A low-loss large-scale power divider combining network and its manufacturing method

Abstract

This invention discloses a low-loss large-scale power divider combining network and its manufacturing method, relating to the field of radar electronic antenna feed system technology, including the following steps: Step 1: Manufacturing a power divider combining network microstrip board with metallized through holes, metallized plug holes, and metallized through slots, the metallized through slots being located at the four edges of the microstrip board; Step 2: Welding resistors and main connectors onto the microstrip board; Step 3: Manufacturing a housing and a cover plate with air cavities; Step 4: Installing 256 split connectors on the housing and installing KK adapter connectors on the cover plate; Step 5: Installing the microstrip board onto the housing and completing the interconnection between the microstrip board and the 256 split connectors; Step 6: Fitting the cover plate to the microstrip board; This invention effectively solves a series of problems caused by existing methods that use screws to fix and compact the microstrip board and metal parts to form a suspended strip structure, resulting in difficulty in tightly fitting the microstrip board and metal parts, gaps in assembly making it difficult to form a complete metal partition, and increased loss and decreased gain.

Description

Technical Field

[0001] This invention relates to the field of radar electronic antenna feed system technology, specifically to a low-loss large power divider and combining network and its manufacturing method. Background Technology

[0002] Power divider / combiner (PDC) networks are multiport microwave networks that divide input power into several output channels or combine several input power channels according to a certain ratio. They are important solid-state components in radar antenna systems. With the development of fields such as information warfare, in order to meet the requirements of ultra-wideband, high-power, highly integrated, and miniaturized electronic equipment, PDC networks are gradually developing towards multi-channel combining technology. Currently, commonly used PDC networks are mostly 1-to-16 or 1-to-32 channels. Each PDC network requires a separate metal sealed housing, resulting in high losses and high heat generation during operation when coupled in series, which cannot meet the requirements of new technologies.

[0003] like Figure 1 As shown, a multi-channel synthesis circuit, such as 1-to-256 channels, can be realized through the fabrication process of a planar suspended microstrip board. A low-profile suspended stripline synthesis network can be fabricated by pressing a microstrip board with an air-cavity shell and an air-cavity cover plate to form a continuous metal partition, thus solving the resonance phenomenon encountered when using insulating dielectric support. However, to ensure the electrical performance and consistency of the power divider synthesis network, a large and thin microstrip board must be fabricated. The metal partition holding the microstrip board consists of, from top to bottom, a metal cover plate, metallized through-holes and pads on the microstrip board that contact the shell and cover plate, and a metal shell. Due to the softness and poor dimensional stability of the microstrip board, this assembly method cannot achieve 100% continuity of the metal partition using screws (i.e., there are certain gaps between the shell, cover plate, and microstrip board). When the metal partition is not continuous, the air cavity deviates from the design dimensions, causing crosstalk between different cavities, increasing losses, reducing receiving gain, and affecting the overall antenna performance.

[0004] Therefore, there is an urgent need to establish a manufacturing method for a low-loss large-scale power divider and synthesizer network to solve a series of problems caused by the existing method of fixing and compacting microstrip boards and metal parts with screws to form a suspended strip structure, such as difficulty in tightly fitting the microstrip board and metal parts, gaps in assembly making it difficult to form a complete metal partition, and increased loss and decreased gain. This method will improve the accuracy, consistency and reliability of processing and assembly, and the process will be simple and fast, with excellent telecommunications indicators and high reliability.

[0005] In view of the above-mentioned defects, the inventors of this invention have finally obtained this invention after a long period of research and practice. Summary of the Invention

[0006] The purpose of this invention is to provide a low-loss large-scale power combining network and its manufacturing method, which effectively solves a series of problems caused by the existing microstrip board and metal parts being fixed and compacted with screws to form a suspended strip structure, and provides a further solution for the efficient, high-precision and high-reliability integration of large-scale power combining networks.

