Film forming apparatus and method of inspecting the same

Abstract

The present application relates to a film formation apparatus and an inspection method thereof, and provides a technology for detecting a leak from an atmosphere tank of a film formation apparatus with high precision. The film formation apparatus includes an atmosphere tank configured inside a vacuum chamber and having an inside maintained as an atmospheric environment, a first supply member that supplies helium to one of candidates for a leak site of an atmosphere leak inside the atmosphere tank at a plurality of sites of the atmosphere tank, a second supply member that supplies a gas different from the helium to a site of the plurality of sites that is not supplied with the helium, and a determination member that determines whether or not a leak of the helium is detected from the atmosphere tank supplied with the helium by the first supply member and supplied with the different gas by the second supply member.

Description

TECHNICAL FIELD

[0001] The present application relates to a film forming apparatus and an inspection method thereof. BACKGROUND

[0002] Flat panel display devices such as organic EL display devices and liquid crystal display devices are being used. For example, an organic EL display device includes an organic EL element of a multi-layer structure that has a functional layer having an organic material layer that generates light, i.e., a light emitting layer, formed between two opposing electrodes. The functional layer and the electrode layer of the organic EL element are formed by causing a film forming material to adhere to a substrate such as glass by passing through a mask while being inside a chamber of a film forming apparatus. If impurities exist in the chamber space at the time of film formation, the likelihood of film formation failure increases, and it can be possible that a panel failure occurs. Therefore, the inside of the chamber of the film forming apparatus is evacuated to a vacuum at the time of film formation.

[0003] Inside such a chamber, a structure called an atmospheric tank that has an internal space maintained as an atmospheric environment is sometimes provided. The internal space of the atmospheric tank communicates with the outside of the chamber. A signal line, a pipe, or the like is provided between the atmospheric tank and the outside of the chamber for exchange of information and substances. The atmospheric tank, which has an internal atmospheric environment, and the chamber space, which needs to be evacuated to a vacuum, are separated in a manner that maintains airtightness.

[0004] As an example of a device that utilizes an atmospheric tank, there is a tandem type film forming apparatus. The tandem type film forming apparatus is an apparatus in which a plurality of chambers are vacuum-connected from the beginning to the end and film formation is performed while a substrate is moved between the chambers. By providing a plurality of film forming chambers in the tandem type film forming apparatus, film formation is sequentially performed on a substrate, and an organic EL element of a multi-layer structure can be produced. A transport roller for moving the substrate is provided inside the chamber of the tandem type film forming apparatus. Also, a driving mechanism such as a motor for driving the transport roller is housed in an atmospheric tank inside the chamber. The driving mechanism receives power and control signals from the outside of the chamber via a signal line and transmits power to the transport roller via a shaft that is inserted into a hole provided in the atmospheric tank.

[0005] In order to maintain airtightness between the atmospheric tank and the chamber, the shaft insertion hole is sealed with a sealing member or grease, but there are cases in which leakage occurs due to aging changes or the like and the airtightness is reduced. This leakage can reduce the degree of vacuum inside the chamber at the time of film formation and cause film formation failure. Therefore, at the time of maintenance of the device, it is necessary to detect whether or not leakage has occurred from the hole provided in the atmospheric tank.

[0006] If the opening that becomes a candidate for a leakage occurrence site in the atmospheric tank (for example, a hole through which a shaft is inserted) is one, leakage can be detected using an existing device such as a helium probe. However, when there are a plurality of openings in the atmospheric tank, even if it is possible to detect that leakage has occurred from the atmospheric tank, it is difficult to detect from which opening leakage has occurred.

[0007] In Patent Literature 1 (Japanese Patent Application Publication No. 2019-512158), when detecting a leak using a helium detector, in a case where there are a plurality of candidates for a leak generation site, helium is selectively supplied to one of the plurality of sites. Thereby, it is possible to check the candidates for the leak generation site one by one.

[0008] PRIOR ART

[0009] PATENT LITERATURE

[0010] Patent Literature 1: Japanese Patent Application Publication No. 2019-512158 SUMMARY

[0011] PROBLEMS TO BE SOLVED BY THE INVENTION

[0012] However, in Patent Literature 1, even if helium is selectively supplied to a certain leak generation candidate site, since helium diffuses as time passes, helium can leak from other leak generation candidate sites. As a result, it can be impossible to know the site of the leak generation.

[0013] The present application has been made in view of the above problem, and an object thereof is to provide a technology of detecting a leak from an atmosphere tank of a film formation device with high accuracy.

[0014] MEANS FOR SOLVING THE PROBLEM

[0015] The present application adopts the following structure. That is, a film formation device characterized by comprising:

[0016] an atmosphere tank configured inside a vacuum chamber and having an inside maintained as an atmospheric environment;

[0017] a first supply member that supplies helium to one of candidates for a leak site of an atmospheric leak inside the atmosphere tank, the candidates being located at a plurality of sites of the atmosphere tank;

[0018] a second supply member that supplies a gas different from helium to a site of the plurality of sites that is not supplied with helium; and

[0019] a determination member that determines whether or not a leak of helium is detected from the atmosphere tank that is supplied with helium by the first supply member and is supplied with the different gas by the second supply member.

[0020] Further, the present application adopts the following structure. That is, a film formation device inspection method characterized by comprising:

[0021] a first supplying step of supplying helium gas to one of candidates of a leakage site of an atmosphere leakage of an inside of the atmospheric chamber located at a plurality of sites of the atmospheric chamber, the atmospheric chamber being arranged in a vacuum chamber and the inside being maintained as an atmospheric environment;

[0022] a second supplying step of supplying a gas different from the helium gas to a site of the plurality of sites which is not supplied with the helium gas; and

[0023] a determining step of determining whether or not the leaked helium gas is detected from the atmospheric chamber supplied with the helium gas by the first supplying step and supplied with the different gas by the second supplying step.

[0024] Inventive Effects

[0025] According to the present application, it is possible to provide a technique of detecting a leakage from an atmospheric chamber of a film forming apparatus with high precision. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a schematic plan view showing a structure of a film forming apparatus.

[0027] Figure 2 is a view explaining support of a substrate by a substrate stage.

[0028] Figure 3 is a view explaining mounting of a substrate stage and a mask.

[0029] Figure 4 is a schematic sectional view showing a structure of a chamber having a rotary stage.

[0030] Figure 5 is a schematic plan view showing a structure of a chamber having a rotary stage.

[0031] Figure 6 is a schematic plan view showing a structure of a chamber after rotation of a rotary stage.

[0032] Figure 7 is a graph explaining control of a rotation speed of a rotary stage.

[0033] Figure 8 is a view explaining movement and rotation between chambers of a transport body.

[0034] Figure 9 is a sectional view explaining carrying-in and carrying-out of a substrate stage and a mask.

[0035] Figure 10 is a subsequent view of the sectional view explaining carrying-in and carrying-out of a substrate stage and a mask.

[0036] Figure 11is a subsequent view illustrating a cross section of substrate stage and mask transfer-in and transfer-out.

[0037] Figure 12 is a cross-sectional view showing the internal structure of the atmosphere tank.

[0038] Figure 13 is a schematic cross-sectional view showing the configuration of the helium detector.

[0039] Figure 14 is a view illustrating steps of the helium detector-based leak detection.

[0040] Figure 15 is a subsequent view illustrating steps of the helium detector-based leak detection.

