An auxiliary loading device for observing the electroplastic effect in situ

Abstract

The application relates to an auxiliary loading device for observing an electroplastic effect in situ, comprising an in-situ electric pulse loading platform, a wire, a pulse power supply, a Hall current sensor, a data acquisition card, a computer, a probe and a scanning electron microscope; the probe is correspondingly arranged on one side of the in-situ electric pulse loading platform; the in-situ electric pulse loading platform is arranged on a sample stage of the scanning electron microscope; the in-situ electric pulse loading platform is connected to positive and negative poles of the pulse power supply through wires respectively, and the wire connected to the positive pole of the pulse power supply is connected to the data acquisition card through the Hall current sensor; the data acquisition card and the probe are both connected to the computer. The application can finely load a sample, observe the change of a structure by using a scanning electron microscope and an EBSD in-situ characterization, synchronously observe the influence law of the electroplastic effect of a pulse current on stress, strain, temperature and a structure of a material in situ, facilitate comparison of the structure performance change of different current densities and traditional isothermal heating with the same parameters, and help quantitatively distinguish a pure electric effect and an electric heating effect.

Description

Technical Field

[0001] This invention relates to the field of plasticizing modification technology for difficult-to-deform alloy materials, and in particular to an auxiliary loading device for in-situ observation of the electroplastic effect. Background Technology

[0002] The electroplastic effect is a complex effect resulting from the combined action of multiple physical effects (electrothermal effect, magnetic compression effect, pure electrostrictive effect, skin effect, and thermoelectric effect). Compared to traditional heat treatment, electropulse treatment can induce complete recovery and recrystallization of magnesium alloys at lower temperatures, eliminating residual stress within the metal. However, it remains difficult to quantitatively distinguish between pure electrostrictive effects (non-thermal effects) and electrothermal effects (Joule heating). This makes it challenging to quantitatively control the effect of the electroplastic effect. Currently, research remains based on empirical accumulation or qualitative descriptions of the physical mechanisms, typically using indicators such as force and temperature to provide feedback on the electroplastic effect. This significantly hinders the progress in exploring the physical mechanisms of the electroplastic effect and the expansion of its industrial applications.

[0003] The study of the electroplastic effect induced by electrical pulses on alloy materials is divided into two directions: macroscopic and microscopic. One approach involves testing the tensile and compressive mechanical properties of materials after electrical pulse treatment to analyze their strength, plasticity, and other properties. The other approach uses scanning electron microscopy (SEM) and transmission electron microscopy (TEM) to observe microscopic changes in grain size, dislocations, and recrystallization before and after electrical pulse treatment. Both methods aim to eliminate the electrothermal effect and discover that the electroplastic effect improves the macroscopic mechanical properties of materials by influencing their microstructure. However, these studies share a common problem: they all infer the existence of the electroplastic effect from phenomena observed in the microscopic and macroscopic tests of materials after electrical pulse treatment, failing to observe the so-called "electron wind" directly altering the microstructure and improving mechanical properties during the electrical pulse treatment process. Some studies have attempted to demonstrate the existence of the electroplastic effect by pre-marking the materials, photographing the initial grain morphology using an electron microscope, and then photographing the treated grain morphology at the marked locations after electrical pulse treatment. This in-situ characterization method has several problems. First, the electrochemical treatment process can generate oxide scale on the material, affecting the location of markers and leading to observations at different locations in two separate observations. Second, observing in two separate sessions cannot reveal the electroplastic effect, i.e., electron wind promoting grain boundary slip, recrystallization, dislocation disappearance, and phase precipitation and dissolution. The electroplastic effect has remained speculative, and the inability to directly observe it is the biggest problem. In-situ testing refers to the continuous observation, recording, and analysis of the test specimen during the testing process using microscopic imaging instruments. Compared with traditional non-in-situ testing, in-situ testing has greater advantages in material property research, allowing for a more in-depth study of the influence of material microstructure on material properties. Summary of the Invention

[0004] To address the aforementioned problems, the present invention aims to provide an auxiliary loading device for in-situ observation of the electroplastic effect. Through microscopic characterization using scanning electron microscopy, the influence of the electroplastic effect on the microstructure of materials under electrical pulse loading is observed, demonstrating the improvement in the mechanical properties of the materials. An in-situ electroplastic loading platform is designed to observe the effect of electron wind, i.e., the electroplastic effect, at the microscopic level, proving that the electroplastic effect has a direct influence on the alloy microstructure, promoting grain boundary slip, recrystallization, dislocation disappearance, and phase precipitation and dissolution, thereby confirming the existence of the electroplastic effect.