[0007] The present invention solves the above-mentioned technical problems through the following technical solution, and the present invention includes the following steps:

[0008] Step 1: Fabricate a power divider and synthesizer microstrip board with metallized vias, metallized plug vias, and metallized through slots. The metallized through slots are located at the four edges of the microstrip board.

[0009] Step 2: Solder the resistors and main connectors onto the microstrip board;

[0010] Step 3: Manufacture the shell and cover plate with air cavity;

[0011] Step 4: Install 256 split connectors on the housing and install KK adapter connectors on the cover plate;

[0012] Step 5: Install the microstrip board into the housing and complete the interconnection between the microstrip board and the 256 split connectors;

[0013] Step 6: Fit the cover plate and the microstrip plate together. A connector is provided in the metallized through groove. Use the first screw to lock and fix the cover plate, microstrip plate and housing.

[0014] Preferably, in step one, the specific processing steps of the microstrip board are as follows: drilling, hole metallization, resin plugging, electroplating, pattern making, surface coating, and shape processing are performed sequentially on the raw material copper-clad board; wherein, hole metallization completes the production of metallized through holes, and hole metallization, resin plugging, and electroplating complete the production of metallized plugged holes.

[0015] Preferably, the copper clad laminate material is selected with a dielectric constant of less than 3.0 and a dielectric loss of less than 0.0015.

[0016] Preferably, the surface of the microstrip plate is coated with any one of electroplated gold, electroless gold, electroplated silver, or electroless silver.

[0017] Preferably, the specific steps of step two are as follows: place the microstrip board on a flat welding fixture and flatten it, and interconnect the resistors with resistor pads and the main connector pads with the main connector through soldering.

[0018] Preferably, in step four, both the split connector and the KK adapter connector are installed and fixed by one of the following methods: screwing, conductive adhesive bonding, or welding.

[0019] Preferably, the connector is a metal boss machined on the cover plate, and the metal boss is adapted to the metallized through groove.

[0020] Preferably, the metal boss and the metallized through slot are interconnected by insertion, and the tolerance between the two is 0.05 to 0.1 mm, and the thickness of the metal boss is the thickness of the finished microstrip board + 0.03 to 0.05 mm.

[0021] Preferably, the connector is a conductive adhesive that fills the metallized channel; and the conductive adhesive is poured into and fills the metallized channel, with the center height of the conductive adhesive being higher than that of the microstrip board.

[0022] The present invention also provides a low-loss large-scale power divider combining network prepared by the manufacturing method of the low-loss large-scale power divider combining network described above.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] 1. Effectively solves a series of problems caused by the existing method of fixing and compacting microstrip plates and metal parts with screws to form a suspended strip structure, such as difficulty in tightly fitting the microstrip plate and the metal workpiece, gaps in assembly making it difficult to form a complete metal partition, and increased loss and decreased gain.

[0025] 2. The low-loss large power divider combining network prepared in this invention can be used below the X-band. After being assembled with an antenna, it achieves a normal gain ≥30dB (8GHz), axial ratio ≤5dB, and gain difference ≤8.5dB. Compared with the traditional suspended strip method, the loss of the combining network is reduced by 0.3, the antenna normal gain is increased by 5dB, and the electrical performance indicators are superior.

[0026] 3. This invention can realize the synthesis of 256-channel unequal power distribution networks with a planar size of less than 600mm*600mm. Compared with traditional multi-combination synthesis networks, it has better consistency and the planar cross-sectional thickness is reduced by more than 70%, which meets the higher technical requirements of miniaturization and high consistency for model products.

[0027] 4. The process method of this invention has higher production efficiency. The suspended microstrip line does not require large-area welding and grounding, which eliminates the influence of thermal history caused by vacuum phase welding on the dimensional stability of the microstrip board, ensuring assembly accuracy and reliability, and greatly improving production efficiency. Compared with the traditional multi-assembly network production time, it is shortened by more than 60%.

