A manufacturing process of a non-contact quartz chuck and a processing device thereof

Abstract

The application discloses a manufacturing process and processing equipment of a non-contact quartz suction disc, and the quartz suction disc comprises a sheet-shaped upper suction disc plate and a sheet-shaped lower suction disc plate; a gas outlet flow guide groove is formed on the upper end face of the lower suction disc plate; a plurality of upper and lower opening inclined gas outlet holes are formed on the bottom face of the gas outlet flow guide groove; the upper suction disc plate is adhered to the upper end face of the lower suction disc plate through inorganic glue; during the processing of the quartz suction disc, the gas outlet flow guide groove and the inclined gas outlet holes are first processed on one surface of the lower suction disc plate, the gas inlet holes are processed on the upper suction disc plate, then the lower suction disc plate and the upper suction disc plate are adhered through the inorganic glue, and finally sintering is performed; the processing mode is convenient for gas channel processing, the thickness of the whole suction disc is relatively small, and the suction disc can adapt to a narrow working environment; meanwhile, the suction disc is high-temperature resistant through the sintering mode; the use of the inorganic glue not only increases the overall strength of the suction disc, but also avoids small particles from scratching the silicon wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of silicon wafer production, in particular to a non-contact quartz chuck manufacturing process and processing equipment thereof. BACKGROUND

[0002] The chuck needs to be used when the silicon wafer is transferred, and an air duct is processed in the chuck. Generally, the processing method is to drill a circular hole in a thick whole plate, and then seal the two ends to form an air duct. However, due to the long and thin air duct, a long and thin drill bit needs to be used for drilling. In this process, the direction accuracy of the hole cannot be guaranteed, and the above processing method needs to satisfy the thickness of the plate to reach a large value, which makes it unable to adapt to the requirement of small working area space in the silicon wafer processing. Therefore, another processing method needs to be sought for chuck processing. SUMMARY

[0003] In order to obtain a chuck with small thickness and simple air duct processing, the present application provides a non-contact quartz chuck manufacturing process and processing equipment thereof.

[0004] The non-contact quartz chuck manufacturing process and processing equipment thereof provided by the present application adopt the following technical scheme:

[0005] A non-contact quartz chuck manufacturing process, specifically comprising the following steps:

[0006] Step S001, quartz thin plate manufacturing: first, grinding the upper and lower surfaces of the upper plate of the chuck and the upper and lower surfaces of the lower plate of the chuck; then processing an air inlet hole on the upper plate of the chuck and processing an air flow guide groove and an inclined air outlet hole on the lower plate of the chuck;

[0007] Step S002, gluing: in a clean room with cleanliness of more than 1000, using a glue spreading machine to spread inorganic glue on the surface of the lower plate of the chuck where the air flow guide groove is located;

[0008] Step S003, bonding: in a clean room with cleanliness of more than 1000, positioning the upper plate of the chuck directly above the lower plate of the chuck, and then pressing the upper plate of the chuck on the lower plate of the chuck to bond them into one;

[0009] Step S004, sintering: placing the bonded quartz chuck into a sintering furnace for sintering, the temperature of the sintering furnace is raised to 1000℃ at a speed of less than or equal to 120℃ per hour, and the sintering temperature is maintained at 1000℃ for a period of time;

[0010] Step S005, natural cooling at room temperature.

[0011] By adopting the technical scheme, firstly, the airflow guide groove and the inclined air outlet hole are machined on one surface of the lower plate of the suction disc, the air inlet hole is machined on the upper plate of the suction disc, then the lower plate of the suction disc and the upper plate of the suction disc are bonded by inorganic glue, and finally sintering is performed, so that the air channel is convenient to process, the thickness of the suction disc is thin, and the suction disc can adapt to a narrow working environment; meanwhile, the suction disc is high-temperature resistant through sintering; the use of inorganic glue not only increases the overall strength of the suction disc, but also avoids scratching the silicon wafer by small particles.

[0012] Optionally, after grinding, the flatness of the upper and lower surfaces of the upper plate and the lower plate of the suction disc is 0.03 mm.

[0013] By adopting the technical scheme, the flatness of the upper and lower surfaces of the upper plate and the lower plate of the suction disc is 0.03 mm, which is beneficial to the bonding of inorganic glue and avoids accidental scratching of the silicon wafer during subsequent suction.

[0014] Optionally, the sintering temperature is 1000℃, and the sintering time is 1-3 hours.

