A method of glass processing and glass article thereof

Abstract

The application discloses a glass processing method and glass product thereof, which comprises the following steps: S1, providing a glass substrate, which has a set size allowance on the basis of a finished product size; S2, galvanometer scanning chamfer processing: using a laser galvanometer scanning system to layer-etch a chamfer forming surface on the glass substrate according to a product design contour; the set size allowance meets the condition that the glass substrate does not have a collapse edge phenomenon during the galvanometer scanning chamfer processing. The application can effectively solve the collapse edge and explosion risk in the glass production process with a chamfer, and improve the process stability and processing precision.

Description

[Technical Field]

[0001] This invention belongs to the field of laser processing technology, and in particular relates to a glass processing method and glass products thereof. [Background Technology]

[0002] With the development and widespread use of personal consumer electronics, such as smartphones and tablets, cover glass is widely used in automotive displays, smartphone and tablet displays, and camera protective lenses due to its excellent optical properties and unique abrasion resistance. Photovoltaic glass is a type of auxiliary material for photovoltaic cell modules. Due to strong market demand, the supply of photovoltaic glass has consistently been insufficient. A crucial step in the processing of photovoltaic glass is cutting and slicing.

[0003] Glass is characterized by its hardness and brittleness, posing significant challenges to processing, especially the cutting of ultra-thick glass, which has long been a technical hurdle. Traditional glass cutting methods utilize carbide or diamond tools, with a two-step process: first, a crack is created on the glass surface using a diamond tip or carbide grinding wheel; second, mechanical means are used to cut the glass along the crack line. However, traditional methods for cutting ultra-thick glass have several drawbacks: first, material removal leads to debris, fragments, and micro-cracks, reducing the strength of the cut edges and necessitating a CNC precision grinding process; second, the tools wear out easily and require regular replacement, making them consumables and increasing cutting costs; and third, this method can only cut straight lines, making it difficult to cut irregular patterns, resulting in low yield rates. Therefore, for products with glass thickness ≥1mm, especially ultra-thick glass such as 5mm or even 12mm thick glass, laser cutting, as a precision machining technology, is gradually becoming the primary process for deep glass processing.

[0004] Ultrafast laser cutting technology boasts strong processing adaptability, enabling the processing of materials with high hardness, high melting points, and brittleness, thus solving the problem of cutting irregular shapes in traditional processing methods. The laser cutting spot is easily controlled, focusing down to the micrometer level, meeting the extremely high precision requirements of processes such as point-to-point processing and fine machining. Furthermore, it offers high processing efficiency, achieving cutting speeds exceeding 800 mm / s for 2 mm thick glass, eliminating the need for subsequent grinding processes and saving materials.

[0005] Ultrafast lasers typically cut glass using either filamentary cutting or Bessel beam cutting. Filamentary cutting creates micron-sized pores in the material, which can extend to a depth of several millimeters in glass. Bessel beam cutting, on the other hand, is a laser beam generated by long-distance interference, allowing energy to be concentrated and propagated within transparent materials without diffraction. It can penetrate glass layers that are several millimeters thick, have a very small diameter (less than 2 μm), and are essentially uniform in shape.

[0006] After glass is cut, the edges are usually quite sharp, which is inconvenient for handling, subsequent processing, or installation, and can easily cause scratches to construction workers. At the same time, many micro-cracks appear at the edges after cutting, and these cracks have a significant impact on the lifespan of the glass. These micro-cracks will gradually widen during use, eventually causing the entire piece of glass to break. To remove the micro-cracks remaining after glass cutting and to prevent sharp edges from cutting people, we need to bevele the glass. Adding narrow bevels to the glass edges can prevent scratches on the skin and also increase the glass's strength, making it less prone to breakage.

[0007] Traditional chamfering typically involves mechanical grinding, which is inefficient and generates dust pollution. In recent years, lasers have been widely used in the cutting and chamfering of glass products. However, most laser chamfering processes involve first contour cutting on the glass substrate, and then chamfering based on the cut lines. For example, patent publication number CN111362570B discloses a method and system for laser processing glass sheets and laser chamfering of glass sheets. This method uses a Bessel beam to scribing the glass sample contour and alignment marks on the glass substrate, obtaining the cutting lines and alignment marks. Then, a Gaussian beam emitted by a galvanometer scanning laser system forms multiple sets of identical scanning lines on the glass substrate. These multiple sets of identical scanning lines are used to deepen and widen the cutting lines layer by layer to form a chamfer structure on the glass sample contour. After the chamfering is completed, a strengthening demolding or scribing demolding process is performed, thereby improving chamfering accuracy, reducing edge chipping, and preventing pollution. However, this method still has a significant risk of edge chipping, as analyzed below:

