A vibration sensor

Abstract

A vibration sensor (200) comprising: a vibration receiver (210) comprising a housing (211) forming an acoustic cavity and a vibration unit (212) located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity (213) and a second acoustic cavity (214); and an acoustic transducer (220) in acoustic communication with the first acoustic cavity (213), wherein: the housing (211) is configured to generate vibrations based on an external vibration signal, the vibration unit (212) changes the sound pressure within the first acoustic cavity (213) in response to the vibrations of the housing (211) such that the acoustic transducer (220) generates an electrical signal; the vibration unit (212) comprises a mass element (2121) and an elastic element (2122), an area of the mass element (2121) on a side facing away from the acoustic transducer (220) is smaller than an area of the mass element (2121) on a side closer to the acoustic transducer (220), and the elastic element (2122) surrounds a side wall connected to the mass element (2121).

Description

[0001] Priority Information

[0002] This application claims priority to International Application No. PCT / CN2020 / 140180 filed on December 28, 2020, Chinese Application No. 202110445739.3 filed on April 23, 2021, and International Application No. PCT / CN2021 / 107978 filed on July 22, 2021, the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0003] The present application relates to the field of acoustics, in particular to a vibration sensor. BACKGROUND

[0004] A vibration sensor is an energy conversion device that converts a vibration signal into an electrical signal. Currently, a vibration sensor can be used as a bone conduction microphone. The vibration sensor can detect the vibration signal transmitted through the skin when a person speaks, so as to detect the voice signal, while being free from the interference of external noise. The structure of the vibration assembly in the current vibration sensor is unstable, which leads to the problems of low product yield of the vibration sensor in the production process and low sensitivity of the vibration sensor in the working process.

[0005] Therefore, it is desirable to provide a vibration sensor with strong structural stability and high sensitivity. SUMMARY

[0006] One of the embodiments of the present application provides a vibration sensor, comprising: a vibration receiver comprising a shell and a vibration unit, the shell forming an acoustic cavity, the vibration unit being located in the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: the shell is configured to generate vibration based on an external vibration signal, the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the shell, so that the acoustic transducer generates an electrical signal; the vibration unit comprises a mass element and an elastic element, the area of the side of the mass element away from the acoustic transducer is smaller than the area of the side of the mass element close to the acoustic transducer, and the elastic element surrounds the side wall connected to the mass element.

[0007] In some embodiments, the mass element comprises a first mass element and a second mass element, the second mass element is close to the acoustic transducer, the first mass element is located on the side of the second mass element away from the acoustic transducer, and the cross-sectional area of the first mass element perpendicular to the vibration direction of the mass element is smaller than the cross-sectional area of the second mass element perpendicular to the vibration direction of the mass element.

[0008] In some embodiments, the first mass element is located in a middle region of the second mass element, and a specific spacing is provided between the sidewall of the first mass element and the sidewall of the second mass element.

[0009] In some embodiments, the specific spacing ranges from 10 um to 500 um.

[0010] In some embodiments, the elastic element includes a first elastic part and a second elastic part, two ends of the first elastic part are connected with the sidewall of the first mass element and the second elastic part respectively, and the second elastic part extends to and is connected with the acoustic transducer.

[0011] In some embodiments, the first elastic part includes a first side and a second side, the first side is connected with the sidewall of the first mass element, and the second side is connected with a surface of the second mass element exposed to the second acoustic cavity.

[0012] In some embodiments, the sidewall of the second mass element is connected with the second elastic part.

[0013] In some embodiments, the acoustic transducer includes a substrate, the second elastic element extends to and is connected with the substrate, and the substrate, the second mass element and the second elastic element form the first acoustic cavity.

[0014] In some embodiments, along the vibration direction of the mass element, the thickness of the first mass element ranges from 50 um to 1000 um, and the thickness of the second mass element ranges from 10 um to 150 um.

[0015] In some embodiments, along the vibration direction of the mass element, the thickness of the first mass element is greater than the thickness of the second mass element.

[0016] In some embodiments, in a cross section of the mass element taken along the vibration direction thereof, an included angle is formed between a line connecting an edge on a side of the mass element away from the acoustic transducer and an edge on a side of the mass element close to the acoustic transducer and the vibration direction of the mass element, and the included angle ranges from 10° to 80°.

[0017] In some embodiments, the mass element includes a first hole part, and the first hole part communicates the first acoustic cavity and the second acoustic cavity.

[0018] In some embodiments, the first hole part has a radius ranging from 1 um to 50 um.

[0019] In some embodiments, a third hole part is provided on the housing, and the second acoustic cavity is communicated with the outside through the third hole part.

[0020] One of the embodiments of the present application also provides a vibration sensor, comprising: a vibration receiver, the vibration receiver comprising a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: the housing is configured to generate vibrations based on an external vibration signal, the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibrations of the housing, so that the acoustic transducer generates an electrical signal; wherein the vibration unit comprises a mass element and an elastic element, the elastic element surrounding a side wall connected to the mass element, the vibration sensor further comprising a limiting piece, the limiting piece being located between the elastic piece and the housing.

[0021] In some embodiments, the height of the limiting piece is 100um-1000um along the vibration direction of the mass element.

[0022] One of the embodiments of the present application also provides a vibration sensor, comprising a vibration receiver, the vibration receiver comprising a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit being located in the acoustic cavity and separating the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer in acoustic communication with the first acoustic cavity, wherein: the housing is configured to generate vibrations based on an external vibration signal, the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibrations of the housing, so that the acoustic transducer generates an electrical signal; the vibration unit comprises a mass element and an elastic element, the mass element comprising a groove, the groove being located at the side of the mass element along the vibration direction thereof.

[0023] In some embodiments, the mass element comprises a first hole portion, the first hole portion communicating the first acoustic cavity and the second acoustic cavity, the first hole portion being located at the groove.

[0024] In some embodiments, the radius of the first hole portion is 1um-50um.

[0025] In some embodiments, the size of the groove is greater than the size of the first hole portion.

[0026] One of the embodiments of the present application also provides a vibration sensor, comprising a vibration receiver, comprising a shell and a vibration unit, the shell forms an acoustic cavity, the vibration unit is located in the acoustic cavity and divides the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and an acoustic transducer, in acoustic communication with the first acoustic cavity, wherein: the shell is configured to generate vibration based on an external vibration signal, the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the shell, so that the acoustic transducer generates an electrical signal, the vibration unit comprises a mass element and an elastic element, the elastic element surrounds the side wall connected to the mass element and extends to the shell.

[0027] In some embodiments, the thickness of the elastic element is greater than the thickness of the mass element along the vibration direction of the mass element.

[0028] In some embodiments, a hole is formed on the mass element or the shell, and the radius of the hole is 1 um to 50 um. BRIEF DESCRIPTION OF DRAWINGS

[0029] The present application will be further illustrated in the form of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting, and in these embodiments, the same numbers represent the same structures, wherein:

[0030] Figure 1 is an exemplary block diagram of a vibration sensor according to some embodiments of the present application;

[0031] Figure 2A is an exemplary structural diagram of a vibration sensor according to some embodiments of the present application;

[0032] Figure 2B is a structural schematic diagram of a mass element according to some embodiments of the present application;

[0033] Figure 3 is a structural schematic diagram of a vibration unit according to some embodiments of the present application;

[0034] Figure 4 is a structural schematic diagram of a vibration unit according to some embodiments of the present application;

[0035] Figure 5 is a structural schematic diagram of a mass element according to some embodiments of the present application;

[0036] Figure 6A is a structural schematic diagram of a vibration unit according to some embodiments of the present application;

[0037] Figure 6B is a structural schematic diagram of a vibration unit according to some embodiments of the present application;

[0038] Figure 6CStructure diagram of a vibration unit according to some embodiments of the present application;

[0039] Figure 6D Structure diagram of a vibration unit according to some embodiments of the present application;

[0040] Figure 7 Structure diagram of a vibration sensor according to some embodiments of the present application;

[0041] Figure 8 Structure diagram of a vibration sensor according to some embodiments of the present application;

[0042] Figure 9 Structure diagram of a vibration transceiver according to some embodiments of the present application. DETAILED DESCRIPTION

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some examples or embodiments of the present specification, and for those skilled in the art, the present specification can also be applied to other similar scenarios without creative labor. Unless it is obvious from the language environment or otherwise stated, the same reference numbers in the drawings represent the same structure or operation.

[0044] It should be understood that the "system", "device", "unit" and / or "module" used herein is a method for distinguishing different components, elements, parts, sections or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0045] The "first", "second", and similar words used in the present specification and claims do not represent any order, number or importance, but are only used to distinguish different components. Similarly, "one" or "a" and similar words do not represent a quantity limit, but represent the existence of at least one. Unless otherwise indicated, "front", "back", "lower" and / or "upper" and similar words are only for convenience of description, and are not limited to a position or a spatial orientation. Generally speaking, the terms "comprise" and "include" only indicate the inclusion of the steps and elements explicitly identified, and these steps and elements do not constitute an exclusive list, and the method or device can also include other steps or elements.

[0046] Embodiments of the present specification describe a vibration sensor. In some embodiments, the vibration sensor can include a vibration receiver and an acoustic transducer. In some embodiments, the vibration receiver can include a housing and a vibration unit, the housing can form an acoustic cavity, and the vibration unit can be located in the acoustic cavity and divide the acoustic cavity into a first acoustic cavity and a second acoustic cavity. The acoustic transducer can be in acoustic communication with the first acoustic cavity. The housing can be configured to generate vibrations based on an external vibration signal (e.g., a signal generated by vibrations of bones, skin, etc. when a user speaks). The vibration unit can change the sound pressure of the first acoustic cavity in response to the vibrations of the housing, so that the acoustic transducer generates an electrical signal.

