Optical drive and camera module

Abstract

The application provides an optical driving device, which comprises a mounting plate arranged in a horizontal direction and used for mounting an image sensor, a frame electrically connected with an external driving circuit and arranged in a spaced manner with the mounting plate, and a plurality of suspension wire groups connecting the mounting plate and the frame, and the optical driving device further comprises a plurality of driving lines electrically connected with the frame and the mounting plate, and at least part of the driving lines are driven by the external driving circuit to drive the mounting plate to move in a vertical direction relative to the frame. The driving lines of the application are controlled by the external driving circuit to drive the mounting plate to move in the vertical direction relative to the frame, so as to realize zooming or focusing of the image sensor in the vertical direction, and meet the development trend of structure simplification, integration and thinning.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and in particular to an optical driving device and a camera module. BACKGROUND

[0002] With the development of electronic technology, the photographing performance of electronic equipment becomes more and more powerful. When the existing electronic equipment takes a picture, it can not only automatically focus, but also automatically anti-shake.

[0003] At present, when the electronic equipment takes a picture, the automatic focusing and the automatic anti-shake are realized by a driving device arranged in the electronic equipment. Specifically, the driving device includes a focusing driving motor and an anti-shake driving device. The focusing driving motor drives the lens to move along the lens optical axis direction to realize the automatic focusing function, and the anti-shake driving device drives the image sensor to move in the plane perpendicular to the lens optical axis to realize the automatic anti-shake function.

[0004] For example, in Chinese patent CN108780207B, a camera is disclosed, which includes an optical assembly that can carry one or more lenses, an axial motion voice coil motor, a lateral motion voice coil motor, and an image sensor for capturing a digital representation of light passing through the lenses. The axial motion voice coil motor is used to focus light from the lenses on the image sensor by moving the optical assembly containing the lenses along the optical axis of the lenses, and the axial motion voice coil motor includes a suspension assembly for movably mounting a lens holder to an actuator base, a plurality of shared magnets mounted to the actuator base, and a focus coil fixedly mounted to the lens holder and mounted to the actuator base through the suspension assembly. The lateral motion voice coil motor can include an image sensor frame member, one or more flexible members for mechanically connecting the image sensor frame member to a frame of the lateral motion voice coil motor, and a plurality of OIS coils. The OIS coils can be mounted to a dynamic platform within a magnetic field of the shared magnets for generating forces for moving the dynamic platform in a plurality of directions orthogonal to the optical axis of the lenses 104. The camera drives the lens to move in the optical axis direction (Z) through the axial motion voice coil motor to focus the light from the lens on the image sensor, thereby realizing the function of automatic focusing (Auto Focus, AF), and drives the image sensor to move in a plurality of directions (XY) orthogonal to the optical axis through the lateral motion voice coil motor, thereby realizing the function of optical image stabilization or optical anti-shake (Optical Image Stabilizer, OIS). In this patent, two different devices are needed to realize the two functions of focusing and anti-shake, which not only increases the manufacturing cost, but also occupies more space, which is not conducive to miniaturization.

[0005] Therefore, it is necessary to provide a new optical driving device and a camera module. SUMMARY

[0006] In order to overcome the defects of the prior art, the present application proposes a new optical drive device and a camera module.

[0007] The first technical solution adopted by the present application to solve the problems of the prior art is:

[0008] An optical drive device comprises a mounting plate arranged in a horizontal direction and used for mounting an image sensor, a frame electrically connected with an external drive circuit and arranged in a spaced manner with the mounting plate, and a plurality of suspension wire groups connecting the mounting plate and the frame, the optical drive device further comprises a plurality of drive lines electrically connected with the frame and the mounting plate, at least part of the drive lines in the plurality of drive lines drive the mounting plate to move in a vertical direction relative to the frame through the external drive circuit.

[0009] Further, the mounting plate is in a planar structure, the frame is in a three-dimensional structure, and the frame comprises side plates arranged in a vertical direction, and at least part of the drive lines are electrically connected between the side plates and the mounting plate.

[0010] Further, the frame is integrally formed.

[0011] Further, the plurality of drive lines comprises a pair of third drive lines inclined upward from the mounting plate and connected to the frame, and a pair of fourth drive lines inclined downward from the mounting plate and connected to the frame, the third drive lines and the fourth drive lines are deformed in extension and contraction to drive the mounting plate to move up and down in the vertical direction.

[0012] Further, the plurality of drive lines further comprises a pair of first drive lines arranged in a horizontal first direction and a pair of second drive lines arranged in a horizontal second direction, the first direction and the second direction are in the same plane, the first direction and the second direction intersect and are perpendicular to each other, the first drive lines and the second drive lines are deformed in extension and contraction to drive the mounting plate to move in the first direction and the second direction.

