Side pad measuring method and device, electronic equipment and storage medium

Abstract

The application is suitable for the technical field of ceramic package shell, and provides a side pad measurement method, device, electronic equipment and storage medium. The side pad measurement method comprises the following steps: obtaining a first side pad pattern and a second side pad pattern of a to-be-measured side pad; determining the contours of a first side pad and a second side pad based on the first and second side pad patterns, so as to provide clear and reliable pad contours for subsequent measurement of size data; selecting corresponding test references and test positions according to the contours of the first side pad and the second side pad, so as to obtain size data of the first side pad and the second side pad; and judging whether the first side pad and the second side pad are size-matched according to the size data of the first side pad and the second side pad. The side pad measurement method can ensure the size consistency of the side pad of the ceramic package shell, so as to avoid lead welding deviation and virtual welding of the ceramic package shell.

Description

Technical Field

[0001] This application belongs to the field of ceramic packaging shell technology, and particularly relates to side pad measurement methods, devices, electronic devices and storage media. Background Technology

[0002] Ceramic packaging shells are widely used in aerospace, aviation, and shipborne electronic equipment. With the rapid development of the domestic packaging industry, the requirements for production quality and efficiency are constantly increasing. Soldering is an important process in the production of ceramic packaging shells. However, ceramic packaging shells with side structures, such as Dual In-line Packages (DIPs) and Ceramic Quad Flat Packs (CQFPs), sometimes experience lead wire misalignment or even cold solder joints, which affects the production efficiency and performance of these products.

[0003] Therefore, it is necessary to measure ceramic package housings with side structures. In related technologies, the method for measuring the side pads of a product involves measuring each pad individually. However, even ceramic package housings that pass this test may still exhibit issues such as lead wire misalignment and cold solder joints. Therefore, providing a measurement method that meets the soldering requirements of ceramic package housings has become an urgent problem to solve. Summary of the Invention

[0004] To overcome the problem that the consistency of the side pads of ceramic packaging shells cannot be guaranteed in related technologies, embodiments of this application provide a side pad measurement method, apparatus, electronic device, and storage medium.

[0005] This application is achieved through the following technical solution:

[0006] In a first aspect, embodiments of this application provide a method for measuring side pads, including:

[0007] Obtain a pattern of the side pad to be measured; wherein the side pad to be measured includes a first side pad and a second side pad;

[0008] Based on the pattern of the side pad to be measured, the outlines of the first side pad and the second side pad are determined;

[0009] Based on the contours of the first side pad and the second side pad, select the corresponding test reference and test position;

[0010] Based on the test benchmark and the test position, the dimensional data of the first side pad and the second side pad are measured respectively;

[0011] Based on the size data of the first side pad and the second side pad, determine whether the first side pad and the second side pad are size-matched.

[0012] In some embodiments, the test location includes points on the contour of the side pad to be measured and points within the contour of the side pad to be measured, and the test reference includes lines and / or points on the contour of the side pad to be measured.

[0013] The step of measuring the dimensional data of the first side pad and the second side pad based on the test benchmark and the test position includes:

[0014] Measure the pixel length from the test position to the test reference at the first side pad and the second side pad respectively, and measure the angle and / or radian of the contour of the first side pad and the second side pad respectively.

[0015] The pixel length, and the angle and / or radian, are used as the size data.

[0016] In some embodiments, the test benchmark includes a first benchmark, a second benchmark, and a third benchmark;

[0017] The step of selecting the corresponding test reference and test position based on the contours of the first side pad and the second side pad includes:

[0018] If the outlines of the first side pad and the second side pad are square, then the test location is selected as the intersection of the center lines of the four sides of the first side pad and the second side pad, and the test reference is the first reference.

[0019] If the outlines of the first side pad and the second side pad are circular, then the test position is selected as the center of the first side pad and the second side pad, respectively, and the test reference is the second reference.

[0020] If the outlines of the first side pad and the second side pad are elliptical, then the test positions are selected as the centers of the ellipses of the first side pad and the second side pad, respectively, and the test reference is the third reference.

[0021] In some embodiments, determining whether the first side pad and the second side pad are size-matched based on the size data of the first side pad and the second side pad includes:

[0022] The pixel lengths of the first side pad and the second side pad are measured and compared with a preset length threshold range, and the angles and / or radians of the contours of the first side pad and the second side pad are measured and compared with a preset angle threshold range and / or a preset radian threshold range.