[0028] 5. The 1-to-256 channel unequal power combining network prepared in this invention has extremely low loss, which reduces the network's operating temperature when used at high power. At the same time, it has a highly reliable mechanical structure with screw fixation, which can meet the environmental test requirements of 500 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, and has good reliability and environmental adaptability. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a comparative suspended strip network structure;

[0030] Figure 2 This is a schematic diagram of the structure of Embodiment 1;

[0031] Figure 3 This is a schematic diagram of the process flow for Example 1;

[0032] Figure 4 This is a schematic diagram of the structure of Example 3;

[0033] Figure 5 This is a schematic diagram of the process flow for Example 3. Detailed Implementation

[0034] The above-mentioned and other technical features and advantages of the present invention will be described in more detail below with reference to the accompanying drawings.

[0035] Comparative Example

[0036] Figure 1 This is a schematic diagram of a traditional suspended strip network, including a cover plate 2, a 1-to-256 network microstrip board 3, and a housing 4. The cover plate 2 has a first air cavity 5 and is equipped with a KK adapter connector 20. The housing 4 has a second air cavity 26 and is equipped with a split connector 7. The 1-to-256 network microstrip board 3 has a split network pattern 12, a mating network pattern 9, a metallized insertion port 6, a metallized plug hole 8, a resistance pad 23, and a main connector pad 15. The main connector pad 15 is fixed with a main connector 17 by soldering (the number of connectors is reduced for clarity of illustration).

[0037] The assembly process is as follows: First, a 1-section 256 microstrip board 3 with dimensions of 580mm*580mm was fabricated using a 0.254mm GNC3004 die. Its surface is coated with chemical gold plating. The flattened board is then connected to resistor 21 via resistance solder wire 22, and to the main connector pad 15 and main connector 17 on the back of the network via connector solder wire 16. Specifically, to achieve the interconnection between resistor 21 and the composite network, metallized vias 13 are used in conjunction with resin plugging and electroplating. That is, resistor 21 is connected to the composite network through the metallized vias 13.

[0038] The split network pattern 12 is interconnected with the network split pad 14 through the metallized through-hole 13; the mating network pattern 9 is interconnected with the resistor pad 23 through the metallized plug hole 8; the housing 4 with the air cavity is interconnected with the outer conductor 10 of the connector using induction soldering through the Sn63Pb37 connector solder ring 11. The soldered microstrip board 3 is fitted to the inner conductor 24 of the connector through the metallized insertion port 6, and then the microstrip board 3 is fixed. The inner conductor is interconnected with the network split pad 14 through the inner conductor solder wire 25. The flange and cover plate 2 are fixed by screws to the main port dual female KK adapter connector, then the KK adapter connector is interconnected with the main port connector 17, and finally the housing 4 and cover plate 2 are fixed by screws through the microstrip board 3. The outer conductor of the other end of the network connector is interconnected with the antenna through solder.

[0039] Example 1

[0040] This embodiment provides a technical solution: a method for manufacturing a low-loss large-scale power divider and combiner network, such as... Figure 3 As shown, it includes the following steps:

[0041] Step 1: Fabricate a power divider and synthesizer microstrip board 3 with metallized vias 13, metallized plug holes 8 and metallized through slots 28. The metallized through slots 28 are located at the four edges of the microstrip board 3.

[0042] The copper-clad laminate of microstrip board 3 is selected. The material of the copper-clad laminate is selected with a dielectric constant of less than 2.94 and a dielectric loss of less than 0.0015. The copper-clad laminate is then subjected to drilling, hole metallization, resin plugging, electroplating, pattern making, surface coating, and shape processing in sequence.

