A machining waste chip cleaning method, system, intelligent terminal and storage medium

Abstract

The application relates to a machining waste chip cleaning method and system, an intelligent terminal and a storage medium, and relates to the field of metal cutting machining.The application comprises the following steps: acquiring a machining process of a current machining workpiece and a machining position of the workpiece on a workbench; determining a cleaning area based on the corresponding relationship between the machining process and the machining position; indicating a preset suction device to suck the waste chips and acquire a cleaning image based on the cleaning area; determining a reference waste chip amount according to comparison and analysis of the cleaning image and a preset waste chip feature; determining an invalid cleaning position based on comparison and analysis of the reference waste chip amount and a preset effective cleaning feature, and acquiring a current position of the suction device; determining a blowing movement path based on analysis of the current position of the suction device and the invalid cleaning position; and indicating a preset blowing device to move to the invalid cleaning position along the blowing movement path for blowing cleaning.The application has the effects of improving the cleaning timeliness of the chips and reducing the probability of workpiece deviation caused by subsequent installation of the workpiece.

Description

Technical Field

[0001] This application relates to the field of metal cutting technology, and in particular to a method, system, smart terminal, and storage medium for cleaning machining waste. Background Technology

[0002] When metal workpieces are processed using a CNC machining center, a certain amount of waste chips are generated under the cutting action of the cutting tools. After processing, these chips need to be cleaned in a timely manner to prevent them from clogging the CNC machining center and hindering its normal operation.

[0003] In related technologies, CNC machining centers have a machining chamber with fixtures inside to hold and fix the workpiece. After the cutting mechanism finishes cutting the workpiece, the waste chips fall onto the worktable near the fixtures. A high-pressure air gun is installed on the outer wall of the CNC machining center. The operator controls the high-pressure air gun to align with the waste chips and blows air to blow the waste chips off the CNC machining center for centralized cleaning.

[0004] Regarding the aforementioned technologies, the inventors believe that the amount of waste generated during the processing of different workpieces is inconsistent, and the area where the waste is scattered is also inconsistent during different processing steps. Repeatedly cleaning up the waste is quite tedious. If the waste is not cleaned up in time, the waste will accumulate at the workpiece installation position, which will cause the workpiece to be raised during installation, causing the workpiece to shift in processing position and affecting processing quality. There is still room for improvement. Summary of the Invention

[0005] To improve the timeliness of debris cleaning and reduce the probability of workpiece misalignment during subsequent workpiece installation, this application provides a method, system, intelligent terminal, and storage medium for cleaning machining debris.

[0006] Firstly, this application provides a method for cleaning processing waste, which adopts the following technical solution:

[0007] A method for cleaning processing waste includes:

[0008] Obtain the current machining process of the workpiece and the machining position of the workpiece on the worktable;

[0009] The cleaning area is determined based on the correspondence between processing steps and processing locations;

[0010] Based on the preset cleaning area indication, the suction device sucks up the waste and obtains the cleaning image by suction;

[0011] The baseline amount of waste is determined by comparing and analyzing the cleaned images with preset waste characteristics.

[0012] Based on the comparison and analysis between the baseline waste volume and the preset effective cleaning characteristics, the invalid cleaning locations are determined, and the current position of the suction device is obtained;

[0013] Based on the analysis of the current position of the suction device and the invalid cleaning position, the air blowing movement path is determined;

[0014] The preset air blowing device is instructed to move along the air blowing path to the invalid cleaning position to perform air blowing cleaning.

[0015] By adopting the above technical solution, different processes at the processing position are analyzed, and the waste chip splashing area formed during the corresponding process is divided, so that the suction device can accurately pick up and clean the waste chips. After processing, for some waste chips that cannot be cleaned by suction, air blowing is used to clean them, so that the waste chips are not easy to accumulate at the processing position. This reduces the probability of the workpiece being offset due to the waste chips being raised or offset when it is installed at the processing position, and helps to improve the accuracy of the workpiece during processing.

[0016] Optionally, methods for cleaning waste from the suction device include:

[0017] Before processing the workpiece, the processing steps and processing position of the workpiece are analyzed to determine the moving area of ​​the preset processing mechanism;

[0018] The cleaned area and the moved area are analyzed to determine the covering area and the splicing parameters corresponding to the covering area;

[0019] Based on the splicing parameters, the preset combination of shielding plates is used to form a shielding cover, and the shielding cover is instructed to cover the covered area at a preset covering distance;

[0020] Before processing the workpiece, the processing end time of the current workpiece is determined based on the processing steps;

[0021] During workpiece processing, the suction device is instructed to collect waste chips from the covered area and to obtain the preset waste chip collection trough position and the current blowing position of the blowing device.

[0022] Based on the analysis of the location of the waste collection trough and the current blowing position of the blowing device, the blowing movement path is determined;

[0023] At the end of the processing time, the blowing device is instructed to move along the blowing path and blow air to clean up any invalid cleaning locations.

[0024] By adopting the above technical solution, the baffle plate, based on the characteristics of different processing steps and combined with the analysis of the moving area of ​​the processing mechanism, forms a baffle that adapts to the corresponding processing characteristics of the workpiece. The baffle covers the area to be covered, thereby reducing the splashing range during the waste chip splashing process and not obstructing the movement of the processing mechanism. This is beneficial to improving the cleaning efficiency of the suction device for waste chips. At the same time, the blowing device moves according to the orientation of the waste chip collection trough, so that the blowing device can blow the waste chips into the waste chip collection trough for collection during blowing, thereby improving the cleaning effect.

[0025] Optionally, methods for forming a mask by combining splicing parameters include:

[0026] The splicing location is determined based on the movement area analysis of the processing mechanism;

[0027] The splicing positions and corresponding processing steps are analyzed to determine the splicing shape of the shield;

[0028] The splicing shape and splicing position of the shielding cover are analyzed to determine the splicing movement path of the shielding plate;

[0029] The indicator panels move along the splicing path and are assembled to form a shield;

[0030] After the baffle plates are spliced ​​together to form a baffle cover, the waste chip ejection distance between the baffle cover and the processing position is obtained;

[0031] The adjustment parameters are determined by comparing the waste ejection distance with the preset benchmark distance.

[0032] Adjust the covering distance based on the parameters.

