Test-driven modules and test systems

Abstract

This application discloses a test driving module and a test system, belonging to the field of photoelectric detection. The test driving module is used to drive a structure under test (DUT) to test photosensitive materials. The DUT includes at least one signal terminal. The test driving module includes: at least one connection structure for detachable connection to the at least one signal terminal of the DUT; and at least one flip-chip film for electrical connection to the at least one connection structure. This application can reduce testing costs, improve testing versatility, and reduce the risk of damage to photosensitive materials in the DUT.

Description

Technical Field

[0001] This application belongs to the field of photoelectric detection technology, and in particular relates to a test drive module and a test system. Background Technology

[0002] Testing of photosensitive materials typically involves bonding a structure under test (SUT) containing the photosensitive material to a chip-on-film (COF) film to form a chip, and then testing the photosensitive material within the chip. However, bonding the SUT to the COF film can easily damage the photosensitive material within the SUT, and the COF film suffers significant losses, resulting in high testing costs and poor test versatility. Summary of the Invention

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a test-driven module and a test system that can reduce test costs, improve test versatility, and reduce the risk of damage to photosensitive materials in the structure under test.

[0004] In a first aspect, this application provides a test driving module for driving a structure under test to test photosensitive materials, the structure under test including at least one signal terminal, and the test driving module including:

[0005] At least one connection structure is provided for detachable connection to at least one signal terminal of the structure under test, corresponding one-to-one;

[0006] At least one flip-chip thin film is electrically connected to at least one of the aforementioned connection structures in a one-to-one correspondence.

[0007] According to the test driving component provided in the embodiments of this application, by setting at least one connection structure and at least one flip-chip film, wherein the at least one connection structure is used for detachable connection with at least one signal terminal of the structure under test, and the at least one flip-chip film is electrically connected to the at least one connection structure, the flip-chip film can be electrically connected to different structures under test to realize the testing of photosensitive materials of different structures under test, effectively reducing testing costs and improving testing versatility. Moreover, the structure under test does not need to be bound to the flip-chip film, reducing the risk of damage to the photosensitive material in the structure under test.

[0008] According to one embodiment of this application, the connection structure is located on the corresponding flip-chip film.

[0009] According to one embodiment of this application, the test driver module further includes:

[0010] The first and second clamping plates, which are set opposite to each other, are used to clamp and fix the structure to be tested;

[0011] At least a portion of the structure of the flip-chip film is located between the first clamping plate and the second clamping plate, and the connecting structure is located on the at least a portion of the structure of the corresponding flip-chip film.

[0012] According to one embodiment of this application, at least a portion of the structure of the flip-chip film is disposed close to a target clamp, the target clamp being either the first clamp or the second clamp, and the connecting structure is located on the side of the corresponding flip-chip film that is away from the target clamp.

[0013] According to one embodiment of this application, the test drive module further includes a circuit board;

[0014] The connection structure is electrically connected to the corresponding flip-chip film via the circuit board.

[0015] According to one embodiment of this application, the circuit board includes at least one first connection terminal, at least one second connection terminal, and at least one trace connected one-to-one between at least one first connection terminal and at least one second connection terminal;

[0016] At least one of the first connection ends is connected to at least one of the connection structures in a one-to-one correspondence, and at least one of the second connection ends is connected to at least one of the flip-chip films in a one-to-one correspondence.

[0017] According to one embodiment of this application, the test driver module further includes:

[0018] The first and second clamping plates, which are set opposite to each other, are used to clamp and fix the structure to be tested;

[0019] The circuit board is located between the first clamping plate and the second clamping plate, and the connecting structure is located on the circuit board.

[0020] According to one embodiment of this application, the circuit board is disposed close to the target clamp, the target clamp being either the first clamp or the second clamp, and the connection structure is located on the side of the circuit board away from the target clamp.

[0021] According to one embodiment of this application, the test drive module further includes a reinforcing plate; the reinforcing plate is located on the side of the circuit board opposite to the connection structure. The reinforcing plate enables the circuit board to achieve better thermal stability and mechanical strength.

[0022] According to one embodiment of this application, the circuit board includes any one of a printed circuit board, a flexible circuit board, a high-density printed circuit board, and a circuit glass circuit board.

[0023] According to one embodiment of this application, the structure under test includes a photosensitive active region;

[0024] At least one of the first clamping plate and the second clamping plate includes a hollow area, and the area of ​​the hollow area is greater than or equal to the area of ​​the photosensitive effective area.

[0025] According to one embodiment of this application, the shape of the clamp having the hollowed-out area includes any one of the following: a square, a U-shape, and an L-shape.

