, and comprises a material receiving table and a tape sticking mechanism. The material receiving table is used for bearing the circuit board supplied by the feeding device. The tape sticking mechanism comprises a tape sticking base and a tape feeding assembly, a guide wheel assembly, a pressing wheel assembly and a cutter assembly arranged on the tape sticking base. The tape feeding assembly is used for supplying the guide wheel assembly with the tape. The tape sticking base is movable relative to the material receiving table under the driving of a moving mechanism, so as to drive the guide wheel assembly to stick the tape on the adjacent films on the surface of the circuit board. The pressing wheel assembly is movable to press on the tape on the surface of the circuit board and cooperate with the guide wheel assembly to tension the tape. The cutter assembly is used for cutting the tape between the pressing wheel assembly and the guide wheel assembly. The application has the advantages of high automation degree and high efficiency.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing equipment, and more specifically to a circuit board film peeling and cutting equipment. Background Technology

[0002] Flexible printed circuits (FPCs) are characterized by high wiring density, light weight, thinness, and good bendability, and are widely used in electronic components. FPCs are typically processed first in rolls or panels, and then the rolls or panels are cut into individual circuit board semi-finished or finished products.

[0003] Generally, during circuit board processing, a protective film or process film needs to be applied to its surface. Before cutting the circuit board, the film applied to the surface of the circuit board needs to be peeled off. In the prior art, circuit board film peeling and cutting equipment is usually designed for situations where the film is distributed as a whole or continuously on the surface of the roll or panel, and can only peel off the film from the surface of the circuit board roll or panel as a whole.

[0004] However, in some cases, the film on the surface of circuit board rolls or panels is discontinuous or distributed in single sheets. Typically, each semi-finished or finished circuit board has a separate film attached to its surface. In such cases, existing circuit board film peeling and cutting equipment is inadequate for peeling off discontinuous films, and instead generally employs the inefficient process of manually peeling the film after cutting, which requires improvement. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the main objective of this invention is to provide a circuit board film peeling and cutting device that can perform discontinuous film peeling to improve processing efficiency.

[0006] To achieve the above-mentioned main objectives, the present invention provides a circuit board film-peeling and cutting device, comprising a feeding device, an adhesive tape application module, a film-peeling module, and a cutting device; wherein, the feeding device is used to supply circuit boards; the adhesive tape application module is used to connect adjacent films on the surface of the circuit board; the film-peeling module is used to peel off the connected films on the surface of the circuit board; the cutting device is used to cut the circuit board after the films have been peeled off; the adhesive tape application module includes:

[0007] The receiving platform is used to hold the circuit boards supplied by the feeding device;

[0008] The adhesive applicator includes an adhesive applicator base and a tape feeding assembly, a guide roller assembly, a pressure roller assembly, and a cutter assembly mounted on the adhesive applicator base. The tape feeding assembly supplies tape to the guide roller assembly. The adhesive applicator base can move relative to the receiving table under the drive of a moving mechanism to drive the guide roller assembly to apply the tape to an adjacent film on the surface of the circuit board. The pressure roller assembly can move to press the tape onto the surface of the circuit board and cooperates with the guide roller assembly to tension the tape. The cutter assembly is used to cut the tape located between the pressure roller assembly and the guide roller assembly.

[0009] In the above technical solution, by connecting adjacent films on the circuit board surface through the tape application module and peeling off the connected films on the circuit board surface through the film peeling module, the automatic peeling of discontinuous films can be achieved, thereby improving processing efficiency. Furthermore, after a single tape application is completed, the tape is tensioned by the cooperation of the pressure roller assembly and the guide roller assembly, and the tape is cut by the cutter assembly. This tape cutting method has the advantage of high reliability.

[0010] According to a specific embodiment of the present invention, the guide roller assembly has a first position in contact with the circuit board for applying adhesive tape and a second position separated from the circuit board; the adhesive application machine base is provided with a transmission assembly, and the pressure roller assembly is connected to the guide roller assembly through the transmission assembly; while the pressure roller assembly moves to press the adhesive tape on the surface of the circuit board, the guide roller assembly switches from the first position to the second position.

[0011] According to a specific embodiment of the present invention, the transmission assembly includes a transmission plate, which is swayably connected to the adhesive applicator base via a hinge shaft; the transmission plate is provided with a first sliding groove;

[0012] The pressure roller assembly includes a pressure roller, a support frame for supporting the pressure roller, and a connecting column disposed on the support frame; the connecting column is rotatably disposed in a first slide groove, and the connecting column can slide within the first slide groove;

[0013] The guide pulley assembly is mounted on the transmission plate; the movement of the pressure roller assembly can drive the transmission plate to swing around the hinge axis, so that the guide pulley assembly switches between the first position and the second position.

