Desmutting device

Abstract

The present application relates to a debonding device, which includes a debonding working cavity formed inside a debonding workbench, and the debonding working cavity is used to accommodate a chip to be debonded; a controller; a debonding execution device installed on the debonding workbench and capable of outputting a debonding light beam into the debonding working cavity, and the debonding execution device is electrically connected to the controller; a thickness measurement transmitting device installed on the debonding workbench, and the thickness measurement transmitting device is used to emit thickness measurement light rays to the chip; and a thickness measurement receiving device installed on the debonding workbench, and the thickness measurement receiving device is used to receive the thickness measurement light rays reflected by the chip. The thickness measurement transmitting device and the thickness measurement receiving device are respectively electrically connected to the controller. The debonding device in this solution does not require human intervention throughout the entire working process, can effectively improve the debonding operation efficiency and the chip thickness measurement efficiency, and can ensure the thickness measurement accuracy. While ensuring the chip safety, the photoresist can be removed cleanly and thoroughly, avoiding affecting the processing quality of the subsequent process flow of the chip.

Description

Technical Field

[0001] The present application relates to the technical field of chip processing, and particularly to a degumming device. Background Art

[0002] As a control center, chips are widely installed in various intelligent interaction devices or automated processing devices. Their performance will greatly affect the working performance and stability of intelligent interaction devices and automated processing devices. In the chip manufacturing process, there is a process of etching using photoresist. After the etching process is completed, the excess photoresist is no longer needed. At this time, the excess photoresist needs to be removed completely first, and then the chip is transferred to the subsequent process flow to avoid interference of the photoresist with the processing quality of the subsequent process flow.

[0003] Currently, the removal of photoresist is usually automatically completed by a degumming device. However, the degree of photoresist removal and whether it is completely removed still need to be manually judged according to the experience of process engineers and frequent downtime to measure the chip thickness. Firstly, the operation is cumbersome, time-consuming and laborious, affecting the degumming operation efficiency. Secondly, the degumming time cannot be accurately grasped. If the time is too long, it will damage the chip surface. If the time is too short, the photoresist will not be removed completely. Summary of the Invention

[0004] Based on this, it is necessary to provide a degumming device to solve the problems of time-consuming and laborious operation, affecting the degumming operation efficiency, easy to cause chip damage, and incomplete removal of photoresist.

[0005] The present application provides a degumming device, which includes:

[0006] A degumming workbench, inside which a degumming work cavity is formed for accommodating the chip to be degummed;

[0007] A controller;

[0008] A degumming execution device, which is installed on the degumming workbench and can output a degumming light beam into the degumming work cavity. The degumming execution device is electrically connected to the controller;

[0009] A thickness measurement emission device, which is installed on the degumming workbench and is used to emit thickness measurement light to the chip; and,

[0010] A thickness measurement receiving device, which is installed on the degumming workbench and is used to receive the thickness measurement light reflected by the chip. The thickness measurement emission device and the thickness measurement receiving device are respectively electrically connected to the controller.

[0011] The photoresist removal device of the above solution is applied to the processing occasion of removing photoresist on a chip. During operation, first, the chip to be de-glued is placed in the de-gluing working chamber of the de-gluing workbench. Immediately afterwards, the de-gluing execution device is turned on. At the same time or after a period of time, the thickness measurement emission device and the thickness measurement reception device are started. The de-gluing execution device can emit a de-gluing light beam to the chip, thereby ablating and removing the photoresist on the chip surface. During this process, the thickness measurement emission device synchronously emits thickness measurement light to the chip surface. After the thickness measurement light contacts the chip, it is reflected and returns to the thickness measurement reception device. The controller can calculate the real-time thickness value of the chip at this time based on the time when the thickness measurement emission device emits the thickness measurement light and the time when the thickness measurement light reaches the thickness measurement reception device. When the real-time thickness value is equal to the pre-stored chip thickness value in the controller, the controller immediately sends a stop instruction to the de-gluing execution device, thereby immediately shutting down the de-gluing execution device from continuing to emit the de-gluing light beam to the chip surface, avoiding damage caused by the de-gluing light beam contacting the chip surface. Moreover, compared with the existing manual thickness measurement operation method, the de-gluing device of this solution does not require human intervention throughout the operation process, can effectively improve the de-gluing operation efficiency and the chip thickness measurement efficiency, and can ensure the thickness measurement accuracy, ensure the safety of the chip while removing the photoresist cleanly and thoroughly, and avoid affecting the processing quality of the subsequent process flow of the chip.

