Wafer rod squaring control system and control method

Abstract

A wafer rod squaring control system and control method, comprising: a squaring bin for removing the edge skin of a wafer rod and a moving platform arranged at the end of the squaring bin; the moving platform is provided with a feeding mechanism and a discharging mechanism, the feeding mechanism and the discharging mechanism are arranged on the two sides of the squaring bin, and the feeding mechanism can synchronously feed the new wafer rod to be squared to the squaring bin when the discharging mechanism collects all the edge skins and removes the wafer rod after squaring. The feeding of the wafer rod to be squared and the discharging of the wafer rod after removing the edge skin are carried out by using the opposite sides of transmission, and the feeding of the wafer rod to be squared in the next round and the discharging of the wafer rod after removing the edge skin in the last round can be synchronously carried out. The safety of the silicon rod turnover can be improved, the feeding and discharging work can be seamlessly connected, the production efficiency is high, the collision between the edge skins and between the edge skin and the wafer rod can be reduced, and the quality is guaranteed.

Description

Technical Field

[0001] This invention belongs to the field of single-crystal silicon rod processing technology, and in particular relates to a wafer rod squaring control system and control method. Background Technology

[0002] In the wafer ingot squaring process, the current equipment operates on the same sliding track, with loading and unloading occurring on the same side. This means that both loading and unloading of the wafer ingots before and after squaring are done using the same robotic arm. The robotic arm cannot rotate during unloading, resulting in wasted time and insufficient coordination, leading to low processing efficiency and low equipment uptime. Furthermore, due to the unreasonable structural design, the wafer edges are prone to collisions during unloading and are also susceptible to damage or breakage during wafer ingot handling. Summary of the Invention

[0003] The problem to be solved by the present invention is to provide a wafer ingot squaring control system and control method, which solves the technical problems of low production efficiency and serious silicon ingot collision caused by the same-side operation of wafer ingot loading and squaring ingot unloading in the prior art.

[0004] To solve at least one of the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0005] A wafer ingot squaring control system, comprising:

[0006] A squaring chamber for removing the edge of a wafer rod and a movable platform placed at the end of the squaring chamber;

[0007] The mobile platform is equipped with a loading mechanism and a unloading mechanism, which are arranged on opposite sides of the squaring chamber. The loading mechanism can simultaneously deliver a new wafer to be squared to the squaring chamber when the unloading mechanism collects all the edge pieces and removes the squared wafer.

[0008] Furthermore, the squaring chamber is equipped with a clamping mechanism for securing the wafer rod, the clamping mechanism including a main clamping shaft and a secondary clamping shaft that are suspended.

[0009] The main top shaft is used to secure the end face of the square bar in the wafer rod.

[0010] The secondary top shaft is used to secure the end face of the edge skin in the wafer rod, which is positioned according to the alignment criteria.

[0011] The main top shaft and the secondary top shaft can move together along the length of the squaring chamber to the mobile platform.

[0012] Furthermore, the mobile platform includes a sliding table placed outside the squaring bin. The loading mechanism and the unloading mechanism are both arranged parallel to the length direction of the squaring bin and perpendicular to the length direction of the sliding table. The loading mechanism and the unloading mechanism are independently slidable along the length direction of the sliding table.

[0013] Furthermore, the feeding mechanism includes:

[0014] A loading platform fixed to one end of the sliding table;

[0015] A material preparation platform is located near the side of the open-cell bin and cooperates with the loading platform;

[0016] Both the loading platform and the preparation platform are equipped with coaxially arranged loading tracks;

[0017] The preparation table is also equipped with two sets of clamping devices for gripping the wafer rods;

[0018] The position of the loading track placed in the preparation platform is fixed and higher than the initial position of the loading track placed in the preparation platform; and the loading platform can move up and down in the vertical direction so that the wafer rod placed on the loading platform moves along the loading track to the preparation platform.

[0019] Furthermore, the clamping device includes two opposing grippers with C-shaped inner walls; the feeding track, placed in the material preparation table, passes through the clamping area formed by the grippers.

[0020] Furthermore, a stop block for positioning the wafer rod is also provided on the feeding track in the preparation table. The stop block is located at the end of the feeding track in the preparation table near the square opening chamber.

[0021] The clamping device near the stop block can move along the width direction of the material preparation table;

[0022] The clamping device, which is away from the stop, can move along the width and length of the preparation table.

[0023] Furthermore, the clamping device away from the stop is provided with a pull rod, which is driven by the clamping device to pull the wafer rod towards the end closer to the stop, and the wafer rod is fixed to the material preparation table by the stop.

[0024] The pull rod has an L-shaped structure and is horizontally arranged along the length of the material preparation table. One end of the rod is fixed to the side wall of the clamping device near the loading table, away from the stop block, and the other end is suspended in the air.

