Radiator

Abstract

A water-cooled radiator includes a radiator body, at least one water inlet heat dissipation structure, and at least one water outlet heat dissipation structure. The radiator body has a water inlet, a water outlet, and at least one delivery channel. The at least one delivery channel has a water inlet section and a water outlet section connected to each other. The water inlet section is connected to the water inlet. The water outlet section is connected to the water outlet. The water inlet heat dissipation structure is thermally coupled to the radiator body at the water inlet section. The water outlet heat dissipation structure is thermally coupled to the radiator body at the water outlet section. At least one water inlet heat dissipation structure includes a plurality of water inlet heat dissipation fin sections, and these water inlet heat dissipation fin sections maintain a first spacing. At least one water outlet heat dissipation structure includes a plurality of water outlet heat dissipation fin sections. These water outlet heat dissipation fin sections maintain a second spacing, which is different from the first spacing.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, in particular to a water cooling radiator. Background Art

[0002] With the development and advancement of technology, computers have gradually become an indispensable necessity in people's daily lives. To enable computers to meet diverse functional requirements, computer motherboards typically have multiple expansion slots for installing expansion cards, such as graphics cards, sound cards, and network cards, to enhance their functionality. When expansion cards operate, the current in the circuit generates heat due to the influence of impedance. If this heat cannot be effectively dissipated, it will accumulate in the electronic components within the expansion card, potentially damaging the components due to the increasing temperature.

[0003] To improve the heat dissipation efficiency of expansion cards, a heat sink is typically used to quickly dissipate the heat generated by the cards. However, current heat sinks are still insufficiently efficient for expansion cards. Therefore, further improving the heat dissipation efficiency of expansion cards has become a major design challenge. Summary of the Invention

[0004] The present invention provides a water cooling radiator to further improve the heat dissipation efficiency of a heat dissipation device for a function expansion card.

[0005] A water-cooling radiator disclosed in one embodiment of the present invention includes a first cavity, a second cavity, a connecting cavity, multiple first channel structures, multiple second channel structures, multiple water inlet and heat dissipation structures, and multiple water outlet and heat dissipation structures. The first cavity includes a first water inlet chamber and a first water outlet chamber that are not connected. The second cavity includes a second water inlet chamber and a second water outlet chamber that are not connected. The connecting cavity includes a connecting cavity. Portions of the first channel structures connect the first water inlet chamber and the second water inlet chamber, respectively, while another portion of the first channel structures connects the first water outlet chamber and the second water outlet chamber. Portions of the second channel structures connect the second water inlet chamber and the connecting cavity, respectively, while another portion of the second channel structures connects the second water outlet chamber and the connecting cavity. The water inlet and heat dissipation structures are thermally coupled to the first and second channel structures that connect the first and second water inlet chambers, respectively. The water outlet and heat dissipation structures are thermally coupled to the first and second channel structures that connect the first and second water outlet chambers, respectively. Among them, each water-entry heat dissipation structure includes multiple water-entry heat dissipation fin parts, and these water-entry heat dissipation fin parts maintain a first spacing. Each water-outlet heat dissipation structure includes multiple water-outlet heat dissipation fin parts, and these water-outlet heat dissipation fin parts maintain a second spacing, which is different from the first spacing.

[0006] In one embodiment of the present invention, the first distance is greater than the second distance.

[0007] In one embodiment of the present invention, the first spacing is 3.2 mm, and the second spacing is 2.5 mm.

[0008] In one embodiment of the present invention, the water-entering heat dissipation fins are connected and are wavy, and the first spacing is the distance between the crests of two adjacent water-entering heat dissipation fins.

[0009] In one embodiment of the present invention, the water outlet heat dissipation fins are connected and are wavy, and the second spacing is the distance between the crests of two adjacent water outlet heat dissipation fins.

[0010] In one embodiment of the present invention, a height of each of the first channel structures is smaller than a height of each of the second channel structures.

