Method of forming an oxidation resistant layer on a composite copper foil surface, product, device

Abstract

This invention relates to a method for forming an anti-oxidation layer on the surface of a composite copper foil, comprising the following steps: under vacuum conditions, using a composite copper foil as a substrate and an anti-oxidation metal as an inductively coupled plasma cathode target, the composite copper foil is subjected to inductively coupled plasma ionization treatment to form an anti-oxidation layer on the surface of the composite copper foil. The anti-oxidation layer is an alloy of the anti-oxidation metal and copper. This application provides a method for forming an anti-oxidation layer on the surface of a composite copper foil. Under the condition that the circuit resistance of the composite copper foil is not affected, an anti-oxidation metal is used as an inductively coupled plasma cathode target, and a dense anti-oxidation layer is formed on the surface of the composite copper foil through inductively coupled plasma ionization treatment. Compared with the traditional method that requires acid-base electrolysis to form an anti-oxidation layer, the method provided in this application is simpler, helps to improve production efficiency, reduce production costs, and can reduce the discharge of acid and alkali wastewater, making it environmentally friendly.

Description

Technical Field

[0001] This invention relates to the field of thin film processing technology, and in particular to a method, product, and apparatus for forming an anti-oxidation layer on the surface of composite copper foil. Background Technology

[0002] Copper foil is a key basic material for the negative electrode of lithium batteries. In lithium-ion batteries, it serves as both a carrier of the negative electrode active material and a collector and conductor of negative electrode electrons. As composite copper foil gradually replaces traditional copper foil in the widespread application of lithium batteries, increasingly higher requirements are being placed on the uniformity of the coating on composite copper foil.

[0003] Composite copper foil is typically coated using vacuum magnetron sputtering. Vacuum magnetron sputtering coating refers to filling the vacuum with inert gases such as argon to induce glow discharge. The glow discharge generates charged ions, which are accelerated by an electric field and collide with argon atoms under vacuum conditions, causing them to ionize and generate argon ions and new ions. The argon ions are accelerated by the electric field and the magnetic field on the back of the target material, bombarding the surface of the target material and causing the target atoms to be ejected. At the same time, secondary ions are generated, which then collide with argon atoms to form more argon ions. The argon ions bombard the target material, causing the neutral atoms on the target material to carry enough kinetic energy to fly to the surface of the coating substrate to deposit and form a film layer.

[0004] Composite copper foil without surface treatment after coating often encounters certain humidity and high temperatures during storage, transportation, and subsequent production processes. This easily leads to oxidation and discoloration of the copper foil surface, causing slight changes in its thickness and increasing the resistance of the copper foil circuitry, thus affecting process quality. Therefore, anti-oxidation treatment is often required for the copper foil surface. Conventional copper foil surface treatment often uses acid-base electrolysis to form an anti-oxidation layer with a complex structure, mainly composed of zinc, chromium, and nickel. However, acid-base electrolysis is complex, has a long process flow, requires separate equipment, necessitates adjustments to the electrolysis process based on the different anti-oxidation layers, and requires different electrolytic solutions for different process requirements. The resulting acid and alkaline wastewater also needs separate treatment, resulting in high costs and low efficiency. Summary of the Invention

[0005] Therefore, it is necessary to provide a method, product, or apparatus for forming an anti-oxidation layer on the surface of composite copper foil that can simplify the processing technology.

[0006] One embodiment of this application provides a method for forming an anti-oxidation layer on the surface of a composite copper foil, comprising the following steps:

[0007] Under vacuum conditions, using composite copper foil as the substrate and an anti-oxidation metal as the cathode target of inductively coupled plasma, the composite copper foil is subjected to inductively coupled plasma ionization treatment to form an anti-oxidation layer on the surface of the composite copper foil. The anti-oxidation layer is an alloy of the anti-oxidation metal and copper.

[0008] In one embodiment, the antioxidant metal includes one or more of nickel, zinc, titanium, and chromium.

[0009] In one embodiment, the working gas used for inductively coupled plasma ionization is an inert gas;

[0010] Optionally, the inert gas includes argon or helium.