[0025] Furthermore, the unloading mechanism is located at one end of the sliding table away from the loading mechanism, and includes an unloading platform partially fixed to the sliding table and a collection box for collecting the edge skins;

[0026] The unloading platform is located above the collection box and is controlled independently of the collection box;

[0027] The unloading platform can move vertically up and down to receive the squared wafer rod and move it to the unloading turnover table.

[0028] Furthermore, the unloading platform is equipped with an unloading track;

[0029] Both the unloading track and the loading track are equipped with several rubber rollers;

[0030] The rubber rollers in the feeding track are all horizontally arranged;

[0031] The rubber rollers in the feeding track are all arranged obliquely upwards and facing each other;

[0032] The feeding track is provided with several sets of baffles near the squaring chamber to prevent the wafer rod from shifting after squaring. The baffles are arranged side by side with gaps on both sides of the feeding track along the length of the feeding track.

[0033] Furthermore, two placement slots are provided side by side along the width direction of the collection box, and the distance between the placement slots is not greater than the width of the square rooted wafer rod;

[0034] When the edge skins of any pair of aligned units fall, the collection box is moved to a position directly below the wafer rod outside the square compartment, and the two placement slots are symmetrically arranged with respect to the length axis of the wafer rod.

[0035] A method for controlling the square root extraction of a wafer ingot, employing the control system described in any of the preceding claims, includes the following steps:

[0036] Based on the number of alignment edge groups in the wafer rod, each alignment edge group is cut sequentially in the squaring chamber, and after each alignment edge group is cut, the edge group is collected between the squaring chamber and the moving platform.

[0037] The unloading mechanism is controlled to acquire the wafer ingot without edge skin, and the loading mechanism is simultaneously controlled to load a new wafer ingot to be squared into the squaring chamber.

[0038] Furthermore, before the wafer ingot is loaded into the squaring chamber, the process further includes fixing the wafer ingot in the preparation table, the steps of which include:

[0039] Control the wafer ingot to be fed from the loading station along the loading track to the preparation station;

[0040] Control the clamping device on the side of the material preparation table near the loading table to move the wafer rod toward the end near the square opening chamber;

[0041] The side of the wafer rod away from the loading platform abuts against the stop block placed on the loading track;

[0042] Control all the clamping devices to grip the wafer rod;

[0043] The loading platform is driven to move the wafer rod to the squaring chamber near the door of the moving platform.

[0044] Furthermore, during the process of the top clamping mechanism gripping the wafer rod, the steps include:

[0045] The top clamping mechanism is suspended idly between the squaring chamber and the moving platform, and is pre-positioned at both ends of the wafer rod;

[0046] The main top shaft is controlled to secure the pre-set end face of the square bar in the wafer rod;

[0047] Control the position of any set of aligned edge skins on the end face of the wafer rod by the secondary top shaft;

[0048] The top clamping mechanism drives the wafer rod through the clamping device and into the squaring chamber in preparation for cutting;

[0049] The material preparation table causes the opened clamping components to retract.

[0050] Furthermore, the process of collecting edge skins includes:

[0051] Control the collection box to move from below the unloading platform to directly below the wafer rod that has been taken out of the squaring chamber;

[0052] Loosen the secondary top shaft and allow the aligned edge skin to fall into the corresponding placement slot;

[0053] Repeat the above steps until all the corresponding edge skins have been collected;

[0054] Control the collection box to retract to its initial position.

[0055] Furthermore, after collecting all aligned edge skins, the process also includes collecting the edge-free wafer rod, comprising:

[0056] Control the unloading platform to move directly below the wafer ingot;

[0057] Drive the unloading platform to rise until it contacts the lower end face of the wafer rod;

[0058] Loosen the main top spindle to place the wafer ingot on the unloading platform;

[0059] The unloading platform is controlled to drive the wafer rod back to its initial position.

[0060] Compared with existing technologies, the above-mentioned technical solution utilizes opposite-side transfer for loading the wafer ingots to be squared and unloading the wafer ingots after edge trimming. It also allows for simultaneous loading of the next round of wafer ingots to be squared and unloading of the previous round of edge-trimmed wafer ingots. This not only improves the safety of silicon ingot turnover but also ensures seamless connection between loading and unloading operations, resulting in high production efficiency. The overall processing time is reduced to 18-22 minutes, and equipment uptime is increased to 95-97%. The separately designed edge-trimming collection structure reduces collisions between edge trimmers and between edge trimmers and the wafer ingots, ensuring silicon ingot quality. Attached Figure Description

[0061] Figure 1 This is a top view of a wafer ingot squaring control system according to an embodiment of the present invention;

[0062] Figure 2 This is a schematic diagram of the cooperation between the material preparation platform and the top clamping mechanism during the feeding process according to an embodiment of the present invention;

[0063] Figure 3 This is a top view of the preparation station and the wafer rod in cooperation according to an embodiment of the present invention;

[0064] Figure 4 This is a side view of the preparation station and wafer rod in cooperation according to an embodiment of the present invention;

[0065] Figure 5 This is a side view of the feeding stage and the wafer rod in cooperation according to an embodiment of the present invention;

[0066] Figure 6 This is a schematic diagram of the cooperation between the collection box and the top clamping mechanism during the edge-gathering process according to an embodiment of the present invention;

[0067] Figure 7 This is a schematic diagram of the cooperation between the unloading platform and the top clamping mechanism during unloading according to an embodiment of the present invention.