[0014] According to a specific embodiment of the present invention, the adhesive applicator base is provided with a second slide groove, and the support frame is provided with a guide post, which is slidably disposed in the second slide groove.

[0015] Furthermore, the cutter assembly includes a cutter, a mounting bracket for mounting the cutter, and a cutter cylinder for driving the extension and retraction of the mounting bracket; the mounting bracket is mounted on the adhesive applicator base or support frame via a slide; the slide guides the extension and retraction of the mounting bracket.

[0016] According to a specific embodiment of the present invention, the guide roller assembly includes a guide roller and an auxiliary roller that cooperate with each other, the auxiliary roller being used to press the tape onto the guide roller; the adhesive applicator base is also provided with an arc-shaped guide groove for oscillating and guiding the guide roller.

[0017] Furthermore, the adhesive application mechanism also includes an air blowing assembly; the air blowing assembly is used to blow air toward the guide pulley so that the cut tape adheres tightly to the guide pulley.

[0018] According to a specific embodiment of the present invention, the tape application module includes two tape application mechanisms located on the upper and lower sides of the receiving platform, so as to apply tape to the upper and lower sides of the circuit board respectively, so that the films on the upper and lower surfaces of the circuit board are respectively connected to their respective adjacent films.

[0019] According to a specific embodiment of the present invention, the film-peeling module includes a collection mechanism and a conveying mechanism; the conveying mechanism is used to peel off the film connected on the surface of the circuit board and guide and convey the film, and the collection mechanism is used to collect the peeled film conveyed by the conveying mechanism.

[0020] According to one specific embodiment of the present invention, it further includes a cleaning device, a transfer device, and a stacking module; the cleaning device is used to clean the product obtained after cutting by the cutting device, and the transfer device is used to transfer the cleaned product to the stacking module for collection.

[0021] According to one specific embodiment of the present invention, the cleaning device includes a first conveying component, a second conveying component, and a cleaning component; the first conveying component and the second conveying component are spaced apart, and the cleaning component is removably disposed between the first conveying component and the second conveying component.

[0022] To more clearly illustrate the purpose, technical solution, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0023] Figure 1 This is a front view of the circuit board film peeling and cutting device of the present invention;

[0024] Figure 2 This is a top view of the circuit board film peeling and cutting device of the present invention;

[0025] Figure 3 This is a perspective view of the tape application module of the present invention;

[0026] Figure 4 This is a side view of the tape application module of the present invention;

[0027] Figure 5 This is a perspective view of the tape-applying mechanism of the present invention;

[0028] Figure 6 This is a first perspective view of the present invention showing the guide roller assembly, pressure roller assembly and cutter assembly;

[0029] Figure 7 This is a second perspective view of the present invention showing the guide roller assembly, pressure roller assembly and cutter assembly;

[0030] Figure 8 This is a schematic diagram showing the position of the adhesive tape on the guide wheel assembly of the present invention;

[0031] Figure 9 This is a schematic diagram showing the position of the guide roller assembly and pressure roller assembly of the present invention for tensioning the rubber belt;

[0032] Figure 10 This is a schematic diagram showing the position where the cutter assembly of the present invention cuts the tape;

[0033] Figure 11 This is a perspective view of the film-peeling module of the present invention;

[0034] Figure 12 This is a diagram showing the first usage state of the film-peeling module of the present invention;

[0035] Figure 13 This is a diagram showing the first usage state of the film-peeling module of the present invention;

[0036] Figure 14 This is a structural diagram of the positioning and pulling mechanism of the present invention;

[0037] Figure 15 This is a perspective view of the cutting device of the present invention;

[0038] Figure 16 This is a side view of the cutting device of the present invention;

[0039] Figure 17 This is a first perspective view of the cleaning device of the present invention;

[0040] Figure 18 This is a second perspective view of the cleaning device of the present invention;

[0041] Figure 19 This is a structural diagram of the cleaning component in the pulled-out position in this invention;

[0042] Figure 20 yes Figure 19 Side view. Detailed Implementation

[0043] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0044] like Figure 1-2 As shown, the circuit board film-peeling and cutting equipment of the embodiment includes a frame 10, a feeding device 20, an adhesive tape application module 30, a film-peeling module 40, a cutting device 50, a cleaning device 60, and a stacking module 70; wherein, the feeding device 20 is used to supply circuit boards, specifically flexible circuit board rolls; the feeding device 20 includes a conveying mechanism for inputting flexible circuit boards, and the conveying mechanism can refer to the feeder structure commonly used in the prior art for loading and unloading flexible circuit board rolls, which will not be elaborated here.

[0045] The outer surface of the flexible circuit board is covered with a series of discontinuous thin films (protective films). Before cutting, the films need to be peeled off. In this embodiment, the films are peeled off by the cooperation of the tape application module 30 and the film peeling module 40. Specifically, the tape application module 30 is used to connect adjacent films on the surface of the circuit board, and the film peeling module 40 is used to peel off the films connected on the surface of the circuit board, thereby facilitating the cutting of the circuit board.