[0023] If the pixel lengths of the first side pad and the second side pad are within the preset length threshold range, and the angles and / or radii of the contours of the first side pad and the second side pad are within the preset angle threshold range and / or preset radii threshold range, then it is determined that the first side pad and the second side pad are size-matched.

[0024] In some embodiments, determining whether the first side pad and the second side pad are size-matched based on the size data of the first side pad and the second side pad includes:

[0025] Calculate the absolute value of the difference between the pixel lengths of the measured first side pad and the second side pad, and calculate the absolute value of the difference between the angles and / or radians of the measured contours of the first side pad and the second side pad.

[0026] The absolute value of the calculated difference in pixel length is compared with the preset length tolerance, and the absolute value of the calculated difference in angle and / or radian is compared with the preset angle and / or radian tolerance.

[0027] If the absolute value of the difference in the calculated pixel length is less than or equal to the preset length tolerance, and the absolute value of the difference in the calculated angle and / or radian is less than or equal to the preset angle and / or radian tolerance, then it is determined that the first side pad and the second side pad are size-matched.

[0028] In some embodiments, determining the contours of the first side pad and the second side pad based on the pattern of the side pad to be measured includes:

[0029] The pattern of the side pad to be measured is subjected to pattern filtering and image binarization to obtain the processed image;

[0030] The processed image is subjected to image edge detection and image contour extraction to obtain the contours of the first side pad and the second side pad.

[0031] In some embodiments, the number of side pads to be measured is multiple;

[0032] The process of obtaining the pattern of the side pads to be measured includes: arranging multiple side pads to be measured into an array using a tooling.

[0033] Obtain a pattern of the multiple side pads to be measured that make up the array.

[0034] Secondly, embodiments of this application provide a side pad measuring device, comprising:

[0035] An acquisition module is used to acquire a pattern of the side pad to be measured; wherein the side pad to be measured includes a first side pad and a second side pad;

[0036] An extraction module is used to determine the contours of the first side pad and the second side pad based on the pattern of the side pad to be measured.

[0037] The processing module is used to select the corresponding test reference and test position based on the contours of the first side pad and the second side pad;

[0038] The measurement module is used to measure the dimensional data of the first side pad and the second side pad based on the test reference and the test position, respectively.

[0039] The judgment module is used to determine whether the first side pad and the second side pad are sized to match based on the size data of the first side pad and the second side pad.

[0040] Thirdly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the side pad measurement method as described in any of the first aspects.

[0041] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the side pad measurement method as described in any of the first aspects.

[0042] Fifthly, embodiments of this application provide a computer program product that, when run on an electronic device, causes the electronic device to perform the side pad measurement method described in any of the first aspects above.

[0043] It is understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here.

[0044] The beneficial effects of this application embodiment compared with the prior art are as follows: After obtaining the first side pad pattern and the second side pad pattern of the side pad to be measured, this application determines the outline of the two side pads based on the two patterns, providing a clear and reliable pad outline for subsequent measurement dimensional data; then, according to the outline of the two side pads, the corresponding test reference and test position are selected, and the dimensional data of the two side pads are measured; finally, according to the dimensional data of the two side pads, it is determined whether the two side pads are dimensionally matched. In this way, subsequent welding can be performed when the pads on both sides of the ceramic package shell with side structure are dimensionally matched, thereby reducing the occurrence of lead soldering misalignment, cold solder joints, etc. in the ceramic package shell, and thus improving the production efficiency and performance of such products.

[0045] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a schematic flowchart of a side pad measurement method provided in an embodiment of this application;

[0048] Figure 2 This is a schematic diagram of the test reference and test position of the square pad outline provided in an embodiment of this application;

[0049] Figure 3 This is a schematic diagram of the side pad measuring device provided in the embodiments of this application;

[0050] Figure 4 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0051] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0052] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0053] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0054] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0055] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0056] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0057] Ceramic packages with side structures, such as dual in-line packages and quad flat packages with guard rings, sometimes experience lead soldering misalignment or even cold solder joints, affecting production efficiency and performance. Therefore, it is necessary to measure ceramic packages with side structures. In related technologies, the method for measuring the side pads involves measuring each pad individually. However, even ceramic packages that pass this test may still exhibit lead soldering misalignment or cold solder joints.

