A test fixture and method of operating the same

Abstract

The application provides a test fixture and an operating method thereof. The test fixture can guide the bracket assembly to be pressed towards the base assembly by operating the assembly, so that the bracket assembly drives the lead-out plate to move towards the base assembly until the lead-out plate is at the same horizontal height as the test bottom plate on the base assembly, the test needles are aligned, and a rectangular slot adapted to the half-hole module to be tested is formed. Then, the half-hole module can be directly pressed into the rectangular slot formed by the test needles for clamping before testing. Finally, when the testing of the half-hole module is completed, the bracket assembly can be pulled upwards by operating the assembly, so that the lead-out plate and the half-hole module on the bracket assembly are vertically lifted at the same time, the half-hole module is stabilized, the test needles on the two sides of the test bottom plate are staggered and spaced, the half-hole module is taken out from the test needles on the lead-out plate along the space part of the half-hole module, and the testing and taking of the half-hole module are completed.

Description

Technical Field

[0001] This invention relates to the field of circuit module testing technology, and in particular to a test fixture and its operating method. Background Technology

[0002] A circuit module, also called an integrated circuit (IC), is a miniature electronic device or component. Using specific processes, transistors, diodes, resistors, capacitors, inductors, and other components required for a circuit, along with their interconnections, are fabricated on one or several small pieces of semiconductor wafers or dielectric substrates. These are then packaged in a housing, forming a miniature structure with the desired circuit function; hence the name integrated module. All components are structurally integrated into a single unit, significantly reducing the overall circuit size and the number of leads and solder joints. This represents a major step forward in the miniaturization, low power consumption, and high reliability of electronic components.

[0003] Half-hole modules are a type of circuit module, typically with signal leads on two or four sides. Since half-hole modules do not have signal lead connectors, they cannot be held by ordinary test fixtures. In order to achieve testing, a fixture (tooling) designed with special test probes for half-hole pads is usually used.

[0004] Currently, the fixtures used to clamp the semi-hole modules have signal ports on all four sides, resulting in the semi-hole modules being in close contact with the signal ports. Furthermore, the limitation imposed by the signal ports on the semi-hole modules makes it inconvenient to pick up and put down the semi-hole modules on the fixture. Therefore, it is of great significance to design a fixture that can both effectively clamp and test the four-sided semi-hole modules and facilitate easy pick-up and put-down operations. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a test fixture and its operation method to solve the problem that the fixtures currently used to clamp half-hole modules in the prior art are prone to causing inconvenience in picking up and putting down the half-hole modules.

[0006] According to an embodiment of the present invention, a test fixture is used to fix a half-hole module. The test fixture includes a base assembly, a bracket assembly movably connected to the base assembly, a test base plate sleeved on the edge of the bracket assembly and fixedly connected to the top of the base assembly, and lead-out plates fixedly connected to both sides of the top of the bracket assembly. Multiple test pins are welded to both the test base plate and the lead-out plates. The test pins on the test base plate and the test pins on the lead-out plates form an accommodating space for accommodating the half-hole module. The test pins abut against the edge of the half-hole module. Operating components are embedded on both sides of the bracket assembly near the lead-out plates.

[0007] Specifically, by pulling up the operating component, the bracket assembly is moved towards and away from the base assembly, so that the half-hole module on the bracket assembly, which is abutted by the two lead-out plates, moves accordingly and is offset from the test base plate.

[0008] Furthermore, the test probe is Q-shaped and includes an outwardly protruding part that abuts against the edge of the half-hole module on one side, an arc-shaped part that extends outward from the bottom of the outwardly protruding part, and a support part that extends outward from the top of the outwardly protruding part.

[0009] Furthermore, the base assembly includes a base plate at the bottom end, mounting portions extending vertically upward along the four corners of the base plate for supporting the test base plate, and positioning pins extending vertically upward along the middle of the base plate.

[0010] Furthermore, a U-shaped groove is provided between the two mounting portions on the wide side of the base plate, and a portion of the operating components are placed in the U-shaped groove.

[0011] Furthermore, a slot is provided between the two mounting portions on the wide side of the base plate to accommodate the bracket assembly. The slot engages with the locating pin to allow the bracket assembly to move along the vertical trajectory of the slot and the locating pin.