[0041] Figure 16 is a schematic cross-sectional view showing another configuration of the helium detector.

[0042] Figure 17 is another view illustrating steps of the helium detector-based leak detection.

[0043] Figure 18 is a schematic cross-sectional view showing another configuration of the helium detector.

[0044] Figure 19 is another view illustrating steps of the helium detector-based leak detection.

[0045] Figure 20 is a view illustrating the structure of the electronic device.

[0046] BRIEF DESCRIPTION OF DRAWINGS

[0047] 201: atmosphere tank, 250: pipe, 275: insertion hole, 500: film formation apparatus, 531: stage separation chamber, 550: control unit. DETAILED DESCRIPTION

[0048] Hereinafter, embodiments of the present application will be described in detail. However, the following embodiments are merely illustrative of preferred structures of the present application, and the scope of the present application is not limited to these structures. In addition, as for the hardware structure and software structure of the apparatus, the processing flow, the manufacturing conditions, the dimensions, the materials, the shapes, and the like in the following description, as long as there is no specific description, the scope of the present application is not intended to be limited only to these.

[0049] The present application is preferably used when detecting a leak of an atmosphere tank arranged in a vacuum chamber in a film formation device that forms a thin film of a film formation material on a surface of a film formation object such as a substrate by evaporation or sputtering. The present application can be grasped as a film formation device, an inspection device for a film formation device, or an inspection method for a film formation device. In addition, the present application can be grasped as a manufacturing device for an electronic device and a control method thereof, a manufacturing method for an electronic device. In addition, the present application can be grasped as a program that causes a computer to execute an inspection method or a control method, or a storage medium that stores the program. The storage medium can be a non-transitory storage medium that can be read by a computer.

[0050] The present application can be appropriately applied to a film formation device that forms a thin film of a desired pattern on a surface of a substrate as a film formation object via a mask. As a material of the substrate, any material such as glass, resin, metal, silicon, or the like can be used. As a film formation material, any material such as an organic material, an inorganic material (metal, metal oxide), or the like can be used. In addition, "substrate" in the following description includes a substrate on a surface of which film formation has been performed one or more times. Typically, the technology of the present application is applied to a manufacturing device for an electronic device or an optical member. In particular, the present application is applicable to an organic EL display that includes an organic EL element, an organic EL display device that uses the organic EL display, or the like. In addition, the present application can be used for a thin film solar cell or an organic CMOS image sensor. However, the application object of the present application is not limited to this, and the present application can be widely used for a device in which an atmosphere tank is arranged in a vacuum chamber.

[0051] [Device structure]

[0052] (Film formation device)

[0053] Figure 1 is a schematic plan view that shows a structure of a serial type film formation device 500 of the embodiment that manufactures an organic EL display. Generally, an organic EL display is manufactured through a circuit element formation process that forms a circuit element, an organic light emitting element formation process that forms an organic light emitting element on a substrate, and a sealing process that forms a protective layer on the formed organic light emitting layer. The film formation device 500 of the embodiment mainly performs the organic light emitting element formation process.

[0054] The film formation apparatus 500 has each chamber of a substrate carrying-in chamber 501, a stage carrying-in chamber 502, a merging chamber 503, a passage chamber 504, a reversing chamber 505, a mask assembly chamber 510, an alignment chamber 511, a buffer chamber 512, a film formation chamber 520, a buffer chamber 521, a rotation chamber 522, a buffer chamber 523, a rotation chamber 524, a buffer chamber 525, a film formation chamber 526, a buffer chamber 530, a stage separation chamber 531, a stage separation chamber 532, a mask carrying-out chamber 533, a mask carrying-in chamber 534, a mask handover chamber 535, a reversing chamber 540, a passage chamber 541, a substrate separation chamber 542, a stage handover chamber 543, a stage carrying-out chamber 544, and a substrate carrying-out chamber 545.

[0055] Each chamber is configured as a vacuum chamber. In addition, in order to make the precision of film formation good, it is preferable that the plurality of chambers of the film formation apparatus be vacuumly connected from the beginning to the end, and the substrate be moved between the chambers which are evacuated to be vacuum. Further, the vacuum in the embodiment means a state in which a space is filled with a gas having a pressure lower than that of the ordinary atmosphere (1013 hPa).

[0056] In each buffer chamber 512, 521, 523, 525, 530, travel adjustment and speed adjustment in a case where film formation is performed using a plurality of substrate stages C are performed. The mask handover chamber 535 can also have a function as a stocker which stores masks M in a case where a plurality of masks M is used, and a function of speed adjustment of the masks M. Thereby, it is possible to select a mask M corresponding to desired film formation. The stage handover chamber 543 can also have a function as a stocker which stores substrate stages C in a case where a plurality of substrate stages C is used, and a function of speed adjustment of the substrate stages C. By the above speed adjustment, it is possible to transport the substrate stages C at predetermined intervals.

[0057] In addition, the film formation apparatus 500 has a transport member (described later) which transports the substrate stage C. The substrate stage C is transported along a predetermined transport path inside each vacuum chamber possessed by the film formation apparatus 500. That is, as shown by solid arrows, the substrate stage C is carried in from the stage carrying-in chamber 502, and merged with the substrate S in the merging chamber 503. In the merging chamber 503, the substrate stage C becomes in a state in which a substrate holding surface thereof faces upward in the vertical direction. The substrate S is mounted to the substrate stage C in a state in which a film formation surface thereof faces upward in the vertical direction.

[0058] Next, the substrate stage C holding the substrate S passes through the passage chamber 504 and is reversed upside down in the reversing chamber 505. A reversing mechanism which reverses the orientation of the substrate holding surface of the substrate stage C upside down in the vertical direction is provided in the reversing chamber 505. As the reversing mechanism, a known mechanism which changes the posture (orientation) by gripping the substrate stage C or the like can be employed. In the reversing chamber 505, the substrate stage C is reversed together with the substrate S, and becomes in a state in which a film formation surface of the substrate S faces downward in the vertical direction.

[0059] The substrate stage C is merged with the mask M in the mask assembly chamber 510, and is aligned with the mask M in the alignment chamber 511. An alignment device is provided in the alignment chamber 511. The alignment device aligns the substrate stage C (and the substrate S held by the substrate stage C) with the mask M, and places the substrate stage C (substrate S) on the mask M.

[0060] Next, the substrate stage C holding the substrate S and aligned with the mask M passes through the buffer chamber 512, receives film formation on the substrate S in the film formation chambers 520 (520a to 520d), and is rotated by 90 degrees in the rotation chamber 522, passes through the buffer chamber 523, is rotated by 90 degrees in the rotation chamber 524, receives film formation on the substrate S in the film formation chambers 526 (526a to 526d), and passes through the buffer chamber 530. Evaporation sources (film formation members) that release evaporation materials toward the upper side in the vertical direction are provided in the film formation chambers 520 and 526. The substrate S held by the substrate stage C in a state where the film formation surface faces the lower side in the vertical direction is passed above the evaporation sources, whereby the film formation surface except for the portion covered by the mask M is formed.

[0061] Next, the mask M is separated during transport of the substrate stage C in the stage separation chamber 531 (first separation chamber) and the stage separation chamber 532 (second separation chamber). The process here will be described later. Next, the substrate stage C holding the substrate S is inverted up and down in the inversion chamber 540 and passes through the passage chamber 541, and the substrate S is separated in the substrate separation chamber 542. Next, the substrate stage C is carried out from the stage carry-out chamber 544 to the outside of the film formation apparatus, or is used again for film formation via the stage handover chamber 543.

