Alignment device, wafer detection system, and wafer alignment method

Abstract

This application relates to the field of semiconductor inspection technology, and provides an alignment device, a wafer inspection system, and a wafer alignment method. The alignment device includes an adsorption power source and an adsorption platform; the adsorption power source has a first gas path and a second gas path that are independently arranged; the adsorption platform is rotatable around a first axis; the adsorption platform is constructed with a first adsorption region and a second adsorption region, the first adsorption region being connected to the first gas path and the second adsorption region being connected to the second gas path; multiple first adsorption regions are provided, spaced apart outside the second adsorption regions. This improves the adsorption and fixation effect on the wafer, enhances adsorption stability, and ensures that the wafer does not easily shift when the adsorption platform switches between rotation and stop under external force, thereby improving wafer alignment accuracy and manufacturing yield.

Description

Technical Field

[0001] This application relates to the field of semiconductor inspection technology, and in particular to an alignment device, a wafer inspection system, and a wafer alignment method. Background Technology

[0002] In wafer fabrication, a wafer alignment device is needed to pre-align the wafers during processing. Specifically, notches on the wafer are used to adjust it to a preset position to ensure that all wafers are in the same position during the next processing stage, facilitating subsequent processes. In related technologies, vacuum adsorption is mainly used for wafer fixation. However, when the wafer alignment device switches between rotation and rest, unstable adsorption can affect the alignment accuracy, leading to lower manufacturing yields. Summary of the Invention

[0003] Therefore, it is necessary to provide an alignment device to improve the adsorption and fixation effect on the wafer, ensure that the wafer does not shift when switching between rotating and stationary states, improve the alignment accuracy of the wafer, and thus improve the manufacturing yield.

[0004] An alignment device includes an adsorption power source and an adsorption platform; the adsorption power source has a first gas path and a second gas path that are independently arranged; the adsorption platform is rotatable about a first axis; the adsorption platform is constructed with a first adsorption area and a second adsorption area, the first adsorption area being connected to the first gas path and the second adsorption area being connected to the second gas path; multiple first adsorption areas are provided and are spaced apart on the outside of the second adsorption area.

[0005] Understandably, the adsorption platform is divided into regions to achieve regional adsorption and fixation. Since each first adsorption region is located outside the second adsorption region, the cooperation between these regions helps the wafer flatten on the adsorption platform and cover the second adsorption region, improving the alignment of the wafer with respect to the second adsorption region. This enhances the adsorption and fixation of the wafer by the second adsorption region. In this way, the adsorption and fixation effect on the wafer is improved, increasing adsorption stability. When the adsorption platform switches between rotation and stop under external force, it ensures that the wafer will not easily shift, improving wafer alignment accuracy and thus increasing manufacturing yield.

[0006] In some embodiments, the adsorption platform includes an adsorption base and a partition plate; the adsorption base is configured with a cavity, the partition plate is installed on the adsorption base and accommodated in the cavity, the cavity is divided into a first cavity and a second cavity that are not interconnected by the partition plate, the first cavity is connected to the first gas path and the first adsorption zone, the second cavity is connected to the second gas path and the second adsorption zone, and the first adsorption zone and the second adsorption zone are both located on the same side of the adsorption base along the first axis.

[0007] In some embodiments, the adsorption base includes a substrate and an adsorption cover plate fastened to the substrate, the substrate and the adsorption cover plate together defining the cavity, and a partition plate installed between the substrate and the adsorption cover plate; the substrate is configured with a first pore, the first pore being connected to the first air passage and the first cavity, and the substrate is configured with a second pore, the second pore being connected to the second air passage and the second cavity.

[0008] In some embodiments, the substrate is constructed with an air channel groove communicating with a first air pore, the air channel groove being located within the first cavity; the partition plate is provided with a plurality of through holes along the path of the air channel groove, each of the through holes communicating with a first adsorption zone.

[0009] In some embodiments, the partition plate is configured with through holes, and the substrate has protrusions adapted to the through holes. The protrusions pass through the through holes and extend into the second cavity, and the second air pores are configured on the protrusions. A first sealing ring is pressed on the side of each through hole facing the adsorption cover plate, and a second sealing ring is pressed on the side of the substrate facing the adsorption cover plate. Each of the first sealing rings is located within the area enclosed by the second sealing ring.

[0010] In some embodiments, along the first axis, one side of the adsorption base is provided with a protrusion and a recess. The protrusion is provided with a plurality of notches spaced apart around the first axis, each notch corresponding to a recess. The protrusion is provided with a plurality of spaced adsorption holes to define the second adsorption area. The recess is provided with an adsorption channel. The adsorption platform further includes a plurality of Bernoulli suction cups. Each Bernoulli suction cup is mounted on a recess and communicates with a corresponding adsorption channel to define a first adsorption area.

[0011] In some embodiments, the adsorption power source is located on one side of the adsorption platform along the first axis, and the adsorption platform has a mounting column protruding on the side facing the adsorption power source; the alignment device further includes a rotating mechanism connected to the mounting column to drive the adsorption platform to rotate around the first axis; the alignment device further includes a lifting mechanism connected to the mounting column to drive the adsorption platform to move along the first axis.

[0012] In some embodiments, the rotating mechanism includes a rotating power source, a rotating shaft, and a power transmission assembly. The power transmission assembly is tractively connected between the rotating power source and the rotating shaft. The rotating shaft is connected between the adsorption power source and the mounting column, and the rotating shaft is rotatably connected to the adsorption power source. The rotating shaft has a first air passage and a second air passage. The first air passage connects the first air path and the first adsorption zone, and the second air passage connects the second air path and the second adsorption zone.

