A quality detection method for an in-built power micro-electrostatic device

Abstract

The present invention relates to a quality detection method for a micro-electrostatic device with a built-in power supply, which belongs to the field of air purification technology. An external power supply is connected in series with a built-in power supply of the micro-electrostatic device to form a power-on circuit; a detection element is connected in series with an ammeter, and the detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the current indication number in real time. If the current indication number is zero, it indicates that the dielectric material is not damaged. The present invention can quickly identify damaged dielectric materials that are invisible to the naked eye, thereby preventing defective products from entering the market. At the same time, it can identify and judge whether the electrode strip is exposed on the outside of the micro-electrostatic device, thereby avoiding the phenomenon of loose wrapping of the electrode strip. In addition, it can also quickly identify whether the dust collecting plate and the electrode strip are abnormally connected.

Description

Technical Field

[0001] The invention belongs to the technical field of air purification, and in particular relates to a quality detection method for a micro-electrostatic device with a built-in power supply. Background Art

[0002] The micro-electrostatic devices currently on the market use a strong electric field with dielectric materials as the carrier to purify the air. The principle is that the dielectric material wraps the electrode sheet to form a honeycomb-shaped hollow microporous channel, forming a strong electric field in the channel. The particles in the air are charged and attracted by the electric field and adsorbed in the honeycomb-shaped hollow microporous channel, so that the microorganisms attached to the particles are collected and killed in the strong electric field, such as CN202211260929.9, a micro-electrostatic purification device that is resistant to high humidity.

[0003] Micro-electrostatic devices have high requirements for production processes. If the production process is not appropriate or the workers operate improperly, it is easy to produce defective products. Problematic micro-electrostatic devices are mainly manifested by incomplete wrapping of dielectric materials, damage, curling, exposed electrode sheets, etc. Among them, dielectric material damage is divided into damage visible to the naked eye and damage not visible to the naked eye. Inspection workers manually identify damage visible to the naked eye, but damage not visible to the naked eye is difficult to be discovered by inspection workers. Micro-electrostatic devices with damaged dielectric materials will have low dust holding capacity, low purification efficiency, short maintenance cycle and safety problems during use, such as increased risk of sparks and short circuits, and even cause local arcing, temperature rise and melting. In addition, when the electrode strips and conductive materials are not reliably connected, or partially not connected, it is also difficult to distinguish with the naked eye.

[0004] Currently, there is no effective detection method on the market to identify dielectric material damage that is invisible to the naked eye, nor to detect the reliability of internal electrical connections. Summary of the Invention

[0005] In view of the various deficiencies in the prior art and in order to solve the above problems, a quality detection method for a micro-electrostatic device with a built-in power supply is proposed.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] In a first aspect, the present invention provides a quality detection method for a micro-electrostatic device with a built-in power supply, characterized by comprising:

[0008] S100, an external power supply is electrically connected to a built-in power supply of the micro-electrostatic device to form a power circuit;

[0009] S300. The detection element is connected in series with the ammeter, and the detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the current display value in real time. If the current display value is zero, it indicates that the dielectric material is not damaged. Otherwise, it indicates that the dielectric material is damaged.

[0010] The technical solution is further configured such that the micro-electrostatic device is located on a detection tooling, the detection tooling includes a side panel, a bottom panel and a conductive connector, the side panel is provided with a mounting hole for mounting the conductive connector, and the mounting hole is insulated from the conductive connector at its junction.

[0011] The present technical solution is further configured as follows: the base plate is provided with a first conductive layer, which is connected in series with the ammeter. If the current indication number is non-zero, sparks occur at the joints between the detection element and the micro-electrostatic device, or sparks occur at the joints between the base plate and the micro-electrostatic device, it indicates that the dielectric material is damaged. If the current indication number is zero, and no sparks occur at the joints between the base plate, the detection element and the micro-electrostatic device, it indicates that the dielectric material is not damaged.

[0012] The technical solution is further configured as follows: the detection tool further includes a back plate, the back plate is provided with a second conductive layer, and the second conductive layer is bonded to the first conductive layer.

