Multifunctional semiconductor laser chip inspection and processing equipment

Abstract

This invention relates to the field of optical inspection technology, and particularly to a multifunctional semiconductor laser chip inspection and processing equipment. The equipment includes an excitation module, a light source switcher, a chopper, an acousto-optic modulator, a stepper motor, a two-dimensional electric displacement stage, an optical microscopy focusing module, an illumination source, a camera, a first microscopic optical path, an optical path switcher, a second microscopic optical path, a third reflecting mirror, a spectrometer, a CCD detector, an optical signal data acquisition module, and a computer. By changing the optical path, this equipment can perform whole-wafer surface defect and particle inspection, spatially resolved photoluminescence spectroscopy inspection, whole-wafer thin film thickness inspection, confocal microscopy Raman spectroscopy inspection, and laser direct writing involved in the photolithography process during semiconductor laser chip fabrication, all within a single device. This reduces equipment costs and space requirements, meeting the application needs of small startups, universities, and research institutes for process reliability testing and process control.

Description

Technical Field

[0001] This invention relates to the field of optical inspection technology, and in particular to a multifunctional semiconductor laser chip inspection and processing equipment. Background Technology

[0002] Semiconductor laser chips, as a new type of laser element, have advantages such as small size, low power consumption, long life, high reliability, and high integration. However, due to the many steps and long process involved in the manufacturing of semiconductor laser chips, the detection of each step requires a high degree of expertise and different equipment.

[0003] The manufacturing process of semiconductor laser chips is similar to that of semiconductor integrated circuits, both utilizing various semiconductor production equipment for wafer fabrication and a series of testing equipment for inspection. This requires significant capital investment, large-scale equipment, multiple processes, and long development cycles for research and production. Among these, five inspection steps—whole-wafer photoluminescence spectroscopy, whole-wafer particle inspection, whole-wafer defect inspection, confocal Raman microscopy, and thin film thickness measurement—cover more than 60% of the entire process flow.

[0004] However, current inspection equipment has relatively limited functionality, only capable of inspecting a single step in the process flow. Therefore, the overall manufacturing process of semiconductor laser chips requires multiple inspection devices, resulting in high costs. Internationally, the leading manufacturers of spatial resolution photoluminescence inspection equipment are primarily Nanometrics (USA); spatial scanning confocal microscopy Raman spectroscopy inspection equipment is mainly produced by Horiba (Japan); whole-wafer particle inspection equipment is primarily produced by KLA (USA); whole-wafer defect inspection equipment is mainly produced by Muetec (Germany); whole-wafer and patterned area thin film thickness inspection equipment is mainly produced by Filmetrics (USA); and laser direct writing equipment is mainly produced by LPKF (Germany).

[0005] In addition, setting up multiple testing devices requires a lot of space and environmental resources, which cannot meet the application needs of small startups, universities and research institutes for process reliability testing and process control. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of existing technologies and propose a multifunctional semiconductor laser chip inspection and processing equipment. By changing the optical path, a single set of equipment can achieve multiple inspection functions, thereby reducing costs while meeting the application requirements for process reliability inspection and process control.

[0007] To achieve the above objectives, the present invention adopts the following specific technical solution:

[0008] The multifunctional semiconductor laser chip inspection and processing equipment provided by this invention includes an excitation module, a light source switcher, a chopper, an acousto-optic modulator, a drive mechanism, a two-dimensional electric displacement stage, an optical microscopy focusing module, an illumination source, a camera, an optical path switcher, a first microscopic optical path, a second microscopic optical path, a third reflecting mirror, a spectrometer group, a CCD detector, an optical signal data acquisition module, and a computer. This multifunctional semiconductor laser chip inspection and processing equipment is used to achieve whole-wafer surface defect and particle detection, spatially resolved photoluminescence spectroscopy detection, whole-wafer thin film thickness detection, confocal microscopy Raman spectroscopy detection, and laser direct writing.

[0009] The excitation module includes a laser source and a halogen lamp; the optical microscopy focusing module includes an objective lens and an eyepiece; the first microscopy optical path includes a first filter, a first reflector, and a first lens; the second microscopy optical path includes a second reflector, a second lens, and a second filter; the optical signal data acquisition module includes a lock-in amplifier, an amplification circuit, and a data acquisition card; and the spectrometer group includes a visible spectrometer, a near-infrared spectrometer, and a confocal Raman spectrometer.