[0026] According to one embodiment of this application, the connection structure includes either a raised metal block or a spring pin assembly.

[0027] According to one embodiment of this application, the connection structure is a spring pin assembly, which includes a precision structural component and a plurality of spring pins fixed in the precision structural component;

[0028] The spring needle includes a needle body, and a first needle tip and a second needle tip located on opposite sides of the needle body; the first needle tip is electrically connected to the corresponding flip-chip film, and the second needle tip is used for detachable connection to the corresponding signal terminal.

[0029] Secondly, this application provides a testing system, including:

[0030] The structure under test includes at least one signal terminal;

[0031] The above-mentioned test driver module, wherein at least one connection structure in the test driver module is detachably connected to at least one of the signal terminals in a one-to-one correspondence;

[0032] The testing device is electrically connected to at least one flip-chip thin film in the test drive module.

[0033] According to the testing system provided in this application, by setting at least one connection structure and at least one flip-chip film, wherein the at least one connection structure is used for detachable connection with at least one signal terminal of the structure under test, and the at least one flip-chip film is electrically connected to the at least one connection structure, the flip-chip film can be electrically connected to different structures under test, thereby realizing the testing of photosensitive materials of different structures under test, effectively reducing testing costs and improving testing versatility. Moreover, the structure under test does not need to be bound to the flip-chip film, reducing the risk of damage to the photosensitive material in the structure under test.

[0034] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0035] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0036] Figure 1 This is one of the structural schematic diagrams of the test driver module provided in the embodiments of this application;

[0037] Figure 2 This is one of the structural schematic diagrams of the test driver module and the structure under test provided in the embodiments of this application;

[0038] Figure 3 This is a second schematic diagram of the structure of the test driver module provided in the embodiments of this application;

[0039] Figure 4 This is the second schematic diagram of the test driver module and the structure under test provided in the embodiments of this application;

[0040] Figure 5 This is the third schematic diagram of the structure of the test driver module provided in the embodiments of this application;

[0041] Figure 6 This is the third schematic diagram of the test driver module and the structure under test provided in the embodiments of this application;

[0042] Figure 7 This is the fourth schematic diagram of the structure of the test driver module provided in the embodiments of this application;

[0043] Figure 8 This is the fourth schematic diagram of the test driver module and the structure under test provided in the embodiments of this application;

[0044] Figure 9 This is the fifth schematic diagram of the test driver module and the structure under test provided in the embodiments of this application;

[0045] Figure 10 This is a schematic diagram of the circuit board structure in the test driver module provided in this application embodiment;

[0046] Figure 11 This is a schematic diagram of the spring pin assembly in the test drive module provided in this application embodiment;

[0047] Figure 12 This is a schematic diagram of the structure of the test system provided in the embodiments of this application. Detailed Implementation

[0048] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0049] The core of photoelectric sensors lies in photodetectors, and the key to photodetectors is photosensitive materials. The development of new sensing technologies is inseparable from the introduction of new photosensitive materials, which must first undergo systematic testing and evaluation. Currently, research institutions and panel manufacturers collaborate on photosensitive material testing. The panel manufacturer provides the substrate, the research institution coats the substrate with photosensitive material to form the structure under test (DUT), the panel manufacturer bonds the DUT to a flip-chip to form a chip, and then the research institution tests the photosensitive material within the chip. This testing method is complex and time-consuming, hindering the rapid iteration and upgrading of sensing technologies. Furthermore, each DUT needs to be bonded to multiple flip-chips, and once bonded, the flip-chips cannot be used for other DUTs, resulting in significant flip-chip wear, high testing costs, and poor test versatility. Additionally, the repeated transport of the DUT between the panel manufacturer and the research institution, and the bonding between the DUT and the flip-chips, can easily cause scratches or failures in the photosensitive material within the DUT.

[0050] Based on this, embodiments of this application provide a test driver module and a test system.

[0051] The following is for reference. Figures 1-12 This application describes a test driver module and a test system provided in its embodiments. The test driver module is used to drive a structure under test (DUT) to test photosensitive materials. Specifically, the test driver module provides a driver chip to the DUT to provide a drive signal during photosensitive material testing. The DUT includes at least one signal terminal, and the test driver module provides a drive signal to the DUT through this signal terminal. For example, the DUT can be a photodetector, and may include a readout circuit board, a photosensitive material coated on the readout circuit board, and a top electrode mounted on the readout circuit board. The at least one signal terminal of the DUT may include a scan terminal and a data terminal of the readout circuit board. During photosensitive material testing, the test driver module provides a scan drive signal to the DUT through the scan terminal and a data drive signal through the data terminal.

