Insulating resin composition, cured product, coil for rotary machine, and rotary machine

Abstract

Provided are an insulating resin composition for further improving the surface tackiness of a cured product, a cured product thereof, a coil for a rotary machine having good surface tackiness, and a rotary machine using the same. The insulating resin composition is an insulating resin composition that is cured at a curing heating temperature. The insulating resin composition includes: a varnish component including a thermosetting resin having both an epoxy group and a methyl (acryl) group in one molecule, and a monofunctional vinyl-based monomer that volatilizes at or above the curing heating temperature; a curing agent and a reaction initiator; and a liquid paraffin.

Description

Technical Field

[0001] This disclosure relates to insulating resin compositions, cured products, coils for rotary machines, and rotary machines. Background Technology

[0002] Patent Document 1 discloses an example of a solvent-free varnish composition. The solvent-free varnish composition comprises: a thermosetting resin having two or more methacryloyl groups in one molecule, a thermosetting resin having both an epoxy group and a methacryloyl group in one molecule, and a monofunctional vinyl monomer. The solvent-free varnish composition is used in the coils of rotating machines to maintain insulation and mechanical strength. The solvent-free varnish composition is impregnated into the coil by an impregnation method such as immersing the coil in an impregnation tank containing the solvent-free varnish composition. The monofunctional vinyl monomer is used as a reactive diluent to reduce the viscosity of the insulating resin composition in order to improve the impregnation properties of the coil. The insulating resin composition impregnated into the coil is cured by heating in a curing oven to become a cured product.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 6532537 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, in the solvent-free varnish composition and other insulating resin compositions of Patent Document 1, sometimes a portion of the monofunctional vinyl monomers evaporates during heating in the curing oven. In such cases, the monofunctional vinyl monomers that have evaporated and filled the curing oven sometimes re-adhere to the surface of the cured product. As a result, a sticky residue sometimes remains on the surface of the cured product.

[0008] This disclosure relates to solving such problems. This disclosure provides an insulating resin composition that further improves the surface fingertip properties of the cured product, a cured product thereof, a coil for a rotary machine with good surface fingertip properties, and a rotary machine using the same.

[0009] Methods for solving problems

[0010] The insulating resin composition disclosed herein is an insulating resin composition that is cured at a curing heating temperature, comprising: a thermosetting resin having both an epoxy group and a methacryloyl group in one molecule, and a varnish component of a monofunctional vinyl monomer that volatilizes above the curing heating temperature; a curing agent and a reaction initiator; and liquid paraffin.

[0011] The cured product disclosed herein is formed by curing the above-mentioned insulating resin composition.

[0012] The coils for rotating machines disclosed herein are impregnated with the aforementioned insulating resin composition.

[0013] The rotating machine disclosed herein is a rotating machine used in a winch that drives the car of a rope elevator, including a stator using the aforementioned rotating machine coils.

[0014] The effects of the invention

[0015] If the insulating resin composition involved in this disclosure is used, the surface fingertip properties of the cured product are further improved. Additionally, the surface fingertip properties of coils for rotating machines are further improved. Attached Figure Description

[0016] Figure 1 This is a conceptual diagram illustrating an example of the cured state of the insulating resin composition according to Embodiment 1.

[0017] Figure 2 This is a cross-sectional view of the winch according to Embodiment 1. Detailed Implementation

[0018] Implementation method 1.

[0019] The following describes the methods by which this disclosure is implemented. It should be noted that the object of this disclosure is not limited to the following embodiments; any modifications or omissions of any constituent elements of the embodiments are possible without departing from the spirit of this disclosure. Furthermore, the embodiments and examples in this disclosure are illustrative in all respects and should not be interpreted restrictively.

[0020] In Embodiment 1, a curable insulating resin composition (X) and its cured product (Y) will be described. Furthermore, a rotating machine coil using the insulating resin composition (X) and a rotating machine using it in a stator will also be described.

[0021] 1. Insulating resin composition (X)

[0022] The insulating resin composition (X) of Embodiment 1 comprises a varnish component (Z), a curing agent and a reaction initiator (C), and liquid paraffin (D). The varnish component (Z) comprises: a thermosetting resin (A) having both epoxy and methacryloyl groups, and a monofunctional vinyl monomer (B) that volatilizes above the curing heating temperature. Herein, methacryloyl group represents acryloyl group or methacryloyl group. Furthermore, the numerical range expressed as "x~y" in this disclosure refers to a numerical range including the lower limit value x and the upper limit value y.

[0023] The insulating resin composition (X) is used, for example, in a coil to maintain insulation and mechanical strength. The equipment using this coil is not limited to any specific device. The coil is used in, for example, electric motors such as motors, or rotating machines such as generators. The coil is used in, for example, elevator winches, or electric compressors. The insulating resin composition (X) is impregnated into the coil, for example, by an impregnation method in which the coil is impregnated in an impregnation bath containing the insulating resin composition (X). The insulating resin composition (X) impregnated in the coil is heated and cured in a curing oven, thereby becoming a cured product (Y).

[0024] Figure 1 This is a conceptual diagram illustrating an example of the cured state of the insulating resin composition (X) according to Embodiment 1. Figure 1 The image shows an example of an insulating resin composition 2 being cured on the surface of a coil 1. In a curing oven, liquid paraffin forms a thin film 3 on the surface of the cured insulating resin composition 2. This suppresses the re-adhesion of the monofunctional vinyl monomers 4, which evaporate and fill the curing oven, to the cured product.

[0025] Generally, when an insulating resin composition is impregnated with a coil in an impregnation tank, excess insulating resin composition adheres to the coil, its core, and other components as it is lifted from the impregnation tank. During the curing process, this excess insulating resin composition sometimes cures as is, forming lumpy cured material on the lower part of the coil and other components. Furthermore, the viscosity of the excess insulating resin composition decreases during the heating process of the curing process, sometimes causing it to sag within the curing oven. This sagning insulating resin composition forms lumpy cured material within the curing oven. This lumpy cured material formed on components such as the coil can, due to thermal stress from curing shrinkage, become a major cause of damage to the coil's enameled wire and other components, leading to a decrease in insulation performance. Additionally, the lumpy cured material formed on components hinders the assembly of the coil to a housing or fixing components, thus requiring removal. Regular cleaning operations are also necessary to periodically remove the lumpy cured material formed within the curing oven. These problems are particularly pronounced in large rotating machines, such as elevator winches, and it is preferable to suppress the formation of excess lumpy solidified material. From the viewpoint of addressing these problems, the insulating resin composition (X) according to Embodiment 1 is preferably formulated to allow for good liquid drainage from the coil without excess adhesion to the coil lifted from the impregnation tank. Regarding the overall viscosity of the insulating resin composition (X), from the viewpoint of improving the liquid drainage of the insulating resin composition (X) from the coil, etc., and suppressing the formation of excess lumpy solidified material, a viscosity of 10 mPa·s to 200 mPa·s is preferred, more preferably 10 mPa·s to 100 mPa·s, and even more preferably 15 mPa·s to 50 mPa·s is preferred.