[0010] When the multifunctional semiconductor laser chip inspection and processing equipment is used to inspect the defects and particles on the entire surface, the illumination source is used to illuminate the semiconductor laser chip on the two-dimensional electric displacement stage, and the reflected light from the surface of the semiconductor laser chip passes through the objective lens and eyepiece and is incident on the camera; the optical path switcher is used to transmit the image information acquired by the camera to the computer through optical fiber; the computer is used to control the stepper motor and thus control the movement of the two-dimensional electric displacement stage to obtain images of different areas of the semiconductor laser chip, and synthesizes and identifies the images of different areas to obtain information on the defects and particles on the entire surface;

[0011] When a multifunctional semiconductor laser chip inspection and processing equipment is used to detect spatially resolved photoluminescence spectra, the illumination source is used to illuminate the semiconductor laser chip on the two-dimensional electric displacement stage, and the reflected light from the surface of the semiconductor laser chip is incident on the camera through a microscopic focusing module; the camera is used to transmit the real-time acquired images to the computer; the excitation module selects the laser source after adjustment by the light source switcher; the chopper is used to modulate the continuous light emitted by the laser source into light of its inherent frequency and output it; the first microscopic optical path is used to filter and focus the modulated laser and incident it on the surface of the semiconductor laser chip on the two-dimensional electric displacement stage; the computer is used to control the stepper motor and thus control the movement of the two-dimensional electric displacement stage to find the detection position. The system controls a stepper motor to move a two-dimensional electric displacement stage, performing two-dimensional planar scanning of the semiconductor laser chip to ensure the laser spot focal point aligns with the imaging focal plane and the camera focal point matches the position of the smallest laser spot. An optical path switcher directs reflected light from the semiconductor laser chip surface into a second microscopic optical path. This second path focuses the reflected light, filters out excitation and frequency-doubled light, and directs it to a visible or near-infrared spectrometer. The visible or near-infrared spectrometer collects the light signal and sends it to a CCD detector. An optical signal data acquisition module converts the received light signal from the CCD detector into a digital signal and inputs it to a computer for display.

[0012] When the multifunctional semiconductor laser chip inspection and processing equipment is used to inspect the thickness of a whole thin film, the illumination source is used to illuminate the semiconductor laser chip on the two-dimensional electric displacement stage, so that the reflected light from the surface of the semiconductor laser chip is incident on the camera through the microscopic focusing module; the camera is used to transmit the real-time acquired image to the computer; the computer is used to control the stepper motor and thus control the movement of the two-dimensional electric displacement stage to find the detection position; the excitation module selects a halogen lamp after adjustment by the light source switcher; the chopper is used to modulate the continuous light emitted by the halogen lamp into light of a natural frequency and output it; the first microscopic optical path is used to filter and focus the modulated beam and incident it on the surface of the semiconductor laser chip on the two-dimensional electric displacement stage; the optical path switcher is used to cause the reflected light reflected from the surface of the semiconductor laser chip to enter the second microscopic optical path; the second microscopic optical path is used to focus and filter the reflected light reflected from the surface of the semiconductor laser chip and then incident it on the visible spectrometer; the visible spectrometer is used to collect the light signal and send it to the CCD detector; the light signal data acquisition module is used to convert the light signal received by the CCD detector into a digital signal and input it into the computer for thickness value calculation.

[0013] When a multifunctional semiconductor laser chip inspection and processing equipment is used to detect confocal micro Raman spectroscopy, the illumination source is used to illuminate the semiconductor laser chip on the two-dimensional electric displacement stage, so that the reflected light from the surface of the semiconductor laser chip passes through the microscopic focusing module and is incident on the camera; the camera is used to transmit the real-time acquired image to the computer; the excitation module selects the laser source after adjustment by the light source switcher; the chopper is used to modulate the continuous light emitted by the laser source into light of its inherent frequency and output it; the first filter in the first microscopic optical path is a laser coupling filter, which is used to filter out other frequencies of light from the modulated laser and focus it, then incident it on the surface of the semiconductor laser chip on the two-dimensional electric displacement stage; the computer is used to control the stepper motor and thus control the movement of the two-dimensional electric displacement stage to find the target. The system measures the position and controls the movement of a two-dimensional electric displacement stage via a stepper motor to perform two-dimensional planar scanning of the semiconductor laser chip, ensuring that the laser spot focal point is aligned with the imaging focal plane and that the camera focus and the minimum laser spot size are matched. An optical path switcher directs the reflected light from the semiconductor laser chip surface into a second microscopic optical path. A Rayleigh scattering filter is used in the second microscopic optical path to focus the reflected light, filter out Rayleigh light and external radiation sources, and direct it to a confocal Raman spectrometer. The confocal Raman spectrometer collects the optical signal and sends it to a CCD detector. An optical signal data acquisition module converts the received optical signal from the CCD detector into a digital signal and inputs it to a computer for display.