[0033] By adopting the above technical solution, the shield is analyzed according to the moving area to determine the splicing position that will not obstruct the movement of the processing mechanism. Then, the range of motion of the processing mechanism is analyzed according to the processing content of the processing procedure, thereby further determining the splicing shape of the shield and splicing it to form the shield. Finally, the distance of the waste chip splashing is analyzed to determine whether the distance between the shield and the processing position can be further reduced to reduce the splashing range of waste chips and improve the efficiency of waste chip cleaning.

[0034] Optionally, after the shielding cover blocks the covered area, the methods for cleaning up the debris include:

[0035] Obtain the material of the workpiece currently being processed;

[0036] Determining debris size based on cleanup image analysis;

[0037] The cleaning type is determined based on the size of the waste debris and the preset material suction conditions.

[0038] Based on cleaning type analysis, activate the suction device or electromagnetic adsorption device;

[0039] When the electromagnetic adsorption device is started, the magnetic field strength and the size of the waste are analyzed to determine the magnetic field strength adjustment parameters.

[0040] The magnetic field strength adjustment parameter indicates that the electromagnetic adsorption device adjusts the magnetic strength and adsorbs waste.

[0041] By adopting the above technical solution, different workpieces have different material properties. The electromagnetic adsorption device is used to clean workpieces made of magnetic metal materials. The appropriate magnetic field strength adjustment parameters are obtained based on the size of the waste. The magnetic adsorption device can be adjusted to adjust the corresponding magnetic strength so that the waste can be effectively adsorbed and cleaned, which helps to improve the cleaning effect of waste.

[0042] Optionally, the control method for the electromagnetic adsorption device includes:

[0043] Acquire the current adsorption image of the electromagnetic adsorption device;

[0044] The adsorption status of the adsorption surface is determined by comparing and analyzing the current adsorption image with the preset adsorption uniformity characteristics.

[0045] The adsorption conditions of the adsorption surface and the preset magnetic field distribution are analyzed to determine the adsorption surface offset adjustment parameters of the electromagnetic adsorption device.

[0046] When the electromagnetic adsorption device adsorbs waste, the offset adjustment parameter instructs the electromagnetic adsorption device to adjust its offset.

[0047] By adopting the above technical solution and analyzing the adsorption image, it is determined whether the adsorption surface of the electromagnetic adsorption device is uniformly adsorbed with waste debris. The analysis is conducted on cases where uniform adsorption is not achieved on the adsorption surface, thereby obtaining parameters to instruct the electromagnetic adsorption device to adjust its offset. Based on the offset adjustment parameters, the electromagnetic adsorption device is controlled to adjust its offset, so that the adsorption surface can uniformly adsorb waste debris, which helps to increase the amount of waste debris adsorbed.

[0048] Optionally, the method for controlling the electromagnetic adsorption device to adsorb waste debris also includes:

[0049] The remaining amount of adsorption surface and the current position of the adsorption surface are determined based on adsorption images and overload adsorption feature analysis.

[0050] Based on the comparison and analysis of the remaining amount of adsorption surface and the current position of the adsorption surface, the adsorption direction parameters are determined.

[0051] The electromagnetic adsorption device is steered based on the steering parameters, and the current adsorption surface is updated accordingly.

[0052] After the current adsorption surface is updated, the remaining amount of adsorption surface is counted.

[0053] Determine the unloading adsorption surface based on residual quantity counting analysis;

[0054] The unloading time is determined based on the analysis of the unloading adsorption surface and the preset adsorption characteristics.

[0055] At the unloading time, the electromagnetic adsorption device is instructed to move to the waste collection tank for unloading.

[0056] By adopting the above technical solution, when the current adsorption surface of the electromagnetic device for adsorbing waste reaches the upper limit of the adsorption capacity, the electromagnetic adsorption device is instructed to change the adsorption surface according to the turning parameters, thereby further improving the upper limit of adsorption and collection of waste. This helps to continuously clean up waste during the continuous processing of a large number of workpieces. When all adsorption surfaces reach the adsorption limit, the electromagnetic adsorption device is controlled to move to the waste collection tank for unloading.

[0057] Optionally, before unloading, the control method for the electromagnetic adsorption device may also include:

[0058] When the unloading time is determined, the dwell position and the air intake position are determined according to the processing procedure and the processing position;

[0059] The suction device moves according to the stopping position and receives the first trigger command;

[0060] Based on the analysis of the first trigger command and the preset first trigger conditions, the replacement situation is determined;

[0061] Based on the replacement situation, the electromagnetic adsorption device is instructed to move from the covered area to the preset unloading area;

[0062] Based on the replacement situation, the suction device is instructed to move from the stationary position to the suction position and suck up the waste, and a second trigger command is obtained;

[0063] Based on the analysis of the second triggering characteristics and the preset second triggering conditions, the regression situation is determined;

[0064] Based on the regression results, the electromagnetic adsorption device is instructed to move to the covered area;

[0065] Based on the regression results, the material feeding device is instructed to move from the suction position to the dwell position and trigger the first command again.

[0066] By adopting the above technical solution, before the last adsorption surface reaches the upper limit of waste adsorption, the first command is triggered to control the electromagnetic adsorption device and the suction device to perform replacement operation, so that when the electromagnetic adsorption device unloads, the suction device can replace the electromagnetic adsorption device to suction the waste, thereby maintaining continuous cleaning of waste. After the electromagnetic adsorption device finishes unloading, the second command is triggered to replace the suction device and the electromagnetic adsorption device and return to the waste adsorption and cleaning work.

[0067] Secondly, this application provides a processing waste cleaning system, which adopts the following technical solution:

[0068] A processing waste cleaning system, comprising:

[0069] The acquisition module is used to acquire the current processing operation of the workpiece and the processing position of the workpiece on the worktable;

[0070] The judgment module determines the cleaning area based on the correspondence between processing steps and processing positions;

[0071] The processing module, connected to the acquisition module and the judgment module, uses a suction device preset based on the cleaning area indication to suck up the waste and acquire the cleaning image;

[0072] The processing module compares and analyzes the cleaned image with preset waste characteristics to determine the baseline waste amount;

[0073] The processing module compares and analyzes the baseline waste volume with preset effective cleaning features to determine invalid cleaning locations and obtain the current position of the suction device.

[0074] The processing module analyzes the current position of the suction device and the invalid cleaning positions to determine the air blowing movement path;

[0075] The processing module instructs the preset air blowing device to move along the air blowing path to the invalid cleaning position for air blowing cleaning.

[0076] By adopting the above technical solution, the acquisition module, judgment module, and processing module cooperate with each other to control the suction device to suck up and clean the waste at the processing position, so that the waste is not easy to accumulate at the processing position and cause the workpiece to shift during installation. It also instructs the air blowing device to blow away the waste that is difficult to clean by suction, so that the waste does not affect the processing position.

