A copper-free pure gold flexible circuit board processing method and copper-free pure gold flexible circuit board

Abstract

The application discloses a copper-free pure gold flexible circuit board processing method and a copper-free pure gold flexible circuit board. The method comprises the following steps: selecting a copper foil with a preset first thickness and cutting, pasting a bearing film and a photosensitive dry film on two sides of the copper foil respectively; exposing a non-pattern area by using a negative to expose a pattern area, and plating gold in the pattern area; removing the photosensitive dry film in the remaining part, pasting a first PI protective film on one side of the copper foil after gold plating and compacting; removing the bearing film and etching all copper layers; selecting a second PI protective film which is pre-opened at a required position and pasting the second PI protective film on one side of the copper foil after etching all copper layers and compacting, so that the copper-free pure gold flexible circuit board is obtained. The copper-free pure gold flexible circuit board can be prepared by using the existing process equipment of the circuit board, the manufacturing cost is low, and the copper-free pure gold flexible circuit board can be used for industrial mass production, so that the enterprise cost is effectively reduced, and the enterprise benefit is provided.

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