[0014] When the multifunctional semiconductor laser chip inspection and processing equipment is used for laser direct writing, the excitation module selects a laser source after adjustment by the light source switcher; the acousto-optic modulator is used to control the intensity change of the laser; the first microscopic optical path is used to filter out stray light from the modulated laser and focus it, then incident it onto the surface of the semiconductor laser chip on the two-dimensional electric displacement stage; the optical path switcher is used to cause the reflected light from the surface of the semiconductor laser chip to be incident onto the third reflecting mirror; the third reflecting mirror is used to cause the reflected light from the surface of the semiconductor laser chip to be incident onto the CCD detector; the optical signal data acquisition module is used to convert the optical signal received by the CCD detector into a digital signal and input it into the computer; the computer is used to control the stepper motor and thus control the two-dimensional electric displacement stage, so that the laser beam scans and exposes the photoresist on the surface of the semiconductor laser chip.

[0015] Furthermore, when the multifunctional semiconductor laser chip inspection and processing equipment is used to detect spatially resolved photoluminescence spectra and confocal micro Raman spectra, a 532nm laser source is selected as the laser source; when the multifunctional semiconductor laser chip inspection and processing equipment is used for laser direct writing, a 375nm or 405nm laser source is selected as the laser source; when the multifunctional semiconductor laser chip inspection and processing equipment is used to detect the thickness of the entire thin film, a white light source is selected as the halogen lamp.

[0016] Furthermore, light-shielding plates are provided between the second reflector and the second lens, as well as between the third reflector and the CCD detector, to block the propagation of light.

[0017] The present invention can achieve the following technical effects:

[0018] The multifunctional semiconductor laser chip inspection and processing equipment provided by this invention can achieve automatic scanning of defects and particles on the entire wafer, confocal micro Raman measurement, whole-film thickness measurement, spatially resolved fluorescence spectroscopy measurement, and laser direct writing on a single device by changing the optical path. This achieves functional integration, reduces costs and the spatial requirements of the inspection equipment, and meets the application needs of small startups, universities, and research institutes for process reliability testing and process control. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a multifunctional semiconductor laser chip inspection and processing equipment provided according to an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of the structure of the multifunctional semiconductor laser chip inspection and processing equipment provided in the embodiment of the present invention when inspecting defects and particles on the entire surface.

[0021] Figure 3 This is a schematic diagram of the structure of the multifunctional semiconductor laser chip detection and processing equipment provided in the embodiment of the present invention when detecting spatially resolved photoluminescence spectra.

[0022] Figure 4 This is a schematic diagram of the structure of the multifunctional semiconductor laser chip inspection and processing equipment according to an embodiment of the present invention when inspecting the thickness of a whole thin film.

[0023] Figure 5 This is a schematic diagram of the structure of the multifunctional semiconductor laser chip detection and processing equipment provided in the embodiment of the present invention when detecting confocal micro Raman spectroscopy.

[0024] Figure 6 This is a schematic diagram of the structure of the multifunctional semiconductor laser chip inspection and processing equipment during laser direct writing according to an embodiment of the present invention.

[0025] The reference numerals in the figures include:

[0026] 1. Halogen lamp; 2. Laser light source; 3. Acousto-optic modulator; 4. Light source switcher; 5. Chopper; 6. First filter; 7. First reflector; 8. First lens; 9. Semiconductor laser chip; 10. Two-dimensional electric displacement stage; 11. Stepper motor; 12. Optical microscopy focusing module; 13. Camera; 14. Illumination light source; 15. Optical path switcher; 16. Second reflector; 17. Second lens; 18. Second filter; 19. Spectrometer; 20. CCD detector; 21. Third reflector; 22. Lock-in amplifier; 23. Amplifier circuit; 24. Data acquisition card; 25. Computer. Detailed Implementation

[0027] In the following description, embodiments of the invention will be described with reference to the accompanying drawings. In the description below, the same modules are denoted by the same reference numerals. Where the same reference numerals are used, their names and functions are also the same. Therefore, their detailed description will not be repeated.