[0011] Another embodiment of the present invention discloses a water-cooled radiator comprising a radiator body, at least one water inlet heat dissipation structure and at least one water outlet heat dissipation structure. The radiator body has a water inlet, a water outlet and at least one delivery channel. At least one delivery channel has a water inlet section and a water outlet section connected to each other. The water inlet section is connected to the water inlet. The water outlet section is connected to the water outlet. The water inlet heat dissipation structure is thermally coupled to the radiator body at the water inlet section. The water outlet heat dissipation structure is thermally coupled to the radiator body at the water outlet section. Among them, at least one water inlet heat dissipation structure comprises a plurality of water inlet heat dissipation fin sections, and these water inlet heat dissipation fin sections maintain a first spacing. At least one water outlet heat dissipation structure comprises a plurality of water outlet heat dissipation fin sections. These water outlet heat dissipation fin sections maintain a second spacing, and the second spacing is different from the first spacing.

[0012] In one embodiment of the present invention, the first distance is greater than the second distance.

[0013] In one embodiment of the present invention, the first spacing is 3.2 mm, and the second spacing is 2.5 mm.

[0014] In one embodiment of the present invention, the water-entering heat dissipation fins are connected and are wavy, and the first spacing is the distance between the crests of two adjacent water-entering heat dissipation fins.

[0015] In one embodiment of the present invention, the water outlet heat dissipation fins are connected and are wavy, and the second spacing is the distance between the crests of the two adjacent water outlet heat dissipation fins.

[0016] In one embodiment of the present invention, the height of each of the first channel structures is smaller than the height of each of the second channel structures.

[0017] According to the above-described embodiment, the water-cooling radiator utilizes water-inlet and water-outlet heat dissipation structures with different spacings, such as a water-inlet heat dissipation structure with a spacing of 3.2 mm and a water-outlet heat dissipation structure with a spacing of 2.5 mm. This balance between airflow resistance and heat dissipation area is achieved. Specifically, if the spacings between the water-inlet and water-outlet heat dissipation structures of the water-cooling radiator are both 2.5 mm, the heat dissipation structures are too dense, resulting in high flow resistance, which reduces airflow and, in turn, poor heat exchange efficiency. Conversely, if the spacings between the water-inlet and water-outlet heat dissipation structures of the water-cooling radiator are both 3.2 mm, while the flow resistance is reduced, the total heat dissipation area of ​​the heat dissipation structures is reduced, similarly resulting in poor heat exchange efficiency. Therefore, a water-cooling radiator utilizing water-inlet and water-outlet heat dissipation structures with different spacings can achieve both low flow resistance and a high heat dissipation area.

[0018] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention, and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a perspective schematic diagram of a water-cooling radiator according to a first embodiment of the present invention;

[0020] Figure 2 for Figure 1 Schematic diagram of the decomposition;

[0021] Figure 3 for Figure 1 Schematic cross-sectional view of ;

[0022] Figure 4 for Figure 1 Another cross-sectional schematic diagram of .

[0023]

Explanation of symbols

[0024] 10: Water cooling radiator

[0025] 100: First cavity

[0026] 101: Partition

[0027] 110: First water entry chamber

[0028] 120: First water outlet chamber

[0029] 130: Water inlet

[0030] 140: Water outlet

[0031] 200: Second cavity

[0032] 201: Partition

[0033] 210: Second water entry chamber

[0034] 220: Second water outlet chamber

[0035] 300: Connecting cavity

[0036] 310: Connecting chamber

[0037] 400: First channel structure

[0038] 500: Second channel structure

[0039] 600: Water cooling structure

[0040] 610: Water cooling fins

[0041] 700: Water outlet heat dissipation structure

[0042] 710: Water outlet fins

[0043] 800: Water inlet connector

[0044] 900: Water outlet connector

[0045] D1: First spacing

[0046] D2: Second spacing

[0047] H1: First height

[0048] H2: Second height DETAILED DESCRIPTION

[0049] See also Figures 1 to 3 . Figure 1 FIG. 1 is a perspective schematic diagram of a water-cooling radiator 10 according to a first embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the decomposition. Figure 3 for Figure 1 Schematic cross-section diagram.

[0050] The radiator 10 of this embodiment is used, for example, to dissipate heat from expansion cards such as graphics cards, sound cards, and network cards. The radiator 10 comprises a first cavity 100, a second cavity 200, a connecting cavity 300, multiple first channel structures 400, multiple second channel structures 500, multiple water inlet and outlet heat dissipation structures 600, and multiple water outlet and heat dissipation structures 700. Furthermore, the radiator 10 may include a water inlet connector 800 and a water outlet connector 900.