[0068] In the picture:

[0069] 10. Square opening chamber; 20. Top clamping mechanism; 21. Main top shaft

[0070] 22. Secondary jacking shaft; 23. Suspension boom; 30. Moving platform

[0071] 31. Sliding table; 40. Feeding mechanism; 41. Feeding platform

[0072] 42. Material preparation table; 421. Clamping parts; 422. Stop block

[0073] 423, pull rod 43, feeding rail 50, unloading mechanism

[0074] 51. Unloading platform; 52. Collection box; 53. Unloading track.

[0075] 54. Baffle; 60. Wafer rod; 61. Square rod

[0076] 62. Edge skin Detailed Implementation

[0077] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0078] This embodiment proposes a wafer ingot square root control system, such as Figure 1 As shown, it includes a squaring chamber 10 for removing the edge 60 of a wafer ingot 60 and a moving platform 30 located at the end of the squaring chamber 10. The moving platform 30 is provided with a loading mechanism 40 for transporting the wafer ingot 60 to be squared to the squaring chamber 10 and a unloading mechanism 50 for taking out the square rod 61 obtained after removing the edge 62 from the squaring chamber 10. The loading mechanism 40 and the unloading mechanism 50 are arranged on opposite sides of the squaring chamber 10, that is, at both ends of the moving platform 30. The loading mechanism 40 can simultaneously send a new wafer ingot 60 to be squared to the entrance of the squaring chamber 10 near the moving platform 30 when the unloading mechanism 50 collects all the edge 62 and removes the square rod 61 after squaring.

[0079] Specifically, the square chamber 10 is a processing cavity enclosed by four movable doors on all four sides. It contains a clamping mechanism 20 for securing the ends of the wafer rod 60. The clamping mechanism 20 includes two sets of main clamping shafts 21 and auxiliary clamping shafts 22 suspended by suspension arms 23; each set of main clamping shafts 21 is equipped with two auxiliary clamping shafts 22. The main clamping shafts 21 are used to secure the end face of the square rod 61 positioned within the wafer rod 60; the auxiliary clamping shafts 22 are used to secure the end face of the edge trim 62 positioned within the wafer rod 60. Furthermore, the main clamping shafts 21 and auxiliary clamping shafts 22 are controlled by two separate control systems, meaning they brake independently. In this embodiment, the wafer rod 60 contains four crystal lines, including four edge trims 62 and one square rod 61. Its structure is common knowledge to those skilled in the art, and the accompanying drawings are omitted.

[0080] Among them, such as Figure 2As shown, the main top shaft 21 and the secondary top shaft 22 can be moved together along the length of the squaring chamber 10 to the moving platform 20 by the suspension arm 23. When securing the wafer rod 60, the main top shaft 21 first contacts and clamps the end face of the square rod 61 in the wafer rod 60. After the main top shaft 21 is secured, the secondary top shaft 22 is controlled to contact the end face of any set of aligned edge pieces 62 in the wafer rod 60 and gradually clamps them. After the set of edge pieces 62 is cut, the suspension arm 23 is controlled to move the main top shaft 21, the secondary top shaft 22 and the wafer rod 60 to the transition area between the squaring chamber 10 and the moving platform 30. The collection box 52 in the unloading mechanism 50 for collecting edge pieces 62 is moved to directly below the wafer rod 60, all secondary top shafts 22 on both sides are released, and the set of edge pieces 62 fall into the two placement slots in the collection box 54 in the unloading mechanism 50. The collecting box 54 is fixed in place, and the wafer rod 60 is controlled to return to the squaring chamber 10 to continue squaring and removing another set of aligned edge pieces 62. After being removed from the squaring chamber 10, the remaining edge pieces 62 are unloaded into the collecting box 54. Then, the collecting box 52 is controlled to return to the initial position and the unloading platform 51 in the unloading mechanism 50 is moved to the underside of the square rod 61. The main top shaft 21 is released, so that the square rod 61 is placed in the unloading track 53 in the unloading platform 51, thereby completing the squaring operation of the wafer rod 60.