[0026] 1.1. Thermosetting Resin (A)

[0027] Regarding the thermosetting resin (A), any component containing one or more epoxy groups and one or more meth(acryloyl) groups as reactive groups in one molecule is acceptable, and it is not limited to a specific resin. The thermosetting resin (A), using meth(acryloyl) groups as reactive groups, promotes a three-dimensional crosslinking reaction caused by both addition reactions of free radicals generated from organic peroxides and ring-opening polymerization using epoxy groups as reactive groups. This facilitates the curing reaction and improves the heat resistance and mechanical strength of the cured product (Y).

[0028] Thermosetting resin (A) can be used alone as a resin containing both epoxy and methacryloyl groups as reactive groups. Thermosetting resin (A) can also be used in combination with other resins having one or both epoxy and methacryloyl groups. Other resins used in combination may contain both epoxy and methacryloyl groups in one molecule. Other resins used in combination may also contain only either an epoxy group or a methacryloyl group in one molecule.

[0029] Regarding the thermosetting resin (A), considering the ease of viscosity adjustment, it is desirable to have a number average molecular weight (Mn) of 15,000 or less, preferably 1,000 to 10,000, and a viscosity of 10,000 mPa·s or less at 60°C.

[0030] The epoxy equivalent of the thermosetting resin (A) incorporated in the insulating resin composition (X) is preferably 500 to 5000, more preferably 1000 to 4000. By controlling the epoxy equivalent within the above range, the curing speed can be increased without compromising the pot life of the insulating resin composition (X), thereby increasing the crosslinking density of the cured product (Y).

[0031] 1.2. Monofunctional vinyl monomers (B)

[0032] In addition to adjusting the crosslinking structure, the monofunctional vinyl monomer (B) is mainly used for viscosity adjustment (X) of insulating resin compositions. In order to maintain the pot life of the insulating resin composition (X), the monofunctional vinyl monomer (B) is preferably a monofunctional monomer with one functional group per molecule.

[0033] As the monofunctional vinyl monomer (B), a low-viscosity monomer having an ether bond or an ester bond is used. Preferably, the monofunctional vinyl monomer (B) used in the insulating resin composition (X) is a monomer having a vinyl, allyl, methacryloyl, or acryloyl group, a hydroxyalkyl group, an alkyl group, an alicyclic group, an aromatic group, or an ether group. In particular, in the insulating resin composition (X), to adjust the viscosity, a low-viscosity methacrylic or acrylic monomer with a viscosity of 20 mPa·s or less at room temperature (25°C) is preferred. Specifically, from the viewpoint of balancing high reactivity during curing and pot life, a monofunctional vinyl monomer having one methacryloyl or acryloyl group is more preferred. Examples of such monofunctional vinyl monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, lauryl (meth)acrylate, ethoxydiethylene (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and n-octyl acrylate. However, these are merely illustrative examples. The use of vinyl monomers other than these will not depart from the spirit of this disclosure. These monofunctional vinyl monomers may be used singly or in combination.

[0034] Regarding the amount of monofunctional vinyl monomer (B), from the viewpoint of improving the liquid drainage of the insulating resin composition (X) from coils, etc., and suppressing the formation of excess lumpy cured material, it is preferable to use as much as possible. On the other hand, although monofunctional vinyl monomer (B) contributes to the increase of crosslinking points, it is a low molecular weight monomer, and a portion of it volatilizes due to curing heating, so its entire amount does not contribute to the curing reaction. Therefore, if the amount of monofunctional vinyl monomer (B) is too large, the mechanical strength of the cured product (Y) may decrease. That is, it is necessary to adjust the amount of monofunctional vinyl monomer (B) to a range that can achieve both the required functions of suppressing excess lumpy cured material and mechanical strength. From the viewpoint of suppressing the formation of excess lumpy cured material, the amount of monofunctional vinyl monomer (B) is preferably 45 wt% or more of the total amount of varnish component (Z), preferably 50 wt% or more, and more preferably 55 wt% or more. On the other hand, from the viewpoint of mechanical strength, the amount of the monofunctional vinyl monomer (B) is preferably 85 wt% or less of the total amount of the varnish component (Z), more preferably 75 wt% or less, and even more preferably 70 wt% or less. Therefore, in order to achieve both of the required functions, the amount of the monofunctional vinyl monomer (B) is preferably 45 wt% to 85 wt% of the total amount of the varnish component (Z), more preferably 50 wt% to 75 wt%, and even more preferably 55 wt% to 70 wt%.

[0035] In the varnish component (Z) of the insulating resin composition (X), a multifunctional vinyl monomer having two or more methyl (acryloyl) or allyl groups in one molecule can be incorporated together with a monofunctional vinyl monomer (B). This multifunctional vinyl monomer acts as a reactive diluent, resulting in a lower viscosity of the insulating resin composition (X). Furthermore, since the multifunctional vinyl monomer contains multiple methyl (acryloyl) or allyl groups, which are different from those in the monofunctional vinyl monomer (B), as reactive groups in one molecule, it facilitates polymerization during the curing reaction of the insulating resin composition (X), leading to a largely complete reaction. Therefore, the multifunctional vinyl monomer exhibits less volatility during curing. Consequently, re-adhesion caused by volatile components is suppressed. Moreover, the incorporation of the multifunctional vinyl monomer promotes three-dimensional cross-linking of the cured product (Y), and also improves the heat resistance and mechanical strength of the cured product (Y). Regarding the amount of multifunctional vinyl monomers, it is acceptable as long as it is within the range that ensures the amount of monofunctional vinyl monomers (B). From the viewpoint of mechanical strength and heat resistance, it is preferably within the range of 2 wt% to 20 wt% of the total amount of varnish component (Z).