[0051] The first chamber 100 has a first water inlet chamber 110, a first water outlet chamber 120, a water inlet 130, and a water outlet 140. The first water outlet chamber 120 is separated from the first water inlet chamber 110 by, for example, a partition 101 and is not directly connected. The water inlet 130 is connected to the first water inlet chamber 110, and the water outlet 140 is connected to the first water outlet chamber 120. The water inlet joint 800 is installed at the water inlet 130 of the first chamber 100, and the water outlet joint 900 is installed at the water outlet 140 of the first chamber 100. The second chamber 200 has a second water inlet chamber 210 and a second water outlet chamber 220, and the second water outlet chamber 220 is separated from the second water inlet chamber 210 by, for example, a partition 101 and is not directly connected. The connecting chamber 300 has a connecting chamber 310.

[0052] These first channel structures 400 are made of a thermally conductive material such as gold, silver, or copper, and are used to transport fluid. These first channel structures 400 connect the first chamber 100 and the second chamber 200. Portions of these first channel structures 400 communicate with the first water inlet chamber 110 and the second water inlet chamber 210, respectively. Other portions of these first channel structures 400 communicate with the first water outlet chamber 120 and the second water outlet chamber 220.

[0053] The plurality of second channel structures 500 are made of a thermally conductive material such as gold, silver, or copper, and are used to transport fluid. The second channel structures 500 connect the second chamber 200 and the third chamber. Portions of these second channel structures 500 connect the second water inlet chamber 210 and the communication chamber 310, respectively. Other portions of these second channel structures 500 connect the second water outlet chamber 220 and the communication chamber 310.

[0054] The multiple water-insertion heat dissipation structures 600 are made of a thermally conductive material, such as gold, silver, or copper. These water-insertion heat dissipation structures 600 are thermally coupled to the first channel structures 400 and the second channel structures 500, respectively, which are connected to the first water-insertion chamber 110 or the second water-insertion chamber 210. In this embodiment, the water-insertion heat dissipation structures 600 are secured to the first channel structures 400 and the second channel structures 500, for example, by welding, but this is not a limitation. In other embodiments, the water-insertion heat dissipation structures may alternatively be secured to the first channel structures and the second channel structures by other means, such as gluing, snapping, or screwing.

[0055] The multiple water outlet heat dissipation structures 700 are made of a thermally conductive material such as gold, silver, or copper. These water outlet heat dissipation structures 700 are thermally coupled to the first channel structures 400 and the second channel structures 500, respectively, which communicate with the first water outlet chamber 120 or the second water outlet chamber 220. In this embodiment, the water outlet heat dissipation structures 700 are secured to the first channel structures 400 and the second channel structures 500, for example, by welding, but this is not a limitation. In other embodiments, the water outlet heat dissipation structures may alternatively be secured to the first channel structures and the second channel structures by other means such as gluing, snapping, or screwing.

[0056] In this embodiment, each water-entry heat dissipation structure 600 is, for example, wavy and includes a plurality of water-entry heat dissipation fins 610. Each water-entry heat dissipation fin 610 has a U-shaped cross-section, for example. A first spacing D1 is maintained between the midsections of any two adjacent water-entry heat dissipation fins 610. In other words, the first spacing D1 is maintained between the crests of any two adjacent water-entry heat dissipation fins 610.

[0057] In this embodiment, each water outlet heat dissipation structure 700 is, for example, wavy in shape and includes a plurality of water outlet heat dissipation fins 710. The cross-sectional shape of each water outlet heat dissipation fin 710 is, for example, U-shaped. A first spacing D1 is maintained between the midsections of any two adjacent water outlet heat dissipation fins 710. In other words, the first spacing D1 is maintained at the crests of any two adjacent water outlet heat dissipation fins 710. The first spacing D1 is, for example, greater than the second spacing D2. For example, the first spacing D1 is, for example, 3.2 mm, and the second spacing D2 is, for example, 2.5 mm.

[0058] In this embodiment, the first distance D1 is greater than the second distance D2, but the present invention is not limited thereto. In other embodiments, the first distance may also be smaller than the second distance.

[0059] In this embodiment, the first spacing D1 is 3.2 mm, and the second spacing D2 is 2.5 mm, but the present invention is not limited thereto. In other embodiments, the first spacing may be 2.8 mm or 3.6 mm, and the second spacing may be 2.3 mm or 2.6 mm.