[0012] Furthermore, the bracket assembly includes a support portion embedded between the two mounting portions on the wide side of the base plate, an operating portion extending outward from both ends of the support portion, and a support platform extending outward from the middle of the support portion. The middle of the support portion also has a positioning hole adapted to the positioning pin, and a portion of the operating components are embedded in the operating portion.

[0013] Furthermore, the test base plate includes a fixing plate, the fixing plate has a receiving groove in the middle for accommodating the bracket assembly, and the fixing plate also has a plurality of test pin holes for accommodating the test pins near the receiving groove on both sides, the test pins are partially embedded in the test pin holes and welded and fixed to the test pin holes.

[0014] Furthermore, the operating component includes a screw partially embedded in the bracket assembly, a spring fixed to the bottom end of the screw, a first steel ball fixed to the end of the spring away from the screw, top pins disposed on both sides of the first steel ball, and a second steel ball disposed on the side of the top pin away from the first steel ball. The screw drives the spring and the first steel ball to move closer to and further away from the position between the two top pins, thereby driving the two top pins and the second steel ball to move closer to and further away from the U-shaped groove.

[0015] Furthermore, both the test base plate and the lead-out plate are provided with power-on pins.

[0016] A test fixture operation method according to an embodiment of the present invention is used to operate the test fixture described in the present invention, the method comprising:

[0017] The drive bracket assembly is pressed down toward the base assembly, so that the bottom surface of the bracket assembly contacts the base plate on the base assembly, and it is checked whether the test pins on the lead-out plate of the bracket assembly and the test pins on the test base plate of the base assembly are at the same level after the pressure is applied.

[0018] If so, place the half-hole module to be tested between the test pins of the lead-out board and the test pins of the test base plate;

[0019] Connect the power-on pins on the test base plate and the lead-out plate respectively to perform a power-on test on the half-hole module under test;

[0020] After the test is completed, the power is turned off, and the drive bracket assembly rises away from the base assembly, so that the bracket assembly takes out the half-hole module and separates it from the test pin on the test base plate. The half-hole module is then removed along the point where it separates from the test pin on the test base plate.

[0021] Compared with existing technologies, this invention proposes a test fixture and its operating method. The operator can guide the bracket assembly downwards towards the base assembly using the operating components. This causes the bracket assembly to move the lead-out plate towards the base assembly simultaneously until the lead-out plate is at the same horizontal height as the test base plate on the base assembly. Simultaneously, it ensures that the test pins on the lead-out plate are aligned with the test pins on the test base plate, forming a rectangular groove that fits the half-hole module being tested. The operator can then directly press the half-hole module into the rectangular groove formed by the test pins for pre-test clamping. Finally, after the half-hole module testing is completed, the operator can guide the bracket assembly using the operating components. Pull upwards to simultaneously raise the lead-out plate and the half-hole module on the drive bracket assembly vertically, ensuring the stability of the half-hole module and disengaging it from the test pins on both sides of the test base plate. This allows the operator to remove the half-hole module from the test pins on the lead-out plate along the disengaged portion, completing the testing and placement of the half-hole module. This solves the problem of current clamps for securing half-hole modules, where the signal ports on all four sides of the half-hole module cause it to be in close contact with the surrounding signal ports, resulting in inconvenience in handling the module. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the test fixture and half-hole module in the first embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the base assembly in the test fixture according to the first embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the bracket assembly, lead-out plate, and half-hole module in the test fixture of the first embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the bracket assembly in the test fixture of the first embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the test base plate in the test fixture in the first embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the structure of the operating component in the test fixture in the first embodiment of the present invention;

[0028] Figure 7 This is a partial structural diagram of the test pin, test base plate, and half-hole module in the test fixture of the second embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the structure of the test pin in the test fixture in the second embodiment of the present invention;

[0030] Figure 9 This is a flowchart illustrating the test fixture operation method in the third embodiment of the present invention.