[0062] As shown by the dotted arrows, the substrate S is carried in from the substrate carry-in chamber 501 and held by the substrate stage C in the merging chamber 503. Thereafter, after moving together with the substrate stage C, the substrate S is separated from the substrate stage C in the substrate separation chamber 542 and carried out from the substrate carry-out chamber 545 to the outside of the film formation apparatus.

[0063] In addition, the film formation apparatus 500 has a transport member (described later) that transports the mask M. As shown by the dashed arrows, the mask M is carried in from the mask carry-in chamber 534 and merged with the substrate stage C in the mask assembly chamber 510 via the stage separation chamber 532 and the mask handover chamber 535. Thereafter, after moving while placing the substrate stage C, the mask M is separated from the substrate stage C in the stage separation chamber 531 and carried out from the mask carry-out chamber 533 to the outside of the film formation apparatus, or is separated from the substrate stage C in the stage separation chamber 532 and used again for film formation via the mask handover chamber 535.

[0064] The control section 550 controls various actions of the film formation apparatus 500. The control section 550 transmits and receives information to and from each chamber structure, a conveyance member that conveys a conveyance body (a substrate, a substrate stage, a mask, etc.) via a control line or wireless communication that is not shown. As the control section 550, an information processing apparatus (for example, a computer, a processing circuit) having a processor, a memory, a communication member, etc. can be used. Further, the control section 550 can also be a control section in which a plurality of information processing apparatuses act in cooperation. For example, a control section can be provided for each chamber.

[0065] A plurality of conveyance rollers as conveyance members are arranged on both sides of the conveyance path in the conveyance direction, and the substrate stage C and the mask M are conveyed by rotating the conveyance rollers using a driving mechanism such as an AC servo motor as a driving member.

[0066] Further, the present application is not limited to the above-described upward deposition structure (a structure in which the film formation surface of the substrate S faces the lower side in the vertical direction at the time of film formation). It can also be a downward deposition structure (a structure in which the film formation surface of the substrate S faces the upper side in the vertical direction at the time of film formation), a side deposition structure (a structure in which the substrate S is vertically erected at the time of film formation).

[0067] (Substrate stage and substrate)

[0068] The structure of the substrate stage C and the holding of the substrate S will be described. Figure 2 (a) is a schematic plan view of the substrate stage C. The substrate stage C is a flat plate-shaped structure body that is substantially rectangular in plan view. Here, a plurality of stage conveyance rollers are arranged along both sides of a stage conveyance path in the film formation apparatus. When the substrate stage C is conveyed, two edges of the four edges of the substrate stage C that face each other in the conveyance direction are supported by the stage conveyance rollers. The substrate stage C is moved in the conveyance direction by rotating the stage conveyance rollers.

[0069] The substrate stage C has a stage panel 401 that is a rectangular flat plate-shaped member, a plurality of clamping members 402, and a plurality of support bodies 403. The substrate S is held so as to face a holding surface 405 of the stage panel 401 of the substrate stage C. For convenience, a broken line that corresponds to the outer edge of the substrate S when the substrate S is held is shown in the drawing. The area inside the broken line is also referred to as a substrate holding portion, and the area outside the broken line is referred to as a peripheral portion. The substrate holding portion and the peripheral portion are defined for convenience, and there can be no difference in structure between the two. The stage panel 401 is a plate-shaped member composed of a metal or the like, and has a certain degree of rigidity (at least higher rigidity than the substrate S). The stage panel 401 holds the substrate S by using the holding surface 405, thereby suppressing the deflection of the substrate S.

[0070] The chucking member 402 is a protrusion having a chucking surface that chucks the substrate S. The chucking surface is composed of a physically sticky chucking member (PSC), and holds the substrate S by physical adhesion or suction. The substrate S is held by the chucking surface of the chucking member 402, and is held by the holding surface 405 of the stage panel 401. The chucking member 402 is arranged so that the chucking surface protrudes from the holding surface 405 of the stage panel 401 by a predetermined distance.

[0071] The chucking member 402 is preferably arranged so as to correspond to the shape of the mask M, and more preferably so as to correspond to the boundary portion (part of the frame) of the mask M that divides the film-formed region of the substrate S. This makes it possible to suppress the influence of the temperature distribution of the film-formed region of the substrate S caused by contact between the chucking member 402 and the substrate S. In addition, the chucking member 402 is preferably arranged outside the active region of the display. This is because stress caused by suction of the chucking member 402 can deform the substrate S, or can affect the temperature distribution during film formation.

[0072] Figure 2 (b) is Figure 2 Fig. 7 is a cross-sectional view of (a) taken along the A-A line, showing the holding surface 405 facing upward. When the substrate stage C is inverted and placed on the mask M so that the holding surface 405 of the stage panel 401 that holds the substrate S faces downward, the support body 403 supports the substrate stage C with respect to the mask M. In addition, although the support body 403 is a protrusion that protrudes from the holding surface 405 of the stage panel 401, it can also be a structure in which the entire substrate S is in close contact with the mask M after inversion. In addition, the support body 403 can be a structure that supports the substrate stage C so that the substrate S held by the substrate stage C is separated from the mask M at least in the vicinity of the support body 403.

[0073] In addition, the mechanism by which the substrate stage C holds the substrate S is not limited to a chucking member, and can be any mechanism that can stably hold the substrate S during conveyance and inversion. For example, the substrate stage C can have a clamping mechanism that holds the substrate S. In addition, an electrostatic chuck that holds the substrate S using electrostatic force generated by voltage application to electrodes can be arranged inside the stage panel 401 or on the surface opposite the holding surface 405 of the stage panel 401.

[0074] Further, the substrate stage C can have a magnetic force generating member for attracting the mask M via the held substrate S by magnetic force. As the magnetic force generating member, a permanent magnet, an electromagnet, or a magnet plate provided with a permanent electromagnet can be used. In addition, in the case where the substrate stage C is provided with an electrostatic chuck, the electrostatic chuck can also attract the mask M in addition to the substrate S.

[0075] (Substrate stage and mask)

[0076] Figure 3 is a schematic cross-sectional view showing a case where the substrate S is mounted to the substrate stage C and the substrate stage C is inverted and placed to the mask M. Figure 3 (a) shows a case where the substrate S is supported by the substrate stage C with the holding surface 405 facing upward in the confluence chamber 503 or the like. The substrate S is lowered toward the holding surface 405 of the stage panel 401, and becomes a state held by the clamping member 402 as shown in Figure 3 (b).

[0077] Figure 3 (b) ~ Figure 3 (c) shows a case where the substrate stage C is inverted up and down together with the substrate S in the inversion chamber 505 or the like. Thereby, the holding surface 405 of the substrate stage C becomes to face downward. At this time, the substrate S is attached to the holding surface 405 from the bottom by the holding force of the clamping member 402, and becomes a state where the film formation surface faces downward. The substrate stage C in this state is carried into the mask assembly chamber 510, and moved to the upper side of the mask M.

[0078] After that, the substrate stage C holding the substrate S and the mask M are moved to the alignment chamber 511. The alignment device provided in the alignment chamber 511 places the substrate stage C on the mask M after aligning the substrate stage C and the mask M. Thereby, a state shown in Figure 3 (d) is obtained. Further, the substrate S can also be in close contact with the mask M. In addition, it can also be that at least a part of the substrate S is in close contact with the mask M.