[0081] Furthermore, such as Figure 1 As shown, the mobile platform 30 also includes a sliding stage 31 located outside the squaring chamber 10. The sliding stage 31 is perpendicular to the length direction of the squaring chamber 10, that is, perpendicular to the length direction of the wafer rod 60. The loading mechanism 40 and the unloading mechanism 50 are both parallel to the length direction of the squaring chamber 10 and perpendicular to the length direction of the sliding stage 31. The loading mechanism 40 and the unloading mechanism 50 are both independently slidable along the length direction of the sliding stage 31.

[0082] Specifically, the loading mechanism 40 includes a loading platform 41 fixed to one end of the sliding table 31 and a preparation platform 42 located near the square box 10 and cooperating with the loading platform 41; wherein the loading platform 41 and the preparation platform 42 are independently and cooperatively arranged, and both the loading platform 41 and the preparation platform 42 are equipped with loading tracks 43 of the same specification and structure and coaxially arranged, the loading platform 41 can move the wafer rod 60 placed on it along the loading track 43 to the preparation platform 42.

[0083] Furthermore, the height of the preparation platform 42 is fixed, and correspondingly, the height of the loading track 43 that cooperates with it is also fixed. That is, it can only move along the length or width of the sliding table 31, and cannot move vertically up or down. The loading platform 41 can move vertically up and down, but its position on the sliding table 31 is fixed, meaning it cannot move along the length or width of the sliding table 31. To ensure that the wafer ingot 60 is moved from the loading platform 41 to the preparation platform 42, the height of the loading track 43 in the preparation platform 42 is set higher than the initial position of the loading track 43 in the loading platform 41. Due to the influence of the length of the loading turnover table used to transport the wafer ingot 60 to be squared and production costs, the loading turnover table is... Figure 1 The double-dotted line structure connecting the loading platform 41 in the middle means that the height of the loading turnover platform cannot be too high. This means that the initial position of the loading platform 42 needs to be adapted to the height of the loading turnover platform. Consequently, the position height of the wafer ingot 60 transmitted from the loading turnover platform is lower than the position height of the preparation platform 42. After the wafer ingot 60 is moved from the loading turnover platform to the loading platform 41, the loading platform 41 needs to automatically rise to the same height as the preparation platform 42, and then be conveyed to the preparation platform 42 through the loading track 43.

[0084] like Figure 3 As shown, two sets of clamping devices 421 are also provided on the material preparation table 42 as robotic arms for gripping the wafer ingots 60. The structure of the clamping device 421 is as follows: Figure 4 As shown, it includes two opposing grippers with C-shaped inner walls. The upper and lower sections of the grippers are equipped with rubber pads that directly contact the outer wall surface of the wafer ingot 60 for gripping the wafer ingot 60. A loading track 43, located in the preparation table 42, passes through the clamping area formed by the two opposing grippers. The loading track 43 is equipped with several rubber rollers, all of which are angled upwards and facing each other. This structure facilitates point contact with the circular structure on the outer wall surface of the wafer ingot 60, improving the sliding effect of the wafer ingot 60 on the loading track 43 and reducing the sliding resistance of the wafer ingot 60 on the loading track 43.

[0085] like Figure 3 As shown, a stop 422 for positioning the wafer rod 60 is also provided on the loading track 43 in the preparation platform 42. The stop 422 is fixedly set at one end of the loading track 43 in the preparation platform 42 near the square opening chamber 10. The purpose of setting the stop 422 is to match the position of the top clamping mechanism 20 in clamping the wafer rod 60, so as to ensure that the top clamping mechanism 20 accurately clamps the wafer rod 60.

[0086] Furthermore, the clamping device 421 on the side near the stop 422 can only move along the width direction of the preparation table 42, and cannot move along the length direction of the preparation table 42. The purpose is to position it to clamp the wafer rod 60 at the end near the stop 422.

[0087] Furthermore, a pull rod 423 is provided in the clamping member 421 on the side away from the stop block 422. The pull rod 423 has an L-shaped structure and is horizontally arranged along the length of the preparation table 42. One end of the pull rod is fixed to the side wall of the clamping member 421 on the side away from the stop block 422 near the loading table 41, and the other end is suspended. The clamping member 421 on the side away from the stop block 422 can move along the width and length of the preparation table 42. That is, the clamping member 421 can tighten or expand synchronously with the clamping member 421 on the side near the stop block 422 along the width of the preparation table 42 to clamp or release the wafer ingot 60; or it can move independently along the length of the preparation table 42. The purpose is that the clamping member 421 on the side away from the stop block 422 pulls the wafer ingot 60 along the loading track 43 towards the end near the stop block 422 through the pull rod 423, so that the wafer ingot 60 is pushed against and fixed on the preparation table 42 by the stop block 422. After the wafer ingot 60 is fixed, the clamping member 421 on the side away from the stop block 422 returns to its initial position. Then, the two clamping members 421 are controlled to tighten synchronously to clamp the wafer ingot 60, preparing to move the wafer ingot 60 towards the middle position of the sliding stage 31, that is, towards the opening position of the square root chamber 10, to meet the top clamping mechanism 20 which is waiting in the space between the square root chamber 10 and the sliding stage 31. Figure 2 As shown. The initial position of the clamping member 421 on the side away from the stop 422 and the fixed position of the clamping member 421 on the side closer to the stop 422 are symmetrically set with respect to the length centerline of the wafer rod 60, in order to ensure the balance of clamping the wafer rod 60.