[0047] In some embodiments, the vibration unit can include a mass element and an elastic element. Among them, the area of the side of the mass element away from the acoustic transducer is smaller than the area of the side of the mass element close to the acoustic transducer. Under the condition of the same thickness, the contact area of the mass element and the elastic element in the embodiments of the present specification is increased relative to the contact area of the cylindrical (e.g., cylindrical or prismatic) mass element and the elastic element. When the elastic element surrounds the connection to the mass element, the connection area of the elastic element and the mass element is increased, thereby improving the connection strength between the elastic element and the mass element and improving the stability of the structure of the vibration assembly. Further, by improving the connection strength between the elastic element and the mass element, the sealing performance of the first acoustic cavity is improved, which can effectively prevent the occurrence of gaps at the connection between the elastic element and the mass element, so as to prevent the gas in the first acoustic cavity from leaking into the second acoustic cavity, thereby making the sound pressure change of the first acoustic cavity in response to the vibration of the housing more sensitive, thereby improving the sensitivity of the vibration sensor.

[0048] Figure 1 is an exemplary block diagram of a vibration sensor 100 according to some embodiments of the present specification. As shown in Figure 1 the vibration sensor 100 can include a vibration receiver 110 and an acoustic transducer 120. In some embodiments, the vibration receiver 110 and the acoustic transducer 120 can be connected by physical means. The physical connection in the present specification can include welding, clamping, gluing or one-piece forming, etc. or any combination thereof.

[0049] In some embodiments, the vibration sensor 100 can be used as a bone conduction microphone. When used as a bone conduction microphone, the vibration sensor 100 can receive a vibration signal of a bone, skin, or other tissue generated when a user speaks, and convert the vibration signal into an electrical signal containing sound information. Since almost no sound (or vibration) in the air is collected, the vibration sensor 100 can be somewhat immune to ambient noise (e.g., ambient other people speaking, noise generated by vehicles passing by), suitable for use in noisy environments to collect voice signals when a user speaks. By way of example only, a noisy environment can include a noisy restaurant, a meeting room, a street, a road nearby, a fire scene, or the like. In some embodiments, the vibration sensor 100 can be applied to a headset (e.g., an air conduction headset and a bone conduction headset), a hearing aid, an assistive listening device, glasses, a helmet, an augmented reality (AR) device, a virtual reality (VR) device, or the like, or any combination thereof. For example, the vibration sensor 100 can be applied to a headset as a bone conduction microphone.

[0050] The vibration receiver 110 can be configured to receive and deliver a vibration signal. In some embodiments, the vibration receiver 110 includes a housing and a vibration unit. The housing can be an internally hollow structure, and part components (e.g., the vibration unit) of the vibration sensor 100 can be located inside the housing. For example, the housing can form an acoustic cavity, and the vibration unit can be located inside the acoustic cavity. In some embodiments, the vibration unit can be located in the acoustic cavity and divide the acoustic cavity formed by the housing into a first acoustic cavity and a second acoustic cavity. The acoustic cavity can be in acoustic communication with the acoustic transducer 120. The acoustic communication can be a manner of communication capable of delivering a sound pressure, a sound wave, or a vibration signal.

[0051] The acoustic transducer 120 can generate an electrical signal containing sound information based on the change of the sound pressure of the first acoustic chamber. In some embodiments, the vibration signal can be received via the vibration receiver 110 and cause the change of the air pressure inside the first acoustic chamber, and the acoustic transducer 120 can generate the electrical signal according to the change of the air pressure inside the first acoustic chamber. In some embodiments, when the vibration sensor 100 is working, the housing can generate vibration based on the external vibration signal (e.g., the signal generated by the vibration of the bone, skin, etc. when the user is speaking). The vibration unit can vibrate in response to the vibration of the housing and transmit the vibration to the acoustic transducer 120 through the first acoustic chamber. For example, the vibration of the vibration unit can cause the change of the volume of the first acoustic chamber, which in turn causes the change of the air pressure inside the first acoustic chamber and converts the change of the air pressure inside the chamber into the change of the sound pressure inside the chamber. The acoustic transducer 120 can detect the change of the sound pressure of the first acoustic chamber and generate an electrical signal based thereon. For example, the acoustic transducer 120 can include a diaphragm, and the change of the sound pressure inside the first acoustic chamber acts on the diaphragm to cause the diaphragm to vibrate (or deform), and the acoustic transducer 120 converts the vibration of the diaphragm into an electrical signal. For detailed description of the vibration sensor 100, reference can be made to the detailed description of the vibration sensor 100 of Figure 2A - Figure 1 0.

[0052] It should be noted that the above description of the vibration sensor 100 and its components is only for example and illustration, and does not limit the scope of the present specification. Various modifications and changes can be made to the vibration sensor 100 under the guidance of the present specification. In some embodiments, the vibration sensor 100 can also include other components, such as a power supply to provide electrical energy for the acoustic transducer 120, etc. These modifications and changes are still within the scope of the present specification.

[0053] Figure 2A is an exemplary structural diagram of a vibration sensor 200 according to some embodiments of the present application. As shown in Figure 2A The vibration sensor 200 can include a vibration receiver 210 and an acoustic transducer 220, wherein the vibration receiver 210 can include a housing 211 and a vibration unit 212.

[0054] The housing 211 can be a hollow structure, and in some embodiments, the housing 211 can be connected with the acoustic transducer 220 to form a structure with an acoustic chamber. The housing 211 and the acoustic transducer 220 can be connected by physical means. In some embodiments, the vibration unit 212 can be located inside the acoustic chamber, and the vibration unit 212 can divide the acoustic chamber into a first acoustic chamber 213 and a second acoustic chamber 214. In some embodiments, the vibration unit 212 can form the first acoustic chamber 213 with the acoustic transducer 220, and the vibration unit 212 can form the second acoustic chamber 214 with the housing 211.

[0055] The vibration sensor 200 can convert an external vibration signal into an electrical signal. For example only, the external vibration signal can include a vibration signal when a person speaks, a vibration signal generated due to a skin movement of a person or due to an operation of another device (e.g., a speaker) close to the skin, a vibration signal generated by an object or air in contact with the vibration sensor 200, etc., or any combination thereof. When the vibration sensor 200 operates, the external vibration signal can be transmitted to the vibration unit 212 through the housing 211, and the mass element 2121 of the vibration unit 212 can vibrate in response to the vibration of the housing 211 with the elastic element 2122. The vibration of the mass element 2121 can cause a volume change of the first acoustic cavity 213, and then cause a change in air pressure in the first acoustic cavity 213, and convert the change in air pressure in the cavity into a change in acoustic pressure in the cavity. The acoustic transducer 220 can detect the change in acoustic pressure of the first acoustic cavity 213 and convert it into an electrical signal. For example, the acoustic transducer 220 can include a sound pickup hole 2221, and the change in acoustic pressure in the first acoustic cavity 213 can act on a diaphragm of the acoustic transducer 220 through the sound pickup hole 2221, causing the diaphragm to vibrate (or deform) to generate an electrical signal. Further, the electrical signal generated by the acoustic transducer 220 can be transmitted to an external electronic device. For example only, the acoustic transducer 220 can include an interface 223. The interface can be wired (e.g., electrically) or wirelessly connected to an internal element (e.g., a processor) of the external electronic device. The electrical signal generated by the acoustic transducer 220 can be transmitted to the external electronic device through the interface in a wired or wireless manner. In some embodiments, the external electronic device can include a mobile device, a wearable device, a virtual reality device, an augmented reality device, etc., or any combination thereof. In some embodiments, the mobile device can include a smartphone, a tablet, a personal digital assistant (PDA), a game device, a navigation device, etc., or any combination thereof. In some embodiments, the wearable device can include a smart bracelet, a headset, a hearing aid, a smart helmet, a smart watch, smart clothing, a smart backpack, a smart accessory, etc., or any combination thereof. In some embodiments, the virtual reality device and / or the augmented reality device can include a virtual reality helmet, a virtual reality glasses, a virtual reality patch, an augmented reality helmet, an augmented reality glasses, an augmented reality patch, etc., or any combination thereof. For example, the virtual reality device and / or the augmented reality device can include Google Glass, Oculus Rift, Hololens, Gear VR, etc.

[0056] In some embodiments, the shape of the housing 211 can be a cuboid, a cylinder, a circular truncated cone, or any regular or irregular three-dimensional structure. In some embodiments, the material of the housing can include metal (e.g., copper, stainless steel), alloy, plastic, or the like, or any combination thereof. In some embodiments, the housing can have a certain thickness to ensure sufficient strength to better protect the components (e.g., the vibration unit 212) of the vibration sensor 100 disposed inside the housing. In some embodiments, the first acoustic cavity 213 can be in acoustic communication with the acoustic transducer 220. By way of example only, the acoustic transducer 220 can include a sound hole 2221, and the acoustic transducer 220 can be in acoustic communication with the first acoustic cavity 213 through the sound hole 2221. It should be noted that the description of the single sound hole 2221 as shown is for illustration only and is not intended to limit the scope of the present disclosure. It should be understood that the vibration sensor 200 can include more than one sound hole 2221. For example, the vibration sensor 200 can include a plurality of sound holes arranged in an array, where the sound holes can be located at any position of the corresponding acoustic transducer 220 of the first acoustic cavity 213. Figure 2A

[0057] In some embodiments, the vibration unit 212 can include a mass element 2121 and an elastic element 2122. In some embodiments, the mass element 2121 and the elastic element 2122 can be connected by physical means, for example, gluing. By way of example only, the elastic element 2122 can be a material with certain viscosity, directly bonded to the mass element 2121.

