Electroplating tank capable of controlling overflow edge fluctuation and electroplating device

Abstract

The application provides a plating tank capable of controlling overflow edge fluctuation and a plating device, wherein the plating tank capable of controlling overflow edge fluctuation comprises a tank body and an overflow device arranged on the tank body, the tank body can contain plating solution, the overflow device comprises an overflow ring and a plurality of support columns, the overflow ring is supported on the upper surface of the tank body through the support columns, and an overflow port is formed between the upper surface of the tank body and the overflow ring. The plating tank capable of controlling overflow edge fluctuation and the plating device provided by the application can realize the following effects: when the liquid inflow amount of the tank body is less than or equal to a preset value, the plating solution overflowing from the tank body flows out from the overflow port; when the liquid inflow amount of the tank body is greater than the preset value, the plating solution overflowing from the tank body flows out from the overflow port and the upper surface of the overflow ring, thereby eliminating the liquid fluctuation at the outermost circle of the wafer and ensuring the uniformity of the plating at the outermost circle of the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to an electroplating tank capable of controlling overflow edge fluctuation, and an electroplating device comprising the electroplating tank. Background Art

[0002] A wafer is a silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. During manufacturing, a layer of conductive metal is electroplated on the wafer and then processed to form conductive circuits. During the electroplating process, the plating solution must be evenly distributed across the wafer. This uniformity is crucial to the electroplating process.

[0003] However, in the existing technology, when the wafer is electroplated, the plating liquid in the plating tank will produce large fluctuations and disturbances at the overflow edge of the plating tank after being stirred by the stirring system, affecting the plating effect of the outermost circle of the wafer, resulting in uneven plating of the wafer, and greatly affecting the plating quality of the wafer.

[0004] Therefore, there is an urgent need in the art for an electroplating tank that can eliminate fluctuations and disturbances of the electroplating solution at the overflow edge, so that the electroplating of the wafer can achieve an ideal effect. Summary of the Invention

[0005] In response to the defects in the prior art, the purpose of the present invention is to provide an electroplating tank that can control the fluctuation of the overflow edge, and an electroplating device comprising the electroplating tank. The electroplating tank can eliminate the fluctuation and disturbance generated by the plating solution at the overflow edge, thereby ensuring the uniformity of electroplating on the outermost circle of the wafer.

[0006] In order to achieve the above-mentioned object of the present invention, the present invention adopts the following technical solution:

[0007] A plating tank capable of controlling overflow edge fluctuations comprises a tank body and an overflow device arranged on the tank body. The tank body can contain plating liquid. The overflow device comprises an overflow ring and a plurality of support columns. The overflow ring is supported on the upper surface of the tank body via the support columns, and an overflow port is formed between the upper surface of the tank body and the overflow ring.

[0008] In the present technical solution, by adopting the above structural design, the overflow ring is supported by the support column and leaves an appropriate gap with the upper surface of the tank body. The gap is the overflow port. When the liquid inlet of the tank body is less than or equal to the preset value, the electroplating liquid in the tank body overflows outward, and the overflowed electroplating liquid flows out from the overflow port. When the liquid inlet of the tank body is greater than the preset value, the electroplating liquid overflowing from the tank body flows out from the overflow port and the upper surface of the overflow ring, thereby eliminating the liquid fluctuation at the outermost circle of the wafer and ensuring the uniformity of the electroplating on the outermost circle of the wafer.

[0009] Preferably, the overflow port has a drainage section extending outward from the inner port, and the diameter of the drainage section gradually decreases from the inside to the outside.

[0010] In this technical solution, by adopting the above structural design and setting up a drainage section with a diameter that gradually shrinks from the inside to the outside, it can ensure that the plating liquid overflowing from the tank body flows out smoothly along the overflow port, avoiding liquid fluctuations at the outermost circle of the wafer.

[0011] Preferably, the overflow ring includes an inclined surface, and a drainage section of the overflow port is formed between the inclined surface and the upper surface of the trough body.