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not constitute a limitation thereof.

[0029] Figure 1 The structure of the multifunctional semiconductor laser chip inspection and processing equipment provided in an embodiment of the present invention is shown.

[0030] like Figure 1 As shown, this embodiment of the invention provides a multifunctional semiconductor laser chip inspection and processing equipment, including an excitation module, an acousto-optic modulator 3, a light source switcher 4, a chopper 5, a two-dimensional electric displacement stage 10, a stepper motor 11, a microscopic focusing module 12, a camera 13, an illumination source 14, a first microscopic optical path, an optical path switcher 15, a second microscopic optical path, a spectrometer 19, a CCD detector 20, a third reflector 21, an optical signal data acquisition module, and a computer 25. This multifunctional semiconductor laser chip inspection and processing equipment can achieve whole-wafer surface defect and particle detection, spatially resolved photoluminescence spectroscopy detection, whole-wafer thin film thickness detection, confocal micro-Raman spectroscopy detection, and laser direct writing.

[0031] The excitation module includes a halogen lamp 1 and a laser source 2; the optical microscopy focusing module includes an objective lens and an eyepiece; the first microscopy optical path includes a first filter 6, a first reflector 7 and a first lens 8; the second microscopy optical path includes a second reflector 16, a second lens 17 and a second filter 18; the optical signal data acquisition module includes a lock-in amplifier 22, an amplification circuit 23 and a data acquisition card 24; and the spectrometer 19 includes a visible spectrometer, a near-infrared spectrometer and a confocal Raman spectrometer.

[0032] When a multifunctional semiconductor laser chip inspection and processing equipment is used to detect defects and particles on the entire surface, the entire chip needs to be divided into multiple small areas, each optically imaged, and the camera 13 is controlled to capture images. The computer 25 then synthesizes the captured regional images to obtain the overall image information, which is used to detect defects and particles on the entire surface. The illumination source 14 illuminates the semiconductor laser chip 9 on the two-dimensional electric displacement stage 10. The reflected light is focused by the microscopic focusing module 12, passes through the objective lens and eyepiece, and is incident on the camera 13. The optical path switcher 15 transmits the image information acquired by the camera to the computer 25. The computer 25 controls the movement of the two-dimensional electric displacement stage 10 by controlling the stepper motor 11 to adjust the camera 13 to capture different areas. The computer 25 synthesizes the images from different areas and performs a full-scale scanning and detection of particles and defects, monitoring their distribution.

[0033] When the multifunctional semiconductor laser chip inspection and processing equipment is used to detect spatially resolved photoluminescence spectra, the illumination source 14 is first turned on to illuminate the semiconductor laser chip 9 on the two-dimensional electric displacement stage 10. The reflected light is focused by the microscopic focusing module 12, passes through the objective lens and eyepiece, and is incident on the camera 13. The camera 13 transmits the real-time acquired image to the computer 25. The computer 25 controls the stepper motor 11 to control the movement of the two-dimensional electric displacement stage 10 to perform two-dimensional planar scanning on the semiconductor laser chip 9, find the position of the semiconductor laser chip 9 to be detected, and after adjustment, the laser spot focal point and the imaging focal plane are kept highly consistent, and the position of the camera focus and the minimum laser spot is perfectly matched. Then the illumination source 14 is turned off. When detecting the photoluminescence spectrum, the excitation module selects a 532nm laser source 2. The light source switcher 4 causes the laser emitted by the laser source 2 to be modulated by the chopper 5 and then pass through the first filter 6, the first reflector 7, and the first lens 8 in sequence. After being filtered by the first filter 6 and focused by the first lens 8, it is incident on the surface of the semiconductor laser chip 9. The optical path switcher 15 directs the reflected light from the semiconductor laser chip 9 into the second microscopic optical path. The reflected light passes sequentially through the second reflecting mirror 16, the second lens 17, and the second filter 18. After being focused by the second lens 17 and filtered out by the second filter 18 to remove the excitation and frequency-doubled light, the light is then incident on the spectrometer 19, which may be a visible or near-infrared spectrometer. The spectrometer 19 collects the optical signal and sends it to the CCD detector 20. The optical signal data acquisition module then converts the received optical signal from the CCD detector 20 into a digital signal by passing sequentially through the lock-in amplifier 22, the amplification circuit 23, and the data acquisition card 24. This digital signal is then input to the computer 25, which displays the CCD image, single-point spectrum, real-time acquired spectrum, and spatially resolved spectral image.