[0013] Further, the drive lines are SMA lines made of shape memory alloys (SMA), the external drive circuit controls the current of the SMA lines, and the SMA lines are deformed or restored to the original state under the action of the current.

[0014] Further, the frame comprises a base plate arranged in a horizontal direction and a plurality of pairs of side plates arranged in a vertical direction.

[0015] Further, the substrate and the mounting plate are arranged in parallel and spaced apart in a vertical direction, the substrate has an opening extending in the vertical direction, an inner edge facing the opening, and an outer edge arranged opposite to the inner edge, and each of the plurality of the suspension wire groups is arranged vertically and connected to the inner edge and a peripheral edge of the mounting plate.

[0016] Further, the pair of the first driving lines are arranged in alignment or misalignment along the first direction, and the pair of the second driving lines are arranged in alignment or misalignment along the second direction.

[0017] Further, the frame includes a substrate arranged horizontally and a plurality of pairs of the side plates arranged vertically, each pair of the side plates has a same height, the pair of the first driving lines extend in a horizontal plane and are connected between a pair of the side plates arranged opposite along the first direction and the mounting plate, and the pair of the second driving lines extend in the horizontal plane and are connected between another pair of the side plates arranged opposite along the second direction and the mounting plate, the side plates are perpendicular to the substrate, and the side plates connected to the first driving lines and the side plates connected to the second driving lines have a same height.

[0018] Further, a pair of the third driving lines are connected between a pair of the side plates and the mounting plate, and a pair of the fourth driving lines are connected between another pair of the side plates and the mounting plate, the side plates connected to the third driving lines have a height greater than the height of the side plates connected to the first driving lines, and the side plates connected to the fourth driving lines have a height less than the height of the side plates connected to the first driving lines.

[0019] Further, a projection of the third driving lines on a horizontal plane is arranged along a fourth direction, and a projection of the fourth driving lines on the horizontal plane is arranged along a fifth direction, the fourth direction and the fifth direction are directions along two opposite sides of the mounting plate.

[0020] Further, the outer edge of the substrate includes a pair of first edges arranged opposite along the first direction and a pair of second edges arranged opposite along the second direction, the plurality of pairs of the side plates includes a pair of first side plates and a pair of second side plates, the pair of the first side plates are connected to the pair of the first edges, and the pair of the second side plates are connected to the pair of the second edges, the first side plates and the second side plates are perpendicular to the substrate, the pair of the first driving lines are connected between the pair of the first side plates and the mounting plate, and the pair of the second driving lines are connected between the pair of the second side plates and the mounting plate.

[0021] Further, the outer edges of the substrate further include a pair of third edges arranged opposite along one diagonal direction and a pair of fourth edges arranged opposite along another diagonal direction, the plurality of side plates further include a pair of first corner plates respectively connected to the pair of third edges and a pair of second corner plates respectively connected to the pair of fourth edges, the first and second corner plates are perpendicular to the substrate, a pair of third driving lines are respectively connected between the pair of first corner plates and the mounting plate, and a pair of fourth driving lines are respectively connected between the pair of second corner plates and the mounting plate.

[0022] Further, the inner edges of the substrate include a pair of first inner edges arranged opposite along a first direction and a pair of second inner edges arranged opposite along a second direction, the plurality of suspension wire groups include a pair of first suspension wire groups and a pair of second suspension wire groups, the pair of first suspension wire groups are respectively connected between the pair of first inner edges and the mounting plate, and the pair of second suspension wire groups are respectively connected between the pair of second inner edges and the mounting plate.

[0023] Further, the suspension wire groups are integrally formed with the substrate and / or the mounting plate, or the suspension wire groups are independently formed relative to the substrate and / or the mounting plate, and the suspension wire groups are electrically connected to the mounting plate and / or the substrate by welding or adhesion.

[0024] Further, the driving lines are connected to the mounting plate and the frame by welding through conductive sheets, or the driving lines are connected to the mounting plate and the frame by mechanical clamping through clamping claws.

[0025] Further, a base supporting the frame is further included, and the frame further includes an integrated extension formed docking portion for connecting with the external driving circuit.

[0026] Further, the mounting plate is independently formed relative to the frame and the suspension wire groups, and the mounting plate is a ceramic substrate formed by a direct plating copper (DPC) process.

[0027] The second technical solution adopted by the present application to solve the problems in the prior art is:

[0028] A camera module includes an image sensor and the optical driving device, and the image sensor is mounted on the mounting plate of the optical driving device.

[0029] Further, the camera module further comprises a lens module arranged on the top side of the image sensor and a driving assembly for controlling the lens module, the driving assembly comprising at least one pair of coils and one pair of magnetic elements matched with the pair of coils, the pair of coils and the pair of magnetic elements interacting to drive the lens module to move in the vertical direction and / or the horizontal plane.