[0077] Thirdly, this application provides a smart terminal, which adopts the following technical solution:

[0078] A smart terminal includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed any of the above-mentioned methods for cleaning processing waste.

[0079] By adopting the above technical solution and using a smart terminal, the corresponding control program is loaded to instruct the suction device and the blowing device to cooperate with each other, thereby realizing the suction and cleaning of waste chips during the workpiece processing, and removing chips that are difficult to pass through at the end of processing.

[0080] Fourthly, this application provides a computer storage medium capable of storing corresponding programs, which improves the efficiency of waste chip removal, thereby making it less likely for waste chips to accumulate at the processing position and reducing the impact of waste chips on the stability of workpiece installation. The technical solution adopted is as follows:

[0081] A computer-readable storage medium storing a computer program that can be loaded by a processor and executed any of the above-described methods for cleaning processing waste.

[0082] By adopting the above technical solution, the storage medium contains a computer program for cleaning processing waste. By storing the corresponding control program, the suction device and the air blowing device execute the corresponding suction cleaning steps and air blowing steps, thereby cleaning the waste in a timely manner, reducing the probability that the waste will affect the stability of the workpiece installation, and the control program can be called at any time.

[0083] In summary, this application includes at least one of the following beneficial technical effects:

[0084] 1. After determining the cleaning area, instruct the suction device to pick up and clean the waste chips, so that the waste chips are not easy to accumulate at the processing position. Therefore, when the current workpiece is finished and the subsequent workpiece is installed, it is not easy to be raised or offset by the waste chips, which helps to improve the installation accuracy of the workpiece and thus improve the processing quality.

[0085] 2. Analyze the characteristics of the workpiece's processing steps and divide the coverage area according to the moving area of ​​the processing mechanism. Control the combination of baffles to form corresponding baffles to cover the parts in the coverage area, thereby reducing the waste chip splashing area and improving the cleaning efficiency when cleaning waste chips.

[0086] 3. For workpieces made of magnetic metal materials, the preset electromagnetic adsorption device is instructed to adsorb and clean the waste. The magnetic force is adjusted according to the size of the waste to meet the adsorption force requirements, thus effectively adsorbing and cleaning some larger waste. Compared with the use of a suction device for cleaning, it helps to improve the cleaning effectiveness. Attached Figure Description

[0087] Figure 1 This is a control flowchart for cleaning up machining waste in a machining center.

[0088] Figure 2 This is a flowchart of the occlusion control method for the occlusion area by the occlusion mask.

[0089] Figure 3 This is a flowchart illustrating the assembly method of splicing shielding panels to form a shielding cover.

[0090] Figure 4 This is a flowchart showing the selection method for choosing the corresponding cleaning type for waste cleaning.

[0091] Figure 5 This is a flowchart of the method for uniformly adjusting the adsorption surface of an electromagnetic adsorption device.

[0092] Figure 6 This is a flowchart illustrating the adjustment method for adsorbing waste debris on different adsorption surfaces.

[0093] Figure 7 This is a flowchart illustrating the method for replacing the electromagnetic adsorption device with the material suction device.

[0094] Figure 8 This is a flowchart of the module for cleaning up processing waste in a machining center. Detailed Implementation

[0095] To make the purpose, technical solution, and advantages of this application clearer, the following description is provided in conjunction with the appendix. Figure 1-8 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the application.

[0096] The embodiments of the present invention will now be described in further detail with reference to the accompanying drawings.

[0097] This application discloses a method for cleaning processing waste. Based on the processing steps of the workpiece and its position on the worktable, the cleaning area is determined. The suction device is instructed to collect and clean the waste after processing the workpiece. After processing is completed, the blowing device is instructed to blow away the remaining waste. This allows waste that is difficult to clean by suction to be blown away from the processing position, reducing the probability of waste causing the workpiece to be raised or misaligned during subsequent installation. This helps the workpiece to be accurately installed at the processing position, improves the accuracy of processing, and thus helps to improve the processing quality.

[0098] Reference Figure 1 The process flow for cleaning up processing waste includes the following steps:

[0099] Step S100: Obtain the current machining process of the workpiece and the machining position of the workpiece on the worktable.

[0100] The clamp is installed at the processing position, and the workpiece to be processed is defined as the current processing workpiece. The shape and size of the current processing workpiece are set by the operator according to the actual situation, and will not be described in detail.

[0101] A processing procedure is the steps a workpiece undergoes during processing, such as turning, milling, planing, and grinding. A processing procedure is a set of processing steps designed by the operator based on the final shape of the workpiece. The specific processing steps are determined by the specific shape of the workpiece and are well known to those skilled in the art, so they will not be elaborated on in detail.

[0102] The machining position refers to the location of the fixture on the machining center. Specifically, the steps for determining the machining position are as follows: obtain the model of the machining center, take a specific point on the fixture as the origin of the coordinate system, and establish a spatial rectangular coordinate system. The specific point can be set by the operator according to the actual situation. The determination of the spatial rectangular coordinate system is well known to those skilled in the art, therefore, the specific steps for determining the specific point and establishing the spatial coordinate system will not be detailed. The model of the machining center can be determined through design drawings.

[0103] Step S101: Determine the cleaning area based on the correspondence between processing steps and processing locations.

[0104] The method for determining the cleaning area is as follows: A waste sputtering database is established, storing sputtering ranges corresponding to processing steps. When a processing step is input, the corresponding sputtering range is obtained. These ranges are then aligned with the coordinates of the processing position to obtain the sputtering range of the workpiece during the corresponding step. Finally, the sputtering ranges corresponding to all processing steps are aligned after one workpiece processing cycle to obtain the maximum sputtering range. This maximum sputtering range is defined as the cleaning area. The method for establishing the database is well-known to those skilled in the art. The sputtering range database can be established by repeatedly experimenting to obtain relevant data; the specific establishment process will not be described in detail.

[0105] Step S102: Based on the pre-set cleaning area indication, the suction device sucks up the waste and obtains a cleaning image by suction.

[0106] The preset suction device is a telescopic robotic arm equipped with a suction pipe. One end of the suction pipe is equipped with a suction head, and the other end is sealed to a negative pressure suction device. When the negative pressure suction device is working, it generates a certain suction force. When the suction head is aligned with the waste, the waste is sucked in, thereby realizing the suction and cleaning of the waste.