[0005] The technical solution adopted in this invention is as follows:

[0006] The present invention proposes an auxiliary loading device for in-situ observation of the electroplastic effect, comprising an in-situ electrical pulse loading platform, wires, a pulse power supply, a Hall current sensor, a data acquisition card, a computer, a probe, and a scanning electron microscope; the probe is correspondingly disposed on one side of the in-situ electrical pulse loading platform; the in-situ electrical pulse loading platform is disposed on the stage of the scanning electron microscope; the in-situ electrical pulse loading platform is connected to the positive and negative terminals of the pulse power supply respectively via wires, and the wire connected to the positive terminal of the pulse power supply is connected to the data acquisition card via the Hall current sensor; both the data acquisition card and the probe are connected to the computer.

[0007] Furthermore, the in-situ electrical pulse loading platform includes a coupling, a reducer, a positive terminal, a lead screw, a heating mechanism, a slide rail, a base plate, a sensing component, a negative terminal, a clamp, an insulation component, a gearbox, a stepper motor, clamping bolts, and clamping nuts; the gearbox is located at one end of the upper surface of the base plate; the stepper motor is located outside the gearbox; the lead screws are symmetrically arranged on the left and right sides above the base plate, and are respectively connected to the output end of the stepper motor through the gearbox, the reducer, and the coupling; the slide rails are respectively arranged on the left and right sides of the upper surface of the base plate corresponding to the lead screws; The clamps are arranged in pairs, and the two ends of the clamps are slidably connected to the lead screws and slide rails on both sides via sliders; the sample is horizontally clamped between the pair of clamps; the heating mechanism is located in the middle area of ​​the upper surface of the base plate and between the two clamps; the sensing component is located on the front side of the upper surface of the base plate and corresponds to one of the clamps; the positive terminal and the negative terminal are fixed to the upper end face of the two clamps respectively by clamping bolts and clamping nuts and are respectively connected to the positive and negative terminals of the pulse power supply via wires; the insulation component is located between the clamps and the positive terminal, the negative terminal, and the sample.

[0008] Furthermore, the sensing component consists of a temperature sensor, a force sensor, and a displacement sensor.

[0009] Furthermore, the insulating assembly includes an insulating cover plate, insulating bolts, and an insulating coating; the portion of the clamp used to hold the sample is provided with an insulating coating; the insulating cover plate is fixed to the upper end face of the two clamps respectively by insulating bolts; the positive terminal and the negative terminal are respectively fixed above the insulating cover plates on both sides by clamping bolts and clamping nuts.

[0010] Furthermore, the bottom surface of the base plate is provided with an EBSD bracket; the EBSD bracket has an L-shaped plate structure; the base plate is correspondingly set on the upper end face of the EBSD bracket, and the two sides of the middle part are respectively connected to the EBSD bracket by fixing buckles; the lower end face of the EBSD bracket is fixed to the corresponding position by positioning bolts.

[0011] Furthermore, a sealing flange is provided between the wire and the cavity wall of the scanning electron microscope. To introduce the pulse current into the interior of the scanning electron microscope, the wire needs to pass through the sealing flange to ensure the vacuum level inside the microscope.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. Current research on the electroplastic effect is limited to abstract qualitative physical mechanism descriptions. However, by using an electric pulse loading method on a loading platform under a scanning electron microscope, the electroplastic effect, i.e., "electron wind," can promote changes in the microstructure of materials during loading. The influence of the pulse current on the microstructure can be observed in real time.

[0014] 2. In existing technologies, the electroplastic effect is indirectly reflected in the field of materials processing by improving mechanical properties and microstructure through post-processing electrical pulse treatment. However, this invention provides an experimental platform that allows for real-time observation under a scanning electron microscope, enabling simultaneous electrical pulse treatment and in-situ loading. This platform allows for synchronous real-time detection and identification of the direct impact of pulse current on the microstructure of the material during loading and deformation.