[0052] like Figures 1 to 9As shown, the test drive module provided in this embodiment includes at least one connection structure 1 and at least one flip-chip film 2. The at least one connection structure 1 is detachably connected to at least one signal terminal 12 of the structure under test 10, corresponding one-to-one. The number of connection structures 1 is the same as the number of signal terminals 12 in the structure under test 10, so that when testing the structure under test 10 for photosensitive materials, at least one connection structure 1 is detachably connected to at least one signal terminal 12 of the structure under test 10. The number of flip-chip films 2 is the same as the number of connection structures 1, and at least one flip-chip film 2 is electrically connected to at least one connection structure 1, so that when testing the structure under test 10 for photosensitive materials, each flip-chip film 2 is electrically connected to a corresponding signal terminal 12 in the structure under test 10 through one connection structure 1, such that each flip-chip film 2 provides a drive signal to the corresponding signal terminal 12 in the structure under test 10 through one connection structure 1.

[0053] In this embodiment, the connection structure 1 is detachably connected to the corresponding signal terminal 12 in the structure under test 10. This allows the structure under test 10 to be electrically connected to the corresponding flip-chip film 2 via the connection structure 1 during photosensitive material testing. After the photosensitive material testing is completed, the structure under test 10 can be detached, allowing the flip-chip film 2 to be electrically connected to other structures under test via the connection structure 1. In other words, the flip-chip film 2 can be electrically connected to different structures under test, enabling the testing of photosensitive materials in different structures, effectively reducing testing costs and improving testing versatility. Furthermore, the structure under test 10 does not need to be bound to the flip-chip film 2, reducing the risk of damage to the photosensitive material in the structure under test 10. In addition, panel manufacturers only need to provide substrates (such as readout circuit substrates). After research institutions coat photosensitive materials on the substrates to form the structure under test, they can electrically connect the signal terminal 12 in the structure under test 10 to the corresponding flip-chip film 2 through the connection structure 1, and then test the photosensitive materials of the structure under test 10. There is no need to repeatedly transfer the structure under test 10 between the panel manufacturers and research institutions. The process is simple and time-saving, which helps to facilitate the rapid iteration and upgrading of sensing technology.

[0054] In some embodiments, such as Figure 1 and Figure 2 As shown, the connecting structure 1 is located on the corresponding flip-chip film 2, meaning that the connecting structure 1 is directly connected to the corresponding flip-chip film 2. The connecting structure 1 can be a connection end of the corresponding flip-chip film 2. For example... Figure 2As shown, the connection structure 1 can be a bump on the flip-chip film 2, and the signal terminal 12 of the structure under test 10 can also be a bump on the structure under test 10. Through alignment and hard-press conductivity, the connection structure 1 on the flip-chip film 2 can be detachably connected to the corresponding signal terminal 12 in the structure under test 10. The connection structure 1 can also be located on the corresponding connection terminal of the flip-chip film 2 and connected to it. For example, the connection structure 1 can be a spring pin assembly, and the flip-chip film 2 can be detachably connected to the corresponding signal terminal 12 in the structure under test 10 through the spring pin assembly. The specific structure of the spring pin assembly will be described in detail below. Alternatively, the connection structure 1 can be other structures, as long as it ensures a detachable connection to the signal terminal 12 of the structure under test 10; no specific limitations are made here.

[0055] like Figure 1 and Figure 2 As shown, the test drive module may further include a first clamping plate 3 and a second clamping plate 4, which are arranged opposite to each other for clamping and fixing the structure under test 10. When testing the structure under test 10 with photosensitive materials, the structure under test 10 is clamped and fixed between the first clamping plate 3 and the second clamping plate 4. The first clamping plate 3 can be a cover plate, and the second clamping plate 4 can be a base, or the first clamping plate 3 and the second clamping plate 4 can form a bearing double-hinged clamping structure. The first clamping plate 3 and the second clamping plate 4 can also form other clamping structures, as long as they can achieve the clamping and fixing of the structure under test 10; no specific limitation is made here.

[0056] like Figure 1 As shown, at least a portion of the flip-chip film 2 is located between the first clamping plate 3 and the second clamping plate 4, and the connecting structure 1 is located on the corresponding at least portion of the flip-chip film 2. That is, the connecting structure 1 is located between the first clamping plate 3 and the second clamping plate 4, and the connecting structure 1 is fixed on the corresponding at least portion of the flip-chip film 2, so that when the first clamping plate 3 and the second clamping plate 4 clamp and fix the structure under test 10, the connecting structure 1 can be detachably connected to the signal terminal 12 of the structure under test 10.