[0079] A photographing member is provided in the alignment chamber 511, which photographs the substrate stage C from above the chamber top. The control section of the alignment device photographs the substrate alignment mark on the substrate and the mask alignment mark on the mask by the photographing member, and relatively moves the substrate stage C and the mask M in the XY plane in such a manner that the substrate alignment mark and the mask alignment mark become in a predetermined positional relationship. Then, at the time when the predetermined positional relationship is obtained, at least either one of the substrate stage C and the mask M is moved in the Z direction, and the substrate stage C is placed on the mask M. Then, the mask M in the state where the substrate stage C is placed as shown in Figure 3 (d) is moved within the film formation system by the mask conveying roller, and receives film formation.

[0080] Further, after the film formation is completed, when the substrate stage C is separated from the mask M in the stage separation chamber, it becomes again Figure 3 (c) the separated state. By moving the substrate transport roller to the lower side of the peripheral portion of the substrate stage C in this state, the substrate stage C and the mask M can be transported individually.

[0081] (Chamber including atmosphere tank)

[0082] Referring to Figure 4 , an example of the structure of a chamber including an atmosphere tank and a rotary stage will be described. Figure 4 is a cross-sectional view of the inside of the chamber of the stage separation chamber 531 (first separation chamber), showing a state in which the mask M on which the substrate stage C is placed is carried into the chamber.

[0083] The mask M in the chamber is supported at two opposite edges by the mask transport roller 210. The mask transport roller 210 is supported by a drive shaft portion 211. The drive shaft portion 211 is connected to a driving mechanism such as a motor housed in the inside of the atmosphere tank 201, and rotates the mask transport roller 210 by transmitting power from the motor. A seal portion 202 for air-tight holding to prevent leakage from the inside of the atmosphere tank to the inside of the chamber is provided between the drive shaft portion 211 and the atmosphere tank 201. As the seal portion, any mechanism such as a mechanical seal, a seal ring, or the like can be used.

[0084] A plurality of atmosphere tanks 201 are provided on a rotary stage 245 supported by a shaft 240. The rotary stage 245 and the shaft 240 are driven by a rotary drive portion 241 provided with a rotary mechanism such as a motor, and rotate about a rotation axis 244 in the XY plane. The shaft 240 and the chamber wall are sealed by a magnetic fluid seal or the like so as to maintain the vacuum in the inside of the chamber. The mask transport roller 210 connected to the atmosphere tank and the mask M supported by the mask transport roller 210 also rotate in the XY plane in conjunction with the rotation of the rotary drive portion 241. As the rotary stage 245, a conventional turntable or the like can be used. In addition, it is preferable that the rotary stage 245 be stably supported by a base 246 fixed in the chamber. In addition, it is preferable that a groove-shaped guide be provided in advance in the base 246, and the rotation operation be stabilized by combining with a protruding portion of the rotary stage 245.

[0085] A stage support portion 230, a stage drive shaft 232, a stage transport roller 220, a drive shaft 221 of the stage transport roller, and a drive portion 222 of the stage transport roller are also provided in the chamber. In addition, a stage Z drive portion 231 is provided on the upper side of the upper wall of the chamber.

[0086] The stage support 230 is connected to the stage Z drive 231 via the stage drive shaft 232. The substrate stage C is supported by engaging a protrusion of the stage support 230a with a groove on the outer periphery of the substrate stage C from the left side of the paper, and by engaging a protrusion of the stage support 230b with a groove on the outer periphery of the substrate stage C from the right side of the paper. After the stage support 230 supports the substrate stage C, the stage Z drive 231 moves the stage drive shaft 232 upward in the Z direction. As a result, the substrate stage C, supported by the stage support 230, moves upward in the Z direction and separates from the mask M. Alternatively, the stage support 230 and the stage drive shaft 232 can be integrated.

[0087] The stage transport roller 220 is connected to the drive unit 222 via a drive shaft 221 and is positioned slightly above the mask transport roller 210 in the Z direction. The drive unit 222 enables the stage transport roller 220 to move in the XY plane (in... Figure 4 The movement is in the Y direction. Specifically, the drive unit 222a moves the stage transport roller 220a in the positive direction of the Y direction, and the drive unit 222b moves the stage transport roller 220b in the negative direction of the Y direction. Thus, the stage transport rollers 220a and 220b move from a retracted position to a stage support position. The retracted position is a position where the distance between the stage transport rollers 220a and 220b in the Y direction is wider than the width of the substrate stage C, allowing the substrate stage C to move freely up and down. The stage support position is a position where the distance between the stage transport rollers 220a and 220b in the Y direction is the same as or wider than the width of the substrate stage C, providing support for the substrate stage C.

[0088] The mechanism by which the stage Z drive unit 231 moves the stage support unit 230 up and down, and the mechanism by which the stage conveyor roller drive unit 222 moves the stage conveyor roller 220 along the roller rotation axis (Y direction in the paper plane), can be any existing mechanism. For example, a device equipped with a guide, a ball screw and a rotary encoder, or a device equipped with a linear motor and a linear encoder can also be used.

[0089] By linking the stage Z drive unit 231 and drive unit 222, which have the above-described structure, the substrate stage C placed on the mask M can be lifted and transferred to the stage transport roller 220. As a result, the substrate stage C can be separated from the mask M and transported separately. Furthermore, while the mask M is rotating together with the rotary table 245, by removing the substrate stage C separated from the mask M, the mask M and the substrate stage C can be moved out in different directions.

[0090] In the atmosphere box 201, various lines, cables are connected from the outside of the chamber via the hollow portion of the shaft 240, the opening provided to the rotary table 245, and the inside of the transfer box 243. As the connected lines, for example, there are a power line to supply power from the outside of the chamber, a signal line to transmit and receive information inside and outside the chamber, a pipe to send a gas into the atmosphere box 201 from the outside of the chamber, and the like. Therefore, the inside of the atmosphere box 201 is maintained as an atmospheric environment as well as the outside of the chamber. In Figure 4 The pipe 250 is exemplified in the drawing. The cable is connected to a mechanism built in the atmosphere box 201. The kind of the built-in mechanism differs depending on the chamber in which the atmosphere box 201 is disposed. For example, in the case of a chamber in which a substrate stage is moved, a driving member connected to a stage conveying member (stage conveying roller) is built in. Further, in the case of a chamber in which a mask is moved, a driving member connected to a mask conveying member (mask conveying roller) is built in. Further, in the case of a film deposition chamber in which a film deposition source (evaporation source) is moved while film deposition is performed, a driving member connected to a film deposition source conveying member is built in.

[0091] Further, a camera or the like photographing member 252 can be provided on the top surface of the chamber. The control section 550 can analyze a photographed image photographed using the photographing member 252 and use it for conveying control of adjusting the speed and position of the conveying body. For example, the control section 550 can analyze an image obtained by photographing the rotated rotary table 245 using the photographing member 252 and determine whether the rotary table 245 is housed in a predetermined position. Thus, even if the conveying direction of the mask conveying roller 210 is shifted, it can be corrected to the correct direction.

[0092] Further, a probe 270 of a helium detector can be provided at a desired position in the chamber (upper partition in the illustrated example). The probe 270 is connected to a main body of the helium detector outside the chamber and sucks surrounding gas and conveys it to the main body for helium detection.