[0015] 3. Current research on the electroplastic effect has consistently failed to quantitatively distinguish between pure electro-induced effects (non-thermal effects) and electrothermal effects (Joule heating), making it difficult to quantitatively control the effects of the electroplastic effect. This invention can calculate the Joule heating generated by a sample under specific voltage, frequency, and pulse width by analyzing the sample's intrinsic properties and pulse current parameters. By providing a identical thermal environment using a heating device, these two experimental conditions can be applied to a deformed sample. In-situ comparison using scanning electron microscopy allows for quantitative analysis of the pure electro-induced effect in terms of its manifestations in current, stress, strain, temperature, and tissue changes.

[0016] 4. The in-situ electric pulse loading platform of the present invention can not only complete a variety of electroplastic effect mechanical experiments under in-situ observation, such as electroplastic tension, electroplastic compression, electroplastic shear, electroplastic bending, and electroplastic fatigue loading, but also use scanning and EBSD characterization to study the electroplastic effect on grain boundary slip, recrystallization, dislocation disappearance, and phase precipitation and dissolution during sample loading. These processes can be recorded in real time in an electron microscope. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 for Figure 1 A schematic diagram of in-situ observation of the electroplastic effect by EBSD in China;

[0019] Figure 3 for Figure 1 A three-dimensional structural schematic diagram of the in-situ electrical pulse loading platform;

[0020] Figure 4 for Figure 3 Schematic diagram of insulation treatment for the loading platform;

[0021] Figure 5 This is a three-dimensional structural diagram of the 70° EBSD characterization stent of the present invention.

[0022] In the attached figures, the following labels are used: 1-In-situ electrical pulse loading platform; 2-Sealing flange; 3-Wire; 4-Pulse power supply; 5-Hall current sensor; 6-Data acquisition card; 7-Computer; 8-Probe; 9-Scanning electron microscope; 10-Coupling; 11-Reducer; 12-Positive terminal; 13-Lead screw; 14-Heating mechanism; 15-Slide rail; 16-Base plate; 17-Mechanical sensor and displacement sensor; 18-Negative terminal; 19-Sample; 20-Clamp; 21-Insulating cover plate; 22-Gearbox; 23-Stepper motor; 24-Clamping bolt; 25-Clamping nut; 26-Insulating bolt; 27-EBSD bracket; 28-Fixing buckle; 29-Positioning bolt. Detailed Implementation

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] It should be noted that in the description of this invention, the terms "upper", "lower", "top", "bottom", "one side", "the other side", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not mean that the device or element must have a specific orientation, or be constructed and operated in a specific orientation.

[0025] See appendix Figures 1 to 5 This paper presents a specific structure of an auxiliary loading device for in-situ observation of the electroplastic effect proposed in this invention. The device includes an in-situ electrical pulse loading platform 1, a wire 3, a pulse power supply 4, a Hall current sensor 5, a data acquisition card 6, a computer 7, a probe 8, and a scanning electron microscope 9. The probe 8 is positioned to the right of the in-situ electrical pulse loading platform 1; the scanning electron microscope 9 is positioned above the in-situ electrical pulse loading platform 1, which is located on the stage of the scanning electron microscope 9; the in-situ electrical pulse loading platform 1 is connected to the positive and negative terminals of the pulse power supply 4 via two wires 3, and a sealing flange 2 is provided between the two wires 3 and the cavity wall of the scanning electron microscope 9. The external pulse power supply can provide a higher energy pulse current, making it easier to observe the electroplastic effect in real time under the scanning electron microscope 9. To introduce the pulse current into the cavity of the scanning electron microscope 9, the wires 3 need to pass through the sealing flange 2, which ensures the vacuum level inside the microscope; the wire connected to the positive terminal of the pulse power supply 4 is connected to the data acquisition card 6 via the Hall current sensor 5 and a wire; the data acquisition card 6 and the probe 8 are both connected to the computer 7 via wires. The AC pulse power supply 4 has high pulse power and a wide adjustable parameter range, enabling independent control of the pulse current loading. This is beneficial for obtaining stable Joule heating of the sample under different electrical parameters by adjusting the current density. The current data is acquired by the Hall current sensor 5, and the signal is converted by the data acquisition card 6 to obtain the current value passing through the sample. The peak current density is calculated by the cross-sectional area of ​​the sample.