[0043] Laser drilling is selected for the drilling process of microstrip board 3, and laser processing is selected for the shape processing process. The shape processing accuracy of microstrip board 3 is -0.05 to 0 mm. Through-hole metallization is used to form metallized through holes 13 on copper-clad laminate. Metallized plug holes 8 are formed by through-hole metallization, resin plugging, and electroplating. The diameter of metallized plug holes 8 is 0.25 to 0.6 mm, and the distance between them and the edge of the large area pattern is 0.2 to 0.4 mm. Metallized plug holes 8 are shielding holes located on the large area pattern of microstrip board 3, at the contact edge with housing 4 and cover plate 2, and are used for shielding between air cavity and metal partition wall. The finished copper thickness of metallized through holes 13 and metallized plug holes 8 of microstrip board 3 is ≥0.025 mm.

[0044] There are 256 metallized through holes 13. The finished diameter of the metallized through holes 13 is +0.15 to 0.25 mm of the diameter of the inner conductor 24 of the connector, and the positional accuracy is ±0.05 mm.

[0045] Metallized through slots 28 are respectively opened on the four sides of the microstrip plate 3, with dimensions of 3mm in length, 2mm in width, and 0.3mm in height;

[0046] The back of the microstrip board 3 is provided with a resistor pad 23 and a main connector pad 15. The pad pattern accuracy is ±0.02mm and the position accuracy is ±0.05mm. The microstrip board 3 is a double-sided microstrip board with a dielectric thickness ≤0.762mm and a finished surface copper thickness ≥0.035mm.

[0047] Step 2: Solder resistor 21 to main connector 17 on microstrip board 3;

[0048] Place the microstrip board 3 flat on the welding fixture, and complete the welding of resistor 21 to resistor pad 23 and main control connector to main port connector pad 15 by manual soldering; the melting point of the solder used for soldering should be ≥179℃; in order to reduce the impact of heating on the dimensional stability of microstrip board 3, local heating method is adopted;

[0049] Step 3: Manufacture the shell 4 with the air cavity and the cover plate 2;

[0050] The metal workpieces used for machining the housing 4 and the cover plate 2 are made of 5A06 aluminum alloy. The aluminum alloy raw material is machined into an air cavity by CNC milling. The flatness of the finished metal workpiece should be ≤0.1mm, the structural dimensional accuracy is ±0.03mm, and the non-air cavity area forms a U-shaped sealing surface.

[0051] Subsequently, using a fitter to drill and tap holes, fixed through holes are machined on cover plate 2 and internal threaded holes are machined on housing 4, with the fixed through holes and internal threads corresponding to each other. Finally, the semi-finished product is subjected to overall conductive oxidation treatment to increase the corrosion resistance and conductivity of housing 4 and cover plate 2 and to prevent electromagnetic signal interference.

[0052] Step 4: Install 256 split connectors 7 on the housing 4 and install KK adapter connectors 20 on the cover plate 2;

[0053] The split connector 7 is a double-male type, meaning that both sides of the connector are plug-type. Both the split connector 7 and the KK adapter connector 20 are installed and fixed to the housing 4 by one of the following methods: screw mounting, conductive adhesive bonding, or soldering. When installing and fixing with screws, the screws pass through the connector flange mounting holes and are fixed to the housing 4. Conductive adhesive should be used to lock the screws to the housing 4 and to reinforce grounding. The number of split connectors 7 is 256 (the number of split connectors 7 is reduced for clarity of illustration).

[0054] Step 5: Install the microstrip board 3 onto the housing 4 and complete the interconnection between the microstrip board 3 and the 256 split connectors 7;

[0055] Transfer the soldered microstrip board 3 to the housing 4, install the connector inner conductor 24 one by one into the metallized through hole 13 of the microstrip board 3, and complete the interconnection between the connector inner conductor 24 and the microstrip board 3 by manual soldering. The melting point of the solder used for soldering should be ≥179℃.

[0056] Step 6: Fit the cover plate 2 and the microstrip plate 3 together. A connector is provided in the metallized through groove 28. Use the first screw 1 to lock and fix the cover plate 2, the microstrip plate 3 and the housing 4.