[0058] To address the aforementioned issues, this application provides a method for measuring side pads. This method involves acquiring two side pad patterns of the side pad to be measured, determining the outlines of the two side pads based on the patterns, and then selecting appropriate test references and test positions according to the outlines to measure the dimensional data of the two side pads. This allows for determination of whether the two side pads are dimensionally matched, enabling soldering to be performed only when the dimensions are matched. This reduces issues such as lead wire misalignment and cold solder joints in ceramic packaging shells, thereby improving the production efficiency and performance of such products.

[0059] Figure 1 This is a schematic flowchart of a side pad measurement method provided in an embodiment of this application, with reference to... Figure 1 The measurement method for the pads on this side is described in detail below:

[0060] In S101, the pattern of the side pad to be measured is obtained; wherein the side pad to be measured includes a first side pad and a second side pad.

[0061] Here, the side pad to be measured can be determined according to the actual situation, such as a ceramic package housing with a side structure that needs to be soldered. In some embodiments of this application, in order to obtain the first side pad pattern and the second side pad pattern of the side pad to be measured, an image acquisition device, such as an industrial camera, can be used to acquire the first side pad pattern and the second side pad pattern of the side pad to be measured.

[0062] In S102, the contours of the first side pad and the second side pad are determined based on the pattern of the side pad to be measured.

[0063] In some embodiments of this application, S102 may include the following steps:

[0064] The pattern of the side pad to be measured is subjected to pattern filtering and image binarization to obtain the processed image. Then, the processed image is subjected to image edge detection and image contour extraction to obtain the contours of the first side pad and the second side pad.

[0065] In this embodiment, the pattern of the side pad to be measured can be filtered and binarized to obtain a processed image. Then, the processed image is subjected to image edge detection and edge tracking-based image contour extraction to obtain the contours of the first side pad and the second side pad, thereby providing a clear and reliable pad contour for subsequent measurement size data.

[0066] In S103, the corresponding test reference and test position are selected based on the contours of the first side pad and the second side pad.

[0067] Here, the test reference may include lines and / or points on the contour of the side pad to be measured, and the test location may include points on the contour of the side pad to be measured and points within the contour of the side pad to be measured.

[0068] For example, the test benchmark may include a first benchmark, a second benchmark, and a third benchmark. S103 may include the following steps:

[0069] If the outlines of the first and second side pads are square, the test location is selected at the intersection of the center lines of the four sides of the first and second side pads, with the test reference being the first reference. If the outlines of the first and second side pads are circular, the test location is selected at the center of the circle of the first and second side pads, with the test reference being the second reference. If the outlines of the first and second side pads are elliptical, the test location is selected at the center of the ellipse of the first and second side pads, with the test reference being the third reference.

[0070] In some embodiments of this application, the contours of the side pads to be measured have different shapes. Therefore, the test reference and test position are different for side pads with different shapes. However, the selection rules for the test position are the same for side pads with different shapes, such as the intersection of two lines or the center position of an exploded shape, which facilitates subsequent measurement. Since the first side pad and the second side pad are located on the same side pad to be measured, the test reference and test position of the first side pad and the second side pad are the same. This further ensures the accuracy of the judgment result when determining whether the two pads match in size.

[0071] Figure 2 This is a schematic diagram of the test reference and test position of the square pad outline provided in an embodiment of this application;

[0072] Reference Figure 2 In some embodiments of this application, if the outline of the first side pad and the second side pad is square, then by determining the center lines of each side of the square ABCD, the intersection point E (i.e., the geometric center) is found, and point E is one of the test positions of the square pad.

[0073] In some embodiments of this application, if the outlines of the first side pad and the second side pad are circular, the test position is selected as the center of the first side pad and the second side pad, respectively, and the center of the circle is also the geometric center of the circular pad.

[0074] In some embodiments of this application, if the outlines of the first side pad and the second side pad are elliptical, the test location is selected as the center of the ellipse of the first side pad and the second side pad, respectively. The center of the ellipse is also the geometric center of the elliptical pad.

[0075] In some embodiments of this application, if the outlines of the first side pad and the second side pad are complex shapes, they can be treated as a combination of straight lines, circles, and ellipses, and the geometric centers of each part of the outline of the side pad to be measured can be determined respectively, and the geometric centers of each part can be used as part of the test position.

[0076] In S104, the dimensional data of the first side pad and the second side pad are measured based on the test reference and test position.