[0058] ​In some embodiments, the elastic element 2122 can be made of a high-temperature resistant material, such that the elastic element 2122 maintains its performance during the manufacturing process of the vibration sensor 200. In some embodiments, the elastic element 2122 has no change or a small change (e.g., within 5%) in its Young's modulus and shear modulus when it is in an environment of 200-300°C, where the Young's modulus can be used to characterize the deformation ability of the elastic element 2122 when it is stretched or compressed, and the shear modulus can be used to characterize the deformation ability of the elastic element 2122 when it is sheared. In some embodiments, the elastic element 2122 can be made of a material with good elasticity (i.e., easy to elastically deform), such that the vibration unit 212 can vibrate in response to the vibration of the shell 211. By way of example only, the material of the elastic element 2122 can include silicone rubber, silicone gel, silicone sealant, or any combination thereof. In order to make the elastic element 2122 have better elasticity, in some embodiments, the Shore hardness of the elastic element 2122 can be less than 50HA. Preferably, the Shore hardness of the elastic element 2122 can be less than 45HA. More preferably, the Shore hardness of the elastic element 2122 can be less than 40HA. More preferably, the Shore hardness of the elastic element 2122 can be less than 35HA. More preferably, the Shore hardness of the elastic element 2122 can be less than 30HA. More preferably, the Shore hardness of the elastic element 2122 can be less than 25HA. More preferably, the Shore hardness of the elastic element 2122 can be less than 20HA. More preferably, the Shore hardness of the elastic element 2122 can be less than 15HA. More preferably, the Shore hardness of the elastic element 2122 can be less than 10HA. More preferably, the Shore hardness of the elastic element 2122 can be less than 5HA.

[0059] In some embodiments, the material of the mass element 2121 can be a material (e.g., a metal) with a density greater than a certain density threshold (e.g., 6g / cm 3 ) of a material, such as a metal. By way of example only, the material of the mass element 2121 can include lead, copper, silver, tin, stainless steel, stainless iron, or any combination thereof. The higher the density of the material of the mass element 2121, the smaller the size of the mass element 2121 at the same mass, and thus the use of a material with a density greater than a certain density threshold to make the mass element 2121 can reduce the size of the vibration sensor 200 to some extent. In some embodiments, the material density of the mass element 2121 has a greater impact on the resonance peak and sensitivity of the frequency response curve of the vibration sensor 200. The greater the density of the mass element 2121, the greater its mass at the same volume, and the resonance peak of the vibration sensor 200 moves to a lower frequency, and since the frequency of the vibration signal (e.g., bone conduction sound) is low, increasing the mass of the mass element 2121 can improve the sensitivity of the vibration sensor 200 in a lower frequency band (e.g., 20-6000Hz). In some embodiments, the material density of the mass element 2121 is greater than 6g / cm3 In some embodiments, the material density of the mass element 2121 is greater than 7 g / cm³. 3 In some embodiments, the material density of the mass element 2121 is 7–20 g / cm³. 3 Preferably, the material density of the mass element 2121 is 7–15 g / cm³. 3 More preferably, the material density of the mass element 2121 is 7–10 g / cm³. 3 More preferably, the material density of the mass element 2121 is 7–8 g / cm³. 3 In some embodiments, the mass element 2121 and the elastic element 2122 may be composed of different materials and then assembled (e.g., glued) together to form the vibration unit 212. In some embodiments, the mass element 2121 and the elastic element 2122 may also be composed of the same material and formed into the vibration unit 212 by integral molding.

[0060] In some embodiments, the mass element 2121 is along its vibration direction (e.g. Figure 2A The thickness of the mass element 2121 (as shown) can be 60um-1150um. Preferably, the thickness of the mass element 2121 along its vibration direction can be 70um-900um. More preferably, the thickness of the mass element 2121 along its vibration direction can be 80um-800um. More preferably, the thickness of the mass element 2121 along its vibration direction can be 90um-700um. More preferably, the thickness of the mass element 2121 along its vibration direction can be 100um-600um. More preferably, the thickness of the mass element 2121 along its vibration direction can be 110um-500um. More preferably, the thickness of the mass element 2121 along its vibration direction can be 120um-400um. More preferably, the thickness of the mass element 2121 along its vibration direction can be 130um-300um. More preferably, the thickness of the mass element 2121 along its vibration direction can be 140um-200um. More preferably, the thickness of the mass element 2121 along its vibration direction can be 100um-150um.

[0061] In some embodiments, the elastic element 2122 can surround the peripheral surface of the mass element 2121. For example, when the mass element 2121 is a columnar structure (cylinder or prism), the peripheral surface of the mass element 2121 is the side surface of the columnar structure. For another example, when the mass element 2121 is two columnar structures of different sizes (e.g., a first mass element 21211 and a second mass element 21212), the peripheral surface of the mass element 2121 includes the side surface of the first mass element 21211 and the second mass element 21212, and the area of the second mass element 21212 that is not covered by the first mass element 21211 in the direction perpendicular to the vibration direction of the mass element 2121. The side surface of the mass element 2121 away from the acoustic transducer 220 and the side surface of the mass element 2121 close to the acoustic transducer 220 are approximately perpendicular to the vibration direction, and are used to define the second acoustic cavity 214 and the first acoustic cavity 213, respectively. Since the elastic element 2122 surrounds the peripheral surface of the mass element 2121, during the vibration of the vibration unit 212 along the vibration direction, the momentum of the mass element 2121 is converted into the force acting on the elastic element 2122, causing the elastic element 2122 to shear deformation. Compared with tensile and compressive deformation, shear deformation reduces the spring coefficient of the elastic element 2122, which reduces the resonant frequency of the vibration sensor 200, thereby increasing the vibration amplitude of the mass element 2121 in a lower frequency range (e.g., 20 Hz-6000 Hz) during the vibration of the vibration unit 212, and improving the sensitivity of the vibration sensor 200. In some embodiments, the elastic element 2122 closely adheres to the peripheral surface of the mass element 2121, which can ensure the sealing of the first acoustic cavity 213, so that the air pressure change of the first acoustic cavity 213 is only related to the vibration amplitude of the vibration unit 212, thereby making the sound pressure change of the first acoustic cavity 213 more obvious and effective.

[0062] In some embodiments, the elastic element 2122 can be a tubular structure. Accordingly, the inner wall shape of the elastic element 2122 in the tubular structure can be adapted to the shape of the lateral surface of the mass element 2121. It can be understood herein that the elastic element 2122 has the same cross-sectional shape with the mass element 2121 at different heights along the vibration direction. The inner wall of the elastic element 2122 refers to the side wall of the tubular structure that is in contact with the mass element 2121. For example, the mass element 2121 is in a stepped shape, and the connection between the elastic element 2122 and the mass element 2121 is in a stepped shape that is adapted to the mass element 2121. In some embodiments, the cross-section of the mass element 2121 perpendicular to the vibration direction can be triangular, quadrilateral, circular, elliptical, sector, rounded rectangular, regular or irregular shape. The present specification does not limit the shape of the outer wall of the tubular structure of the elastic element 2122, which can be the side wall away from the inner wall of the elastic element 2122 connected to the mass element 2121. For example, the shape of the outer wall of the tubular structure of the elastic element 2122 can include a cylindrical shape, an elliptical cylindrical shape, a conical shape, a rounded rectangular column, a rectangular column, a polygonal column, an irregular column, etc. or any combination thereof.

[0063] In some embodiments, the elastic element 2122 can extend to the acoustic transducer 220 and connect the acoustic transducer 220. For example, as shown in FIG. 2B, one end of the elastic element 2122 extending to the acoustic transducer 220 can be connected to the acoustic transducer 220. The elastic element 2122 and the acoustic transducer 220 can be connected by physical means, such as gluing, welding. In some embodiments, the elastic element 2122 can also be connected to the acoustic transducer 220 by a connecting member (not shown in FIG. 2B), wherein one end of the connecting member is connected to the elastic element 2122, and the other end of the connecting member is connected to the acoustic transducer 220. Figure 2A In some embodiments, the elastic element 2122 can extend to the acoustic transducer 220 and connect the acoustic transducer 220. For example, as shown in FIG. 2B, one end of the elastic element 2122 extending to the acoustic transducer 220 can be connected to the acoustic transducer 220. The elastic element 2122 and the acoustic transducer 220 can be connected by physical means, such as gluing, welding. In some embodiments, the elastic element 2122 can also be connected to the acoustic transducer 220 by a connecting member (not shown in FIG. 2B), wherein one end of the connecting member is connected to the elastic element 2122, and the other end of the connecting member is connected to the acoustic transducer 220. Figure 2A In some embodiments, the elastic element 2122 can extend to the acoustic transducer 220 and connect the acoustic transducer 220. For example, as shown in FIG. 2B, one end of the elastic element 2122 extending to the acoustic transducer 220 can be connected to the acoustic transducer 220. The elastic element 2122 and the acoustic transducer 220 can be connected by physical means, such as gluing, welding. In some embodiments, the elastic element 2122 can also be connected to the acoustic transducer 220 by a connecting member (not shown in FIG. 2B), wherein one end of the connecting member is connected to the elastic element 2122, and the other end of the connecting member is connected to the acoustic transducer 220. Figure 2A In some embodiments, the elastic element 2122 can extend to the acoustic transducer 220 and connect the acoustic transducer 220. For example, as shown in FIG. 2B, one end of the elastic element 2122 extending to the acoustic transducer 220 can be connected to the acoustic transducer 220. The elastic element 2122 and the acoustic transducer 220 can be connected by physical means, such as gluing, welding. In some embodiments, the elastic element 2122 can also be connected to the acoustic transducer 220 by a connecting member (not shown in FIG. 2B), wherein one end of the connecting member is connected to the elastic element 2122, and the other end of the connecting member is connected to the acoustic transducer 220.

[0064] In some embodiments, the area of the side of the mass element 2121 away from the acoustic transducer 220 is less than the area of the side of the mass element 2121 close to the acoustic transducer 220. In some embodiments, the areas of the multiple cross sections perpendicular to the vibration direction on the mass element 2121 can all be different, for example, the mass element 2121 is a stepped structure. In order to increase the connection area of the elastic element 2122 and the peripheral surface of the mass element 2121, in some embodiments, the areas of the multiple cross sections perpendicular to the vibration direction on the mass element 2121 gradually increase from the side of the mass element 2121 away from the acoustic transducer 220 to the side of the mass element 2121 close to the acoustic transducer 220. In some embodiments, the areas of the multiple cross sections perpendicular to the vibration direction on the mass element 2121 can be partially the same, for example, the peripheral side of the mass element 2121 can be a stepped structure. In the case that the thickness of the mass element 2121 along the vibration direction is constant, the areas of the multiple cross sections perpendicular to the vibration direction on the mass element 2121 being different can increase the peripheral surface area of the mass element 2121, and in turn increase the connection area of the elastic element 2122 and the mass element 2121, improve the connection strength between the elastic element 2122 and the mass element 2121, strengthen the sealing of the first acoustic cavity, make the acoustic pressure change of the first acoustic cavity in response to the shell vibration more significant, and thus improve the sensitivity of the vibration sensor.