[0107] The cleaning image is an image captured when waste chips are formed on the worktable after the workpiece has been processed. The cleaning image can be captured by a camera, which can be pre-installed on the machining center. When the workpiece is being processed, a processing command is issued, and the camera receives the processing command and captures an image, which is then defined as the cleaning image.

[0108] Step S103: Determine the baseline amount of waste by comparing and analyzing the cleaning image with the preset waste characteristics.

[0109] The sub-step of comparing and analyzing the cleaned image with the preset waste features is as follows: establish a waste quantity database, which stores waste features corresponding to the waste quantity. When a cleaned image is input, the waste quantity database can output the corresponding waste quantity in the cleaned image, and define the waste quantity as the baseline waste quantity.

[0110] Step S104: Based on the comparison and analysis between the baseline waste volume and the preset effective cleaning features, determine the invalid cleaning location and obtain the current position of the suction device.

[0111] The sub-step for comparing and analyzing the baseline waste volume with the preset effective cleaning characteristics is as follows:

[0112] First, establish an effective cleaning feature database, and then use a camera located in the processing center to obtain the current cleaning image of the cleaning area.

[0113] Then, the current cleaned image is matched and analyzed with the valid cleaned feature database to determine whether there are any invalid cleaned locations.

[0114] If no invalid cleanup location is found, continue acquiring cleanup images.

[0115] If an invalid cleaning location exists, obtain the coordinates of the invalid cleaning location and the current position of the material suction location.

[0116] In the sub-step of comparing the baseline waste material quantity with the preset effective cleaning features, the effective feature database can be established through multiple experiments and data collection. The specific method for establishing the database is set by the staff according to the actual situation and will not be described in detail. Obtaining the suction device is for the purpose of facilitating subsequent control of the blowing device. The determination of the acetylene in the invalid cleaning image can be achieved by calling the invalid cleaning features stored in the preset invalid cleaning database, and the coordinate position corresponding to the invalid cleaning feature is defined as the invalid cleaning position.

[0117] Step S105: Determine the air blowing path based on the analysis of the current position of the suction device and the invalid cleaning position.

[0118] The sub-step for analyzing the current position and invalid cleaning position of the suction device is as follows: By connecting the coordinates of the invalid cleaning position with the coordinates of the current position of the suction device, the moving direction and shortest moving path of the air blowing device are determined. The shortest moving path is defined as the air blowing moving path. The determination of the air blowing moving path is for the purpose of controlling the movement of the air blowing device in the future.

[0119] Step S106: Instruct the preset air blowing device to move along the air blowing path to the invalid cleaning position for air blowing cleaning.

[0120] The blowing device uses a gripping robot to hold the end of an air blowing pipe. The end of the air blowing pipe away from the gripping end is connected to a high-pressure air source in an airtight manner. When the high-pressure air source forms an airflow, the robot aligns the port of the air blowing pipe with the invalid cleaning position to achieve the cleaning of waste.

[0121] Reference Figure 2 The methods for cleaning waste from the suction device include:

[0122] Step S200: Before processing the workpiece, analyze the processing steps and processing position of the workpiece to determine the moving area of ​​the preset processing mechanism.

[0123] The sub-steps for analyzing processing procedures and processing locations include:

[0124] Establish a machining mechanism movement database, which stores the movement range of machining mechanisms corresponding to different machining processes. When the corresponding machining process is input, the movement range of the machining mechanism can be output, and this movement range is defined as the movement area.

[0125] Step S201: Analyze the cleaned area and the moved area to determine the covered area and the splicing parameters corresponding to the covered area.

[0126] The sub-steps for analyzing the cleaned and moved areas include:

[0127] Compare the cleaned area and the moved area, and determine whether the cleaned area and the moved area overlap.

[0128] If they overlap, the overlapping cleanup area is defined as the non-covered area.

[0129] If they do not overlap, the cleaned area is defined as the covered area.

[0130] Obtain the current position of the preset shielding plate, and determine the splicing movement direction and splicing shape based on the current position of the covering area and the shielding plate.

[0131] During the assembly of the shielding panels, a robotic arm mechanically grasps and moves them. A corresponding number of shielding panels are spliced ​​together to form a shielding cover. When the shielding panels are spliced ​​to form a shielding cover, shielding covers with different shapes and angles can be formed. These shielding covers can be fixed in shielding covers with different sizes of coverage areas. The specific splicing shape is determined by the staff by establishing a splicing database. The splicing database stores the splicing angles and shapes corresponding to the coverage areas. When a splicing area is entered into the splicing database, the splicing parameters corresponding to the corresponding splicing area can be obtained. Thus, the robotic arm can splice the shielding panels according to the corresponding parameters.

[0132] Step S202: Based on the splicing parameters, the preset combination of shielding plates is used to form a shielding cover, and the shielding cover is instructed to cover the covered area at a preset covering distance.

[0133] After the baffle plates are assembled according to the splicing parameters to form a baffle cover, they move to the covered area at a preset distance to cover the processing position. During the covering process, the side furthest from the processing mechanism is covered. The preset moving distance is the covering distance. Within the covering distance, when waste chips splash onto the baffle cover and bounce off, they will not fall back to the processing position.

[0134] Step S203: Before processing the workpiece, determine the processing end time of the current workpiece based on the processing procedure.

[0135] The processing end time is the time when the workpiece is completed according to the processing procedure. It can be obtained by establishing a processing procedure database. Each processing procedure has a corresponding time consumption. By obtaining the initial processing time on the machining center and summing the initial time with the processing time, the processing end time can be obtained. The purpose of obtaining the processing end time is to facilitate the subsequent indication and control of the material suction device.

[0136] Step S204: During workpiece processing, instruct the suction device to collect waste chips from the covered area, and obtain the preset waste chip collection trough position and the current blowing position of the blowing device.

[0137] The waste collection trough is a pre-installed waste storage trough on the machining center, allowing for the local storage of waste. When full, it can be cleaned centrally, reducing cleaning time during daily operations. The current blowing position of the blowing device can be obtained by acquiring a position image through a camera, and the position image is compared with a coordinate system to determine its location.

[0138] Step S205: Based on the location of the waste collection trough and the current blowing position of the blowing device, determine the blowing movement path.

[0139] After determining the current position of the blowing device, connect the current blowing position with the area of ​​the collection tank to determine the direction of movement and multiple movement paths, and select the path that will not cause obstacle collisions as the blowing movement path.