[0036] 1.3. Curing agent and reaction initiator (C)

[0037] To cure the thermosetting resin (A) and the monofunctional vinyl monomer (B), a curing agent and a reaction initiator (C) are used. In Embodiment 1, as the curing agent and reaction initiator (C), an organic peroxide that mainly acts on the methacryloyl group and a curing agent for epoxy groups are used together.

[0038] 1.3.1. Organic peroxides

[0039] Organic peroxides are primarily used as reaction initiators for methyl (acryloyl) groups, and substances known in this technical field are employed. There are no particular limitations on the organic peroxide as long as its 10-hour half-life temperature is 40°C or higher; however, considering the reduction of curing heating time and the adjustment of curing heating temperature, a 10-hour half-life temperature of 100°C to 170°C is preferred. Examples of such organic peroxides include peroxide-ketone, peroxide-ketal, hydroperoxide, peroxide-dialkyl, peroxide-diacyl, peroxide-ester, and peroxide-dicarbonate peroxides. These organic peroxides can be used alone or in combination of two or more. Specific examples of such organic peroxides with a 10-hour half-life temperature include 1,1-di(tert-butylperoxide)cyclohexane, 1,1-di(tert-hexylperoxide)cyclohexane, 1,1-di(tert-hexylperoxide)-3,3,5-trimethylcyclohexane, 1,1-di(tert-butylperoxide)-2-methylcyclohexane, 2,2-di(4,4-di-(butylperoxide)cyclohexyl)propane, 4,4-di-(tert-butylperoxide)valerate n-butyl ester, 2,2-di-(tert-butylperoxide)butane, tert-hexylperoxide isopropyl monocarbonate, tert-butylperoxide maleic acid, tert-butylperoxide-3,5,5-trimethylhexanoic acid, tert-butylperoxide lauric acid, tert-butylperoxide isopropyl monocarbonate, tert-butylperoxide... Benzoic acid esters, tert-butyl peroxyacetic acid esters, tert-hexyl peroxybenzoic acid esters, 2,5-dimethyl-2,5-di(benzoyl peroxide)hexane, tert-butyl peroxide 2-ethylhexyl monocarbonate, di(2-tert-butyl peroxide isopropyl)benzene, dicumyl peroxide, di-tert-hexyl peroxide, 2,5-dimethyl-2,5-di(tert-butyl peroxide)hexane, di-tert-hexyl peroxide, tert-butyl cumyl peroxide, di-tert-butyl peroxide, 2,5-dimethyl-2,5-di(tert-butyl peroxide)hexyn-3, hydroperoxide p-menthane, tert-butyl peroxide allyl monocarbonate, methyl ethyl ketone peroxide, hydroperoxide 1,1,3,3-tetramethylbutyl, hydroperoxide tert-butyl, hydroperoxide cumene, hydroperoxide diisopropylbenzene, etc. However, these are merely examples. The use of other organic peroxides will not depart from the spirit of this disclosure. They can be used individually or in combination of two or more.

[0040] There is no particular limitation on the amount of organic peroxide in the insulating resin composition (X), but it is preferably 0.1 to 10 parts by mass relative to 100 parts by mass of the varnish component (Z), more preferably 0.5 to 5 parts by mass. If the amount of organic peroxide is less than 0.1 parts by mass, the crosslinking density becomes low, and the mechanical strength required for the cured product is not obtained. On the other hand, if the amount of organic peroxide is more than 10 parts by mass, the pot life of the insulating resin composition (X) tends to be significantly shorter.

[0041] 1.3.2. Curing agents for epoxy groups

[0042] Regarding curing agents for epoxy groups, substances known in the art are used, such as amine compounds, borate ester compounds, organometallic compounds, organophosphorus compounds, quaternary ammonium salts, quaternary phosphonium salts, amine complexes, imidazole compounds, compounds containing transition metals such as titanium and cobalt, acid anhydrides, imidazole compounds, polythiol compounds, phenols, Lewis acid compounds, and isocyanate compounds. These can be used individually or in combination of two or more.

[0043] Specific examples of amine-based curing agents include tertiary amines and tertiary amine salts. Examples include dodecyl dimethylamine, N,N-dimethylcyclohexylamine, N,N-dimethylbenzylamine, N,N-dimethylaniline, (N,N-dimethylaminomethyl)phenol, 2,4,6-tris(N,N-dimethylaminomethyl)phenol, 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 1,5-diazabicyclo[4.3.0]nonene-5 (DBN), ethylenediamine, 1,3-diaminopropane, 1,4-diaminobutane, hexamethylenediamine, dipropylenediamine, polyether diamine, 2,5-dimethylhexamethylenediamine, trimethylhexamethylenediamine, diethylenetriamine, iminodipropylamine, bis(hexamethylenediamine) Triamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, aminoethylethanolamine, tri(methylamino)hexane, dimethylaminopropylamine, diethylaminopropylamine, methyliminodipropylamine, menthene diamine, isophorone diamine, bis(4-amino-3-methyldicyclohexyl)methane, diaminodicyclohexylmethane, bis(aminomethyl)cyclohexane, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5,5]undecane, m-phenylenediamine, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, diaminodiethyldiphenylmethane, dicyandiamide, organic acid dihydrazide, etc. Examples of tertiary amine salts include carboxylates, sulfonates, and inorganic acid salts of the aforementioned tertiary amines. Examples of carboxylate salts include salts of carboxylic acids (especially fatty acid salts) with 1 to 30 carbon atoms (particularly 1 to 10 carbon atoms), such as octanoate. Examples of sulfonates include p-toluenesulfonate, benzenesulfonate, methanesulfonate, and ethanesulfonate. Specific examples of representative tertiary amine salts include salts of 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) (e.g., p-toluenesulfonate, octanoate). However, these are merely examples. Using amine-based curing agents other than these will not depart from the spirit of this disclosure.

[0044] Examples of borate esters include trimethyl borate, triethyl borate, tripropyl borate, tributyl borate, and cyclic borate ester compounds. However, these are merely illustrative examples. The use of other borate esters is not contrary to the spirit of this disclosure.