[0026] like Figure 3-5As shown, the in-situ electrical pulse loading platform 1 includes a coupling 10, a reducer 11, a positive terminal 12, a lead screw 13, a heating mechanism 14, a slide rail 15, a base plate 16, a sensing assembly 17, a negative terminal 18, a clamp 20, an insulation assembly, a gearbox 22, a stepper motor 23, clamping bolts 24, and clamping nuts 25; the gearbox 22 is fixedly mounted on the rear end of the upper surface of the base plate 16; the stepper motor 23 is fixedly mounted on the outside of the gearbox 22; two lead screws 13 are provided. The components are symmetrically arranged on the left and right sides above the base plate 16, and connected to the output end of the stepper motor 23 via a gearbox 22, a reducer 11, and a coupling 10, respectively. Two slide rails 15 are provided, corresponding one-to-one with the lead screws 13 on the left and right sides of the upper surface of the base plate 16. The clamps 20 are arranged in pairs, with their ends slidably connected to the lead screws 13 and slide rails 15 on both sides via sliders. The sample 19 is horizontally clamped between a pair of clamps 20. The heating mechanism 14 is located in the middle area of ​​the upper surface of the base plate 16 and between the two clamps 20, corresponding to the sample 19. Through the thermal effect of the current, it provides a high-temperature environment for the sample 19, maintaining the temperature concentrated in the middle of the sample 19 at the observation position to prevent heat conduction from the heating stage to the electron microscope sample stage. The sensing component 17 is located on the front side of the upper surface of the base plate 16 and corresponds to one clamp 20. The positive terminal 12 is fixed to the upper end face of one clamp 20 via clamping bolts 24 and clamping nuts 25. The negative terminal... The terminal 18 is fixed to the upper end face of the clamp 20 on the other side by clamping bolts 24 and clamping nuts 25; the clamping bolts 24 contact the end of the sample 19 to apply clamping force, allowing the pulse current to pass through the clamping bolts 24 from the positive terminal 12 into the sample 19; the positive terminal 12 and the negative terminal 18 are respectively connected to the positive and negative terminals of the pulse power supply 4 by wires 3; the insulating component is disposed between the clamp 20 and the positive terminal 12, the negative terminal 18 and the sample 19.

[0027] In this embodiment, the sensing component 17 consists of a temperature sensor, a force sensor, and a displacement sensor. The temperature sensor measures the ambient temperature of the loaded sample in real time, which facilitates precise control of the temperature and the temperature generated by the electrical pulse. The sample loaded on the experimental platform is subjected to force and displacement. The force sensor and displacement sensor are located on the front clamp. During the loading experiment, these two sensors collect force signals and displacement signals respectively. The stress-strain curve is obtained by computer calculation, which is used to analyze the mechanical properties of the sample and is beneficial for quantitatively analyzing the effect of electroplastic effect on the material.

[0028] The insulating assembly includes an insulating cover plate 21, insulating bolts 26, and an insulating coating (not shown in the figure). The portion of the clamp 20 used to contact and hold the sample 19 is provided with an insulating coating to isolate the connection between the energized sample 19 and the clamp 20. The insulating cover plate 21 is fixed to the upper end face of the two clamps 20 by insulating bolts 26. The positive terminal 12 and the negative terminal 18 are respectively fixed above the insulating cover plates 21 on both sides by clamping bolts 24 and clamping nuts 25. The energized terminal contacts the insulating cover plate 21, and the insulating bolts 26 fix the insulating cover plate 21 to the clamp 20, which helps to reduce the energized part and prevent pulse current from interfering with the operation of the components.

[0029] In this embodiment, an EBSD support 27 can also be provided on the bottom surface of the base plate 16; the EBSD support 27 has an L-shaped plate structure; the base plate 16 is correspondingly provided on the upper end face of the EBSD support 27, and the two sides of the middle part are respectively fixedly connected to the EBSD support 27 by fixing buckles 28; the lower end face of the EBSD support 27 is fixed to the corresponding position of the stage by positioning bolts 29. In use, the in-situ electric pulse loading platform 1 is installed on the stage inside the scanning electron microscope 9. It can be placed flat or, when performing EBSD characterization, it can be placed at a 70° angle to the horizontal using the EBSD support 27. The electroplastic effect can be observed using the scanning electron microscope 9 and EBSD while loading in the electron microscope. The phenomenon of the electroplastic effect has always been an abstract concept and cannot be observed in real time. With this device, the real manifestation of the electroplastic effect on microstructures can be observed simultaneously and in real time under the scanning electron microscope 9 under the synergistic effect of pulse current and loading platform. This is something that other loading platforms cannot achieve. Simultaneously, the changes in grain boundary slip, dislocations, and metallic phases influenced by the electroplastic effect can be observed under a scanning electron microscope (SEM). Changes in microstructure and crystal recrystallization can be observed under EBSD. Furthermore, the generation and diffusion of edge cracks under in-situ electric pulse action and the morphological characteristics of the fracture surface can be observed.