[0065] In some embodiments, the peripheral surface of the mass element 2121 can be at least a stepped structure. Figure 2B is a structural schematic diagram of the mass element 2121 according to some embodiments of the present application. In combination with the above description of the acoustic transducer 220, the structure of the mass element 2121 will be further described. Figure 2A and Figure 2BThe mass element 2121 can include a first mass element 21211 and a second mass element 21212, the second mass element 21212 is close to the acoustic transducer 220, the first mass element 21211 is located on a side of the second mass element 21212 away from the second mass element 21212, the cross-sectional area of the first mass element 21211 perpendicular to the vibration direction of the mass element 2121 is smaller than the cross-sectional area of the second mass element 21212 perpendicular to the vibration direction of the mass element 2121, and the overall outer edge of the first mass element 21211 and the second mass element 21212 forms a stepped structure. For example, the circumferential surface of the mass element 2121 can include a side wall a of the first mass element 21211, a region b and a side wall c of the second mass element 21212, and the side wall a, the region b and the side wall c form a stepped structure. The stepped structure can increase the area of the circumferential surface of the mass element 2121, and correspondingly, the area of the connection between the elastic element 2122 and the side wall of the mass element 2121 is larger, which is conducive to the close fit of the mass element 2121 and the elastic element 2122, thereby achieving better sealing between the elastic element 2122 and the mass element 2121, and facilitating the sealing of the first acoustic cavity 213. In some embodiments, the first mass element 21211 and the second mass element 21212 can be connected and fixed by a physical method, for example, by gluing (using epoxy glue, silicone sealant or other adhesive to achieve bonding), or can be integrally formed. In some embodiments, the side of the first mass element 21211 close to the acoustic transducer 220 and the side of the second mass element 21212 away from the acoustic transducer 220 can be connected and fixed by a physical method.

[0066] In some embodiments, the side of the first mass element 21211 away from the acoustic transducer 220 is perpendicular to the vibration direction thereof, and the side of the second mass element 2121 close to the acoustic transducer 220 is perpendicular to the vibration direction thereof. In some embodiments, the closer to the second mass element 2121, the larger the area of the cross section of the first mass element 21211 perpendicular to the vibration direction thereof, and the closer to the acoustic transducer 220, the larger the area of the cross section of the second mass element 21212 perpendicular to the vibration direction thereof. In some embodiments, the first mass element 21211 can be concentrically arranged with the second mass element 21212, or can be arranged eccentrically with the second mass element 21212. In some embodiments, the shape of the side wall (i.e., the cross section perpendicular to the vibration direction) of the first mass element 21211 and / or the second mass element 21212 can include a cylindrical shape, an elliptical cylindrical shape, a trapezoidal shape, a circular rectangular column (as shown in Figure 2B For example, the shape of the side wall of the first mass element 21211 and the second mass element 21212 can be the same, for example, as shown inFigure 2B As shown, the sidewalls of both the first mass element 21211 and the second mass element 21212 are formed as rounded rectangular prisms. In some embodiments, the sidewall shapes of the first mass element 21211 and the second mass element 21212 may be different; for example, the sidewall shape of the first mass element 21211 may be cylindrical, and the sidewall shape of the second mass element 21212 may be a rounded rectangular prism. In some embodiments, the materials of the first mass element 21211 and the second mass element 21212 may be the same or different. As an example only, the materials of the first mass element 21211 and the second mass element 21212 may include metals or alloys such as lead, copper, silver, tin, stainless steel, and stainless iron, or any combination thereof. In some embodiments, the material density of the first mass element 21211 and the second mass element 21212 may be greater than 6 g / cm³. 3 In some embodiments, the material density of the first mass element 21211 and the second mass element 21212 may be greater than 7 g / cm³. 3 .

[0067] In some embodiments, the first mass element 21211 is located in a middle region of the second mass element 21212, such that there can be a certain spacing d (e.g., 10um-1000um) between the sidewall of the first mass element 21211 and the sidewall of the second mass element 21212, i.e., there is a certain spacing d between the side edge of the first mass element 21211 close to the acoustic transducer 220 and the side edge of the second mass element 21212 away from the acoustic transducer 220. In some embodiments, the spacing d between the sidewall of the first mass element 21211 and the sidewall of the second mass element 21212 can be equal everywhere, e.g., when the first mass element 21211 and the second mass element 21212 are concentrically arranged, the sidewall shape of the first mass element 21211 and the sidewall shape of the second mass element 21212 are both cylindrical structures, and the spacing d between the sidewall of the first mass element 21211 and the sidewall of the second mass element 21212 is equal everywhere. In some embodiments, the spacing d between the sidewall of the first mass element 21211 and the sidewall of the second mass element 21212 can not be equal everywhere, e.g., the sidewall shape of the first mass element 21211 is a cylindrical structure, and the sidewall shape of the second mass element 21212 is a rectangular column, and the spacing at the edge of the sidewall of the second mass element 21212 and the spacing at the side edge of the sidewall of the first mass element 21211 are not equal. In some embodiments, the certain spacing d can be 10um-500um. More preferably, the certain spacing d can be 20um-450um. More preferably, the certain spacing d can be 30um-400um. More preferably, the certain spacing d can be 40um-350um. More preferably, the certain spacing d can be 50um-300um. More preferably, the certain spacing d can be 60um-250um. More preferably, the certain spacing d can be 70um-200um. More preferably, the certain spacing d can be 80um-150um. More preferably, the certain spacing d can be 90um-100um.

[0068] In some embodiments, the thickness of the first mass element 21211 along its vibration direction can be greater than the thickness of the second mass element 21212 along its vibration direction. By increasing the thickness of the first mass element 21211, not only the mass of the mass element 2121 as a whole can be increased, but also the connection area between the elastic element 2122 and the side wall a of the first mass element 21211 can be increased, thereby improving the connection strength between the elastic element 2122 and the mass element 2121. In some embodiments, the thickness of the first mass element 21211 along its vibration direction can be 50 um to 1000 um, and the thickness of the second mass element 21212 along its vibration direction can be 10 um to 150 um. More preferably, the thickness of the first mass element 21211 along its vibration direction can be 60 um to 900 um, and the thickness of the second mass element 21212 along its vibration direction can be 20 um to 130 um. More preferably, the thickness of the first mass element 21211 along its vibration direction can be 70 um to 800 um, and the thickness of the second mass element 21212 along its vibration direction can be 30 um to 120 um. More preferably, the thickness of the first mass element 21211 along its vibration direction can be 80 um to 700 um, and the thickness of the second mass element 21212 along its vibration direction can be 40 um to 110 um. More preferably, the thickness of the first mass element 21211 along its vibration direction can be 90 um to 600 um, and the thickness of the second mass element 21212 along its vibration direction can be 50 um to 100 um. More preferably, the thickness of the first mass element 21211 along its vibration direction can be 100 um to 500 um, and the thickness of the second mass element 21212 along its vibration direction can be 60 um to 90 um. More preferably, the thickness of the first mass element 21211 along its vibration direction can be 200 um to 400 um, and the thickness of the second mass element 21212 along its vibration direction can be 60 um to 90 um. More preferably, the thickness of the first mass element 21211 along its vibration direction can be 300 um to 350 um, and the thickness of the second mass element 21212 along its vibration direction can be 70 um to 80 um.

[0069] It should be noted that the mass element 2122 is not limited to Figure 2A and Figure 2B the structure including the first mass element 21211 and the second mass element 21212 as shown, but can also include a third mass element, a fourth mass element, or more mass elements. When the mass element 2122 includes two or more mass elements, a stepped structure can be formed between the side walls of each two mass elements.

[0070] In some embodiments, the elastic element 2122 can include a first elastic portion 21221 surrounding the sidewall connected to the first mass element 21211 and a second elastic portion 21222 surrounding the sidewall connected to the second mass element 21212. The first elastic portion 21221 and the second elastic portion 21222 can be connected by physical means, such as gluing, welding. In some embodiments, the first elastic portion 21221 and the second elastic portion 21222 can be integrally formed. In some embodiments, the first elastic portion 21221 is tightly fitted with the sidewall of the first mass element 21211, and the second elastic portion 21222 is tightly fitted with the sidewall of the second mass element 21212. The first elastic portion 21221 and the second elastic portion 21222 are sealingly connected. In some embodiments, the two ends of the first elastic portion 21221 can be connected with the sidewall of the first mass element 21211 and the second elastic portion 21222, respectively. In some embodiments, the two ends of the first elastic portion 21221 can be sealingly connected with the sidewall of the first mass element 21211 and the second elastic portion 21222, respectively. The first elastic portion 21221 can include a first side surface 21221a connected with the sidewall of the first mass element 21211 and a second side surface 21221b connected with the surface of the second mass element 21212 exposed to the second acoustic cavity 214. The second side surface 21221b of the first elastic portion 21221 can be connected with the stepped surface of the second mass element 21212, and the stepped surface of the second mass element 21212 supports the first elastic portion 21221. The second side surface 21221b of the first elastic portion 21221 can be connected with the second elastic portion 21222. The sidewall of the second mass element 21212 is connected with the second elastic portion 21222. In some embodiments, the second elastic portion 21222 extends to the acoustic transducer 220 and is connected with the acoustic transducer 220 (e.g., the substrate 222). In some embodiments, the two ends of the second elastic portion 21222 can be connected with the sidewall of the second mass element 21212 and the acoustic transducer 220, respectively. The end of the second elastic portion 21222 connected with the sidewall of the second mass element 21212 can also be connected with the first elastic portion 21221. In some embodiments, the first side surface 21221a of the first elastic portion 21221 is shaped to adapt to the shape of the sidewall of the first mass element 21211. For example, the cross-sectional shape of the first mass element 21211 perpendicular to the vibration direction of the first mass element 21211 can be triangular, quadrilateral, circular, elliptical, sector, rounded rectangular, regular or irregular shape. At each height along the vibration direction of the first mass element 21211, the cross-sectional shape of the first side surface 21221a perpendicular to the vibration direction of the first mass element 21211 is the same as the cross-sectional shape of the first mass element 21211.In some embodiments, the side surface shape of the second elastic portion 21222 near the sidewall of the second mass element 21212 is adapted to the sidewall shape of the second mass element 21212, for example, the cross-sectional shape of the second mass element 21212 perpendicular to the vibration direction can be triangular, quadrilateral, circular, elliptical, sector, rounded rectangular, equilateral or irregular shape, at each height in the vibration direction, the cross-sectional shape of the side surface of the second elastic portion 21222 near the sidewall of the second mass element 21212 perpendicular to the vibration direction is the same as the cross-sectional shape of the sidewall of the second mass element 21212 perpendicular to the vibration direction. The present specification does not limit the side surface shape of the first elastic portion 21221 away from the sidewall of the first mass element 21211 and the side surface shape of the second elastic portion 21222 away from the sidewall of the second mass element 21212, for example, the side surface shape can include a cylindrical shape, an elliptical cylindrical shape, a conical shape, a rounded rectangular column, a rectangular column, a polygonal column, an irregular column shape, etc. or any combination thereof. In some embodiments, the materials of the first elastic portion 21221 and the second elastic portion 21222 can be the same or different, for example only, the material of the first elastic portion 21221 or the second elastic portion 21222 can include silicone rubber, silicone gel, silicone sealant, etc. or any combination thereof.

