A precision cooling rack for data centers based on the Peltier effect

Abstract

The present invention belongs to the technical field related to data center refrigeration, and relates to an intelligent rack that utilizes the Peltier effect to precisely cool local hot spots in a data center. The present invention's precise cooling rack, based on heat dissipation channels and heat pipes, comprises a precise cooling TEC air conditioning unit, a heat dissipation channel system, and an intelligent adjustment system. The precise cooling TEC air conditioning unit is integrated into a frame, which is positioned at the server entrance and fits into the server mounting slots to receive cold air from the data center's cold aisles. Intelligent scheduling systems are located on both sides of the frame, enabling it to be moved and scheduled according to real-time changes in the data center's load. The present invention's intelligent rack has a compact structure and a high degree of integration. It can reduce thermal non-uniformity in the air, lower energy consumption, improve the rationality and stability of the thermal environment within the data center rack, and enhance server reliability.

Description

Technical Field

[0001] The present invention belongs to the technical field related to data center refrigeration, and more specifically, relates to an intelligent rack that utilizes the Peltier effect to accurately cool local hot spots in a data center. Background Art

[0002] With the continuous development of the digital economy and the requirements of "carbon peak and carbon neutrality," the increasing energy consumption of data centers has become a pressing issue. Currently, air-cooled data centers are the most mainstream type of data center. Most of these data centers use a cold-aisle air conditioning system structure. This air cooling method has the advantages of low cost, simple construction, and convenient adjustment. However, with the popularization of virtualization technology, more and more data centers are adopting oversubscription technology. This can cause the energy consumption of a particular server to suddenly increase, causing the local thermal environment to deteriorate and thus generating local hotspots.

[0003] However, existing data center thermal environment regulation methods mostly rely on room-level airflow adjustments, such as lowering the supply air temperature and increasing the air flow rate. This holistic approach can overcool areas with normal temperatures, causing servers to overheat. Furthermore, due to the inherent hysteresis of the HVAC system, adjustments to air conditioning parameters cannot promptly eliminate local hotspots. Furthermore, such wide-ranging adjustments increase the energy consumption of the air conditioning system. Data shows that for every 1°C decrease in the air conditioning system's set temperature, the energy consumption of the refrigeration unit increases by 6%-8%, resulting in significant energy waste. Therefore, to address the frequent occurrence of hotspots in air-cooled data centers, it is necessary to develop a cooling technology that can quickly and accurately eliminate local hotspots. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a cooling device and an application method thereof that can quickly and accurately eliminate local hot spots.

[0005] The Peltier effect refers to the phenomenon that when an electric current passes through a loop composed of different conductors, in addition to generating irreversible Joule heating, heat absorption and heat release will occur at the joints of different conductors depending on the direction of the current. The research of the present invention shows that a data center precision cooling rack based on the Peltier effect can be designed. Based on the working characteristics of existing data centers, an intelligent rack that uses the Peltier effect to accurately cool local hot spots in the data center is designed. The intelligent rack is designed with hot and cold channels integrated on the rack, and combined with thermoelectric cooling technology based on the Peltier effect, it can accurately eliminate local hot spots point by point; before a local hot spot occurs, the intelligent adjustment system obtains the power consumption value of each server in the cabinet, senses the location of the hot spot in advance, moves to the corresponding server position through the transmission system, adjusts the cooling power according to the server power consumption, and accurately cools the server to achieve the purpose of eliminating the hot spot, solving the energy waste problem caused by the reduction of the global supply air temperature during adjustment of the traditional air conditioning system. The present invention is completed based on this research.

[0006] In one aspect, the present invention provides a data center precision cooling rack based on the Peltier effect. The rack includes a precision cooling TEC (semiconductor cooler) air conditioning unit 200, a heat dissipation channel 104, and an intelligent adjustment system 107. The precision cooling rack based on heat dissipation channels and heat pipes includes a rack frame 101, a server 102 (or a server cabinet), two rows of soft sealing brushes 103, two heat dissipation channels 104, four air shields 105, and server mounting slots 106. The server mounting slots 106 are threadedly connected to the rack frame 101, and the servers 102 are each placed above the server mounting slots 106. Two rows of channels are defined between the rack frames 101. The two rows of soft sealing brushes 103 prevent the hot and cold channels from connecting, thereby preventing airflow short-circuiting.

[0007] The precision cooling TEC air conditioning unit is integrated into a frame 205. This frame 205 is positioned at the entrance of the server 102 and aligns with the server mounting slots 206, receiving cool air from the data center's cold aisles. Intelligent scheduling systems are installed on both sides of the frame 205, enabling it to be moved and scheduled according to real-time changes in the data center's load. When the air conditioning unit is moved, the windshield 105 connected to the movable frame 205 pushes aside the soft sealing brushes 103, forming a heat dissipation channel 104 between the frame and the rack frame 101. Two TEC hot-end fin heat sinks 201 are located within these two heat dissipation channels 104.

