A method, apparatus, system, device and medium for thermal testing of a gateway controller

Abstract

The application discloses a kind of gateway controller's thermal test method, device, system, equipment and medium.The method comprises: obtaining at least one target heat source included in the gateway controller to be carried out thermal test and the heat-sensitive area matched with each target heat source respectively;According to each target heat source, each heat-sensitive area, the location of gateway controller outlet and the preset at least one thermocouple wiring rule, generate thermocouple wiring mode, so that user can configure thermocouple on each target heat source in gateway controller according to thermocouple wiring mode, obtain target gateway controller;After obtaining the real-time position information of the baffle cover of the baffle cover of the oven after placing the target gateway controller in the baffle cover, set the orientation of the high-temperature fan according to the real-time position information of the baffle cover, start the oven to carry out thermal test on the target gateway controller.Using the above technical scheme, the measurement error caused by external factors can be reduced, and the thermal test precision can be effectively improved.

Description

Technical Field

[0001] This invention relates to the field of thermal testing technology, and in particular to a thermal testing method, apparatus, system, device, and medium for a gateway controller. Background Technology

[0002] Vehicle gateway controllers typically contain several electronic components that generate significant heat, such as power chips, system-on-chip (SoC) chips, and Ethernet PHY (Port Physical Layer) chips. Although software simulations of the vehicle gateway controller are performed during the early product development stages, actual thermal testing is still required after PCB (Printed Circuit Board) fabrication to obtain the true heat generation status and verify the initial design and simulation results.

[0003] During the thermal testing of the gateway controller, the gateway controller needs to be placed in a pre-built test environment, and thermocouples are used to detect the heat of each heat-generating electronic component. However, the setup of the test environment and the configuration of the thermocouples may introduce measurement errors into the thermal testing of the gateway controller, resulting in test results that do not reflect the actual heat generation. Summary of the Invention

[0004] This invention provides a method, apparatus, system, device, and medium for thermal testing of gateway controllers, which can reduce measurement errors caused by external factors and effectively improve the accuracy of thermal testing.

[0005] According to one aspect of the present invention, a thermal testing method for a gateway controller is provided, comprising:

[0006] Acquire at least one target heat source included in the gateway controller to be thermally tested, and the heat-sensitive area matched with each target heat source respectively;

[0007] Based on the location of each target heat source, each heat-sensitive area, the gateway controller output port, and at least one preset thermocouple wiring rule, a thermocouple wiring method is generated so that the user can configure thermocouples on each target heat source in the gateway controller according to the thermocouple wiring method to obtain the target gateway controller.

[0008] Obtain the real-time position information of the baffle after placing the target gateway controller in the baffle of the temperature chamber. Set the orientation of the high-temperature fan according to the real-time position information of the baffle. After the orientation of the high-temperature fan is set, start the temperature chamber to perform a thermal test on the target gateway controller.

[0009] According to another aspect of the present invention, a thermal testing apparatus for a gateway controller is provided, comprising:

[0010] The heat dissipation information acquisition module is used to acquire at least one target heat source included in the gateway controller to be tested for heat, as well as the heat-sensitive area matched with each target heat source.

[0011] The target gateway controller acquisition module is used to generate a thermocouple wiring method based on each target heat source, each heat-sensitive area, the location of the gateway controller output port, and at least one preset thermocouple wiring rule, so that the user can configure thermocouples on each target heat source in the gateway controller according to the thermocouple wiring method to obtain the target gateway controller.

[0012] The thermal testing module is used to acquire the real-time position information of the baffle after the target gateway controller is placed in the baffle of the temperature chamber. Based on the real-time position information of the baffle, the orientation of the high-temperature fan is set. After the orientation of the high-temperature fan is set, the temperature chamber is started to perform thermal testing on the target gateway controller.

[0013] According to another aspect of the present invention, a thermal testing system for a gateway controller is provided, comprising a central controller, a printed circuit board, and a temperature chamber; wherein,

[0014] The central controller is used to execute the thermal testing method for the gateway controller according to any embodiment of the present invention;

[0015] The printed circuit board is used to provide a configuration environment for the gateway controller and thermocouples;

[0016] The temperature chamber is used to acquire images of the fairing and to provide a thermal testing environment to the gateway controller.