[0013] In some embodiments, the rotating mechanism further includes a connecting sheet metal, one end of which is connected to the rotating power source and the other end of which is connected to the adsorption power source.

[0014] In some embodiments, the power transmission assembly includes a driving pulley, a transmission belt, and a driven pulley. The transmission belt is tensioned between the driving pulley and the driven pulley. The driving pulley is driven to the rotary power source, and the driven pulley is connected to the rotary shaft to drive the rotary shaft to rotate synchronously.

[0015] In some embodiments, the lifting mechanism includes a lifting power source, a transmission rod, and a transmission block; the lifting power source is used to drive the transmission rod to rotate about a first axis, the transmission block is screwed to the transmission rod and can move along the first axis, and the transmission block is connected to the mounting column; the alignment device further includes a guide seat, the guide seat is slidably connected to the mounting column to limit the rotation of the mounting column about the axis of the transmission rod.

[0016] This application provides a wafer inspection system, including an image acquisition device and the aforementioned alignment device. The image acquisition device is installed on one side of the alignment device along a first axis and is located above the adsorption platform in the alignment device. The image acquisition device is used to acquire image information of the wafer adsorbed by the alignment device. The alignment device improves the adsorption stability of the wafer, thereby reducing the offset after wafer rotation and improving wafer alignment accuracy. After the wafer is in place, the image acquisition device takes a picture of it to satisfy the pre-alignment of the wafer, ensuring that all wafers are in the same position, facilitating subsequent processes.

[0017] This application also provides a wafer alignment method, which, based on the above-described alignment apparatus, includes the following steps:

[0018] The first gas path is activated to initially position the wafer through each first adsorption region, thereby causing the wafer to cover the second adsorption region.

[0019] The second gas path is activated to adsorb and fix the wafer through the second adsorption zone;

[0020] The alignment device drives the wafer to rotate around the first axis and / or move along the direction of the first axis.

[0021] Once the wafer is in place, image information of the wafer after adsorption and fixation is obtained.

[0022] In some embodiments, after activating the second gas path to adsorb and fix the wafer through the second adsorption region, the process includes:

[0023] After the second adsorption zone has adsorbed for a certain period of time, the first gas path is closed to cut off the adsorption of the wafer by each first adsorption zone. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic diagram of an alignment device provided in an embodiment of this application;

[0026] Figure 2 for Figure 1 A partial schematic diagram of the alignment device provided in the diagram;

[0027] Figure 3 A top view of an alignment device provided in an embodiment of this application;

[0028] Figure 4 for Figure 3 Sectional view of AA;

[0029] Figure 5 for Figure 4 A magnified view of a section at point C;

[0030] Figure 6 for Figure 3 Sectional view of BB;

[0031] Figure 7 This is a first partial schematic diagram of the adsorption platform in an alignment device provided in an embodiment of this application;

[0032] Figure 8 This is a second partial schematic diagram of the adsorption platform in an alignment device provided in an embodiment of this application;

[0033] Figure 9 This is a schematic diagram of a wafer inspection system provided in one embodiment of this application;

[0034] Figure 10 This is a schematic diagram of a wafer alignment method provided in an embodiment of this application.

[0035] Reference numerals: 10. Adsorption power source; 11. First air path; 12. Second air path; 20. Adsorption platform; 21. Adsorption base; 22. Partition plate; 23. Bernoulli suction cup; 24. Mounting column; 30. Rotation mechanism; 31. Rotation power source; 32. Rotation shaft; 33. Power transmission assembly; 40. Lifting mechanism; 41. Lifting power source; 42. Transmission rod; 43. Transmission block; 50. Guide seat; 60. Connecting sheet metal; 2001. First adsorption area; 2002. Second adsorption area; 100. Alignment device; 101. Rotating part; 102. Fixing part; 200. Image acquisition device; 211. Base; 212. Adsorption cover plate; 231, first sealing ring; 232, second sealing ring; 241, mounting substrate; 300, wafer; 331, driving wheel; 332, driven wheel; 333, transmission belt; 2101a, first cavity; 2101b, second cavity; 2102, protrusion; 2103, recess; 2111, first vent; 2112, second vent; 2113, air channel groove; 2114, protrusion; 2121, adsorption hole; 2122, adsorption channel; 2201, through hole; 2202, through hole; 2401, third air channel; 2402, fourth air channel; 3201, first air channel; 3202, second air channel. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0040] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0041] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 9One embodiment of this application provides an alignment device 100, including an adsorption power source 10 and an adsorption platform 20. The adsorption power source 10 has a first air passage 11 and a second air passage 12 that are independently arranged. The adsorption platform 20 is constructed with a first adsorption region 2001 and a second adsorption region 2002. The first adsorption region 2001 is connected to the first air passage 11, and the second adsorption region 2002 is connected to the second air passage 12, so as to respectively satisfy the adsorption operation of the first adsorption region 2001 and the second adsorption region 2002. Multiple first adsorption regions 2001 are provided and spaced apart outside the second adsorption region 2002. The adsorption platform 20 is rotatable around a first axis to facilitate material handling in cooperation with a robotic arm.