[0077] For example, S104 may include the following steps:

[0078] Measure the pixel length from the test position to the test reference for the first side pad and the second side pad respectively, and measure the angle and / or radian of the contour of the first side pad and the second side pad respectively. Use the pixel length and the angle and / or radian as size data to determine whether the first side pad and the second side pad are size-matched.

[0079] In some embodiments of this application, after selecting the test reference and test position for the outlines of the corresponding first side pad and second side pad, the pixel length from the test position to the test reference is measured for both the first and second side pads. If the outlines of the first and second side pads are square, refer to... Figure 2 The pixel lengths from point E to each side of the first reference (square ABCD) and the pixel lengths of each side of square ABCD need to be measured. If the outlines of the first and second side pads are circular, the pixel lengths from the center of the circle to the outline of the second reference (circular pad) and the pixel lengths of the diameter of the circular pad need to be measured. If the outlines of the first and second side pads are elliptical, the pixel lengths from the center of the ellipse to the third reference need to be measured. The third test reference can be the intersection point of the elliptical pad outline with the major axis and / or minor axis.

[0080] In some embodiments of this application, after selecting the test reference and test position of the corresponding first side pad and second side pad contours, the angle and / or curvature of the first side pad and second side pad contours can be measured respectively.

[0081] In S105, based on the size data of the first side pad and the second side pad, it is determined whether the first side pad and the second side pad are size-matched.

[0082] In some embodiments of this application, S105 may include the following steps:

[0083] The pixel lengths of the first and second side pads are measured and compared with preset length threshold ranges, and the angles and / or radians of the contours of the first and second side pads are measured and compared with preset angle threshold ranges and / or preset radian threshold ranges. If the pixel lengths of the first and second side pads are within the preset length threshold ranges, and the angles and / or radians of the contours of the first and second side pads are within the preset angle threshold ranges and / or preset radian threshold ranges, then the dimensions of the first and second side pads are determined to be matched.

[0084] In the embodiments of this application, after measuring the size data of the first side pad and the second side pad, the measured pixel lengths of the first side pad and the second side pad are compared with a preset length threshold range, and the measured angles and / or radii of the contours of the first side pad and the second side pad are compared with preset angle thresholds and / or preset radii threshold ranges. If the pixel lengths of the first side pad and the second side pad are within the preset length threshold range, and the angles and / or radii of the contours of the first side pad and the second side pad are within the preset angle thresholds and / or preset radii threshold ranges, then it is determined that the first side pad and the second side pad are size-matched.

[0085] The preset length threshold range is a limit on the pixel length from different test positions to the test reference, based on actual conditions or needs. The preset angle threshold and / or preset radius threshold range is a limit on the angle and / or radius of the contour of different pads to be measured, based on actual conditions or needs. The specific ranges of the preset length threshold range and the preset angle threshold and / or preset radius threshold range are not specified here.

[0086] In some embodiments of this application, S105 further includes the following steps:

[0087] Calculate the absolute value of the difference between the pixel lengths of the measured first side pad and the second side pad, and calculate the absolute value of the difference between the angle and / or radian of the measured first side pad and the second side pad. Compare the calculated absolute value of the pixel length difference with a preset length tolerance, and compare the calculated absolute value of the angle and / or radian difference with a preset angle and / or radian tolerance. If the absolute value of the calculated pixel length difference is less than or equal to the preset length tolerance, and the absolute value of the calculated angle and / or radian difference is less than or equal to the preset angle and / or radian tolerance, then the first side pad and the second side pad are dimensionally matched.

[0088] In the embodiments of this application, after measuring the size data of the first side pad and the second side pad, the absolute value of the difference between the measured pixel lengths of the first side pad and the second side pad can be calculated, and the absolute value of the difference between the angle and / or radian of the measured contours of the first side pad and the second side pad can be calculated. The absolute value of the calculated difference in pixel length is compared with a preset length tolerance, and the absolute value of the calculated difference in angle and / or radian is compared with a preset angle and / or radian tolerance. If the absolute value of the calculated difference in pixel length is less than or equal to the preset length tolerance, and the absolute value of the calculated difference in angle and / or radian is less than or equal to the preset angle and / or radian tolerance, then the first side pad and the second side pad are sized to match.

[0089] The preset length tolerance is a length limit imposed on the pixel length from different test positions to the test reference, based on actual conditions or needs. The preset angle and / or radian tolerance is an angle and / or radian limit imposed on the angle and / or radian of the contour of different pads to be measured, based on actual conditions or needs. The specific ranges of the preset length tolerance and preset angle and / or radian tolerance are not limited here.