[0008] This method first uses a Bezier beam to etch dicing lines on a glass substrate. Since the Bezier beam cuts directly through the glass, the glass substrate is effectively divided into two parts by the dicing lines: a working part and a scrap part. Both the working and scrap parts have sharp-angled structures on their upper and lower surfaces at the dicing lines. Figure 1 As shown, a Gaussian beam is then emitted from a galvanometer scanning laser system and struck on the surface of the glass substrate, starting from the top or bottom surface, to gradually scan and process the chamfered structure, as shown. Figure 2As is well known, the sharp corner structure of glass is a region of concentrated internal stress. The smaller the area of ​​the sharp corner, the more the stress tends to be infinitely large. When the high-energy Gaussian beam emitted by the galvanometer scanning laser system acts on the glass surface, the cutting line area is heated instantly. The sharp corner structure is heated instantly, which makes it very easy for edge chipping or cracking to occur. Therefore, the glass processing technology described in this method is definitely unable to meet the precision requirements of workpieces with high precision requirements, and the risk of edge chipping and cracking is high, and the process stability is poor.

[0009] Therefore, it is necessary to provide a new glass processing method and glass products thereof to solve the above-mentioned technical problems. [Summary of the Invention]

[0010] The main objective of this invention is to provide a glass processing method that can effectively solve the risks of edge chipping and cracking during the production of beveled glass, and improve process stability and processing accuracy.

[0011] The present invention achieves the above objective through the following technical solution: a glass processing method, comprising the following steps:

[0012] S 1. Provide a glass substrate, wherein the glass substrate has a set dimensional margin based on the finished product size;

[0013] S2, Galvanometer scanning chamfering: A chamfered surface is etched layer by layer on the glass substrate according to the product design outline using a laser galvanometer scanning system; the allowance of the set size ensures that the glass substrate will not chip during the galvanometer scanning chamfering process.

[0014] Furthermore, the glass processing method also includes: S3, cutting processing: using a Bessel beam or the laser galvanometer scanning system to form a separation cutting surface adjacent to the chamfered forming surface within the thickness range of the glass substrate, wherein the separation cutting surface is consistent with the product design requirements.

[0015] Furthermore, the cutting process is performed using a Bessel beam or a laser galvanometer scanning system.

[0016] Furthermore, step S2 includes: firstly completing the point scan of the first horizontal layer, then completing the point scan of the next horizontal layer, until the chamfer depth of the product is reached, and completing the point scan of the last horizontal layer; the scan points of the same horizontal layer constitute a scan line, and the scan lines of all horizontal layers constitute a chamfer scan line group; the scan lines in the chamfer scan line group follow the shape contour surface formed and the product design contour, the size of the shape contour surface gradually increases with the increase of the chamfer processing depth, and the chamfer scan line group acts on the glass substrate thickness range to form the chamfer forming surface and form scanning processing grooves on the glass substrate surface.

[0017] Furthermore, the chamfered scanning line group acts within the thickness range of the glass substrate to form a processing boundary surface, and the chamfered forming surface and the processing boundary surface together form the scanning processing groove.

[0018] Furthermore, the processing boundary surface corresponding to the incident side of the Bessel beam is located between the chamfering surface and the extension plane of the separation cutting surface.

[0019] Furthermore, the surface of the glass substrate is divided into a finished product area and a waste area by the scanning processing groove; the separation cutting surface completely separates the finished product area and the waste area.

[0020] Furthermore, the inclination angle and the length of the chamfered surface are consistent with the product design requirements.

[0021] Furthermore, the glass substrate has a first surface and a second surface opposite to each other, and the laser galvanometer scanning system starts processing from the first surface of the glass substrate; in the Bessel beam cutting process, the Bessel beam is incident on the glass substrate from the second surface of the glass substrate.

[0022] Furthermore, the glass substrate has a first surface and a second surface opposite to each other, and the laser galvanometer scanning system starts processing from the first surface of the glass substrate; the Bessel beam of the Bessel beam cutting process is incident from the first surface of the glass substrate; the intersection of the Bessel beam and the first surface forms an incident point A, the incident point A is located in the waste area, and the transmission path of the Bessel beam inside the glass substrate completely avoids the scanning processing groove area.