[0045] Examples of organometallic compounds include zinc octanoate, tin octanoate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate, and aluminum acetylacetonate complexes. However, these are merely illustrative examples. The use of other organometallic compounds does not depart from the spirit of this disclosure.

[0046] Examples of organophosphorus compounds include tetraphenylphosphonium-tetraphenylborate and triphenylphosphine. However, these are merely illustrative examples. The use of other organophosphorus compounds does not depart from the spirit of this disclosure.

[0047] Examples of quaternary ammonium salts include tetramethylammonium chloride, tetramethylammonium bromide, tetramethylammonium iodide, tetraethylammonium chloride, tetraethylammonium bromide, tetraethylammonium iodide, tetrabutylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium iodide, triethylbenzylammonium chloride, triethylbenzylammonium bromide, triethylbenzylammonium iodide, triethylphenylethylammonium chloride, triethylphenylethylammonium bromide, and triethylphenylethylammonium bromide. However, these are merely examples. The use of quaternary ammonium salts other than these does not depart from the spirit of this disclosure.

[0048] Examples of quaternary phosphonium salts include tetrabutylphosphonium chloride, tetrabutylphosphonium iodide, tetrabutylphosphonium acetate, tetraphenylphosphonium chloride, tetraphenylphosphonium bromide, tetraphenylphosphonium iodide, ethyltriphenylphosphonium chloride, ethyltriphenylphosphonium bromide, ethyltriphenylphosphonium iodide, ethyltriphenylphosphonium acetate, ethyltriphenylphosphonium phosphate, propyltriphenylphosphonium chloride, propyltriphenylphosphonium bromide, propyltriphenylphosphonium iodide, butyltriphenylphosphonium chloride, butyltriphenylphosphonium bromide, and butyltriphenylphosphonium iodide. However, these are merely examples. The use of quaternary phosphonium salts other than these does not depart from the spirit of this disclosure.

[0049] Examples of amine complexes include boron halide amine complexes, such as boron trifluoride, boron trichloride, and boron tribromide, which are complexes of boron halides and amine compounds. Examples of amine compounds include aliphatic tertiary amines such as trimethylamine, tri-n-propylamine, N,N-dimethyloctylamine, and N,N-dimethylbenzylamine; aromatic tertiary amines such as N,N-dimethylaniline; heterocyclic tertiary amines such as substituted or unsubstituted imidazoles or pyridines with alkylation at the 1-position; aliphatic primary amines such as monoethylamine and n-hexylamine; aromatic primary amines such as benzylamine; aromatic primary amines such as aniline; and secondary amines such as piperidine. Representative examples of boron halide amine complexes include boron trifluoride monoethylamine complex, boron trifluoride diethylamine complex, boron trifluoride isopropylamine complex, boron trifluoride chloroaniline complex, boron trifluoride-triallylamine complex, boron trifluoride benzylamine complex, boron trifluoride aniline complex, boron trichloride monoethylamine complex, boron trichloride phenol complex, boron trichloride piperidine complex, boron trichloride disulfide dimethyl complex, boron trichloride N,N-dimethyloctylamine complex, boron trichloride N,N-dimethyldodecylamine complex, and boron trichloride N,N-diethyldioctylamine complex. However, these are merely examples. The use of amine complexes other than these is not contrary to the spirit of this disclosure.

[0050] Examples of imidazole compounds include 2-methylimidazolium, 2-phenylimidazolium, 2-undecylimidazolium, 2-heptadecylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenyl-4-methylimidazolium, 1-benzyl-2-phenylimidazolium, 1-benzyl-2-methylimidazolium, 1-cyanoethyl-2-methylimidazolium, 1-cyanoethyl-2-phenylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazolium, and 2,4-diamino-6(2'-methylimidazolium(1'))ethyl-tris(2'-methylimidazolium) Examples of imidazole curing agents include aziridines, 2,4-diamino-6-(2'-undecylimidazole (1'))ethyl-triazine, 2,4-diamino-6-(2'-ethyl,4-methylimidazole (1'))ethyl-triazine, 2,4-diamino-6-(2'-methylimidazole (1'))ethyl-triazine isocyanuric acid adducts, 2:3 adducts of 2-methylimidazole isocyanuric acid, 2-phenylimidazole isocyanuric acid adducts, 2-phenyl-3,5-dihydroxymethylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, and 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole. However, these are merely examples. The use of imidazole-based curing agents other than these is not contrary to the spirit of this disclosure.

[0051] Specific examples of anhydride-based curing agents include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methylnadic anhydride. However, these are merely examples. The use of anhydride-based curing agents other than these is not contrary to the spirit of this disclosure.

[0052] The amount of curing agent used for the epoxy group described above can be appropriately adjusted according to the type of thermosetting resin (A) and the type of curing agent. Regarding the amount of curing agent, it is preferably between 0.5 equivalents and 2 equivalents or less relative to the epoxy equivalent of the thermosetting resin (A). If the amount of curing agent is less than 0.5 equivalents, the thermosetting resin (A) may not cure sufficiently. If the amount of curing agent exceeds 2 equivalents, the heat resistance, mechanical properties, etc., of the cured product may decrease.

[0053] 1.3.3. Reaction accelerators for epoxy groups

[0054] In addition to the curing agents for epoxy groups mentioned above, curing accelerators may also be used to promote or control the curing reaction. Examples of curing accelerators include tertiary amines and their salts, quaternary ammonium compounds, imidazoles, and alkali metal alkoxides. However, these are merely examples. The use of curing accelerators other than these does not depart from the spirit of this disclosure.

[0055] Regarding the amount of curing accelerator, it is preferably 0.01% by mass or more and about 30% by mass or less (more preferably 0.05% by mass or more and about 20% by mass or less) relative to the mass of the thermosetting resin (A). If the amount is less than 0.01% by mass, the promoting effect may be small. If the amount exceeds 30% by mass, the storage stability of the insulating resin composition (X) and the moldability of the cured product (Y) may also decrease.

[0056] 1.4. Liquid Paraffin (D)

[0057] Regarding liquid paraffin (D), it is added to achieve the following effect: forming a film on the surface of the cured product (Y) during the curing reaction of the insulating resin composition (X), preventing the adhesion of the monofunctional vinyl monomer (B) that is volatilized and filled in the curing oven to the surface of the cured product (Y).