[0046] like Figure 3-4 As shown, the tape application module 30 includes a frame 31, a feeding roller 32, a receiving platform 33, and two tape application mechanisms 34. The frame 31 is mounted on the machine frame 10, and the feeding roller 32 is set on the frame 31 to assist in the smooth transport of the circuit board. The receiving platform 33 is set on the frame 31 to support the circuit board. The two tape application mechanisms 34 are set on the upper and lower sides of the receiving platform 33 to apply tape to the upper and lower sides of the circuit board respectively, so that the film on the upper and lower surfaces of the circuit board is connected to the adjacent film respectively.

[0047] The following section will use the adhesive applicator 34 located at the top as an example to introduce its specific structure; for example... Figure 5 As shown, the adhesive applicator 34 includes an adhesive applicator base 341 and an adhesive tape feeding assembly 342, a guide roller assembly 343, a pressure roller assembly 344, and a cutter assembly 345 disposed on the adhesive applicator base 341.

[0048] The adhesive applicator base 341 can move relative to the receiving table 33 under the drive of a moving mechanism to apply adhesive tape. Specifically, an adhesive applicator slide rail 311 is provided on the frame 31, and the adhesive applicator base 341 is slidably mounted on the adhesive applicator slide rail 311. The direction of the adhesive applicator slide rail 311 is perpendicular to the conveying direction of the circuit board. The moving mechanism can be a belt drive mechanism, a screw drive mechanism, etc., as long as it can drive the adhesive applicator base 341 to reciprocate on the adhesive applicator slide rail 311. Figure 4 As shown, the moving mechanism uses a single moving motor 312 in conjunction with a synchronous wheel assembly to simultaneously drive two adhesive application mechanisms 34 to reciprocate along the corresponding adhesive application slide rail 311.

[0049] The tape feeding assembly 342 supplies tape to the guide pulley assembly 343, and includes a turntable 3421 for storing tape; correspondingly, a tape guide roller 3411 is provided on the tape applicator base 341 to turn and guide the tape; the turntable 3421 is, for example, a self-tensioning structure to generate rotation when the tape is pulled out, thereby supplying tape; other structural forms may also be adopted in other embodiments, which will not be elaborated here.

[0050] The guide roller assembly 343 is used to output adhesive tape and apply the tape to adjacent films on the surface of the circuit board during the movement of the adhesive applicator base 341. The guide roller assembly 343 includes a cooperating guide roller 3431 and an auxiliary roller 3432. The adhesive tape passes between the guide roller 3431 and the auxiliary roller 3432. The auxiliary roller 3432 is used to press the adhesive tape firmly onto the guide roller 3431 to prevent the adhesive tape from falling off. Preferably, a first sensor 3412 is provided on the adhesive applicator base 341 for detecting whether the adhesive tape is fed onto the guide roller 3431. In this embodiment, the guide roller 3431 can rotate relative to the adhesive applicator base 341. During the rotation of the guide roller 3431, it can drive the adhesive tape to move together to output the adhesive tape. When the adhesive applicator base 341 moves, the guide roller 3431 presses against the surface of the circuit board to apply the adhesive tape to the surface of the circuit board, thereby connecting adjacent films on the surface of the circuit board.

[0051] The pressure roller assembly 344 is used to move onto the tape pressed onto the surface of the circuit board after the tape application is completed, and cooperates with the guide roller assembly 343 to tension the tape; the cutter assembly 345 is used to cut the tape located between the pressure roller assembly 344 and the guide roller assembly 343; in this embodiment, after a single tape application is completed, the tape is tensioned by the cooperation of the pressure roller assembly 344 and the guide roller assembly 343, and the tape is cut by the cutter assembly 345, thereby automating the tensioning and cutting of the tape, which has the advantage of high reliability.

[0052] Furthermore, such as Figure 6-7 As shown, the pressure roller assembly 344 includes a pressure roller cylinder 3441, a pressing roller 3442, and a support frame 3443. The pressure roller cylinder 3441 is mounted on the adhesive applicator base 341, the support frame 3443 is mounted on the piston rod of the pressure roller cylinder 3441, and the pressing roller 3442 is mounted on the support frame 3443. Specifically, the pressure roller cylinder 3441 is inclined downward, so that when the pressure roller cylinder 3441 extends, it drives the support frame 3443 and the pressing roller 3442 to extend and press on the adhesive tape on the surface of the circuit board. When the pressing roller cylinder retracts, it drives the support frame 3443 and the pressing roller 3442 to retract to avoid contact with the adhesive tape.