[0017] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0018] At least one processor; and

[0019] A memory communicatively connected to the at least one processor; wherein,

[0020] The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the thermal testing method for the gateway controller according to any embodiment of the present invention.

[0021] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the thermal testing method of the gateway controller according to any embodiment of the present invention.

[0022] By acquiring the target heat source and heat-sensitive area, the thermocouple wiring method is automatically generated, and the orientation of the high-temperature fan is set according to the direction of the baffle outlet. This can largely avoid thermal test measurement errors caused by external factors, improve the accuracy of thermal testing, and effectively save labor costs.

[0023] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a flowchart of a thermal testing method for a gateway controller according to Embodiment 1 of the present invention;

[0026] Figure 2 This is a schematic diagram of a thermocouple wiring method according to an embodiment of the present invention;

[0027] Figure 3 This is a diagram illustrating the effect of thermocouple pressing according to an embodiment of the present invention;

[0028] Figure 4 This is a flowchart of another thermal testing method for a gateway controller provided according to Embodiment 2 of the present invention;

[0029] Figure 5 This is a schematic diagram of the orientation of a fan outlet according to an embodiment of the present invention;

[0030] Figure 6 This is a schematic diagram of the structure of a thermal testing device for a gateway controller according to Embodiment 3 of the present invention;

[0031] Figure 7 This is a schematic diagram of the structure of a thermal testing system for a gateway controller according to Embodiment 4 of the present invention;

[0032] Figure 8 This is a schematic diagram of the structure of an electronic device that implements the thermal testing method for the gateway controller according to an embodiment of the present invention. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0035] Example 1

[0036] Figure 1 This is a flowchart of a thermal testing method for a gateway controller according to Embodiment 1 of the present invention. This embodiment is applicable to situations where optimal thermocouple wiring is automatically generated and the orientation of the high-temperature fan inside the chamber is adaptively adjusted to reduce measurement errors in thermal testing. This method can be executed by a thermal testing device for the gateway controller, which can be implemented in hardware and / or software. This thermal testing device for the gateway controller can have data processing capabilities and is generally configured within the thermal testing system of the gateway controller. Figure 1 As shown, the method includes:

[0037] S110. Obtain at least one target heat source included in the gateway controller to be thermally tested, and a heat-sensitive area matched with each target heat source.

[0038] Optionally, the gateway controller can be composed of multiple electronic components, which may include various types of chips, such as power chips, main control SoC chips, Ethernet PHY chips, Ethernet Switch chips, PMIC (Power Management IC) chips, and DDR (Double Data Rate) chips.

[0039] Optionally, the gateway controller can be configured on a printed circuit board. If thermal testing of the gateway controller is required, thermocouples for detecting heat can also be configured on the printed circuit board to detect the heat of each heat-generating electronic component.

[0040] Optionally, the target heat source can refer to an electronic component whose heating temperature exceeds a certain threshold under set operating conditions. The set operating conditions can include temperature. For example, in an environment with an operating temperature of 85℃, an electronic component with a temperature greater than 95℃ can be used as a target heat source. The temperature rise range of each electronic component under the set operating conditions can be calculated based on the specifications of each electronic component.

[0041] Optionally, the heat-sensitive area can be determined based on the temperature rise range of each target heat source. For example, for a target heat source with a temperature of 95°C under set operating conditions, its temperature rise range can be within a 1 mm radius around the target heat source, and thus the heat-sensitive area can be set within a 1 mm radius around the target heat source. Similarly, for a target heat source with a temperature of 100°C under set operating conditions, its temperature rise range can be within a 2 mm radius around the target heat source, and thus the heat-sensitive area can be set within a 2 mm radius around the target heat source. The above examples are only for better understanding of the present invention and do not limit the temperature rise range of the target heat source at each temperature, nor do they limit the specific method of obtaining the heat-sensitive area.