[0030] The driving line of the present application is controlled by an external driving circuit to drive the mounting plate to move relative to the frame in the vertical direction, thereby realizing zooming or focusing of the image sensor in the vertical direction, which conforms to the development trend of structure simplification, integration and thinning. BRIEF DESCRIPTION OF DRAWINGS

[0031] The above-mentioned purposes, technical solutions and advantages of the present application can be realized by the following drawings:

[0032] Figure 1 is a structural schematic diagram of an optical driving device of the first embodiment of the present application.

[0033] Figure 2 is Figure 1 is a structural schematic diagram of another view of the optical driving device shown in the figure.

[0034] Figure 3 is a structural schematic diagram of an optical driving device of the second embodiment of the present application.

[0035] Figure 4 is Figure 3 is a structural schematic diagram of another view of the optical driving device shown in the figure.

[0036] Figure 5 is a structural schematic diagram of an optical driving device of the third embodiment of the present application.

[0037] Figure 6 is Figure 5 is a structural schematic diagram of another view of the optical driving device shown in the figure.

[0038] Element Symbol

[0039] 100, optical drive device; 10, frame; 11, base plate; 110, opening; 111, first edge; 112, second edge; 113, third edge; 114, fourth edge; 115, butt joint; 15, inner edge; 151, first inner edge; 152, second inner edge; 12, side plate; 121, first side plate; 122, second side plate; 13, first diagonal plate; 14, second diagonal plate; 20, mounting plate; 21, first mounting edge; 22, second mounting edge; 23, third mounting edge; 24, fourth mounting edge; 30, suspension wire group; 31, first suspension wire group; 32, second suspension wire group; 41, first SMA wire; 42, second SMA wire; 43, third SMA wire; 44, fourth SMA wire; 50, conductive sheet. DETAILED DESCRIPTION

[0040] The application will be further described below in conjunction with the accompanying drawings of the embodiments.

[0041] Patent CN108780207B discloses a camera module, the camera module includes a lens module, an image sensor and a driving assembly, the driving assembly includes a plurality of magnetic elements and a coil, the driving assembly is used for focusing light from the lens on the image sensor by moving the lens assembly containing the lens along the optical axis, thereby realizing the function of Auto Focus (AF).

[0042] The present application provides a camera module, the camera module of the present application can also have the above structure, especially when the camera module of the present application is applied to electronic products such as mobile phones, tablet computers and the like as a rear camera module. The camera module includes an image sensor and an optical drive device, the image sensor is mounted on the mounting plate of the optical drive device. The camera module further includes a lens module arranged on the top side of the image sensor and a driving assembly for controlling the lens module, the driving assembly includes at least one pair of coils and one pair of magnetic elements matched with the pair of coils, the pair of coils and the pair of magnetic elements interact to drive the lens module to move in the vertical direction and / or the horizontal plane. The present application focuses on the optical drive device for driving the image sensor, which is as follows:

[0043] As Figures 1 to 6 shown, the optical drive device 100 provided by each embodiment of the present application is used to mount an image sensor assembly (not shown) and can drive the image sensor assembly to move along the horizontal X, Y axes and along the vertical Z axis direction, or even rotate in each direction around the X, Y or Z axis. The optical drive device 100 of the present application, after cooperating with the image sensor assembly, can be mounted below the voice coil motor to form a camera module together, thereby better realizing the functions of camera module anti-shake, focusing and zooming by controlling the displacement of the image sensor.

[0044] AsFigure 1 With Figure 2 As shown in FIG. 1, the first embodiment of the present application discloses an optical driving device 100, which comprises a mounting plate 20 for mounting an image sensor (not shown), a frame 10 for supporting the mounting plate 20, and four suspension wire sets 30 connecting the mounting plate 20 and the frame 10. The image sensor driving mechanism 100 further comprises a plurality of driving lines controlled by an external driving circuit to generate driving force for the mounting plate 20. In the present embodiment, the driving lines are SMA lines made of Shape Memory Alloys (SMA), and the external driving circuit controls the current of the SMA lines to make the SMA lines deform or restore to the original shape. In the present embodiment, the driving lines, i.e. the SMA lines, specifically comprise a pair of first SMA lines 41, a pair of second SMA lines 42, a pair of third SMA lines 43, and a pair of fourth SMA lines 44. The frame 10 has a three-dimensional structure and drives the mounting plate 20 to move horizontally in the first direction and the second direction and vertically in the third direction by the above-mentioned pairs of first SMA lines 41, second SMA lines 42, third SMA lines 43, and fourth SMA lines 44, thereby realizing the anti-shake function of the image sensor in the first direction and the second direction and the zooming or focusing or anti-shake function in the third direction. Specifically, the frame 10 is electrically connected to the pairs of first SMA lines 41, second SMA lines 42, third SMA lines 43, and fourth SMA lines 44, and both ends of the first SMA lines 41, second SMA lines 42, third SMA lines 43, and fourth SMA lines 44 are respectively connected to the frame 10 and the mounting plate 20, so as to realize the left and right movement and the forward and backward movement of the mounting plate 20 in the plane of the first direction and the second direction and the upward and downward movement of the mounting plate 20 in the third direction by the pairs of first SMA lines 41, second SMA lines 42, third SMA lines 43, and fourth SMA lines 44.