[0057] The at least part of the structure of the flip-chip film 2 is disposed close to the target clamp, which is either the first clamp 3 or the second clamp 4. That is, the at least part of the structure of the flip-chip film 2 is fixed to the first clamp 3 or the second clamp 4. The connecting structure 1 is located on the side of the corresponding at least part of the flip-chip film 2 that is away from the target clamp. In other words, if at least a portion of the flip-chip film 2 is fixed on the first clamping plate 3, then the connecting structure 1 is located on the side of the corresponding flip-chip film 2 that is away from the first clamping plate 3, that is, the connecting structure 1 is located between the corresponding flip-chip film 2 that is away from the first clamping plate 3 and the second clamping plate 4; if at least a portion of the flip-chip film 2 is fixed on the second clamping plate 4, then the connecting structure 1 is located on the side of the corresponding flip-chip film 2 that is away from the second clamping plate 4, that is, the connecting structure 1 is located between the corresponding flip-chip film 2 that is away from the first clamping plate 4 and the first clamping plate 3, so that when the first clamping plate 3 and the second clamping plate 4 clamp and fix the structure under test 10, the connecting structure 1 can be detachably connected to the signal terminal 12 of the structure under test 10.

[0058] It should be noted that, as Figure 2 As shown, when the structure under test 10 is a photodetector and has two signal terminals 12 (i.e., a scanning terminal and a data terminal), the two signal terminals 12 of the structure under test 10 are respectively positioned close to adjacent sides of the structure under test 10. The test drive module includes two flip-chip films 2 and two connecting structures 1 correspondingly disposed on the two flip-chip films 2. The positions of the two flip-chip films 2 correspond one-to-one with the positions of the two signal terminals 12 on the structure under test 10, and the positions of the two connecting structures 1 correspond one-to-one with the positions of the two signal terminals 12 on the structure under test 10. That is, the two flip-chip films 2 are respectively positioned close to adjacent sides of the target clamp, and the two connecting structures 1 are respectively positioned close to adjacent sides of the target clamp, so that when the structure under test 10 is fixed in the test drive module, the two signal terminals 12 of the structure under test 10 are detachably connected to the two connecting structures 1.

[0059] In some embodiments, such as Figures 3 to 9 As shown, the test drive module also includes a circuit board 5. The connection structure 1 is electrically connected to the corresponding flip-chip film 2 through the circuit board 5. That is, both the connection structure 1 and the flip-chip film 2 are located on the circuit board 5, and the connection structure 1 and the corresponding flip-chip film 2 are connected through the circuit board 5.

[0060] The circuit board 5 may include a first connection terminal, and the connection structure 1 may be the first connection terminal on the circuit board 5. For example, the connection structure 1 may be a raised metal bump on the circuit board 5, and the signal terminal 12 of the structure under test 10 may also be a raised metal bump on the structure under test 10. By alignment, hard-pressing conductivity, etc., the connection structure 1 on the circuit board 5 and the corresponding signal terminal 12 in the structure under test 10 can be detachably connected. The connection structure 1 may also be disposed on the first connection terminal of the circuit board 5 and connected to the first connection terminal of the circuit board 5. For example, the connection structure 1 may be a spring pin assembly, and the first connection terminal of the circuit board 5 may be detachably connected to the corresponding signal terminal 12 in the structure under test 10 through the spring pin assembly. The specific structure of the spring pin assembly will be described in detail below. In addition, the connection structure 1 may also be other structures, as long as it ensures detachable connection with the signal terminal of the structure under test, which is not specifically limited here.

[0061] The circuit board 5 may also include a second connection terminal, through which the flip-chip film 2 is connected to the circuit board 5. For example, the second connection terminal of the circuit board 5 is a raised metal block, and the flip-chip film 2 also has a raised metal block. After the raised metal block on the circuit board and the raised metal block on the flip-chip film 2 are aligned, the circuit board 5 and the flip-chip film 2 are fixed and electrically connected by a bonding process or a pressing fixture.

[0062] like Figures 3 to 9 As shown, the test drive module may also include a first clamping plate 3 and a second clamping plate 4, the first clamping plate 3 and the second clamping plate 4 being arranged opposite to each other for clamping and fixing the structure under test. Figure 4 , Figure 6 , Figure 8 and Figure 9 As shown, when testing the photosensitive material on the structure under test 10, the structure under test 10 is clamped and fixed between the first clamping plate 3 and the second clamping plate 4. The first clamping plate 3 can be a cover plate, and the second clamping plate 4 can be a base, or the first clamping plate 3 and the second clamping plate 4 can form a bearing double-hinged clamping structure. The first clamping plate 3 and the second clamping plate 4 can also form other clamping structures, as long as they can achieve the clamping and fixing of the structure under test 10; no specific limitation is made here.