[0042] Optionally, to obtain the target heat sources and the heat-sensitive areas matching each target heat source, a gateway controller built on a virtual platform can be acquired first. The gateway controller built on the virtual platform can have the same configuration structure as the gateway controller configured on the printed circuit board under test. In other words, the gateway controller built on the virtual platform and the actual gateway controller under test are structurally identical, and the virtual platform can store the specifications matching each component of the gateway controller. Then, based on the specifications of each electronic component of the gateway controller in the virtual platform and the set operating conditions of the thermal test, the heating temperature of each electronic component under the set operating conditions can be calculated. Electronic components whose heating temperature exceeds the set temperature threshold can be used as target heat sources. Furthermore, based on the temperature of each target heat source, each heat-sensitive area can be defined in the gateway controller of the virtual platform.

[0043] S120. Based on the location of each target heat source, each heat-sensitive area, the gateway controller output port, and at least one preset thermocouple wiring rule, generate a thermocouple wiring method so that the user can configure thermocouples on each target heat source in the gateway controller according to the thermocouple wiring method, thereby obtaining the target gateway controller.

[0044] It is understandable that the temperature of electronic components in the heat-sensitive area will rise to a certain extent. Therefore, when arranging thermocouples, the thermocouple probe and connecting wires should be prevented from passing through the heat-sensitive area over a large area. If the thermocouple connecting wires pass through the heat-sensitive area over a large area, heat may be lost through the thermocouple connecting wires, thereby reducing the measurement accuracy of the thermal test.

[0045] This invention addresses the issue that, due to the large number of electronic components on printed circuit boards, technicians often rely on experience when arranging thermocouples, which can lead to heat loss from the target heat source due to poor placement of thermocouple connection wires. Therefore, this invention creatively proposes an automatic generation of thermocouple wiring patterns, allowing users to arrange thermocouple connection wires according to these patterns, thereby minimizing the impact of thermocouple connection wires on thermal testing.

[0046] Optionally, the gateway controller output port can be the output port of each thermocouple connection wire passing through the printed circuit board. The gateway controller output port can generally be configured on the edge of the gateway controller on the printed circuit board.

[0047] Optionally, the target gateway controller can be understood as a gateway controller that allows users to directly perform thermal tests after configuring thermocouples for each target heat source.

[0048] In the embodiments described in this invention, the thermocouple can be pressed and positioned at the center of the upper surface of the target heat source. Specifically, a heat dissipation pad that closely fits the lower protrusion of the target gateway controller housing can be used to press the thermocouple at the center of the target heat source surface.

[0049] The advantage of this setup is that it avoids using a fixed medium to fix the thermocouple, effectively mitigating measurement errors introduced into the entire thermal testing system by factors such as overlapping heat-sensitive areas, the inability to calculate the thermal conductivity of the fixed medium, and the inability to calculate the space occupied by the fixed medium.

[0050] The thermocouple wiring method may include: the location of the fixed medium setting point of the thermocouple connection wire, and the wiring location of the thermocouple connection wire.

[0051] Thermocouple wiring rules may include: the fixed medium setting point of the thermocouple connection line is located outside each heat-sensitive area; the direction of the thermocouple connection line at the gateway controller outlet is parallel to the direction of the thermocouple connection line at the fixed medium setting point; and the thermocouple connection line within the heat-sensitive area is a straight line.

[0052] The advantage of this setup is that it can maximize the restoration of the thermal resistance coefficient of the target heat source itself and the effective contact area between the target heat source and the heat dissipation pad, and it can also avoid the error caused by the position deviation of the thermocouple probe due to uneven force when the thermocouple connection wires are leading out.

[0053] Figure 2 This is a schematic diagram of an optional thermocouple wiring method. Optionally, the thermocouple wiring method can be... Figure 2 The diagram shown can be presented to the user, or it can be presented to the user in data form. There are no restrictions on the form of thermocouple wiring.

[0054] Figure 3 This is a diagram illustrating the effect of one possible thermocouple pressing method. (Example) Figure 3 As shown, the thermocouple is not fixed to the target heat source through a medium, but is fixed by compression.

[0055] It should be noted that, Figure 2 and Figure 3 This is for illustrative purposes only and does not limit the specific content shown.

[0056] S130. Obtain the real-time position information of the baffle after placing the target gateway controller in the baffle of the temperature chamber. Set the orientation of the high-temperature fan according to the real-time position information of the baffle. After the orientation of the high-temperature fan is set, start the temperature chamber to perform a thermal test on the target gateway controller.