[0045] The first SMA wire 41, the second SMA wire 42, the third SMA wire 43 and the fourth SMA wire 44 are made of shape memory alloy (SMA), which is an alloy material that can completely eliminate the deformation occurred at a lower temperature and restore the original shape before deformation after heating and temperature rising, i.e., an alloy having a "memory" effect. For example, the first SMA wire 41, the second SMA wire 42, the third SMA wire 43 and the fourth SMA wire 44 can be made of any suitable SMA wire material such as Nitinol or titanium alloy. Shape memory alloy (SMA) is a thermoelastic martensitic phase change material, which can produce phase change when temperature changes, and thus the stress state also changes. At a low temperature state, the SMA is in a martensitic phase state; when the temperature rises, the SMA is converted from the martensitic phase to the austenitic phase and produces deformation contraction. When the SMA wire is heated by passing current, the SMA wire deforms and contracts and pulls the mounting plate, thereby driving the image sensor to move. When the temperature decreases, the SMA wire is converted from the austenitic phase to the martensitic phase, so that the stress is reduced and the mounting plate returns to the original position under the elastic restoring force of the suspension wire. In the present application, when the SMA wire is heated by passing current, the SMA wire deforms and contracts and pulls the mounting plate 20, thereby driving the image sensor to move. When the temperature decreases, the SMA wire is cooled to the martensitic phase state, so that the stress is reduced and the length is restored, and the mounting plate 20 returns to the original position under the elastic restoring force of the suspension wire group 30.

[0046] The mounting plate 20 is driven to move left and right and forward and backward in the plane of the first and second directions by the two first SMA wires 41 and the two second SMA wires 42 extending horizontally between the frame 10 and the mounting plate 20, and is driven to move up and down in the third direction by the two third SMA wires 43 and the two fourth SMA wires 44 extending obliquely. In the present embodiment, the first direction and the second direction are in the same plane and perpendicular to each other, and the third direction is perpendicular to the plane of the first direction and the second direction, i.e., the first direction is the X direction, the second direction is the Y direction, and the third direction is the Z direction.

[0047] The frame 10 and the suspension wire group 30 of the present application each include an insulating substrate (not shown) and a conductive pattern (not shown) formed on the insulating substrate, and the two are connected to each other through the conductive pattern to realize electrical connection. The mounting plate 20 can be selected to have the same conductive pattern structure as the frame 10 and the suspension wire group 30, and the three can be formed on the same insulating substrate at the same time. In one embodiment, after the three are formed, the suspension wire group 30 and the mounting plate 20 are cut, and the suspension wire group 30 is bent relative to the frame 10, and finally the cut mounting plate 20 is welded and fixed with the suspension wire group 30. In another embodiment, after the three are formed, the suspension wire group 30 and the frame 10 are cut, and the suspension wire group 30 is bent relative to the mounting plate 20, and finally the cut frame 10 is welded and fixed with the suspension wire group 30.

[0048] In the preferred embodiment of the present application, the mounting plate 20 can also be separately formed, and a ceramic substrate formed by a direct plating copper (DPC) process can be used to increase structural strength and improve heat dissipation.

[0049] Specifically, the frame 10 includes a substrate 11 including two first edges 111 arranged opposite in the X direction and two second edges 112 arranged opposite in the Y direction, and four side plates 12 connected to the two first edges 111 and the two second edges 112 of the substrate 11, respectively, and the side plates 12 are bent at an angle relative to the substrate 11. In this embodiment, the substrate 11 is horizontally arranged, the side plates 12 are vertically arranged, and the four side plates 12 have the same height. The four side plates 12 include two first side plates 121 arranged opposite in the X direction and two second side plates 122 arranged opposite in the Y direction. The mounting plate 20 includes two first mounting edges 21 arranged opposite in the X direction and two second mounting edges 22 arranged opposite in the Y direction, and the two first mounting edges 21 are arranged corresponding to the upper edges of the two first side plates 121, respectively, and the two second mounting edges 22 are arranged corresponding to the upper edges of the two second side plates 122, respectively. One of the first SMA wires 41 extends in the horizontal plane and is connected between the upper edges of one pair of opposite first side plates 121 and the first mounting edges 21 of the mounting plate 20, and the other first SMA wire 41 extends in the horizontal plane and is connected between the upper edges of the other pair of opposite first side plates 121 and the first mounting edges 21 of the mounting plate 20. One of the second SMA wires 42 extends in the horizontal plane and is connected between the upper edges of one pair of opposite second side plates 122 and the second mounting edges 22 of the mounting plate 20, and the other second SMA wire 42 extends in the horizontal plane and is connected between the upper edges of the other pair of opposite second side plates 122 and the second mounting edges 22 of the mounting plate 20.