[0053] In this embodiment, the guide roller assembly 343 preferably has a first position that contacts the circuit board for applying adhesive tape and a second position that separates from the circuit board, such as... Figure 8-10As shown; the guide roller assembly 343 can be switched between a first position and a second position by a separate power drive mechanism; in order to make the structure more compact and control more convenient, the adhesive applicator base 341 in this embodiment is provided with a transmission assembly 346, and the pressure roller assembly 344 is connected to the guide roller assembly 343 through the transmission assembly 346; when the pressure roller assembly 344 moves to press the adhesive tape on the surface of the circuit board, the guide roller assembly 343 switches from the first position to the second position.

[0054] The transmission assembly 346 includes a transmission plate 3461, which is pivotally connected to the adhesive applicator base 341 via a hinge shaft 3462. To provide mounting space for the guide roller assembly 343, pressure roller assembly 344, and cutter assembly 345, the adhesive applicator base 341 may also be provided with a carrier plate 3413. The carrier plate 3413 is fixedly connected to the adhesive applicator base 341 via multiple support columns, and defines the aforementioned mounting space between the carrier plate 3413 and the adhesive applicator base 341. Preferably, there are two transmission plates 3461, one of which is pivotally connected to the carrier plate 3413, and the other is pivotally connected to the adhesive applicator base 341. The two transmission plates 3461 are respectively arranged on opposite sides of the aforementioned mounting space to form a more stable transmission support.

[0055] Please continue reading Figure 5 The transmission plate 3461 is specifically fan-shaped; wherein, the guide pulley assembly 343 is disposed on the first side of the transmission plate 3461. Preferably, the adhesive applicator base 341 and the carrier plate 3413 are provided with arc-shaped guide grooves 3414, and the two ends of the guide pulley 3431 pass through the arc-shaped guide grooves 3414 and respectively form a hinged engagement with the two transmission plates 3461, thereby switching between the first position and the second position under the guidance of the arc-shaped guide grooves 3414; furthermore, a mounting plate 3463 extending out of the transmission plate 3461 is provided on the first side of the transmission plate 3461, and the auxiliary wheel 3432 is rotatably disposed on the mounting plate 3463 and contacts the guide pulley 3431 to prevent the tape from falling off.

[0056] The second side of the transmission plate 3461 is provided with a first sliding groove 3464; the support frame 3443 is provided with a connecting column 3444, which is rotatably disposed in the first sliding groove 3464 and can slide in the first sliding groove 3464, that is, the connecting column 3444 and the first sliding groove 3464 form a rotational sliding fit; preferably, the first sliding groove 3464 is disposed along the radial direction of the transmission plate 3461.

[0057] To ensure the smooth movement of the support frame 3443 during extension and retraction, a second slide groove 3415 can be provided on the carrier plate 3413 and the adhesive applicator base 341. A guide post 3445 is provided on the support frame 3443 and slidably disposed in the second slide groove 3415. The cooperation between the guide post 3445 and the second slide groove 3415 provides guidance for the extension and retraction of the support frame 3443.

[0058] Preferably, bearings can be provided on both the connecting post 3444 and the guide post 3445 to reduce sliding friction.

[0059] In this embodiment, when the support frame 3443 extends under the drive of the pressure roller cylinder 3441, it drives the pressure roller 3442 to extend and press on the tape on the surface of the circuit board. On the other hand, through the cooperation of the connecting column 3444 and the first slide groove 3464, it drives the transmission plate 3461 to swing forward around the hinge axis 3462, thereby driving the guide roller assembly 343 to switch from the first position to the second position.

[0060] Please continue reading Figure 6-7 The cutter assembly 345 includes a cutter 3451, a mounting bracket 3452 for mounting the cutter 3451, and a cutter cylinder 3453 for driving the extension and retraction of the mounting bracket 3452. The mounting bracket 3452 is mounted on the adhesive applicator base 341 or support frame 3443 via a slide 3454. The slide 3454 is used to guide the extension and retraction of the mounting bracket 3452 to maintain the smoothness of the movement of the cutter 3451 during extension and retraction.

[0061] Furthermore, the adhesive applicator 34 also includes an air blowing assembly 347, such as... Figure 5 As shown, the air blowing assembly 347 is used to blow air toward the guide pulley 3431 so that the tape output by the guide pulley assembly 343 adheres tightly to the guide pulley 3431 after being cut. The air blowing assembly 347 can keep the cut tape in its sheet shape and prevent self-adhesion. At the same time, by setting the blowing angle of the air blowing assembly 347, the tape can always be tilted toward the circuit board, which is conducive to the tape being stably adhered to the circuit board and connecting adjacent films on the surface of the circuit board.