[0013] The present technical solution is further configured such that the bottom plate is provided with a first elongated hole along its width direction, and the back plate is provided with a second elongated hole corresponding to the first elongated hole. The first elongated hole and the second elongated hole are fastened by fastening bolts, and the relative position of the back plate and the bottom plate can be adjusted by bolts.

[0014] The technical solution is further configured such that if the current indication number is non-zero, sparking occurs at the contact point between the base plate and the micro-electrostatic device, or sparking occurs at the contact point between the detection element and the micro-electrostatic device, indicating that the dielectric material is damaged;

[0015] If the current reading is non-zero, or sparks appear at the joint between the back plate and the micro-electrostatic device, it means that the electrode strip is not tightly wrapped;

[0016] If the current display is zero and there is no sparking phenomenon at the joints of the bottom plate, back plate, detection element and micro-electrostatic device, it means that the micro-electrostatic device is qualified.

[0017] The present technical solution is further configured as follows: in S300, the detection element is made of a conductive material, one end of the detection element is electrically connected to the input end of the ammeter, the output end of the ammeter is grounded, and the other end of the detection element is contacted with the upper surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device.

[0018] The technical solution is further configured such that one end of the detection element in contact with the upper surface of the micro-electrostatic device is configured as a brush-like structure.

[0019] In a second aspect, the present invention provides a quality detection method for a micro-electrostatic device with a built-in power supply, comprising:

[0020] S100, an external power supply is electrically connected to a built-in power supply of the micro-electrostatic device to form a power circuit;

[0021] S200: Move the test probe of the electrostatic field detector along the surface of the micro-electrostatic device. When the absolute value of the real-time induced voltage displayed by the electrostatic field detector is not less than the voltage threshold, it indicates that the dust collecting plate and the electrode strip of the micro-electrostatic device are properly connected. Otherwise, it indicates that the dust collecting plate and the electrode strip of the micro-electrostatic device are abnormally connected.

[0022] S300. The detection element is connected in series with the ammeter, and the detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the current display value in real time. If the current display value is zero, it indicates that the dielectric material is not damaged. Otherwise, it indicates that the dielectric material is damaged.

[0023] The technical solution is further configured such that, in S200, the moving route of the test probe of the electrostatic field detector on the surface of the micro-electrostatic device is an S-shaped curve, and the order of S200 and S300 can be interchanged.

[0024] The technical solution is further configured such that, in S200, the voltage threshold is determined by:

[0025] Before the micro-electrostatic device is packaged, the external power supply is used to charge the micro-electrostatic device. When the micro-electrostatic device is in a fully charged state, the induced voltage in the fully charged state is measured using an electrostatic field detector, and 0.5-1 times the induced voltage is used as the voltage threshold of the electrostatic field detector.

[0026] The beneficial effects of the present invention are:

[0027] 1. By moving the detection element along the surface of the micro-electrostatic device and observing the current display and whether sparking occurs, damaged dielectric materials that are invisible to the naked eye can be quickly identified to prevent defective products from entering the market.

[0028] 2. By observing whether there is sparking at the joint between the back plate and the micro-electrostatic device and the current display number, determine whether the electrode strip is exposed on the outside of the micro-electrostatic device to avoid the phenomenon of loose electrode strip wrapping.

[0029] 3. Use the test probe of the electrostatic field detector to move along the surface of the micro-static device. By observing the reading of the electrostatic field detector, you can quickly identify whether the dust collecting plate and the electrode strip are abnormally connected.

[0030] 4. The position of the back plate can be adjusted by cooperating with the first long hole, the second long hole and the fastening bolts to adapt to micro-electrostatic devices of different specifications.

[0031] 5. The second end of the ejector pin is designed to be tooth-shaped or needle-shaped to improve its contact stability with the electrode contact piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a flowchart of an embodiment of the present invention;

[0033] Figure 2 is a circuit diagram of the present invention;

[0034] Figure 3 It is a structural schematic diagram of the detection tooling in the present invention;

[0035] Figure 4 is a top view of the back plate of the present invention;

[0036] Figure 5 This is a schematic structural diagram of an embodiment of the spring ejector in the present invention;

[0037] Figure 6 1 is a schematic structural diagram of another embodiment of the spring ejector in the present invention;

[0038] Figure 7 It is a structural schematic diagram of an embodiment of the detection element of the present invention;

[0039] Figure 8 It is a structural schematic diagram of another embodiment of the detection element in the present invention;

[0040] Figure 9 It is a structural schematic diagram of another embodiment of the detection element in the present invention;

[0041] Figure 10 It is a schematic structural diagram of the micro-electrostatic device of the present invention;

[0042] Figure 11 It is a flow chart of another embodiment of the present invention.