[0057] The connector mates with the metallized through slot 28 to achieve a tight fit between the microstrip plate 3, the cover plate 2, and the housing 4. The first screw 1 passes through the fixing through hole, the microstrip plate 3, and the internal threaded hole in sequence. After tightening the first screw 1, the cover plate 2 and the housing 4 can be used to clamp and fix the microstrip plate 3. During installation, thread locking adhesive should be used between the first screw 1 and the housing 4 to increase reliability.

[0058] Example 2

[0059] This embodiment is a further optimization based on Embodiment 1. The parts that are the same as those described above will not be repeated here. Figure 2-3 As shown, to further better realize the present invention, the following configuration is specifically adopted: a metal boss 27 with a length of 3mm, a width of 2mm, and a height of 0.3mm is machined on the side of the cover plate 2 that mates with the housing 4; the microstrip plate 3 has a metallized through groove 28 that matches the size of the metal boss 27, the size of the metallized through groove 28 is the same as that of the metal boss 27, the tolerance is 0.05~0.1mm, and the thickness of the metal boss 27 is the finished thickness of the microstrip plate 3 + 0.03~0.05mm; the split connector 7 is connected by using the cooperation of the second flange 30 and the third screw 29 to fix it on the housing 4.

[0060] The assembly process in this embodiment is as follows: Figure 3 As shown, the housing 4 with microstrip board 3 is fitted with cover plate 2 to adapt the position of metal boss 27 and metallized through groove 28. After aligning metal boss 27 and metallized through groove 28, blind mating of main port connector 17 and KK adapter connector 20 is completed, ensuring that metal boss 27 is in close contact with housing 4 after passing through metallized through groove 28.

[0061] This embodiment of the 1-to-256 power divider combining network has a loss ≤3.0dB@8GHz. The assembled antenna thickness meets the requirements of normal gain ≥30dB (8GHz), axial ratio ≤5dB, and gain difference ≤8.5dB. The cross-sectional dimensions are 70% smaller than those of traditional power divider combining networks. It can meet the environmental test requirements of 500 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, demonstrating good reliability and environmental adaptability.

[0062] Example 3

[0063] This embodiment is a further optimization based on Embodiment 1. The parts that are the same as those described above will not be repeated here. Figure 4-5 As shown, to further better realize the present invention, the following arrangement is specifically adopted: After the microstrip plate 3 is installed in the housing 4, conductive adhesive is poured into the metallized through groove 28. The conductive adhesive can be one of Epo-tek's H20E, Henkel's 84-1A, Heilongjiang Petrochemical Research Institute's J-423, J-425, J-427, J-428, or Zhengzhou Silande's MF1343. In this embodiment, J-423 conductive adhesive is used to form the adhesive area 31. Because the conductive adhesive will shrink after curing, it is ensured that the conductive adhesive can continuously bond the housing 4 and the cover plate 2. The adhesive area 31 is filled when the center height of the conductive adhesive is higher than that of the microstrip plate 3.

[0064] Then, the cover plate 2 is attached to the microstrip plate 3. The housing 4 and the cover plate 2 are bonded and fixed by conductive adhesive filled in the metallized through hole 13. At the same time, the main port connector 17 and the KK adapter connector 20 are blindly mated. The composite network without screws is placed in a vacuum oven and cured at 30 min @ 120℃.

[0065] After curing is complete, the first screw 1 is passed through the fixing through hole, the microstrip plate 3 and the internal thread hole in sequence. After tightening the first screw 1, the microstrip plate 3 can be clamped and fixed by the cover plate 2 and the housing 4. During installation, thread locking glue should be used between the first screw 1 and the housing 4 to increase the reliability.