[0015] By adopting the technical scheme, the sintering time in the sintering temperature of 1000℃ is controlled to be 1-3 hours, and the performance of the obtained suction disc is better.

[0016] An equipment for processing a non-contact quartz suction disc, comprising a grinding machine for grinding the upper and lower surfaces of the upper plate and the lower plate of the suction disc, and a bonding positioning device for positioning the upper plate of the suction disc directly above the lower plate of the suction disc.

[0017] By adopting the technical scheme, the grinding machine completes the grinding of the upper and lower surfaces of the upper plate and the lower plate of the suction disc, and improves the grinding efficiency; the bonding positioning device positions the upper plate of the suction disc directly above the lower plate of the suction disc, which is beneficial to the position stability during subsequent bonding.

[0018] Optionally, the grinding machine comprises a machine frame, a grinding seat and a grinding mechanism arranged on the machine frame; a cylindrical groove-shaped grinding groove is arranged on the upper end surface of the grinding seat; an upper plate support seat, a lower plate support seat and a workpiece driving assembly are arranged in the grinding groove; the workpiece driving assembly is used to drive the upper plate support seat and the lower plate support seat to revolve around the rotation center axis of the grinding groove and to rotate around the rotation center axis thereof; an upper plate placing groove is arranged on the upper end surface of the upper plate support seat for vertically inserting the upper plate of the suction disc in a horizontal state; and a lower plate placing groove is arranged on the upper end surface of the lower plate support seat for vertically inserting the lower plate of the suction disc in a horizontal state.

[0019] By adopting the technical scheme, the suction plate upper plate is placed in the upper plate placing groove, and the suction plate lower plate is placed in the lower plate placing groove, so that the grinding of one surface of the suction plate upper plate and the suction plate lower plate is simultaneously completed by one-time grinding, the grinding efficiency is improved, and in the grinding process, the suction plate lower plate and the suction plate upper plate revolve around the rotation center axis of the grinding groove and rotate around their own rotation center axes, so that the surfaces of the suction plate lower plate and the suction plate upper plate are uniformly ground, and the grinding quality is improved.

[0020] Optionally, a plurality of lower plate corner avoiding grooves are arranged on the side wall of the lower plate placing groove; the lower plate corner avoiding grooves correspond to the corners of the suction plate lower plate one by one; a plurality of upper plate corner avoiding grooves are arranged on the side wall of the upper plate placing groove; the upper plate corner avoiding grooves correspond to the corners of the suction plate upper plate one by one.

[0021] By adopting the technical scheme, in the grinding process of the suction plate lower plate and the suction plate upper plate, stress is easily concentrated at the corners, which causes the corners of the suction plate lower plate and the suction plate upper plate to collapse, and the arrangement of the lower plate corner avoiding grooves and the upper plate corner avoiding grooves avoids stress concentration and damage to the suction plate lower plate and the suction plate upper plate in the grinding process.

[0022] Optionally, the adhesive positioning device comprises a tool support seat and an upper plate supporting mechanism; a lower plate placing groove into which the suction plate lower plate is vertically inserted in a horizontal state is formed on the upper end face of the tool support seat; a positioning support seat is formed on the upper end face of the tool support seat; a vertically sliding groove with an upper opening and a lower opening is formed on the vertical end face of the positioning support seat close to the lower plate placing groove; the lower end of the vertically sliding groove is communicated with the lower plate placing groove; the vertically sliding groove is used for vertically sliding the upper clamping handle of the suction plate upper plate and the lower clamping handle of the suction plate lower plate; the upper plate supporting mechanism comprises a horizontal bottom supporting assembly and a suction plate upper plate end limiting assembly; the horizontal bottom supporting assembly is used for supporting the suction plate upper plate; the suction plate upper plate end limiting assembly is opposite to the vertically sliding groove and cooperates with the vertically sliding groove to position the suction plate upper plate.