[0058] As for liquid paraffin (D), there are no particular limitations as long as it is liquid at room temperature. Liquid paraffin (D) is, for example, formed by making n an integer, and by C. n H 2n+2The compound is composed of chain-like saturated hydrocarbons. The integer n is, for example, 20 or more. The melting point of the liquid paraffin (D) is, for example, 30°C or less. Regarding the liquid paraffin (D), it does not completely evaporate even at the boiling point of the monofunctional vinyl monomer (B). That is, regarding the liquid paraffin (D), it is sufficient that it remains to the extent that a thin film can be formed on the surface of the insulating resin composition (X) and its cured product (Y), even at the boiling point of the monofunctional vinyl monomer (B). For example, the boiling point of the liquid paraffin (D) is higher than that of the monofunctional vinyl monomer (B). Examples of liquid paraffin (D) include flowing paraffin, mineral oil, liquid paraffin, white mineral oil, etc.

[0059] Liquid paraffin (D) can be directly added to a mixture of thermosetting resin (A) and monofunctional vinyl monomer (B). From a dispersibility viewpoint, it is preferable to pre-disperse the monofunctional vinyl monomer (B) as a dispersion medium before mixing. It should be noted that the liquid paraffin (D) is preferably a liquid paraffin with a viscosity of 10 mPa·s to 200 mPa·s at room temperature (25°C).

[0060] The amount of liquid paraffin (D) should preferably be 5 wt% or less of the total amount of the varnish component (Z), more preferably 3 wt% or less, and even more preferably 0.01 wt% to 1 wt%. If the amount is less than 0.01 wt%, it is difficult to form a coating that adequately prevents the re-adhesion of the monofunctional vinyl monomer (B). On the other hand, if the amount exceeds 5 wt%, it will affect the mechanical strength and heat resistance of the cured product (Y).

[0061] 2. Method for manufacturing insulating resin composition (X) and its cured product (Y)

[0062] 2.1. Insulating resin composition (X)

[0063] Regarding the insulating resin composition (X), it can be manufactured by the following manufacturing method. The proportions of (A) to (D) are set as described in the examples and comparative examples. In addition, regarding the mixing method, mixing methods known in the art can be effectively used, and there are no particular limitations as long as uniform mixing is achieved.

[0064] (a) Adjustment of liquid paraffin solution

[0065] Liquid paraffin (D) is added to the total amount or a portion of the monofunctional vinyl monomer (B) and dispersed uniformly by ultrasonication.

[0066] (b) Adjustment of the insulating resin composition (X)

[0067] The liquid paraffin solution adjusted in (a) above is mixed with the thermosetting resin (A), wherein the curing agent and the reaction initiator (C) are uniformly mixed.

[0068] To illustrate, when a multifunctional vinyl monomer is incorporated into the varnish component (Z) of the insulating resin composition (X), the multifunctional vinyl monomer is mixed with a liquid paraffin solution in a thermosetting resin (A), for example, as described in (b) above.

[0069] 2.2. Cured product (Y)

[0070] Cured product (Y) is a cured product of insulating resin composition (X). Cured product (Y) is typically generated by heating insulating resin composition (X). Cured product (Y) is used in various forms and shapes depending on the application. Cured product (Y) can be molded into desired shapes by various molding methods such as impregnation, coating, casting, or sheet molding.

[0071] Cured material (Y) exhibits excellent insulation and heat resistance. Therefore, cured material (Y) is suitable for applications requiring at least one of these properties: insulation and heat resistance. For example, cured material (Y) is suitable as an insulating component for heavy electrical equipment such as rotating machines and power transmission and distribution equipment. Examples of insulating components include, for instance, varnishes, insulating coatings, cable sheathing materials, insulating sheets, and sealing materials.

[0072] When the cured product (Y) becomes a product that is cured by impregnating the insulating resin composition (X) into the coil of a rotating machine, an impregnation process of the insulating resin composition (X) adjusted by a conditioning process is performed on the coil. There are no particular limitations on the impregnation method in the impregnation process; a preheating process and an air cooling process are performed before the impregnation process. Furthermore, a heat curing process is performed after the impregnation process, following a de-drip process.

[0073] The preheating process is an annealing treatment aimed at improving the microcrack resistance of coils made of enameled wire or similar materials. In the preheating process, the coil is heated at a specified temperature. There are no particular limitations on the heating temperature in the preheating process, as long as it is a temperature that improves microcrack resistance; for example, treatment at 150°C is acceptable.

[0074] The air cooling process is a process of cooling the coil to a specified temperature to suppress the temperature rise of the insulating resin composition (X). As long as the temperature range does not affect the pot life of the insulating resin composition (X), there is no particular limitation on the temperature after cooling; for example, a temperature range of 40°C to 60°C is suitable.

[0075] In the impregnation process, the insulating resin composition (X) is impregnated into the coil using methods known in the art, such as impregnation, dripping, pressure impregnation, and vacuum impregnation. For example, when the coil is used in a large rotating machine, impregnation or pressure / vacuum impregnation is generally performed to ensure that the insulating resin composition (X) is impregnated into the interior of the coil. In the case of impregnation, the coil is immersed statically in an impregnation tank filled with the insulating resin composition (X). There is no particular limitation on the impregnation time, but since air adhering between the enameled wires and in the components of the winding becomes bubbles and floats to the surface during impregnation, it is preferable to impregnate until the formation of these bubbles disappears. The time until the bubbles subside varies depending on the size of the coil, and the impregnation time is about 10 minutes to 60 minutes. From the viewpoint of maximizing the efficiency of the manufacturing process, i.e., shortening the time, it is preferable to impregnate for about 15 minutes to 45 minutes. This is because if the impregnation time is less than 10 minutes, the resin does not penetrate the entire coil. Even if impregnation continues for more than 60 minutes until the bubble formation process ends, the amount of insulating resin composition (X) penetrating into the coil does not increase. Regarding the impregnation temperature, i.e., the temperature of the insulating resin composition (X) in the impregnation tank, there is no particular limitation as long as there is no starting temperature range for the thickening caused by curing; generally, it is set to room temperature of 25°C to 60°C. The insulating resin composition (X) involved in Embodiment 1 has a low viscosity, so impregnation at room temperature of 25°C is also possible. During the impregnation process, the coil is formed into a state where the insulating resin composition (X) enters between the windings, etc.