[0011] In one embodiment, the power supply for inductively coupled plasma ionization is 5KW to 10KW.

[0012] In one embodiment, the inductively coupled plasma ionization process further includes the following steps:

[0013] The composite copper foil is subjected to a cooling treatment to control its surface temperature between 150°C and 200°C.

[0014] In one embodiment, the thickness of the anti-oxidation layer is 10 nm to 20 nm.

[0015] In one embodiment, the composite copper foil has a first surface and a second surface, and the step of performing inductively coupled plasma ionization treatment on the composite copper foil to form an anti-oxidation layer on the surface of the composite copper foil includes:

[0016] First, the first surface of the composite copper foil is subjected to a first inductively coupled plasma ionization treatment to form a first anti-oxidation layer on the first surface of the composite copper foil.

[0017] The second surface of the composite copper foil is then subjected to a second inductively coupled plasma ionization treatment to form a second anti-oxidation layer on the second surface of the composite copper foil.

[0018] An embodiment of this application also provides a composite copper foil processed product, which is obtained by the method for forming an anti-oxidation layer on the surface of the composite copper foil as described in any of the above embodiments.

[0019] An embodiment of this application also provides a composite copper foil surface ionization device, including a vacuum chamber, wherein the vacuum chamber has an unwinding mechanism, a winding mechanism, and an inductively coupled plasma ionization mechanism disposed between the unwinding mechanism and the winding mechanism, wherein the inductively coupled plasma cathode target of the inductively coupled plasma ionization mechanism is selected from an antioxidant metal.

[0020] The composite copper foil is released from the unwinding mechanism, undergoes inductively coupled plasma ionization treatment in the ion replacement region corresponding to the inductively coupled plasma ionization mechanism, and is then wound up by the winding mechanism.

[0021] In one embodiment, an ionization cooling roller is also provided in the ion replacement region. After the composite copper foil is released from the unwinding mechanism, it is first cooled by the ionization cooling roller before being wound up by the winding mechanism.

[0022] In one embodiment, the composite copper foil has a first surface and a second surface, the ionization cooling roller includes a first ionization cooling roller and a second ionization cooling roller, and the inductively coupled plasma ionization mechanism includes a first inductively coupled plasma ionization mechanism and a second inductively coupled plasma ionization mechanism. After being unwound from the unwinding mechanism, the composite copper foil first passes through the first ionization cooling roller, and the first surface of the composite copper foil undergoes a first inductively coupled plasma ionization treatment in the ion replacement region corresponding to the first inductively coupled plasma ionization mechanism. The composite copper foil then passes through the second ionization cooling roller, and the second surface of the composite copper foil undergoes a second inductively coupled plasma ionization treatment in the ion replacement region corresponding to the second inductively coupled plasma ionization mechanism.

[0023] One embodiment of this application also provides a composite copper foil preparation apparatus, including the composite copper foil surface ionization device as described in any of the above embodiments.

[0024] In one embodiment, a magnetron sputtering coating mechanism is further included between the unwinding mechanism and the inductively coupled plasma ionization mechanism, and a partition is provided between the magnetron sputtering coating mechanism and the inductively coupled plasma ionization mechanism;

[0025] The initial substrate is unwound from the unwinding mechanism and coated by the magnetron sputtering coating mechanism to form a composite copper foil. The formed composite copper foil is then subjected to inductively coupled plasma ionization treatment by the inductively coupled plasma ionization mechanism.

[0026] In one embodiment, the magnetron sputtering coating mechanism includes a first coating cooling roller shaft, a second coating cooling roller shaft, a first copper target, and a second copper target. After the initial substrate is unwound from the unwinding mechanism, it first passes through the first coating cooling roller shaft, and the first surface of the initial substrate forms the first surface of the composite copper foil in the sputtering area corresponding to the first copper target. The initial substrate then passes through the second coating cooling roller shaft, and the second surface of the initial substrate forms the second surface of the composite copper foil in the sputtering area corresponding to the second copper target.