[0008] Preferably, the precision cooling TEC air conditioning device further includes a plurality of spaced fins 212, which are sleeved on the evaporation section of the heat pipe and are used to enhance the heat transfer coefficient of the surface of the evaporation section of the heat pipe; the heat pipe 211 is connected to the connection port 204 on the surface of the TEC cold end heat sink 203 and is sealed and enhanced with silicone grease; several heat pipes 211 connected to the connection port 204 on the surface of the TEC cold end heat sink 203 are arranged in a staggered or sequential manner to achieve a balance between local resistance and heat transfer characteristics; two TEC elements 202 are respectively located at the left and right ends of the movable frame 205, and the two heat sinks 203 are connected to the cold end of the TEC element 202, with the cold end facing the inside of the movable frame 205; the hot ends of the two TEC elements 202 are externally connected to the fin heat sink 201.

[0009] Preferably, the TEC element 202 is embedded in a movable frame 205 to prevent mixing of hot and cold air caused by the interconnected hot and cold channels. The heat sink 203 directs the cooling energy from the TEC element 202 into the frame interior, thereby increasing the heat exchange area. This cooling energy is diffused toward the center of the frame by heat pipes 211 passing through the connection port 204 on the surface of the TEC cold-end heat sink 203, where it is transferred to the inlet cold air.

[0010] Preferably, the intelligent adjustment system also includes a motor 304, which drives the device to move; there are four motors 304 and they are respectively fixed to the frame 205, and the four motors 304 are moved through the cable 301 system, and there are four cables 301, which are fixed in the rack outer frame 101 through a fixing device; there are eight guide pulleys 303 on the surface of the four cables, and the eight guide pulleys 303 are respectively arranged at two points of the cable 301; a cable guide 302 is installed above or below the pulley.

[0011] Preferably, the TEC hot-end fin heat sink 201 is spaced apart in a direction perpendicular to the airflow direction in the cold channel of the data center where the air-conditioning device is located; parameters such as the spacing and thickness between the fins need to be optimized by CFD (computational fluid dynamics).

[0012] Preferably, the heat dissipation method of the TEC hot end fin heat sink 201 is to use the low-temperature air in the cold channel of the data center to increase the flow rate through the heat dissipation channel 104 to perform air cooling on the TEC hot end fin heat sink 201.

[0013] Preferably, the heat dissipation channel 104 is formed by a windshield 105 fixed on the precise refrigeration and air-conditioning device and enclosed by the rack outer frame 101, and a soft sealing brush 103 is installed between the outer frames to close other channels, so that the heat dissipation channel 104 moves with the movement of the precise refrigeration and air-conditioning device, thereby reducing the dissipation of cold air.

[0014] Preferably, the heat pipe 211 is composed of two opposite heat pipe sections connected together, and the evaporation sections are connected by welding. In addition to being filled with a working fluid, the heat pipe 211 also includes a mesh wick. The heat pipe 211 transfers cold energy from the surface of the TEC cold end heat sink 203 to the fin (group) 212 through the internal working fluid, and then diffuses it into the interior of the rack, thereby reducing the server temperature.

[0015] Specifically, the rack of the present invention includes a precision cooling TEC air conditioning device, a heat pipe heat exchanger, an intelligent scheduling system, a heat dissipation channel, a server mounting slot, and a control system;

[0016] The precision cooling TEC air conditioning system is integrated into a frame, with hot-end finned heat sinks, TEC elements, cold-end heat sinks, and connectors mounted on both sides. The frame is placed at the server entrance, generating a localized low temperature to further cool the cold air flowing from the data center's cold aisle. Two TEC elements are located on the left and right ends of the movable frame, with two cold-end heat sinks connected to the cold ends of the TEC elements, facing into the movable frame. The hot ends of the two TEC elements are externally connected to hot-end finned heat sinks.

[0017] The heat pipe heat exchanger consists of a heat pipe and a fin group. The heat pipe is connected to the connection port on the surface of the heat sink at the cold end of the TEC. The fin is sleeved on the evaporation section of the heat pipe to enhance the heat transfer coefficient of the evaporation section of the heat pipe.

[0018] The control system is installed on both sides of the precision cooling TEC air-conditioning device. After the intelligent scheduling system located above the cabinet receives the server power consumption data of the data center, the intelligent scheduling system can perform mobile scheduling based on the real-time changes in the data center load and move the precision cooling TEC air-conditioning device to the corresponding hot server location; at the same time, the control system receives signals from the intelligent scheduling system and adjusts the TEC current to match the TEC cooling power with the power required for server cooling, thereby achieving the purpose of precise cooling.