[0060] In this embodiment, the multiple inlet fins 610 are integrally connected, and the multiple outlet fins 710 are integrally connected, but this is not limiting. In other embodiments, the multiple inlet fins may be separated from one another or connected to one another through welding or other methods. Similarly, the multiple outlet fins may be separated from one another or connected to one another through welding or other methods.

[0061] In this embodiment, each water-inlet heat dissipation structure 600 is, for example, wavy, and the cross-sectional shape of each water-inlet heat dissipation fin portion 610 is, for example, U-shaped, but this is not limited to such. In other embodiments, the cross-sectional shape of each water-inlet heat dissipation fin portion is, for example, I-shaped, and these water-inlet heat dissipation fin portions are arranged side by side. Similarly, each water-outlet heat dissipation structure 700 is, for example, wavy, and the cross-sectional shape of each water-outlet heat dissipation fin portion 710 is, for example, U-shaped, but this is not limited to such. In other embodiments, the cross-sectional shape of each water-outlet heat dissipation fin portion is, for example, I-shaped, and these water-outlet heat dissipation fin portions are arranged side by side.

[0062] The radiator 10 of this embodiment utilizes water-inlet and water-outlet heat dissipation structures 600 and 700 with varying spacing, for example, a 3.2 mm spacing between the water-inlet and water-outlet heat dissipation structures 600 and 700 with a 2.5 mm spacing, to achieve a balance between airflow resistance and heat dissipation area. Specifically, if the spacing between the water-inlet and water-outlet heat dissipation structures of the radiator is both 2.5 mm, the heat dissipation structures are too dense, resulting in high flow resistance, reduced airflow, and consequently, poor heat exchange efficiency. Conversely, if the spacing between the water-inlet and water-outlet heat dissipation structures is both 3.2 mm, while the flow resistance is reduced, the total heat dissipation area of ​​the heat dissipation structures is reduced, similarly resulting in poor heat exchange efficiency. Therefore, a radiator 10 employing water-inlet and water-outlet heat dissipation structures 600 and 700 with varying spacing achieves the desired balance between low flow resistance and high heat dissipation area.

[0063] See also Figure 4 . Figure 4 for Figure 1 In this embodiment, the height of each first channel structure 400 is, for example, less than the height of each second channel structure 500, but the invention is not limited thereto. In other embodiments, the height of each first channel structure may also be, for example, greater than the height of each second channel structure.

[0064] In the above embodiment, the configuration consisting of a first cavity 100, a second cavity 200, a connecting cavity 300, multiple first channel structures 400, and multiple second channel structures 500 is merely one embodiment of the radiator body and is not intended to be limiting. In other embodiments, the number of cavities may be two, with only one first channel structure or one second channel structure. Furthermore, the number of both the first channel structure and the second channel structure may be single.

[0065] In more detail, the state of the radiator body of the water-cooled radiator 10 is not intended to limit the present invention, as long as the radiator body of the water-cooled radiator 10 has a water inlet 130, a water outlet 140 and at least one delivery channel. At least one delivery channel has a water inlet section and a water outlet section connected to each other. The water inlet section is connected to the water inlet 130. The water outlet section is connected to the water outlet 140. Furthermore, the water inlet heat dissipation structure 600 is thermally coupled to the radiator body at the water inlet section. The water outlet heat dissipation structure 700 is thermally coupled to the radiator body at the water outlet section. In addition, at least one water inlet heat dissipation structure 600 includes a plurality of water inlet heat dissipation fin sections 610. These water inlet heat dissipation fin sections 610 maintain a first spacing D1, and at least one water outlet heat dissipation structure 700 includes a plurality of water outlet heat dissipation fin sections 710, and these water outlet heat dissipation fin sections 710 maintain a second spacing D2, and the second spacing D2 is different from the first spacing D1.

[0066] In other words, the shape of the radiator body of the water-cooling radiator 10 can be changed according to actual needs. As long as it is equipped with the water inlet heat dissipation structure 600 and the water outlet heat dissipation structure 700 with different spacings, it falls within the scope of the present invention.