[0071] In some embodiments, the mass element 2121 can further include a first hole portion 21213, the first hole portion 21213 communicating the first acoustic cavity 213 and the second acoustic cavity 214. The first hole portion 21213 can pass through the mass element 2121, the first hole portion 21213 can make the gas in the first acoustic cavity 213 and the second acoustic cavity 214 flow, thereby balancing the change of the gas pressure inside the first acoustic cavity 213 and the second acoustic cavity 214 caused by the temperature change during the preparation process of the vibration sensor 200 (for example, during the reflow soldering process), reducing or preventing the damage of the components of the vibration sensor 200 caused by the change of the gas pressure, for example, cracking, deformation, etc.

[0072] In some embodiments, the first hole portion 21213 can be a single hole structure. In some embodiments, the diameter of the single hole can be 1-50 um. Preferably, the diameter of the single hole can be 2-45 um. More preferably, the diameter of the single hole can be 3-40 um. More preferably, the diameter of the single hole can be 4-35 um. More preferably, the diameter of the single hole can be 5-30 um. More preferably, the diameter of the single hole can be 5-25 um. More preferably, the diameter of the single hole can be 5-20 um. More preferably, the diameter of the single hole can be 6-15 um. More preferably, the diameter of the single hole can be 7-10 um. In some embodiments, the first hole portion 21213 can be an array of a number of micropores. By way of example only, the number of micropores can be 2-10. In some embodiments, the diameter of each micropore can be 0.1-25 um. Preferably, the diameter of each micropore can be 0.5-20 um. More preferably, the diameter of each micropore can be 0.5-25 um. More preferably, the diameter of each micropore can be 0.5-20 um. More preferably, the diameter of each micropore can be 0.5-15 um. More preferably, the diameter of each micropore can be 0.5-10 um. More preferably, the diameter of each micropore can be 0.5-5 um. More preferably, the diameter of each micropore can be 0.5-4 um. More preferably, the diameter of each micropore can be 0.5-3 um. More preferably, the diameter of each micropore can be 0.5-2 um. More preferably, the diameter of each micropore can be 0.5-1 um.

[0073] In some embodiments, the mass element 2121 can also not be provided with the first hole portion 21213. In some embodiments, when the mass element 2121 is not provided with the first hole portion 21213, damage to the components of the vibration sensor 200 due to changes in air pressure inside the first acoustic cavity 213 can be avoided by increasing the connection strength between the mass element 2121 and the elastic element 2122 (e.g., increasing the adhesive strength of the glue between the mass element 2121 and the elastic element 2122).

[0074] In some embodiments, the acoustic transducer 220 may include a substrate 222. The substrate 222 may be used to fix and / or support the vibration receiver 210. In some embodiments, the substrate 222 may be disposed on the acoustic transducer 220, and the housing 211 and the substrate 222 are physically connected to form an acoustic cavity. In some embodiments, one end of the elastic element 2122 extending into the acoustic transducer 220 may be connected to the substrate 222, and the substrate 222 may be used to fix and support the vibration unit 212. The provision of the substrate 222 allows the vibration receiver 210 to be processed, manufactured, and sold as a separate component. The vibration receiver 210 with the substrate 222 can be directly physically connected (e.g., glued) to the acoustic transducer 220 to obtain the vibration sensor 200, which simplifies the manufacturing process of the vibration sensor 200 and improves the process flexibility of manufacturing the vibration sensor 200. In some embodiments, the thickness of the substrate 222 may be 10 μm to 300 μm. Preferably, the thickness of the substrate 222 may be 20 μm to 280 μm. More preferably, the thickness of the substrate 222 can be 30µm to 270µm. More preferably, the thickness of the substrate 222 can be 40µm to 250µm. More preferably, the thickness of the substrate 222 can be 80µm to 90µm. In some embodiments, the material of the substrate 222 may include metals (e.g., iron, copper, stainless steel, etc.), alloys, non-metals (plastics, rubber, resin), etc., or any combination thereof.

[0075] In some embodiments, the pickup hole 2221 may be located on the substrate 222, and the pickup hole 2221 extends through the substrate 222 along the vibration direction. The sound pressure change in the first acoustic cavity 213 can act on the acoustic transducer 220 through the pickup hole 2221 to generate an electrical signal.

[0076] It should be noted that the above description of the vibration sensor 200 and its components is for illustrative purposes only and does not limit the scope of this specification. Those skilled in the art can make various modifications and changes to the vibration sensor 200 under the guidance of this specification. For example, the vibration sensor 200 may include at least one first hole 21213, which may be disposed through the elastic element 2122. These modifications and changes are still within the scope of this specification.

[0077] To ensure a large connection area between the elastic element and the mass element, thereby improving the connection strength between them, the mass element can also be of other structures, provided that the area of ​​the side of the mass element away from the acoustic transducer is smaller than the area of ​​the side of the mass element closer to the acoustic transducer. Figure 3 This is a structural schematic diagram of the vibration unit 312 shown in some embodiments of this application. For example... Figure 3As shown, the area of ​​the side of mass element 3121 away from the acoustic transducer is smaller than the area of ​​the side of mass element 3121 closer to the acoustic transducer. Along its vibration direction (e.g., ...) Figure 3 In the cross-section shown, the side connecting the edge of the mass element 312 away from the acoustic transducer and the edge of the mass element 312 near the acoustic transducer is an inclined surface. The inclined surface connecting the elastic element 3122 and the side of the mass element 312 away from the acoustic transducer and the side of the mass element 312 near the acoustic transducer ensures that the elastic element 3122 and the mass element 3121 have a large connection area, thereby improving the connection strength between the elastic element 3122 and the mass element 3121.

[0078] In some embodiments, the side of mass element 3121 that connects the side away from the acoustic transducer and the side of mass element 3121 that is close to the acoustic transducer can be a smooth inclined surface. In some embodiments, the side of mass element 3121 that connects the side away from the acoustic transducer and the side of mass element 3121 that is close to the acoustic transducer can be an inclined surface with multiple irregularities, for example, the surface of the inclined surface can be a wavy or sawtooth structure. In some embodiments, in a cross-section of the mass element 3121 along its vibration direction, the line connecting the edge of the mass element 3121 facing away from the acoustic transducer and the edge of the mass element 3121 near the acoustic transducer forms an angle c with the vibration direction of the mass element 3121. This angle c can be 10°-80°. Setting the range of values ​​for this angle c can prevent the connection strength optimization effect between the elastic element 3122 and the mass element 3121 from being insignificant when the angle c is too small, and can also prevent the area of ​​the mass element 3121 facing away from the acoustic transducer from being too small when the angle c is too large, resulting in a small mass of the mass element 3121. Preferably, the angle c can be 20°-70°. More preferably, the angle c can be 30°-60°. More preferably, the angle c can be 40°-50°. More preferably, the angle c can be 42°-48°. More preferably, the angle c can be 44°-46°.

[0079] In some embodiments, the elastic element 3122 is connected around the side surface between the side of the mass element 3121 facing away from the acoustic transducer and the side of the mass element 3121 close to the acoustic transducer. In some embodiments, one end of the elastic element 3122 is connected to the inclined surface of the mass element 3121, and the other end of the elastic element 3122 is connected to the acoustic transducer. The side of the mass element 3121 close to the acoustic transducer, the elastic element 3122, and the acoustic transducer form a first acoustic cavity 313. In some embodiments, the shape of the end surface of the elastic element 3122 connected to the inclined surface of the mass element 3121 is adapted to the shape of the inclined surface of the mass element 3121, for example, the edge of the side surface is a wavy or jagged curve, and the outer edge of the end surface of the elastic element 3122 connected to the side surface is also a wavy or jagged curve. The present specification does not limit the shape of the side surface of the elastic element 3122 exposed to the second acoustic cavity, for example, in the cross section of the mass element 3121 along the vibration direction thereof, the edge of the side of the elastic element 3122 exposed to the second acoustic cavity can be an irregular curve with multiple concavities and convexities.

[0080] In some embodiments, the mass element 3121 can further include a first hole portion 31213 penetrating the mass element 3121 to allow gas flow between the first acoustic cavity 313 and the second acoustic cavity. In some embodiments, the first hole portion 31213 can be a single-hole structure. In some embodiments, the first hole portion 31213 can be an array of a certain number of micropores. For example only, the number of micropores can be 2-10.