[0027] This application provides a method for forming an anti-oxidation layer on the surface of composite copper foil. Using an anti-oxidation metal as the cathode target of inductively coupled plasma, a dense anti-oxidation layer is formed on the surface of the composite copper foil through inductively coupled plasma ionization treatment. Compared with the traditional method that requires acid-base electrolysis to form an anti-oxidation layer, the method provided in this application is simpler, helps to improve production efficiency, reduce production costs, and can reduce the discharge of acid and alkali wastewater, making it green and environmentally friendly. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the composite copper foil preparation apparatus in one embodiment;

[0029] Figure 2 This is a partial structural schematic diagram of the inductively coupled plasma ionization mechanism and the ionization cooling roller shaft in one embodiment;

[0030] Figure 3 This is a schematic diagram of the internal structure of an inductively coupled plasma ionization mechanism in one embodiment.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1: Composite copper foil preparation apparatus; 10: Composite copper foil surface ionization device; 110: Vacuum chamber; 120: Unwinding mechanism; 130: Winding mechanism; 140: Inductively coupled plasma ionization mechanism; 141: Inductively coupled plasma cathode target; 142: Magnetic field; 143: First inductively coupled plasma ionization mechanism; 144: Second inductively coupled plasma ionization mechanism; 150: Gas distribution pipeline; 160: Ionization cooling roller shaft; 161: First ionization cooling roller shaft; 162: Second ionization cooling roller shaft; 20: Composite copper foil; 30: Magnetron sputtering coating mechanism; 310: First coating cooling roller shaft; 320: Second coating cooling roller shaft; 330: First copper target; 340: Second copper target; 40: Barrier; 50: Initial substrate. Detailed Implementation

[0033] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0034] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0039] One embodiment of this application provides a method for forming an anti-oxidation layer on the surface of a composite copper foil, comprising the following steps:

[0040] Under vacuum conditions, composite copper foil is used as the substrate and an anti-oxidation metal is used as the cathode target for inductively coupled plasma. The composite copper foil is subjected to inductively coupled plasma ionization treatment to form an anti-oxidation layer on the surface of the composite copper foil. The anti-oxidation layer is an alloy of anti-oxidation metal and copper.

[0041] This application provides a method for forming an anti-oxidation layer on the surface of composite copper foil. Under the condition that the circuit resistance of the composite copper foil is not affected, an anti-oxidation metal is used as the cathode target of inductively coupled plasma. A dense anti-oxidation layer is formed on the surface of the composite copper foil through inductively coupled plasma ionization treatment. Compared with the traditional method that requires acid-base electrolysis to form an anti-oxidation layer, the method provided in this application is simpler, helps to improve production efficiency, reduce production costs, and can reduce the discharge of acid and alkali wastewater, making it green and environmentally friendly.

[0042] The inductively coupled plasma (ICP) ionization process described in this application refers to applying high-frequency energy from a radio frequency generator to an inductively coupled coil, causing the working gas to ionize and generate charged ions. These charged ions move at high speed under the influence of a high-frequency alternating electromagnetic field, colliding with gas atoms to rapidly and massively ionize them. They then bombard the surface of the composite copper foil and the inductively coupled plasma cathode target, causing the copper on the surface of the composite copper foil and the antioxidant metal in the inductively coupled plasma cathode target to ionize. The copper ions and antioxidant metal ions break free from their bonds and collide and replace each other in the ion replacement region, finally depositing on the surface of the composite copper foil to form an alloy antioxidant layer of antioxidant metal and copper. At the same time, the high temperature generated under the influence of the high-frequency induced current makes the alloy antioxidant layer on the surface of the composite copper foil more dense.

[0043] In one embodiment, the antioxidant metal includes one or more of nickel, zinc, titanium, and chromium.

[0044] In one embodiment, the working gas used for inductively coupled plasma ionization is an inert gas.

[0045] Alternatively, the inert gas may include argon or helium.