[0066] The 1-to-256 power divider combining network of this embodiment has a loss of ≤2.9dB@8GHz. The assembled antenna thickness meets the requirements of normal gain ≥30.5dB (8GHz), axial ratio ≤5dB, and gain difference ≤8.0dB. The cross-sectional dimensions are 70% smaller than those of traditional power divider combining networks. It can meet the environmental test requirements of 500 temperature cycles (-40℃ to +75℃) and 13.88g random vibration, and has good reliability and environmental adaptability.

[0067] Example 4

[0068] This embodiment provides a technical solution: a low-loss large-scale power divider combining network manufactured using the manufacturing method of the low-loss large-scale power divider combining network of Embodiment 2, such as... Figure 1-2As shown, the device includes a housing and a microstrip board 3. The housing includes a shell 4 and a cover plate 2. The shell 4 and the cover plate 2 are respectively provided with a first air cavity 5 and a second air cavity 26. The non-air cavity area on one side of the shell 4 and the cover plate 2 forms a U-shaped sealing surface. The shell 4 and the cover plate 2 clamp the four edges of the microstrip board 3. The shell 4, the microstrip board 3 and the cover plate 2 are locked and fixed by multiple first screws 1. The shell 4 and the cover plate 2 clamp the four sides of the microstrip board 3 to ensure the stability of the microstrip board 3. The center of the microstrip board 3 is located in the air cavity. The first air cavity 5 and the second air cavity 26 make both sides of the microstrip board 3 air-free. The microstrip board 3 is a double-sided microstrip board 3 with a dielectric thickness ≤0.762mm and a finished surface copper thickness ≥0.035mm.

[0069] The copper clad laminate material for microstrip board 3 can be selected from Rogers' RT6002, CLTE-XT, Taconic's TSM-DS3, CF294 and CFG294 from the 46th Research Institute of China Electronics Technology Group Corporation, GNC3004 from Guoneng Company, and SG9294 from Shengyi Technology. Alternatively, copper clad laminate materials containing fiberglass cloth can be selected to enhance the dimensional stability and assemblability of microstrip board 3.

[0070] The back of the microstrip board 3 is provided with a main port connector pad 15. The main port connector pad 15 is interconnected with the main port connector 17 by soldering the connector solder wire 16. A KK adapter connector 20 is installed on the cover plate 2. The KK adapter connector 20 is installed and fixed on the cover plate 2 by one of the following methods: screw mounting, conductive adhesive, and soldering. The main port connector 17 and the KK adapter connector 20 are interconnected. In this embodiment, the KK adapter connector 20 is fixed to the cover plate 2 by screw mounting, that is, the main port connector 17 is fixed to the cover plate 2 by the first flange 19 and the second screw 18.

[0071] A resistor 21 is soldered to the back of the microstrip board 3. A resistor pad 23 is provided on the back of the microstrip board 3 and interconnected with the metallized plug hole 8. The resistor 21 is soldered to the resistor pad 23 by a resistor solder wire 22.

[0072] 256 split connectors 7 are fixed on the housing 4. The split connectors 7 are installed and fixed on the housing 4 by one of the following methods: screwing, conductive adhesive, and welding. In this embodiment, the split connectors 7 are fixed to the housing 4 by screwing, that is, the split connectors 7 are fixed to the housing 4 by the second flange 30 and the third screw 29. The split connectors 7 are double male, that is, both sides are plug type.

[0073] A metallized through-slot 28 is provided on the microstrip board 3, and a metal boss 27 adapted to the metallized through-slot 28 is machined on the cover plate 2. After assembly, the metal boss 27 is inserted into the metallized through-slot 28 to complete the installation and positioning of the housing 4, microstrip board 3 and cover plate 2.