[0081] In some embodiments, the substrate 322 can be used to fix and / or support the vibration unit 312. In some embodiments, the end of the elastic element 3122 connected to the acoustic transducer can be connected to the substrate 322, so that the substrate 322 can be used to fix and support the vibration unit 312. In some embodiments, the substrate 322 can include a pickup hole 2221 for acoustically connecting the first acoustic cavity 313 to the acoustic transducer.

[0082] It should be noted that the above description of the vibration unit 312 and its components is only for example and illustration, and does not limit the scope of the present specification. Various modifications and changes can be made to the vibration unit 312 under the guidance of the present specification, for example, the vibration sensor 200 can include at least two elastic elements, the elastic elements are connected to each other, the elastic element close to the mass element is connected to the mass element, and the mass element close to the acoustic transducer is connected to the acoustic transducer. These modifications and changes are still within the scope of the present specification.

[0083] In the process of opening the first hole part on the mass element, part of the elements of the acoustic transducer (e.g., the substrate) can be damaged. In order to prevent the opening of the first hole part from damaging the acoustic transducer, in some embodiments, the mass element can include one or more second hole parts (also referred to as recesses), and the first hole part communicates with the second hole part. Figure 4 is a structural schematic diagram of a vibration unit 412 according to some embodiments of the present application. As shown, the two ends of the elastic element 4122 are physically connected to the side wall of the mass element 4121 and the acoustic transducer, for example, by gluing. The side of the mass element 4121 close to the acoustic transducer, the elastic element 4122, and the acoustic transducer form a first acoustic cavity 413. Figure 4

[0084] In the case where the mass element 4121 needs to be provided with the first hole part 41213, it is inconvenient to process the first hole part 41213 due to the large overall thickness of the mass element 4121 along its vibration direction. In some embodiments, the mass element 4121 can be provided with a second hole part 41214, and the first hole part 41213 communicates with the second hole part 41214. In some embodiments, the mass element 4121 can include one or more second hole parts 41214. The provision of the second hole part 41214 thins the local structure of the mass element 4121, so as to facilitate the opening of the first hole part 41213 at the thinned local structure, and facilitate the control of the processing strength of the first hole part 41213, so as not to cause damage to other components (e.g., the substrate 422, the acoustic transducer) of the vibration sensor in the processing of the first hole part 41213. In some embodiments, the second hole part 41214 is located at the side of the mass element 4121 along its vibration direction. For example, the second hole part 41214 can be located at the side of the mass element 4121 close to or away from the substrate 422. In some embodiments, the first hole part 41213 and the second hole part 41214 are arranged along the vibration direction of the mass element 4121, and the first hole part 41213 and the second hole part 41214 penetrate through the mass element 4121. In some embodiments, the second hole part 41214 can be concentrically arranged with the mass element 4121, or can not be concentrically arranged with the mass element 4121. In some embodiments, the first hole part 41213 can be concentrically arranged with the second hole part 41214, or can not be concentrically arranged with the second hole part 41214.

[0085] ​In some embodiments, the second hole portion 41214 and / or the first hole portion 41213 can be a square hole, a polygonal hole, a circular hole, an irregular hole, or the like, or any combination thereof, and the present specification does not limit the hole shape of the second hole portion 41214 and the first hole portion 41213. In some embodiments, the first hole portion 41213 can have the same hole shape as the second hole portion 41214, or can have a different hole shape. In some embodiments, the first hole portion 41213 and the second hole portion 41214 can each be a single-hole structure. In some embodiments, the second hole portion 41214 can be a single-hole structure, and the first hole portion 31213 can be an array of a certain number of micropores.

[0086] In some embodiments, the size of the second hole portion 41214 is greater than the size of the first hole portion 41213, facilitating machining of the first hole portion 41213 in the second hole portion 41214. In some embodiments, the cross-sectional area of the second hole portion 41214 perpendicular to the vibration direction of the mass element 4121 is greater than the cross-sectional area of the first hole portion 41213 perpendicular to the vibration direction of the mass element 4121. When the second hole portion 41214 and the first hole portion 41213 are each a circular hole, the diameter of the second hole portion 41214 can be 100 um to 1600 um, and the diameter of the first hole portion 41213 can be 1 um to 50 um. Preferably, the diameter of the second hole portion 4121 can be 110 um to 1400 um, and the diameter of the first hole portion 41213 can be 2 um to 45 um. Preferably, the diameter of the second hole portion 41214 can be 120 um to 1200 um, and the diameter of the first hole portion 41213 can be 3 um to 40 um. Preferably, the diameter of the second hole portion 41214 can be 130 um to 1000 um, and the diameter of the first hole portion 41213 can be 4 um to 35 um. Preferably, the diameter of the second hole portion 41214 can be 140 um to 800 um, and the diameter of the first hole portion 41213 can be 5 um to 30 um. Preferably, the diameter of the second hole portion 41214 can be 160 um to 600 um, and the diameter of the first hole portion 41213 can be 5 um to 25 um. Preferably, the diameter of the second hole portion 41214 can be 180 um to 500 um, and the diameter of the first hole portion 41213 can be 5 um to 20 um. Preferably, the diameter of the second hole portion 41214 can be 200 um to 400 um, and the diameter of the first hole portion 41213 can be 10 um to 15 um.

[0087] Figure 5 is Figure 4A structural diagram of the mass element 4121 shown in FIG. 12A is shown in FIG. 12B. The second hole portion 41214 is disposed on the side of the mass element 4121 close to the acoustic transducer, and the first hole portion 41213 is disposed on the side of the mass element 4121 away from the acoustic transducer. The second hole portion 41214 and the first hole portion 41213 pass through the mass element 4121.

[0088] Figure 6A A structural diagram of the vibration unit 412 according to some embodiments of the present application is shown in FIG. 13A. As shown in FIG. 13A, the second hole portion 41214 is disposed on the side of the mass element 4121 away from the acoustic transducer, and the first hole portion 41213 is disposed on the side of the mass element 4121 close to the acoustic transducer. The second hole portion 41214 and the first hole portion 41213 pass through the mass element 4121. Figure 6A In some embodiments, the depth of the first hole portion 41213 along the vibration direction of the mass element 4121 can be greater than, less than, or equal to the depth of the second hole portion 41214 along the vibration direction of the mass element 4121, for example only. Figure 6B A structural diagram of the vibration unit 412 according to some embodiments of the present application is shown in FIG. 13B. As shown in FIG. 13B, the second hole portion 41214 is disposed on the side of the mass element 4121 away from the acoustic transducer, and the first hole portion 41213 is disposed on the side of the mass element 4121 close to the acoustic transducer. The second hole portion 41214 and the first hole portion 41213 pass through the mass element 4121. The depth of the first hole portion 41213 along the vibration direction of the mass element 4121 is greater than the depth of the second hole portion 41214 along the vibration direction of the mass element 4121. Figure 6B A structural diagram of the vibration unit 412 according to some embodiments of the present application is shown in FIG. 13B. As shown in FIG. 13B, the second hole portion 41214 is disposed on the side of the mass element 4121 away from the acoustic transducer, and the first hole portion 41213 is disposed on the side of the mass element 4121 close to the acoustic transducer. The second hole portion 41214 and the first hole portion 41213 pass through the mass element 4121. The depth of the first hole portion 41213 along the vibration direction of the mass element 4121 is greater than the depth of the second hole portion 41214 along the vibration direction of the mass element 4121. Figure 6C A structural diagram of the vibration unit 412 according to some embodiments of the present application is shown in FIG. 14A. As shown in FIG. 14A, in some embodiments, the second hole portion 41214 is disposed on both sides of the mass element 4121 close to and away from the acoustic transducer. The second hole portions 41214 on both sides of the mass element 4121 are connected by the first hole portion 41213. Figure 6C A structural diagram of the vibration unit 412 according to some embodiments of the present application is shown in FIG. 14B. As shown in FIG. 14B, in some embodiments, the vibration unit 412 can include multiple layers of stacked mass elements 4121. The materials of the multiple layers of mass elements 4121 can be the same or not completely the same or completely different. The first hole portion 41213 passes through part of the mass elements 4121, and the second hole portion 41214 passes through part of the mass elements 4121. The first hole portion 41213 and the second hole portion 41214 are connected. Figure 6D A structural diagram of the vibration unit 412 according to some embodiments of the present application is shown in FIG. 14B. As shown in FIG. 14B, in some embodiments, the vibration unit 412 can include multiple layers of stacked mass elements 4121. The materials of the multiple layers of mass elements 4121 can be the same or not completely the same or completely different. The first hole portion 41213 passes through part of the mass elements 4121, and the second hole portion 41214 passes through part of the mass elements 4121. The first hole portion 41213 and the second hole portion 41214 are connected. Figure 6DAs shown, the vibration unit 412 can include two layers of stacked mass elements 4121, the materials of the two layers of mass elements 4121 are different, the first hole portion 41213 is disposed through the mass element 4121 away from the acoustic transducer, and the second hole portion 41214 is disposed through the mass element 4121 close to the acoustic transducer, the first hole portion 41213 communicates with the second hole portion 41214.

[0089] It should be noted that the above description of the vibration unit 412 and its components is only for example and illustration, and does not limit the scope of the present specification. Various modifications and changes can be made to the vibration unit 412 under the guidance of the present specification, for example, the second hole portion 41214 and the first hole portion 41213 can be disposed through the side wall of the mass element 4121. These modifications and changes are still within the scope of the present specification. It should be noted that, Figure 4 - Figure 6D The second hole portion 41214 shown can also be applied to Figure 2A The vibration sensor 200 shown. In addition, Figure 4 - Figure 6D The mass element 4121 is only illustrative, and its specific shape and structure can refer to Figure 2A and 2B The contents of the present specification, and will not be further elaborated here.