[0057] Optionally, when performing thermal testing on the target gateway controller, the target gateway controller needs to be placed in a baffle, which is arranged in a temperature chamber. The temperature chamber is also equipped with a high-temperature fan. The temperature chamber is heated by blowing air through the high-temperature fan. The baffle is used to block the high-temperature gas blown out by the high-temperature fan. In order to avoid measurement errors caused by the influence of natural convection, this invention proposes to change the direction of the fan so that the direction of the high-temperature fan is perpendicular to the direction of the outlet of the baffle in the horizontal direction.

[0058] The technical solution of this invention obtains the target heat source and the heat-sensitive area, thereby automatically generating the thermocouple wiring method, and sets the orientation of the high-temperature fan according to the direction of the baffle outlet. This can largely avoid thermal test measurement errors caused by external factors, improve the accuracy of thermal testing, and effectively save labor costs.

[0059] Example 2

[0060] Figure 4 This is a flowchart of a thermal testing method for a gateway controller provided in Embodiment 2 of the present invention. Based on the above embodiments, this embodiment specifically describes the thermal testing method for a gateway controller.

[0061] like Figure 4 As shown, the method includes:

[0062] S210. Based on the specifications and parameters of each electronic component in the gateway controller and the set operating conditions, calculate the heating temperature of each electronic component under the set operating conditions.

[0063] S220. Identify electronic components whose heating temperature is greater than a preset temperature threshold as target heat sources.

[0064] S230. Calculate the temperature rise range of each main heat source based on the heating temperature of each target heat source under the set operating conditions.

[0065] S240. Based on the heating range of each target heat source, determine the heat-sensitive area that matches each target heat source.

[0066] S250. Sequentially obtain the current heat source among each target heat source, and obtain the target configuration position of the thermocouple that matches the current heat source.

[0067] S260. Based on the heat-sensitive area matching the current heat source being processed, the location of the gateway controller output port, and the thermocouple wiring rules, determine at least one alternative fixed medium setting point location matching the target configuration location and the wiring location of the thermocouple connection line corresponding to each alternative fixed medium setting point location.

[0068] S270. Based on the wiring position of the thermocouple connection line corresponding to each candidate fixed medium setting point, calculate the wiring complexity corresponding to each candidate fixed medium setting point.

[0069] by Figure 2 For example, fixed media setting point 1 and fixed media setting point 2 are two alternative fixed media setting points. It can be seen that... Figure 2 Both of the wiring methods matched by the two fixed medium setting points conform to the thermocouple wiring rules, but the wiring complexity of fixed medium setting point 2 is significantly greater than that of fixed medium setting point 1. Therefore, fixed medium setting point 1 and its matching wiring method can be selected as the thermocouple wiring method matched with the current heat source.

[0070] However, it should be noted that Figure 2 The wiring method for thermocouples is simpler than that in practice, in order to make the invention easier to understand. The actual printed circuit board has a complex structure and the wiring method is also relatively complex.

[0071] S280. Based on the complexity of each wiring, determine the thermocouple wiring method that matches the current heat source, so that the user can configure thermocouples on each target heat source in the gateway controller according to the thermocouple wiring method, and obtain the target gateway controller.

[0072] S290. Acquire an image of the baffle in the temperature chamber, and identify the direction of the baffle outlet in the baffle image.

[0073] S2100, The orientation of the high-temperature fan is set to be perpendicular to the direction of the outlet of the baffle in the horizontal direction.

[0074] Figure 5 This is a schematic diagram illustrating one possible fan outlet orientation. (Example) Figure 5 As shown, the ellipse represents the air outlet of the high-temperature fan, and the rectangle represents the baffle. The direction of the fan's airflow can be perpendicular to the direction of the baffle's outlet in the horizontal direction, thereby avoiding measurement errors introduced by the influence of natural convection.

[0075] By acquiring the target heat source and heat-sensitive area, the thermocouple wiring can be automatically generated, which can effectively reduce the impact of thermocouple connection wires on thermal testing. By setting the direction of the high-temperature fan according to the direction of the baffle outlet, the measurement error introduced by the influence of natural convection can be avoided. This can largely avoid thermal testing measurement errors caused by external factors, improve the accuracy of thermal testing, and effectively save labor costs.