[0023] Furthermore, the glass substrate has a first surface and a second surface opposite to each other, and the laser galvanometer scanning system simultaneously processes the chamfered surface from the first surface and the second surface respectively, or sequentially processes the chamfered surface from the first surface and the second surface respectively, or sequentially processes the chamfered surface from the second surface and the first surface respectively;

[0024] Then, the Bessel beam cutting process selectively enters from the first surface or from the second surface. The first surface or the second surface corresponding to the incident side of the Bessel beam constitutes the incident surface. The intersection of the Bessel beam and the incident surface forms the incident point A. The incident point A is located in the waste area, and the transmission path of the Bessel beam inside the glass substrate completely avoids the scanning processing groove area.

[0025] Furthermore, in glass articles with double-sided chamfers, the upper and lower chamfered surfaces are connected together by the separating cut surfaces.

[0026] Furthermore, the glass processing method also includes: S4, glass breakage and demolding.

[0027] Another object of the present invention is to provide a glass article prepared by the glass processing method described above.

[0028] Compared with the prior art, the beneficial effects of the glass processing method and glass products of the present invention are as follows:

[0029] 1) By leaving sufficient processing allowance on the glass substrate, and then directly using a laser galvanometer scanning system for chamfering instead of first using a Bezier beam for cutting, sufficient allowance allows the chamfering process to be performed at a sufficiently large distance from the sharp corners of the glass substrate, thereby greatly reducing the occurrence of edge chipping.

[0030] 2) While reducing the risk of edge chipping, in order to ensure processing efficiency, the glass products with beveled structure are directly processed by beveling before cutting. Compared with the original cutting before beveling, this can effectively reduce the risk of edge chipping and cracking.

[0031] 3) For the processing of glass products with double-sided chamfering, or single-sided chamfering where the chamfered surface and the incident surface of the Bezier beam cutting are on the same side, this method controls the included angle of the chamfering groove on the incident side of the Bezier beam cutting. Specifically, by controlling the position of the processing boundary surface, it ensures that the incident point of the Bezier beam on the glass substrate is located on the smooth surface of the glass substrate rather than the processing surface. Therefore, it effectively solves the problem that the Bezier beam cutting cannot be effectively incident for cutting when processing double-sided chamfered glass products or single-sided chamfered glass products without flipping them by chamfering first and then cutting. This achieves high-precision processing of such glass products, effectively prevents glass edge breakage, greatly improves product yield, and enhances the stability and reliability of the processing process. Moreover, there is no dust pollution during the processing, reducing environmental protection and cleaning costs. The processed glass products have smooth edges, protecting human skin from edge cuts, and the finished products are not easily broken, resulting in higher safety. [Attached Image Description]

[0032] Figure 1 This is one of the structural schematic diagrams of the glass chamfering process in the prior art;

[0033] Figure 2 This is the second structural schematic diagram of the glass chamfering process in the prior art;

[0034] Figure 3 This is one of the method flowcharts of an embodiment of the present invention;

[0035] Figure 4 This is a second flowchart of the method according to an embodiment of the present invention;

[0036] Figure 5 This is the third flowchart of the method according to an embodiment of the present invention;

[0037] Figure 6 This is the fourth flowchart of the method according to an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of the cross-sectional structure of the glass substrate after the galvanometer scanning chamfering process in an embodiment of the present invention;

[0039] Figure 8 This is a schematic diagram of the chamfered scanning line group in the glass substrate in an embodiment of the present invention;

[0040] Figure 9 This is a top view of the glass substrate after chamfering by galvanometer scanning in an embodiment of the present invention;

[0041] Figure 10 This is a schematic diagram of the cross-sectional structure of the glass substrate after Bessel beam cutting in an embodiment of the present invention.

[0042] Figure 11 This is a schematic diagram of the cross-sectional structure of the glass substrate after Bezier beam cutting in the double-sided chamfered glass processing according to an embodiment of the present invention;

[0043] The numbers in the diagram represent:

[0044] 1-Laser galvanometer scanning system; 2-Glass substrate; 21-Beveille forming surface; 22-Scanning processing groove; 23-Finished product area; 24-Waste area; 25-Separation cutting surface; 26-Processing boundary surface; 27-Scanning line; 3-Bessel beam.