[0034] When the multifunctional semiconductor laser chip inspection and processing equipment is used to inspect the thickness of a whole film, the illumination source 14 is first turned on to illuminate the semiconductor laser chip 9 on the two-dimensional electric displacement stage 10. The reflected light is focused by the microscopic focusing module 12 and then passes through the objective lens and eyepiece before being incident on the camera 13. The camera 13 transmits the real-time acquired image to the computer 25. The computer 25 controls the stepper motor 11 to move the two-dimensional electric displacement stage 10 to perform a two-dimensional planar scan on the semiconductor laser chip 9, dividing the entire chip into multiple areas for film thickness measurement. Then, the illumination source 14 is turned off. When measuring the film thickness, the excitation module uses a halogen lamp 1 with white light source. The light source switcher 4 causes the beam emitted by the halogen lamp 1 to be modulated by the chopper 5 and then passed sequentially through the first filter 6, the first reflector 7, and the first lens 8. After being filtered by the first filter 6 and focused by the first lens 8, the light is incident on the surface of the semiconductor laser chip 9. The optical path switcher 15 directs the reflected light from the semiconductor laser chip 9 into the second microscopic optical path. The reflected light passes sequentially through the second reflecting mirror 16, the second lens 17, and the second filter 18. After being focused by the second lens 17 and filtered out by the second filter to remove the excitation and frequency-doubled light, the light is incident on the spectrometer 19, which is a visible spectrometer. The spectrometer 19 collects the light signal and sends it to the CCD detector 20. The light signal received by the CCD detector 20 is then processed by the optical signal data acquisition module, passing sequentially through the lock-in amplifier 22, the amplification circuit 23, and the data acquisition card 24. The light signal is converted into a digital signal and input to the computer 25, which calculates and outputs the thickness value.

[0035] When the multifunctional semiconductor laser chip inspection and processing equipment is used to detect confocal micro Raman spectroscopy, the illumination source 14 illuminates the semiconductor laser chip 9 on the two-dimensional electric displacement stage 10. The reflected light is focused by the micro-focusing module 12, passes through the objective lens and eyepiece, and is incident on the camera 13. The camera 13 transmits the real-time acquired image to the computer 25. The computer 25 controls the stepper motor 11 to move the two-dimensional electric displacement stage 10, performs two-dimensional planar scanning on the semiconductor laser chip 9, finds the position to be detected on the semiconductor laser chip 9, makes the laser spot focus point consistent with the imaging focal plane, matches the position of the camera focus and the minimum laser spot, and then turns off the illumination source 14. When detecting confocal micro Raman spectroscopy, the excitation module selects a 532nm laser source 2. The source switcher 4 causes the laser emitted by the laser source 2 to be modulated by the chopper 5 and then pass through the first filter 6, the first reflector 7, and the first lens 8 in sequence. The first filter is a laser coupling filter. After being filtered by the first filter 6 and focused by the first lens 8, the light is incident on the surface of the semiconductor laser chip 9. The optical path switcher 15 directs the reflected light from the semiconductor laser chip 9 into the second microscopic optical path. The reflected light passes sequentially through the second reflecting mirror 16, the second lens 17, and the second filter 18, where the second filter is a Rayleigh scattering filter. After being focused by the second lens 17 and filtered out by the second filter 18 to remove Rayleigh light and external radiation sources, the light is then incident on the spectrometer 19, which is a confocal Raman spectrometer. The spectrometer 19 collects the optical signal and sends it to the CCD detector 20. The optical signal data acquisition module then converts the optical signal received by the CCD detector 20 into a digital signal by passing sequentially through the lock-in amplifier 22, the amplification circuit 23, and the data acquisition card 24. The signal is then input to the computer 25, which displays the CCD image, single-point spectrum, real-time acquired spectrum, and spatially resolved spectral image.