[0090] In some embodiments of this application, the measured pixel length can be converted into the actual length according to existing algorithms, and then, based on the actual length, it can be determined whether the first side pad and the second side pad are size-matched.

[0091] In some embodiments of this application, the number of side pads to be measured can be multiple, then S101 may include:

[0092] Multiple side pads to be measured are arranged into an array using a tooling; the pattern of the multiple side pads to be measured in the array is then obtained.

[0093] In this embodiment, if there are multiple side pads to be measured, the above-mentioned side pad measurement method can use a tooling to form an array of multiple side pads to be measured, so that the dimensions of both sides of the side pads to be measured can be measured in a batch processing manner to determine whether they match.

[0094] In the embodiments of this application, a fixture can be used to arrange multiple side pads to be measured into an array, thereby enabling batch processing of the side pads to be measured and improving measurement efficiency. Each cavity of the fixture that holds the side pad to be measured has a slot on its side to enhance the edge gripping efficiency of the ceramic package shell and improve measurement stability.

[0095] In some embodiments of this application, AI learning technology can also be used to learn the features of the side pads to be measured. For example, when measuring the side pads, AI learning technology can be used to train a measurement model. This measurement model takes a pad image as input and outputs the pad dimensions. Thus, in actual measurement, only an image of the side pad to be measured needs to be input to complete the size measurement of the side pad. Moreover, this embodiment can also distinguish between qualified and unqualified products after determining whether the first side pad and the second side pad match in size, so as to achieve the purpose of qualified products entering the next process and unqualified products being rejected.

[0096] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0097] Corresponding to the side pad measurement method described in the above embodiments, Figure 3 A structural block diagram of the side pad measuring device provided in an embodiment of this application is shown. For ease of explanation, only the parts related to the embodiment of this application are shown.

[0098] See Figure 3 The side pad measuring device in this application embodiment may include an acquisition module 301, an extraction module 302, a processing module 303, a measurement module 304, and a judgment module 305.

[0099] The acquisition module 301 is used to acquire the pattern of the side pad to be measured; wherein the side pad to be measured includes a first side pad and a second side pad.

[0100] Extraction module 302 is used to determine the contours of the first side pad and the second side pad based on the pattern of the side pad to be measured.

[0101] The processing module 303 is used to select the corresponding test reference and test position according to the contours of the first side pad and the second side pad.

[0102] Measurement module 304 is used to measure the dimensional data of the first side pad and the second side pad based on the test reference and the test position, respectively.

[0103] The judgment module 305 is used to determine whether the first side pad and the second side pad are sized to match based on the size data of the first side pad and the second side pad.

[0104] Optionally, the measurement module 304 can be used to measure the pixel length from the test position to the test reference for the first side pad and the second side pad, respectively, and to measure the angle and / or radian of the contours of the first side pad and the second side pad, respectively; and to use the pixel length, as well as the angle and / or radian, as dimensional data. The test position includes points on the contour of the side pad to be measured and points within the contour of the side pad to be measured, and the test reference includes lines and / or points on the contour of the side pad to be measured.

[0105] Optionally, the processing module 303 is specifically configured to: if the outlines of the first side pad and the second side pad are square, select the test location as the intersection of the center lines of the four sides of the first side pad and the second side pad, with the test reference being the first reference; if the outlines of the first side pad and the second side pad are circular, select the test location as the center of the circle of the first side pad and the second side pad, with the test reference being the second reference; if the outlines of the first side pad and the second side pad are elliptical, select the test location as the center of the ellipse of the first side pad and the second side pad, with the test reference being the third reference. The test references include the first reference, the second reference, and the third reference.

[0106] Optionally, the judgment module 305 can be used to compare the measured pixel lengths of the first side pad and the second side pad with a preset length threshold range, and to compare the measured angles and / or radii of the contours of the first side pad and the second side pad with a preset angle threshold range and / or a preset radii threshold range. If the pixel lengths of the first side pad and the second side pad are within the preset length threshold range, and the angles and / or radii of the contours of the first side pad and the second side pad are within the preset angle threshold range and / or a preset radii threshold range, then it is determined that the dimensions of the first side pad and the second side pad are matched.