[0062] The working cycle of the tape applicator module 30 in this embodiment is as follows: Figure 8-10 As shown: Before the tape application begins, the tape application mechanism 34 is located on the opposite side of the circuit board. At this time, the guide roller assembly 343 is in the first position in contact with the circuit board, and the pressure roller 3442 is in the retracted state. The tape application base 341 is moved to the opposite side of the circuit board via a moving mechanism. The guide roller 3431 presses against the surface of the circuit board, thus applying the tape to the surface of the circuit board and connecting adjacent films on the circuit board surface, as shown. Figure 8As shown. After the tape is applied, the pressure roller cylinder 3441 actuates to drive the pressure roller 3442 to extend, and simultaneously drives the guide roller assembly 343 to switch to the second position; at this time, the tape is tensioned by the guide roller 3431 and the pressure roller 3442, as shown. Figure 9 As shown. Finally, the cutter cylinder 3453 actuates to drive the cutter 3451 to extend and cut the tape located between the guide pulley 3431 and the pressure wheel 3442, as shown. Figure 10 As shown.

[0063] like Figure 11-13 As shown, the film-peeling module 40 includes a film-peeling base 41, a collecting mechanism 42, and a conveying mechanism 43. The film-peeling base 41 is mounted on the frame 10. The conveying mechanism 43 is used to peel off the films bonded together on the surface of the circuit board and guide and convey the films. The collecting mechanism 42 is used to collect the peeled films conveyed by the conveying mechanism 43. The film-peeling base 41 is equipped with two conveying rollers 411, and the circuit board is conveyed between the two conveying rollers 411.

[0064] In this embodiment, a set of collecting mechanisms 42 and a conveying mechanism 43 are respectively provided on the upper and lower sides of the two conveying rollers 411 on the film peeling machine base 41 to peel and collect the film on the two surfaces of the circuit board respectively. It should be noted that when only a single surface of the circuit board needs to be peeled, only the corresponding set of collecting mechanisms 42 and conveying mechanisms 43 can work.

[0065] The following section describes one structure of the film-tearing module 40, using the upper-mounted group collection mechanism 42 and conveying mechanism 43 as examples:

[0066] The conveying mechanism 43 includes a conveying motor 431, a drive roller 432, and a driven roller 433. The drive roller 432 is mounted on the film-tearing machine base 41 and rotates under the drive of the conveying motor 431. The driven roller 433 is mounted on the film-tearing machine base 41 via a movable frame 434, and the driven roller 433 can cooperate with the drive roller 432 to clamp the film for stable conveying.

[0067] Specifically, the film-peeling machine base 41 is equipped with a clamping cylinder 412, and the movable frame 434 is mounted on the piston rod of the clamping cylinder 412. Driven by the clamping cylinder 412, the driven roller 433 can approach or separate from the driving roller 432. When the driven roller 433 separates from the driving roller 432, the film to be peeled can be manually passed between them. When the driven roller 433 approaches the driving roller 432, such as... Figure 12-13As shown, the rotation of the driving roller 432 drives the driven roller 433 to rotate, conveying the film held between them. Preferably, the driven roller 433 is a coated roller to better cooperate with the driving roller 432 for film conveying. Preferably, there are two clamping cylinders 412, located on opposite sides of the driven roller 433, to maintain the smoothness of the driven roller 433's movement.

[0068] For ease of installation, the transmission motor 431 is connected to the drive roller 432 via a synchronous pulley assembly 435. Furthermore, the transmission motor 431 is preferably a stepper motor, and its output end may also be equipped with a reducer 436. Power is transmitted via the reducer 436 and the synchronous pulley assembly 435 to achieve stable rotation of the drive roller 432.

[0069] The collection mechanism 42 includes a collection motor 421 and a collection roll 422. The collection roll 422 is mounted on the film-tearing machine base 41 and rotates under the drive of the collection motor 421. The active roller 432, the driven roller 433, and the collection roll 422 are located on the same side of the circuit board, and the active roller 432 and the driven roller 433 are located in the middle of the circuit board and the collection roll 422. Preferably, the active roller 432 and the driven roller 433 are flush with each other in the height direction.

[0070] In the embodiment, the collecting motor 421 is preferably a torque motor, and the collecting roll 422 is preferably an air-expanding shaft, so as to cooperate in completing the stable peeling and winding of the film.

[0071] In this embodiment, the conveying mechanism 43 actively conveys the peeled film, which is beneficial for the collection mechanism 42 to collect the film. This eliminates the influence of the diameter change on the collection speed caused by the increase of collected film on the collection roll 422, so that the peeling force of the collection roll 422 does not change during the film collection process, thereby completely avoiding adverse phenomena such as film breakage during the film collection process.

[0072] In an optional embodiment, the movable frame 434 is further provided with a second sensor 437 for detecting the presence or absence of film between the active roller 432 and the driven roller 433. The second sensor 437 is connected to the control system of the equipment to issue an early warning in case of abnormal film breakage or other situations.