[0043] In the accompanying drawings: 1-external power supply, 2-built-in power supply, 3-detection tooling, 4-side panel, 5-back panel, 6-bottom panel, 7-detection element, 8-first long hole, 9-mounting hole, 10-second long hole, 11-ammeter, 12-micro-electrostatic device, 13-housing, 14-filter layer, 15-electrode contact, 16-spring ejector, 17-housing, 18-spring, 19-ejector, 20-through hole, 21-insulating handle, 22-brush-like structure. DETAILED DESCRIPTION

[0044] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only reference to the directions of the drawings. Therefore, the directional words used are used to illustrate rather than limit the invention.

[0045] Example 1:

[0046] like Figure 1 、 Figure 2 As shown, a quality inspection method for a micro-electrostatic device with a built-in power supply comprises:

[0047] S100 , an external power supply 1 and a built-in power supply 2 of the micro-electrostatic device are connected in series to form a power-on circuit.

[0048] Specifically, the specific structure of the micro-static device with a built-in power supply can be referred to paragraphs 0089-0094 of the specification of CN202211260929.9, a micro-static purification device resistant to high humidity. The ammeter 11 can be a micro-ampere ammeter or a multimeter with an AC / DC micro-ampere current range.

[0049] It is worth noting that the external power supply 1 supplies power, and the built-in power supply 2 converts it into DC high voltage, which can be negative high voltage or positive high voltage. The micro-electrostatic device forms an electric field to adsorb charged particles and sterilize. In a DC circuit, the micro-electrostatic device is like a capacitor, capable of storing charge. After the external power supply 1 and the built-in power supply 2 form a power circuit, the external power supply 1 will charge the micro-electrostatic device. At the beginning of charging, the current in the micro-electrostatic device is generally tens of microamperes. As the charging time increases, the charging current gradually decreases until the current in the micro-electrostatic device drops to 0 microamperes. At this time, the micro-electrostatic module is in a fully charged state.

[0050] S300, the detection element 7 is connected in series with the ammeter 11, and the detection element 7 contacts the surface of the micro-electrostatic device 12 and moves along the surface of the micro-electrostatic device 12, and the reading of the ammeter 11 is detected in real time. If the reading of the ammeter 11 is zero, it means that the dielectric material is not damaged, otherwise it means that the dielectric material is damaged.

[0051] It is worth noting that if Figure 10As shown, the micro-electrostatic device 12 includes a housing 13, a built-in power supply 2, and a filter layer 14, wherein the built-in power supply 2 and the filter layer 14 are both located inside the housing 13. Furthermore, the housing 13 is provided with electrode contacts 15, which are connected to the built-in power supply 2, which is electrically connected to electrode strips located at the ends of the filter layer 14. Specifically, the detection element 7 contacts the surface of the filter layer 14 and moves along the surface of the filter layer 14.

[0052] like Figure 1 、 Figure 3 、 Figure 5 as well as Figure 11 As shown, in S100, the external power source 1 is connected to the electrode contact piece 15 through a conductive connector, so that the external power source 1 is electrically connected to the built-in power source 2 of the micro-electrostatic device to form a power circuit.

[0053] The present technical solution is further configured such that the micro-electrostatic device 12 is located on the detection tool 3 and is pushed along the surface of the detection tool 3 to facilitate connection between the conductive connector and the electrode contact 15. At the same time, the detection tool 3 is grounded.

[0054] The technical solution is further configured as follows: the detection tool 3 includes a side plate 4, and a mounting hole 9 for mounting the conductive connecting member is provided on the side plate 4, and the connection between the mounting hole 9 and the conductive connecting member is insulated.

[0055] Specifically, the side plate 4 can be made of an insulating material. Alternatively, the side plate 4 can be made of a conductive material, with only the connection between the mounting hole 9 and the conductive connector being insulated.