[0019] The heat dissipation channel is formed by a windshield fixed on the precise refrigeration and air-conditioning device and an outer frame of the rack. Soft sealing brushes are installed between the outer frames, so that the heat dissipation channel moves with the movement of the precise refrigeration and air-conditioning device to close other channels and reduce the dissipation of cold energy.

[0020] The server installation slot is a server fixing bracket, which consists of 48 installation slots in 1U (1U=44.45mm) units. Each installation slot is equipped with a baffle. When no server is installed in the slot, the slot opening is blocked to avoid mixing of cold and hot air flows and causing waste of cooling capacity.

[0021] The intelligent scheduling system, located directly above the cabinet, consists of a data receiving module, a data processing module, and a signal transmission module. The control system receives server power consumption data from the data center's operations and maintenance department. After calculations by the data processing module, the signal transmission module sends control signals to the control system.

[0022] Furthermore, the TEC elements of the precision cooling TEC air conditioner are embedded in the movable frames of the heat dissipation channels to prevent the mixing of hot and cold air caused by the connection between the hot and cold channels. The heat sink guides the cooling energy of the TEC elements into the interior of the frame, thereby increasing the heat exchange area. The introduced cooling energy is diffused toward the center of the frame by the heat pipe connected to the connection port on the surface of the TEC cold end heat sink, and then transferred to the inlet cold air.

[0023] Furthermore, the TEC hot-end fin heat sink is spaced apart in a direction perpendicular to the airflow direction in the cold channel of the data center where the air-conditioning device is located; parameters such as the spacing and thickness between the fins need to be calculated through CFD finite element analysis.

[0024] Furthermore, the heat dissipation method of the TEC hot end fin heat sink is to use the low-temperature air in the cold channel of the data center to increase the flow rate through the heat dissipation channel to perform air cooling on the TEC hot end fin heat sink.

[0025] Furthermore, the number of heat pipes is 4, which needs to satisfy the balance between local resistance and heat transfer characteristics; the number of fins is 35.

[0026] Furthermore, the heat pipe is connected by two opposite sections of heat pipes, and the evaporation sections are connected by welding; in addition to being filled with a working fluid, the interior of the heat pipe also includes a mesh liquid absorption core; the heat pipe transfers the cold energy from the TEC cold end heat sink surface to the fin group through the internal working fluid, and then diffuses it into the interior of the rack, thereby reducing the server temperature.

[0027] Furthermore, the connection between the heat pipe and the TEC cold end is sealed and heat transfer is enhanced using thermal grease with a thermal conductivity of 8.5W·m -1 K -1 .

[0028] Furthermore, the intelligent scheduling system also includes a motor, which drives the device to move; there are four motors and they are respectively fixed to the frame, and the four motors are moved through a cable system, there are four cables, which are fixed to the outer frame of the frame through a fixing device; there are eight guide pulleys on the surface of the four cables, and the eight guide pulleys are respectively arranged at two points of the cables; a cable guide is installed above or below the pulley.

[0029] On the other hand, the present invention also provides an application of the rack. The precise cooling rack based on heat dissipation channels and heat pipes eliminates local hot spots precisely point by point. Before a local hot spot occurs, the presence of the local hot spot is sensed in advance through a pre-designed task planning algorithm and prediction algorithm, thereby improving the cooling effect.

[0030] Furthermore, when a local hot spot occurs, under the action of electric cooling, the temperatures of the TEC cold end, the TEC cold end heat sink 203, the heat pipe condensation section at the connection between the heat pipe 211 and the TEC cold end heat sink 203, the condensation section liquid wick-liquid combination layer, the condensation section vapor-liquid interface, the flowing working medium vapor from the evaporation section to the condensation section, the phase change interface of the evaporation section liquid-vapor interface, the evaporation section liquid wick-liquid combination layer, and the heat pipe evaporation section wall are reduced in sequence, thereby cooling the inlet airflow of the server 102 cabinet.

[0031] Furthermore, before a local hotspot occurs, if a high load externality is detected, the predictive component of the intelligent regulation system is activated, and the drive motor 304 is also powered on to cool the server 102 that is about to develop a local hotspot. Subsequently, the TEC element is activated, and air flows sequentially through the fin assembly, the heat pipe 211, and the server 102 with the local hotspot. The air cooled by the fin assembly, the heat pipe 211, the cold end of the TEC element 202, and the TEC cold end heat sink 203 decreases in temperature. Under lower temperature conditions, the heat transfer efficiency of the server 102 that is about to develop a local hotspot is improved.

[0032] Furthermore, when the data center rack server 102 is operating normally, the TEC element 202 is turned on for auxiliary cooling, thereby preventing the cold airflow generated by the normal cold channel cooling of the computer room air conditioner from being insufficient to achieve a good heat exchange effect; the auxiliary cooling helps reduce the power consumption of the server 102;

[0033] After the TEC element 202 is turned on, when the cold channel air passes through the heat dissipation channel 104 from the outside, the flow cross section becomes narrower, the flow velocity of the flowing air increases, and its cooling heat is utilized by the TEC hot end fin heat sink 201.