[0042] In other words, this embodiment divides the adsorption platform 20 into regions, and through the cooperation of multiple different regions, achieves the adsorption and fixation of the wafer 300. Since each of the first adsorption regions 2001 is spaced apart on the outside of the second adsorption region 2002, the cooperation between the first adsorption regions 2001 allows the wafer 300 to be flattened on the adsorption platform 20 and cover the second adsorption region 2002, thereby improving the alignment effect of the wafer 300 relative to the second adsorption region 2002. This allows the second adsorption region 2002 to be more fully aligned with the wafer 300, thus improving the adsorption and fixation of the wafer 300 by the second adsorption region 2002. In this way, the adsorption and fixation effect of the wafer 300 is improved, the adsorption stability is enhanced, and when the adsorption platform 20 switches between rotation and stop under external force, the wafer 300 is minimized from shifting, improving the alignment accuracy of the wafer 300 and thus increasing the manufacturing yield.

[0043] In practical use, each of the first adsorption regions 2001 can be adsorbed and fixed before the second adsorption region 2002. At this time, the adsorption and fixation of each of the first adsorption regions 2001 relative to the wafer 300 can serve as the initial positioning for the adsorption and fixation of the wafer 300 relative to the second adsorption region 2002. Furthermore, along the first axis, the projected area of ​​the first adsorption region 2001 is smaller than the projected area of ​​the second adsorption region 2002. This ensures that the second adsorption region 2002 has a larger adsorption range, guaranteeing the contact area between the second adsorption region 2002 and the wafer 300, thus enabling more stable and reliable adsorption and fixation of the wafer 300.

[0044] The first axis direction can be the thickness direction of the adsorption platform 20, so as to... Figure 1 Taking the placement in the example, the first axis direction is the Z-axis direction.

[0045] like Figure 1 and Figure 2As shown, for example, along the first axis direction, the adsorption power source 10 is located on one side of the adsorption platform 20 along the first axis direction, for example, below along the Z-axis direction. At this time, the first adsorption region 2001 and the second adsorption region 2002 are both located on the side of the adsorption platform 20 away from the adsorption power source 10, so as to avoid interference between the wafer 300 and the adsorption power source 10 and further improve the adsorption and fixation effect.

[0046] Please continue to refer to Figure 1 and Figure 2 As shown, in an optional embodiment, along the first axis, one side of the adsorption platform 20 is provided with a protrusion 2102 and a recess 2103. The protrusion 2102 is provided with a plurality of notches spaced apart around the first axis, each notch corresponding to a recess 2103. The protrusion 2102 is provided with a plurality of spaced adsorption holes 2121 to define a second adsorption area 2002. The recess 2103 is provided with an adsorption channel 2122. The adsorption platform 20 also includes a plurality of Bernoulli suction cups 23, each Bernoulli suction cup 23 being mounted on a recess 2103 and communicating with a corresponding adsorption channel 2122 to define a first adsorption area 2001.

[0047] Specifically, the protrusions 2102 and recesses 2103 create a height difference between the first adsorption zone 2001 and the second adsorption zone 2002, making the adsorption range between them more defined and reducing adsorption interference. Simultaneously, this height difference provides assembly space for the Bernoulli suction cup 23. In actual use, the first air passage 11 is used to deliver positive pressure gas. At this time, one end of each adsorption channel 2122 is connected to the first air passage 11, and the other end is connected to the corresponding Bernoulli suction cup 23, so that positive pressure gas is delivered to the Bernoulli suction cup 23 and then ejected to form a negative pressure cyclone, thereby achieving non-contact adsorption in the first adsorption zone 2001. The second air passage 12 is used to deliver negative pressure gas. At this time, each adsorption hole 2121 is connected to the second air passage 12, achieving negative pressure adsorption in the second adsorption zone 2002.

[0048] It should be noted that the specific structure and working principle of the Bernoulli suction cup 23 are mature technologies and will not be elaborated here.

[0049] The adsorption platform 20 is described in detail below.

[0050] Please combine Figures 5 to 8As shown, in some embodiments, the adsorption platform 20 includes an adsorption base 21 and a partition plate 22. The adsorption base 21 has a cavity, and the partition plate 22 is installed on the adsorption base 21 and housed within the cavity. The cavity is divided by the partition plate 22 into a first cavity 2101a and a second cavity 2101b that are not interconnected. The first cavity 2101a is connected to the first gas passage 11 and the first adsorption zone 2001, and the second cavity 2101b is connected to the second gas passage 12 and the second adsorption zone 2002. The first adsorption zone 2001 and the second adsorption zone 2002 are both located on the same side of the adsorption base 21 along the first axis.

[0051] In this way, it can be ensured that the adsorption action of the first adsorption zone 2001 and the adsorption action of the second adsorption zone 2002 do not interfere with each other; and, through the setting of the first cavity 2101a, multiple first adsorption zones 2001 can be connected, realizing the simultaneous control of multiple first adsorption zones 2001, ensuring that the airflow intensity distributed to each first adsorption zone 2001 is basically the same, thus improving adsorption stability. When each first adsorption zone 2001 is provided with an adsorption channel 2122, and the second adsorption zone 2002 is formed by multiple adsorption holes 2121, each adsorption channel 2122 is connected to the first cavity 2101a, and each adsorption hole 2121 is connected to the second cavity 2101b.

[0052] Please continue reading. Figures 5 to 8 As shown, in some specific embodiments, along the Z-axis, the first cavity 2101a is located below the partition plate 22, and the second cavity 2101b is located above the partition plate 22. This arrangement reduces the communication distance between each adsorption hole 2121 and the second cavity 2101b, allowing the negative pressure airflow to act on each adsorption hole 2121 in a timely manner, thus improving the adsorption timeliness of the second adsorption zone 2002. Furthermore, the staggered arrangement of multiple adsorption channels 2122 and multiple adsorption holes 2121 effectively avoids adsorption interference between the first adsorption zone 2001 and the second adsorption zone 2002.