[0050] Specifically, the two first side plates 121 and the mounting plate 20 are connected by two first SMA wires 41 arranged in the horizontal plane to drive the mounting plate 20 to move forward and backward along the X direction in the plane of the X and Y directions.

[0051] In the present embodiment, the two first SMA wires 41 are arranged in alignment along the X direction, and the two second SMA wires 42 are arranged in alignment along the Y direction. In other embodiments, the two first SMA wires 41 are arranged staggered with respect to each other along the X direction and / or the two second SMA wires 42 are arranged staggered with respect to each other along the Y direction, to drive the mounting plate 20 to translate left and right and forward and backward in the plane of the X and Y directions, while generating a torque to further drive the mounting plate 20 to rotate in the plane of the X and Y directions, thereby achieving the function of anti-shake rotation of the image sensor along the Z axis.

[0052] The substrate 11 further comprises two third edges 113 arranged opposite along a first diagonal direction and two fourth edges 114 arranged opposite along a second diagonal direction, the first diagonal direction and the second diagonal direction intersecting, in the present embodiment, the first diagonal direction and the second diagonal direction intersecting, in the preferred embodiment of the present application, the first diagonal direction and the second diagonal direction being perpendicular to each other. The third edge 113 is located between and connecting the first edge 111 and the second edge 112, and the fourth edge 114 is located between and connecting the first edge 111 and the second edge 112. The mounting plate 20 comprises two third mounting edges 23 arranged opposite along the first diagonal direction and two fourth mounting edges 24 arranged opposite along the second diagonal direction.

[0053] The frame 10 further comprises two first diagonal plates 13 respectively connected to the two third edges 113 of the base plate 11, and two second diagonal plates 14 respectively connected to the two fourth edges 114 of the base plate 11, the first and second diagonal plates 13 and 14 are both angularly bent with the base plate 11, in the embodiment, the first and second diagonal plates 13 and 14 are both vertically arranged, the height of the first diagonal plate 13 is greater than the height of the side plate 12, and the height of the second diagonal plate 14 is less than the height of the side plate 12. The two third mounting edges 23 of the mounting plate 20 are respectively arranged corresponding to the upper edges of the two first diagonal plates 13, and the two fourth mounting edges 24 of the mounting plate 20 are respectively arranged corresponding to the upper edges of the two second diagonal plates 14. One of the third SMA wires 43 is obliquely extended and connected between the upper edges of one pair of oppositely arranged first diagonal plates 13 and the third mounting edges 23 of the mounting plate 20, and the other third SMA wire 43 is obliquely extended and connected between the upper edges of the other pair of oppositely arranged first diagonal plates 13 and the third mounting edges 23 of the mounting plate 20. One of the fourth SMA wires 44 is obliquely extended and connected between the upper edges of one pair of oppositely arranged second diagonal plates 14 and the fourth mounting edges 24 of the mounting plate 20, and the other fourth SMA wire 44 is obliquely extended and connected between the upper edges of the other pair of oppositely arranged second diagonal plates 14 and the fourth mounting edges 24 of the mounting plate 20. Specifically, the third SMA wire 43 is obliquely extended upward from the third mounting edge 23 of the mounting plate 20 and connected to the upper edge of the first diagonal plate 13, and the fourth SMA wire 44 is obliquely extended downward from the fourth mounting edge 24 of the mounting plate 20 and connected to the upper edge of the second diagonal plate 14.

[0054] The third SMA wire 43 is obliquely extended upward from the third mounting edge 23 of the mounting plate 20 to the upper edge of the first diagonal plate 13 to drive the upward movement of the mounting plate 20 in the Z direction, and the fourth SMA wire 44 is obliquely extended downward from the fourth mounting edge 24 of the mounting plate 20 to the upper edge of the second diagonal plate 14 to drive the downward movement of the mounting plate 20 in the Z direction.