[0073] To achieve precise feeding of the circuit boards, the feeding device 20 in this embodiment also includes a positioning and pulling mechanism 21, such as... Figure 14As shown, the positioning and pulling mechanism 21 includes a fixed base 211, a movable base 212, a positioning component 213, and a pulling component 214. The fixed base 211 is mounted on the frame 10, and several support bars 215 for supporting the circuit board are provided on the fixed base 211. The movable base 212 is slidably disposed on the fixed base 211 along the conveying direction of the circuit board. Specifically, the fixed base 211 is provided with a screw drive structure to drive the movable base 212 to reciprocate. The positioning component 213 is disposed on the fixed base 211 and located on the discharge side of the fixed base 211, and is used to press the circuit board.

[0074] The material pulling assembly 214 is mounted on the movable base 212 and is used to clamp the circuit board and pull it for conveying, so as to achieve precise conveying. Specifically, a camera module 216 is provided on the movable base 212. The camera module 216 accurately positions the reciprocating movement of the movable base 212, thereby ensuring that the material pulling assembly 214 moves in a set manner to feed the material and accurately control the length of each feeding. Specifically, the material pulling assembly 214 includes, for example, an upper clamping plate and a lower clamping plate. The lower clamping plate is slidably mounted on the support bar, and the upper clamping plate is a pneumatic clamping plate that can rise and fall. When the upper clamping plate falls, it presses the circuit board onto the lower clamping plate. The movable base 212 slides forward to drive the upper clamping plate, the lower clamping plate, and the circuit board clamped by the upper clamping plate to feed forward.

[0075] Cutting device 50 is used to cut the circuit board after the film has been removed; such as Figure 1-2 As shown in Figures 15-16, the circuit board is conveyed to the cutting device 50 via the positioning and pulling mechanism 21. The cutting device 50 includes a cutting base 51, an upper cutting piece 52, and a lower cutting piece 53. The cutting base 51 is mounted on the frame 10, and the upper cutting piece 52 and the lower cutting piece 53 are arranged vertically on the cutting base 51. At least one of the upper cutting piece 52 and the lower cutting piece 53 is movable to cut the circuit board. Preferably, the lower cutting piece 53 is fixed and the upper cutting piece 52 is movable. More preferably, the upper cutting piece 52 is driven by a cylinder.

[0076] Specifically, a third sensor 54 is provided on the cutting machine base 51. The third sensor 54 is used to detect whether the product obtained after the circuit board is cut is conveyed forward; please continue reading Figure 15-16 A dust collection box 55 is also provided on the cutting machine base 51 to collect dust or debris during the cutting process.

[0077] The cleaning device 60 is used to clean the product obtained after cutting by the cutting device 50, such as... Figure 17-18As shown; the cleaning device 60 includes a cleaning base 61, a first conveying assembly 62, a second conveying assembly 63, and a cleaning assembly 64; the first conveying assembly 62 and the second conveying assembly 63 are spaced apart, and the cleaning assembly 64 is removably disposed between the first conveying assembly 62 and the second conveying assembly 63.

[0078] Specifically, the overall length of the first conveying component 62 near the feed side is preferably slightly smaller than the overall length of the second conveying component 63 near the discharge side, so as to facilitate cooperation with other equipment to receive products; preferably, the overall length of the second conveying component 63 is preferably longer than the length of the conveyed product, so that the product can be entirely placed on the second conveying component 63 and conveyed by the second conveying component 63.

[0079] Furthermore, both the first conveying assembly 62 and the second conveying assembly 63 are belt conveyor assemblies; the structure of the first conveying assembly 62 will be described below as an example; for example... Figure 17 As shown, the first conveying assembly 62 includes a drive roller 621, a driven roller 622, and multiple elastic conveyor belts 623 wound around the drive roller 621 and the driven roller 622; the products supported on the elastic conveyor belts 623 are conveyed by the multiple elastic conveyor belts 623, the conveying is highly stable, and the relative position of the products does not change during the conveying process, which is conducive to the automatic feeding of products.

[0080] The cleaning device 60 also includes a movable support 65, which has a working position and a non-working position; wherein, the cleaning component 64 is disposed on the movable support 65; specifically, when the movable support 65 is in the working position, such as Figure 17-18 As shown, the cleaning component 64 is located between the first conveying component 62 and the second conveying component 63 to clean the product; when the movable support 65 is in the non-working position, as... Figures 19-20 As shown, the cleaning component 64 is located beside the first conveying component 62 and the second conveying component 63, at which time the cleaning component 64 can be maintained.

[0081] In this embodiment, the movable support 65 slides between a working position and a non-working position; wherein, the cleaning base 61 is provided with a cleaning slide rail 611, and the movable support 65 is slidably mounted on the cleaning slide rail 611. Specifically, a handle 651 is preferably provided on the outer side of the movable support 65 to form a drawer-type structure, thereby facilitating the overall pushing in and pulling out of the movable support 65.