[0046] In one embodiment, the power supply for inductively coupled plasma ionization treatment is 5KW to 10KW. It is understood that the power supply for inductively coupled plasma ionization treatment can be adjusted according to the thickness of the anti-oxidation layer, and is not limited to the power supply power described above; other power values ​​may also be used in other embodiments.

[0047] In one embodiment, the inductively coupled plasma ionization process further includes the following steps:

[0048] The composite copper foil undergoes a cooling treatment to control its surface temperature between 150℃ and 200℃. The composite copper foil generates high temperatures under the bombardment of gaseous ions. During the inductively coupled plasma ionization process, the composite copper foil is simultaneously cooled to maintain its surface temperature between 150℃ and 200℃. This high-temperature ionization annealing treatment of the composite copper foil surface prevents its performance from being damaged at high temperatures and makes the protective layer on the surface of the composite copper foil denser.

[0049] In one embodiment, the thickness of the anti-oxidation layer is 10 nm to 20 nm. It is understood that the thickness of the anti-oxidation layer can be determined and adjusted according to process requirements, and is not limited to the thickness described above. In other embodiments, other values ​​for the anti-oxidation layer thickness may also be used.

[0050] In one embodiment, the composite copper foil has a first surface and a second surface. The step of performing inductively coupled plasma ionization treatment on the composite copper foil to form an anti-oxidation layer on the surface of the composite copper foil includes:

[0051] First, the first surface of the composite copper foil is subjected to a first inductively coupled plasma ionization treatment to form a first anti-oxidation layer on the first surface of the composite copper foil;

[0052] The second surface of the composite copper foil is then subjected to a second inductively coupled plasma ionization treatment to form a second anti-oxidation layer on the second surface of the composite copper foil.

[0053] An embodiment of this application also provides a composite copper foil processed product, which is obtained by the method for forming an anti-oxidation layer on the surface of the composite copper foil as described in any of the above embodiments.

[0054] like Figures 1-3 As shown, an embodiment of this application also provides a composite copper foil surface ionization device 10, including a vacuum chamber 110, the vacuum chamber 110 having an unwinding mechanism 120, a winding mechanism 130 and an inductively coupled plasma ionization mechanism 140 disposed between the unwinding mechanism 120 and the winding mechanism 130, wherein the inductively coupled plasma cathode target 141 of the inductively coupled plasma ionization mechanism 140 is selected from an antioxidant metal;

[0055] The composite copper foil 20 is released from the unwinding mechanism 120, undergoes inductively coupled plasma ionization treatment in the ion replacement region corresponding to the inductively coupled plasma ionization mechanism 140, and is then wound up by the winding mechanism 130.

[0056] The aforementioned apparatus includes an inductively coupled plasma ionization mechanism 140. The inductively coupled plasma cathode target 141 of the mechanism 140 is an antioxidant metal. After inductively coupled plasma ionization treatment, the antioxidant metal and the surface of the composite copper foil 20 are ionized and released from their bonds, colliding and undergoing displacement. Finally, an alloy antioxidant layer of antioxidant metal and copper is deposited on the surface of the composite copper foil 20. Using this apparatus to perform inductively coupled plasma ionization treatment on the composite copper foil 20 forms a dense protective layer on its surface. Compared to the traditional acid-base electrolysis process for preparing the antioxidant layer, this method is simpler and more efficient.

[0057] Understandably, the ion replacement region described in this application refers to the area in which the metal atoms on the surface of the antioxidant metal and composite copper foil 20 are bombarded by gas ions, ionized, and released from their bonds, allowing the antioxidant metal ions and copper ions to collide and replace each other. The range of the ion replacement region is related to the width of the inductively coupled plasma cathode target 141. The wider the inductively coupled plasma cathode target 141, the larger the range of the ion replacement region, and vice versa.