[0012] In this technical solution, by adopting the above structural design and utilizing the design of the inclined surface of the overflow ring, the diameter of the drainage section is gradually reduced from the inside to the outside, ensuring that the electroplating liquid overflowing from the tank body can flow out smoothly along the overflow port.

[0013] Preferably, the inclination angle of the inclined surface relative to the horizontal plane is between 30° and 45°.

[0014] In this technical solution, by adopting the above structural design, the inclination angle range of the overflow ring inclined surface is set to 30° to 45°. Within this angle range, the electroplating solution can be better guided to overflow through the overflow port.

[0015] Preferably, the inclination angle of the inclined surface relative to the horizontal plane is 45°.

[0016] In this technical solution, by adopting the above structural design, the inclination angle of the overflow ring inclined surface relative to the horizontal plane is set to 45°. Such an angle design can effectively drain the electroplating liquid and ensure that the electroplating liquid flows out smoothly from the overflow port.

[0017] Preferably, the ratio of the outer diameter to the inner diameter of the drainage section is between 1 / 7 and 2 / 5.

[0018] In this technical solution, by adopting the above structural design, the ratio of the outer diameter and the inner diameter of the drainage section is set between 1 / 7 and 2 / 5. On the one hand, it avoids the gap between the inner diameter and the outer diameter of the drainage section being too large, resulting in the electroplating solution not being able to overflow well; on the other hand, it avoids the gap between the inner diameter and the outer diameter of the overflow port being too small, so that the electroplating solution cannot have a good drainage effect.

[0019] Preferably, the inner diameter of the drainage section ranges from 5 to 7 mm; the outer diameter of the drainage section ranges from 1 to 2 mm.

[0020] In this technical solution, by adopting the above structural design, the value range of the inner diameter of the drainage section is set between 5 and 7 mm, and the value range of the outer diameter of the drainage section is set between 1 and 2 mm. The setting of this value range can, on the one hand, well meet the drainage effect of the electroplating liquid, and on the other hand, can make the structure of the electroplating tank more simple and compact, and avoid the overflow device taking up too much space in the vertical direction.

[0021] Preferably, the inner diameter of the drainage section is 5 mm, and the outer diameter of the drainage section is 1 mm.

[0022] In this technical solution, by adopting the above structural design, the inner diameter of the drainage section is limited to 5mm, and the outer diameter of the drainage section is limited to 1mm, which ensures a good overflow effect while making the structure of the equipment more simple and compact.

[0023] Preferably, the support columns are distributed at equal intervals along the annular surface of the overflow ring.

[0024] In this technical solution, by adopting the above structural design, the support columns are distributed at equal intervals along the annular surface of the overflow ring, thereby improving the stability of the overflow ring and improving the uniformity of the overflow.

[0025] An electroplating device comprises the electroplating tank capable of controlling overflow edge fluctuation as described above.

[0026] In this technical solution, by adopting the above structural design, the electroplating device includes an electroplating tank that can control the overflow edge fluctuation as described in any of the above items, thereby eliminating the liquid fluctuation at the outermost circle of the wafer during the electroplating process, and ensuring the uniformity of the electroplating of the outermost circle of the wafer.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The present invention provides an electroplating tank and an electroplating device that can control the fluctuation of the overflow edge. Through the setting of the overflow device, when the liquid inlet amount of the tank body is less than or equal to a preset value, the electroplating liquid in the tank body overflows outward, and the overflowed electroplating liquid flows out from the overflow port. When the liquid inlet amount of the tank body is greater than the preset value, the electroplating liquid overflowing from the tank body flows out from the overflow port and the upper surface of the overflow ring, thereby eliminating the liquid fluctuation at the outermost circle of the wafer and ensuring the uniformity of the electroplating of the outermost circle of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0030] Figure 1 Schematic diagram of the overall structure of the electroplating tank capable of controlling overflow edge fluctuation according to the first embodiment;

[0031] Figure 2 Figure 1 is a schematic view of the overflow device of the electroplating tank with controllable overflow edge fluctuation according to the first embodiment;

[0032] Figure 3 Figure 2 is a partial front view of the electroplating tank with controllable overflow edge fluctuation according to the first embodiment.