[0036] When the multifunctional semiconductor laser chip inspection and processing equipment is used for laser direct writing, the excitation module selects a 375nm or 405nm laser source. The source switcher 4 causes the laser emitted by the laser source 2 to be modulated by the acousto-optic modulator 3 and then pass through the first filter 6, the first reflector 7, and the first lens 8 in sequence. After the first filter 6 filters out stray light and the first lens 8 focuses the light, it is incident on the surface of the semiconductor laser chip 9. The optical path switcher 15 directs the reflected light from the semiconductor laser chip 9 to the third reflector 21, changes the optical path, and then directs it to the CCD detector 20. The optical signal data acquisition module causes the optical signal received by the CCD detector 20 to pass through the lock-in amplifier 22, the amplification circuit 23, and the data acquisition card 24 in sequence, converting the optical signal into an electrical signal and inputting it to the computer 25. The computer 25 outputs a control signal based on the received electrical signal, which controls the stepper motor 11 to control the movement of the two-dimensional electric displacement stage 10, so that the laser beam scans and exposes the photoresist on the surface of the semiconductor laser chip 9 to achieve writing.

[0037] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0038] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

[0039] The specific embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made in accordance with the technical concept of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A multifunctional semiconductor laser chip inspection and processing equipment, characterized in that, The system includes an excitation module, a light source switcher, a chopper, an acousto-optic modulator, a stepper motor, a two-dimensional electric displacement stage, a microscopic focusing module, an illumination source, a camera, an optical path switcher, a first microscopic optical path, a second microscopic optical path, a third reflecting mirror, a spectrometer group, a CCD detector, an optical signal data acquisition module, and a computer. This multifunctional semiconductor laser chip inspection and processing equipment is used to achieve whole-wafer surface defect and particle detection, spatially resolved photoluminescence spectroscopy detection, whole-wafer thin film thickness detection, confocal micro-Raman spectroscopy detection, and laser direct writing involved in the photolithography process during semiconductor laser chip fabrication. The excitation module includes a laser source and a halogen lamp; the microscopic focusing module includes an objective lens and an eyepiece; the first microscopic optical path includes a first filter, a first reflector, and a first lens; the second microscopic optical path includes a second reflector, a second lens, and a second filter; the optical signal data acquisition module includes a lock-in amplifier, an amplification circuit, and a data acquisition card; and the spectrometer group includes a visible spectrometer, a near-infrared spectrometer, and a confocal Raman spectrometer. When the multifunctional semiconductor laser chip inspection and processing equipment is used to inspect surface defects and particles, the illumination source is used to illuminate the semiconductor laser chip on the two-dimensional electric displacement stage, and the reflected light from the surface of the semiconductor laser chip passes through the objective lens and eyepiece and is incident on the camera; the optical path switcher is used to transmit the image information acquired by the camera to the computer; the computer is used to control the stepper motor and thus control the movement of the two-dimensional electric displacement stage to obtain images of different areas of the semiconductor laser chip, and to synthesize and analyze the images of different areas to obtain information on surface defects and particles. When the multifunctional semiconductor laser chip inspection and processing equipment is used to detect spatially resolved photoluminescence spectra, the illumination source is used to illuminate the semiconductor laser chip on the two-dimensional electric displacement stage, and the reflected light from the surface of the semiconductor laser chip is incident on the camera through the microscopic focusing module; the camera is used to transmit the real-time acquired image to the computer; the excitation module selects a laser source after adjustment by the light source switcher; the chopper is used to modulate the continuous light emitted by the laser source into light of a natural frequency and output it; the first microscopic optical path is used to filter and focus the modulated laser and incident it on the surface of the semiconductor laser chip on the two-dimensional electric displacement stage; the computer is used to control the stepper motor and thus control the movement of the two-dimensional electric displacement stage to find... The system locates the detection position and controls the movement of the two-dimensional electric displacement stage via the stepper motor to perform two-dimensional planar scanning of the semiconductor laser chip, ensuring that the laser spot focal point is aligned with the imaging focal plane and that the positions of the camera focal point and the minimum laser spot are matched. The optical path switcher directs the reflected light from the semiconductor laser chip surface into a second microscopic optical path. This second microscopic optical path focuses the reflected light, filters out excitation and frequency-doubled light, and directs it to a visible or near-infrared spectrometer. The visible or near-infrared spectrometer collects the light signal and sends it to a CCD detector. The light signal data acquisition module converts the light signal received by the CCD detector into a digital signal and inputs it to a computer for display. When the multifunctional semiconductor laser chip inspection and processing equipment is used to