[0056] It is worth noting that a plurality of mounting holes 9 are provided to match the spacing of the electrode contacts 15. When the electrode contacts 15 are located on the same side of the micro-electrostatic device 12, the mounting holes 9 corresponding to the electrode contacts 15 can be selected to install the conductive connector. When the electrode contacts 15 are located on different sides of the micro-electrostatic device 12, the electrode contacts 15 on one side are connected to the conductive connector on the side panel 4, and the electrode contacts 15 on the other side can be connected to the external power supply 1 through other conductive elements. Alternatively, two side panels 4 are provided opposite to each other on the detection tooling 3, and the electrode contacts 15 on both sides are connected to the conductive connector on the corresponding side panels 4.

[0057] The present technical solution is further configured such that the detection tool 3 further includes a bottom plate 6, which is in contact with the lower surface of the micro-electrostatic device 12, that is, the micro-electrostatic device 12 is located on the bottom plate 6. The bottom plate 6 is provided with a first conductive layer, which is connected in series with the ammeter 11.

[0058] Specifically, the bottom plate 6 can be made of a conductive material. Alternatively, the bottom plate 6 can be made of an insulating material, with the first conductive layer only being provided at the portion where the bottom plate 6 and the side surface of the micro-electrostatic device 12 meet.

[0059] Specifically, if the reading of the ammeter 11 is non-zero, sparks occur at the joints between the detection element 7 and the micro-electrostatic device 12, or sparks occur at the joints between the base plate 6 and the micro-electrostatic device 12, it indicates that the dielectric material is damaged. If the current reading is zero, and no sparks occur at the joints between the base plate 6, the detection element 7 and the micro-electrostatic device 12, it indicates that the dielectric material is not damaged.

[0060] The present technical solution is further configured such that the detection tool 3 further includes a back plate 5 , the back plate 5 is in contact with the side surface of the micro-electrostatic device 12 , and the back plate 5 is provided with a second conductive layer, which is in contact with the first conductive layer.

[0061] Specifically, the back plate 5 can be made of a conductive material. Alternatively, the back plate 5 can be made of an insulating material, with a second conductive layer only provided where the back plate 5 and the side surface of the micro-electrostatic device 12 meet.

[0062] Specifically, if the ammeter 11 shows a non-zero reading, sparks occur at the joints between the base plate 6 and the micro-electrostatic device 12, or sparks occur at the joints between the detection element 7 and the micro-electrostatic device 12, it indicates that the dielectric material is damaged; if the ammeter 11 shows a non-zero reading, or sparks occur at the joints between the back plate 5 and the micro-electrostatic device 12, it indicates that the electrode strip is not tightly wrapped; if the ammeter 11 shows zero, and there is no sparking at the joints between the base plate 6, the back plate 5, the detection element 7 and the micro-electrostatic device 12, it indicates that the micro-electrostatic device is qualified.

[0063] The technical solution is further configured such that a first elongated hole 8 is provided on the bottom plate 6 along its width direction, and a second elongated hole 10 is provided on the back plate 5 corresponding to the first elongated hole 8, and the first elongated hole 8 and the second elongated hole 10 are fastened by fastening bolts.

[0064] It is worth noting that if Figure 4 As shown, the back plate 5 is L-shaped, with one side aligned with the side of the micro-electrostatic device 12 and the other side aligned with the bottom plate 6. The position of the back plate 5 can be adjusted to accommodate micro-electrostatic devices 12 of different specifications through the cooperation of the first and second elongated holes 8, 10, and the fastening bolts.

[0065] The present technical solution is further configured such that the conductive connector is a spring thimble 16, which includes a housing 17, a spring 18, and a thimble 19. A cavity is provided inside the housing 17, and the spring 18 is located in the cavity. A first end of the thimble 19 extends into the cavity and is connected to the spring 18, and a second end of the thimble 19 is located outside the cavity.

[0066] Specifically, the housing 17 is located inside the mounting hole 9 and fixed, the first end of the ejector pin 19 is connected to the external power supply 1, the second end of the ejector pin 19 is connected to the electrode contact 15, and the second end of the ejector pin 19 is configured as a tooth to improve the contact stability between the ejector pin 19 and the electrode contact 15. In other embodiments, such as Figure 6 As shown, the second end of the ejector pin 19 can also be configured to be needle-shaped.

