Force measuring device for use in electronic component handling apparatus

Abstract

A device for measuring a force exerted on a component when bonding the component to a component carrier or when encapsulating the component, comprising a deformable portion and a contact stem connected to the deformable portion. The deformable portion is configured to contain a sensor for detecting a degree of deformation of the deformable portion due to the exertion of the force in order to measure the force. In use, the contact stem is positionable to contact the component or the component carrier such that the deformable portion deforms when the force is exerted on the component. One or more such devices can be included in a sintering or encapsulation apparatus for measuring the force.

Description

Technical Field

[0001] The present invention generally relates to the measurement of pressure applied to a component, for example, during the process of bonding a component to a carrier or during the process of encapsulating a component, and more specifically to the real-time in-situ measurement of such force. Background Technology

[0002] In semiconductor assembly and packaging processes, silver sintering has been widely used to bond electronic components to substrates or carriers. Accurate measurement of the sintering pressure applied to the electronic components is necessary to assess whether they have been successfully bonded to the substrate under the correct sintering pressure and to improve the quality of the bonds formed between them.

[0003] Attempts have been made to measure the sintering pressure applied to electronic components bonded to a substrate using pressure sensors in sintering equipment. However, these sensors can only measure the force applied to the substrate, not the pressure or force applied to each die or electronic component on the substrate. Furthermore, since the pressure sensors cannot operate at high temperatures (sintering temperatures are typically above 300°C), cooling devices are required to maintain the sensors at an acceptable operating temperature, and additional heat dissipation elements are needed to accelerate the heating of the substrate support for efficient sintering. Therefore, the structure of the sintering equipment is very complex, which prolongs the time required for assembly and installation, and increases manufacturing costs.

[0004] In another existing method for measuring sintering pressure, described in PCT International Publication No. 2021 / 075966A1 entitled "Component Handling Apparatus, such as Pressure Sintering Apparatus or Component Packaging Apparatus," a fiber Bragg grating (FBG) strain sensor is used to measure the force applied to the component when it is bonded to a component carrier. The FBG strain sensor is mounted in a through-hole formed in the mold to apply sintering pressure to the component. Therefore, a portion of the component located below the through-hole in the mold will not be subjected to sintering pressure. Furthermore, when the cable of the FBG strain sensor protrudes from the top surface of the mold, it may interfere with the application of uniformly distributed sintering pressure to the mold.

[0005] Similarly, it is important to accurately measure the pressure applied to at least a portion of the surface of the electronic component during molding to avoid the molding compound covering at least a portion of the surface of the electronic component to which the force is applied. Therefore, it is beneficial to provide a solution for accurately measuring this force, whether during sintering or packaging, which can at least avoid some of the aforementioned drawbacks of conventional methods used for force measurement during sintering or packaging. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide an improved mechanism for measuring sintering pressure in a sintering apparatus or for measuring pressing pressure applied to an element in a packaging apparatus.

[0007] According to a first aspect of the invention, an apparatus is provided for measuring the force applied to an element when it is bonded to an element carrier or when it is packaged. The apparatus includes a deformable portion configured to include a sensor for detecting the degree of deformation of the deformable portion due to the application of a force in order to measure the force, and a contact rod connected to the deformable portion, the contact rod being positionable to contact the element or element carrier such that the deformable portion deforms when a force is applied to the element. In embodiments of the invention, the force may be a sintering pressure applied to the element when it is bonded to the element carrier, or a pressing force applied to the element when it is packaged.

[0008] Using the proposed force measurement device, when a force is applied to a component to bond the component to a component carrier or package component, the deformable portion deforms due to the applied force, allowing a sensor included in the deformable portion to detect the degree of deformation. Therefore, the force applied to the component can be determined based on the sensor's detection result. Thus, the proposed device enables force measurement at the component or die level in sintering or packaging equipment.

[0009] In some embodiments, the apparatus for measuring force may further include a sensor incorporated into the deformable portion. If the sensor is a wired sensor, the apparatus may also include an inductive cable.

[0010] In some embodiments, the deformable portion may define a container configured to hold / mount / accommodate a sensor, with the sensor attached to an inner surface of the container to detect the degree of deformation of the inner surface due to the application of force. In one embodiment, the deformable portion includes a cutout or groove configured to mount the sensor.