[0058] Understandably, in this application, the inductively coupled plasma ionization mechanism 140, except for the specific selection of the material of the inductively coupled plasma cathode target 141, has a conventional structure for inductively coupled plasma ionization devices. For example, the inductively coupled plasma ionization mechanism 140 mainly includes the inductively coupled plasma cathode target 141, a magnetic field 142, and an RF high-frequency power supply (not shown). A gas distribution pipe 150 is provided around the inductively coupled plasma cathode target 141, and inert gas can be introduced into the location of the inductively coupled plasma ionization mechanism 140 through the gas distribution pipe 150.

[0059] In one embodiment, an ionization cooling roller 160 is also provided in the ion exchange region. After the composite copper foil 20 is unwound by the unwinding mechanism 120, it is first cooled by the ionization cooling roller 160 before being wound up by the winding mechanism 130. Inductively coupled plasma ionization generates high temperatures. The ionization cooling roller 160 in the ion exchange region can cool the composite copper foil 20, allowing it to achieve high-temperature ionization annealing of the surface. This results in a denser antioxidant layer structure and ensures that the substrate properties of the composite copper foil 20 are not damaged at high temperatures.

[0060] In one embodiment, the composite copper foil 20 has a first surface and a second surface. The ionization cooling roller shaft 160 includes a first ionization cooling roller shaft 161 and a second ionization cooling roller shaft 162. The inductively coupled plasma ionization mechanism 140 includes a first inductively coupled plasma ionization mechanism 143 and a second inductively coupled plasma ionization mechanism 144. After being unwound from the unwinding mechanism 120, the composite copper foil 20 first passes through the first ionization cooling roller shaft 161. The first surface of the composite copper foil 20 undergoes a first inductively coupled plasma ionization treatment in the ion replacement region corresponding to the first inductively coupled plasma ionization mechanism 143. The composite copper foil 20 then passes through the second ionization cooling roller shaft 162. The second surface of the composite copper foil 20 undergoes a second inductively coupled plasma ionization treatment in the ion replacement region corresponding to the second inductively coupled plasma ionization mechanism 144.

[0061] An embodiment of this application also provides a composite copper foil preparation apparatus 1, including the composite copper foil surface ionization device 10 as described in any of the above embodiments.

[0062] In one embodiment, a magnetron sputtering coating mechanism 30 is also included between the unwinding mechanism 120 and the inductively coupled plasma ionization mechanism 140, and a partition 40 is provided between the magnetron sputtering coating mechanism 30 and the inductively coupled plasma ionization mechanism 140.

[0063] The initial substrate 50 is released from the unwinding mechanism 120 and coated by the magnetron sputtering coating mechanism 20 to form a composite copper foil 20. The formed composite copper foil 20 is then subjected to inductively coupled plasma ionization treatment by the inductively coupled plasma ionization mechanism 140.

[0064] Using the composite copper foil preparation apparatus 1, a double-sided coated composite copper foil 20 is first formed by magnetron sputtering. Then, a dense anti-oxidation layer is formed on the surface of the composite copper foil 20 by inductively coupled plasma ionization. This process is simple, and the protective layer is dense with good anti-oxidation effect. If magnetron sputtering is used to form the anti-oxidation layer on the surface of the composite copper foil 20, an alloy of copper and anti-oxidation metals needs to be prepared in advance as the target material for magnetron sputtering, which is more difficult. However, by using inductively coupled plasma ionization to form the anti-oxidation layer, there is no need to prepare the alloy target material in advance. By controlling the power of the inductively coupled plasma ionization, the number of anti-oxidation metal ions can be controlled, thereby ensuring the formation of an alloy anti-oxidation layer with the expected ratio and thickness.

[0065] In one embodiment, the magnetron sputtering coating mechanism 30 includes a first coating cooling roller 310, a second coating cooling roller 320, a first copper target 330, and a second copper target 340. After the initial substrate is released from the unwinding mechanism 120, it first passes through the first coating cooling roller 310, and the first surface of the initial substrate 50 forms the first surface of the composite copper foil 20 in the sputtering area corresponding to the first copper target 330. The initial substrate 50 then passes through the second coating cooling roller 320, and the second surface of the initial substrate 50 forms the second surface of the composite copper foil 20 in the sputtering area corresponding to the second copper target 340.