[0088] like Figure 1 As shown, the unloading mechanism 50 is located at the end of the sliding table 31 away from the loading mechanism 40, and includes an unloading platform 51 partially fixed on the sliding table 31 and a collection box 52 for collecting the edge scraps 62; the unloading platform 51 is located above the collection box 52, and the unloading platform 51 and the collection box 52 are independently arranged. The unloading platform 51 can move vertically up and down, and can also move along the length of the sliding table 31, but cannot move along the width of the sliding table 31. The purpose of the unloading platform 51 moving vertically up and down is to receive the square-opened wafer ingots 60 and move them to the unloading turnover table, as shown in the diagram. Figure 1 The structure with two dotted lines connecting the middle and the unloading platform 51.

[0089] The unloading platform 51 is equipped with an unloading track 53, which, like the loading track 43, is also equipped with several rubber rollers, all of which are horizontally positioned. The unloading track 53 primarily supports the placement of the square bars 61 obtained after squaring and removing the edge trimmings 62. To ensure the stability of the square bars 61, all rubber rollers on it must be horizontally positioned. The fit between the square bars 61 and the unloading track 53 is as follows: Figure 5 As shown.

[0090] To ensure the accuracy of the placement of the square bar 61 on the feeding track 53, several sets of baffles 54 are provided at one end of the feeding track 53 near the square opening 10 to prevent the square bar 61 from shifting. The baffles 54 are arranged side by side with gaps on both sides of the feeding track 53 along the length direction of the feeding track 53. The baffles 54 arranged on both sides of the feeding track 53 can be aligned or staggered, both of which can achieve the purpose of preventing the square bar 61 from shifting.

[0091] like Figure 6 As shown, the length of the unloading platform 51 is not less than the length of the collecting box 52, and is compatible with the sum of the lengths of the loading platform 41 and the preparation platform 42. Two parallel placement slots are provided along the width direction of the collecting box 52, with the spacing between the slots not exceeding the width of the square bar 61. When any set of aligned edge pieces 62 fall, the collecting box 52 is moved to directly below the wafer rod 60 located outside the square compartment 10, and the two placement slots of the collecting box 52 are symmetrically arranged with respect to the length axis of the wafer rod 60, with the edge pieces 62 on both sides falling into the two placement slots respectively. The collecting box 52 remains positioned at the edge piece collection point until both sets of aligned edge pieces 62 in the wafer rod 60 are completely collected by the placement slots. Then, the collecting box 52 moves the edge pieces 62 back to their initial position, which is the end of the sliding bar 31 away from the loading platform 41.

[0092] like Figure 7 As shown, while the collection box 52 retracts, the unloading platform 51 is driven by external force to move towards the position where the square bar 61 is located, that is, between the squaring chamber 10 and the sliding table 31, until the unloading track 53 is directly below the square bar 61; then the unloading platform 51 is controlled to move vertically upward until the rubber roller in the unloading track 53 is in complete contact with the square bar 61, and then the top clamping mechanism 20 is released. After the top clamping mechanism 20 releases the square bar 61, it remains in place, waiting for the next set of wafer bars 60 to be squared to be loaded; the unloading platform 51 drives the square bar 61 down to the initial height, and then retracts along the sliding bar 31 to the position coaxial with the unloading turnover table. Thus, the unloading of the square bar 61 is completed.

[0093] As the unloading platform 51 receives and retracts the square bar 61, a new wafer bar 60 to be squared, placed on the preparation platform 42, is clamped by two clamping fasteners 421 and gradually driven to the position of the top clamping mechanism 20. After the main top shaft 21 of the top clamping mechanism 20 secures the end face of the square bar 61 of the wafer bar 60, the secondary top shaft 22 then secures any set of aligned edge skin 62 positions of the wafer bar 60. Simultaneously, the clamping fasteners 421 open their grippers and release the wafer bar 60. At this time, the clamping fasteners 421 remain stationary, while the top clamping mechanism 20 is driven and the suspension arm 23 controls the main top shaft 21 and the secondary top shaft 22 carrying the wafer bar 60 to move together along the length of the wafer bar 60 into the squared opening chamber 10. After the top clamping mechanism 20 places the wafer bar 60 into the squared opening chamber 10, the four side doors of the squared opening chamber 10 are closed, ready for squared opening and edge skin removal. Meanwhile, the clamping fastener 421 in the preparation table 42 remains open, and the empty preparation table 42 returns to its initial position, waiting for the next set of new wafer rods 60 to be prepared.