[0055] It can be understood that the third and fourth edges 113 and 114, the first and second diagonal plates 13 and 14 corresponding to the third and fourth edges 113 and 114, and the third and fourth mounting edges 23 and 24 corresponding to the first and second diagonal plates 13 and 14 in the present application are all corner structures arranged for the convenience of automatic production and convenient assembly, but the present application scheme does not limit the shape of the specific corner structure, and in other embodiments, other corner structure shapes can be adjusted.

[0056] For example, the first SMA wire 41, the second SMA wire 42, the third SMA wire 43 and the fourth SMA wire 44 can be connected to the mounting edge of the mounting plate 20 by the conductive sheet 50 in a soldering manner; the first SMA wire 41, the second SMA wire 42, the third SMA wire 43 and the fourth SMA wire 44 can be connected to the upper edge of the side plate 12 by the conductive sheet 50 in a soldering manner; the first SMA wire 41, the second SMA wire 42, the third SMA wire 43 and the fourth SMA wire 44 can be connected to the upper edge of the first and second diagonal plates 13, 14 by the conductive sheet 50 in a soldering manner.

[0057] For example, the first SMA wire 41, the second SMA wire 42, the third SMA wire 43 and the fourth SMA wire 44 can be connected to the mounting edge of the mounting plate 20 by the clamping jaw (not shown) in a mechanical clamping manner; the first SMA wire 41, the second SMA wire 42, the third SMA wire 43 and the fourth SMA wire 44 can be connected to the upper edge of the side plate 12 by the clamping jaw (not shown) in a mechanical clamping manner; the first SMA wire 41, the second SMA wire 42, the third SMA wire 43 and the fourth SMA wire 44 can be connected to the upper edge of the first and second diagonal plates 13, 14 by the clamping jaw (not shown) in a mechanical clamping manner. Specifically, the clamping jaw (not shown) can be soldered to the mounting plate 20, the side plate 12, the first diagonal plate 13 and the second diagonal plate 14 by the conductive sheet to achieve electrical connection; the clamping jaw (not shown) can also be clamped to the mounting plate 20, the side plate 12, the first diagonal plate 13 and the second diagonal plate 14 to achieve electrical connection.

[0058] The substrate 11 has an opening 110, four inner edges 15 disposed towards the opening 110, and four outer edges disposed opposite to the four inner edges 15, the four inner edges 15 including two first inner edges 151 disposed opposite along the X direction and two second inner edges 152 disposed opposite along the Y direction. The four suspension groups 30 of the optical drive device 100 include two first suspension groups 31 and two second suspension groups 32. One of the first suspension groups 31 vertically extends and is connected between a pair of opposite first inner edges 151 of the substrate 11 and a first mounting edge 21 of the mounting plate 20, and the other first suspension group 31 vertically extends and is connected between another pair of opposite first inner edges 151 of the substrate 11 and the first mounting edge 21 of the mounting plate 20. One of the second suspension groups 32 vertically extends and is connected between a pair of opposite second inner edges 152 of the substrate 11 and a second mounting edge 22 of the mounting plate 20, and the other second suspension group 32 vertically extends and is connected between another pair of opposite second inner edges 152 of the substrate 11 and the second mounting edge 22 of the mounting plate 20. The suspension groups 30 are disposed vertically to the substrate 11, more specifically, the suspension groups 30 are integrally formed relative to the substrate 11 and then are bent relative to the substrate 11 to be disposed at an angle, thereby providing the mounting plate 20 with the elastic restoring force in the Z direction when the suspension groups 30 are not conducting. For example, the suspension groups 30 can be integrally connected with the substrate 11 and the mounting plate 20, i.e. the four suspension groups 30 can be integrally upwardly bent and extended from the two first inner edges 151 and the two second inner edges 152 of the substrate 11 or integrally downwardly bent and extended from the two first mounting edges 21 and the two second mounting edges 22 of the mounting plate 20, respectively. For example, the suspension groups 30 can be electrically connected with the mounting plate 20 and / or the substrate 11 by welding or adhesion.

[0059] In the embodiment, the four side plates 12, the two first diagonal plates 13 and the two second diagonal plates 14 are integrally bent and extended from the substrate 11. The frame 10 is integrally formed.

[0060] The mounting plate 20 is arranged in parallel with the substrate 11 and is spaced from the substrate 11. The mounting plate 20 is arranged corresponding to the opening 110 of the substrate 11. The outer edge of the mounting plate 20 in the Z direction (i.e. vertical direction) is located inside the outer edge of the substrate 11 in the Z direction, and in the preferred embodiment of the present application, the outer edge of the mounting plate 20 in the Z direction (i.e. vertical direction) is flush with the inner edge 15 of the substrate 11 in the Z direction. The frame 10 is a three-dimensional structure and forms a three-dimensional movement space inside the frame 10, which is formed by the substrate 11 and the side plates 12. The mounting plate 20 moves in the X, Y and Z directions within the movement space and does not exceed the movement space. Therefore, the three-dimensional frame 10 not only can drive the mounting plate 20 to move in the X, Y and Z directions by arranging SMA wires at different positions, but also provides protection for the movement of the mounting plate 20.