[0107] Optionally, the judgment module 305 can be used to calculate the absolute value of the difference between the pixel lengths of the measured first side pad and the second side pad, and to calculate the absolute value of the difference between the angle and / or radian of the contours of the measured first side pad and the second side pad; compare the calculated absolute value of the difference in pixel length with a preset length tolerance, and compare the calculated absolute value of the difference in angle and / or radian with a preset angle and / or radian tolerance; if the calculated absolute value of the difference in pixel length is less than or equal to the preset length tolerance, and the calculated absolute value of the difference in angle and / or radian is less than or equal to the preset angle and / or radian tolerance, then it is determined that the dimensions of the first side pad and the second side pad are matched.

[0108] Optionally, the extraction module 302 can be used to perform graphic filtering and image binarization on the graphic of the side pad to be measured to obtain the processed image; and to perform image edge detection and image contour extraction on the processed image to obtain the contours of the first side pad and the second side pad.

[0109] Optionally, if there are multiple side pads to be measured, the acquisition module 301 can also be used to form an array of multiple side pads to be measured using a fixture; and acquire the pattern of the multiple side pads to be measured forming the array.

[0110] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0111] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0112] This application also provides an electronic device, see [link to relevant documentation] Figure 4 The electronic device 400 may include: at least one processor 410, a memory 420, and a computer program stored in the memory 420 and executable on the at least one processor 410. When the processor 410 executes the computer program, it implements the steps in any of the above-described method embodiments, for example... Figure 1 Steps S101 to S105 in the illustrated embodiment. Alternatively, when the processor 410 executes the computer program, it implements the functions of each module / unit in the above-described device embodiments, for example... Figure 3 The functions of modules 301 to 305 are shown.

[0113] For example, a computer program may be divided into one or more modules / units, one or more of which are stored in memory 420 and executed by processor 410 to complete this application. The one or more modules / units may be a series of computer program segments capable of performing a specific function, which describe the execution process of the computer program in electronic device 400.

[0114] Those skilled in the art will understand that Figure 4 This is merely an example of an electronic device and does not constitute a limitation on the electronic device. It may include more or fewer components than shown, or combinations of certain components, or different components, such as input / output devices, network access devices, buses, etc.

[0115] The processor 410 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0116] The memory 420 can be an internal storage unit of the electronic device or an external storage device, such as a plug-in hard drive, a smart media card (SMC), a secure digital card (SD), or a flash card. The memory 420 is used to store the computer program and other programs and data required by the electronic device. The memory 420 can also be used to temporarily store data that has been output or will be output.

[0117] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0118] The side pad measurement method provided in this application embodiment can be applied to electronic devices such as computers, wearable devices, in-vehicle devices, tablet computers, laptops, netbooks, personal digital assistants (PDAs), augmented reality (AR) / virtual reality (VR) devices, and mobile phones. This application embodiment does not impose any restrictions on the specific type of electronic device.

[0119] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in the various embodiments of the side pad measurement method described above.

[0120] This application provides a computer program product that, when run on a mobile electronic device, enables the mobile electronic device to execute the steps described in the various embodiments of the side pad measurement method.

[0121] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying computer program code to a photographic device / electronic device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0122] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0123] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0124] In the embodiments provided in this application, it should be understood that the disclosed apparatus / network devices and methods can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0125] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0126] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for measuring side pads, characterized in that, include: Obtain a pattern of the side pad to be measured; wherein the side pad to be measured includes a first side pad and a second side pad; Based on the pattern of the side pad to be measured, the outlines of the first side pad and the second side pad are determined; Based on the contours of the first side pad and the second side pad, select the corresponding test reference and test position; Based on the test benchmark and the test position, the dimensional data of the first side pad and the second side pad are measured respectively; Based on the size data of the first side pad and the second side pad, determine whether the first side pad and the second side pad are size-matched; The test locations include points on the outline of the side pad to be measured and points within the outline of the side pad to be measured, and the test reference includes lines and / or points on the outline of the side pad to be measured. The step of measuring the dimensional data of the first side pad and the second side pad based on the test benchmark and the test position includes: Measure the pixel length from the test position to the test reference at the first side pad and the second side pad respectively, and measure the angle and / or radian of the contour of the first side pad and the second side pad respectively. The pixel length, and the angle and / or radian, are used as the size data; The step of determining whether the first side pad and the second side pad are size-matched based on the size data of the first side pad and the second side pad includes: The measured pixel lengths of the first and second side pads are compared with a preset length threshold range, and the measured angles and / or radians of the contours of the first and second side pads are compared with a preset angle threshold range and / or a preset radian threshold range. If the pixel lengths of the first and second side pads are within the preset length threshold range, and the angles and / or radians of the contours of the first and second side pads are within the preset angle threshold range and / or the preset radian threshold range, then it is determined that the first and second side pads are sized to match; or Calculate the absolute value of the difference between the measured pixel lengths of the first side pad and the second side pad, and calculate the absolute value of the difference between the angle and / or radian of the measured contours of the first side pad and the second side pad; compare the calculated absolute value of the difference in pixel length with a preset length tolerance, and compare the calculated absolute value of the difference in angle and / or radian with a preset angle and / or radian tolerance; if the absolute value of the calculated difference in pixel length is less than or equal to the preset length tolerance, and the absolute value of the calculated difference in angle and / or radian is less than or equal to the preset angle and / or radian tolerance, then determine that the first side pad and the second side pad are dimensionally matched.