[0012] The technical solution of the present application will be further described below:

[0013] In one embodiment, the thickness measurement emission device includes a thickness measurement light emitter, the thickness measurement reception device includes a thickness measurement light receiver, the thickness measurement light emitter and the thickness measurement light receiver are respectively arranged on opposite sides of the de-gluing execution device, and both the thickness measurement light emitter and the thickness measurement light receiver are inclined to the tabletop of the de-gluing workbench.

[0014] In one embodiment, the thickness measurement emission device further includes a first vacuum isolation valve, and the first vacuum isolation valve is installed on the thickness measurement light emitter.

[0015] In one embodiment, the thickness measurement reception device further includes a second vacuum isolation valve, and the second vacuum isolation valve is installed on the thickness measurement light receiver.

[0016] In one embodiment, the de-gluing workbench includes a carrier and a workbench main body. The carrier is movably arranged on the top surface of the workbench main body. The de-gluing execution device, the thickness measurement emission device and the thickness measurement reception device are respectively installed on the carrier.

[0017] In one embodiment, the top surface of the workbench main body is provided with a first track and a second track. The first track and the second track intersect and are connected to each other. A moving block is installed at the bottom of the carrier, and the moving block is movably installed on the first track or the second track.

[0018] In one embodiment, an annular track is provided on the carrier, which surrounds the carrier and is parallel to the tabletop of the workbench main body. A first rotating assembly and a second rotating assembly are movably installed on the annular track. The thickness measurement transmitting device is installed on the first rotating assembly and can rotate in a vertical plane, and the thickness measurement receiving device is installed on the second rotating assembly and can rotate in a vertical plane.

[0019] In one embodiment, both the first rotating assembly and the second rotating assembly include a seat body, a damping sleeve and a rotating body. The seat body is installed on the carrier, and the seat body is provided with a rotating hole. The rotating body is provided with a rotating shaft portion, and the rotating shaft portion is rotatably inserted into the rotating hole. The damping sleeve is sleeved between the rotating shaft portion and the hole wall of the rotating hole.

[0020] In one embodiment, the debonding device further includes a support table and a fixture. The support table is installed in the debonding working chamber, and the fixture is arranged on the tabletop of the support table and is used for clamping and fixing the chip to be debonded.

[0021] In one embodiment, the debonding execution device uses a plasma generator. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of this application are used to provide a further understanding of this application. The schematic embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation to this application.

[0023] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 Is an axonometric structure diagram of the debonding device according to an embodiment of this application.

[0025] Figure 2 Is Figure 1 The front view structure diagram of.

[0026] Figure 3 Is Figure 2 The top view structure diagram of.

[0027] Description of reference numerals:

[0028] 100. Glue removal device; 10. Glue removal workbench; 11. Glue removal working chamber; 12. Carrier; 13. Workbench body; 20. Glue removal execution equipment; 30. Thickness measurement transmitting equipment; 31. Thickness measurement light transmitter; 32. First vacuum isolation valve; 40. Thickness measurement receiving equipment; 41. Thickness measurement light receiver; 42. Second vacuum isolation valve; 50. Support platform; 60. Clamp; 200. Chip. DETAILED DESCRIPTION

[0029] Implementation

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified or limited, if terms such as "installed", "connected", "linked", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In this application, unless otherwise clearly specified or limited, if there is a description such as the first feature being "on" or "under" the second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or just means that the first feature is at a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or just means that the first feature is at a lower horizontal height than the second feature.

[0035] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0036] Refer to Figures 1 to 3 , a debonding device 100 shown in an embodiment of this application, includes a debonding workbench 10, a controller, a debonding execution device 20, a thickness measurement transmitting device 30, and a thickness measurement receiving device 40.