[0053] Please continue reading. Figures 5 to 8 As shown, exemplarily, the adsorption base 21 includes a base 211 and an adsorption cover plate 212 fastened to the base 211. The base 211 and the adsorption cover plate 212 together define a cavity, and a partition plate 22 is installed between the base 211 and the adsorption cover plate 212. The base 211 is configured with a first pore 2111, which connects to the first air passage 11 and the first cavity 2101a. Furthermore, the base 211 is also configured with a second pore 2112, which connects to the second air passage 12 and the second cavity 2101b. The second pore 2112 and the first pore 2111 are arranged in a staggered manner.

[0054] Specifically, the substrate 211 and the adsorption cover plate 212 are each provided with a cavity, which facilitates the formation of the cavity of the adsorption base 21 when the two are fastened together. The arrangement of the first vent 2111 and the second vent 2112 facilitates the flow of gas transported through the first gas passage 11 and the second gas passage 12 along their respective vents, so as to flow into their respective first cavities 2101a and second cavities 2101b, thereby realizing the adsorption operation of the first adsorption zone 2001 and the second adsorption zone 2002; and, during the gas transport process, it is ensured that there is no interference between the gases, thus improving the adsorption stability.

[0055] Please continue reading. Figures 5 to 8 As shown, in some specific embodiments, multiple adsorption channels 2122 and multiple adsorption holes 2121 are all disposed on the adsorption cover plate 212, and therefore the corresponding protrusions 2102 and recesses 2103 are also disposed on the adsorption cover plate 212. At the same time, along the first axis direction, the projection range of the protrusions 2102 and the projection range of the recesses 2103 are within the projection range of the adsorption cover plate 212; and the sum of the projection areas of the protrusions 2102 and the projection areas of the recesses 2103 is equal to the projection area of ​​the adsorption cover plate 212, so that the wafer 300 can be precisely flattened and covered to the second adsorption area 2002 under the action of multiple first adsorption areas 2001.

[0056] Furthermore, there are four recesses 2103, which are evenly distributed around the first axis, causing the protrusions 2102 to form a cross shape. Each recess 2103 is radially inwardly curved to soften sharp edges, facilitating installation of the Bernoulli suction cup 23 while improving safety. Simultaneously, the extended ends of each recess 2103 at the corresponding curved position are gradually widened to provide a larger installation space; and the corresponding portions of the protrusions 2102 are also gradually widened to ensure a larger adsorption range.

[0057] In alternative embodiments, the number of recesses 2103 can also be three, five, etc., each recess 2103 corresponds to an adsorption channel 2122, and each recess 2103 is evenly distributed around the first axis to ensure that the adsorption force of each first adsorption region 2001 on the wafer 300 is uniform, so that the wafer 300 can be more flatly spread and cover the second adsorption region 2002.

[0058] Please continue reading. Figures 5 to 8As shown, in an optional embodiment, the substrate 211 is constructed with an air channel 2113 communicating with the first air hole 2111. The air channel 2113 is located within the first cavity 2101a, and the partition plate 22 is provided with a plurality of through holes 2201 along the path of the air channel 2113. Each through hole 2201 is connected to a first adsorption zone 2001. That is, the air channel 2113 is used to guide the flow of gas and connect the various first adsorption zones 2001 to achieve gas diversion. When the partition plate 22 is installed on the substrate 211, it is exactly sealed at the opening of the air channel 2113. Thus, the plurality of through holes 2201 on the partition plate 22 can be used to connect with their respective first adsorption zones 2001. Specifically, each through hole 2201 corresponds to an adsorption channel 2122 on the adsorption cover plate 212, and the through holes 2201 are evenly distributed around the first axis. The vertical distance between the axis of each through hole 2201 and the axis of the base 211 is basically the same.

[0059] like Figure 8 As shown, the airway groove 2113 further includes an annular groove and a radial groove. The annular groove is disposed around the first axis on the base 211, and the length of the radial groove extends along the diameter direction of the annular groove, with its two ends respectively communicating with portions of the annular groove on the same side. The first air hole 2111 is disposed in the middle or near the middle of the radial groove. In this way, the communication between the first air hole 2111 and the airway groove 2113 can be satisfied, as well as the purpose of diverting air through the airway groove 2113.

[0060] In an alternative embodiment, the air passage groove 2113 may also include a plurality of radial grooves radiating from the center of the substrate 211, with the first air hole 2111 disposed at the intersection of the radial grooves relative to the center of the substrate 211. It should be noted that the arrangement of the air passage groove 2113 includes, but is not limited to, the above description, and is only an example here.

[0061] like Figures 5 to 7As shown, in actual use, a first sealing ring 231 is pressed onto the side of each through hole 2201 facing the adsorption cover plate 212. That is, the first sealing ring 231 is located inside the second cavity 2101b and installed at the junction of the through hole 2201 and the adsorption channel 2122 to isolate each through hole 2201 and each adsorption channel 2122 from the second cavity 2101b, thereby improving the sealing performance of the junction between the through hole 2201 and the adsorption channel 2122 and reducing the adsorption interference between the first adsorption region 2001 and the second adsorption region 2002. At the same time, when the adsorption cover plate 212 is fastened to the substrate 211, a second sealing ring 232 is pressed onto the side of the substrate 211 facing the adsorption cover plate 212 to improve the sealing performance between the adsorption cover plate 212 and the substrate 211. Specifically, the second sealing ring 232 is installed on the side of the partition plate 22 away from the first cavity 2101a to separate the first cavity 2101a and the second cavity 2101b; and each of the first sealing rings 231 is located within the area enclosed by the second sealing ring 232.