[0061] The frame 10 further comprises a docking portion 115 integrally extending from the substrate 11. The docking portion 115 is used to connect with a main board (not shown). A plurality of conductive sheets can be formed on the docking portion 115, and the plurality of conductive sheets are used to electrically connect with a circuit layer of the main board.

[0062] The optical drive 100 further comprises a base (not shown) or a housing (not shown), which surrounds the periphery of the frame 10 and thereby supports the substrate 11, the side plates 12 and the first and second diagonal plates 13 and 14, and increases the structural strength to prevent deformation.

[0063] As shown in FIG. 1, a first embodiment of the optical drive 100 according to the present application is disclosed. The optical drive 100 comprises a frame 10, a substrate 11, a plurality of side plates 12, a plurality of first diagonal plates 13 and a plurality of second diagonal plates 14. Figure 3 As shown in FIG. 2, a second embodiment of the optical drive 100 according to the present application is disclosed. The second embodiment is substantially the same as the first embodiment, and the difference is the arrangement of the suspension wire group 30. Figure 4 As shown in FIG. 3, a third embodiment of the optical drive 100 according to the present application is disclosed. The second embodiment and the third embodiment each adopt a technical solution substantially the same as the first embodiment, and the difference is only the arrangement of the suspension wire group 30. Figure 5 Figure 6 As shown in FIG. 3, a third embodiment of the optical drive 100 according to the present application is disclosed. The second embodiment and the third embodiment each adopt a technical solution substantially the same as the first embodiment, and the difference is only the arrangement of the suspension wire group 30.

[0064] ​In the present application, the frame 10 is a three-dimensional structure, and the horizontal movement of the mounting plate in the X and Y directions and the vertical movement of the mounting plate in the Z direction are driven by different SMA wires, thereby realizing the anti-shake function of the image sensor in the X and Y directions and the zooming or focusing function in the Z direction, and integrating the functions of optical anti-shake and automatic focusing, which conforms to the development trend of structure simplification, integration and thinning. The movement of the mounting plate 20 in the Z direction is driven by the third SMA wire 43 and the fourth SMA wire 44, thereby realizing the focusing or zooming function, replacing the traditional axial voice coil motor, greatly reducing the overall size, and being applicable to front or rear camera modules. The frame 10 of the three-dimensional structure realizes the extension of the SMA wire in different positions and different directions through the side plates 12 and the first and second diagonal plates 13 and 14 of different heights, thereby facilitating the control of the movement of the image sensor in the X, Y and Z directions. The movement range of the mounting plate 20 in the X, Y and Z directions is limited within the frame 10, preventing the image sensor from colliding with other components and protecting the image sensor.

[0065] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present application.

[0066] The above-described embodiments only express the implementation of the present application, and the description is more specific and detailed, but it should not be construed as limiting the scope of the patent of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. An optical driving device, comprising a mounting plate arranged horizontally for mounting an image sensor, a frame electrically connected to an external driving circuit and spaced apart from the mounting plate, and a plurality of suspension wire assemblies connecting the mounting plate and the frame, characterized in that, The optical driving device further includes a plurality of driving lines electrically connecting the frame and the mounting plate. At least a portion of the driving lines drive the mounting plate to move vertically relative to the frame via the external driving circuit. The mounting plate has a planar structure, and the frame has an integrally formed three-dimensional structure. The frame includes a horizontally arranged base plate and a plurality of vertically arranged side plates. A plurality of suspension wire assemblies are all vertically arranged and electrically connected to the base plate and the mounting plate. The plurality of driving lines include a pair of first driving lines arranged in a first horizontal direction and connected between the corresponding side plate and the mounting plate, and a pair of driving lines arranged in a second horizontal direction and connected between the corresponding side plate and the mounting plate. The second drive line between the mounting plates has the first direction and the second direction located in the same plane, intersecting and perpendicular to each other. The first drive line and the second drive line drive the mounting plate to move along the first direction and the second direction through telescopic deformation, thereby achieving image stabilization. The plurality of drive lines also include a pair of third drive lines extending upward from the mounting plate and connected to the corresponding side plate of the frame, and a pair of fourth drive lines extending downward from the mounting plate and connected to the corresponding side plate of the frame. The third drive lines and the fourth drive lines drive the mounting plate to move up and down along the vertical direction through telescopic deformation, thereby achieving focusing or zooming functions. The height of each pair of side plates is the same, and the height of the side plate connected to the first drive line and the height of the side plate connected to the second drive line are the same; the height of the side plate connected to the third drive line is greater than the height of the side plate connected to the first drive line, and the height of the side plate connected to the fourth drive line is less than the height of the side plate connected to the first drive line. The mounting plate, the suspension wire assembly, and the frame are all formed on the same insulating substrate. The mounting plate, the suspension wire assembly, and the frame have the same conductive pattern structure. The substrate and the mounting plate are spaced apart vertically and arranged parallel to each other. The substrate has a through opening, an inner edge facing the opening, and an outer edge opposite to the inner edge. Along a direction perpendicular to the mounting plate, at least a portion of the periphery of the mounting plate is flush with at least a portion of the inner edge. A plurality of suspension wire assemblies are connected to the inner edge and the periphery of the mounting plate.