[0076] In the heat curing process, the insulating resin composition (X) impregnated with the coil in the impregnation process is heated and cured in a curing oven, thereby becoming a cured product (Y). Regarding the curing temperature in the heat curing process, there is no particular limitation as long as it is above the reaction initiation temperature (half-life temperature) of the reaction initiator added to the insulating resin composition (X), generally 130°C to 180°C, preferably 140°C to 170°C. Generally, the curing time required in the heat curing process varies depending on the curing speed of the resin, the amount of the coil adhered, and the composition of the raw materials. Furthermore, the curing time required for curing depends on the temperature; generally, at higher temperatures, the time until curing is achieved is shorter. Therefore, the curing temperature and curing time are set according to the composition of the insulating resin composition (X) to be the temperature and time required for complete curing. However, if the curing temperature or curing time is insufficient, the insulating resin composition (X) may not be completely cured, resulting in uncured portions. In this case, various properties such as electrical and mechanical properties may decrease. On the other hand, if the curing heating temperature or curing heating time is excessive, the equilibrium of the crosslinking reaction caused by curing heating may sometimes collapse, leading to cracks in the cured product (Y). The curing heating temperature and curing heating time are set within a range where these problems do not occur. The insulating resin composition (X) according to Embodiment 1 is fully cured at a curing heating temperature of 130°C to 180°C for a curing heating time of 30 minutes to 8 hours. If the curing heating time is less than 30 minutes, the insulating resin composition (X) does not reach complete curing. On the other hand, the mechanical strength, i.e., the fixing strength of the wire, slowly emerges and increases after curing, tending to end after a predetermined time, in this case, 4 hours. Therefore, from the viewpoint of complete curing and the end of mechanical strength, the curing heating time is preferably 1 hour to 4 hours, more preferably 1 hour to 2 hours. Through the heating curing process, the coil, between the windings, etc., forms a cured product (Y).

[0077] 2.3. Coils for rotating machines and stators of rotating machines using them

[0078] The insulating resin composition (X) of Embodiment 1 is applied to, for example, large rotating machines used in the winches of rope elevators. Figure 2 This is a cross-sectional view of the winch according to Embodiment 1.

[0079] Figure 2 The winch 10 shown includes a rotating part 11, a braking part 12, and a motor part 13.

[0080] The rotating part 11 includes a pulley 14, a rotor 15, a brake disc 16, and a rotating shaft 17. The pulley 14, rotor 15, and brake disc 16 are coaxially coupled via the rotating shaft 17. A main rope (not shown) is wound in the pulley 14. The elevator car (not shown), supported by the main rope, is driven by the friction between the main rope and the pulley 14.

[0081] The braking unit 12 includes a movable brake pad (not shown). The braking unit 12 generates a braking force on the rotating part 2 by the friction produced when the brake pad abuts against the brake disc 16.

[0082] The motor unit 13 includes a frame 18 and a stator 19. The stator 19 is fixed to the frame 18 by pressing or burning in. The stator 19 has an annular iron core 20. Wires 21 are wound into the teeth of the iron core 20. The wires 21 and the iron core 20 are insulated by an insulator 22. The wires 21 are also fixed by the insulator 22. The wires 21 wound into the teeth are connected to each other in a predetermined order, and magnetic flux is generated when energized.

[0083] Regarding the stator 19, it is manufactured, for example, by a method comprising the following steps. First, bare wires insulated with enamel are prepared. The bare wires are conductive. The material of the bare wires is, for example, copper, aluminum, silver, etc. There is no particular limitation on the type of enamel; polyesterimide, polyamideimide, polyamide, etc., are used in combination. In the insulating layer using these enamels, inorganic fillers for improving insulation withstand voltage may be included. These enameled wires can be commercially available enameled wires for motor coils. Such insulated enameled wires are wound around the respective teeth of the iron core 20 to form a winding 21. Then, by the impregnation process described above, the winding 21 is impregnated with an insulating resin composition (X), and the insulating resin composition (X) is cured by a heat curing process.

[0084] As a reactive diluent to reduce viscosity and improve the impregnation properties of the insulating resin composition (X) onto the coil, a low molecular weight monofunctional vinyl monomer (B) is used. Therefore, even in large rotating machine coils with long and thick coils, the insulating resin composition (X) can be easily impregnated. Due to the low viscosity of the insulating resin composition (X), the formation of excess blocky cured material is suppressed, and the surface fingertip properties of the cured material (Y) are further improved by the film formed by the liquid paraffin (B). This improves the manufacturability of large rotating machines.

[0085] 3. Example

[0086] The following examples illustrate Implementation 1. It should be noted that the examples below do not limit the scope of this disclosure.

[0087] 3.1. Preparation of insulating resin composition (X) and its cured product (Y)

[0088] The insulating resin compositions (X) and their cured products (Y) of the various embodiments and comparative examples are manufactured as described below.

[0089] 3.1.1. Preparation of materials

[0090] Prepare the following materials.

[0091] Thermosetting resin (A)

[0092] A thermosetting resin containing both epoxy and methacryloyl groups in one molecule, with a number-average molecular weight of approximately 2000 and a viscosity of approximately 3900 mPa·s at 60°C.

[0093] • Monofunctional vinyl monomers (B)

[0094] 2-Hydroxyethyl methacrylate (2-HEMA)

[0095] Multifunctional vinyl monomers

[0096] A polyfunctional vinyl monomer having two or more methyl (acryloyl) or allyl groups in one molecule (neopentyl glycol dimethacrylate with a viscosity of 5 mPa·s at 25°C).

[0097] • Curing agent and reaction initiator (C)

[0098] Curing agent: Zinc octanoate

[0099] Reaction initiator: 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane

[0100] Liquid paraffin (D)

[0101] Liquid paraffin wax, solid paraffin wax (comparative example)

[0102] 3.1.1.1. Examples 1 to 26

[0103] The formulation amounts of Examples 1 through 26 are shown in Table 1. In Table 1, the weight percentages (wt%) of liquid paraffin (D) and reaction initiator represent the ratios relative to the total weight of the varnish component (Z) composed of thermosetting resin (A), monofunctional vinyl monomer (B), and polyfunctional vinyl monomer. Additionally, in Table 1, 1 phr represents the formulation amount of 1 part by weight of curing agent relative to a total of 100 parts by weight of thermosetting resin (A) and monofunctional vinyl monomer (B).