[0023] By adopting the technical scheme, in the use process, first, the suction plate lower plate coated with inorganic glue is placed into the lower plate placing groove, then the suction plate upper plate is placed on the horizontal bottom supporting assembly and the upper clamping handle thereof is located in the vertically sliding groove, then the suction plate upper plate end limiting assembly is started to enable the suction plate upper plate to be positioned by the positioning support seat and the suction plate upper plate end limiting assembly, so that the suction plate upper plate is located directly above the suction plate lower plate, then the suction plate upper plate end limiting assembly is started to be separated from the suction plate upper plate, then the horizontal bottom supporting assembly is separated from the suction plate upper plate, then the suction plate upper plate vertically falls on the suction plate lower plate due to the self weight, so that the accuracy between the positions of the suction plate upper plate and the suction plate lower plate is improved, and finally the suction plate upper plate is pressed manually or with the aid of a tool, so that the suction plate upper plate and the suction plate lower plate are connected into an integral whole by the inorganic glue.

[0024] Optionally, the horizontal supporting assembly comprises a pair of horizontal supporting plates and a pair of supporting plate driving members; the supporting plate driving members correspond to the horizontal supporting plates one by one and the supporting plate driving members are used for driving the horizontal supporting plates to move horizontally along the upper end surface of the positioning support base; and the pair of horizontal supporting plates are synchronously away from or close to each other.

[0025] By adopting the above technical scheme, when the pair of horizontal supporting plates abut against each other, the pair of horizontal supporting plates are used for supporting the upper plate of the suction disc, and when the pair of horizontal supporting plates are away from each other, the upper plate of the suction disc automatically falls due to the weight, so as to facilitate the feeding of the upper plate of the suction disc and facilitate the upper plate of the suction disc to reach the correct position on the lower plate of the suction disc.

[0026] Optionally, the end limiting assembly of the upper plate of the suction disc comprises an end limiting plate and a limiting driving member; the limiting driving member is used for driving the end limiting plate to move horizontally and close to or away from the positioning support base.

[0027] By adopting the above technical scheme, when the limiting driving member drives the end limiting plate to close to the positioning support base, the end limiting plate drives the upper plate of the suction disc to move until the upper clamping handle away from one end of the end limiting plate abuts against the side wall of the vertical sliding groove away from the end limiting plate, so as to move the upper plate of the suction disc to the accurate position.

[0028] Optionally, an upper plate positioning groove matched with the end of the upper plate of the suction disc away from the upper clamping handle is formed on the end surface of the end limiting plate close to the positioning support base; and the upper plate positioning groove is provided with an upper opening and a lower opening.

[0029] By adopting the above technical scheme, in the movement process of the end limiting plate, the upper plate positioning groove is sleeved on the end of the upper plate of the suction disc away from the upper clamping handle, so as to facilitate the upper plate of the suction disc to move to the accurate position.

[0030] In summary, the beneficial effects of the present application are:

[0031] 1. The airway is convenient to process, the thickness of the suction disc is relatively thin, and the suction disc can adapt to narrow working environment.

[0032] 2. The setting of the lower plate corner avoiding groove and the upper plate corner avoiding groove avoids stress concentration. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is the process flowchart of the present application.

[0034] Figure 2 is the structural schematic view of the quartz suction disc 10 of the present application.

[0035] Figure 3 is the structural schematic view of the suction disc upper plate 11 of the present application.

[0036] Figure 4is a structural schematic view of the section of A-A in the grinding machine 20 of the present application.

[0037] Figure 5 is a structural schematic view of the section of A-A in the grinding machine 20 of the present application. Figure 4

[0038] Figure 6 is a structural schematic view of the section of A-A in the grinding machine 20 of the present application.

[0039] Figure 7 is a structural schematic view of the section of A-A in the grinding machine 20 of the present application.

[0040] Figure 8 is a structural schematic view of the section of A-A in the grinding machine 20 of the present application.

[0041] Figure 9 is a structural schematic view of the section of A-A in the grinding machine 20 of the present application. Figure 8

[0042] BRIEF DESCRIPTION OF THE DRAWINGS

[0043] 10, quartz chuck; 11, chuck upper plate; 110, air inlet hole; 111, upper clamping handle; 12, chuck lower plate; 120, air outlet flow guide groove; 1200, inclined air outlet hole; 121, lower clamping handle; 13, inorganic glue;

[0044] 20, grinding machine; 21, frame; 22, grinding seat; 220, grinding groove; 23, gear ring; 24, center driving motor; 25, center gear; 26, lower plate support seat; 260, lower plate installation groove; 2600, lower plate corner avoiding groove; 27, upper plate support seat; 270, upper plate installation groove; 2700, upper plate corner avoiding groove; 28, grinding lifting electric cylinder; 281, lifting seat; 282, swing support plate; 29, grinding disc; 291, grinding motor;

[0045] 30, adhesive positioning device; 31, tool support seat; 310, horizontal driving groove; 3100, lower plate installation groove; 311, vertical support plate; 32, positioning support seat; 320, vertical sliding groove; 33, horizontal driving motor; 331, horizontal driving screw; 34, horizontal supporting plate; 341, horizontal driving block; 35, end limiting plate; 350, upper plate positioning groove; 36, limiting driving member; 37, discharging supporting plate; 38, discharging driving member. DETAILED DESCRIPTION

[0046] The following will be described in detail in combination with the accompanying drawings. Figures 1-8 The present application will be further described in detail.