[0140] Step S206: At the end of the processing time, instruct the blowing device to move along the blowing path and blow air to clean the invalid cleaning positions.

[0141] The blowing device is controlled according to the blowing path to clean the ineffective cleaning location by blowing air. The blowing cleaning method can generate a large blowing force, so that the waste at the ineffective cleaning location enters the waste collection tank under the action of the strong airflow.

[0142] Reference Figure 3 Methods for forming a mask by combining splicing parameters include:

[0143] Step S300: Determine the splicing position based on the movement area analysis of the processing mechanism.

[0144] The splicing position is the position where the shield is spliced. By comparing the images of the moving area and the covered area, the overlapping area is determined, and the splicing position is marked in the non-overlapping area to reduce the probability of the processing mechanism colliding with the shield during the movement.

[0145] Step S301: Analyze the splicing position and corresponding processing steps to determine the splicing shape of the shield.

[0146] The splicing shape is the external shape of the shield when it is spliced ​​together. It is determined by the splicing database in step S200 above. The splicing database stores the processing steps corresponding to the splicing shape. When the corresponding processing step is input, the corresponding splicing shape can be obtained.

[0147] Step S302: Analyze the splicing shape and splicing position of the shielding cover to determine the splicing movement path of the shielding plate.

[0148] The movement path of the shield can be determined by first obtaining the position of the shield when it is not spliced ​​into a shield, connecting the coordinates of the splicing position with the coordinates of the position when the shield is not spliced ​​into a shield, and defining this connection as the splicing movement path.

[0149] Step S303: Instruct the shielding plates to move along the splicing movement path and splice them together to form a shielding cover.

[0150] The shielding panels move and are spliced ​​along the splicing path to form a shielding cover suitable for the processing procedure.

[0151] Step S304: After the shielding plates are spliced ​​to form a shielding cover, the waste chip ejection distance between the shielding cover and the processing position is obtained.

[0152] The chip ejection distance is the distance at which chips will be ejected during the machining process of the workpiece, and it is determined by the chip ejection database.

[0153] Step S305: Based on the comparison and analysis between the waste ejection distance and the preset benchmark distance, determine the adjustment parameters.

[0154] Once the position of the shield is determined, the rebound distance of the debris upon contact with the shield during the sputtering process can be calculated through 3D modeling and simulation. This rebound distance is compared with a preset reference distance. If the rebound distance is greater than the reference distance, it indicates that the debris will return to the processing position. In this case, the adjustment distance pre-stored in the adjustment database needs to be called, and the shield needs to be moved and adjusted accordingly. If the rebound distance is less than the reference distance, it indicates that the debris will not return to the processing position, and no adjustment of the shield is required. The adjustment distance is the corresponding adjustment parameter.

[0155] Step S306: Adjust the covering distance based on the adjustment parameters.

[0156] The adjustment distance is compared with the shielding distance. When the adjustment distance coincides with the shielding distance, an adjustment command is issued. The shielding responds to the adjustment command and adjusts its position so that the shielding will not affect the rebound of waste chips and prevent waste chips from falling back to the processing position.

[0157] Reference Figure 4 After the shielding cover blocks the area, the methods for cleaning up the debris include:

[0158] Step S400: Obtain the workpiece material of the currently processed workpiece.

[0159] The material of the workpiece for processing rods is the material used in the workpiece processing. This material can be determined by the staff, and a corresponding material database can be established after the processing materials are organized. Before processing, the image of the workpiece is acquired by a camera and entered into the material database for comparison, thereby determining the material of the current workpiece and judging whether the workpiece material is a magnetic metal or a non-magnetic metal. When the workpiece is a magnetic metal, it is marked as a magnetic metal workpiece.

[0160] Step S401: Determine the size of the debris based on the cleaning image analysis.

[0161] Image analysis is performed on the cleaning images to determine the size of the debris. The purpose of analyzing the size of the debris is to facilitate the subsequent determination of the cleaning method.

[0162] Step S402: Determine the cleaning type based on the size of the waste debris and the preset material suction conditions.

[0163] The cleaning types are adsorption cleaning, suction cleaning, and air blowing cleaning. Smaller waste particles can be cleaned in these three ways. When the waste particles are larger, they can be cleaned by air blowing. The size of the waste particles can be determined by comparing the waste particle features extracted from the cleaning image with a pre-set baseline waste particle size and judging whether the waste particle size exceeds the baseline waste particle size. The purpose of this judgment is to facilitate subsequent waste particle cleaning control.

[0164] Step S403: Activate the suction device or electromagnetic adsorption device based on the cleaning type analysis.

[0165] When analyzing cleaning types, the analysis sub-steps include:

[0166] Determine whether the volume of the waste debris is smaller than the reference waste debris size.

[0167] If the size is less than the specified value, the suction device will be activated to suction the waste material.

[0168] If the waste is larger than the benchmark waste, then determine whether it is a metallic magnetic material.

[0169] If the material is a metallic magnetic material, the magnetic adsorption device will be activated, and the device will be controlled to adsorb waste debris in the covered area.

[0170] If the material is non-metallic magnetic, activate the suction device to collect and clean the waste within the covered area.

[0171] Step S404: When the electromagnetic adsorption device is started, an analysis is performed based on the preset magnetic field strength and the size of the waste debris to determine the magnetic field strength adjustment parameters.

[0172] Step S405: Based on the magnetic field strength adjustment parameter, instruct the electromagnetic adsorption device to adjust the magnetic strength and instruct the electromagnetic adsorption device to adsorb waste.

[0173] The steps for determining the magnetic field strength adjustment parameters and instructing the electromagnetic adsorption device to adsorb waste debris include:

[0174] The system calls upon a pre-set magnetic adjustment database, inputting the size of the waste debris into it. Since the database stores the magnetic strength corresponding to each waste debris size, its creation can be achieved through repeated experiments to obtain data. The specific creation method is a common practice among those skilled in the art and will not be described in detail here. By identifying waste debris of corresponding sizes, the corresponding magnetic strength is obtained. This magnetic strength is defined as the strength to be adjusted. The magnetic strength at startup of the magnetic adsorption device is compared with the strength to be adjusted to obtain the adjustment range, which is then used for adjustment. After completing the magnetic strength adjustment, the electromagnetic adsorption device is controlled to adsorb and clean the waste debris within the covered area.

[0175] Reference Figure 5 The control methods for the electromagnetic adsorption device include:

[0176] Step S500: Obtain the current adsorption image of the electromagnetic adsorption device.