[0031] Explanation of key component symbols:

[0032] Base assembly 1 First steel ball 33 base plate 11 Top pin 34 Installation Department 12 Second steel ball 35 Positioning pin 13 Test base plate 4 U-shaped groove 14 Fixed plate 41 Bracket assembly 2 Test pinhole 42 Operations Department 21 Container slot 43 Bearing section 22 Lead-out plate 5 positioning holes 23 test needle 6 support platform 24 Outer convex part 61 Operation Components 3 curved part 62 screw 31 Support section 63 spring 32 Half-hole module 7

[0033] The following detailed description of the embodiments will further illustrate the present invention in conjunction with the above-described accompanying drawings. Detailed Implementation

[0034] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of the invention are illustrated in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0036] Example 1

[0037] Please see Figures 1 to 6The image shows a test fixture in the first embodiment of the present invention, used to fix the half-hole module 7. The test fixture includes a base assembly 1, a bracket assembly 2 movably connected to the base assembly 1, a test base plate 4 sleeved on the edge of the bracket assembly 2 and fixedly connected to the top of the base assembly 1, and lead-out plates 5 fixedly connected to both sides of the top of the bracket assembly 2. The position design of the lead-out plates 5 can be referred to the appendix of the specification. Figure 3 As shown, multiple test pins 6 are welded on both the test base plate 4 and the lead-out plate 5. The test pins 6 on the test base plate 4 and the test pins 6 on the lead-out plate 5 form a space for accommodating the half-hole module 7. The test pins 6 abut against the edge of the half-hole module 7. The bracket assembly 2 is embedded with operating components 3 near the two sides of the lead-out plate 5. By pulling up the operating components 3, the bracket assembly 2 is moved towards and away from the base assembly 1, so that the half-hole module 7 on the bracket assembly 2, which abuts against the two lead-out plates 5, moves accordingly and is offset from the test base plate 4.

[0038] Furthermore, the base assembly 1 includes a base plate 11 at the bottom end, mounting portions 12 extending vertically upward from the four corners of the base plate 11 to support the test base plate 4, and a positioning pin 13 extending vertically upward from the middle of the base plate 11. A U-shaped groove 14 is formed between the two mounting portions 12 on the wide side of the base plate 11, and a portion of the operating component 3 is placed in the U-shaped groove 14. A slot for accommodating the bracket assembly 2 is provided between the two mounting portions 12 on the wide side of the base plate 11. The slot engages with the positioning pin 13 to allow the bracket assembly 2 to move along the vertical trajectory of the slot and the positioning pin 13. The bracket assembly 2 includes a support portion 22 embedded between the two mounting portions 12 on the wide side of the base plate 11, an operating portion 21 extending outward from both ends of the support portion 22, and a positioning pin 13 extending outward from the middle of the support portion 22. The extended support platform 24 has a positioning hole 23 through the middle of the support part 22, which is adapted to the positioning pin 13. The operation part 21 is embedded with some operation components 3. The test base plate 4 includes a fixing plate 41. The fixing plate 41 has a receiving groove 43 in the middle for accommodating the bracket assembly 2. The fixing plate 41 also has multiple test pin holes 42 for accommodating test pins 6 near the receiving groove 43 on both sides. In addition, the lead-out plate 5 also has multiple pin holes for accommodating test pins 6. The test pins 6 are partially embedded in the test pin holes 42 or the pin holes on the lead-out plate 5 and are fixed by welding. It should be noted that the periphery of the half-hole module 7 has multiple fitting grooves adapted to the test pins 6. When welding the test pins 6 to the test base plate 4 and the lead-out plate 5 respectively, the fitting grooves can be adjusted according to the current situation. The design of the adapter slots around the edge of the front half-hole module 7 ensures the installation gap between each test pin 6, thereby ensuring accurate subsequent testing. In some optional embodiments, to ensure the adaptability of the half-hole module 7, the spacing of the adapter slots around the edge of different sizes of half-hole modules 7 in the industry can be uniformly designed. Alternatively, the installation position of the test pin 6 on the test base plate 4 and the lead-out plate 5 can be adjusted relative to the spacing of the adapter slots opened around the edge of the current half-hole module 7. The adapter slot is a signal lead-out terminal that snaps into the test pin 6, and the signal leads are conductive to the test pin 6. In addition, the half-hole modules 7 in the industry can be of different sizes. The test base plate 4 and the lead-out plate 5 used for testing the corresponding sizes of half-hole modules 7 must be compatible with the size of the half-hole module 7. For example, if the half-hole module 7 is a square plate with a side length of 20cm, the position of the lead-out plate 5 on the bracket assembly 2 needs to be adjusted so that the distance between the two lead-out plates 5 is adjusted to 20cm. The corresponding test base plate 4 needs to be selected with a 20cm wide receiving groove 43 for installation and use with the base assembly 1. The operating component 3 includes a screw 31 partially embedded in the bracket assembly 2, a spring 32 fixed to the bottom end of the screw 31, a first steel ball 33 fixed to the end of the spring 32 away from the screw 31, top pins 34 set on both sides of the first steel ball 33, and a second steel ball 35 set on the side of the top pin 34 away from the first steel ball 33. The screw 31 drives the spring 32 and the first steel ball 33 to move towards and away from the position between the two top pins 34.This allows the two top pins 34 and the second steel ball 35 to move towards and away from the U-shaped groove 14. Both the test base plate 4 and the lead-out plate 5 are equipped with power-on pins. It should be noted that the lead-out plate 5 has a power pin located at the top center (as per the attached manual). Figure 3 As shown), the electrical pins on the test base plate 4 adopt the same electrical pin structure as those on the lead-out plate 5, and are located at the bottom of the base assembly 1 near the test pin 6. In some optional embodiments, the medium for conducting external current on the test base plate 4 and the lead-out plate 5 can also be a wire and plug design. During operation, simply connect the wire plug to the external circuit board to energize the test pin 6 on the test base plate 4 and the lead-out plate 5, which is convenient to operate.