[0047] Reference will be made to Figure 2 and Figure 3 ​​The quartz suction disc 10 comprises a sheet-shaped suction disc upper plate 11 and a sheet-shaped suction disc lower plate 12; an air outlet flow guide groove 120 is formed on the upper end face of the suction disc lower plate 12; a plurality of upward and downward open inclined air outlet holes 1200 are formed on the bottom face of the air outlet flow guide groove 120; the suction disc upper plate 11 is adhered on the upper end face of the suction disc lower plate 12 through inorganic glue 13; a space is formed among the suction disc upper plate 11, the air outlet flow guide groove 120 and the inorganic glue 13, which forms an air channel; one end of the suction disc upper plate 11 is formed as an upper clamping handle 111; one end of the suction disc lower plate 12 is formed as a lower clamping handle 121; an upward and downward open air inlet hole 110 is formed on the upper clamping handle 111; the air inlet hole 110 is in communication with the air channel.

[0048] The application discloses a manufacturing process of a non-contact quartz suction disc. Figure 1 Specifically, the manufacturing process comprises the following steps.

[0049] S001, manufacturing of a quartz thin plate: first, the upper and lower surfaces of the sheet-shaped suction disc upper plate 11 and the sheet-shaped suction disc lower plate 12 are respectively ground by using a grinding machine 20, and the flatness of the upper and lower surfaces of the suction disc upper plate 11 and the suction disc lower plate 12 is 0.03 mm after grinding; then, the air inlet hole 110 is processed on the suction disc upper plate 11, and the air outlet flow guide groove 120 and the inclined air outlet hole 1200 are processed on the suction disc lower plate 12.

[0050] S002, gluing: in a workshop with cleanliness higher than 1000, inorganic glue 13 is coated on the surface of the suction disc lower plate 12 where the air outlet flow guide groove is located by using a glue coating machine.

[0051] S003, adhering: in the workshop with cleanliness higher than 1000, the suction disc upper plate 11 is limited above the suction disc lower plate 12 by using an adhering positioning device 30, and then the suction disc upper plate 11 is pressed on the suction disc lower plate 12 so as to be adhered into an integrated whole.

[0052] S004, sintering: the quartz suction disc 10 after the adhering is put into a sintering furnace for sintering, the temperature of the sintering furnace is increased to 1000 DEG C at a speed less than or equal to 120 DEG C per hour, and the sintering temperature is kept at 1000 DEG C for 1-3 hours.

[0053] S005, natural cooling at room temperature.

[0054] The grinding machine 20 comprises a machine frame 21, a grinding seat 22 arranged on the machine frame 21 and a grinding mechanism. Figure 4 The grinding mechanism comprises a grinding wheel 23 and a grinding wheel driving mechanism.

[0055] Figures 4-7 ​The upper end surface of the grinding base 22 is formed with a cylindrical groove-shaped grinding groove 220; the grinding groove 220 is provided with an upper plate support seat 27, a lower plate support seat 26 and a workpiece driving assembly; the workpiece driving assembly comprises a gear ring 23 formed on the inner cylindrical surface of the grinding groove 220, a center gear 25 and a center driving motor 24 fixed on the rack 21; the center gear 25 is coaxially fixed on the output shaft of the center driving motor 24; the center axes of rotation of the center gear 25 and the gear ring 23 are collinear; the upper plate support seat 27 and the lower plate support seat 26 are gears and are placed on the bottom surface of the grinding groove 220; the upper plate support seat 27 is located between the center gear 25 and the gear ring 23 and is engaged with the center gear 25 and the gear ring 23 respectively; the lower plate support seat 26 is located between the center gear 25 and the gear ring 23 and is engaged with the center gear 25 and the gear ring 23 respectively; the upper end surface of the lower plate support seat 26 is formed with a lower plate placing groove 260 for vertically inserting the suction cup lower plate 12 in a horizontal state; the side wall of the lower plate placing groove 260 is formed with a plurality of lower plate corner avoiding grooves 2600; the lower plate corner avoiding grooves 2600 correspond one-to-one to the corners of the suction cup lower plate 12; the upper end surface of the upper plate support seat 27 is formed with an upper plate placing groove 270 for vertically inserting the suction cup upper plate 11 in a horizontal state; the side wall of the upper plate placing groove 270 is formed with a plurality of upper plate corner avoiding grooves 2700; the upper plate corner avoiding grooves 2700 correspond one-to-one to the corners of the suction cup upper plate 11.