Detailed Implementation Methods

[0045] Example 1:

[0046] Please refer to Figures 3-11 This embodiment is a glass processing method, which includes the following steps:

[0047] S1. Provide a glass substrate 2, which has a set dimensional allowance based on the finished product size. The set dimensional allowance can ensure that the chamfering position is far enough away from the sharp corner area of ​​the outline edge of the glass substrate 2, thereby ensuring that edge chipping will not occur.

[0048] S2, Galvanometer scanning chamfering: Using a laser galvanometer scanning system 1, chamfered surfaces 21 are etched in layers on the glass substrate 2 according to the product design outline.

[0049] The laser beam of the laser galvanometer scanning system 1 is focused on the lower surface of the glass substrate 2 and gradually scans and removes material according to the product design contour: first, the first horizontal layer is scanned, and then the next horizontal layer is scanned until the product chamfer depth is reached, and the last horizontal layer is scanned. The scanning points of the same horizontal layer form a scanning line 27, and all the scanning lines 27 of the horizontal layers form a chamfer scanning line group. The scanning lines in the chamfer scanning line group follow the shape contour surface formed by the product design contour, but the size of the shape contour surface gradually increases with the depth. The chamfer scanning line group acts on the glass substrate thickness to form a chamfer forming surface 21 and a scanning processing groove 22 on the glass substrate surface. The surface of the glass substrate 2 is divided into a finished product area 23 and a waste area 24 by the scanning processing groove 22.

[0050] The inclination angle and length of the chamfered surface 21 are consistent with the product design requirements.

[0051] S3. Cutting process: Using Bessel beam 3 or laser galvanometer scanning system 1 to act on glass substrate 2, cut through glass substrate 2, completely separate finished product area 23 from waste area 24, and form separation cutting surface 25 adjacent to chamfered forming surface 21 within the thickness range of glass substrate. Separation cutting surface 25 is consistent with product design requirements.

[0052] In this embodiment, a Bessel beam is used for cutting, creating a through-crack in the glass substrate 2. In other embodiments, a laser galvanometer scanning system 1 can also be used for cutting. Bessel beam cutting is mainly for thicker glass products, while laser galvanometer scanning system 1 is mainly for thinner glass, where the glass thickness is comparable to the chamfer height. When the glass thickness exceeds a certain chamfer height, the choice between Bessel beam cutting and laser galvanometer scanning system 1 can be determined based on processing costs.

[0053] In another embodiment, if the remaining thickness allowance of the glass substrate 2 is very small after the chamfered forming surface 21 is processed, the cutting operation in step S3 can be skipped, and the subsequent slitting and demolding operation can be carried out directly.

[0054] S4. Demolding the wafer. The wafer can be cleaved using conventional methods in the existing technology, such as using a carbon dioxide laser for heating, mechanical methods, or by hand. Carbon dioxide laser heating is preferred.

[0055] For chamfering of glass products, the industry generally focuses on optimizing the chamfering parameters of the laser galvanometer to solve the chipping problem. However, since the Bezier beam cutting process is performed first, the glass body already has a sharp corner structure, which has a very high possibility of chipping. No matter how much the parameters of the laser galvanometer scanning chamfering process are optimized, it is difficult to overcome this inherent chipping problem. This embodiment mainly solves the chipping problem by leaving sufficient margin in the glass substrate of the finished product, and then directly using the laser galvanometer scanning system to chamfer the glass substrate according to the finished product size outline. For chamfering height and glass substrate thickness that are not much different, the chamfering and cutting processes can be completed directly by the laser galvanometer scanning system to reduce the configuration cost of the laser system. For chamfering height and glass substrate thickness that are much different, the chamfering process can be performed by the laser galvanometer scanning system first, and then the Bezier beam cutting process can be performed to improve processing efficiency. Because the glass substrate has sufficient margin and the chamfering process is performed by the laser galvanometer scanning system first, the chipping phenomenon caused by the existence of sharp corner structures during chamfering is avoided, thus effectively solving the chipping problem.