[0037] The debonding workbench 10 is designed with a box-shaped structure, which is simple and regular in structure and has a low manufacturing cost. Therefore, a debonding work cavity 11 is formed inside the debonding workbench 10, and the debonding work cavity 11 is used to accommodate the chip 200 to be debonded. Generally speaking, usually only one chip 200 is installed in the debonding work cavity 11 at a time or in one processing cycle; of course, two or more chips 200 can also be selected to be installed at the same time, thereby improving the processing capacity of the debonding device 100 in a single processing cycle, reducing the downtime caused by frequent loading and unloading of the chip 200, and improving the processing efficiency of the chip 200.

[0038] It is easy to understand that the installation and removal of the chip 200 can be achieved manually or automatically by an automatic loading and unloading device (such as a loading and unloading manipulator, etc.), and can be flexibly selected according to actual needs.

[0039] The degluing execution device 20 is installed on the degluing workbench 10 and can output a degluing beam into the degluing working chamber 11. The degluing execution device 20 is electrically connected to the controller. For example, in this embodiment, the degluing execution device 20 uses a plasma generator. That is, the above-mentioned degluing beam is specifically a plasma beam. The plasma generator can emit a plasma beam to the chip 200. The plasma beam has a good effect on removing photoresist, which helps to improve the photoresist removal efficiency and removal cleanliness.

[0040] Please continue to refer to Figure 2 , in addition, the thickness measurement emission device 30 is installed on the degluing workbench 10. The thickness measurement emission device 30 is used to emit thickness measurement light to the chip 200; the thickness measurement reception device 40 is installed on the degluing workbench 10. The thickness measurement reception device 40 is used to receive the thickness measurement light reflected by the chip 200. The thickness measurement emission device 30 and the thickness measurement reception device 40 are respectively electrically connected to the controller.

[0041] It should be noted that the thickness measurement light emitted by the film thickness emission device and received by the film thickness reception device is specifically an X-ray. Therefore, the working principle for measuring the thickness of the chip 200 can be briefly described as follows: using the penetration ability of X-rays to detect substances. When X-rays pass through a material, they interact with the atoms inside the material, including scattering and absorption. The atoms near the material surface interact more strongly with X-rays and scatter, with relatively little impact, while the atoms deep inside scatter less and mainly absorb. Therefore, by using the energy absorbed by X-rays inside the material and the resulting attenuation and scattering, the thickness of the material can be determined.

[0042] In summary, implementing the technical solution of this embodiment will have the following beneficial effects: The degumming device 100 of the above solution is applied to the processing occasion of removing photoresist on the chip 200. During operation, first, the chip 200 to be degummed is placed in the degumming working chamber 11 of the degumming workbench 10. Immediately afterwards, the degumming execution device 20 is turned on. At the same time or after a period of time, the thickness measurement emission device 30 and the thickness measurement reception device 40 are started. The degumming execution device 20 can emit a degumming beam to the chip 200, thereby ablating and removing the photoresist on the surface of the chip 200. During this process, the thickness measurement emission device 30 synchronously emits thickness measurement light to the surface of the chip 200. After the thickness measurement light contacts the chip 200, it is reflected and returns to the thickness measurement reception device 40. The controller can calculate the real-time thickness value of the chip 200 at this time based on the time when the thickness measurement emission device 30 emits the thickness measurement light and the time when the thickness measurement light reaches the thickness measurement reception device 40. When the real-time thickness value is equal to the pre-stored thickness value of the chip 200 in the controller, the controller immediately sends a stop instruction to the degumming execution device 20, thereby immediately shutting down the degumming execution device 20 from continuing to emit the degumming beam to the surface of the chip 200, avoiding damage caused by the degumming beam contacting the surface of the chip 200. Moreover, compared with the existing manual thickness measurement operation method, the degumming device 100 of this solution does not require human intervention throughout the work process, can effectively improve the degumming operation efficiency and the chip 200 thickness measurement efficiency, and can ensure the thickness measurement accuracy, ensuring the safety of the chip 200 while removing the photoresist cleanly and thoroughly, and avoiding affecting the processing quality of the subsequent process flow of the chip 200.