[0034] Furthermore, the cooled TEC hot-end fin heat sink 201 absorbs the heat of the hot end of the TEC element 202 , and the temperature difference between the hot and cold ends of the cooled TEC element 202 is subsequently reduced.

[0035] Furthermore, the TEC element 202 is located at the entrance of the server 102 cabinet, and the cooling object is the relatively low-temperature air in the cold channel of the data center. The heat pipe 211 and the fin group are used to enhance heat exchange, so that the operating temperature of the TEC element 202 is still lower than the temperature of the cold end surface of the TEC element 202 and will not fail.

[0036] In general, compared with the prior art, the above technical solutions conceived by the present invention mainly have the following advantages in that the intelligent rack that uses the Peltier effect to precisely cool local hot spots in the data center

[0037] Beneficial effects:

[0038] 1. The TEC air conditioning device is used to precisely apply cooling capacity to hot spots on the racks, matching the load. The liquid working fluid in the heat pipes continuously evaporates under the action of heat, transforming into a gaseous working fluid. This heat is transferred from the data center cabinet entrance and concentrated on the condensing section of the heat pipe connected to the TEC cold-end heat sink. The working fluid is cooled and condensed, then drips under the action of gravity. Combining thermoelectric cooling technology with heat pipe heat transfer, the air conditioning device reduces thermal unevenness, reduces energy consumption, improves the rationality and stability of the thermal environment within the data center racks, and enhances server reliability.

[0039] 2. The fins, the fin heat sink, the windward heat pipe array and the air conditioning device are sequentially arranged along the airflow direction of the cold channel of the data center, with a compact structure and high integration.

[0040] 3. The air-conditioning device is an enhanced device based on the original cold channel refrigeration, and does not have the exclusion of the original air-conditioning adjustment method, so as to prevent the damage caused by the local hot spot out of control problem that may occur after long-term operation or maintenance, thereby improving safety and reliability.

[0041] 4. The two fin heat sinks are respectively arranged on the opposite sides of the two TEC elements and are covered by the heat dissipation area. The sudden expansion of the heat dissipation channel can greatly reduce the air resistance along the way, increase the flow speed of the cold air, and improve the heat exchange efficiency; the two wind shields are arranged above and below the fin heat sink to prevent energy loss caused by the mixing of cold and hot, ensuring the low inlet temperature and high outlet temperature of the air blown to the heat exchanger. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, each drawing described below is for some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0043] Figure 1 It is a schematic diagram of a data center precision cooling rack based on the Peltier effect provided by the present invention.

[0044] Figure 2 yes Figure 1 Schematic diagram of the structure of the TEC air-conditioning device that uses the Peltier effect to achieve thermoelectric conversion.

[0045] Figure 3 yes Figure 1 Side view of a TEC air conditioning device that uses the Peltier effect to achieve thermoelectric conversion.

[0046] Figure 4 yes Figure 1 A partial enlarged view of the TEC air-conditioning device that uses the Peltier effect to achieve thermoelectric conversion.

[0047] Among them: 101 - rack frame, 102 - server, 103 - soft sealing brush, 104 - heat dissipation channel, 105 - wind shield, 106 - server mounting slot, 107 - intelligent scheduling system, 108 - control system, 200 - precision cooling TEC air conditioning device, 201 - TEC hot-end fin heat sink, 202 - TEC element, 203 - TEC cold-end heat sink, 204 - connection port, 205 - movable frame, 210 - heat pipe exchanger, 211 - heat pipe, 212 - fin, 301 - cable (including cable clamp), 302 - cable guide, 303 - guide pulley, 304 - motor. DETAILED DESCRIPTION

[0048] The present invention belongs to the technical field of data center refrigeration and discloses a precision cooling rack for data centers based on the Peltier effect. The rack includes a precision cooling (TEC) air conditioning unit, a heat pipe heat exchanger, an intelligent scheduling system, a heat dissipation channel, server mounting slots, and a control system. The air conditioning unit includes a TEC element and a cross-fin heat pipe bundle. The heat pipe bundle is connected to the TEC element via a heat sink and is placed at the cabinet entrance to cool overloaded or heat-stricken servers. The heat pipe bundle includes heat pipes, annular fins arranged at intervals between the heat pipes, and contact ports for connecting to the heat sink. The contact ports are located on either side of the condensing section of the heat pipes and are coated with silicone grease at the interface to control contact thermal resistance. The two contact ports are respectively connected to heat sinks at the cold end of the TEC element, located on opposite sides of the entrance. The TEC is embedded in a frame with movable guide rails, with the frame opening facing the cabinet entrance. The movable guide rails are controlled by an intelligent adjustment system. The hot end of the TEC element dissipates heat to the heat dissipation channel via the heat sink. The present invention reduces energy consumption and improves data center reliability.