[0076] Example 3

[0077] Figure 6 This is a schematic diagram of the structure of a thermal testing device for a gateway controller provided in Embodiment 3 of the present invention. Figure 6 As shown, the device includes: a heat information acquisition module 310, a target gateway controller acquisition module 320, and a heat testing module 330.

[0078] The heat information acquisition module 310 is used to acquire at least one target heat source included in the gateway controller to be tested for heat and the heat-sensitive area matched with each target heat source.

[0079] The target gateway controller acquisition module 320 is used to generate a thermocouple wiring method based on each target heat source, each heat-sensitive area, the location of the gateway controller output port, and at least one preset thermocouple wiring rule, so that the user can configure thermocouples on each target heat source in the gateway controller according to the thermocouple wiring method to obtain the target gateway controller.

[0080] The thermal testing module 330 is used to acquire the real-time position information of the baffle after the target gateway controller is placed in the baffle of the temperature chamber, set the orientation of the high-temperature fan according to the real-time position information of the baffle, and start the temperature chamber to perform thermal testing on the target gateway controller after the orientation of the high-temperature fan is set.

[0081] By acquiring the target heat source and heat-sensitive area, the thermocouple wiring method is automatically generated, and the orientation of the high-temperature fan is set according to the direction of the baffle outlet. This can largely avoid thermal test measurement errors caused by external factors, improve the accuracy of thermal testing, and effectively save labor costs.

[0082] Based on the above embodiments, the heat dissipation information acquisition module 310 can be specifically used for:

[0083] Based on the specifications and parameters of each electronic component in the gateway controller and the set operating conditions, the heating temperature of each electronic component under the set operating conditions is calculated.

[0084] Electronic components whose heating temperature exceeds a preset temperature threshold are identified as target heat sources.

[0085] Based on the heating temperature of each target heat source under the set operating conditions, the heating range of each main heat source is calculated.

[0086] Based on the temperature rise range of each target heat source, determine the heat-sensitive area that matches each target heat source.

[0087] Based on the above embodiments, the thermocouple wiring method may include: the location of the fixed medium setting point of the thermocouple connection wire, and the wiring location of the thermocouple connection wire;

[0088] Thermocouple wiring rules may include: the fixed medium installation point of the thermocouple connection line is located outside each heat-sensitive area; the direction of the thermocouple connection line at the gateway controller outlet is parallel to the direction of the thermocouple connection line at the fixed medium installation point; and the thermocouple connection line within the heat-sensitive area is a straight line.

[0089] Based on the above embodiments, the target gateway controller acquisition module 320 can be specifically used for:

[0090] The current heat source is sequentially obtained from each target heat source, and the target configuration position of the thermocouple matching the current heat source is obtained.

[0091] Based on the heat-sensitive area matching the current heat source being processed, the location of the gateway controller output port, and the thermocouple wiring rules, determine at least one alternative fixed medium setting point location matching the target configuration location and the wiring location of the thermocouple connection line corresponding to each alternative fixed medium setting point location.

[0092] Calculate the routing complexity corresponding to each candidate fixed medium setting point location based on the wiring position of the thermocouple connection line corresponding to each candidate fixed medium setting point location.

[0093] Based on the complexity of each wiring route, determine the thermocouple wiring method that matches the current heat source.

[0094] Based on the above embodiments, the thermal testing module 330 can be specifically used for:

[0095] Acquire an image of the baffle in the temperature chamber, and identify the direction of the baffle outlet from the baffle image;

[0096] The orientation of the high-temperature fan should be perpendicular to the direction of the outlet of the baffle in the horizontal direction.

[0097] Based on the above embodiments, in the target gateway controller, each thermocouple can be pressed together and placed in the center of the upper surface of the target heat source.

[0098] The thermal testing device for gateway controllers provided in this embodiment of the invention can execute the thermal testing method for gateway controllers provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects for executing the method.