[0039] In practice, the operator first selects the appropriate test base plate 4 and lead-out plate 5 according to the size of the half-hole module 7 being tested. The test base plate 4 is then installed on the base assembly 1, and the lead-out plate 5 is installed on the bracket assembly 2. Next, the bracket assembly 2 with the lead-out plate 5 installed is placed into the slot between the two mounting parts 12 on the wide side of the base assembly 1, ensuring that the positioning hole 23 on the bracket assembly 2 is aligned with the positioning pin 13 on the base assembly 1. The bracket assembly 2 is stably placed inside the base assembly 1. After the bottom end of the bracket assembly 2 contacts the base plate 11, the operator can rotate the screw 31 on the operating component 3 clockwise. The threaded part of the screw 31 is threaded into the operating part 21, so that the screw 31 moves in the direction of being embedded in the operating part 21, thereby screwing the screw 31 into the operating part 21. At the same time, the screw can push the spring 32 and the first steel ball 33 at its bottom end to move between the two top pins 34 set at the bottom (as per the instruction manual). Figure 6 As shown in the diagram, it should be noted that through holes adapted to the outer diameter of the top pins 34 are provided on both sides of the operating part 21. This allows the tension generated between the two top pins 34 after being pressed to be restricted by the through holes, so that the top pins 34 can move along the diameter of the through holes. This allows the top pins 34 to push the second steel ball 35, which is away from the first steel ball 33, out of the operating part 21 (as shown in the attached manual). Figure 4 (as shown) and pressed against and clamped against the U-shaped groove 14 (as per the instruction manual). Figure 2As shown, to achieve the effect of stabilizing the bracket assembly 2 in the base assembly 1, in some optional embodiments of the present invention, a PU material pad or a rubber material wrapped around the surface of the second steel ball 35 can also be provided in the U-shaped groove 14 to increase the friction between the second steel ball 35 and the U-shaped groove 14. While not restricting the subsequent movement of the bracket assembly 2 in the base assembly 1, it also ensures that the bracket assembly 2 maintains a stable relationship with the base assembly 1 after moving to the designated position on the base assembly 1. At the same time, the design of the test base plate 4 located at the top of the U-shaped groove 14 can prevent the bracket assembly 2 from easily falling off when it moves vertically on the base assembly 1. The operator can then use the hand screw 31 to drive the bracket assembly 2 to move up and down on the base assembly 1 to complete the picking and putting of the semi-hole module 7 before and after the subsequent test.