[0049] The following examples of the present application will clearly and completely describe the technical solution. Obviously, the described examples are only some preferred embodiments of the present application, not all embodiments. Based on the examples in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] See Figure 1 The precision cooling rack based on heat dissipation channels and heat pipes provided by this invention combines thermoelectric cooling technology with heat pipe heat transfer, reducing thermal unevenness in the air, lowering energy consumption, improving the rationality and stability of the thermal environment within the data center rack, and increasing server reliability. Furthermore, the rack eliminates the need to lower the air temperature supplied by the air conditioner, directly converting electrical energy into cooling capacity through electric cooling technology. This reduces costs and energy consumption, simplifies the process, improves the cooling effect on the server environment during operation, and alleviates the localized hot spots on the server surface during high loads.

[0051] The precise cooling rack based on heat dissipation channels and heat pipes includes a rack outer frame 101, a server 102 (or a server cabinet), two rows of soft sealing brushes 103, two heat dissipation channels 104, four windshields 105, and a server mounting slot 106. The server mounting slots 106 are threadedly connected to the rack outer frame 101. The servers 102 are all placed above the server mounting slots 106. There are two rows of channels between the rack outer frames 101. The two rows of soft sealing brushes 103 prevent the hot and cold channels from being connected, thereby preventing airflow short circuit.

[0052] When the air conditioning unit moves, the windshield 105 connected to the movable frame 205 pushes the soft sealing brush 103 aside, forming the heat dissipation channel 104 between the windshield 105 and the rack outer frame 101. The two TEC hot-end fin heat sinks 201 are located within the two heat dissipation channels 104. In this embodiment, the inlet flow velocity of the server 102 is 2.86 m / s, which is mainly used to remove the heat generated by the server. The heat pipe 211, the TEC hot-end fin heat sink 201, and the TEC cold-end heat sink 203 are made of copper or aluminum, preferably copper to increase thermal conductivity, eliminate key thermal resistance points, and accelerate heat dissipation. The soft sealing brush 103 is an aluminum alloy strip brush.

[0053] See Figure 2The air conditioning unit includes a movable frame 205, a TEC element 202 housed within the movable frame, a TEC cold-end heat sink 203, a connector 204, and a heat pipe heat exchanger 210. The heat pipe heat exchanger includes a heat pipe 211 and a plurality of spaced fins 212. The heat pipe 211 and fins 212 are arranged along the airflow direction of the air conditioning unit. The TEC hot-end fin heat sink 201 is disposed outside the outdoor unit housing and is used to cool the TEC element 202, reduce temperature differences, and improve the COP (Coefficient of Performance) of the TEC element 202. The TEC hot-end fin heat sink 201 is disposed at the hot end of the TEC element 202. The heat pipe 211 and fin 212 are designed and arranged, and parameters such as spacing, thickness, length, sequential or staggered arrangement, number of rows, diameter, and wall thickness can be selected based on specific thermal characteristics and heat exchange requirements.

[0054] The air conditioning system is installed at the entrance of the server 102. One end of the movable frame 205 is open facing the entrance of the server 102, and the other end is connected to the data center's cold aisle, which functions as a static pressure box. In this embodiment, the data center's cold aisle air supply temperature is 20°C. When a local hot spot occurs, the movable frame 205, controlled by a motor 304 and cable 301, moves to the local hot spot. The TEC element 202 begins to provide cooling. The hot-end heat is discharged by the TEC hot-end fin heat sink 201 through the heat dissipation channel 104 to the data center's hot aisle. The cold-end cooling is delivered by the TEC cold-end heat sink 203 through the heat pipe 211 and fins 212 to the rack outer frame 101. The rack outer frame 101 is connected to the data center's hot aisle. In this embodiment, the data center's hot aisle is located at the rack exit.

[0055] The two windshields 105 are respectively arranged on the upper and lower sides of the heat dissipation channel 104 to remove the heat in the heat dissipation channel 104 when air passes through. At the same time, the windshield 105 is used to isolate the server inlet from the fin heat sink, and cooperates with the movable frame 205 to isolate the airflow from the cold end and the hot end of the TEC to prevent heat backflow.