2. The side pad measurement method as described in claim 1, characterized in that, The test benchmarks include a first benchmark, a second benchmark, and a third benchmark; The step of selecting the corresponding test reference and test position based on the contours of the first side pad and the second side pad includes: If the outlines of the first side pad and the second side pad are square, then the test location is selected as the intersection of the center lines of the four sides of the first side pad and the second side pad, and the test reference is the first reference. If the outlines of the first side pad and the second side pad are circular, then the test position is selected as the center of the first side pad and the second side pad, respectively, and the test reference is the second reference. If the outlines of the first side pad and the second side pad are elliptical, then the test positions are selected as the centers of the ellipses of the first side pad and the second side pad, respectively, and the test reference is the third reference.

3. The side pad measurement method as described in claim 1, characterized in that, Determining the contours of the first side pad and the second side pad based on the pattern of the side pad to be measured includes: The pattern of the side pad to be measured is subjected to pattern filtering and image binarization to obtain the processed image; The processed image is subjected to image edge detection and image contour extraction to obtain the contours of the first side pad and the second side pad.

4. The side pad measurement method according to any one of claims 1 to 3, characterized in that, The number of side pads to be measured is multiple; The process of obtaining the pattern of the side pad to be measured includes: Multiple side pads to be measured are arranged into an array using tooling; Obtain a pattern of the multiple side pads to be measured that make up the array.

5. A side pad measuring device, characterized in that, include: An acquisition module is used to acquire the pattern of the side pad to be measured; wherein, the side pad to be measured includes a first side pad and a second side pad; An extraction module is used to determine the contours of the first side pad and the second side pad based on the pattern of the side pad to be measured. The processing module is used to select the corresponding test reference and test position based on the contours of the first side pad and the second side pad; The measurement module is used to measure the dimensional data of the first side pad and the second side pad based on the test reference and the test position, respectively. The judgment module is used to determine whether the first side pad and the second side pad are size-matched based on the size data of the first side pad and the second side pad; The test locations include points on the outline of the side pad to be measured and points within the outline of the side pad to be measured, and the test reference includes lines and / or points on the outline of the side pad to be measured. The measurement module is specifically used for: Measure the pixel length from the test position to the test reference at the first side pad and the second side pad respectively, and measure the angle and / or radian of the contour of the first side pad and the second side pad respectively. The pixel length, and the angle and / or radian, are used as the size data; The judgment module is specifically used for: The measured pixel lengths of the first and second side pads are compared with a preset length threshold range, and the measured angles and / or radians of the contours of the first and second side pads are compared with a preset angle threshold range and / or a preset radian threshold range. If the pixel lengths of the first and second side pads are within the preset length threshold range, and the angles and / or radians of the contours of the first and second side pads are within the preset angle threshold range and / or the preset radian threshold range, then it is determined that the first and second side pads are sized to match; or Calculate the absolute value of the difference between the measured pixel lengths of the first side pad and the second side pad, and calculate the absolute value of the difference between the angle and / or radian of the measured contours of the first side pad and the second side pad; compare the calculated absolute value of the difference in pixel length with a preset length tolerance, and compare the calculated absolute value of the difference in angle and / or radian with a preset angle and / or radian tolerance; if the absolute value of the calculated difference in pixel length is less than or equal to the preset length tolerance, and the absolute value of the calculated difference in angle and / or radian is less than or equal to the preset angle and / or radian tolerance, then determine that the first side pad and the second side pad are dimensionally matched.

6. An electronic device comprising a memory and a processor, wherein the memory stores a computer program executable on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 4.

7. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 1 to 4.

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