[0093] Figure 5 and Figure 6 is a plan view of the inside of the chamber viewed from above the stage separation chamber 531, showing a state in which the mask M and the substrate stage C are not carried in. As illustrated, on the rotary table 245, four atmosphere boxes 201 are provided in two rows each, a total of eight atmosphere boxes 201 are provided, and two mask conveying rollers 210 are supported by each of the atmosphere boxes 201. However, the number and arrangement of the atmosphere boxes are not limited to this. In Figure 5 In the drawing, the mask conveying rollers 210 are connected in the left-right direction on the paper. This is the direction in which the mask M is carried in from the buffer chamber 530 on the right side on the paper and carried out to the stage separation chamber 532 (second separation chamber) on the left side on the paper.

[0094] In Figure 5In this structure, a fixed conveyor roller 260 and a fixed driven roller 263 are arranged along the extension line of the mask conveyor roller 210 in a continuous direction (X direction in the paper plane). The fixed conveyor roller 260 receives power from the drive unit 262 of the fixed conveyor roller via the drive shaft 261 of the fixed conveyor roller and conveys the mask M in the X direction. The fixed driven roller 263 is a roller capable of supporting the mask M and rotates passively when the fixed conveyor roller 260 and the mask conveyor roller 210 convey the mask M. The positions of the fixed conveyor roller 260 and the fixed driven roller 263 within the cavity are fixed.

[0095] Figure 6 This is a top view showing the state after the rotary drive unit 241 rotates the rotary table 245 90 degrees in the XY plane with the rotation axis 244 as the center. Figure 6 In this configuration, mask conveying rollers 210 are connected vertically on the paper surface. This direction allows the mask M to be moved from the stage separation chamber 531 to the mask removal chamber 533 on the lower side of the paper surface. Figure 6 In this state, although the fixed conveyor roller 260 and the fixed driven roller 263 cannot be used for conveying the mask M, the stability of conveying the mask M will not be a problem because the vertical width of the cavity is narrower than the horizontal width. Furthermore, the placement and quantity of the fixed conveyor roller 260 and the fixed driven roller 263 can be appropriately determined based on the shape of the cavity, the size of the object being conveyed, and its strength. Alternatively, the fixed conveyor roller 260 and the fixed driven roller 263 may be omitted if not necessary.

[0096] In addition, the control unit 550 can make the rotary table 245 rotate at a constant speed, but it can also change the rotation speed according to the timing and state. Figure 7 This is a diagram illustrating an example of a method for controlling the rotational speed of the rotary table 245. The horizontal axis represents the angle when the rotary table 245 rotates 90 degrees, and the vertical axis represents the relative value of the rotational speed, with the fastest speed in the state of carrying the mask set to 100. Figure 7 In the example, the control unit 550 gradually accelerates the rotary table 245 from the start of rotation (0 degrees) to time t1, when the rotation is halfway through, rotates the rotary table 245 at a constant speed from time t1 to time t2, and decelerates the rotary table 245 from time t2 until the end of the rotation (90 degrees). By controlling with such a trapezoidal speed curve, the operation of the rotary table 245 can be smooth while maintaining the stability of the mask M, and the rotation can be completed as quickly as possible. Furthermore, the control curve is not limited to a trapezoid; control can be performed in the order of acceleration-fixed speed-deceleration. For example, an S-shaped control that slowly changes the speed at the start of acceleration or when transitioning to a fixed speed can also be used.

[0097] In addition, the control section 550 can change the rotation speed when the mask M, the substrate stage C, or the like is transported and when the mask M, the substrate stage C, or the like is not transported in the rotation control. In Figure 7 In the example, the control is performed in such a manner that the speed at the fixed speed is slower when the transport body is not placed (solid line) than when the transport body is placed (dotted line).

[0098] [Embodiment 1]

[0099] In this embodiment, the mounting, separation, carrying-in, and carrying-out of the substrate stage C and the mask M in each chamber in the film formation apparatus 500 are described with reference to the drawings. Thus, an application example of the rotation of the mask M in the chamber of the film formation apparatus 500 is described. Specifically, the actions in the mask assembly chamber 510 in which the substrate stage C and the mask M are combined, the rotation chambers 522 and 524 in which the mask M is rotated while the substrate stage C is placed, and the stage separation chambers 531 (first separation chamber) and 532 (second separation chamber) in which the substrate stage C can be separated from the mask M are described.

[0100] Figure 8 is a schematic view of the carrying-out, carrying-in, and rotation of the transport bodies (substrate stage C and mask M) in each of the above chambers. Table 1 is a table that describes the actions in each of the chambers shown in Figure 8 "up", "down", "left", and "right" in the following description are shown for the convenience of the illustrated example and do not limit the arrangement of the chambers, the orientation of the transport bodies, and the transport direction in the actual film formation apparatus. In addition, the transport bodies do not necessarily need to be rotated in each chamber, and the presence or absence of rotation can be appropriately determined depending on the structure of the apparatus, the connection state of the chambers.

[0101] Table 1

[0102]

[0103] (1) Mask Assembly Chamber 510

[0104] The substrate stage C is carried into the mask assembly chamber 510 from the left side, and the mask M is carried into the mask assembly chamber 510 from the lower side. The same rotary table as that of the stage separation chamber 531 is provided in the mask assembly chamber 510, and the orientation of the mask M is changed by 90 degrees by rotating the rotary table in the XY plane. The substrate stage C is transported to the right side by the stage transport roller, and the mask M is transported to the right side by the mask transport roller. In addition, in the structure of the embodiment, the substrate stage C is placed on the mask M in the alignment chamber 511, but the placement can be performed in the mask assembly chamber 510.

[0105] (2) Rotation Chambers 522 and 524

[0106] The mask M, on which the substrate stage C is placed, is moved from the left side into the rotation chamber 522. A rotating stage is also provided in the rotation chamber 522; by rotating the rotating stage, the orientation of the mask M and the substrate stage C changes by 90 degrees. The mask M, on which the substrate stage C is placed, is moved from the top into the rotation chamber 524. A rotating stage is also provided in the rotation chamber 524; by rotating the rotating stage, the orientation of the mask M and the substrate stage C changes by 90 degrees.

[0107] (3) Stage separation chamber 531 (first separation chamber)

[0108] The mask M, on which the substrate stage C is placed, is moved from the right side into the stage separation chamber 531. In the stage separation chamber 531, the substrate stage C is separated from the mask by the action of the stage Z drive unit 231 and supported on the stage transport roller 220.

[0109] (3-1)

[0110] In the stage separation chamber 531, the mask M can perform two operations. First, when the mask M is removed from the film forming apparatus 500 for reasons such as mask replacement, the rotary table 245 in the stage separation chamber 531 rotates, changing the orientation of the mask M by 90 degrees. Then, the mask conveyor roller 210... Figure 6 After achieving that continuous state in the Y direction, the mask M is moved downwards.

[0111] (3-2)

[0112] On the other hand, when the mask M is reused for the next film formation, the rotary table 245 is not rotated, and the mask conveyor roller 210 is as follows: Figure 5 In a continuous state in the X direction, the mask M is moved to the left. Furthermore, in either (3-1) or (3-2), the substrate stage C is moved to the left by the substrate transport roller. In the embodiment, the substrate stage C is necessarily separated in the stage separation chamber 531, but the present invention is not limited thereto. In the case of reusing the mask M as in (3-2), the substrate stage C can also be moved directly to the left while mounted on the mask M, and separated in the stage separation chamber 532.