[0040] More specifically, before testing the half-hole module 7, the operator can use the hand screw 31 to press the bracket assembly 2 down to the contact point between its bottom end and the base plate 11 on the base assembly 1, so that the lead plate 5 falls down to be flush with the test base plate 4, ensuring that the test pins 6 on the test base plate 4 and the lead plate 5 are at the same horizontal position. Then, the operator can press the half-hole module 7 to be tested into the rectangular space formed by the test pins 6, ensuring that the test pins 6 correspond sequentially to the adapter slots around the edge of the half-hole module 7, and confirming that the front and back of the half-hole module 7 correspond to the required test positions. Then, the electrical pins on the test base plate 4 and the lead plate 5 are energized to begin the test. After testing the half-hole module 7, the operator can first disconnect the power supply and then pull up the bracket assembly 2 by holding the screw 31 on the operating component 3. The half-hole module 7 can then be lifted up through the bracket assembly 2. It should be noted that the lead plate 5, while making conductive contact with the half-hole module 7, also serves to support the half-hole module 7. The bracket assembly 2 drives the half-hole module 7 to rise vertically, ensuring the stability of the half-hole module 7 and simultaneously disengaging the half-hole module 7 from the test pins 6 on both sides of the test base plate 4, thus freeing up space. Afterward, the operator can remove the half-hole module 7 from the test pins 6 on the lead plate 5 along the freed-up portion of the half-hole module 7, completing the testing and placement of the half-hole module 7.

[0041] In summary, the operator can guide the bracket assembly 2 towards the base assembly 1 using the operating component 3, causing the bracket assembly 2 to move the lead-out plate 5 towards the base assembly 1 simultaneously, until the lead-out plate 5 is at the same horizontal height as the test base plate 4 on the base assembly 1. Simultaneously, ensure that the test pins 6 on the lead-out plate 5 are flush with the test pins 6 on the test base plate 4, forming a rectangular groove that fits the half-hole module 7 to be tested. The operator can then directly press the half-hole module 7 into the rectangular groove formed by the test pins 6 for pre-test clamping. Finally, after the half-hole module 7 has been tested, the operator can guide the bracket assembly 2 upwards using the operating component 3, causing the bracket assembly 2 to move towards the base assembly 1. The lead-out plate 5 and the half-hole module 7 on the frame assembly 2 rise vertically simultaneously, ensuring the stability of the half-hole module 7 and disengaging it from the test pins 6 on both sides of the test base plate 4, thus freeing it up. Afterwards, the operator can remove the half-hole module 7 from the test pins 6 on the lead-out plate 5 along the freed-up part of the half-hole module 7, completing the test and placement of the half-hole module 7. This solves the problem that the current clamps used to clamp the half-hole module have signal ports on all four sides, causing the half-hole module to be in close contact with the signal ports on all four sides. Furthermore, the signal ports limit the movement of the half-hole module on all four sides, making it inconvenient to pick up and place the half-hole module on the clamp.

[0042] Example 2

[0043] Please see Figure 7 and Figure 8 The image shows a test fixture in the second embodiment of the present invention. The test needle 6 is Q-shaped and includes an outward protrusion 61 that abuts against the edge of the half-hole module 7 on one side, an arc-shaped portion 62 that extends outward from the bottom of the outward protrusion 61, and a support portion 63 that extends outward from the top of the outward protrusion 61.

[0044] First, the operator can sequentially weld multiple test pins 6 into the test pin holes 42 opened on the test base plate 4 and the lead-out plate 5. It should be noted that the test pin holes 42 are divided into two parts: a round hole and an oblong hole. The round hole is used to accommodate the vertically downward part of the support part 63, and the oblong hole is used to accommodate the arc-shaped part 62 and the outward protrusion 61 near the arc-shaped part 62. To further explain, the support part 63 is inserted along the top of the round hole and passes through the bottom of the round hole. The operator can weld and fix the round hole and the part through which the support part 63 passes. The corresponding outward protrusion 61 and arc-shaped part 62 are also embedded in the oblong hole. The oblong hole also has a space for the outward protrusion 61 and arc-shaped part 62 to move. The operator can sequentially weld the test pins 6 onto the test base plate 4 and the lead-out plate 5 according to the above operation method.