[0043] Please continue to refer to Figure 2 , on the basis of the above embodiment, the thickness measurement emission device 30 includes a thickness measurement light emitter 31, and the thickness measurement reception device 40 includes a thickness measurement light receiver 41. The thickness measurement light emitter 31 and the thickness measurement light receiver 41 are respectively arranged on opposite sides of the degumming execution device 20, and both the thickness measurement light emitter 31 and the thickness measurement light receiver 41 are inclined to the tabletop of the degumming workbench 10. After such a setting, the thickness measurement light emitter 31 emits X-rays to the chip 200, and the X-rays are more likely to be reflected at a suitable angle on the surface of the chip 200, so that the X-rays can return to the thickness measurement light receiver 41 more accurately, so as to accurately and quickly complete the real-time measurement of the thickness of the chip 200.

[0044] Further, the thickness measurement emission device 30 further includes a first vacuum isolation valve 32, and the first vacuum isolation valve 32 is installed on the thickness measurement light emitter 31. Similarly, the thickness measurement reception device 40 further includes a second vacuum isolation valve 42, and the second vacuum isolation valve 42 is installed on the thickness measurement light receiver 41. When it is detected that the real-time thickness value of the chip 200 is equal to the pre-stored thickness value of the chip 200, in addition to shutting down the plasma generator, the controller also synchronously issues commands to the first vacuum isolation valve 32 and the second vacuum isolation valve 42 to control the first vacuum isolation valve 32 and the second vacuum isolation valve 42 to close, so as to cut off the optical paths of the thickness measurement light emitter 31 and the thickness measurement light receiver 41, stop the X-ray from continuing to emit, and avoid the harm of X-ray to the detection personnel when taking out the chip 200.

[0045] Please continue to refer to Figures 1 to 3 In addition, on the basis of any of the above embodiments, the photoresist removal workbench 10 includes a carrier 12 and a workbench main body 13. The carrier 12 is movably arranged on the top surface of the workbench main body 13. The photoresist removal execution device 20, the thickness measurement emission device 30, and the thickness measurement reception device 40 are respectively installed on the carrier 12. During operation, by operating the carrier 12 to move relative to the workbench main body 13, the positions of the photoresist removal execution device 20, the thickness measurement emission device 30, and the thickness measurement reception device 40 can be flexibly changed, so as to completely remove the photoresist on different parts of the surface of the chip 200 and perform a complete thickness measurement on the chip 200, ensuring the cleanliness of photoresist removal and the accuracy of chip 200 thickness measurement.

[0046] Specifically, in the above embodiment, a first track and a second track are provided on the top surface of the workbench main body 13. The first track and the second track intersect and communicate with each other. A moving block is installed at the bottom of the carrier 12, and the moving block is movably installed on the first track or the second track. Therefore, the moving block can move flexibly on the intersecting first track or second track, so that the photoresist removal execution device 20, the thickness measurement emission device 30, and the thickness measurement reception device 40 can be aligned with different parts of the chip 200 and the photoresist, ensuring processability and detectability.

[0047] Alternatively, as an alternative to the above embodiments, in some other embodiments, an annular track is provided on the carrier 12, which surrounds the carrier 12 and is parallel to the tabletop of the workbench body 13. A first rotating assembly and a second rotating assembly are movably installed on the annular track. The thickness measurement transmitting device 30 is installed on the first rotating assembly and can rotate in a vertical plane, and the thickness measurement receiving device 40 is installed on the second rotating assembly and can rotate in a vertical plane. By moving along the annular track extending in the horizontal direction, the thickness measurement transmitting device 30 and the thickness measurement receiving device 40 can obtain different circumferential relative positions with respect to the chip 200. On this basis, the thickness measurement transmitting device 30 and the thickness measurement receiving device 40 rotate vertically and adaptively through the corresponding first rotating assembly and second rotating assembly, so that the thickness measurement light can reach different parts of the chip 200, and the real-time thickness measurement of different parts of the chip 200 can be completed.