inspect the thickness of a whole thin film, the illumination source is used to illuminate the semiconductor laser chip on the two-dimensional electric displacement stage, so that the reflected light from the surface of the semiconductor laser chip passes through the microscopic focusing module and is incident on the camera; the camera is used to transmit the real-time acquired image to the computer; the computer is used to control the stepper motor and thus control the two-dimensional electric displacement stage to move to find the detection position; the excitation module selects a halogen lamp after adjustment by the light source switch; the chopper is used to modulate the continuous light emitted by the halogen lamp into light of a natural frequency and output it; the first microscopic optical path is used to filter and focus the modulated beam and incident it on the surface of the semiconductor laser chip on the two-dimensional electric displacement stage; the optical path switch is used to cause the reflected light reflected from the surface of the semiconductor laser chip to enter the second microscopic optical path; the second microscopic optical path is used to focus and filter the reflected light reflected from the surface of the semiconductor laser chip and then incident it on the visible spectrometer; the visible spectrometer is used to collect the light signal and send it to the CCD detector; the light signal data acquisition module is used to convert the light signal received by the CCD detector into a digital signal and input it to the computer for thickness value calculation. When the multifunctional semiconductor laser chip detection and processing equipment is used to detect confocal micro Raman spectroscopy, the illumination source is used to illuminate the semiconductor laser chip on the two-dimensional electric displacement stage, so that the reflected light from the surface of the semiconductor laser chip passes through the microscopic focusing module and is incident on the camera; the camera is used to transmit the real-time acquired image to the computer; the excitation module selects a laser source after adjustment by the light source switcher; the chopper is used to modulate the continuous light emitted by the laser source into light of a natural frequency and output it; the first filter in the first microscopic optical path is a laser coupling filter, and the first microscopic optical path is used to filter out other frequencies of light from the modulated laser and focus it, and then incident it on the surface of the semiconductor laser chip on the two-dimensional electric displacement stage; the computer is used to control the stepper motor and thus control the two-dimensional electric displacement stage. The stage moves to find the detection position, and the stepper motor is controlled to move the two-dimensional electric displacement stage to perform two-dimensional planar scanning of the semiconductor laser chip, so that the laser spot focal point is consistent with the imaging focal plane, and the positions of the camera focal point and the minimum laser spot are matched; the optical path switcher is used to allow the reflected light reflected from the surface of the semiconductor laser chip to enter the second microscopic optical path; the second filter in the second microscopic optical path is a Rayleigh scattering filter, which is used to focus the reflected light reflected from the surface of the semiconductor laser chip, filter out Rayleigh light and external radiation sources, and incident it on the confocal Raman spectrometer; the confocal Raman spectrometer is used to collect optical signals and send them to the CCD detector, and the optical signal data acquisition module is used to convert the optical signals received by the CCD detector into digital signals and input them to the computer for display; When the multifunctional semiconductor laser chip inspection and processing equipment is used for laser direct writing, the excitation module selects a laser light source after adjustment by the light source switcher; The acousto-optic modulator is used to control the intensity change of the laser beam; the first microscopic optical path is used to filter out stray light from the modulated laser and focus it, and then incident it onto the surface of the semiconductor laser chip on the two-dimensional electric displacement stage; the optical path switch is used to cause the reflected light reflected from the surface of the semiconductor laser chip to be incident onto the third reflecting mirror; the third reflecting mirror is used to cause the reflected light reflected from the surface of the semiconductor laser chip to be incident onto the CCD detector. The optical signal data acquisition module is used to convert the optical signal received by the CCD detector into a digital signal and input it into the computer; the computer is used to control the stepper motor and then control the two-dimensional electric displacement stage so that the laser beam scans and exposes the photoresist on the surface of the semiconductor laser chip.

2. The multifunctional semiconductor laser chip inspection and processing equipment according to claim 1, characterized in that, When the multifunctional semiconductor laser chip inspection and processing equipment is used to detect spatially resolved photoluminescence spectrum and confocal micro Raman spectrum, a 532nm laser light source is selected; when the multifunctional semiconductor laser chip inspection and processing equipment is used for laser direct writing, a 375nm or 405nm laser light source is selected; when the multifunctional semiconductor laser chip inspection and processing equipment is used to detect the thickness of the entire thin film, a white light source is selected for the halogen lamp.

3. The multifunctional semiconductor laser chip inspection and processing equipment according to claim 1, characterized in that, A light-shielding plate is provided between the second reflector and the second lens, and between the third reflector and the CCD detector, to block the propagation of light.

Images