[0056] See Figure 3The pulley system includes a cable (including a cable clamp) 301, a cable guide 302 along the direction of the cable 301, a guide pulley 303 supporting the cable 301, and a motor 304. The cable 301 is set on the frame 101 using fasteners, and is used to guide the movement of the movable frame 205 and the air-conditioning device. The cable 301 is placed vertically, passing through the windshield 105 and the cable guide 302, and the cable 301 and the windshield 105 are sealed; multiple guide pulleys 303 are arranged at intervals on the cable 301, and the motor 304 is arranged in the middle of the cable 301. The motor 304 is used to drive the air-conditioning device to move to support the elimination of local hot spots, thereby achieving the purpose of precise cooling. In this embodiment, the sensor is a device that can convert temperature changes into voltage signals, usually using principles such as thermocouples or thermistors. Motor 304 is a stainless steel stepper motor that precisely rotates a certain angle based on an input pulse signal, thereby driving the pulley system and moving the TEC air conditioning unit 200 to a specified position. A sensor is installed at the outlet of server 102, receiving the temperature signal from the server 102 outlet and outputting a voltage signal to the intelligent scheduling system 107. The intelligent scheduling system 107 receives the sensor voltage signal, converts it into a digital signal, and determines whether a local hotspot exists based on a preset temperature threshold. For example, if the sensor temperature reaches above 40°C, it is considered a local hotspot; if it falls below 35°C, the local hotspot is eliminated. This can also be customized according to local standards. Based on the sensor's location information (i.e., the vertical height of the server corresponding to the sensor), the intelligent scheduling system 107 calculates the required distance for the TEC air conditioning unit 200 to move and sends the corresponding step pulse signal to the motor 304, activating it and precisely aligning it with the local hotspot (i.e., the location of the overheating server). Simultaneously, the intelligent scheduling system 107 adjusts the cooling capacity of the TEC air conditioning unit 200 based on the temperature and range of the local hotspot to achieve optimal cooling.

[0057] See Figure 4The air conditioning device includes a movable frame 205, TEC elements 202 housed within the movable frame, a TEC cold-end heat sink 203, a connector 204, a heat pipe 211, fins 212, TEC hot-end fin heat sinks 201 housed outside the movable frame, four windshields 105, a cable (including a cable clamp) 301, a cable guide 302 along the cable 301, a guide pulley 303 supporting the cable 301, and a motor 304. The heat pipe 211 and fins 212 are arranged along the airflow direction of the air conditioning device. The four windshields 105 are welded to the movable frame 205. The guide pulley 303 is screwed to the movable frame 205. The guide pulley 303 is screwed to the movable frame 205. The heat exchanger fins 212 are sleeved and welded using a secondary flanging process to maintain a fixed spacing. The TEC cold-end heat sink 203 and the TEC hot-end fin heat sink 201 are both connected to the TEC element 202 by welding, and are located in the left and right walls of the movable frame 205 .

[0058] When a local hotspot occurs, the outlet temperature of the server 102 must first be determined. Under the action of electric cooling, the temperatures of the TEC cold end, the TEC cold end heat sink 203, the heat pipe condensation section at the connection between the heat pipe 211 and the TEC cold end heat sink 203, the condensation section wick-liquid combination layer, the condensation section vapor-liquid interface, the flowing working fluid vapor from the evaporation section to the condensation section, the phase change interface at the evaporation section liquid-vapor interface, the evaporation section wick-liquid combination layer, and the heat pipe evaporation section wall are sequentially reduced, thereby cooling the airflow inlet to the server 102 cabinet. Typically, the excess heat generated by the local hotspot is roughly equivalent to the TEC cooling capacity and can be completely dissipated within a few minutes. When the TEC element 202 is activated, the cold aisle air from the outside passes through the heat dissipation channel 104. Due to the narrowing of the flow cross-section, the flow velocity of the air increases, and the cooling heat is utilized by the TEC hot end fin heat sink 201. After cooling, the TEC hot end fin heat sink 201 absorbs the heat from the hot end of the TEC element 202. After being cooled, the temperature difference between the hot and cold ends of the TEC element 202 is reduced, and the COP is increased.

[0059] In this embodiment, the temperature of the cooled air is very low. This is because the TEC element 202 is located at the entrance of the server 102 cabinet and is cooling the relatively low-temperature air in the cold aisle of the data center. This may cause the cold end temperature of the TEC element 202 to be too low, resulting in adverse consequences such as a decrease in COP. Therefore, the heat pipe 211 and the fin 212 are used to enhance heat exchange, so that the operating temperature of the TEC element 202 is still lower than the temperature of the cold end surface of the TEC element 202 and does not fail.

[0060] Before a local hotspot occurs, if a high load externality is detected, the predictive component of the intelligent regulation system is activated, and the drive motor 304 is powered on to cool the server 102 that is about to develop a local hotspot. The TEC element is then activated, and air flows sequentially through the fins 212, the heat pipe 211, and the server 102 with the local hotspot. The air, cooled by the fins 212, the heat pipe 211, the cold end of the TEC element 202, and the TEC cold end heat sink 203, decreases in temperature. Under lower temperature conditions, the heat transfer efficiency of the server 102 that is about to develop a local hotspot is improved.