[0104]

[0105] According to the proportions shown in Table 1, thermosetting resin (A), monofunctional vinyl monomer (B), polyfunctional vinyl monomer, curing agent, and reaction initiator (C) were weighed. In Examples 1 to 26, the amount of curing agent was 1 phr, and the amount of reaction initiator was 0.4 wt%. Next, according to the proportions shown in Table 1, flowing paraffin (D) was weighed and dispersed in the monofunctional vinyl monomer (B) to prepare a liquid paraffin solution. Next, the weighed thermosetting resin (A), polyfunctional vinyl monomer, curing agent, reaction initiator (C), and adjusted liquid paraffin solution were all mixed and stirred evenly to obtain an insulating resin composition (X).

[0106] 3.1.1.2. Comparative Example 1

[0107] The insulating resin compositions were prepared using the same method as in Examples 1 to 26, according to the proportions shown in Table 1. As shown in Table 1, Comparative Example 1 is an example where the proportions of materials other than liquid paraffin (D) are the same as in Example 7.

[0108] 3.1.1.3. Comparative Example 2

[0109] The insulating resin compositions were prepared according to the proportions shown in Table 1, using the same method as in Examples 1 to 26. As shown in Table 1, Comparative Example 2 is an example with the same formulation as Example 7, except that it contains 1 wt% solid paraffin instead of liquid paraffin (D). As the solid paraffin, a paraffin that is solid at room temperature (25°C), i.e., has a melting point higher than 25°C, was used. In Comparative Example 2, the solid paraffin was pulverized for uniform dispersion in the monofunctional vinyl monomer (B).

[0110] 3.2. Evaluation

[0111] The insulating resin composition (X) and its cured product (Y) are evaluated as described below.

[0112] 3.2.1. Viscosity

[0113] The viscosity of the insulating resin composition (X) was determined using an E-type viscometer. The results of the measurements at room temperature are shown in Table 1.

[0114] 3.2.2. Mechanical strength (fixing force of the helical coil)

[0115] Using 1mm diameter magnetic wire (Hitachi Metals KMK-20E), spiral coils were fabricated as test pieces according to J ISC 3216-1 and 6. Next, the spiral coils were preheated by heating at 150°C for 120 minutes and then cooled to room temperature. These spiral coils were then immersed in an insulating resin composition (X) and allowed to stand for 1 minute before being lifted and lowered from the oven at appropriate intervals. The coils were then heated for a specified time to cure the insulating resin composition (X). The curing temperature was set at 150°C. The curing time was 1 hour in Examples 1-21 and Comparative Examples 1 and 2, 25 minutes in Example 25, 30 minutes in Example 23, 120 minutes in Example 24, 180 minutes in Example 25, and 240 minutes in Example 26. The spiral coils obtained after heat curing were subjected to a 3-point bending test using an Autograph (strength testing machine). The evaluation results are shown in the "Intensity" column of Table 1. In Table 1, less than 100N is marked as △, more than 100N but less than 150N is marked as ○, and more than 150N is marked as ◎.

[0116] 3.2.3. Inhibition of the formation of blocky solidified materials

[0117] Ready to simulate Figure 2 The sample of stator 19 shown was impregnated and cured in the insulating resin composition (X). The thickness of the blocky cured material formed on the underside (coil end) of the portion of the simulated wound wire 21 and the portion of the simulated insulation 22 was measured. The evaluation results are shown in the "Ice Slip" column of Table 1. In Table 1, 10 mm or more is marked as △, 2 mm or more but less than 10 mm is marked as ○, and less than 2 mm is marked as ◎.

[0118] To clarify, since a balance between mechanical strength and inhibition of bulk curing formation is sought, the balance of these properties is evaluated. The evaluation results are shown in the "Balance" column of Table 1. In Table 1, a balance of mechanical strength and inhibition of bulk curing formation is marked as ◎, ○ if any of these properties is ○, and △ if any of these properties is △.

[0119] 3.2.4. Tactile

[0120] The coils of the aforementioned spiral coils and the sample of the simulated stator 19, or the cured (Y) of the insulating resin composition (X) formed on the surface of the constituent parts, were touched by fingers, and the tactile properties were evaluated by the presence or absence of finger adhesion. The evaluation results are shown in the "Tactile Properties" column of Table 1. In Table 1, the case where the insulating resin composition (X) adheres to the fingers in a liquid or gel state is marked as ×, the case where it feels sticky but does not adhere to the fingers is marked as △, and the case where it is non-sticky, smooth, and does not adhere to the fingers is marked as ○.

[0121] 3.3. Results and Investigation

[0122] As shown in Table 1, the tactile properties of Examples 1 to 26 were improved compared to Comparative Examples 1 and 2. This is believed to be because the liquid paraffin (D) forms a thin film on the surface of the cured product (Y) and is distributed with a concentration gradient from the surface to the interior, thereby inhibiting the re-adhesion of the monofunctional vinyl monomers (B) that fill the curing oven.

[0123] Based on the results of Example 7 and Comparative Example 1, the effect of the presence or absence of liquid paraffin (D) was investigated. It was concluded that, since Comparative Example 1 did not contain liquid paraffin (D), no film of liquid paraffin (D) was formed on the surface of the cured product (Y), and the adhesion of the monofunctional vinyl monomer (B) volatilized at the curing heating temperature to the surface of the cured product was not suppressed. Furthermore, 2-HEMA, used as the monofunctional vinyl monomer (B) in Example 7 and Comparative Example 1, has hygroscopic properties. Therefore, it was concluded that, in Comparative Example 1, not only was the re-adhesion of volatilized 2-HEMA not suppressed, but the 2-HEMA re-adheded to the surface also exhibited poorer tactile properties due to the adsorption of moisture from the cooled air.

[0124] Based on the results of Example 7 and Comparative Example 2, the effect of paraffin morphology was investigated. The concentration of the paraffin solution in Comparative Example 2 was the same as that in Example 7, but solid paraffin, which is solid at room temperature (25°C), was used in Comparative Example 2. Although the solid paraffin was pulverized for use in Comparative Example 2, unlike liquid paraffin (D), it was difficult to disperse uniformly. Therefore, it was concluded that in Comparative Example 2, the formation of the paraffin film on the surface of the cured product became uneven, and the expected improvement in touchability was not achieved.