[0113] (4) Stage separation chamber 532 (second separation chamber)

[0114] (4-1)

[0115] In the event of a mask change, the mask M is moved from the bottom into the stage separation chamber 532. Here, a rotary table is also provided in the stage separation chamber 532, and in the case of (4-1), the mask transport rollers are controlled to move continuously in the vertical direction. Therefore, the moved-in mask M is directly moved upwards without changing its orientation.

[0116] (4-2)

[0117] On the other hand, when mask M is reused, it is moved into the stage separation chamber 532 from the right side. In this case, the rotary table is controlled so that the mask transport rollers move continuously in the left-right direction. After the mask M is moved in, the rotary table is rotated 90 degrees. Then, the mask M is moved upward. Furthermore, in either case (4-1) or (4-2), the substrate stage C holding the film-formed substrate S is moved in from the right side and moved out from the left side. Therefore, in case (4-1), the mask M and the substrate stage C are transported while being supported on the mask transport rollers and stage transport rollers respectively in a separated state.

[0118] The mechanisms configured in each chamber can be appropriately determined based on Table 1 above. For example, the stage separation chamber 531 includes a mask transport roller, a Z-drive mechanism for lifting the substrate stage C from the mask M, a stage transport roller for supporting the lifted substrate stage C, and a rotation mechanism for changing the orientation of the mask transport roller. On the other hand, in the stage separation chamber 532 and the mask assembly chamber 510, only a mask transport roller, a stage transport roller, and a rotation mechanism are required. In addition, in the rotation chambers 522 and 524, only a mask transport roller and a rotation mechanism are required. Furthermore, the structure of each chamber can be determined based on the separation of the mask M from the substrate stage C, the presence or absence of placement, and the necessity of rotation determined by the direction of movement of the transport body.

[0119] (specific example)

[0120] Next, refer to Figures 9-11 The cross-sectional view of the chamber illustrates a specific example of the rotation and transport of the mask M. Here, the example of mask replacement occurring in the stage separation chamber 531 as described in (3-1) above will be used for explanation. In each figure, reference numerals or descriptions are omitted for components that are not required in the explanation.

[0121] Figure 9 (a) illustrates the process of conveying the mask M and the substrate stage C placed on the mask M into the stage separation chamber 531. At this time, the power transmitted from the electric motor located inside the atmospheric chamber 201 via the drive shaft 211 causes the mask conveyor roller 210 to rotate. As a result, the mask M, whose ends are supported by the mask conveyor roller 210, moves to a predetermined position within the chamber.

[0122] Figure 9(b) shows a case where the substrate stage C is moved upward in the Z direction and is supported by the stage transport rollers 220. First, the protruding portions of the stage support portion 230 engage with the groove portions of the substrate stage C and support the substrate stage C. Then, the stage Z drive portion 231 lifts the stage support portion 230 via the stage drive shaft 232, whereby the substrate stage C is separated from the mask M and is raised. The stage Z drive portion 231 lifts the substrate stage C to a position higher than the setting height of the stage transport rollers 220. Next, the stage transport rollers 220a, 220b are moved from the retreat position to the support position by causing the stage transport rollers 220a, 220b to approach in the rotation axis direction of the rollers by means of the drive portions 222a, 222b of the stage transport rollers. Next, the stage Z drive portion 231 lowers the substrate stage C and places it on the stage transport rollers 220.

[0123] Figure 10 (a) shows a case where the substrate stage C is transported to the stage separation chamber 532. After the substrate support based on the stage support portion 230 is released, the drive portions 222 of the stage transport rollers transmit power to the stage transport rollers 220 via the drive shaft 231. Thereby, the stage transport rollers 220 rotate to carry out the substrate stage C.

[0124] Figure 10 (b) is a cross-sectional view taken at a position 90 degrees different from Figure 9 (a) ~ Figure 10 (a) is a cross-sectional view taken at a position 90 degrees different from

[0125] Figure 11 (a) shows a case where the mask M is carried out to the lower side. The mask transport rollers 210 are driven by means of the drive members inside the atmosphere tank, and the fixed transport rollers 260 are driven by means of the drive portions 262, whereby the mask M supported by the mask transport rollers 210, the fixed driven rollers 263, and the fixed transport rollers 260 are moved and carried out.

[0126] As described above, according to the structure of the embodiment, by providing a mechanism capable of rotation inside the chamber, it is possible to change the transport direction of the transport body such as a mask. As a result, for example, as in the embodiment, the carry-out destination of the mask from the stage separation chamber 531 is branched into the left side and the lower side, it is possible to flexibly set the path of the transport body.

[0127] [Embodiment 2]

[0128] In this embodiment, a method of detecting a leak from an atmosphere tank arranged inside a chamber with high precision is described.

[0129] Figure 12(a) is a cross-sectional view in the vertical direction of the atmosphere tank 201. The partition wall of the atmosphere tank 201 is provided with a number of (two in this embodiment) through-holes 275 corresponding to the mask transport roller 210. The drive shaft portion 211 is arranged in the through-hole 275, and the gap between the drive shaft portion 211 and the through-hole 275 is sealed by the seal portion 202. Inside the atmosphere tank 201, a pipe 250 is introduced from the outside of the chamber for each through-hole 275. The through-hole 275 is a through-hole for a member (in this case, the drive shaft portion) arranged to pass through from the inside of the atmosphere tank 201 to the outside, and corresponds to a candidate for the leakage site in this embodiment. However, the candidate for the leakage site is not limited to this.

[0130] Figure 12 (b) is a plan cross-sectional view of the atmosphere tank 201. The drive shaft portion is connected to the drive member 280 inside the atmosphere tank, and is connected to the mask transport roller 210 outside the atmosphere tank. The drive member 280 of this embodiment is a motor connected to the outside of the chamber via a power line and a signal line, not shown.

[0131] (Embodiment 2-1)

[0132] Figure 13 is a schematic cross-sectional view showing the chamber structure of the stage separation chamber 531 of Embodiment 2-1. For convenience, one of the eight atmosphere tanks 201 is focused on and shown enlarged. Two through-holes 275a, 275b are provided in the chamber. The candidates for the leakage sites from the atmosphere tank to the inside of the chamber are the above-mentioned through-holes 275a, 275b.

[0133] In the atmosphere tank 201, a pipe 250a, 250b is introduced from the main body of the helium detector 301 provided outside the chamber. The pipe 250a is introduced to the vicinity of the through-hole 275a, and is capable of sending out helium (He) from the helium detector 301. When the helium detector 301 is connected to the pipe 250a, a valve is installed at the end of the pipe 250a, and is connected to the helium gas bottle of the helium detector 301.

[0134] In addition, the pipe 250b is introduced to the vicinity of the through-hole 275b, and is capable of sending out a gas other than helium from the helium detector 301. The gas other than helium is a gas heavier than helium, and for example, air, nitrogen, carbon dioxide, oxygen, etc. can be used. In the case of using air, a valve is installed at the end of the pipe 250b, and is connected to a pump or the like for air sending. However, a gas lighter than helium (for example, hydrogen) is not contained in the gas sent out from the pipe 250b of this embodiment.