[0094] A method for controlling the square root extraction of a wafer ingot, employing the control system described in any of the preceding claims, includes the following steps:

[0095] Based on the number of groups of alignment edge skins 62 in the wafer rod 60, each group of alignment edge skins 62 is cut sequentially in the square root chamber 10, and after each group of alignment edge skins 62 is cut, the group of edge skins 62 is collected between the square root chamber 10 and the moving platform 30.

[0096] The unloading mechanism 50 is controlled to acquire the square bar 61 without edge skin, and at the same time the loading mechanism 40 is controlled to load the new wafer bar 60 to be squared into the squaring chamber 10 near the opening of the moving platform 30.

[0097] Furthermore, before the wafer ingot 60 is loaded into the square-opening chamber, the process also includes fixing the wafer ingot 60 in the preparation table 42, the steps of which include:

[0098] Control the wafer ingot to be fed from the loading station along the loading track to the preparation station;

[0099] Control the clamping device on the side of the material preparation table near the loading table to move the wafer rod toward the end near the square opening chamber;

[0100] First, control the wafer rod 60 removed from the loading turntable to enter the loading table 41.

[0101] Then control the loading platform 41 to automatically rise to the same height as the preparation platform 42.

[0102] The wafer ingot 60 is then driven to move from the loading platform 41 along the loading track 43 to the preparation platform 42. At this time, both clamps 421 in the preparation platform 42 are open. Correspondingly, the loading platform 41 falls to its original height position, ready to receive the next set of new wafer ingots 60 moved in from the loading turnover table.

[0103] After the wafer ingot 60 has fully entered the preparation table 42, the two grippers of the clamping device 421 on the side near the loading table 41 are controlled to move relative to each other along the width direction of the preparation table 42, so as to tighten its width and prevent it from contacting the outer wall surface of the wafer ingot 60, and to make the pull rod 423 provided on the clamping device 421 directly opposite to the end face of the wafer ingot 60 on the side near the loading table 41.

[0104] The clamping fastener 421, which is driven to the side of the loading platform 41, drives the pull rod 423 to first contact the end face of the wafer ingot 60. Then, the pull rod 423 continues to pull the wafer ingot 60 along the loading track 43 toward the end closer to the square chamber 10, until the end face of the wafer ingot 60 away from the loading platform 41 abuts against the stop block 422 set on the loading track 43 in the preparation platform 42, thereby completing the positioning of the wafer ingot 60 on the preparation platform 42.

[0105] Then drive the clamping device 421 near the loading table 41 to move back to the end near the loading table 41 and fix it in a position symmetrically arranged with another clamping device 421 along the length centerline of the wafer rod 60. Then control all clamping devices 421 to retract and completely clamp the wafer rod 60.

[0106] The drive loading table 41 moves the wafer rod 60 along the length of the sliding bar 31 to the door of the square opening chamber 10 near the sliding table 31, that is, it moves to the area between the main top axis 21 and the secondary top axis 22, which are pre-set between the square opening chamber 10 and the sliding bar 31.

[0107] Furthermore, the top clamping mechanism 20 clamps the wafer ingot 60, and the specific operation process includes:

[0108] The clamping mechanism 20 is pre-set between the squaring chamber 10 and the sliding stage 31, and the main top spindle 21 and the secondary top spindle 22 are suspended relative to each other at both ends of the wafer rod 60. The control suspension arm 23 drives the main top spindle 21 and the secondary top spindle 22 to a position at the same height as the wafer rod 60.

[0109] First, control the end face position of the preset square bar 61 in the wafer rod 60 that is fixed by the main top shaft 21; then control the end face position of any set of aligned edge skins 62 in the wafer rod 60 that is fixed by the secondary top shaft 22.

[0110] After the top clamping mechanism 20 fully clamps both ends of the wafer rod 60, the clamping jaws of the clamping device 421 in the preparation stage 42 slowly open outward to release the wafer rod 60.

[0111] Then, the top clamping mechanism 20 is controlled to drive the wafer ingot 60 through the space between the clamping members 421 and into the square opening chamber 10 for cutting. At the same time, the material preparation table 42 is controlled to move along the length of the sliding bar 31 and return to its initial position, waiting for the next set of wafer ingots 60 to be loaded.

[0112] Furthermore, the collection box 52 is controlled to collect the edge skin 62, and the specific steps include:

[0113] After the edge 62 is cut off, the top frame mechanism 20 moves the wafer rod 60 out of the square box 10 and to the position where the wafer rod 60 is loaded and handed over, that is, between the square box 10 and the sliding table 31.