[0177] The electromagnetic adsorption device is an adsorption device that forms an adsorption strength through electromagnetic induction. The adsorption device consists of a clamping mechanical wall and an adsorption magnetic metal block. The magnetic metal block has multiple adsorption surfaces, which can be used for magnetic metal waste to adhere. When the electromagnetic adsorption device adsorbs the waste, it sends an acquisition command. After receiving the acquisition command, the camera acquires an image of the electromagnetic adsorption block and defines the image as the current adsorption image.

[0178] Step S501: Based on the comparison and analysis between the current adsorption image and the preset adsorption uniformity features, the adsorption status of the adsorption surface is determined.

[0179] The pre-established adsorption feature database is called up. The database contains uniform adsorption features. When the current adsorption image is input, it can be determined whether the current adsorption surface is uniformly adsorbing the waste. The purpose of this determination is to facilitate the subsequent control of the electromagnetic adsorption device.

[0180] Step S502: Analyze the adsorption situation of the adsorption surface and the preset magnetic field distribution to determine the adsorption surface offset adjustment parameters of the electromagnetic adsorption device.

[0181] Step S503: When the electromagnetic adsorption device adsorbs waste, the electromagnetic adsorption device is instructed to adjust its offset based on the offset adjustment parameter.

[0182] If the current adsorption surface is uniformly adsorbing waste, no additional control is required for the electromagnetic adsorption device.

[0183] If uneven adsorption occurs on the current adsorption surface, the current adsorption image is analyzed to determine the location with less adsorption. This location is defined as the turning position, and the electromagnetic adsorption device is controlled to offset and rotate the magnetic metal block. After the magnetic metal block is offset, the turning position is brought closer to the waste, so that the waste is preferentially adsorbed on the current adsorption surface. The image of the adsorption surface is continuously acquired, and the turning position is repeatedly updated.

[0184] Reference Figure 6 The methods for controlling the electromagnetic adsorption device to adsorb waste debris also include:

[0185] Step S600: Determine the remaining amount of adsorption surface and the current position of the adsorption surface based on the adsorption image and overload adsorption feature analysis.

[0186] The remaining adsorption surface quantity refers to the number of adsorption surfaces of the magnetic metal block. The number of adsorption surfaces is set to at least two, with the specific number determined by the operator; this is not detailed in this embodiment. The current adsorption surface quantity can be determined by comparing and analyzing adsorption images. The remaining adsorption surface quantity can be obtained by marking and counting the current adsorption surfaces, and then subtracting the marked number from the total number of adsorption surfaces.

[0187] Step S601: Determine the adsorption direction parameters based on the comparison and analysis of the remaining amount of adsorption surface and the current position of the adsorption surface.

[0188] Step S602: Instruct the electromagnetic adsorption device to turn based on the steering parameters and update the current adsorption surface.

[0189] The parameters corresponding to the steering parameters are the steering angle and the steering direction. The steering direction is determined by the current position of the adsorption surface and the position of the adsorption surface to be turned. The adsorption surface to be turned is the adsorption surface that has not been adsorbed for waste. When the number of adsorption surfaces is greater than two, the adsorption surfaces are sorted and arranged in ascending order. If it is necessary to adjust the next adsorption surface to adsorb waste, the number of the current adsorption surface is incremented by one to determine the next adsorption surface. The magnetic metal block is controlled to rotate in one direction until the position of the next adsorption surface coincides with the position of the previous adsorption surface.

[0190] Step S603: After the current adsorption surface is updated, count the remaining amount of the adsorption surface.

[0191] The remaining quantity can be determined based on the order of the adsorption surfaces. The number of remaining adsorption surfaces can be obtained by calculating the difference between the current adsorption surface number and the largest adsorption surface number.

[0192] Step S604: Determine the unloading adsorption surface based on the remaining quantity count analysis.

[0193] Once the remaining quantity is determined, the number of remaining adsorption surfaces and the sequence number of the last adsorption surface can be identified. The adsorption surface with the largest value is defined as the unloading adsorption surface, which facilitates the subsequent removal of debris from the magnetic metal block.

[0194] Step S605: Determine the unloading time based on the analysis of the unloading adsorption surface and the preset adsorption characteristics.

[0195] Step S606: At the unloading time, instruct the electromagnetic adsorption device to move into the waste collection tank for unloading.

[0196] After the unloading adsorption surface is updated to the current adsorption surface, the image of the current adsorption surface is acquired again and input into the preset adsorption upper limit database. The adsorption upper limit database stores the adsorption upper limit characteristics. The adsorption upper limit characteristics are compared and analyzed with the image of the current adsorption surface to determine the remaining adsorption amount. Based on the remaining adsorption amount, the remaining adsorption amount is compared with the upper limit benchmark adsorption amount. If the remaining adsorption amount is not less than the upper limit benchmark adsorption amount, a stop command is output and the command output time is acquired. After adding a waiting time based on the command output time, the time for stopping adsorption is output. This time is defined as the unloading time. At the unloading time, the electromagnetic adsorption device is controlled to move to the waste collection tank for unloading. During unloading, the power supply connected to the magnetic metal block is turned on, causing the magnetic metal block to lose its magnetic attraction, thus completing the unloading of waste.

[0197] Reference Figure 7 Before unloading from the electromagnetic adsorption device, the control methods for the electromagnetic adsorption device also include:

[0198] Step S700: When the unloading time is determined, the dwell position and the suction position are determined according to the processing procedure and the processing position.

[0199] The suction position is the location where the suction device picks up the workpiece during machining. The suction position can be determined by dividing the machining area according to a preset radius to obtain the suction range. When the suction device moves into the suction range, it is adjacent to the machining area. By comparing the suction range with the movement area of ​​the machining mechanism during the machining process, a safe zone where collisions will not occur is determined. A point is randomly selected within the safe zone, and its coordinates are defined as the stopping position. Then, the point closest to the machining position is selected from the safe zone, and its coordinates are defined as the suction position.

[0200] Step S701: Move the suction device according to the dwell position and obtain the first trigger command.

[0201] When the suction device moves toward the stopping position, the distance between the suction device and the stopping position is calculated and it is determined whether it is less than the preset reference collision distance. If it is not less than the reference collision distance, no additional control is performed. When the distance between the suction device and the stopping position is less than the reference collision distance, a trigger signal is issued and the trigger signal is defined as a trigger command.

[0202] Step S702: Based on the analysis of the first trigger command and the preset first trigger condition, determine the replacement situation.