[0062] Furthermore, the partition plate 22 is constructed with a through hole 2202, and the base 211 is provided with a protrusion 2114 that is adapted to the through hole 2202. The protrusion 2114 passes through the through hole 2202 and extends into the second cavity 2101b. The second air hole 2112 is constructed on the protrusion 2114.

[0063] In other words, the protrusion 2114 is designed to elevate the second air hole 2112 relative to the first air hole 2111, thus achieving a staggered arrangement of the first air hole 2111 and the second air hole 2112 and reducing interference. Since the partition plate 22 is pressed against the opening of the air channel groove 2113, and the first air hole 2111 is located within the air channel groove 2113, a through hole 2202 needs to be provided on the partition plate 22 so that the protrusion 2114 on the base 211 passes through the first cavity 2101a and extends into the second cavity 2101b. This allows the second air hole 2112 to connect to the corresponding second cavity 2101b, and also separates the first air hole 2111 and the second air hole 2112. Specifically, the first air hole 2111 is below the partition plate 22, and the second air hole 2112 is above the partition plate 22.

[0064] In some specific embodiments, the air passage 2113 includes an annular groove and a radial groove communicating with the annular groove, which divides the first cavity 2101a into two parts along its own width direction. Therefore, the base 211 has protrusions 2114 in both of these regions, each protrusion 2114 corresponding to a through hole 2202, and the sidewall of the protrusion 2114 along the first axis direction is sealed to the hole wall of the corresponding through hole 2202. The partition plate 22 is welded and fixed relative to the protrusion 2114, specifically by friction stir welding; of course, other assembly methods are also possible, which are not specifically limited here.

[0065] The following is a detailed description of the driving of the adsorption platform 20 in the alignment device 100.

[0066] Please combine Figure 1 , Figure 2 , Figure 4 and Figure 9 As shown, in some embodiments, the adsorption platform 20 has a mounting column 24 protruding from the side facing the adsorption power source 10. The alignment device 100 also includes a rotating mechanism 30 connected to the mounting column 24 to drive the adsorption platform 20 to rotate around a first axis. Simultaneously, the alignment device 100 also includes a lifting mechanism 40 connected to the mounting column 24 to drive the adsorption platform 20 to move along the first axis. Specifically, the mounting column 24 provides a mounting portion for the connection between the adsorption platform 20 and the rotating mechanism 30 and lifting mechanism 40, preventing damage to the first adsorption area 2001 and the second adsorption area 2002 caused by the rotating mechanism 30 and lifting mechanism 40 being directly connected to the adsorption platform 20; furthermore, the mounting column 24 increases the distance between the rotating mechanism 30 and lifting mechanism 40 and the adsorption platform 20, improving assembly safety.

[0067] In practical use, after the second adsorption area 2002 stably adsorbs the wafer 300, the rotation mechanism 30 can be used to drive the adsorption platform 20 to rotate around the first axis via the mounting column 24 to adjust the position of the wafer 300. Simultaneously, the lifting mechanism 40 can also be used to drive the adsorption platform 20 to move along the first axis (i.e., the Z-axis) via the mounting column 24 to adjust the distance between the wafer and the robotic arm, or between the wafer and the image acquisition device 200. During this process, the multiple first adsorption areas 2001 allow the wafer 300 to be flattened on the adsorption platform 20 and cover the second adsorption area 2002, improving the alignment between the wafer 300 and the second adsorption area 2002 and ensuring that the second adsorption area 2002 can stably adsorb the wafer 300. Thus, even when rotating under the action of the rotation mechanism 30 or lifting under the action of the lifting mechanism 40, the position of the wafer 300 relative to the adsorption platform 20 will not easily change, thereby improving the alignment accuracy of the wafer 300.

[0068] The specific structures of the rotating mechanism 30 and the lifting mechanism 40 are described below.

[0069] Please continue reading. Figure 1 , Figure 4 and Figure 9 As shown, exemplarily, the rotating mechanism 30 includes a rotating power source 31, a rotating shaft 32, and a power transmission assembly 33. The power transmission assembly 33 is drively connected between the rotating power source 31 and the rotating shaft 32. The rotating shaft 32 is connected between the adsorption power source 10 and the mounting column 24, and the rotating shaft 32 is rotatably connected to the adsorption power source 10. The rotating shaft 32 is configured with a first air passage 3201 and a second air passage 3202. The first air passage 3201 connects to the first air path 11 and the first adsorption zone 2001, and the second air passage 3202 connects to the second air path 12 and the second adsorption zone 2002.

[0070] In other words, the rotating shaft 32 is not only used to connect the mounting column 24 to transmit torque, but also to connect the adsorption power source 10 and the adsorption platform 20 to meet gas delivery requirements. Specifically, the mounting column 24 is provided with a third air passage 2401 and a fourth air passage 2402, which are spaced apart and not connected to each other. The third air passage 2401 connects to the first air passage 3201 and the first air hole 2111, and the fourth air passage 2402 connects to the second air passage 3202 and the second air hole 2112. The first air path 11 connects to the first air passage 3201, and the second air path 12 connects to the second air passage 3202. In this way, gas delivery between the adsorption power source 10 and the adsorption platform 20 can be satisfied. In addition, the rotating shaft 32 extends the distance between the adsorption power source 10 and the adsorption platform 20 to reduce assembly interference between the rotating mechanism 30 and the adsorption power source 10.