[0099] Example 4

[0100] Figure 7 A schematic diagram of a thermal testing system for a gateway controller is shown. Figure 7 As shown, the thermal testing system for the gateway controller may include a central controller 41, a printed circuit board 42, and a temperature chamber 43.

[0101] The central controller 41 is used to execute the thermal testing method of the gateway controller according to any embodiment of the present invention.

[0102] Printed circuit board 42 is used to provide a configuration environment for the gateway controller and thermocouples.

[0103] The temperature chamber 43 is used to acquire images of the fairing and to provide a thermal testing environment to the gateway controller 41.

[0104] Optionally, the printed circuit board 42 may include a gateway controller 421 configured with multiple electronic components. A thermocouple 422 may also be configured on the printed circuit board 42. The thermocouple can be pressed onto the gateway controller 421 by a heat dissipation pad that is in close contact with the protruding boss of the gateway controller housing.

[0105] Optionally, the temperature chamber 43 may include an image capturing device 431 and a high-temperature fan 432.

[0106] Optionally, the image capturing device 431 can be used to capture an image of the fairing 433 and send the fairing image to the central controller 41.

[0107] Optionally, a high-temperature fan 432 can be used to heat the incubator 43.

[0108] Optionally, the temperature chamber 43 may also be equipped with a baffle, which can be used to prevent the high-temperature gas blown out by the high-temperature fan 432 from directly contacting the printed circuit board 42.

[0109] The technical solution of this invention, by configuring a central controller, printed circuit board and temperature chamber in the thermal testing system of the gateway controller, can reduce measurement errors caused by external factors and effectively improve the accuracy of thermal testing.

[0110] Example 5

[0111] Figure 8 A schematic diagram of an electronic device 10 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0112] like Figure 8 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0113] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0114] Processor 11 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, central processing unit (CPU), graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the thermal testing method for a gateway controller as described in the embodiments of the present invention. That is:

[0115] Acquire at least one target heat source included in the gateway controller to be thermally tested, and the heat-sensitive area matched with each target heat source respectively;

[0116] Based on the location of each target heat source, each heat-sensitive area, the gateway controller output port, and at least one preset thermocouple wiring rule, a thermocouple wiring method is generated so that the user can configure thermocouples on each target heat source in the gateway controller according to the thermocouple wiring method to obtain the target gateway controller.

[0117] Obtain the real-time position information of the baffle after placing the target gateway controller in the baffle of the temperature chamber. Set the orientation of the high-temperature fan according to the real-time position information of the baffle. After the orientation of the high-temperature fan is set, start the temperature chamber to perform a thermal test on the target gateway controller.

[0118] In some embodiments, the gateway controller thermal testing method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or mounted on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the gateway controller thermal testing method described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the gateway controller thermal testing method by any other suitable means (e.g., by means of firmware).

[0119] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0120] Computer programs used to implement the methods of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs can be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0121] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0122] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0123] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0124] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0125] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0126] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method of thermal testing of a gateway controller, the method comprising: The method comprises the following steps: acquiring at least one target heat source included in a gateway controller to be subjected to heat test and a heat-sensitive area respectively matched with each target heat source; generating a thermocouple wiring mode according to each target heat source, each heat-sensitive area, the location of the outlet of the gateway controller and a preset thermocouple wiring rule, so as to configure a thermocouple on each target heat source in the gateway controller according to the thermocouple wiring mode, and obtaining a target gateway controller; acquiring real-time position information of a baffle cover of the target gateway controller after the target gateway controller is placed in the baffle cover of a temperature box, setting the orientation of a high-temperature fan according to the real-time position information of the baffle cover, and starting the temperature box to perform heat test on the target gateway controller after the orientation of the high-temperature fan is set; wherein the thermocouple wiring mode comprises a fixed medium setting point position of a thermocouple connecting line and a wiring position of the thermocouple connecting line; the thermocouple wiring rule comprises that the fixed medium setting point position of the thermocouple connecting line is located outside each heat-sensitive area, the direction of the thermocouple connecting line at the outlet of the gateway controller is parallel to the direction of the thermocouple connecting line at the fixed medium setting point position, and the thermocouple connecting line in the heat-sensitive area is a straight line.