[0056] Reference Figure 4 The grinding mechanism comprises a grinding lifting electric cylinder 28 fixed on the rack 21; the upper end of the piston rod of the grinding lifting electric cylinder 28 is fixed with a lifting seat 281; the lifting seat 281 is fixed with a swing motor; the output shaft of the swing motor is fixed with a swing support plate 282 at the upper end; the swing support plate 282 is fixed with a grinding motor 291; the lower end of the output shaft of the grinding motor 291 is fixed with a grinding disc 29.

[0057] When the grinder 20 works, the suction plate lower plate 12 is placed in the lower plate placing groove 260, the suction plate upper plate 11 is placed in the upper plate placing groove 270, then the swing motor drives the swing support plate 282 to swing, so that the grinding disc 29 is located directly above the grinding seat 22, then the grinding lifting cylinder 28 drives the lifting seat 281 to descend, so that the grinding disc 29 abuts against the upper surfaces of the suction plate lower plate 12 and the suction plate upper plate 11, then the central driving motor 24 drives the central gear 25 to rotate, under the joint action of the central gear 25 and the gear ring 23, the upper plate support seat 27 and the lower plate support seat 26 revolve around the rotation center axis of the grinding groove 220 and rotate around their own rotation center axes; at the same time, the grinding motor 291 drives the grinding disc 29 to rotate, so that the upper surfaces of the suction plate lower plate 12 and the suction plate upper plate 11 are polished; then the suction plate lower plate 12 and the suction plate upper plate 11 are turned over and placed in the lower plate placing groove 260 and the upper plate placing groove 270 respectively, then the other surfaces of the suction plate lower plate 12 and the suction plate upper plate 11 are polished according to the above principle; during the polishing process, the existence of the upper plate corner avoiding groove 2700 and the lower plate corner avoiding groove 2600 avoids stress concentration at the corners of the suction plate upper plate 11 and the suction plate lower plate 12.

[0058] With reference to Figure 8 and Figure 9 , the adhesive positioning device 30 comprises a tool support seat 31 and an upper plate support mechanism; the upper end surface of the tool support seat 31 is formed with a lower plate placing groove 3100 for vertically inserting the suction plate lower plate 12 in a horizontal state; the upper end surface of the tool support seat 31 is formed with a positioning support seat 32; the vertical end surface of the positioning support seat 32 close to the lower plate placing groove 3100 is formed with a vertically sliding groove 320 which is open upward and downward; the lower end of the vertically sliding groove 320 communicates with the lower plate placing groove 3100; the vertically sliding groove 320 is for vertically sliding the upper clamping handle 111 and the lower clamping handle 121.

[0059] With reference to Figure 8 and Figure 9 , the upper plate support mechanism comprises a horizontal bottom supporting assembly and a suction plate upper plate end limiting assembly; the horizontal bottom supporting assembly is used for supporting the suction plate upper plate 11; the suction plate upper plate end limiting assembly is opposite to the vertically sliding groove 320 and cooperates with the vertically sliding groove 320 to position the suction plate upper plate 11.

[0060] With reference to Figure 8 and Figure 9The horizontal supporting assembly comprises a pair of horizontal supporting plates 34 and a pair of supporting plate driving members; a pair of horizontal driving grooves 310 are formed on the upper end surface of the tool supporting base 31; the lower end surfaces of the pair of horizontal supporting plates 34 are respectively vertically formed with horizontal driving blocks 341 at the ends away from each other; the horizontal driving blocks 341 correspond to the horizontal driving grooves 310 and are slidingly arranged in the horizontal driving grooves 310 on the corresponding sides; the supporting plate driving members comprise a horizontal driving motor 33; the horizontal driving motor 33 is fixed on the side wall of the horizontal driving groove 310; a horizontal driving screw 331 is fixed on the output shaft of the horizontal driving motor 33; the other end of the horizontal driving screw 331 is pivoted to the side wall of the horizontal driving groove 310; the horizontal driving screw 331 is horizontally arranged and perpendicular to the horizontal opening direction of the vertical sliding groove 320; the horizontal driving block 341 is screwed on the horizontal driving screw 331 on the corresponding side; the pair of horizontal supporting plates 34 horizontally slide on the upper end surface of the tool supporting base 31 and synchronously move away from or close to each other.