[0063] The circuit board 5 is located between the first clamping plate 3 and the second clamping plate 4, and the connecting structure 1 is located on the circuit board 5. That is, the connecting structure 1 is located between the first clamping plate 3 and the second clamping plate 4, and the connecting structure 1 is fixed on the circuit board 5 so that when the first clamping plate 3 and the second clamping plate 4 clamp and fix the structure under test, the connecting structure 1 can be detachably connected to the signal terminal 12 of the structure under test 10.

[0064] The circuit board 5 is positioned close to the target clamp, which is either the first clamp 3 or the second clamp 4. That is, the circuit board 5 is fixed to either the first clamp 3 or the second clamp 4. The connecting structure 1 is located on the side of the circuit board 5 facing away from the target clamp. Specifically, if the circuit board 5 is fixed to the first clamp 3, the connecting structure 1 is located on the side of the circuit board 5 facing away from the first clamp 3, i.e., the connecting structure 1 is located between the circuit board 5 and the second clamp 4; if the circuit board 5 is fixed to the second clamp 4, the connecting structure 1 is located on the side of the circuit board 5 facing away from the second clamp 4, i.e., the connecting structure 1 is located between the circuit board 5 and the first clamp 3, so that when the first clamp 3 and the second clamp 4 clamp and fix the structure under test, the connecting structure 1 can be detachably connected to the signal terminal of the structure under test.

[0065] The circuit board 5 can include any one of the following: printed circuit board (PCB), flexible printed circuit board (FPC), high-density printed circuit board, and circuit glass circuit board. Among them, high-density printed circuit boards have the advantage of narrower linewidth technology compared to ordinary printed circuit boards, meaning that the traces in high-density printed circuit boards can achieve narrower linewidths. Circuit glass circuit boards have higher adaptability to the structure under test, have the advantage of narrower linewidth technology, and also have higher thermal stability.

[0066] In some embodiments, such as Figure 9 As shown, the test drive module also includes a reinforcing plate 6, which is located on the side of the circuit board 5 away from the connection structure 1. The reinforcing plate 6 is located between the circuit board 5 and the target clamping plate (first clamping plate 3 or second clamping plate 4). If the target clamping plate is the first clamping plate 3, that is, the circuit board 5 is set close to the first clamping plate 3, then the reinforcing plate 6 is located between the circuit board 5 and the first clamping plate 3; if the target clamping plate is the second clamping plate 4, that is, the circuit board 5 is set close to the second clamping plate 4, then the reinforcing plate 6 is located between the circuit board 5 and the second clamping plate 4.

[0067] It should be noted that when the material of circuit board 5 is relatively soft or the thickness of circuit board 5 is relatively thin, a reinforcing plate 6 can be provided to improve the thermal stability and mechanical strength of circuit board 5. For example, when circuit board 5 is a flexible circuit board (the material of flexible circuit boards is relatively soft) or a high-density printed circuit board (the thickness of high-density printed circuit boards is relatively thin), a reinforcing plate 6 can be provided on the side of circuit board 5 away from the connecting structure 1.

[0068] In some embodiments, such as Figure 10As shown, the circuit board 5 may include at least one first connection terminal 51, at least one second connection terminal 52, and at least one trace 53 correspondingly connected between the at least one first connection terminal 51 and the at least one second connection terminal 52. The at least one first connection terminal 1 is connected to at least one connection structure 1, and the at least one second connection terminal 52 is connected to at least one flip-chip film 2. That is, the number of first connection terminals 1 is the same as the number of connection structures 1, and each first connection terminal 51 is connected to one connection structure 1. The number of second connection terminals 52 is the same as the number of flip-chip films 2, and each second connection terminal 52 is connected to one flip-chip film 2. The number of first connection terminals 51, the number of second connection terminals 52, and the number of traces 53 are all the same, and each trace 53 is connected to one first connection terminal 51 and one second connection terminal 52 at each end.

[0069] like Figure 10 As shown, the first connection terminal 51 may include multiple first terminals 51a, which may be arranged in multiple columns, with any two adjacent columns of first terminals 51a staggered. The second connection terminal 52 may include multiple second terminals 52a, which may be arranged in a single column. The wiring 53 may include multiple sub-wires 53a, which are connected one-to-one between the multiple first terminals 51a and the multiple second terminals 52a. That is, the number of first terminals 51a, the number of second terminals 52a, and the number of sub-wires 53a are the same, and each sub-wire 53a is connected to one first terminal 51a and one second terminal 52a at its two ends. The multiple first terminals 51a in the first connection terminal 51 and the multiple second terminals 52a in the second connection terminal 42 may also be arranged in other ways, which are not specifically limited here.