[0045] In practical implementation, when the operator inserts the semi-hole module 7 into the rectangular space formed by the test needle 6, the oblong hole provides movable space for the protruding part 61 and the arc-shaped part 62. Therefore, after being squeezed by the semi-hole module 7, the protruding part 61 causes the arc-shaped part 62 to bend and deform away from the semi-hole module 7. At the same time, the arc-shaped part 62 will abut against the inner wall of the oblong hole on the side away from the semi-hole module 7, so that the arc-shaped part 62 forms a support point after contacting the inner wall of the other end of the oblong hole. When the pressure applied by the semi-hole module 7 is large, the circular... The portion of the arc 62 that contacts the oblong hole can also deform, generating a certain tension. This tension is fed back from the arc 62 to the convex portion 61, applying a reverse elastic pressure to the half-hole module 7. This further enhances the support strength of the convex portion 61 for the half-hole module 7, ensuring structural stability. It should be noted that this degree of deformation is within the deformable range of the convex portion 61 and the arc 62. Understandably, when the half-hole module 7 is removed, the test pin 6 will spring back to its initial installation state, retaining a certain elastic pressure to ensure the stability of the half-hole module. The stability of module 7 in contact with test needle 6 is improved. Furthermore, existing test needle designs typically lack a support portion 63 or employ the same welding method as the support portion 63 at the bottom of the protruding part 61. In cases where the support portion 63 is missing, the protruding part 61 deforms under the pressure of the semi-hole module 7. This lack of support at the other end of the protruding part 61 leads to instability in the clamping mechanism or, during use, the deformation range exceeds the deformable range of the protruding part 61, causing it to fail to spring back after detaching from the semi-hole module 7. Welding both the protruding part 61 and the support portion 63 increases the assembly difficulty of the test needle. Secondly, the high structural strength of the protruding part 61, due to its fixed ends, makes it prone to damage to the semi-hole module 7 or prevents the semi-hole module 7 from engaging the test needle 6 when clamped against it. The test needle 6 design in this embodiment effectively solves these shortcomings of existing test needles, exhibiting strong elasticity and high reliability.

[0046] Example 3

[0047] Please see Figure 9 The figure shows a test fixture operation method in the second embodiment of the present invention, which specifically includes steps S01-S04.

[0048] Step S01: Drive the bracket assembly to press down toward the base assembly, so that the bottom surface of the bracket assembly contacts the base plate on the base assembly, and check whether the test pins of the lead-out plate on the bracket assembly and the test pins of the test base plate on the base assembly are at the same level after pressing down. If so, proceed to step S02.

[0049] Step S02: Place the half-hole module to be tested between the test pins of the lead-out board and the test pins of the test base plate.

[0050] In practical implementation, the bracket assembly can be pressed down towards the base assembly by driving a robotic arm, so that the bottom surface of the bracket assembly contacts the base plate on the base assembly. A leveling instrument is then used to check whether the test pins on the lead-out plate of the bracket assembly and the test pins on the test base plate of the base assembly are at the same level after pressing down. If they are, another robotic arm is used to place the half-hole module to be tested between the test pins on the lead-out plate and the test base plate. If not, the bracket assembly can be lifted up by driving the robotic arm and then pressed down again. It should be noted that in the initial design of the bracket assembly and base assembly, when the bottom end of the bracket assembly is in complete contact with the base assembly, the test pins on the lead-out plate of the bracket assembly and the test pins on the test base plate of the base assembly are at the same level. The difference in the level of the test pins may be due to uneven downward pressure from the robotic arm on the bracket assembly, resulting in an angle difference between the bracket assembly and the base assembly. Therefore, simply lifting the bracket assembly with the robotic arm and then pressing it down again can solve the above problem.

[0051] Step S03: Connect the power-on pins on the test base plate and the lead-out plate respectively to perform a power-on test on the half-hole module under test.

[0052] Step S04: After the test is completed, the power is turned off, and the drive bracket assembly is raised away from the base assembly, so that the bracket assembly takes out the half-hole module and disengages from the test pin on the test base plate. The half-hole module is then removed along the point where it disengages from the test pin on the test base plate.