[0030] During use, the heating mechanism 14 adapted to the in-situ electric pulse loading platform 1 enables isothermal loading of sample 19 at the same Joule temperature during electric pulse treatment. Simultaneous in-situ observation of current, stress, strain, temperature, and tissue changes allows for comparison of results from different treatments. This facilitates comparison of tissue property changes under different current densities and traditional isothermal heating with the same parameters, and helps quantitatively distinguish between pure electrothermal effects and electrothermal effects. The in-situ electric pulse loading platform 1 utilizes a stepper motor 23 and a lead screw 13 for precise loading, ensuring stable deformation of sample 19 under electric pulse action and guaranteeing that the tissue of sample 19 is uniformly and synchronously subjected to electric pulse and force. The loading process serves several purposes: Temperature is stably controlled using temperature, mechanical, and displacement sensors; stress and strain are recorded synchronously and in real-time during the electroplastic loading process; and the effect of the electroplastic effect is reflected in the microscopic images obtained from the scanning electron microscope (SEM) 9. The insulating coating of the fixture 20, the insulating cover plate 21, and the insulating bolts 26 isolate the energized sample 19 and the terminal block, enabling small-scale current loading and protecting the internal components of the SEM. The coordinated operation of the external power supply and the internal electric pulse loading platform, under in-situ real-time observation by the SEM 9, provides a direct view of the electroplastic effect of the pulsed current on the material's microstructure, thus optimizing the electroplastic processing technology.

[0031] The operation method of the present invention will be further illustrated below through specific examples:

[0032] The specific operation includes the following steps:

[0033] Sample preparation: Taking the tensile test of magnesium alloy AZ91D as an example, commercially available magnesium alloy AZ91D was selected and homogenized in a box furnace at 300℃ for 1 hour to ensure uniform microstructure. Then, the sample was cut using an EDM wire cutter according to the following dimensions: total length 30.7mm, width 8mm, thickness 1mm, transition radius 10mm, gauge length 10mm.

[0034] Metallographic sample preparation: After removing surface oil from the cut sample, wash it clean. Then, wet-polish with sandpaper at grits #180, #400, #800, #1500, #2000, #3000, and #5000. For each pass, rotate the sample 90° and polish in the same direction. Next, polish the sample to a mirror finish using SiO2 polishing paste with a W0.5 grit. For etching, two chemical etching agents are used: ① 4.2g picric acid, 10ml acetic acid, 70ml anhydrous ethanol, and 10ml water (this agent is highly corrosive; immerse the sample surface in the agent for 3-5 seconds); ② 1ml nitric acid, 1g oxalic acid, 1ml glacial acetic acid, and 150ml water (this agent is less corrosive than the first; rub the sample repeatedly with an anhydrous cotton ball soaked in the etching solution for about 15 seconds). After chemical treatment, immediately rinse with alcohol and dry thoroughly before observing under a microscope.

[0035] Sample loading: Preserve the prepared metallographic sample in alcohol to prevent oxidation. After removing the sample with tweezers and drying it with degreased cotton, place it on the fixture, ensuring the insulating coating of the fixture is intact. Tightly fix the insulating cover plate and insulating bolts to the fixture. Use highly conductive copper terminals, clamping bolts, and nuts. The clamping bolts press the sample firmly into the groove of the fixture, and the nuts secure the terminals to the cover plate, ensuring there are no gaps between the clamping bolts and the sample to prevent short circuits and arcing damage to components after the pulse current is applied. It is essential to ensure both conductive path formation and proper insulation. Then, connect the positive and negative wires of the pulse power supply to the positive and negative terminals on the insulating cover plate and tighten them. Install the current measuring coil between the positive terminal and the positive terminal of the power supply. Install the in-situ electrical pulse loading platform at the designated position on the stage of the scanning electron microscope. If EBSD characterization is to be performed, the electrical pulse loading platform needs to be mounted on the EBSD holder at a 70° angle to the horizontal for imaging.