[0203] The replacement situation corresponding to the first triggering situation is: the control is to replace the suction device with the electromagnetic adsorption device, and at the same time stop the electromagnetic adsorption device from adsorbing, start the suction device to suck up the waste.

[0204] Step S703: Based on the replacement situation, instruct the electromagnetic adsorption device to move from the covered area to the preset unloading area.

[0205] After the electromagnetic adsorption device is replaced by the material suction device, the position of the preset material feeding area is obtained. The preset material feeding area is located directly above the opening of the waste collection trough. The position of the opening of the waste collection trough is determined by image recognition. When the electromagnetic adsorption device stops working, the material feeding area is marked and connected to the current position of the electromagnetic adsorption device to determine the direction of material feeding movement. The electromagnetic adsorption device is controlled to move along the direction of material feeding movement. During the movement, the image of the material feeding area is acquired, and it is determined whether there are unloading characteristics in the image of the material feeding area. If there are unloading characteristics, the electromagnetic adsorption device is controlled to de-energize the magnetic metal block.

[0206] Step S704: Based on the replacement situation, instruct the suction device to move from the dwell position to the suction position and suck up the waste, and obtain the second trigger command.

[0207] When the electromagnetic adsorption device moves along the material feeding direction, the suction device is controlled to move from the stopping position to the suction position to suction the material and acquire a proximity image. It is then determined whether the proximity image contains electromagnetic adsorption device features. The electromagnetic adsorption device features can be obtained by calling up a preset electromagnetic adsorption feature image database. When the proximity image contains electromagnetic adsorption device features, it indicates that the unloading device has completed unloading and is resetting, and a second trigger signal, i.e., a second trigger command, is issued.

[0208] Step S705: Analyze the second triggering features and the preset second triggering conditions to determine the regression situation.

[0209] The return situation refers to the situation when the electromagnetic adsorption device is reset. The characteristic of the electromagnetic adsorption device is defined as the second triggering characteristic. When the second triggering command is issued, it means that the electromagnetic adsorption device is approaching the suction device and will replace the suction device to perform waste adsorption operation.

[0210] Step S706: Based on the regression results, instruct the electromagnetic adsorption device to move to the covered area.

[0211] The electromagnetic adsorption device gradually moves toward the material suction device, and the electromagnetic adsorption device is controlled to move into the acquisition cover area to facilitate subsequent cleaning of waste.

[0212] Step S707: Based on the regression situation, instruct the suction device to move from the suction position to the dwell position and re-trigger the first command.

[0213] After the electromagnetic adsorption device replaces the material suction device, the material suction device is controlled to move from the covered area toward the stopping position and the material suction operation is stopped. The first trigger command is then re-acquired to determine the time when the material suction device and the electromagnetic adsorption device will replace each other next.

[0214] Reference Figure 8 Based on the same inventive concept, embodiments of the present invention provide a processing waste cleaning system, comprising:

[0215] The acquisition module is used to acquire the current processing step of the workpiece and the processing position of the workpiece on the worktable.

[0216] The judgment module determines the cleaning area based on the correspondence between processing steps and processing positions.

[0217] The processing module, connected to the acquisition module and the judgment module, uses a pre-set suction device based on the cleaning area indication to suck up the waste and acquire a cleaning image.

[0218] The processing module compares and analyzes the cleaned image with preset waste characteristics to determine the baseline waste quantity.

[0219] The processing module compares and analyzes the baseline waste volume with preset effective cleaning features to determine invalid cleaning locations and obtain the current position of the suction device.

[0220] The processing module analyzes the current position of the suction device and invalid cleaning positions to determine the air blowing path.

[0221] The processing module instructs the preset air blowing device to move along the air blowing path to the invalid cleaning position for air blowing cleaning.

[0222] The shielding splicing control module shields the processing position before workpiece processing, making it less likely for waste chips to splash over a large area during processing, reducing the cleaning area and improving the cleaning efficiency of waste chips.

[0223] The shield parameter forming module splices the shields according to the workpiece's processing steps and splicing positions to form a shield that can adapt to the waste splicing range. At the same time, it forms adjustment parameters to further correct and reduce the distance between the shield and the processing position.

[0224] The magnetic waste cleaning module uses magnetic adsorption to clean the workpiece based on its material properties. For larger waste pieces, the magnetic strength can be adjusted to improve the adhesion of the waste pieces.

[0225] The adsorption surface uniformity adjustment module detects the surface of the magnetic adsorption device that adsorbs waste debris, and adjusts the rotation angle according to the amount of waste debris adsorbed on the surface, so that the adsorption surface can adsorb waste debris evenly.

[0226] The adsorption surface replacement control module replaces the adsorption surface when the current adsorption surface reaches the upper limit of the waste adsorption capacity, so as to facilitate continuous adsorption and cleaning of waste.

[0227] The cleaning device replacement module controls the replacement of the suction device and the second-generation adsorption device before the maximum waste adsorption limit is reached, so as to ensure the normal operation of waste adsorption.

[0228] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0229] This invention provides a computer-readable storage medium storing a computer program that can be loaded by a processor and executed as a method for cleaning processing waste.

[0230] Computer storage media include, for example, USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, optical disks, and other media that can store program code.

[0231] Based on the same inventive concept, embodiments of the present invention provide a smart terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed to clean up processing waste.

[0232] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0233] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Any feature disclosed in this specification (including the abstract and drawings) may be replaced by other equivalent or similar features unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is only one example of a series of equivalent or similar features.

Claims

1. A method for cleaning processing waste, characterized in that, include: Obtain the current machining process of the workpiece and the machining position of the workpiece on the worktable; The cleaning area is determined based on the correspondence between processing steps and processing locations; Based on the preset cleaning area indication, the suction device sucks up the waste and obtains the cleaning image by suction; The baseline amount of waste is determined by comparing and analyzing the cleaned images with preset waste characteristics. Based on the comparison and analysis between the baseline waste volume and the preset effective cleaning features, invalid cleaning locations are determined, and the current position of the suction device is obtained. This includes: establishing an effective cleaning feature database and acquiring the current cleaning image of the cleaning area through a camera installed in the machining center; matching and analyzing the current cleaning image with the effective cleaning feature database to determine whether there is an invalid cleaning location; if there is no invalid cleaning location, then continue to acquire cleaning images; if there is an invalid cleaning location, then acquire the coordinates of the invalid cleaning location and obtain the current position of the suction device. Based on the analysis of the current position of the suction device and the invalid cleaning position, the air blowing movement path is determined, including: by connecting the coordinate points of the invalid cleaning position with the coordinates of the current position of the suction device, the movement direction of the air blowing device and the shortest movement path are determined, and the shortest movement path is defined as the air blowing movement path. The preset air blowing device is instructed to move along the air blowing path to the invalid cleaning position to perform air blowing cleaning.