[0135] Further, in the present embodiment, a structure for sending helium gas to the detection target site is provided, but as long as the gas sent to the tube 250b corresponding to the other through hole 275b is heavier than the gas sent to the tube 250a corresponding to the detection target through hole 275a. Further, the tubes 250a, 250b can be fixed to the atmosphere tank 201 or can be provided at the time of the leak test. The tube 250a functions as a first supply member that supplies helium gas to one of the sites (through holes) that are candidates for the leak sites of the plurality of sites of the atmosphere tank 201. Further, the tube 250b functions as a second supply member that supplies a gas different from the helium gas to the site that is not supplied with the helium gas among the candidates for the leak sites.

[0136] As the helium detector 301 of the present embodiment, for example, an existing device that separates the stage chamber 531 as a vacuum chamber and performs a leak test based on the bell jar method can be used. The probe 270 is a detection member that collects the gas in the vicinity and sends the gas to the main body of the helium detector 301 via a tube. It is also preferable that the probe 270 has a suction function. The main body of the helium detector 301 analyzes the gas collected by the probe, detects and measures the helium gas in the gas, and thereby checks the presence or absence of a leak from the workpiece (in this case, the atmosphere tank) that is disposed inside the chamber and is filled with helium gas inside. The detection determination of the helium gas can be performed by the control section 550 based on the detection information of the helium detector 301, for example. In this case, the control section 550 functions as a determination member. Further, the helium detector 301 itself can perform the detection determination of the helium gas as the determination member.

[0137] Figure 14 is a diagram that explains a step for detecting a leak caused by insufficient sealing of the through hole of the atmosphere tank in the structure of the embodiment. The purpose of this step is to detect a leak from the through hole 275a. When the leak detection sequence is started and the gas is sent from each tube, inside the atmosphere tank 201, the end of the tube 250a is filled with helium gas and the end of the tube 250b is filled with the atmosphere. Since the helium gas is lighter than the atmosphere, it rapidly spreads inside the atmosphere tank (reference numeral 311). However, the atmosphere (reference numeral 312) that is heavier than the helium gas already exists in the vicinity of the through hole 275b. That is, since the helium gas is blocked by the atmosphere in the vicinity of the through hole 275b, the helium gas does not leak in the vicinity of the through hole 275b.

[0138] Figure 15 shows the situation inside the chamber in the case where a leak occurs from both the through hole 275a and the through hole 275b. The helium gas leaks from the through hole 275a (reference numeral 315), but although the atmosphere leaks from the through hole 275, the helium gas does not leak (reference numeral 316). Therefore, in the case where the helium detector 301 detects the helium gas, it is known that a leak has occurred in the through hole 275a.

[0139] Next, the gas cylinder is replaced so that air is sent out from the pipe 250a and helium is sent out from the pipe 250b, and after that, by performing the same inspection, it is also possible to detect the presence or absence of leakage from the insertion hole 275b.

[0140] (Example 2-2)

[0141] Figure 16 is a block diagram showing the structure of the helium detector 301 performing leakage detection by the pressurization integration method. As for the same parts as Figure 13 , the explanation is omitted. The entire atmosphere tank 201 is covered with the gas-tight covering portion 320. The probe 270 is disposed inside the covering portion 320.

[0142] Figure 17 shows a state in which leakage has occurred in both of the insertion holes 275a, 275b. Since the vicinity of the insertion hole 275b is blocked by air, in the case where leakage of helium is detected, it is known that the insertion hole 275a is the leakage site. Next, by performing the same inspection after replacing the gas introduced from the pipes 250a, 250b into the atmosphere tank, it is possible to perform leakage inspection of the other insertion hole 275b.

[0143] (Example 2-3)

[0144] Figure 18 is a block diagram showing the structure of the helium detector 301 performing leakage detection by the sniffing method. As for the same parts as Figure 13 , the explanation is omitted. In the vicinity of the candidates of the leakage sites of the atmosphere tank 201, the suction probes 279 (279a, 279b) are respectively disposed. The main body of the helium detector 301 analyzes the gas collected by each suction probe and detects the presence or absence of helium.

[0145] Figure 19 shows a state in which leakage has occurred in both of the insertion holes 275a, 275b. Since the vicinity of the insertion hole 275b is blocked by air heavier than helium, helium is detected only from the insertion hole 275a. Therefore, since it is possible to select each site from among the candidates of the plurality of leakage sites present in the atmosphere tank and to detect the presence or absence of leakage in detail, the accuracy of the leakage detection is improved.

[0146] Next, by performing the same inspection after replacing the gas introduced from the pipes 250a, 250b into the atmosphere tank, it is possible to perform leakage inspection of the other insertion hole 275b. Further, in the illustrated example, one suction probe 279 is disposed at each candidate of the leakage site. However, in the case of the structure of the present embodiment, it is also possible to dispose the suction probe 279 only at the insertion hole (here, the insertion hole 279a) that is the detection object.

[0147] In the structure of Embodiments 2-1 to 2-3, the number of leak candidate sites provided to the atmospheric tank is not limited to two. Also, a plurality of atmospheric tanks having leak candidate sites can be inspected at the same time. For example, two atmospheric tanks each having two insertion holes can be inspected at the same time. In this case, one tube is introduced in the vicinity of each of the four insertion holes, and four tubes are introduced in total, and helium is selectively supplied to the tube of any one site, and air is supplied to the tubes of the other sites. Further, the helium detector used in the present application has only to have the ability to supply helium and other gas to each opening of the atmospheric tank and to detect helium leaked from the atmospheric tank, and is not limited to the above example.

[0148] According to the structure shown in the embodiments, helium can be selectively supplied to a certain leak generation candidate site, and a gas heavier than helium can be supplied to the other leak generation candidate sites. As a result, even if the helium supplied to the site where the leak actually occurs diffuses with the passage of time, since the other leak generation candidate sites are blocked by air or the like, the site where the leak has occurred can be determined. Therefore, the leak from the atmospheric tank of the film formation apparatus can be detected with high precision.

[0149] <Method for manufacturing electronic device>

[0150] Next, an example of a method for manufacturing an electronic device using the film formation apparatus of the present embodiment will be described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device will be shown, and a method for manufacturing an organic EL display device will be exemplified. Here, as a film formation apparatus used in the film formation step of the method for manufacturing an electronic device described below, a film formation apparatus having no leak, which has been inspected by the inspection method described in the above embodiment, is used, and thus high-precision film formation can be performed.

[0151] First, an organic EL display device to be manufactured will be described. Figure 20 (a) is a general view showing an organic EL display device 700, Figure 20 (b) shows a cross-sectional structure of one pixel.

[0152] As Figure 20(a) is shown, a plurality of pixels 702 each having a plurality of light emitting elements are arranged in a matrix form in a display region 701 of the organic EL display device 700. Details will be described later, but the light emitting elements each have a configuration having an organic layer sandwiched by a pair of electrodes. Further, the pixel referred to herein means a minimum unit capable of performing display of a desired color in the display region 701. In the case of the organic EL display device of the present embodiment, the pixel 702 is constituted by a combination of a first light emitting element 702R, a second light emitting element 702G, and a third light emitting element 702B each emitting a different color. The pixel 702 is usually constituted by a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but can be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, as long as it is at least one color, and is not particularly limited.