[0074] The microstrip board 3 has a large area of ​​densely shielded metallized vias 13. The diameter of the metallized vias 13 is the diameter of the inner conductor 24 of the connector + 0.15~0.25mm, and the positional accuracy is ±0.05mm. There are 256 metallized vias 13. Each of the 256 split connectors 7 corresponds to one of the 256 metallized vias 13. The network split pads 14 are interconnected with the split network pattern 12 using the metallized vias 13. The interior of the metallized vias 13 forms a metallized insertion port 6. The inner port of the split connector 7 is interconnected with the inner conductor 24 of the connector. The inner conductor 24 of the connector is positionally matched with the metallized insertion port 6. The inner conductor 24 of the connector and the network split pad 14 are interconnected through the inner conductor solder wire 25. The outer port of the split connector 7 is interconnected with the outer conductor 10 of the connector. The outer conductor 10 of the connector is interconnected with the antenna through the outer conductor solder wire.

[0075] The above description is merely a preferred embodiment of the present invention and is illustrative rather than restrictive. Those skilled in the art will understand that many changes, modifications, and even equivalents can be made within the spirit and scope defined by the claims of the present invention, all of which will fall within the protection scope of the present invention.

Claims

1. A method for manufacturing a low-loss, large-scale power divider combining network, characterized in that: Includes the following steps: Step 1: Fabricate a power divider and synthesizer microstrip board with metallized vias, metallized plug vias, and metallized through slots. The metallized through slots are located at the four edges of the microstrip board. Step 2: Solder the resistors and main connectors onto the microstrip board; Step 3: Manufacture the shell with air cavities and the cover plate with air cavities; Step 4: Install 256 split connectors on the housing and install KK adapter connectors on the cover plate; Step 5: Install the microstrip board into the housing and complete the interconnection between the microstrip board and the 256 split connectors; Step 6: Fit the cover plate and the microstrip plate together. A connector is provided in the metallized through groove. Use the first screw to lock and fix the cover plate, microstrip plate and housing. The connector is either conductive adhesive filled into the metallized channel or a metal boss machined on the cover plate, and the metal boss is adapted to the metallized channel.

2. The method for manufacturing a low-loss large-scale power divider combining network according to claim 1, characterized in that, In step one, the specific processing steps of the microstrip board are as follows: drilling, hole metallization, resin plugging, electroplating, pattern making, surface coating, and shape processing are carried out sequentially on the raw material copper-clad board; among them, hole metallization completes the production of metallized through holes, and hole metallization, resin plugging, and electroplating complete the production of metallized plugged holes.

3. The method for manufacturing a low-loss large-scale power divider and combiner network according to claim 2, characterized in that, The copper clad laminate material is selected with a dielectric constant of less than 3.0 and a dielectric loss of less than 0.0015.

4. The method for manufacturing a low-loss large-scale power divider combining network according to claim 2, characterized in that, The surface of the microstrip plate is coated with any one of electroplated gold, electroless gold, electroplated silver, or electroless silver.

5. The method for manufacturing a low-loss large-scale power divider combining network according to claim 1, characterized in that, The specific steps of step two are as follows: place the microstrip board on a flat welding fixture and flatten it. Then, interconnect the resistors with the resistor pads and the main connector pads with the main connector using a soldering process.

6. The method for manufacturing a low-loss large-scale power divider combining network according to claim 1, characterized in that, In step four, both the split connector and the KK adapter connector are installed and fixed using one of the following methods: screw mounting, conductive adhesive bonding, or soldering.

7. The method for manufacturing a low-loss large-scale power divider and combiner network according to claim 1, characterized in that, The metal boss is connected to the metallized through slot, and the tolerance between the two is 0.05~0.1mm. The thickness of the metal boss is 0.03~0.05mm more than the thickness of the finished microstrip board.

8. The method for manufacturing a low-loss large-scale power divider and combiner network according to claim 1, characterized in that, When the connector is a conductive adhesive, the conductive adhesive is poured into and fills the metallized through groove, and the filling state is such that the center height of the conductive adhesive is higher than that of the microstrip board.

9. A low-loss large-scale power divider combining network prepared by the manufacturing method of the low-loss large-scale power divider combining network as described in any one of claims 1 to 8.

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