[0061] With reference to Figure 8 A vertical supporting plate 311 is formed on the upper end surface of the tool supporting base 31; the vertical supporting plate 311 is parallel to the positioning supporting base 32 and located on the two sides of the lower plate placing groove 3100; the upper plate end limiting assembly comprises an end limiting plate 35 and a limiting driving member 36; the limiting driving member 36 comprises a limiting driving electric cylinder fixed on the vertical supporting plate 311; the working direction of the limiting driving electric cylinder is horizontally arranged and perpendicular to the positioning supporting base 32; the end limiting plate 35 is fixed on the piston rod of the limiting driving electric cylinder; an upper plate positioning groove 350 is formed on the end face of the end limiting plate 35 close to the positioning supporting base 32 and matched with the end of the upper plate 11 away from the upper clamping handle 111; the upper plate positioning groove 350 is open upward and downward.

[0062] With reference to Figure 9 The tool supporting base 31 is provided with a discharging mechanism; the discharging mechanism comprises a discharging supporting plate 37 vertically and upwardly arranged in the lower plate placing groove 3100 and a discharging driving member 38 for driving the discharging supporting plate 37; the discharging driving member 38 comprises a discharging driving electric cylinder fixed on the positioning supporting base 31; the discharging supporting plate 37 is fixed on the upper end of the piston rod of the discharging driving electric cylinder; the horizontal cross section of the discharging supporting plate 37 is of the same shape as the horizontal cross section of the lower plate placing groove 3100.

[0063] When the adhesive positioning device 30 works, first, the suction plate lower plate 12 is vertically placed in the lower plate placing groove 3100 in a horizontal state, at this time, the air outlet flow guide groove 120 is open upward, then the pair of horizontal supporting plates 34 are close to each other, then the suction plate upper plate 11 is placed on the pair of horizontal supporting plates 34, and the upper clamping handle 111 is inserted into the vertical sliding groove 320, then the end limiting plate 35 moves, in the process, the end of the suction plate upper plate 11 away from the upper clamping handle 111 is inserted into the upper plate positioning groove 350 of the end limiting plate 35, finally, the suction plate upper plate 11 is positioned by the vertical sliding groove 320 and the upper plate positioning groove 350, then the end limiting plate 35 moves back, then the pair of horizontal supporting plates 34 are away from each other, finally, the suction plate upper plate 11 vertically falls on the suction plate lower plate 12 due to gravity, which is beneficial to the positioning of the suction plate upper plate 11 and the suction plate lower plate 12, finally, the suction plate upper plate 11 is pressed manually or by means of a tool, so that the suction plate upper plate 11 and the suction plate lower plate 12 are connected into an integrated whole by the inorganic glue 13.