[0061] Furthermore, when the data center rack servers 102 are operating normally, the TEC elements 202 can be activated for auxiliary cooling, thereby preventing the cold airflow generated by the normal computer room air conditioning cold aisle cooling from being insufficient to achieve a good heat exchange effect. Similarly, auxiliary cooling can reduce the power consumption of the servers 102, as the power consumption of the servers 102 is a function of temperature. Traditional computer room air conditioning cold aisle cooling can only achieve optimal server operation by changing the supply air temperature, ultimately resulting in an unnecessary or even harmful decrease in the operating temperature of other servers 102.

[0062] To address the aforementioned shortcomings or improvements in the prior art, the present invention provides an intelligent rack that utilizes the Peltier effect to precisely cool local hotspots in data centers. Based on the operating characteristics of existing data centers, the present invention researches and designs an intelligent rack that utilizes the Peltier effect to precisely cool local hotspots in data centers. Inspired by the separation of hot and cold aisles in data centers, the intelligent rack features integrated heat dissipation channels. Combined with thermoelectric cooling technology, the rack uses automated technologies such as task scheduling, prediction, and detection to precisely eliminate local hotspots on a point-by-point basis. Pre-designed task planning and prediction algorithms detect the presence of local hotspots before they occur, thereby improving cooling effectiveness. Furthermore, the rack incorporates a sensor system that monitors data center parameters in real time. Using an intelligent adjustment system and pulley system, the TEC-assisted air conditioning unit is moved to the location of the local hotspot. The rack then uses thermoelectric cooling technology to directly remove heat from the cabinet to eliminate the local hotspot. This reduces costs and energy consumption, simplifies procedures, and improves the cooling effect of high-density areas during high-density distributed operation. This eliminates the energy waste caused by the reduction in total supply air temperature during traditional air conditioning.

[0063] The embodiments described above are merely specific implementations of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be imagined by any person skilled in the art within the technical scope disclosed in the present application without resorting to creative effort should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims in the present application.

Claims

1. A precision cooling rack based on heat dissipation channels and heat pipes, the rack comprising a precision cooling TEC air conditioning device (200), a heat dissipation channel (104) and an intelligent scheduling system (107), characterized in that: The precise cooling rack based on heat dissipation channels and heat pipes comprises a rack outer frame (101), a server (102) or a server cabinet, a soft sealing brush (103), a windshield (105), and a server mounting slot (106); the server mounting slot (106) is connected to the rack outer frame (101), and the servers (102) are all placed in the server mounting slot (106); there are two rows of channels between the rack outer frames (101), and the two rows of soft sealing brushes (103) prevent the hot and cold channels from being connected; The precise cooling TEC air conditioning device (200) is integrated as a whole by a movable frame (205), and moves back and forth along the rack outer frame (101) according to the real-time change of the data center load through the intelligent scheduling system (107); the precise cooling TEC air conditioning device (200) is arranged at the entrance of the server (102), one end of the movable frame (205) is opened facing the entrance direction of the server (102), and the other end is connected to the cold channel of the data center with a static pressure box function; the intelligent scheduling system (107) is arranged on the left and right sides of the movable frame (205), the windshield (105) connected to the movable frame (205) pushes the soft sealing brush (103) away, and forms the heat dissipation channel (104) between the windshield and the rack outer frame (101), and the two TEC hot end fin heat sinks (201) are located in the two heat dissipation channels (104).

2. The precise cooling rack based on heat dissipation channels and heat pipes according to claim 1, characterized in that: The precision cooling TEC air conditioning device (200) further includes a heat pipe heat exchanger (210), the heat pipe heat exchanger including a heat pipe (211) and a plurality of spaced fins (212), the fins (212) being sleeved on the evaporation section of the heat pipe and used to enhance the heat transfer coefficient of the surface of the evaporation section of the heat pipe; the heat pipe heat exchanger (210) is connected to a connection port (204) on the surface of a TEC cold end heat sink (203) through the heat pipe (211), and is sealed and heat transfer enhanced using silicone grease; a plurality of connection ports (204) connected to the surface of the TEC cold end heat sink (203) are provided. The heat pipes (211) of the interface (204) are arranged in a staggered or parallel arrangement; the two TEC elements (202) are respectively located at the left and right ends of the movable frame (205); the two TEC cold end heat sinks (203) are connected to the cold ends of the TEC elements (202), with the cold ends facing the inside of the movable frame (205); the hot ends of the two TEC elements (202) are externally connected to the TEC hot end fin heat sinks (201); the function of the heat pipe heat exchanger (210) is to transport the cold energy of the cold end of the TEC element (202) to the entrance of the server (102).