[0056] For processing thicker glass substrates, to improve processing efficiency, the Bessel beam is used for cutting. By scientifically and rationally planning the sequence of Bessel beam 3 processing and laser galvanometer scanning system 1 processing, the laser galvanometer scanning system 1 first uses a layer-by-layer scanning method to form the chamfered surface 21 on the glass substrate 2. The heating process of the glass is placed before the Bessel beam 3 processing. Because there are no stress concentration areas within the glass substrate 2 during laser galvanometer scanning system 1 processing, the possibility of edge chipping or cracking of the glass substrate 2 is greatly reduced, even during instantaneous heating. Then, the Bessel beam 3 processing is used to cut the finished area 23. Completely separated from the waste area 24, microcracks are generated on the thickness side surface of the glass substrate 2 along the root of the chamfered forming surface 21. Since the Bessel beam is a laser beam generated by long-distance interference, it allows energy to be concentrated and propagated inside the transparent material without diffraction. The Bessel beam generated by beam shaping allows for deep ablation of the irradiated material, which is particularly useful for forming nanochannels with high aspect ratio. Therefore, the Bessel beam is used to act on the glass substrate 2 to form microcracks on the set path to separate the finished product area 23 and the waste area 24. Finally, the dicing process is used to completely separate the finished product area 23 and the waste area 24, effectively reducing the occurrence of edge chipping.

[0057] For single-sided chamfering of glass substrate 2, laser galvanometer scanning system 1 can start processing from the first surface (i.e., the upper surface) of glass substrate 2, while Bessel beam processing can enter the glass substrate 2 from the second surface (i.e., the lower surface). The angle between the Bessel beam and the second surface can be set according to the side profile structure of the product design. If the side profile corresponds to the vertical surface of the separation cutting surface 25, the Bessel beam 3 is incident perpendicular to the second surface; if it is an inclined surface, the Bessel beam 3 is incident at an angle to the second surface, and the Bessel beam 3 is coplanar with the designed profile surface. Since the second surface is a smooth plane rather than a rough surface, the Bessel beam can enter the interior of the glass substrate 2 along a stable and pre-set path to complete the set cutting line.

[0058] In other embodiments, the Bessel beam cutting process can also be incident from the first surface of the glass substrate 2, and the intersection point of the Bessel beam 3 and the first surface is the incident point A. The incident point A is located in the waste area 24 area, rather than in the non-scanning processing groove 22, and the transmission path of the Bessel beam 3 inside the glass substrate 2 completely avoids the scanning processing groove 22 area.

[0059] For the double-sided chamfering of the glass substrate 2, the laser galvanometer scanning system 1 can simultaneously process the chamfered surfaces 21 from the first surface and the second surface, or sequentially process the chamfered surfaces 21 from the first surface and the second surface, or sequentially process the chamfered surfaces 21 from the second surface and the first surface. Then, the Bessel beam cutting process can selectively enter from either the first surface or the second surface. However, regardless of whether the first surface or the second surface forms the incident surface, the incident point A formed by the intersection of the Bessel beam 3 and the incident surface must be located within the waste area 24, not within the scanning processing groove 22. Furthermore, when the Bessel beam 3 enters the glass substrate 2 to form the chamfered surfaces 21, it completely avoids the scanning processing groove 22 area. In the finished part with double-sided chamfers, the upper and lower chamfered surfaces 21 are connected together by a separating cutting surface 25.

[0060] The chamfered scanning line group acts within the thickness range of the glass substrate 2, forming not only a chamfered surface 21 but also a processing boundary surface 26. The chamfered surface 21 and the processing boundary surface 26 together form a scanning processing groove 22. The processing boundary surface 26 corresponding to the incident side of the Bessel beam 3 is located between the chamfered surface 21 and the separation cutting surface 25, thereby ensuring that the Bessel beam 3 can effectively enter the interior of the glass substrate 2 and form a separation cutting surface 25 that meets the requirements.

[0061] The existing technology, patent publication number CN111362570B, uses an ultrafast laser to process V-grooves on the cutting line to complete the chamfering structure. If the chamfering structure is completed by processing V-grooves first, and then the Bessel beam is used for cutting and separation, it can be achieved for single-sided chamfering of glass, but it cannot be achieved for double-sided chamfering of glass. Due to the existence of the V-shaped processing groove, the Bessel beam can only enter from the processing groove area. The side wall surface of the processing groove is the processing surface, which is a rough surface structure. When the Bessel beam enters the glass substrate 2 from the processing groove area or passes through the processing surface after entering the glass substrate 2, the beam energy will be greatly attenuated, thus failing to achieve effective micro-crack cutting, resulting in the inability to perform normal slicing and thus causing processing failure.