[0125] Based on the results of Examples 1 to 14, the effect of the amount of monofunctional vinyl monomer (B) incorporation is discussed. Regarding the amount of monofunctional vinyl monomer (B), it was less than 45 wt% of the total amount of varnish component (Z) in Examples 1 to 3 and Example 13, 50 wt% to 75 wt% in Examples 4, 5, and 10, and 84 wt% or more in Examples 11, 12, and 14. In Examples 1 to 3 and Example 13, good strength (◎) was obtained in terms of mechanical strength, and the thickness of the solidified block exceeded 10 mm. In Examples 11, 12, and 14, the thickness of the solidified block was good, less than 2 mm, but the mechanical strength decreased, resulting in a (△) criterion. In Examples 4, 5, and 10, characteristics of ○ or better were obtained in terms of both mechanical strength and suppression of solidified block formation, representing the best balance between the two. This is because, as described above, the monofunctional vinyl monomer (B) reduces the viscosity of the insulating resin composition (X), which helps improve the liquid's drainability and has the effect of inhibiting the formation of blocky cured products. On the other hand, due to its low molecular weight and volatile nature during curing heating, it reduces the mechanical strength of the cured product (Y). That is, the reason is that there is a trade-off between the inhibition of blocky cured product formation and mechanical strength, which depends on the amount of monofunctional vinyl monomer (B) incorporated. As a result of in-depth research in this disclosure, it has been found that, in order to balance these two properties, the amount of monofunctional vinyl monomer (B) incorporated can be 44 wt% to 84 wt% of the total amount of the varnish component (Z), preferably 51 wt% to 72 wt%, and more preferably 58 wt% to 68 wt%.

[0126] Based on the results of Examples 15 to 21, the amount of liquid paraffin (D) was discussed. Regarding the amount of liquid paraffin (D), it was less than 0.01 wt% of the total amount of the varnish component (Z) in Example 15, 1 wt% to 3 wt% in Examples 16 and 17, 3 wt% to 6 wt% in Examples 18 and 19, and more than 6 wt% in Examples 20 and 21. The cured product (Y) in all cases showed superior tactile properties compared to Comparative Examples 1 and 2. On the other hand, in Example 15, although there was no adhesion to the fingers after touch, it felt sticky. This is presumably because the amount was too small, thus failing to obtain a paraffin film with sufficient non-sticky tactile properties. In Examples 20 and 21, although the tactile properties were good, a decrease in mechanical strength and uneven appearance (mottling) were observed. In Examples 18 and 19, good tactile properties were found without affecting other properties. As a result of the in-depth research conducted in this disclosure, it has been found that the amount of liquid paraffin (D) is 5.3 wt% or less of the total amount of varnish component (Z), preferably 2.9 wt% or less, and more preferably 0.008 wt% to 1.2 wt%.

[0127] Based on the results of Examples 22 to 26, the effect of curing heating time is discussed. Regarding the curing heating time, it was set to 25 minutes in Example 22, 30 minutes in Example 23, 120 minutes in Example 24, 180 minutes in Example 25, and 240 minutes in Example 26. For comparison, results equivalent to Example 7 with the same formulation and a curing heating time of 60 minutes are shown in Table 1 along with Examples 22 to 26. In all examples, a mechanical strength of 100 N or more was obtained. On the other hand, focusing on the numerical value of mechanical strength, from a curing heating time of 60 minutes, the mechanical strength reaches approximately 200 N, and at longer curing heating times, the increase in mechanical strength saturates. From the viewpoint of manufacturing process and quality management, it is preferable to set a time at which the increase in mechanical strength saturates after high mechanical strength is observed. As a result of in-depth research in this disclosure, it has been determined that the curing heating time is preferably 1 hour to 4 hours, more preferably 1 hour to 2 hours.

[0128] Industrial availability

[0129] The rotating machine disclosed herein can be applied to the winch of a rope elevator. The coil disclosed herein can be applied to the rotating machine. The insulating resin processed material and its cured material disclosed herein can be used to maintain the insulation and mechanical strength of the coil, etc.

[0130] Explanation of reference numerals in the attached figures

[0131] 1. Coil, 2. Insulating resin composition, 3. Film, 4. Monofunctional vinyl monomer, 10. Winch, 11. Rotating part, 12. Braking part, 13. Motor part, 14. Sheave, 15. Rotor, 16. Brake disc, 17. Rotating shaft, 18. Frame, 19. Stator, 20. Core, 21. Winding, 22. Insulator

Claims

1. An insulating resin composition, which is an insulating resin composition cured at a curing heating temperature, comprising: The varnish component comprises: a thermosetting resin having both an epoxy group and a (meth)acryloyl group in one molecule, and a monofunctional vinyl monomer that volatilizes above the curing heating temperature. Curing agents and reaction initiators; and Liquid paraffin, The amount of liquid paraffin is more than 0.008 wt% and less than 4 wt% of the total components of the varnish.

2. The insulating resin composition according to claim 1, wherein, The liquid paraffin is made from C n H 2n＋2 The structure shown is composed of chain-like saturated hydrocarbons.

3. The insulating resin composition according to claim 1 or 2, wherein, The liquid paraffin does not completely evaporate even at the boiling point of the monofunctional vinyl monomer.

4. The insulating resin composition according to claim 1 or 2, wherein, The monofunctional vinyl monomer is used as the dispersion medium for the liquid paraffin. The liquid paraffin is uniformly dispersed in a dispersion medium using ultrasound.

5. The insulating resin composition according to claim 1 or 2, wherein, The amount of liquid paraffin is more than 1 wt% and less than 4 wt% of the total components of the varnish.

6. The insulating resin composition according to claim 1 or 2, wherein, The amount of the monofunctional vinyl monomer is more than 45 wt% and less than 85 wt% of the total varnish component.

7. The insulating resin composition according to claim 1 or 2, wherein, The viscosity is above 10 mPa·s and below 210 mPa·s.

8. A cured product formed by curing the insulating resin composition according to any one of claims 1 to 7.

9. A coil for a rotating machine, impregnated with the insulating resin composition according to any one of claims 1 to 7.

10. A rotating machine, used in a winch that drives the car of a rope elevator, comprising: The stator uses the coil for a rotating machine as described in claim 9.

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