[0070] It should be noted that when the structure under test 10 is a photodetector and has two signal terminals 12 (i.e., a scanning terminal and a data terminal), the two signal terminals 12 are respectively positioned close to adjacent sides of the structure under test 10. The test drive module includes two flip-chip films 2 and two connection structures 1 located on the circuit board 5. The positions of the two connection structures 1 correspond one-to-one with the positions of the two signal terminals 12 on the structure under test 10, that is, the two connection structures 1 are respectively positioned close to adjacent sides of the circuit board 5, so that when the structure under test 10 is fixed in the test drive module, the two signal terminals 12 of the structure under test 10 are detachably connected to the two connection structures 1. The circuit board 5 includes two first connection terminals 51 and two second connection terminals 52. The positions of the two first connection terminals 51 correspond one-to-one with the positions of the two connection structures 1, that is, the two first connection terminals 51 are respectively positioned close to adjacent sides of the circuit board 5, so that the two connection structures 1 are connected one-to-one with the two first connection terminals 51. The two second connection terminals 52 can be set close to the same side of the circuit board 5. The positions of the two flip-chip films 2 correspond one-to-one with the positions of the two second connection terminals 52, that is, the two flip-chip films 2 are set close to the same side of the circuit board 5, so as to facilitate the subsequent connection of the two flip-chip films 2 with the test device.

[0071] In some embodiments, such as Figure 11 As shown, the connection structure 1 is a spring pin assembly, which includes a precision structural component 18 and a plurality of spring pins 13 fixed in the precision structural component 18. Each spring pin 13 includes a pin body 14 and a first pin tip 15 and a second pin tip 16 located on opposite sides of the pin body 14. The second pin tip 16 is used for detachable connection to the corresponding signal terminal 12 in the structure under test 10. If the spring pin assembly is located on the corresponding flip-chip film 2, the first pin tip 15 is connected to the corresponding flip-chip film 2; if the spring pin assembly is located on the circuit board 5, the first pin tip 15 is connected to the corresponding first connection terminal 51 in the circuit board 5.

[0072] When the spring pin assembly is located on the circuit board 5, the number of spring pins 13 in the spring pin assembly is the same as the number of first terminals 51a in the first connection terminal 51, and the arrangement of the multiple spring pins 13 in the spring pin assembly is the same as the arrangement of the multiple first terminals 51a in the first connection terminal 51, so that the first pin tips 15 of the multiple spring pins 13 are connected one-to-one with the multiple first terminals 51a in the corresponding first connection terminal 51. When testing the photosensitive material of the structure under test 10, the second pin tips 16 of the multiple spring pins 13 are detachably connected to the corresponding signal terminals 12 in the structure under test 10, so that the structure under test 10 is electrically connected to the flip-chip film 2 through the spring pin assembly and the circuit board 5.

[0073] The spring pin assembly may further include a spring 17, and the lower end of the precision structural component 18 (i.e., the end of the precision structural component 18 closest to the circuit board 5) is fixed to the circuit board 5 by the spring 17. The distance between the surface of the upper end of the precision structural component 18 (i.e., the end of the precision structural component 18 facing away from the circuit board 5) and the circuit board 5 is greater than the distance between the surface of the upper end of the second pin 16 (i.e., the end of the second pin 16 facing away from the circuit board) and the circuit board 5, so as to hide the spring pin 13 in the precision structural component 18 and protect the spring pin 13 from damage by external forces. When the structure under test 10 is fixed in the test drive module, the structure under test 10 presses the precision structural component 18, the spring 17 is compressed, and the second pin 16 of the spring pin 13 is exposed, thereby realizing the detachable connection between the second pin 16 and the signal terminal of the structure under test 10.

[0074] like Figure 2 , Figure 4 , Figure 6 , Figure 8 and Figure 9 As shown, the structure under test 10 includes a photosensitive active region 11, and the signal terminal of the structure under test 10 is located in a non-photosensitive active region (i.e., the area other than the photosensitive active region 11). To prevent the photosensitive active region 11 of the structure under test 10 from being blocked after the first clamping plate 3 and the second clamping plate 4 clamp and fix the structure under test 10, at least one of the first clamping plate 3 and the second clamping plate 4 includes a hollow region 7, that is, the first clamping plate 3 includes a hollow region 7, or the second clamping plate 4 includes a hollow region 7, or the first clamping plate 3 and the second clamping plate 4 each include a hollow region 7. When the first clamping plate 3 and the second clamping plate 4 each include a hollow region 7, the size and shape of the hollow region 7 of the first clamping plate 3 and the hollow region 7 of the second clamping plate 4 can be the same or different.