[0071] Furthermore, the power transmission assembly 33 includes a driving wheel 331, a driven wheel 332, and a transmission belt 333 tensioned between the driving wheel 331 and the driven wheel 332. The driving wheel 331 is connected to the rotating power source 31, and the driven wheel 332 is connected to the rotating shaft 32 to drive the rotating shaft 32 to rotate synchronously. That is, in this embodiment, a belt drive is used to satisfy the rotation of the rotating shaft 32, which can absorb vibration and improve the rotational stability of the adsorption platform 20. Moreover, this arrangement can change the transmission direction of the rotating power source 31 and separate the rotating power source 31 and the rotating shaft 32 along the rotation direction of the transmission belt 333, reducing the space occupied by the rotating mechanism 30 along the axial direction of the rotating shaft 32 and improving the space utilization in the horizontal direction. The wheel diameters of the driving wheel 331 and the driven wheel 332 can be different. For example, the wheel diameter of the driving wheel 331 is smaller than that of the driven wheel 332. In this way, a deceleration effect can be achieved, so that the rotational speed of the rotating shaft 32 is lower, thereby improving the rotational stability of the adsorption platform 20.

[0072] It should be noted that the axis of the rotating shaft 32 is the first axis, and the axis of the mounting column 24, the axis of the adsorption platform 20, and the axis of the rotating shaft 32 coincide, that is, they are coaxially set.

[0073] In an optional embodiment, the rotating mechanism 30 further includes a connecting sheet metal 60, one end of which is connected to the rotating power source 31 and the other end of which is connected to the adsorption power source 10.

[0074] Specifically, the rotary power source 31 needs to be assembled with the machine using a rotary mounting base, and the adsorption power source 10 also needs to be installed stably. Therefore, a connecting sheet metal 60 is used to fix the rotary power source 31 and the adsorption power source 10 to connect the adsorption power source 10 relative to the rotary power source 31, ensuring that the position of the adsorption power source 10 will not easily change, and making it easier to stably support the rotating shaft 32 connected to it; moreover, this arrangement can better prevent the air pipe connected to the adsorption power source 10 from getting tangled due to rotation.

[0075] like Figure 1 and Figure 9 As shown, in some specific embodiments, the adsorption power source 10 includes a rotating part 101 and a fixed part 102. Both the rotating part 101 and the fixed part 102 are provided with a positive pressure air chamber and a negative pressure air chamber, and the corresponding positive pressure air chamber and the corresponding negative pressure air chamber are each connected to each other. The rotating part 101 is rotatably connected to the fixed part 102, and the rotating part 101 is connected to the rotating shaft 32 so as to rotate synchronously with the rotating shaft 32. The positive pressure air chamber in the rotating part 101 is connected to the first air passage 3201 in the rotating shaft 32 through a first air passage 11, and the negative pressure air chamber in the rotating part 101 is connected to the second air passage 3202 in the rotating shaft 32 through a second air passage 12. The fixed part 102 is connected to the connecting sheet metal 60 to prevent the air pipes from tangling.

[0076] Please continue reading. Figure 1 , Figure 4 and Figure 9 As shown, in some embodiments, the lifting mechanism 40 includes a lifting power source 41, a transmission rod 42, and a transmission block 43. The lifting power source 41 drives the transmission rod 42 to rotate around a first axis. The transmission block 43 is screwed to the transmission rod 42 and can move along the first axis. The transmission block 43 is connected to the mounting column 24. This arrangement allows the adsorption platform 20 to reciprocate along the Z-axis to adjust the distance between the wafer 300 and the robot arm, facilitating the picking and placing of the wafer 300. In actual use, a mounting base 241 is connected to the mounting column 24. The mounting base 241 can be movably mounted on the machine tool for mounting the alignment device 100 to support the alignment device 100. The transmission block 43 is connected to the mounting base 241, and the mounting base 241 is constructed with a mounting hole for the transmission rod 42 to pass through. The diameter of the mounting hole is larger than the outer diameter of the transmission rod 42, preventing contact or interference between the two. The lifting power source 41 is mounted on the machine tool using a lifting mounting seat.

[0077] Furthermore, the alignment device 100 also includes a guide seat 50, which is slidably connected to the mounting column 24 to restrict the rotation of the mounting column 24 around the axis of the transmission rod 42. Specifically, the mounting base plate 241 on the mounting column 24 is constructed with a sliding groove, and the guide seat 50 is provided with a slide rail. The slide rail cooperates with the sliding groove to guide the movement of the mounting base plate 241 along the Z-axis. Moreover, it is precisely because of this arrangement that the rotation of the mounting base plate 241 around the axis of the transmission rod 42 can be limited, thereby limiting the rotation of the transmission block 43 around the axis of the transmission rod 42, so that the mounting base plate 241 can only move linearly along the Z-axis.

[0078] Furthermore, limit blocks are installed on the guide seat 50. The limit blocks are located at both ends of the slide rail along its length to limit the movement of the mounting base 241 along the Z-axis, preventing it from falling out of the support range of the slide rail. The guide seat 50 can also be installed on a machine tool to ensure guiding stability.