[0062] The angle between the processing boundary surface 26 on the incident side of the Bessel beam 3 and the chamfered surface 21 can be flexibly designed according to the separation cutting surface 25. However, it must be between the chamfered surface 21 and the extended plane of the separation cutting surface 25 so that the incident point of the Bessel beam 3 hits the smooth surface area of ​​the glass substrate 2, thereby ensuring that the Bessel beam 3 can form a microcrack cutting line inside the glass substrate 2. The angle between the processing boundary surface 26 on the opposite side of the incident side of the Bessel beam 3 and the chamfered surface 21 is not limited. A V-groove structure can be formed. The processing boundary surface 26 can also be a vertical surface structure, or it can be oblique to the chamfered surface 21 at an acute angle to the vertical surface.

[0063] This embodiment also provides a glass product prepared using the above-described glass processing method.

[0064] The above descriptions are merely some embodiments of the present invention. Those skilled in the art can make various modifications and improvements without departing from the inventive concept of the present invention, and these all fall within the scope of protection of the present invention.

Claims

1. A glass processing method, characterized in that: It includes the following steps: S1. Provide a glass substrate, wherein the glass substrate has a set dimensional margin based on the finished product size; S2. Galvanometer Scanning Chamfering: A chamfered surface is etched layer by layer on a glass substrate according to the product design contour using a laser galvanometer scanning system; the set dimensional allowance ensures that the glass substrate will not experience edge chipping during the galvanometer scanning chamfering process; and includes: First, the first horizontal layer is scanned, and then the next horizontal layer is scanned until the chamfer depth of the product is reached, completing the last horizontal layer. The scan points of the same horizontal layer form a scan line, and the scan lines of all horizontal layers form a chamfer scan line group. The scan lines in the chamfer scan line group follow the shape contour surface formed and the product design contour. The size of the shape contour surface gradually increases with the chamfering depth. The chamfer scan line group acts within the thickness range of the glass substrate to form the chamfering surface and to form scanning grooves on the glass substrate surface. S3. Cutting process: Using a Bessel beam or the laser galvanometer scanning system, a separation cutting surface adjacent to the chamfered surface is formed within the thickness range of the glass substrate. The separation cutting surface is consistent with the product design requirements. The surface of the glass substrate is divided into a finished product area and a waste area by the scanning processing grooves; the separation cutting surface completely separates the finished product area and the waste area; The glass substrate has opposing first and second surfaces; when the separation cut surface is formed using a Bezier beam during the cutting process, the galvanometer scanning chamfering and the cutting process are performed in one of the following ways: Method 1: In the galvanometer scanning chamfering process, the laser galvanometer scanning system starts processing from the first surface of the glass substrate; in the Bessel beam cutting process, the Bessel beam enters the glass substrate from the second surface of the glass substrate. Method 2: In the galvanometer scanning chamfering process, the laser galvanometer scanning system starts processing from the first surface of the glass substrate; in the Bessel beam cutting process, the Bessel beam of the Bessel beam cutting process is incident from the first surface of the glass substrate. Method 3: The laser galvanometer scanning system simultaneously processes the chamfered surfaces from the first surface and the second surface, or sequentially processes the chamfered surfaces from the first surface and the second surface, or sequentially processes the chamfered surfaces from the second surface and the first surface; then the Bessel beam cutting process selectively enters from the first surface or from the second surface; When the Bessel beam uses the first surface or the second surface as the incident surface, the intersection of the Bessel beam and the incident surface forms an incident point A. The incident point A is located within the waste area, and the transmission path of the Bessel beam inside the glass substrate completely avoids the scanning processing groove area.

2. The glass processing method as described in claim 1, characterized in that: The chamfered scanning line group acts within the thickness range of the glass substrate and also forms a processing boundary surface. The chamfered forming surface and the processing boundary surface together form the scanning processing groove.

3. The glass processing method as described in claim 2, characterized in that: The processing boundary surface corresponding to the incident side of the Bessel beam is located between the chamfering surface and the extension plane of the separation cutting surface.

4. The glass processing method as described in claim 1, characterized in that: The inclination angle and length of the chamfered surface are consistent with the product design requirements.

5. The glass processing method as described in claim 1, characterized in that: In glass articles with double-sided chamfers, the upper and lower chamfered surfaces are connected together by the separating cut surfaces.

6. The glass processing method as described in claim 1, characterized in that: The glass processing method also includes: S4, glass breakage and demolding.

7. A glass article, characterized in that: It is prepared by the glass processing method as described in any one of claims 1 to 6.

Images