[0066] Example 1:

[0067] A method for forming an anti-oxidation layer on the surface of a composite copper foil includes the following steps:

[0068] Under vacuum conditions, using a composite copper foil with a first surface and a second surface as a substrate, the composite copper foil undergoes ionization treatment via a surface ionization device: after being unwound from the unwinding mechanism, the composite copper foil passes through a first ionization cooling roller, where the first surface of the composite copper foil undergoes first inductively coupled plasma ionization treatment in the ion replacement region corresponding to the first inductively coupled plasma ionization mechanism to form a first anti-oxidation layer; the composite copper foil then passes through a second ionization cooling roller, where the second surface of the composite copper foil undergoes second inductively coupled plasma ionization treatment in the ion replacement region corresponding to the second inductively coupled plasma ionization mechanism to form a second anti-oxidation layer, and is then wound up by a winding mechanism;

[0069] The inductively coupled plasma cathode target material of the first and second inductively coupled plasma ionization mechanisms is selected from metallic chromium.

[0070] The working gas used for the first and second inductively coupled plasma ionization treatments is argon, and the power supply is 5KW.

[0071] The surface temperature of the composite copper foil is controlled to 150°C after being cooled by the first ionization cooling roller and then by the second ionization cooling roller.

[0072] The thickness of the first anti-oxidation layer is 10 nm, and the thickness of the second anti-oxidation layer is 10 nm.

[0073] Example 2

[0074] It is largely the same as Example 1, except that the power supply is 6KW, the thickness of the first anti-oxidation layer is 12nm, and the thickness of the second anti-oxidation layer is 12nm.

[0075] Example 3

[0076] It is largely the same as Example 1, except that the power supply is 4KW, the thickness of the first anti-oxidation layer is 8nm, and the thickness of the second anti-oxidation layer is 8nm.

[0077] Example 4

[0078] It is largely the same as Example 1, except that the power supply is 2KW, the thickness of the first anti-oxidation layer is 3nm, and the thickness of the second anti-oxidation layer is 3nm.

[0079] Comparative Example 1

[0080] Comparative Example 1 is a comparative example of Example 1. Compared with Example 1, the working gas and power of the ionization device on the surface of the composite copper foil were turned off, and no anti-oxidation layer was formed on the surface of the composite copper foil through ionization treatment.

[0081] The composite copper foils of Examples 1 to 4 and Comparative Example 1 were tested for sheet resistance, adhesion and oxidation resistance. The test results are shown in Table 1 below.

[0082] The method for testing antioxidant properties is as follows: After baking the composite copper foil at 150°C for 1 hour in atmospheric conditions, the sheet resistance change rate is tested. The smaller the sheet resistance change rate, the better the antioxidant performance; conversely, the larger the sheet resistance change rate, the worse the antioxidant performance.

[0083] Table 1. Results of sheet resistance, adhesion and oxidation resistance tests of composite copper foil

[0084]

[0085] As shown in Table 1, after inductively coupled plasma ionization treatment, the composite copper foil forms an anti-oxidation layer, which is beneficial to improving the anti-oxidation performance of the composite copper foil surface.

[0086] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for forming an anti-oxidation layer on the surface of a composite copper foil, characterized in that, Includes the following steps: Under vacuum conditions, using composite copper foil as the substrate and an anti-oxidation metal as the cathode target for inductively coupled plasma (ICP), the composite copper foil is subjected to ICP ionization treatment. The power supply for the ICP ionization treatment is 5kW~10kW. During the ICP ionization treatment, the composite copper foil is cooled to control its surface temperature at 150℃~200℃, forming an anti-oxidation layer on the surface of the composite copper foil. The anti-oxidation layer is an alloy of the anti-oxidation metal and copper, and its thickness is 10nm~20nm.

2. The method for forming an anti-oxidation layer on the surface of the composite copper foil according to claim 1, characterized in that, The antioxidant metals include one or more of nickel, zinc, titanium, and chromium.