[0153] Figure 20 (b) is Figure 20 (a) is a schematic view of a partial cross section at the B-B line. The pixel 702 is constituted by a plurality of light emitting elements each having a first electrode (anode) 704, a hole transporting layer 705, any one of light emitting layers 706R, 706G, 706B, an electron transporting layer 707, and a second electrode (cathode) 708 on a substrate 703. The hole transporting layer 705, the light emitting layers 706R, 706G, 706B, and the electron transporting layer 707 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 706R is an organic EL layer emitting red light, the light emitting layer 706G is an organic EL layer emitting green light, and the light emitting layer 706B is an organic EL layer emitting blue light. The light emitting layers 706R, 706G, 706B are formed in patterns corresponding to the light emitting elements (sometimes also referred to as organic EL elements) emitting red light, green light, and blue light, respectively.

[0154] Further, the first electrodes 704 are formed separately for each light emitting element. The hole transporting layer 705, the electron transporting layer 707, and the second electrode 708 can be formed commonly for the plurality of light emitting elements 702R, 702G, 702B, or can be formed for each light emitting element. Further, in order to prevent the first electrodes 704 and the second electrodes 708 from being short-circuited due to foreign matter, an insulating layer 709 is provided between the first electrodes 704. Further, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 710 for protecting the organic EL elements from the moisture and the oxygen is provided.

[0155] In Figure 20In (b), the hole-transport layer 705 and the electron-transport layer 707 are represented by one layer, but depending on the configuration of the organic EL display element, they can be formed by a plurality of layers including a hole-blocking layer and an electron-blocking layer. Further, a hole-injection layer having a band structure that enables smooth injection of holes from the first electrode 704 to the hole-transport layer 705 can be formed between the first electrode 704 and the hole-transport layer 705. Similarly, an electron-injection layer can be formed between the second electrode 708 and the electron-transport layer 707.

[0156] Next, an example of the manufacturing method of the organic EL display device will be described in detail.

[0157] First, a circuit (not shown) for driving the organic EL display device and a substrate (mother glass) 703 on which the first electrode 704 is formed are prepared.

[0158] An acrylic resin is formed on the substrate 703 on which the first electrode 704 is formed by spin coating, and the acrylic resin is patterned by photolithography to form an opening in the portion where the first electrode 704 is formed, and an insulating layer 709 is formed. The opening portion corresponds to the light-emitting region where the light-emitting element actually emits light.

[0159] The substrate 703 on which the insulating layer 709 is patterned is placed on a substrate stage provided with an adhesive member. The substrate 703 is held by the adhesive member. After being inverted and carried into the first organic material film forming device, the hole-transport layer 705 is formed as a common layer on the first electrode 704 of the display region. The hole-transport layer 705 is formed by vacuum evaporation. Since the hole-transport layer 705 is actually formed to a size larger than the display region 701, a high-precision mask is not required.

[0160] Next, the substrate 703 on which the hole-transport layer 705 is formed is carried into the second organic material film forming device. The substrate is aligned with a mask, and placed on the mask, and the red light-emitting layer 706R is formed in the portion of the substrate 703 where the red light-emitting element is formed.

[0161] Similarly to the formation of the light-emitting layer 706R, the green light-emitting layer 706G is formed by the third organic material film forming device, and the blue light-emitting layer 706B is formed by the fourth organic material film forming device. After the formation of the light-emitting layers 706R, 706G, and 706B is completed, the electron-transport layer 707 is formed on the entire display region 701 by the fifth film forming device. The electron-transport layer 707 is formed as a common layer on the three color light-emitting layers 706R, 706G, and 706B.

[0162] The substrate on which the electron transport layer 707 is formed is moved to a film formation apparatus for the second electrode 708.

[0163] After that, the film formation process for the substrate 703 is completed by moving to a plasma CVD apparatus and forming a protective layer 710. After being reversed, the substrate 703 is separated from the substrate stage by peeling the adhesive member from the substrate 703. After that, the organic EL display device 700 is completed by dicing.

[0164] From the time when the substrate 703 on which the insulating layer 709 is patterned is carried into the film formation apparatus to the time when the film formation of the protective layer 710 is completed, the light emitting layer composed of the organic EL material can be deteriorated by moisture and oxygen if exposed to an atmosphere containing moisture and oxygen. Therefore, in this embodiment, the carrying in and out of the substrate between the film formation apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

Claims

1. A film forming apparatus characterized by comprising: The film formation apparatus includes: an atmospheric chamber disposed inside a vacuum chamber and maintained at an atmospheric environment; a first supply member that supplies helium to one of a plurality of candidates for a leakage site of an atmospheric gas leakage from the inside of the atmospheric chamber to the outside through at least one of a plurality of through-holes of a member disposed at a plurality of sites of the atmospheric chamber and for passing through from the inside of the atmospheric chamber to the outside; a second supply member that supplies a gas heavier than helium to a site of the plurality of sites that is not supplied with helium; a detection member that detects helium leaked from the atmospheric chamber in a case where the inside of the atmospheric chamber is supplied with helium by the first supply member and supplied with a gas heavier than the helium by the second supply member, the detection member including a plurality of probes each of which is disposed at least one of the plurality of through-holes and a detector that detects helium from a gas collected by the plurality of probes; and a determination member that determines whether a leakage occurs in the through-hole corresponding to the site supplied with helium based on detection information of the detection member.

2. The film formation apparatus according to claim 1, wherein the atmospheric chamber has a drive member that drives a mechanism disposed inside the vacuum chamber.

3. The film formation apparatus according to claim 2, wherein the mechanism disposed inside the vacuum chamber includes at least one of a film formation source transport member that moves a film formation source for forming a thin film on a substrate, a stage transport member that transports a substrate stage that holds the substrate, and a mask transport member that transports a mask disposed between the substrate and the film formation source for forming the thin film.

4. An inspection method of a film forming apparatus, characterized by, An inspection method of the film formation apparatus includes: a first supply step of supplying helium to one of a plurality of candidates for a leakage site of an atmospheric gas leakage from the inside of an atmospheric chamber to the outside through at least one of a plurality of through-holes of a member disposed at a plurality of sites of the atmospheric chamber and for passing through from the inside of the atmospheric chamber to the outside, the atmospheric chamber being disposed inside a vacuum chamber and being maintained at an atmospheric environment; a second supply step of supplying a gas heavier than helium to a site of the plurality of sites that is not supplied with helium; a detection step of detecting helium leaked from the atmospheric chamber in a case where the inside of the atmospheric chamber is supplied with helium by the first supply step and supplied with a gas heavier than the helium by the second supply step, using a detection member that includes a plurality of probes each of which is disposed at least one of the plurality of through-holes and a detector that detects helium from a gas collected by the plurality of probes; and a determination step of determining whether a leakage occurs in the through-hole corresponding to the site supplied with helium based on detection information of the detection member. determination step of determining whether a leak occurs in the through-hole corresponding to a portion to which helium gas is supplied, based on detection information in the detection step, by detecting helium gas leaked from the atmosphere tank to which helium gas is supplied through the first supply step and to which a gas heavier than the helium gas is supplied through the second supply step.

5. A method for manufacturing an electronic device, characterized by comprising a film formation step of forming a film on a substrate using a film formation apparatus that has been inspected by the inspection method of the film formation apparatus according to claim 4.

5. A method for manufacturing an electronic device, characterized by comprising a film formation step of forming a film on a substrate using a film formation apparatus that has been inspected by the inspection method of the film formation apparatus according to claim 4.

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