[0067] like Figure 1 、 Figure 7 As shown, in S300, the detection element 7 is made of conductive material, one end of the detection element 7 is electrically connected to the input end of the ammeter 11, the output end of the ammeter 11 is grounded, and the other end of the detection element 7 is in contact with the upper surface of the micro-electrostatic device 12 and moves along the surface of the micro-electrostatic device 12.

[0068] The present technical solution is further configured such that, in S300 , if the reading of the ammeter 11 is non-zero or sparking occurs at the contact point between the detection element 7 and the micro-electrostatic device 12 , it indicates that the dielectric material is damaged.

[0069] It is worth noting that when the detection element 7 moves, if the detection element 7 contacts the damaged position of the dielectric material, the charge accumulated on the micro-electrostatic device 12 is quickly released. At this time, the external power supply 1 will continue to charge the micro-electrostatic device 12, and the ammeter 11 will show a corresponding non-zero reading. At the same time, sparks will occur on the detection element 7, accompanied by sounds.

[0070] The technical solution is further configured such that the length of the detection element 7 is the same as the width of the filter core layer 14 to improve detection accuracy.

[0071] The present technical solution is further configured such that the detection element 7 is provided with a through hole 20 and an insulating handle 21. The through hole 20 is electrically connected to the input terminal of the ammeter 11 via a wire, and the insulating handle 21 is convenient for holding. Specifically, the insulating handle 21 completely wraps around the top of the detection element 7. At the same time, a recess is provided on the insulating handle 21 to accommodate the through hole 20. In other embodiments, such as Figure 8 As shown, the insulating handle 21 does not completely cover the top of the detection element 7, so as to facilitate the setting of the through hole 20.

[0072] This technical solution is further configured as follows: Figure 9 As shown, the end of the detection element 7 that contacts the upper surface of the micro-electrostatic device 12 is set as a brush-like structure 22 to improve the contact stability between the detection element 7 and the upper surface of the micro-electrostatic device 12.

[0073] Example 2:

[0074] like Figure 11As shown, the same parts of this embodiment as those of the first embodiment are not repeated here, except that:

[0075] A quality inspection method for a micro-electrostatic device with a built-in power supply, comprising:

[0076] S100, an external power supply is electrically connected to a built-in power supply of the micro-electrostatic device to form a power circuit;

[0077] S200: Move the test probe of the electrostatic field detector along the surface of the micro-electrostatic device. When the absolute value of the real-time induced voltage displayed by the electrostatic field detector is not less than the voltage threshold, it indicates that the dust collecting plate and the electrode strip of the micro-electrostatic device are properly connected. Otherwise, it indicates that the dust collecting plate and the electrode strip of the micro-electrostatic device are abnormally connected.

[0078] S300. The detection element is connected in series with the ammeter, and the detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the current display value in real time. If the current display value is zero, it indicates that the dielectric material is not damaged. Otherwise, it indicates that the dielectric material is damaged.

[0079] This technical solution further provides that, in S200, the electrostatic field detector's test probe moves along an S-shaped curve across the surface of the micro-electrostatic device, avoiding missed detection points and improving detection accuracy. Due to the unique structure of the micro-electrostatic module, detection along this S-shaped curve encompasses all power-on conditions. Furthermore, the order of S200 and S300 can be reversed.

[0080] This technical solution is further configured such that, in S200, the voltage threshold is determined by:

[0081] Before packaging the micro-electrostatic device, the external power source is used to charge the micro-electrostatic device. When the micro-electrostatic device is at a fully charged voltage, an electrostatic field detector is used to measure the induced voltage in the fully charged state. 0.5-1 times the induced voltage is used as the voltage threshold of the electrostatic field detector, preferably 0.8 times. This is to quickly determine the quality of the micro-electrostatic device during production, as the micro-electrostatic device is already close to being fully charged. It is worth noting that other multiples can also be selected for detection and judgment.

[0082] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.