[0036] Pulse current processing: Set the pulse power supply type and electrical parameters, and set the loading type (tension, compression, shear, bending, fatigue loading, etc.), loading rate, and sample size in the computer system. At the same time, turn on the pulse power switch, loading system, mechanical signal and displacement signal acquisition system, and simultaneously use a scanning electron microscope to capture microscopic images of the sample during the electrical pulse processing.

[0037] Sample Heating: In isothermal comparison experiments, to eliminate Joule heating generated by pulsed current, a heating mechanism is used to provide the sample with a uniform temperature environment. The heating mechanism can be placed on the base plate of the in-situ electric pulse loading platform, and the heating temperature can be set. The heat generated by the heating furnace is concentrated through a reflective layer, focusing the heat on the center of the sample and preventing heat conduction to other components.

[0038] Data analysis: The processed stress-strain curves obtained from the loading system, mechanical signal and displacement signal acquisition system are analyzed in conjunction with images captured by scanning electron microscope during the electrical pulse processing.

[0039] All matters not covered in this invention are common knowledge.

[0040] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. An auxiliary loading device for in-situ observation of the electroplastic effect, characterized in that: The device includes an in-situ electrical pulse loading platform, wires, a pulse power supply, a Hall current sensor, a data acquisition card, a computer, a probe, and a scanning electron microscope. The probe is positioned on one side of the in-situ electrical pulse loading platform. The in-situ electrical pulse loading platform is mounted on the stage of the scanning electron microscope. The in-situ electrical pulse loading platform is connected to the positive and negative terminals of the pulse power supply via wires, and the wire connected to the positive terminal of the pulse power supply is connected to the data acquisition card via the Hall current sensor. Both the data acquisition card and the probe are connected to the computer. The in-situ electrical pulse loading platform includes a coupling, a reducer, a positive terminal, a lead screw, a heating mechanism, a slide rail, a base plate, a sensing component, a negative terminal, a clamp, an insulation component, a gearbox, a stepper motor, clamping bolts, and clamping nuts. The gearbox is located at one end of the upper surface of the base plate. The stepper motor is located outside the gearbox. The lead screws are symmetrically arranged on the left and right sides above the base plate and are connected to the output end of the stepper motor through the gearbox, reducer, and coupling, respectively. The slide rails are arranged on the left and right sides of the upper surface of the base plate, corresponding to the lead screws. The clamps are arranged in pairs, and the two ends of the clamps are slidably connected to the lead screws and slide rails on both sides via sliders; the sample is horizontally clamped between the pair of clamps; the heating mechanism is located in the middle area of ​​the upper surface of the base plate and between the two clamps; the sensing component is located on the front side of the upper surface of the base plate and corresponds to one of the clamps; the positive terminal and the negative terminal are fixed to the upper end face of the two clamps respectively by clamping bolts and clamping nuts and are respectively connected to the positive and negative terminals of the pulse power supply by wires; the insulation component is located between the clamps and the positive terminal, the negative terminal, and the sample.

2. The auxiliary loading device for in-situ observation of the electroplastic effect according to claim 1, characterized in that: The sensing component consists of a temperature sensor, a force sensor, and a displacement sensor.

3. The auxiliary loading device for in-situ observation of the electroplastic effect according to claim 1, characterized in that: The insulating assembly includes an insulating cover plate, insulating bolts, and an insulating coating; the portion of the clamp used to hold the sample is provided with an insulating coating; the insulating cover plate is fixed to the upper end face of the two clamps by insulating bolts; the positive terminal and the negative terminal are respectively fixed above the insulating cover plates on both sides by clamping bolts and clamping nuts.

4. The auxiliary loading device for in-situ observation of the electroplastic effect according to claim 1, characterized in that: The bottom surface of the base plate is provided with an EBSD bracket; the EBSD bracket has an L-shaped plate structure; the base plate is correspondingly set on the upper end face of the EBSD bracket, and the two sides of the middle part are respectively connected to the EBSD bracket by fixing buckles; the lower end face of the EBSD bracket is fixed to the corresponding position by positioning bolts.

5. The auxiliary loading device for in-situ observation of the electroplastic effect according to claim 1, characterized in that: A sealing flange is provided between the wire and the cavity wall of the scanning electron microscope. To introduce the pulse current into the interior of the scanning electron microscope, the wire needs to pass through the sealing flange to ensure the vacuum level inside the microscope.

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