3. The method for forming an anti-oxidation layer on the surface of the composite copper foil according to claim 1, characterized in that, The working gas used for inductively coupled plasma ionization is an inert gas.

4. The method for forming an anti-oxidation layer on the surface of the composite copper foil according to claim 3, characterized in that, The inert gas includes argon or helium.

5. The method for forming an anti-oxidation layer on the surface of a composite copper foil according to any one of claims 1 to 4, characterized in that, The composite copper foil has a first surface and a second surface. The step of performing inductively coupled plasma ionization treatment on the composite copper foil to form an anti-oxidation layer on the surface of the composite copper foil includes: First, the first surface of the composite copper foil is subjected to a first inductively coupled plasma ionization treatment to form a first anti-oxidation layer on the first surface of the composite copper foil. The second surface of the composite copper foil is then subjected to a second inductively coupled plasma ionization treatment to form a second anti-oxidation layer on the second surface of the composite copper foil.

6. A composite copper foil processed product, characterized in that, It is obtained by the method for forming an anti-oxidation layer on the surface of the composite copper foil as described in any one of claims 1 to 5.

7. A composite copper foil surface ionization device, characterized in that, The composite copper foil surface ionization device is used to process the composite copper foil product as described in claim 6. The composite copper foil surface ionization device includes a vacuum chamber. The vacuum chamber has an unwinding mechanism, a winding mechanism, and an inductively coupled plasma ionization mechanism disposed between the unwinding mechanism and the winding mechanism. The inductively coupled plasma cathode target of the inductively coupled plasma ionization mechanism is selected from antioxidant metals. The composite copper foil is released from the unwinding mechanism and undergoes inductively coupled plasma ionization treatment in the ion replacement area corresponding to the inductively coupled plasma ionization mechanism. An ionization cooling roller is also provided in the ion replacement area. After being released from the unwinding mechanism, the composite copper foil is first cooled by the ionization cooling roller and then wound up by the winding mechanism.

8. The composite copper foil surface ionization device according to claim 7, characterized in that, The composite copper foil has a first surface and a second surface. The ionization cooling roller shaft includes a first ionization cooling roller shaft and a second ionization cooling roller shaft. The inductively coupled plasma ionization mechanism includes a first inductively coupled plasma ionization mechanism and a second inductively coupled plasma ionization mechanism. After being unwound from the unwinding mechanism, the composite copper foil first passes through the first ionization cooling roller shaft. The first surface of the composite copper foil undergoes a first inductively coupled plasma ionization treatment in the ion replacement region corresponding to the first inductively coupled plasma ionization mechanism. The composite copper foil then passes through the second ionization cooling roller shaft. The second surface of the composite copper foil undergoes a second inductively coupled plasma ionization treatment in the ion replacement region corresponding to the second inductively coupled plasma ionization mechanism.

9. A composite copper foil preparation apparatus, characterized in that, Includes the composite copper foil surface ionization device as described in any one of claims 7 to 8.

10. The composite copper foil preparation apparatus according to claim 9, characterized in that, Between the unwinding mechanism and the inductively coupled plasma ionization mechanism, there is also a magnetron sputtering coating mechanism, and a partition is provided between the magnetron sputtering coating mechanism and the inductively coupled plasma ionization mechanism; The initial substrate is unwound from the unwinding mechanism and coated by the magnetron sputtering coating mechanism to form a composite copper foil. The formed composite copper foil is then subjected to inductively coupled plasma ionization treatment by the inductively coupled plasma ionization mechanism.

11. The composite copper foil preparation apparatus according to claim 10, characterized in that, The magnetron sputtering coating mechanism includes a first coating cooling roller shaft, a second coating cooling roller shaft, a first copper target, and a second copper target. After the initial substrate is unwound from the unwinding mechanism, it first passes through the first coating cooling roller shaft, and the first surface of the initial substrate forms the first surface of the composite copper foil in the sputtering area corresponding to the first copper target. The initial substrate then passes through the second coating cooling roller shaft, and the second surface of the initial substrate forms the second surface of the composite copper foil in the sputtering area corresponding to the second copper target.

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