[0033] The figures show:

[0034] 100 - electroplating tank with controllable overflow edge fluctuation

[0035] 10 - tank body

[0036] 20 - overflow device

[0037] 21 - overflow ring

[0038] 211 - upper surface of the overflow ring

[0039] 212 - inclined surface

[0040] 22 - support column

[0041] 30 - overflow port

[0042] 31 - flow guiding section

[0043] D - inner diameter

[0044] d - outer diameter

[0045] β - inclination angle DETAILED DESCRIPTION

[0046] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0047] Therefore, the detailed description of the embodiments of the present application provided below in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0048] It should be noted that similar numbers and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. In addition, all directional indications in this application (such as up, down, left, right, front, back, bottom...) are only used to explain the relative position relationship, movement, etc. between the components under a specific posture (as shown in the figures). If the specific posture changes, the directional indication will also change accordingly. Furthermore, the descriptions of "first", "second", etc. in the application are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features.

[0049] Example 1

[0050] The electroplating tank is the most basic piece of equipment in electroplating equipment. Its main function is to hold the plating solution for use in the wafer electroplating process. To ensure uniform distribution of metal ions in the plating solution, electroplating tanks currently on the market generally incorporate a jet or stirring device to maintain the flow of the plating solution and achieve uniform plating of the metal ions. However, the design of the jet or stirring device can easily cause large fluctuations and disturbances at the overflow edge of the plating tank, affecting the plating effect on the outermost circle of the wafer, leading to uneven plating on the wafer and significantly affecting the plating quality of the wafer.

[0051] To this end, this embodiment provides an electroplating tank 100 that can control the fluctuation of the overflow edge. By adding an overflow device 20 to the traditional electroplating tank, the plating liquid at the overflow edge can directly and smoothly overflow outward, thereby avoiding affecting the electroplating effect of the outermost circle of the wafer.

[0052] Specifically, if Figure 1 and Figure 2 As shown, the electroplating tank 100 provided in this embodiment can control the fluctuation of the overflow edge, including a tank body 10 and an overflow device 20 arranged on the tank body 10. The tank body 10 can contain the electroplating solution. The overflow device 20 includes an overflow ring 21 and a plurality of support columns 22. The overflow ring 21 is supported on the upper surface of the tank body 10 through the support columns 22, and an overflow port 30 is formed between the upper surface of the tank body 10 and the overflow ring 21.

[0053] The above structural design ensures that when the liquid inlet amount of the tank body 10 is less than or equal to the preset value, the plating liquid in the tank body 10 overflows outward, and the overflowing plating liquid can flow out from the overflow port 30. When the liquid inlet amount of the tank body 10 is greater than the preset value, the plating liquid overflowing from the tank body 10 flows out from the overflow port 30 and the upper surface 211 of the overflow ring, thereby eliminating the liquid fluctuation at the outermost circle of the wafer and ensuring the uniformity of the electroplating of the outermost circle of the wafer.

[0054] Furthermore, in order to ensure that the plating solution can flow out smoothly along the overflow port 30, as shown in FIG. Figure 3 As shown, the overflow port 30 has a drainage section 31 extending outward from the inner opening. The diameter of the drainage section 31 gradually decreases from the inside to the outside. Specifically, the inner diameter D of the drainage section 31 can range from 5 to 7 mm, and the outer diameter d can range from 1 to 2 mm. Preferably, the inner diameter D of the drainage section 31 is 5 mm, and the outer diameter d of the drainage section 31 is 1 mm. This ensures that the plating solution is drained while making the device structure simpler and more compact, and preventing the overflow device 20 from occupying too much vertical space.