2. The method for cleaning processing waste according to claim 1, characterized in that, Methods for cleaning waste from the suction device include: Before processing the workpiece, the processing steps and processing position of the workpiece are analyzed to determine the moving area of ​​the preset processing mechanism; The cleaned area and the moved area are analyzed to determine the covering area and the splicing parameters corresponding to the covering area; Based on the splicing parameters, the preset combination of shielding plates is used to form a shielding cover, and the shielding cover is instructed to cover the covered area at a preset covering distance; Before processing the workpiece, the processing end time of the current workpiece is determined based on the processing steps; During workpiece processing, the suction device is instructed to collect waste chips from the covered area and to obtain the preset waste chip collection trough position and the current blowing position of the blowing device. Based on the analysis of the location of the waste collection trough and the current blowing position of the blowing device, the blowing movement path is determined; At the end of the processing time, the blowing device is instructed to move along the blowing path and blow air to clean up any invalid cleaning locations.

3. The method for cleaning processing waste according to claim 2, characterized in that, Methods for forming a mask by combining splicing parameters include: The splicing location is determined based on the movement area analysis of the processing mechanism; The splicing positions and corresponding processing steps are analyzed to determine the splicing shape of the shield; The splicing shape and splicing position of the shielding cover are analyzed to determine the splicing movement path of the shielding plate; The indicator panels move along the splicing path and are assembled to form a shield; After the baffle plates are spliced ​​together to form a baffle cover, the waste chip ejection distance between the baffle cover and the processing position is obtained; The adjustment parameters are determined by comparing the waste ejection distance with the preset benchmark distance. Adjust the covering distance based on the parameters.

4. The method for cleaning processing waste according to claim 3, characterized in that, After the shielding cover blocks the area, the methods for cleaning up the debris include: Obtain the material of the workpiece currently being processed; Determining debris size based on cleanup image analysis; The cleaning type is determined based on the size of the waste debris and the preset material suction conditions. Based on cleaning type analysis, activate the suction device or electromagnetic adsorption device; When the electromagnetic adsorption device is started, the magnetic field strength and the size of the waste are analyzed to determine the magnetic field strength adjustment parameters. The magnetic field strength adjustment parameter indicates that the electromagnetic adsorption device adjusts the magnetic strength and adsorbs waste.

5. The method for cleaning processing waste according to claim 4, characterized in that, The control methods for electromagnetic adsorption devices include: Acquire the current adsorption image of the electromagnetic adsorption device; The adsorption status of the adsorption surface is determined by comparing and analyzing the current adsorption image with the preset adsorption uniformity characteristics. The adsorption conditions of the adsorption surface and the preset magnetic field distribution are analyzed to determine the adsorption surface offset adjustment parameters of the electromagnetic adsorption device. When the electromagnetic adsorption device adsorbs waste, the offset adjustment parameter instructs the electromagnetic adsorption device to adjust its offset.

6. The method for cleaning processing waste according to claim 5, characterized in that, Methods for controlling the adsorption of waste by electromagnetic adsorption devices also include: The remaining amount of adsorption surface and the current position of the adsorption surface are determined based on adsorption images and overload adsorption feature analysis. Based on the comparison and analysis of the remaining amount of adsorption surface and the current position of the adsorption surface, the adsorption direction parameters are determined. The electromagnetic adsorption device is steered based on the steering parameters, and the current adsorption surface is updated accordingly. After the current adsorption surface is updated, the remaining amount of adsorption surface is counted. Determine the unloading adsorption surface based on residual quantity counting analysis; The unloading time is determined based on the analysis of the unloading adsorption surface and the preset adsorption characteristics. At the unloading time, the electromagnetic adsorption device is instructed to move to the waste collection tank for unloading.

7. The method for cleaning processing waste according to claim 6, characterized in that, Before unloading from the electromagnetic adsorption device, the control methods for the electromagnetic adsorption device also include: When the unloading time is determined, the dwell position and the air intake position are determined according to the processing procedure and the processing position; The suction device moves according to the stopping position and receives the first trigger command; Based on the analysis of the first trigger command and the preset first trigger conditions, the replacement situation is determined; Based on the replacement situation, the electromagnetic adsorption device is instructed to move from the covered area to the preset unloading area; Based on the replacement situation, the suction device is instructed to move from the stationary position to the suction position and suck up the waste, and a second trigger command is obtained; Based on the analysis of the second triggering characteristics and the preset second triggering conditions, the regression situation is determined; Based on the regression results, the electromagnetic adsorption device is instructed to move to the covered area; Based on the regression results, the material feeding device is instructed to move from the suction position to the dwell position and trigger the first command again.

8. A processing waste cleaning system, characterized in that, include: The acquisition module is used to acquire the current processing operation of the workpiece and the processing position of the workpiece on the worktable; The judgment module determines the cleaning area based on the correspondence between processing steps and processing positions; The processing module, connected to the acquisition module and the judgment module, uses a suction device preset based on the cleaning area indication to suck up the waste and acquire the cleaning image; The processing module compares and analyzes the cleaned image with preset waste characteristics to determine the baseline waste amount; The processing module, based on a comparison and analysis of the baseline waste volume and preset effective cleaning features, determines invalid cleaning locations and obtains the current position of the suction device. This includes: establishing an effective cleaning feature database and acquiring current cleaning images of the cleaning area using a camera located in the machining center; matching and analyzing the current cleaning images with the effective cleaning feature database to determine if invalid cleaning locations exist; if no invalid cleaning locations exist, continuing to acquire cleaning images; if invalid cleaning locations exist, acquiring the coordinates of the invalid cleaning locations and obtaining the current position of the suction device. The processing module analyzes the current position of the suction device and the invalid cleaning position to determine the air blowing movement path, including: connecting the coordinate points of the invalid cleaning position with the coordinates of the current position of the suction device to determine the movement direction of the air blowing device and the shortest movement path, and defining the shortest movement path as the air blowing movement path; The processing module instructs the preset air blowing device to move along the air blowing path to the invalid cleaning position for air blowing cleaning.

9. A smart terminal, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer program is stored that can be loaded by a processor and executed according to any one of claims 1 to 7.

Images