[0064] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, therefore: equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. An apparatus for processing a non-contact quartz chuck, characterized by: The application relates to a positioning device for positioning a suction disc upper plate (11) above a suction disc lower plate (12). The grinding machine (20) comprises a rack (21), a grinding seat (22) arranged on the rack (21) and a grinding mechanism; a cylindrical groove-shaped grinding groove (220) is arranged on the upper end surface of the grinding seat (22); an upper plate support seat (27), a lower plate support seat (26) and a workpiece driving assembly are arranged in the grinding groove (220); the workpiece driving assembly is used for driving the upper plate support seat (27) and the lower plate support seat (26) to revolve around the rotation center axis of the grinding groove (220) and to rotate around the rotation center axis of the workpiece driving assembly; an upper plate placing groove (270) for vertically inserting the suction disc upper plate (11) in a horizontal state is arranged on the upper end surface of the upper plate support seat (27); a lower plate placing groove (260) for vertically inserting the suction disc lower plate (12) in a horizontal state is arranged on the upper end surface of the lower plate support seat (26). The adhesive positioning device (30) comprises a tool support seat (31) and an upper plate supporting mechanism; a lower plate placing groove (3100) for vertically inserting the suction disc lower plate (12) in a horizontal state is formed on the upper end surface of the tool support seat (31); a positioning support seat (32) is formed on the upper end surface of the tool support seat (31); a vertically sliding groove (320) with an upper opening and a lower opening is formed on the vertical end surface of the positioning support seat (32) close to the lower plate placing groove (3100); the lower end of the vertically sliding groove (320) is communicated with the lower plate placing groove (3100); the vertically sliding groove (320) is used for vertically sliding the upper clamping handle (111) of the suction disc upper plate (11) and the lower clamping handle (121) of the suction disc lower plate (12); the upper plate supporting mechanism comprises a horizontal bottom supporting assembly and a suction disc upper plate end limiting assembly; the horizontal bottom supporting assembly is used for supporting the suction disc upper plate (11); the suction disc upper plate end limiting assembly is opposite to the vertically sliding groove (320) and cooperates with the vertically sliding groove (320) to position the suction disc upper plate (11).

2. An apparatus for processing a non-contact quartz chuck according to claim 1, characterized by: A plurality of lower plate corner avoiding grooves (2600) are arranged on the side wall of the lower plate placing groove (260); the lower plate corner avoiding grooves (2600) correspond to the corners of the suction disc lower plate (12) one by one; a plurality of upper plate corner avoiding grooves (2700) are arranged on the side wall of the upper plate placing groove (270); the upper plate corner avoiding grooves (2700) correspond to the corners of the suction disc upper plate (11) one by one.

3. An apparatus for processing a non-contact quartz chuck according to claim 1, characterized by: The horizontal bottom supporting assembly comprises a pair of horizontal supporting plates (34) and a pair of supporting plate driving elements; the supporting plate driving elements correspond to the horizontal supporting plates (34) one by one and are used for driving the horizontal supporting plates (34) to move horizontally along the upper end surface of the positioning support seat (31); the pair of horizontal supporting plates (34) synchronously move away or close to each other.

4. An apparatus for processing a non-contact quartz chuck according to claim 1, characterized by: The end limiting assembly of the upper plate of the suction cup comprises an end limiting plate (35) and a limiting driving element (36); the limiting driving element (36) is used for driving the end limiting plate (35) to move horizontally and close to or away from the positioning support base (32).

5. An apparatus for processing a non-contact quartz chuck according to claim 4, characterized by: The end limiting plate (35) is formed with an upper plate positioning groove (350) on the end face close to the positioning support base (32), which cooperates with the end of the upper clamping handle (111) of the upper plate (11) of the suction cup; the upper plate positioning groove (350) is provided with an upper opening and a lower opening.

6. A manufacturing process for manufacturing a non-contact quartz chuck using the non-contact quartz chuck manufacturing apparatus according to claim 1, characterized by: Specifically, the following steps are included: Step S001, quartz thin plate manufacturing: first, the upper and lower surfaces of the sheet-shaped upper plate (11) of the suction cup and the upper and lower surfaces of the sheet-shaped lower plate (12) of the suction cup are ground; then, the air inlet hole (110) is machined on the upper plate (11) of the suction cup, the airflow guide groove (120) and the inclined air outlet hole (1200) are machined on the lower plate (12) of the suction cup; Step S002, gluing: in a clean workshop with a cleanliness level of more than 1000, an inorganic glue (13) is coated on the surface of the lower plate (12) of the suction cup where the airflow guide groove (120) is located by using a glue coating machine; Step S003, bonding: in a clean workshop with a cleanliness level of more than 1000, the upper plate (11) of the suction cup is positioned directly above the lower plate (12) of the suction cup, and then the upper plate (11) of the suction cup is pressed tightly on the lower plate (12) of the suction cup to bond them into one body; Step S004, sintering: the quartz suction cup (10) after bonding is put into a sintering furnace for sintering, the temperature of the sintering furnace is increased to 1000℃ at a speed of less than or equal to 120℃ per hour, and the sintering temperature of 1000℃ is maintained for a period of time; Step S005, natural cooling at room temperature; After grinding, the flatness of the upper and lower surfaces of the upper plate (11) and the lower plate (12) of the suction cup is 0.03mm.

7. The method of claim 6, wherein: The sintering temperature of 1000℃ is maintained for 1-3 hours.

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