[0067] According to the above-described embodiment, the water-cooling radiator utilizes water-inlet and water-outlet heat dissipation structures with different spacings, such as a water-inlet heat dissipation structure with a spacing of 3.2 mm and a water-outlet heat dissipation structure with a spacing of 2.5 mm. This balance between airflow resistance and heat dissipation area is achieved. Specifically, if the spacings between the water-inlet and water-outlet heat dissipation structures of the water-cooling radiator are both 2.5 mm, the heat dissipation structures are too dense, resulting in high flow resistance, which reduces airflow and, in turn, poor heat exchange efficiency. Conversely, if the spacings between the water-inlet and water-outlet heat dissipation structures of the water-cooling radiator are both 3.2 mm, while the flow resistance is reduced, the total heat dissipation area of ​​the heat dissipation structures is reduced, similarly resulting in poor heat exchange efficiency. Therefore, a water-cooling radiator utilizing water-inlet and water-outlet heat dissipation structures with different spacings can achieve both low flow resistance and a high heat dissipation area.

[0068] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Anyone skilled in the art may make such modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope defined by the claims attached to this specification.

Claims

1. A water cooling radiator, characterized in that: Include: A first chamber having a first water inlet chamber and a first water outlet chamber which are not connected; A second chamber having a second water inlet chamber and a second water outlet chamber that are not connected; a communicating cavity having a communicating chamber; a plurality of first channel structures, the first channel structures connecting the first cavity and the second cavity, portions of the first channel structures respectively communicating with the first water inlet chamber and the second water inlet chamber, and another portion of the first channel structures communicating with the first water outlet chamber and the second water outlet chamber; a plurality of second channel structures, portions of the second channel structures respectively connecting the second water inlet chamber and the communication chamber, and another portion of the second channel structures connecting the second water outlet chamber and the communication chamber; A plurality of water inlet heat dissipation structures are respectively thermally coupled to the first channel structures and the second channel structures connected to the first water inlet chamber or the second water inlet chamber; as well as A plurality of water outlet heat dissipation structures are respectively thermally coupled to the first channel structures and the second channel structures connected to the first water outlet chamber or the second water outlet chamber; Each of the water-inlet heat dissipation structures includes a plurality of water-inlet heat dissipation fin portions, which maintain a first spacing; each of the water-outlet heat dissipation structures includes a plurality of water-outlet heat dissipation fin portions, which maintain a second spacing, which is different from the first spacing.

2. The water cooling radiator according to claim 1, characterized in that: The first distance is greater than the second distance.

3. The water cooling radiator according to claim 1, characterized in that: The first spacing is 3.2 mm, and the second spacing is 2.5 mm.

4. The water cooling radiator according to claim 1, wherein: The water-entering heat dissipation fins are connected and are wavy, and the first spacing is the distance between the wave crests of two adjacent water-entering heat dissipation fins.

5. The water cooling radiator according to claim 1, wherein: The water outlet heat dissipation fins are connected and are wavy, and the second spacing is the distance between the wave crests of two adjacent water outlet heat dissipation fins.

6. The water cooling radiator according to claim 1, wherein: The height of each of the first channel structures is smaller than the height of each of the second channel structures.

7. A water cooling radiator, characterized in that: Include: A radiator body having a water inlet, a water outlet, and at least one conveying channel, wherein the at least one conveying channel has a water inlet section and a water outlet section connected to each other, the water inlet section being connected to the water inlet, and the water outlet section being connected to the water outlet; At least one water-entry heat dissipation structure, thermally coupled to the radiator body at the water-entry section; and At least one water outlet heat dissipation structure, thermally coupled to the radiator body at the water outlet section; Among them, the at least one water-entering heat dissipation structure includes a plurality of water-entering heat dissipation fin parts, and the water-entering heat dissipation fin parts maintain a first spacing. The at least one water-outlet heat dissipation structure includes a plurality of water-outlet heat dissipation fin parts, and the water-outlet heat dissipation fin parts maintain a second spacing, which is different from the first spacing. The water-outlet heat dissipation structure is made of a material with thermal conductivity.

8. The water cooling radiator according to claim 7, characterized in that: The first distance is greater than the second distance.

9. The water cooling radiator according to claim 7, characterized in that: The first spacing is 3.2 mm, and the second spacing is 2.5 mm.

10. The water cooling radiator according to claim 7, wherein: The water-entering heat dissipation fins are connected and are wavy, and the first spacing is the distance between the wave crests of two adjacent water-entering heat dissipation fins.

11. The water cooling radiator according to claim 7, wherein: The water outlet heat dissipation fins are connected and are wavy, and the second spacing is the distance between the wave crests of two adjacent water outlet heat dissipation fins.

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