Claims

1. A quality detection method for a micro-electrostatic device with a built-in power supply, characterized in that: include: S100, an external power supply is electrically connected to a built-in power supply of the micro-electrostatic device to form a power circuit; S300, the detection element is connected in series with the ammeter, and the detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the current reading in real time. If the current reading is zero, it indicates that the dielectric material is not damaged. Otherwise, it indicates that the dielectric material is damaged. The micro-electrostatic device is located on the detection tooling, which includes a side panel, a bottom panel and a conductive connector. The side panel is provided with a mounting hole for installing the conductive connector, and the mounting hole is insulated from the conductive connector at the junction. The bottom panel is provided with a first conductive layer, which is connected in series with the ammeter. If the current indication number is non-zero, sparks occur at the joint between the detection element and the micro-electrostatic device, or sparks occur at the joint between the bottom panel and the micro-electrostatic device, it indicates that the dielectric material is damaged. If the current indication number is zero, and no sparks occur at the joints between the bottom panel, the detection element and the micro-electrostatic device, it indicates that the dielectric material is not damaged.

2. A quality detection method for a micro-electrostatic device with a built-in power supply according to claim 1, characterized in that: The detection tool further includes a back plate, the back plate is provided with a second conductive layer, and the second conductive layer is bonded to the first conductive layer.

3. A quality detection method for a micro-electrostatic device with a built-in power supply according to claim 2, characterized in that: The bottom plate is provided with a first elongated hole along its width direction, and the back plate is provided with a second elongated hole corresponding to the first elongated hole. The first elongated hole and the second elongated hole are fastened by fastening bolts, and the relative position of the back plate and the bottom plate can be adjusted by the bolts.

4. A quality detection method for a micro-electrostatic device with a built-in power supply according to claim 2, characterized in that: If the current reading is non-zero, sparks may appear at the joints between the base plate and the micro-electrostatic device, or at the joints between the detection element and the micro-electrostatic device, indicating that the dielectric material is damaged. If the current reading is non-zero, or sparks appear at the joint between the back plate and the micro-electrostatic device, it means that the electrode strip is not tightly wrapped; If the current reading is zero and there is no sparking at the joints between the bottom plate, back plate, detection element and micro-electrostatic device, it means that the micro-electrostatic device is qualified.

5. A quality detection method for a micro-electrostatic device with a built-in power supply according to any one of claims 1 to 4, characterized in that: In S300, the detection element is made of conductive material, one end of the detection element is electrically connected to the input end of the ammeter, the output end of the ammeter is grounded, and the other end of the detection element is contacted with the upper surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device.

6. A quality inspection method for a micro-electrostatic device with a built-in power supply according to claim 5, characterized in that: One end of the detection element in contact with the upper surface of the micro-electrostatic device is configured as a brush-like structure.

7. A quality inspection method for a micro-electrostatic device with a built-in power supply according to claim 1, characterized in that: include: S100, an external power supply is electrically connected to a built-in power supply of the micro-electrostatic device to form a power circuit; S200: Move the test probe of the electrostatic field detector along the surface of the micro-electrostatic device. When the absolute value of the real-time induced voltage displayed by the electrostatic field detector is not less than the voltage threshold, it indicates that the dust collecting plate and the electrode strip of the micro-electrostatic device are properly connected. Otherwise, it indicates that the dust collecting plate and the electrode strip of the micro-electrostatic device are abnormally connected. S300. The detection element is connected in series with the ammeter, and the detection element contacts the surface of the micro-electrostatic device and moves along the surface of the micro-electrostatic device to detect the current display value in real time. If the current display value is zero, it indicates that the dielectric material is not damaged. Otherwise, it indicates that the dielectric material is damaged.

8. A quality inspection method for a micro-electrostatic device with a built-in power supply according to claim 7, characterized in that: In S200 , the moving path of the test probe of the electrostatic field detector on the surface of the micro-electrostatic device is an S-shaped curve, and the order of S200 and S300 can be interchanged.

9. A quality inspection method for a micro-electrostatic device with a built-in power supply according to claim 7, characterized in that: In S200, the voltage threshold is determined by: Before the micro-electrostatic device is packaged, the external power supply is used to charge the micro-electrostatic device. When the micro-electrostatic device is in a fully charged state, the induced voltage in the fully charged state is measured using an electrostatic field detector, and 0.5-1 times the induced voltage is used as the voltage threshold of the electrostatic field detector.

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