[0075] The area of ​​the cutout area 7 is greater than or equal to the area of ​​the photosensitive effective area 11. When the structure under test 10 is clamped and fixed by the first clamping plate 3 and the second clamping plate 4, the orthographic projection of the photosensitive effective area 11 on the first clamping plate 3 or the second clamping plate 4 is located in the cutout area 7, so as to expose the photosensitive effective area 11 of the structure under test 10, which facilitates the subsequent testing of the photosensitive material of the structure under test 10.

[0076] In some embodiments, the photosensitive active area 11 is rectangular in shape, the hollow area 7 is rectangular in shape, and the shape of the clamp with the hollow area 7 includes any one of the following: a square, a U-shape, and an L-shape. If the first clamp 3 includes the hollow area 7, then the shape of the first clamp 3 includes any one of the following: a square, a U-shape, and an L-shape; if the second clamp 4 includes the hollow area 7, then the shape of the second clamp 4 includes any one of the following: a square, a U-shape, and an L-shape; if the first clamp 3 and the second clamp 4 each include the hollow area 7, then the shape of the first clamp 3 and the shape of the second clamp 4 each include any one of the following: a square, a U-shape, and an L-shape, and the shapes of the first clamp 3 and the second clamp 4 can be the same or different. It should be noted that the clamp with the hollow area 7 can also be other shapes, which are not specifically limited here. The shape of the clamp without the hollow area 7 can be rectangular or other shapes, which are not specifically limited here.

[0077] When a circuit board 5 is positioned between the first clamping plate 3 and the second clamping plate 4, the orthographic projection of the circuit board 5 onto the target clamping plate (first clamping plate 3 or second clamping plate 4) lies within the target clamping plate. In some embodiments, the orthographic projection of the circuit board 5 onto the target clamping plate coincides precisely with the target clamping plate, so as not to affect the clamping and fixing of the first clamping plate 3 and the second clamping plate 4 to the structure under test 10, and to avoid obstructing the photosensitive effective area 11 of the structure under test 10. For example, if the target clamping plate without a cutout area is rectangular, then the circuit board 5 can be rectangular. As another example, if the target clamping plate with a cutout area is U-shaped, then the circuit board 5 can be U-shaped.

[0078] According to the test driving component provided in the embodiments of this application, by setting at least one connection structure and at least one flip-chip film, wherein the at least one connection structure is used for detachable connection with at least one signal terminal of the structure under test, and the at least one flip-chip film is electrically connected to the at least one connection structure, the flip-chip film can be electrically connected to different structures under test to realize the testing of photosensitive materials of different structures under test, effectively reducing testing costs and improving testing versatility. Moreover, the structure under test does not need to be bound to the flip-chip film, reducing the risk of damage to the photosensitive material in the structure under test.

[0079] Accordingly, this application also provides a testing system.

[0080] like Figure 12 As shown, the testing system includes: a structure under test (SUT) 10, a test driver module 20, and a testing device 30. The test driver module 20 is the same as the test driver module described in the above embodiment, and will not be further elaborated here.

[0081] The structure under test (DUT) 10 includes at least one signal terminal 12. For example, the DUT can be a photodetector, and may include a readout circuit board, a photosensitive material coated on the readout circuit board, and a top electrode mounted on the readout circuit board. At least one signal terminal of the DUT may include a scan terminal and a data terminal of the readout circuit board. At least one connection structure 1 in the test drive module 20 is detachably connected to at least one signal terminal 12 of the DUT 10 in a one-to-one correspondence.

[0082] The testing device 30 is electrically connected to at least one flip-chip film 2 in the test driving module. The testing device may include a main circuit board 31 and a smart terminal 32 (such as a computer, laptop, etc.), with host computer software installed in the smart terminal 32. At least one flip-chip film 2 in the test driving module is electrically connected to the main circuit board 31 via an FPC connector, and the main circuit board 31 is electrically connected to the smart terminal 32.

[0083] When testing the photosensitive material in the structure under test 10, the optical path environment is configured, and the side of the test driving module 20 with the cutout area 7 is placed facing the light source (i.e., the clamping plate with the cutout area 7 in the test driving module 20 is placed facing the light source). If both clamping plates of the test driving module 20 have cutout areas 7, either side of the test driving module 20 can be placed facing the light source, thereby achieving the selectability of the light source direction. That is, either the film layer (photosensitive material) or the glass surface (substrate) of the structure under test 10 can face the light source. Then, the upper computer software in the intelligent terminal 32 is used to acquire images and analyze and characterize the photosensitive material, thus realizing the testing of the photosensitive material in the structure under test 10.