[0090] In some embodiments, during processing, when the elastic element is in a semi-flowing state, or the elastic element deforms in a high-temperature process, the size of the elastic element, especially the size of the elastic element, is not convenient to control, resulting in occupying a larger acoustic cavity space. In some embodiments, the vibration sensor can further include a limiting member between the elastic element and the shell to limit the flow trajectory of the elastic element in a high-temperature state, so as to facilitate the control of the size of the elastic element. Figure 7 is a structural schematic diagram of a vibration sensor 500 according to some embodiments of the present application. As Figure 7 As shown, the vibration sensor 500 includes a vibration receiver 510, an acoustic transducer 520, and a limiting member 530. The vibration receiver 510 can include a shell 511 and a vibration unit 512. The shell 511 can be connected with the acoustic transducer 520 to form an encapsulation structure with an acoustic cavity. The vibration unit 512 can be located in the acoustic cavity. The vibration unit 512 can divide the acoustic cavity into a first acoustic cavity 513 and a second acoustic cavity 514. The vibration unit 512 can include a mass element 5121 and an elastic element 5122. The elastic element 5122 can surround the side wall connected to the mass element 5121, and extend to the acoustic transducer 520 and be directly connected to the substrate 522, the substrate 522 is disposed on the acoustic transducer 520, and the vibration receiver 510 can be disposed on the substrate 522. The structure and components of the vibration sensor 500 are the same as those of the vibration sensor 200, Figure 2AThe structure and components of the vibration sensor 200 described in the foregoing are the same or similar to those of the vibration sensor 200 described in the foregoing, and details can be referred to the description in the foregoing, which will not be repeated here. Figure 2A

[0091] In some embodiments, the limiting member 530 is located between the elastic element 5122 and the shell 511, and the limiting member 530 limits the outer wall of the elastic element 5122, so as to control the flow of the elastic element 5122 in the preparation process of the vibration receiver 510, and better control the size and shape of the elastic element 5122.

[0092] In some embodiments, the limiting member 530 can be arranged around the elastic element 5122, and the side of the elastic element 5122 close to the mass element 5121 is physically connected to the mass element 5121, and the side of the elastic element 5122 close to the limiting member 530 is physically connected to the limiting member 530. In some embodiments, the limiting member 530 can be physically connected to the substrate 522. In some embodiments, the limiting member 530 can not be in contact with the shell 511 or be in contact with the shell 511.

[0093] In some embodiments, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 100 um to 1000 um. Preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 110 um to 900 um. Preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 120 um to 800 um. Preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 130 um to 700 um. Preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 140 um to 600 um. Preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 150 um to 500 um. Preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 160 um to 400 um. Preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 170 um to 300 um. Preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 can be 180 um to 200 um. More preferably, the height of the limiting member 530 along the vibration direction of the mass element 5121 is equal to the height of the mass element 5121. The present specification does not limit the material and density of the limiting member 530, for example, the limiting member 530 can be made of a non-magnetic metal material.

[0094] In some embodiments, at least one third hole portion 5111 can be arranged on the shell 511, and the third hole portion 5111 penetrates the shell 511. The structure of the third hole portion 5111 is the same or similar to that of the first hole portion 21213, and details can be referred to the description in the foregoing Figure 2A ​The third hole portion 5111 can allow the second acoustic cavity 514 to communicate with the gas outside, so as to balance the change of the gas pressure inside the second acoustic cavity 514 caused by the temperature change during the preparation process (e.g., the reflow process) of the vibration sensor 500, and reduce or prevent the damage (e.g., cracking, deformation, etc.) of the components of the vibration sensor 500 caused by the change of the gas pressure. In addition, the third hole portion 5111 can be used to reduce the damping of the gas inside the second acoustic cavity 514 when the mass element 5121 vibrates.

[0095] In some embodiments, the air-conducted sound in the environment can affect the performance of the vibration sensor 500. In order to reduce the influence of the air-conducted sound in the environment, after the preparation of the vibration sensor 500 is completed, for example, after the reflow process, a sealing material can be used to seal the third hole portion 5111 on the shell 511. For example only, the sealing material can include epoxy glue, silicone sealant, etc. or any combination thereof. In some embodiments, the shell 511 can also not be provided with the third hole portion 5111.

[0096] It should be noted that the above description of the vibration sensor 500 and its components is only for example and illustration, and does not limit the scope of the present specification. Various modifications and changes can be made to the vibration sensor 500 under the guidance of the present specification. For example, the shell 511 and the acoustic transducer 520 can be in contact (e.g., physically connected) or indirectly connected. These modifications and changes are still within the scope of the present specification. It should be noted that Figure 7 The description of the vibration sensor 500 and its components is only for example and illustration, and does not limit the scope of the present specification. Various modifications and changes can be made to the vibration sensor 500 under the guidance of the present specification. For example, the shell 511 and the acoustic transducer 520 can be in contact (e.g., physically connected) or indirectly connected. These modifications and changes are still within the scope of the present specification. It should be noted that Figure 7 The stopper 530 shown can also be applied to Figure 2A - Figure 6D The vibration sensor shown. In addition, Figure 7 The mass element 5121 of the vibration sensor is only for example and illustration, and its specific shape and structure can refer to the content of Figure 2A - Figure 6D The content of the vibration sensor is not further described here.

[0097] Figure 8 is a structural schematic diagram of a vibration sensor 600 according to some embodiments of the present application. As Figure 8 The vibration sensor 600 includes a vibration receiver 610 and an acoustic transducer 620. The vibration receiver 610 can include a shell 611 and a vibration unit 612. The shell 611 can be connected with the acoustic transducer 620 to form an encapsulation structure with an acoustic cavity, and the vibration unit 612 can be located in the acoustic cavity. The vibration unit 612 can divide the acoustic cavity into a first acoustic cavity 613 and a second acoustic cavity 614. The vibration unit 612 can include a mass element 6121 and an elastic element 6122, and the mass element 6121 is connected with the shell 611 through the elastic element 6122. The structure and components of the vibration sensor 600 are similar to those of Figure 2AThe structure and components of the vibration sensor 200 described herein are the same as or similar to those described herein; for details, please refer to [link to relevant documentation]. Figure 2A The description in the text will not be repeated here.

[0098] In some embodiments, the elastic element 6122 is sleeved on the outside of the mass element 6121, wherein the inner side of the elastic element 6122 is physically connected to the mass element 6121, and the outer side of the elastic element 6122 is physically connected to the housing 611. In some embodiments, the elastic element 6122 and the substrate 622 have a certain distance in the vibration direction of the mass element 6121, wherein the elastic element 6122, the mass element 6121, the housing 611, and the substrate 622 form a first acoustic cavity 613, and the elastic element 6122, the mass element 6121, and the housing 611 form a second acoustic cavity 614. When forming the first acoustic cavity 613 and the second acoustic cavity 614, a jig ( Figure 8 (Not shown) The height of the mass element 6121 can be controlled, for example, by placing the mass element 6121 on a fixture, using the height of the fixture itself to lift the mass element 6121, and then connecting the mass element 6121 to the housing 611 via an elastic element 6122, thereby achieving height control of the mass element 6121. This allows for more stable control of the heights of the first acoustic cavity 613 and the second acoustic cavity 614. In some embodiments, the thickness of the elastic element 6122 along the vibration direction of the mass element 6121 is equal to the thickness of the mass element 6121. In some embodiments, the thickness of the elastic element 6122 along the vibration direction of the mass element 6121 is less than or greater than the thickness of the mass element 6121.

[0099] Figure 9 This is a structural schematic diagram of a vibration transceiver 610 according to some embodiments of this application. For example... Figure 9 As shown, in some embodiments, the thickness of the elastic element 6122 along the vibration direction of the mass element 6121 is greater than the thickness of the mass element 6121. The two sides of the elastic element 6122 along the vibration direction of the mass element 6121 can protrude relative to the two sides of the mass element 6121, thereby increasing the connection area between the elastic element 6122 and the mass element 6121, and thus increasing the connection strength between the two.

[0100] In some embodiments, the mass element 6121 can be provided with a hole 630. The hole 630 can pass through the mass element 6121 to communicate the first acoustic cavity 613 and the second acoustic cavity 614, thereby balancing the pressure change inside the first acoustic cavity 613 and the second acoustic cavity 614 due to the temperature change during the manufacturing process (e.g., the reflow process) of the vibration sensor 600, reducing or preventing the damage (e.g., cracking, deformation, etc.) of the components of the vibration sensor 200 caused by the pressure change. In some embodiments, the housing 611 can be provided with a hole 630. The hole 630 can pass through the housing 611 to communicate the second acoustic cavity 614 and the outside. The hole 630 can be used to reduce the damping of the gas inside the second acoustic cavity 614 when the mass element 6121 vibrates. The shape and structure of the hole 630 can refer to the related descriptions of the first hole, the second hole, and the third hole elsewhere in this specification, for example Figure 2A and the related content.

[0101] It should be noted that the above description of the vibration sensor 600 and its components is only for example and illustration, and does not limit the scope of the present specification. Various modifications and changes can be made to the vibration sensor 600 under the guidance of the present specification. For example, neither the housing 611 nor the mass element 6121 is provided with a hole 630, or both the housing 611 and the mass element 6121 are provided with a hole 630. These modifications and changes are still within the scope of the present specification. Figure 8 and Figure 9 The above has described the basic concept. It is obvious that the above detailed disclosure is only for example and does not constitute a limitation on the present application. Although it is not explicitly stated herein, those skilled in the art can make various modifications, improvements, and changes to the present application. Such modifications, improvements, and changes are suggested in the present application, so such modifications, improvements, and changes still belong to the spirit and scope of the exemplary embodiments of the present application.

[0102] Meanwhile, specific words are used in the present application to describe the embodiments of the present application. As "one embodiment", "an embodiment", and / or "some embodiments" means a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "an embodiment" or "one embodiment" or "one alternative embodiment" mentioned in different places in the specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the present application can be properly combined.

[0103] Meanwhile, specific words are used in the present application to describe the embodiments of the present application. As "one embodiment", "an embodiment", and / or "some embodiments" means a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "an embodiment" or "one embodiment" or "one alternative embodiment" mentioned in different places in the specification does not necessarily refer to the same embodiment. In addition, certain features, structures or characteristics in one or more embodiments of the present application can be properly combined.