[0079] When a mounting base plate 241 is provided on the mounting column 24, since the rotating shaft 32 is connected to the mounting column 24, when the lifting mechanism 40 cooperates with the mounting base plate 241 to lift the adsorption platform 20, the rotating mechanism 30 lifts and lowers synchronously, thereby reducing operational interference between the lifting mechanism 40 and the rotating mechanism 30. At this time, the rotating mounting seat for mounting the rotating power source 31 can also cooperate with the machine tool via a slider and guide rail. The specific assembly method is existing mature technology and will not be described in detail here.

[0080] like Figures 1 to 9As shown, another embodiment of this application provides a wafer inspection system, including the aforementioned alignment device 100 and image acquisition device 200. The image acquisition device 200 is installed on one side of the alignment device 100 along the first axis and is located above the adsorption platform 20 in the alignment device 100. The image acquisition device 200 is used to acquire image information of the wafer 300 adsorbed by the alignment device 100. That is, after the alignment device 100 adsorbs and fixes the wafer 300 through the second adsorption area 2002, the rotation mechanism 30 and the lifting mechanism 40 can be activated respectively, driving the adsorption platform 20 to move within the imaging range of the image acquisition device 200, thereby allowing the image acquisition device 200 to take a picture of the wafer 300. Specifically, a notch is reserved on the wafer 300 to allow the image acquisition device 200 to capture the location of the notch for robotic arm operation.

[0081] like Figure 4 , Figure 9 and Figure 10 As shown, another embodiment of this application provides a wafer alignment method based on the alignment apparatus 100 described above. This wafer alignment method includes the following steps:

[0082] The first gas path 11 is activated to initially position the wafer 300 through each first adsorption area 2001, causing the wafer 300 to cover the second adsorption area 2002; the second gas path 12 is activated to adsorb and fix the wafer 300 through the second adsorption area 2002; the alignment device 100 drives the wafer 300 to rotate around the first axis, and the alignment device 100 drives the wafer 300 to move along the first axis; once it is in place, image information of the wafer 300 after adsorption and fixation is acquired.

[0083] In actual use, the positive pressure gas delivered by the first air passage 11 flows along the first air channel 3201 and the third air channel 2401 to the first air hole 2111, and is then diverted along the air channel groove 2113 to the four adsorption channels 2122, so as to flow to their respective Bernoulli chucks 23. The negative pressure cyclone formed after the positive pressure airflow is introduced to the Bernoulli chucks forms an initial adsorption on the wafer 300, causing the wafer 300 to flatten on the adsorption platform 20 and cover the second adsorption area 2002; this is the initial positioning of the wafer 300 relative to the second adsorption area 2002. Next, the second air passage 12 is activated to evacuate the second air channel 3202, the fourth air channel 2402 and the second air hole 2112, which acts on the multiple adsorption holes 2121 to form a negative pressure at the multiple adsorption holes 2121 to adsorb the wafer 300, thereby achieving the adsorption and fixation of the wafer 300. Then, according to actual needs, the rotation mechanism 30 can be activated to drive the adsorption platform 20 to rotate around its own axis via the rotation shaft 32, thereby adjusting the position of the notch on the wafer 300 to a preset position for easy operation by the robotic arm. Additionally, after rotation, the lifting mechanism 40 can be activated to drive the adsorption platform 20 to move along the Z-axis to adjust the distance between it and the robotic arm. After adjustment, the image acquisition device 200 takes a picture of the wafer 300 to obtain the position of the notch.

[0084] Furthermore, in actual operation, after activating the second gas path 12 to adsorb and fix the wafer 300 through the second adsorption zone 2002, the first gas path 11 is then closed after the second adsorption zone 2002 has adsorbed for a certain period of time, thus cutting off the adsorption of the wafer 300 by each of the first adsorption zones 2001. This setting ensures that the second adsorption zone 2002 can stably adsorb the wafer 300, preventing the wafer 300 from shifting, and also has an energy-saving effect. Here, "the first period of time" does not refer to a specific time interval, but is merely a name used for ease of description.

[0085] In an alternative embodiment, the alignment device 100 can also drive the wafer 300 to rotate only around the first axis or move only along the direction of the first axis, as long as it can ensure that the wafer 300 is moved to the target position so as to acquire image information of the wafer 300.

[0086] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. An alignment device, characterized in that, The alignment device (100) includes: The adsorption power source (10) has a first air passage (11) and a second air passage (12) that are independently set up; An adsorption platform (20) is rotatable around a first axis; the adsorption platform (20) is constructed with a first adsorption zone (2001) and a second adsorption zone (2002), the first adsorption zone (2001) is connected to the first gas passage (11), and the second adsorption zone (2002) is connected to the second gas passage (12); multiple first adsorption zones (2001) are provided and are spaced apart on the outside of the second adsorption zone (2002); the adsorption platform (20) includes an adsorption base (21) and a partition plate (22); Along the first axis, one side of the adsorption platform (20) is provided with a protrusion (2102) and a recess (2103). The protrusion (2102) is provided with a plurality of notches arranged at intervals around the first axis, and each notch corresponds to a recess (2103). The protruding portion (2102) is configured with a plurality of spaced-apart adsorption holes (2121) to define the second adsorption area (2002), the recessed portion (2103) is configured with an adsorption channel (2122), and the adsorption platform (20) further includes a plurality of Bernoulli suction cups (23), each of the Bernoulli suction cups (23) being mounted on a recessed portion (2103) and connected to the corresponding adsorption channel (2122) to define a first adsorption area (2001).