[0084] According to the testing system provided in this application, by setting at least one connection structure and at least one flip-chip film, wherein the at least one connection structure is used for detachable connection with at least one signal terminal of the structure under test, and the at least one flip-chip film is electrically connected to the at least one connection structure, the flip-chip film can be electrically connected to different structures under test, thereby realizing the testing of photosensitive materials of different structures under test, effectively reducing testing costs and improving testing versatility. Moreover, the structure under test does not need to be bound to the flip-chip film, reducing the risk of damage to the photosensitive material in the structure under test.

[0085] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more.

[0086] In the description of this application, "multiple" means two or more.

[0087] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0088] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A test driving module for driving a structure under test to test photosensitive materials, wherein the structure under test includes at least one signal terminal, characterized in that, The structure under test includes a photodetector, and the test driving module includes: At least one connection structure is provided for detachable connection to at least one signal terminal of the structure under test, corresponding one-to-one; At least one flip-chip thin film is electrically connected to at least one of the aforementioned connection structures in a one-to-one correspondence, for providing a drive signal to the corresponding signal terminal through the corresponding connection structure.

2. The test drive module according to claim 1, characterized in that, The connection structure is located on the corresponding flip-chip film.

3. The test drive module according to claim 2, characterized in that, The test driver module also includes: The first and second clamping plates, which are set opposite to each other, are used to clamp and fix the structure to be tested; At least a portion of the structure of the flip-chip film is located between the first clamping plate and the second clamping plate, and the connecting structure is located on the at least a portion of the structure of the corresponding flip-chip film.

4. The test drive module according to claim 3, characterized in that, The at least part of the structure of the flip-chip film is disposed close to the target clamp, the target clamp being either the first clamp or the second clamp, and the connecting structure is located on the side of the corresponding flip-chip film that is away from the target clamp.

5. The test drive module according to claim 1, characterized in that, The test drive module also includes a circuit board; The connection structure is electrically connected to the corresponding flip-chip film via the circuit board.

6. The test drive module according to claim 5, characterized in that, The circuit board includes at least one first connection terminal, at least one second connection terminal, and at least one trace connected one-to-one between at least one first connection terminal and at least one second connection terminal; At least one of the first connection ends is connected to at least one of the connection structures in a one-to-one correspondence, and at least one of the second connection ends is connected to at least one of the flip-chip films in a one-to-one correspondence.

7. The test drive module according to claim 5, characterized in that, The test driver module also includes: The first and second clamping plates, which are set opposite to each other, are used to clamp and fix the structure to be tested; The circuit board is located between the first clamping plate and the second clamping plate, and the connecting structure is located on the circuit board.

8. The test drive module according to claim 7, characterized in that, The circuit board is positioned close to the target clamp, which is either the first clamp or the second clamp, and the connection structure is located on the side of the circuit board away from the target clamp.

9. The test drive module according to claim 5, characterized in that, The test drive module also includes a reinforcement plate; The reinforcing plate is located on the side of the circuit board away from the connection structure.

10. The test drive module according to claim 5, characterized in that, The circuit board includes any one of printed circuit boards, flexible circuit boards, high-density printed circuit boards, and circuit glass circuit boards.

11. The test drive module according to claim 3 or 7, characterized in that, The structure under test includes a photosensitive active region; At least one of the first clamping plate and the second clamping plate includes a hollow area, and the area of ​​the hollow area is greater than or equal to the area of ​​the photosensitive effective area.

12. The test drive module according to claim 11, characterized in that, The shape of the clamp with the hollowed-out area includes any one of the following: square, U-shaped, and L-shaped.

13. The test drive module according to claim 1, characterized in that, The connection structure includes either a raised metal block or a spring pin assembly.

14. The test drive module according to claim 13, characterized in that, The connection structure is a spring pin assembly, which includes a precision structural component and a plurality of spring pins fixed in the precision structural component. The spring needle includes a needle body, and a first needle tip and a second needle tip located on opposite sides of the needle body; the first needle tip is electrically connected to the corresponding flip-chip film, and the second needle tip is used for detachable connection to the corresponding signal terminal.

15. A testing system, characterized in that, include: The structure under test includes at least one signal terminal; The test drive module as described in any one of claims 1 to 14, wherein at least one connection structure in the test drive module is detachably connected to at least one of the signal terminals in a one-to-one correspondence; The testing device is electrically connected to at least one flip-chip thin film in the test drive module.

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