2. The method of claim 1, wherein, acquiring at least one target heat source included in a gateway controller to be subjected to heat test and a heat-sensitive area respectively matched with each target heat source, comprising: calculating the heat generation temperature of each electronic component under the set working condition according to the specification parameters of each electronic component in the gateway controller and the set working condition; determining the electronic component with a heat generation temperature greater than a preset temperature threshold as a target heat source; calculating the temperature rise range of each main heat source according to the heat generation temperature of each target heat source under the set working condition; determining a heat-sensitive area respectively matched with each target heat source according to the temperature rise range of each target heat source.

3. The method of claim 1, wherein, generating a thermocouple wiring mode according to each target heat source, each heat-sensitive area, the location of the outlet of the gateway controller and a preset thermocouple wiring rule, comprising: obtaining a current heat source in turn among each target heat source, and obtaining a target configuration position of a thermocouple matched with the current heat source; determining at least one alternative fixed medium setting point position matched with the target configuration position and the wiring position of the thermocouple connecting line corresponding to each alternative fixed medium setting point position according to the heat-sensitive area matched with the current processing heat source, the location of the outlet of the gateway controller and the thermocouple wiring rule; calculating the wiring complexity corresponding to each alternative fixed medium setting point position according to the wiring position of the thermocouple connecting line corresponding to each alternative fixed medium setting point position; determining the thermocouple wiring mode matched with the current heat source according to each wiring complexity.

4. The method of claim 1, wherein, acquiring real-time position information of a baffle cover of the target gateway controller after the target gateway controller is placed in the baffle cover of a temperature box, setting the orientation of a high-temperature fan according to the real-time position information of the baffle cover, and starting the temperature box to perform heat test on the target gateway controller after the orientation of the high-temperature fan is set; acquiring the baffle cover image of the baffle cover in the temperature box, and identifying the direction of the baffle cover outlet in the baffle cover image; setting the orientation of the high-temperature fan to be perpendicular to the direction of the baffle cover outlet in the horizontal direction.

5. The method according to any one of claims 1 to 4, characterized in that, In the target gateway controller, each thermocouple is arranged in a press-fit manner on the central surface of the target heat source.

6. A thermal testing apparatus of a gateway controller, characterized by, The method comprises the following steps: The heat generation information acquisition module is configured to acquire at least one target heat source included in the gateway controller to be subjected to the heat test and a heat-sensitive area respectively matched with each target heat source. The target gateway controller acquisition module is configured to generate a thermocouple wiring mode according to the target heat sources, the heat-sensitive areas, the location of the outlet of the gateway controller, and at least one preset thermocouple wiring rule, so as to enable a user to configure thermocouples on the target heat sources in the gateway controller according to the thermocouple wiring mode, and obtain the target gateway controller. The heat test module is configured to acquire real-time position information of the baffle cover after the target gateway controller is placed in the baffle cover of the oven, set the orientation of the high-temperature fan according to the real-time position information of the baffle cover, and start the oven to perform the heat test on the target gateway controller after the orientation of the high-temperature fan is set. The thermocouple wiring mode comprises a fixed medium setting point position of a thermocouple connecting line and a wiring position of the thermocouple connecting line. The thermocouple wiring rule comprises that the fixed medium setting point of the thermocouple connecting line is located outside the heat-sensitive areas, the direction of the thermocouple connecting line at the outlet of the gateway controller is parallel to the direction of the thermocouple connecting line at the fixed medium setting point, and the thermocouple connecting line in the heat-sensitive area is a straight line.

7. A thermal test system for a gateway controller, the system comprising: The system comprises a central controller, a printed circuit board, and an oven. The central controller is configured to execute the heat test method of the gateway controller according to any one of claims 1-5. The printed circuit board is configured to provide a configuration environment for the gateway controller and the thermocouple. The oven is configured to acquire a baffle cover image and provide a heat test environment for the gateway controller.

8. An electronic device, comprising: The electronic device comprises: at least one processor; and a memory connected to the at least one processor in communication; wherein The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the heat test method of the gateway controller according to any one of claims 1-5.

9. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions for enabling the processor to execute the heat test method of the gateway controller according to any one of claims 1-5 when executed.

Images