2. The alignment device according to claim 1, characterized in that, The adsorption base (21) is constructed with a cavity, and the partition plate (22) is installed on the adsorption base (21) and housed in the cavity. The cavity is divided into a first cavity (2101a) and a second cavity (2101b) that are not interconnected by the partition plate (22). The first cavity (2101a) is connected to the first gas passage (11) and the first adsorption zone (2001), and the second cavity (2101b) is connected to the second gas passage (12) and the second adsorption zone (2002). The first adsorption zone (2001) and the second adsorption zone (2002) are both located on the same side of the adsorption base (21) along the first axis.

3. The alignment device according to claim 2, characterized in that, The adsorption base (21) includes a base (211) and an adsorption cover plate (212) fastened to the base (211). The base (211) and the adsorption cover plate (212) together define the cavity. The partition plate (22) is installed between the base (211) and the adsorption cover plate (212). The substrate (211) is provided with a first pore (2111) which is connected to the first air passage (11) and the first cavity (2101a). The substrate (211) is provided with a second pore (2112) which is connected to the second air passage (12) and the second cavity (2101b).

4. The alignment device according to claim 3, characterized in that, The substrate (211) is constructed with an air channel (2113) communicating with the first air pore (2111), the air channel (2113) being located within the first cavity (2101a); the partition plate (22) is provided with a plurality of through holes (2201) along the path of the air channel (2113), each of the through holes (2201) communicating with a first adsorption zone (2001).

5. The alignment device according to claim 4, characterized in that, The partition plate (22) is configured with a through hole (2202), and the base (211) is provided with a protrusion (2114) adapted to the through hole (2202). The protrusion (2114) passes through the through hole (2202) and extends into the second cavity (2101b). The second air hole (2112) is configured on the protrusion (2114). Each of the through holes (2201) is provided with a first sealing ring (231) on the side facing the adsorption cover plate (212), and a second sealing ring (232) is provided on the side of the substrate (211) facing the adsorption cover plate (212). Each of the first sealing rings (231) is located within the area enclosed by the second sealing ring (232).

6. The alignment device according to any one of claims 1 to 5, characterized in that, The adsorption power source (10) is located on one side of the adsorption platform (20) along the first axis, and the adsorption platform (20) is provided with a mounting column (24) protruding on the side facing the adsorption power source; The alignment device (100) further includes a rotating mechanism (30) connected to the mounting column (24) for driving the adsorption platform (20) to rotate about a first axis; The alignment device (100) further includes a lifting mechanism (40), which is connected to the mounting column (24) and is used to drive the adsorption platform (20) to move along the first axis.

7. The alignment device according to claim 6, characterized in that, The rotating mechanism (30) includes a rotating power source (31), a rotating shaft (32), and a power transmission assembly (33). The power transmission assembly (33) is connected between the rotating power source (31) and the rotating shaft (32). The rotating shaft (32) is connected between the adsorption power source (10) and the mounting column (24), and the rotating shaft (32) is rotatably connected to the adsorption power source (10). The rotating shaft (32) is constructed with a first air passage (3201) and a second air passage (3202). The first air passage (3201) is connected to the first air path (11) and the first adsorption zone (2001), and the second air passage (3202) is connected to the second air path (12) and the second adsorption zone (2002).

8. The alignment device according to claim 7, characterized in that, The rotating mechanism (30) further includes a connecting sheet metal (60), one end of which is connected to the rotating power source (31), and the other end is connected to the adsorption power source (10); and / or The power transmission assembly (33) includes a drive wheel (331), a driven wheel (332), and a transmission belt (333) tensioned between the drive wheel (331) and the driven wheel (332). The drive wheel (331) is connected to the rotary power source (31), and the driven wheel (332) is connected to the rotating shaft (32) to drive the rotating shaft (32) to rotate synchronously.

9. The alignment device according to claim 6, characterized in that, The lifting mechanism (40) includes a lifting power source (41), a transmission rod (42), and a transmission block (43); The lifting power source (41) is used to drive the transmission rod (42) to rotate around the axis of the transmission rod (42). The transmission block (43) is screwed to the transmission rod (42) and can move along the axis of the transmission rod (42). The transmission block (43) is connected to the mounting column (24). The alignment device (100) further includes a guide seat (50) which is slidably connected to the mounting column (24) to restrict the rotation of the mounting column (24) about the axis of the transmission rod (42).

10. A wafer inspection system, characterized in that, The wafer inspection system includes an alignment device according to any one of claims 1 to 9, and an image acquisition device (200), wherein the image acquisition device (200) is mounted on one side of the alignment device (100) along the first axis direction and is located above the adsorption platform (20) in the alignment device (100); The image acquisition device (200) is used to acquire image information of the wafer (300) adsorbed by the alignment device (100).

11. A wafer alignment method, characterized in that, Based on the alignment apparatus according to any one of claims 1 to 9, the wafer alignment method includes the following steps: The first gas path (11) is activated to initially position the wafer (300) through each first adsorption region (2001), causing the wafer (300) to cover the second adsorption region (2002); The second gas path (12) is activated to adsorb and fix the wafer (300) through the second adsorption zone (2002); The alignment device (100) drives the wafer (300) to rotate about the first axis and / or move along the direction of the first axis; Once the wafer is in place, image information of the wafer (300) after adsorption and fixation is obtained.

12. The wafer alignment method according to claim 11, characterized in that, The process of activating the second gas path (12) to adsorb and fix the wafer (300) through the second adsorption region (2002) includes: After the second adsorption zone (2002) has adsorbed for a first time, the first gas path (11) is closed to cut off the adsorption of the wafer (300) by each first adsorption zone (2001).

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