[0104] Moreover, those skilled in the art will appreciate that the various aspects of the application can be illustrated and described by means of a number of illustrative classes or categories of items, including any new and useful processes, machines, products or compositions of matter, or any new and useful improvements to these items, as well as any new and useful combinations of these items. Accordingly, the various aspects of the application can be embodied in whole, or in part, by hardware, software (including firmware, resident software, micro-code, etc.) or by combinations thereof. The foregoing flow diagrams can be embodied in hardware, software (including firmware, resident software, micro-code, etc.) or by combinations thereof. The foregoing flow diagrams can be embodied in hardware, software (including firmware, resident software, micro-code, etc.) or by combinations thereof. The various aspects of the application can also be embodied as computer-readable product comprising a computer-readable medium having stored thereon computer program codes means.

[0105] Computer storage media can include a propagated data signal with the computer program code embodied therein, e.g., in baseband or as part of a carrier wave. Such a propagated signal can take any of a variety of forms, including but not limited to electro-magnetic, optical, or any suitable combination thereof. Computer storage media can be any media that can be accessed by a computer. By way of example, and not limitation, such computer storage media can comprise RAM, ROM, EEPROM, CD-ROM or any other optical disk storage, magnetic disk storage or any other storage medium that can be used to carry or store desired computer program code means in the form of computer-readable program codes means, etc. Computer storage media can be any computer readable medium.

[0106] Computer program code means or computer program code for use on or in connection with the instruction execution systems, apparatus, or devices can be stored in any computer storage media. By way of example, and not limitation, such computer program code can embody one or more of a specification, instructions, code, machine code, data, and / or any combination thereof. A data signal embodied in a carrier wave can comprise any base or character set representation of computer program code, whether in source code, encrypted, or interpreted form, or any other form.

[0107] Furthermore, the order of the processing elements and sequences, unless specifically stated to the contrary, are not designed to be a limitation with regard to the present processes and methods. Although the above description has discussed certain embodiments of the application, other alternatives, modifications, and equivalents thereof will become apparent to those skilled in the art in view of the foregoing description. For example, although the system components described above can be implemented through hardware devices, they can also be implemented through software solutions, such as installing the described system on an existing server or mobile device.

[0108] Similarly, it is to be noticed that the term "comprising", used in the description, is not used as a limitation but rather as the plain-English equivalent of the term "comprising". It is also to be noted that, as used in the specification, the articles "a", "an" and "the" are not intended to mean that there is only one of the entity but rather there is at least one of the entity. Rather the said articles are to be understood as the equivalents of the term "one or more", unless otherwise stated.

[0109] Some embodiments use numerical designations to describe components, quantities of attributes. It is to be understood that such numerical designations used in the description of embodiments are, in some examples, modified by the adjectives "about", "approximately", or "generally". Unless otherwise stated, "about", "approximately", or "generally" indicates that the stated numerical value is permitted to vary by ±20%. Accordingly, numerical values used in the specification and claims are approximations that can vary depending upon the desired properties sought to be obtained by the individual embodiment. In some embodiments, numerical values are determined without considering significant figures. Even though numerical ranges and parameters setting forth the broad scope of some embodiments of the application are approximations, the numerical values set forth in the specific examples are reported as precisely as practicable. The numerical values set forth in the specific examples are provided to be as precise as reasonably possible. However, some variations may

[0110] Each patent, patent application, publication, document, article, book, specification, and other material cited in this application is hereby incorporated by reference in its entirety. Nothing herein is to be construed as an admission that the application is not entitled to antedate such disclosure by virtue of prior application. No admission is made that any application, field, or disclaimer, current or future, is relevant prior art. If any Voucher Information is supplied with this application, it is in addition to the incorporation by reference of the above materials and is not an admission of the accuracy or sufficiency of the above information. If there is an inconsistency between the Voucher Information and the above incorporation by reference, the above incorporation by reference will control.

[0111] Finally, it should be understood that the embodiments described herein are merely exemplary of the principles of the application. Other embodiments can fall within the scope of the application. Thus, although the application has been described with respect to example embodiments, it will be recognized that the scope of the application encompasses alternatives and modifications thereof. Accordingly, the embodiments of the application are not limited to the examples described above, but rather are limited only by the claims.

Claims

1. A vibration sensor, comprising: A vibration receiver includes a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit being located within the acoustic cavity, and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; as well as An acoustic transducer is acoustically connected to the first acoustic cavity, wherein: The housing is configured to generate vibration based on an external vibration signal, and the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the housing, so that the acoustic transducer generates an electrical signal. The vibration unit includes a mass element and an elastic element. The area of ​​the mass element on the side away from the acoustic transducer is smaller than the area of ​​the mass element on the side close to the acoustic transducer. The elastic element is configured as a tubular structure. The inner wall shape of the tubular elastic element is adapted to the shape of the peripheral surface of the mass element and is connected around the peripheral surface of the mass element so that the first acoustic cavity is sealed.

2. The vibration sensor according to claim 1, wherein, The mass element includes a first mass element and a second mass element. The second mass element is close to the acoustic transducer, and the first mass element is located on the side of the second mass element away from the acoustic transducer. The cross-sectional area of ​​the first mass element perpendicular to the vibration direction of the mass element is smaller than the cross-sectional area of ​​the second mass element perpendicular to the vibration direction of the mass element.

3. The vibration sensor according to claim 2, wherein, The first mass element is located in the middle region of the second mass element, and there is a specific distance between the sidewall of the first mass element and the sidewall of the second mass element.

4. The vibration sensor according to claim 3, wherein, The specific spacing ranges from 10µm to 500µm.

5. The vibration sensor according to claim 3, wherein, The elastic element includes a first elastic portion and a second elastic portion. The two ends of the first elastic portion are respectively connected to the sidewall of the first mass element and the second elastic portion. The second elastic portion extends toward the acoustic transducer and is connected to the acoustic transducer.

6. The vibration sensor according to claim 5, wherein, The first elastic portion includes a first side and a second side, the first side being connected to the sidewall of the first mass element, and the second side being connected to the surface of the second mass element exposed in the second acoustic cavity.

7. The vibration sensor according to claim 6, wherein, The sidewall of the second mass element is connected to the second elastic part.

8. The vibration sensor according to claim 5, wherein, The acoustic transducer includes a substrate, a second elastic element extends toward and is connected to the substrate, and the substrate, the second mass element, and the second elastic element form the first acoustic cavity.

9. The vibration sensor according to claim 2, wherein, Along the vibration direction of the mass element, the thickness of the first mass element is 50um to 1000um, and the thickness of the second mass element is 10um to 150um.

10. The vibration sensor according to claim 9, wherein, Along the vibration direction of the mass element, the thickness of the first mass element is greater than the thickness of the second mass element.

11. The vibration sensor according to claim 1, wherein, In a cross-section obtained along the vibration direction of the mass element, the line connecting the edge of the mass element away from the acoustic transducer and the edge of the mass element near the acoustic transducer forms an angle with the vibration direction of the mass element, the angle being in the range of 10°-80°.

12. The vibration sensor according to claim 1, wherein, The mass element includes a first aperture that connects the first acoustic cavity and the second acoustic cavity.

13. The vibration sensor according to claim 12, wherein, The radius of the first hole is 1µm to 50µm.

14. The vibration sensor according to claim 1, wherein the housing includes a third hole, and the second acoustic cavity communicates with the outside through the third hole.

15. A vibration sensor, comprising: A vibration receiver includes a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit being located within the acoustic cavity, and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; as well as An acoustic transducer is acoustically connected to the first acoustic cavity, wherein: The housing is configured to generate vibration based on an external vibration signal, and the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the housing, so that the acoustic transducer generates an electrical signal. The vibration unit includes a mass element and an elastic element. The elastic element is configured as a tubular structure, and the inner wall shape of the tubular elastic element is adapted to the shape of the peripheral surface of the mass element and is connected around the peripheral surface of the mass element so that the first acoustic cavity is sealed. A limiting member is provided between the elastic element and the housing.

16. The vibration sensor according to claim 15, wherein, Along the vibration direction of the mass element, the height of the limiting member is 100um to 1000um.

17. A vibration sensor, comprising: A vibration receiver includes a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit being located within the acoustic cavity, and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; as well as An acoustic transducer is acoustically connected to the first acoustic cavity, wherein: The housing is configured to generate vibration based on an external vibration signal, and the vibration unit changes the sound pressure in the first acoustic cavity in response to the vibration of the housing, so that the acoustic transducer generates an electrical signal. The vibration unit includes a mass element and an elastic element. The elastic element is configured as a tubular structure, and the inner wall shape of the tubular elastic element is adapted to the shape of the peripheral surface of the mass element and is connected around the peripheral surface of the mass element so that the first acoustic cavity is sealed. The mass element includes a groove located on the side of the mass element along its vibration direction.

18. The vibration sensor according to claim 17, wherein, The mass element includes a first aperture that connects the first acoustic cavity and the second acoustic cavity, and the first aperture is located at the groove.

19. The vibration sensor according to claim 18, wherein, The radius of the first hole is 1µm to 50µm.

20. The vibration sensor according to claim 19, wherein, The size of the groove is larger than the size of the first hole.

21. A vibration sensor comprising a vibration receiver, including a housing and a vibration unit, the housing forming an acoustic cavity, the vibration unit being located within the acoustic cavity and dividing the acoustic cavity into a first acoustic cavity and a second acoustic cavity; and An acoustic transducer is acoustically connected to the first acoustic cavity, wherein: The housing is configured to generate vibration based on an external vibration signal, and the vibration unit responds to the vibration of the housing by changing the sound pressure within the first acoustic cavity, causing the acoustic transducer to generate an electrical signal. The vibration unit includes a mass element and an elastic element. The elastic element is configured as a tubular structure, and the inner wall shape of the tubular elastic element is adapted to the shape of the peripheral surface of the mass element and surrounds and connects to the peripheral surface of the mass element so that the first acoustic cavity is sealed and extends into the housing.

22. The vibration sensor according to claim 21, wherein, Along the vibration direction of the mass element, the thickness of the elastic element is greater than the thickness of the mass element.

23. The vibration sensor according to claim 21, wherein, The mass element or the housing has a hole with a radius of 1µm to 50µm.

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