[0114] Then control the collection box 52 to move from below the unloading platform 51 to directly below the wafer rod 60 that has been taken out of the open squaring chamber 10, and make the two placement slots in the collection box 52 located on both sides of the axis of the wafer rod 60.

[0115] The secondary top shaft 22 is released synchronously, and the aligned edge skin 62 falls synchronously into the placement slot corresponding to it; the collection box 52 remains fixed.

[0116] Repeat the above steps until another set of matching edge skins 62 are collected, then control the collection box 52 to retract to its initial position.

[0117] Furthermore, after collecting all the corresponding edge skins, the process also includes collecting the square bars 61 without edge skins, specifically including:

[0118] Control the unloading platform 51 to move along the length of the sliding bar 31 to directly below the square bar 61.

[0119] Then drive the unloading platform 51 to rise until it contacts the lower end face of the square bar 61.

[0120] Release the main top shaft 21 to place the square bar 61 on the unloading track 53 on the unloading platform 51. After the square bar 61 is placed stably, control the unloading platform 51 to descend to its initial height position and drive the square bar 61 back to the initial position of the unloading platform 51.

[0121] At this point, the new wafer rod 60, which has been placed on the preparation table 42, is moved to the top clamping mechanism 20 directly below it.

[0122] Compared with the existing technology, the comparison of the time taken for feeding, squaring, edge trimming 62 and unloading of any group of wafer rods 60, as well as the comparison of equipment utilization rate, are shown in Table 1. As can be seen from Table 1, the squaring time of each group of wafer rods is shortened to 18-22 minutes, and the equipment utilization rate is increased to 95-97%.

[0123] Table 1. Technical effects of this control method compared to existing technologies.

[0124]

[0125] Compared with existing technologies, the above-mentioned technical solution utilizes opposite-side transfer for loading the wafer ingots to be squared and unloading the wafer ingots after edge trimming. It also allows for simultaneous loading of the next round of wafer ingots to be squared and unloading of the previous round of edge-trimmed wafer ingots. This not only improves the safety of silicon ingot turnover but also ensures seamless connection between loading and unloading operations, resulting in high production efficiency. The overall processing time is reduced to 18-22 minutes, and equipment uptime is increased to 95-97%. The separately designed edge-trimming collection structure reduces collisions between edge trimmers and between edge trimmers and the wafer ingots, ensuring silicon ingot quality.

[0126] The embodiments of the present invention have been described in detail above. These descriptions are merely preferred embodiments and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A wafer ingot squaring control system, characterized in that, include: A squaring chamber for removing the edge of a wafer rod and a movable platform placed at the end of the squaring chamber; The mobile platform is equipped with a loading mechanism and a unloading mechanism, which are arranged on opposite sides of the squaring bin. The loading mechanism can simultaneously deliver a new wafer to be squared to the squaring bin when the unloading mechanism collects all the edge pieces and removes the squared wafer. The feeding mechanism includes: A loading platform fixed to one end of a sliding table outside the square box; A material preparation platform is located near the side of the open-cell bin and cooperates with the loading platform; Both the loading platform and the preparation platform are equipped with coaxial loading tracks, and the loading tracks are also equipped with stops for positioning the wafer rods. The preparation table is also equipped with two sets of clamping devices for gripping the wafer rods; The clamping member away from the stop is provided with a pull rod. The pull rod is driven by the clamping member to pull the wafer rod towards the end closer to the stop, and the wafer rod is fixed to the material preparation table by the stop. The pull rod has an L-shaped structure and is horizontally arranged along the length of the material preparation table. One end of the rod is fixed to the side wall of the clamping device near the loading table, away from the stop block, and the other end is suspended in the air.

2. The wafer ingot squaring control system according to claim 1, characterized in that, The squaring chamber is equipped with a clamping mechanism for securing the wafer rod, the clamping mechanism including a main clamping shaft and a secondary clamping shaft that are suspended. The main top shaft is used to secure the end face of the square bar in the wafer rod. The secondary top shaft is used to secure the end face of the edge skin in the wafer rod, which is positioned according to the alignment criteria. The main top shaft and the secondary top shaft can move together along the length of the squaring chamber to the mobile platform.

3. A wafer ingot squaring control system according to claim 1 or 2, characterized in that, The mobile platform includes the sliding table. The feeding mechanism and the unloading mechanism are both arranged parallel to the length direction of the square bin and perpendicular to the length direction of the sliding table. The feeding mechanism and the unloading mechanism are independently slidable along the length direction of the sliding table.

4. The wafer ingot squaring control system according to claim 3, characterized in that, The position of the loading track placed in the preparation platform is fixed and higher than the initial position of the loading track placed in the preparation platform; and the loading platform can move up and down in the vertical direction so that the wafer rod placed on the loading platform moves along the loading track to the preparation platform.