[0082] Furthermore, to ensure the structural stability of the cleaning component 64 during product cleaning, a positioning component 66 is provided on the cleaning base 61. The positioning component 66 is used to lock the movable support 65 in the working position. Preferably, the positioning component 66 includes two positioning cylinders 661. When the movable support 65 slides to the working position, the positioning cylinders 661 extend to lock the position of the movable support 65. Correspondingly, a fourth sensor 612 is provided on the cleaning base 61 to detect whether the movable support 65 is in the working position. The fourth sensor 612 detects the position of the movable support 65 to interlock with the action of the positioning cylinders 661, thereby automatically locking the position of the movable support 65.

[0083] In this embodiment, the cleaning component 64 includes an upper cleaning roller 641, a lower cleaning roller 642, and a drive motor 643 for driving the upper cleaning roller 641 and the lower cleaning roller 642 to rotate. The drive motor 643 is connected to the upper cleaning roller 641 or the lower cleaning roller 642 through a coupling 644. Specifically, the upper cleaning roller 641 and the lower cleaning roller 642 can refer to the cleaning wheels used for cleaning circuit boards after cutting in the prior art. This embodiment does not limit the structure and material of the upper cleaning roller 641 and the lower cleaning roller 642, as long as they can achieve the cleaning of the product surface.

[0084] The upper cleaning roller 641 and the lower cleaning roller 642 are used to contact the upper and lower surfaces of the product respectively to clean the upper and lower surfaces of the product; specifically, at least one of the upper cleaning roller 641 and the lower cleaning roller 642 is a movable cleaning roller so that the upper cleaning roller 641 and the lower cleaning roller 642 can approach or separate from each other.

[0085] Specifically, when the upper cleaning roller 641 and the lower cleaning roller 642 are separated from each other, the distance between them is relatively large, which allows for replacement, maintenance and other operations. When the upper cleaning roller 641 and the lower cleaning roller 642 are close to each other, the upper and lower surfaces of the product passing between them can contact the upper cleaning roller 641 and the lower cleaning roller 642 respectively, thereby achieving cleaning of the upper and lower surfaces of the product.

[0086] Please refer to it again. Figures 19-20In this embodiment, the upper cleaning roller 641 is fixedly mounted on the movable support 65, and the lower cleaning roller 642 is freely movable and height-adjustable on the movable support 65. For example, the movable support 65 is provided with a vertical guide rail 652, and the two ends of the lower cleaning roller 642 are slidably connected to the guide rail 652 through sliders 653 to achieve free lifting and lowering. For example, the movable support 65 also includes a lifting member 654 mounted on the cleaning base 61, which is used to drive the lower cleaning roller 642 to rise and approach the upper cleaning roller 641. Specifically, the lifting member 654 is preferably a lifting cylinder; in other embodiments, a lifting mechanism such as an electric push rod can also be used, which will not be elaborated here.

[0087] To facilitate the wiring and assembly of the drive motor 643, in this embodiment, the drive motor 643 is mounted on the cleaning base 61 and is connected to the upper cleaning roller 641 via a coupling 644. The coupling 644 is a magnetic coupling. When the movable support 65 is in the working position, the upper cleaning roller 641 and the magnetic coupling form a magnetic transmission connection, allowing the drive motor 643 to drive the upper cleaning roller 641 to rotate. When the movable support 65 is in the non-working position, the transmission connection between the upper cleaning roller 641 and the magnetic coupling fails, preventing the drive motor 643 from driving the upper cleaning roller 641 to rotate. This allows for quick maintenance of both the upper and lower cleaning rollers 641 and 642.

[0088] The cleaning assembly 64 also includes a sticky paper roller 645, which can be used to clean the upper cleaning roller 641 or the lower cleaning roller 642 to improve the cleanliness of the upper cleaning roller 641 or the lower cleaning roller 642. Specifically, one or two sticky paper rollers 645 are provided according to the actual situation and process requirements; for example, when the embodiment is for peeling the film off the upper surface of the product, only one sticky paper roller 645 corresponding to the upper cleaning roller 641 is needed. Specifically, as... Figures 19-20 As shown, the movable bracket 65 is provided with a vertical guide groove 655, and the dust-adhesive paper roller 645 is disposed in the guide groove 655 and located above the upper cleaning roller 641. Under the action of gravity, the dust-adhesive paper roller 645 comes into contact with the upper cleaning roller 641 to form a contact fit, thereby removing dust and other debris attached to the surface of the upper cleaning roller 641.