3. The precise cooling rack based on heat dissipation channels and heat pipes according to claim 2, characterized in that: The intelligent scheduling system (107) further includes a motor (304), wherein the motor (304) drives the device to move; there are four motors (304) and they are respectively fixed to the frame (205); the four motors (304) move through a cable (301) system, wherein there are four cables (301) fixed in the outer frame (101) of the rack through a fixing device; there are eight guide pulleys (303) on the surface of the four cables, and the eight guide pulleys (303) are respectively arranged at two points of the cables (301); a cable guide (302) is installed above or below the pulley.

4. The precise cooling rack based on heat dissipation channels and heat pipes according to any one of claims 1 to 3, characterized in that: The TEC hot end fin heat sinks (201) are arranged at intervals along a direction perpendicular to the airflow direction in the cold channel of the data center where the precision cooling TEC air conditioning device (200) is located.

5. The precise cooling rack based on heat dissipation channels and heat pipes according to any one of claims 1 to 3, characterized in that: The heat dissipation method of the TEC hot end fin heat sink (201) is to utilize the low-temperature air in the cold channel of the data center to increase the flow rate through the heat dissipation channel (104) to perform air cooling on the TEC hot end fin heat sink (201).

6. The precise cooling rack based on heat dissipation channels and heat pipes according to any one of claims 1 to 3, characterized in that: The heat dissipation channel (104) is formed by enclosing a windshield (105) fixed to the precise cooling TEC air conditioning device (200) and a rack outer frame (101), and a soft sealing brush (103) is installed between the outer frames to close other channels, so that the heat dissipation channel (104) moves with the movement of the precise cooling TEC air conditioning device (200), thereby reducing the dissipation of cooling capacity.

7. The precise cooling rack based on heat dissipation channels and heat pipes according to any one of claims 1 to 3, characterized in that: The heat pipe (211) is composed of two opposite sections of heat pipes (211) connected together, and the evaporation sections are connected by welding; in addition to being filled with a working fluid, the interior of the heat pipe (211) also includes a mesh liquid wick; the heat pipe (211) transfers cold energy from the surface of the TEC cold end heat sink (203) to the fins (212) through the internal working fluid, and then diffuses it into the interior of the rack, thereby reducing the temperature of the server.

8. The application of the precise cooling rack based on heat dissipation channels and heat pipes as claimed in claim 3, characterized in that: The precise cooling rack based on heat dissipation channels and heat pipes eliminates local hot spots precisely point by point. Before a local hot spot occurs, the presence of the local hot spot is sensed in advance through pre-designed task planning algorithms and prediction algorithms, thereby improving the cooling effect.

9. The use according to claim 8, characterized in that: When a local hot spot occurs, under the action of electric cooling, the temperatures of the TEC cold end, the TEC cold end heat sink (203), the heat pipe condensation section at the connection between the heat pipe (211) and the TEC cold end heat sink (203), the condensation section liquid wick-liquid combination layer, the condensation section vapor-liquid interface, the flowing working medium vapor from the evaporation section to the condensation section, the phase change interface of the evaporation section liquid-vapor interface, the evaporation section liquid wick-liquid combination layer, and the heat pipe evaporation section wall are sequentially reduced, thereby cooling the airflow at the inlet of the server (102) cabinet; or, Before a local hotspot occurs, when a high load externality is detected, the prediction component of the intelligent regulation system needs to be started, and the power supply of the motor (304) needs to be turned on to cool the server (102) that is about to generate a local hotspot; then the TEC element (202) is turned on, and air blows through the fins (212), the heat pipes (211) and the server (102) that is about to generate a local hotspot in sequence, and the temperature of the air cooled by the fins (212), the heat pipes (211), the cold end of the TEC element (202) and the TEC cold end heat sink (203) is reduced; under lower temperature conditions, the heat transfer efficiency of the server (102) that is about to generate a local hotspot is improved.

10. The use according to claim 8, characterized in that: When the server (102) is operating normally, the TEC element (202) is turned on for auxiliary cooling, thereby preventing the cold air flow generated by the normal cold channel cooling of the computer room air conditioner from being insufficient to achieve a good heat exchange effect, and the auxiliary cooling helps reduce the power consumption of the server (102); After the TEC element (202) is turned on, when the cold channel air passes through the heat dissipation channel (104) from the outside, the flow cross section becomes narrower, the flow velocity of the flowing air increases, and its cold exergy is utilized by the TEC hot end fin heat sink (201); The cooled TEC hot end fin heat sink (201) absorbs the hot end heat of the TEC element (202), and the temperature difference between the hot and cold ends of the cooled TEC element (202) is subsequently reduced; The TEC element (202) is located at the entrance of the server (102) cabinet, and the cooling object is the relatively low-temperature air in the cold channel of the data center. The heat pipe (211) and the fin (212) are used to enhance heat exchange, so that the operating temperature of the TEC element (202) is still lower than the temperature of the cold end surface of the TEC element (202) and will not fail.

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