5. A wafer ingot squaring control system according to claim 3, characterized in that, The clamping device includes two opposing clamps, each with a C-shaped inner wall; the feeding track, placed in the material preparation table, passes through the clamping area enclosed by the clamps.

6. A wafer ingot squaring control system according to claim 4, characterized in that, The stop block is located on the feeding track in the material preparation platform, near the end of the square bin. The clamping device near the stop block can move along the width direction of the material preparation table; The clamping device, which is away from the stop, can move along the width and length of the preparation table.

7. A wafer ingot squaring control system according to any one of claims 4-6, characterized in that, The unloading mechanism is located at one end of the sliding table away from the loading mechanism, and includes an unloading platform partially fixed to the sliding table and a collection box for collecting the edge skins; The unloading platform is located above the collection box and is controlled independently of the collection box; The unloading platform can move vertically up and down to receive the squared wafer rod and move it to the unloading turnover table.

8. A wafer ingot squaring control system according to claim 7, characterized in that, The unloading platform is equipped with a unloading track; Both the unloading track and the loading track are equipped with several rubber rollers; The rubber rollers in the feeding track are all horizontally arranged; The rubber rollers in the feeding track are all arranged obliquely upwards and facing each other; The feeding track is provided with several sets of baffles near the squaring chamber to prevent the wafer rod from shifting after squaring. The baffles are arranged side by side with gaps on both sides of the feeding track along the length of the feeding track.

9. A wafer ingot squaring control system according to claim 8, characterized in that, Two placement slots are provided side by side along the width direction of the collection box, and the distance between the placement slots is not greater than the width of the square rooted wafer rod; When the edge skins of any pair of aligned units fall, the collection box is moved to a position directly below the wafer rod outside the square compartment, and the two placement slots are symmetrically arranged with respect to the length axis of the wafer rod.

10. A method for controlling the square root of a wafer ingot, characterized in that, The control system described in any one of claims 1-9 includes the following steps: Based on the number of alignment edge groups in the wafer rod, each alignment edge group is cut sequentially in the squaring chamber, and after each alignment edge group is cut, the edge group is collected between the squaring chamber and the moving platform. The unloading mechanism is controlled to acquire the wafer ingot without edge skin, and the loading mechanism is simultaneously controlled to load a new wafer ingot to be squared into the squaring chamber.

11. The method for controlling the square root of a wafer ingot according to claim 10, characterized in that, Before the wafer ingot is loaded into the square-opening chamber, the method further includes fixing the wafer ingot in the preparation table, the steps of which include: Control the wafer ingot to be fed from the loading station along the loading track to the preparation station; The clamping device on the side of the material preparation table near the loading table is controlled to move the wafer rod towards the end near the square opening chamber; wherein, the square opening chamber is equipped with a top clamping mechanism for securing the wafer rod. The side of the wafer rod away from the loading platform abuts against the stop block placed on the loading track; Control all the clamping devices to grip the wafer rod; The loading platform is driven to move the wafer rod to the squaring chamber near the door of the moving platform.

12. The method for controlling the square root of a wafer ingot according to claim 11, characterized in that, The squaring chamber is equipped with a clamping mechanism for securing the wafer ingot. During the clamping process, the steps include: The top clamping mechanism is suspended idly between the squaring chamber and the moving platform, and is pre-positioned at both ends of the wafer rod; The main top shaft in the top clamping mechanism is controlled to secure the pre-set end face of the square bar in the wafer rod. Control the secondary top shaft in the top clamping mechanism to fix the end face of any set of aligned edge skins in the wafer rod; The top clamping mechanism drives the wafer rod through the clamping device and into the squaring chamber in preparation for cutting; The material preparation table causes the opened clamping components to retract.

13. A method for controlling the square root extraction of a wafer ingot according to claim 11 or 12, characterized in that, The process of collecting edge skins includes: The feeding mechanism includes a feeding platform partially fixed to the sliding table, and controls the collection box in the feeding mechanism for collecting the edge skin to move from below the feeding platform to directly below the wafer rod that has been taken out of the squaring chamber; Two parallel placement slots are provided along the width of the collection box. Loosen the secondary top shaft in the top clamping mechanism and let the aligned edge skin fall into the placement slot corresponding to it. Repeat the above steps until all the corresponding edge skins have been collected; Control the collection box to retract to its initial position.

14. The method for controlling the square root of a wafer ingot according to claim 13, characterized in that, After collecting all aligned edge skins, the process also includes collecting the edge-free wafer rod, comprising: Control the unloading platform to move directly below the wafer ingot; Drive the unloading platform to rise until it contacts the lower end face of the wafer rod; Release the main top shaft in the top clamping mechanism to place the wafer rod on the unloading stage; The unloading platform is controlled to drive the wafer rod back to its initial position.

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