2. The optical driving device according to claim 1, characterized in that, The driving line is an SMA line, which is made of shape memory alloy (SMA). The external driving circuit controls the current flowing through the SMA line, and the SMA line deforms or returns to its original shape under the action of the current.

3. The optical driving device according to claim 1, characterized in that, A pair of first drive lines are aligned or misaligned along the first direction, and a pair of second drive lines are aligned or misaligned along the second direction.

4. The optical driving device according to claim 1, characterized in that, The projection of the third drive line onto the horizontal plane is set along the fourth direction, and the projection of the fourth drive line onto the horizontal plane is set along the fifth direction. The fourth and fifth directions are directions along the two diagonals of the mounting plate.

5. The optical driving device according to claim 1, characterized in that, The outer edge of the substrate includes a pair of first edges disposed opposite to each other along the first direction and a pair of second edges disposed opposite to each other along the second direction. The plurality of side plates include a pair of first side plates and a pair of second side plates. The pair of first side plates are respectively connected to the pair of first edges, and the pair of second side plates are respectively connected to the pair of second edges. Both the first side plates and the second side plates are perpendicular to the substrate. A pair of first driving lines are respectively connected between the pair of first side plates and the mounting plate, and a pair of second driving lines are respectively connected between the pair of second side plates and the mounting plate.

6. The optical driving device according to claim 5, characterized in that, The outer edge of the substrate also includes a pair of third edges arranged opposite each other along one of the diagonal directions and a pair of fourth edges arranged opposite each other along the other diagonal direction. The plurality of side plates also include a pair of first diagonal plates respectively connected to a pair of the third edges and a pair of second diagonal plates respectively connected to a pair of the fourth edges. The first diagonal plates and the second diagonal plates are both perpendicular to the substrate. A pair of third driving lines are respectively connected between a pair of first diagonal plates and the mounting plate, and a pair of fourth driving lines are respectively connected between a pair of second diagonal plates and the mounting plate.

7. The optical driving device according to claim 1, characterized in that, The inner edge of the substrate includes a pair of first inner edges disposed opposite to each other along a first direction and a pair of second inner edges disposed opposite to each other along a second direction. The plurality of suspension wire groups include a pair of first suspension wire groups and a pair of second suspension wire groups. The pair of first suspension wire groups are respectively connected between the pair of first inner edges and the mounting plate, and the pair of second suspension wire groups are respectively connected between the pair of second inner edges and the mounting plate.

8. The optical driving device according to claim 1, characterized in that, The suspension wire assembly is integrally formed with the substrate and / or the mounting plate; or, the suspension wire assembly is formed independently relative to the substrate and / or the mounting plate, and the suspension wire assembly is electrically connected to the mounting plate and / or the substrate by welding or bonding.

9. The optical driving device according to claim 1, characterized in that, The drive line is connected to the mounting plate and the frame by welding conductive sheets; or, the drive line is connected to the mounting plate and the frame by mechanical clamping via claws.

10. The optical driving device according to claim 1, characterized in that, It also includes a base that supports the frame, and the frame also includes an integrally extended docking portion for connecting with the external drive circuit.

11. The optical driving device according to claim 1, characterized in that, The mounting plate is formed independently of the frame and the suspension wire assembly. The mounting plate is a ceramic substrate formed using a direct copper plating (DPC) process.

12. A camera module, comprising an image sensor, characterized in that, It also includes an optical driving device as described in any one of claims 1-11, wherein the image sensor is mounted on the mounting plate of the optical driving device.

13. The camera module according to claim 12, characterized in that, It also includes a lens module disposed on the top side of the image sensor and a drive assembly for controlling the lens module. The drive assembly includes at least one pair of coils and a pair of magnetic elements cooperating with the pair of coils. The pair of coils and the pair of magnetic elements interact to drive the lens module to move in the vertical direction and / or horizontal plane.

Images