[0055] It should be noted that the so-called inner opening refers to the opening on the inner side of the tank body 10, the so-called outer opening refers to the opening on the outer side of the tank body 10, and the so-called diameter refers to the height of the opening in the vertical direction. Figure 3 As shown, the inner diameter D of the drainage section 31 refers to the vertical opening height of the drainage section 31 on the side facing the interior of the tank body 10, and the outer diameter d of the drainage section 31 refers to the vertical opening height of the drainage section 31 on the side facing the exterior of the tank body 10. The inner opening of the overflow port 30 refers to the opening of the overflow port 30 on the side facing the interior of the tank body 10.

[0056] In addition, the following method can be used to gradually reduce the diameter of the drainage section 31 from the inside to the outside: Figure 2 and Figure 3 As shown, the inner side of the overflow ring 21 is an inclined surface 212. This inclined surface 212 and the upper surface of the tank body 10 form a drainage section 31 of the overflow port 30. The inclination angle β of the inclined surface 212 relative to the horizontal plane ranges from 30° to 45°, thereby ensuring that the overflowing electroplating solution can flow smoothly outward along the overflow port 30. Preferably, the inclination angle β of the inclined surface 212 relative to the horizontal plane is 45°. This angle design can effectively drain the electroplating solution and ensure that the electroplating solution flows out of the overflow port 30 at a steady rate.

[0057] Furthermore, the overflow ring 21 is supported on the upper surface of the tank body 10 by support columns 22 , and the support columns 22 are distributed at equal intervals along the annular surface of the overflow ring 21 , thereby improving the stability of the overflow ring 21 and improving the uniformity of the overflow.

[0058] Example 2

[0059] This embodiment provides an electroplating device, including the electroplating tank 100 described in Example 1 that can control the overflow edge fluctuation, thereby eliminating the liquid fluctuation at the outermost circle of the wafer during the electroplating process, and ensuring the uniformity of the electroplating at the outermost circle of the wafer.

[0060] The above describes the specific embodiments of the present invention. Based on the above description, relevant personnel can make various changes and modifications without departing from the scope of the technical concept of this invention.

Claims

1. A plating tank capable of controlling overflow edge fluctuation, characterized in that: The plating liquid is contained in the tank body and an overflow device provided on the tank body. The overflow device includes an overflow ring and a plurality of support columns. The overflow ring is supported on the upper surface of the tank body by the support columns, and an overflow port is formed between the upper surface of the tank body and the overflow ring. The overflow port has a drainage section extending outward from the inner port, and the diameter of the drainage section gradually decreases from the inside to the outside.

2. The electroplating tank capable of controlling overflow edge fluctuation according to claim 1, characterized in that: The overflow ring includes an inclined surface, and a drainage section of the overflow port is formed between the inclined surface and the upper surface of the trough body.

3. The electroplating tank capable of controlling overflow edge fluctuation according to claim 2, characterized in that: The inclination angle of the inclined surface relative to the horizontal plane is between 30° and 45°.

4. The electroplating tank capable of controlling overflow edge fluctuation according to claim 3, characterized in that: The inclination angle of the inclined surface relative to the horizontal plane is 45°.

5. The electroplating tank capable of controlling overflow edge fluctuation according to claim 1, characterized in that: The ratio of the outer diameter to the inner diameter of the drainage section is between 1 / 7 and 2 / 5.

6. The electroplating tank capable of controlling overflow edge fluctuation according to claim 5, characterized in that: The inner diameter of the drainage section has a value range of 5 to 7 mm; the outer diameter of the drainage section has a value range of 1 to 2 mm.

7. The electroplating tank capable of controlling overflow edge fluctuation according to claim 5, characterized in that: The inner diameter of the drainage section is 5 mm, and the outer diameter of the drainage section is 1 mm.

8. The electroplating tank capable of controlling overflow edge fluctuation according to claim 1, characterized in that: The support columns are distributed at equal intervals along the annular surface of the overflow ring.

9. An electroplating device, characterized in that: An electroplating tank capable of controlling overflow edge fluctuations according to any one of claims 1 to 8.

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