[0089] In this embodiment, the product cleaned by the cleaning device 60 is transferred to the stacking module 70 via the transfer device 80 for collection; such as Figure 2As shown, the transfer device 80 in this embodiment can refer to the negative pressure suction and transfer structure commonly used in the prior art for transferring sheet circuit boards, and the stacking module 70 can refer to the lifting stacking structure commonly used in the prior art for storing sheet circuit boards. This embodiment does not limit the transfer device 80 and the stacking module 70, so they will not be elaborated further.

[0090] While the present invention has been disclosed above with reference to specific embodiments, these embodiments are not intended to limit the scope of the invention. Any person skilled in the art can make variations / modifications without departing from the scope of the invention; all equivalent variations / modifications made in accordance with the present invention should be covered by the protection scope of the present invention.

Claims

1. A circuit board film-peeling and cutting device, comprising a feeding device, an adhesive tape application module, a film-peeling module, and a cutting device; wherein, The feeding device is used to supply circuit boards; the tape application module connects adjacent films on the surface of the circuit board with tape; the film peeling module is used to peel off the films connected on the surface of the circuit board to be processed; the cutting device is used to cut the circuit board after the films have been peeled off. The tape application module includes: A receiving platform is used to hold the circuit boards supplied by the feeding device; An adhesive applicator includes an adhesive applicator base and a tape feeding assembly, a guide roller assembly, a pressure roller assembly, and a cutter assembly disposed on the adhesive applicator base. The tape feeding assembly supplies tape to the guide roller assembly. The adhesive applicator base can be moved relative to the receiving table under the drive of a moving mechanism to drive the guide roller assembly to apply the tape to an adjacent film on the surface of a circuit board. The pressure roller assembly can be moved to press the tape onto the surface of the circuit board and cooperates with the guide roller assembly to tension the tape. The cutter assembly is used to cut the tape located between the pressure roller assembly and the guide roller assembly.

2. The circuit board film peeling and cutting equipment as described in claim 1, wherein: The guide roller assembly has a first position in contact with the circuit board for applying tape and a second position separated from the circuit board; the tape application base is provided with a transmission assembly, and the pressure roller assembly is connected to the guide roller assembly through the transmission assembly; as the pressure roller assembly moves to press the tape onto the surface of the circuit board, the guide roller assembly switches from the first position to the second position.

3. The circuit board film peeling and cutting equipment as described in claim 2, wherein: The transmission assembly includes a transmission plate, which is swayably connected to the adhesive applicator base via a hinge shaft; the transmission plate is provided with a first sliding groove. The pressure roller assembly includes a pressure roller, a support frame for supporting the pressure roller, and a connecting column disposed on the support frame; the connecting column is rotatably disposed in the first slide groove, and the connecting column can slide in the first slide groove; The guide roller assembly is disposed on the transmission plate; the movement of the pressure roller assembly can drive the transmission plate to swing around the hinge axis, so that the guide roller assembly switches between a first position and a second position.

4. The circuit board film peeling and cutting equipment as described in claim 3, wherein: The adhesive applicator base is provided with a second sliding groove, and the support frame is provided with a guide post, which is slidably disposed in the second sliding groove.

5. The circuit board film peeling and cutting equipment as described in claim 3, wherein: The cutting assembly includes a cutting blade, a mounting bracket for mounting the cutting blade, and a cutting blade cylinder for driving the mounting bracket to extend and retract; the mounting bracket is mounted on the adhesive applicator base or the support frame via a slide; the slide guides the extension and retraction of the mounting bracket.

6. The circuit board film peeling and cutting equipment as described in claim 3, wherein: The guide roller assembly includes a guide roller and an auxiliary roller that cooperate with each other. The auxiliary roller is used to press the tape onto the guide roller. The adhesive applicator base is also provided with an arc-shaped guide groove for swinging and guiding the guide roller.

7. The circuit board film peeling and cutting equipment as described in claim 6, wherein: The adhesive application mechanism also includes an air blowing assembly; the air blowing assembly is used to blow air toward the guide pulley so that the cut adhesive tape adheres tightly to the guide pulley.

8. The circuit board film peeling and cutting equipment as described in claim 1, wherein: The tape application module includes two tape application mechanisms located on the upper and lower sides of the receiving platform, respectively, to apply tape to the upper and lower sides of the circuit board, so that the films on the upper and lower surfaces of the circuit board are respectively connected to their respective adjacent films.

9. The circuit board film peeling and cutting equipment as described in claim 1, wherein: It also includes a cleaning device, a transfer device, and a stacking module; the cleaning device is used to clean the product obtained after cutting by the cutting device, and the transfer device is used to transfer the cleaned product to the stacking module for collection.

10. The circuit board film peeling and cutting equipment as described in claim 9, wherein: The cleaning device includes a first conveying component, a second conveying component, and a cleaning component; the first conveying component and the second conveying component are spaced apart, and the cleaning component is removably disposed between the first conveying component and the second conveying component.

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