[0053] In practice, after the test is completed, the test setter is determined. The robotic arm can be driven again to lift the bracket assembly away from the base assembly, so that the bracket assembly takes out the half-hole module and separates it from the test pin on the test base plate. Then, another robotic arm is inserted along the part where the half-hole module is separated from the test pin on the test base plate and lifted vertically to remove the half-hole module from the test pin.

[0054] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A test fixture for fixing a half-hole module, characterized in that, The test fixture includes a base assembly, a bracket assembly movably connected to the base assembly, a test base plate sleeved on the edge of the bracket assembly and fixedly connected to the top of the base assembly, and lead-out plates fixedly connected to both sides of the top of the bracket assembly. Multiple test pins are welded to both the test base plate and the lead-out plates. The test pins on the test base plate and the test pins on the lead-out plates form an accommodating space for accommodating the half-hole module. The test pins abut against the edge of the half-hole module. Operating components are embedded on both sides of the bracket assembly near the lead-out plates. Specifically, by pulling up the operating component, the bracket assembly is moved towards and away from the base assembly, so that the half-hole module on the bracket assembly, which is abutted by the two lead-out plates, moves accordingly and is offset from the test base plate.

2. The test fixture according to claim 1, characterized in that, The test probe is Q-shaped and includes an outwardly protruding part that abuts against the edge of the half-hole module on one side, an arc-shaped part that extends outward from the bottom of the outwardly protruding part, and a support part that extends outward from the top of the outwardly protruding part.

3. The test fixture according to claim 1, characterized in that, The base assembly includes a base plate at the bottom end, mounting portions extending vertically upward from the four corners of the base plate to support the test base plate, and positioning pins extending vertically upward from the center of the base plate.

4. The test fixture according to claim 3, characterized in that, A U-shaped groove is provided between the two mounting portions on the wide side of the base plate, and a portion of the operating components are placed in the U-shaped groove.

5. The test fixture according to claim 4, characterized in that, A slot is provided between the two mounting portions on the long side of the base plate to accommodate the bracket assembly. The slot engages with the positioning pin to allow the bracket assembly to move along the vertical trajectory of the slot and the positioning pin.

6. The test fixture according to claim 5, characterized in that, The bracket assembly includes a support portion embedded between the two mounting portions on the long side of the base plate, an operating portion extending outward from both ends of the support portion, and a support platform extending outward from the middle of the support portion. The middle of the support portion also has a positioning hole adapted to the positioning pin. A portion of the operating components are embedded in the operating portion.

7. The test fixture according to claim 1, characterized in that, The test base plate includes a fixing plate. The fixing plate has a receiving groove in the middle for accommodating the bracket assembly. The fixing plate also has a plurality of test pin holes near the receiving groove on both sides for accommodating the test pins. The test pins are partially embedded in the test pin holes and welded to the test pin holes for fixation.

8. The test fixture according to claim 4, characterized in that, The operating component includes a screw partially embedded in the bracket assembly, a spring fixed to the bottom end of the screw, a first steel ball fixed to the end of the spring away from the screw, top pins disposed on both sides of the first steel ball, and a second steel ball disposed on the side of the top pin away from the first steel ball. The screw drives the spring and the first steel ball to move closer to and further away from the position between the two top pins, thereby driving the two top pins and the second steel ball to move closer to and further away from the U-shaped groove.

9. The test fixture according to claim 1, characterized in that, Both the test base plate and the lead-out plate are equipped with power-on pins.

10. A method for operating a test fixture, characterized in that, The method for operating the test fixture according to any one of claims 1 to 9 includes: The drive bracket assembly is pressed down toward the base assembly, so that the bottom surface of the bracket assembly contacts the base plate on the base assembly, and it is checked whether the test pins on the lead-out plate of the bracket assembly and the test pins on the test base plate of the base assembly are at the same level after the pressure is applied. If so, place the half-hole module to be tested between the test pins of the lead-out board and the test pins of the test base plate; Connect the power-on pins on the test base plate and the lead-out plate respectively to perform a power-on test on the half-hole module under test; After the test is completed, the power is turned off, and the drive bracket assembly rises away from the base assembly, so that the bracket assembly takes out the half-hole module and separates it from the test pin on the test base plate. The half-hole module is then removed along the point where it separates from the test pin on the test base plate.

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