[0048] In some embodiments, both the first rotating assembly and the second rotating assembly include a seat body, a damping sleeve and a rotating body. The seat body is installed on the carrier 12, and the seat body is provided with a rotating hole. The rotating body is provided with a rotating shaft portion, and the rotating shaft portion is rotatably inserted into the rotating hole. The damping sleeve is sleeved between the rotating shaft portion and the hole wall of the rotating hole. Therefore, when the rotating shaft portion of the rotating body rotates in the rotating hole, the first rotating assembly and the second rotating assembly can provide the rotational freedom required by the thickness measurement transmitting device 30 and the thickness measurement receiving device 40; further, the damping sleeve increases the frictional resistance between the diameter of the rotating shaft portion and the hole wall of the rotating hole, so that the thickness measurement transmitting device 30 and the thickness measurement receiving device 40 can be fixed at the rotated angular position without random rotation, which helps to ensure the accuracy of the chip 200 thickness measurement.

[0049] Optionally, the damping sleeve is made of a rubber sleeve.

[0050] Please continue to refer to Figure 2 , in addition, on the basis of any of the above embodiments, the debonding device 100 further includes a support table 50 and a fixture 60. The support table 50 is installed in the debonding working chamber 11, and the fixture 60 is arranged on the tabletop of the support table 50 and is used for clamping and fixing the chip 200 to be debonded. The fixture 60 can clamp and fix the chip 200, so that the position of the chip 200 remains stable during the entire debonding process and thickness measurement process.

[0051] Optionally, the fixture 60 can be a mechanical fixture 60, or a vacuum adsorption device, etc., and can be flexibly selected according to actual needs.

[0052] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0053] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A degumming device, characterized in that, Comprising: A degumming workbench, within which a degumming working chamber is formed for accommodating a chip to be degummed. A controller; A degumming execution device installed on the degumming workbench and capable of outputting a degumming light beam into the degumming working chamber, the degumming execution device being electrically connected to the controller; a thickness measurement emission device installed on the degumming workbench for emitting thickness measurement light towards the chip; and a thickness measurement reception device installed on the degumming workbench for receiving the thickness measurement light reflected by the chip, the thickness measurement emission device and the thickness measurement reception device being respectively electrically connected to the controller. The thickness measurement emission device includes a thickness measurement light emitter, the thickness measurement reception device includes a thickness measurement light receiver, the thickness measurement light emitter and the thickness measurement light receiver are respectively arranged on opposite sides of the degumming execution device, and both the thickness measurement light emitter and the thickness measurement light receiver are inclined with respect to the tabletop of the degumming workbench. The thickness measurement emission device further includes a first vacuum isolation valve installed on the thickness measurement light emitter. The thickness measurement reception device further includes a second vacuum isolation valve installed on the thickness measurement light receiver.

2. The debonding device according to claim 1, wherein The degumming workbench includes a carrier and a workbench main body, the carrier being movably arranged on the top surface of the workbench main body, and the degumming execution device, the thickness measurement emission device and the thickness measurement reception device are respectively installed on the carrier.

3. The debonding device according to claim 2, characterized in that, On the top surface of the workbench main body, a first track and a second track are provided, the first track and the second track intersect and are connected to each other, and a moving block is installed at the bottom of the carrier, the moving block being movably installed on the first track or the second track.

4. The debonding device according to claim 2, characterized in that, On the carrier, an annular track surrounding the carrier and parallel to the tabletop of the workbench main body is provided, and a first rotation assembly and a second rotation assembly are movably installed on the annular track, the thickness measurement emission device being installed on the first rotation assembly and capable of rotating in a vertical plane, and the thickness measurement reception device being installed on the second rotation assembly and capable of rotating in a vertical plane.

5. The debonding device according to claim 4, characterized in that Both the first rotation assembly and the second rotation assembly include a seat body, a damping sleeve and a rotating body, the seat body being installed on the carrier, and the seat body being provided with a rotation hole, the rotating body being provided with a rotating shaft portion, the rotating shaft portion being rotatably inserted into the rotation hole, and the damping sleeve being sleeved between the rotating shaft portion and the hole wall of the rotation hole.

6. The debonding device according to any one of claims 1 to 5, characterized in that, The degumming device further includes a support table and a fixture, the support table being installed in the degumming working chamber, and the fixture being arranged on the tabletop of the support table for clamping and fixing the chip to be degummed.

7. The degumming device according to claim 6, wherein The degumming execution device uses a plasma generator.

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