[0011] In some embodiments, the deformable portion may further include at least one opening, each opening configured to allow a sensing cable connected to the sensor to pass through. It should be noted that if the sensor is a wireless device, this at least one opening is not required.

[0012] In some embodiments, the device may have a T-shaped structure. Specifically, the cross-sectional width of the deformable portion along a direction substantially perpendicular to the direction of force application is greater than the corresponding cross-sectional width of the contact rod to form a T-shaped structure. In one embodiment, the sensor and the sensing cable connected to the sensor are placed or disposed in the deformable portion along a direction parallel to the cross-sectional width of the deformable portion.

[0013] When the device is used to measure the force applied to an element, in order to avoid wear and tear of the device due to the application of force and to reduce stress, the device may also include a narrowing connection located between the deformable part and the contact rod, so that when a force is applied to the element, the deformable part can move around the connection relative to the contact rod.

[0014] To provide a device suitable for measuring forces applied to elements of different shapes and / or sizes, the contact rod may include a detachable end whose shape and / or size are designed to contact the element to measure the force applied to it. In one embodiment, the device may include multiple detachable ends. Thus, when the device is used to perform force measurements in a sintering or encapsulation apparatus, appropriate ends are selected and connected to a fixed portion of the contact rod.

[0015] In some embodiments, the sensor includes a high-temperature strain gauge configured to operate at a temperature between 150°C and 500°C.

[0016] In some embodiments, the deformable portion may be integrally formed with part or all of the contact rod. If the device further includes a narrowing connection, the deformable portion may be integrally formed with at least a portion of the contact rod and the narrowing connection.

[0017] In some embodiments, the deformable portion of the device may be made of a material whose Young's modulus is less than that of the material forming at least a portion of the contact rod. In other words, the deformable portion may be made of a material that is more easily deformable than at least a portion of the contact rod (e.g., the end of the contact rod). The connecting portion may be made of the same material as the deformable portion or the contact rod.

[0018] In some embodiments of the invention, the device is arranged on a component to be bonded to a component carrier or to be packaged and is used for force application and force tracking at the die level. That is, force measurement features are incorporated into a mold for applying force to the component in a sintering or packaging apparatus. In these embodiments, a contact rod of the device is positioned to contact the component when the device is in use, and the device further includes a pressing portion detachably mounted to a deformable portion to apply force to the component via the deformable portion and the contact rod.

[0019] In this embodiment of the invention, "removably mounted to" can refer to, but is not limited to, "directly placed on" or "removably fixed to". For a pressing part removably mounted to a deformable portion, in one embodiment, the pressing part can be placed directly on the deformable portion to apply force to the element via the deformable portion and the contact rod. In another embodiment, to prevent relative movement between the pressing part and the deformable portion when force is applied, the device may further include a coupling for fixing the pressing part to the deformable portion. In one example, the coupling includes a first coupling structure located on the pressing part and a second coupling structure located on the deformable portion, and the first and second coupling structures are configured to detachably engage with each other.

[0020] In some embodiments, the device may be arranged below the component carrier such that forces applied to the component are transmitted to the device via the component carrier. In these embodiments, when the device is in use, the deformable portion and the contact rod are located on the side of the component carrier opposite to the side to which the force is applied, and the contact rod is positioned to contact the component carrier so that the force is received by the contact rod through the component carrier, thereby deforming the deformable portion.

[0021] According to a second aspect of the invention, a sintering or encapsulation apparatus is provided, comprising means for measuring forces applied to an element when the element is bonded to an element carrier or when the element is encapsulated, wherein the means includes a deformable portion configured to include a sensor for detecting the degree of deformation of the deformable portion due to the application of a force, in order to measure the force, and a contact rod connected to the deformable portion, the contact rod being positionable to contact the element or element carrier such that the deformable portion deforms when a force is applied to the element. The sintering or encapsulation apparatus may include one or more of the proposed force measuring means, each of which may be configured to measure forces applied to one or more elements.

[0022] In some embodiments, when the device is in use, the contact rod can be positioned to contact the element, and the device also includes a pressing portion detachably mounted to the deformable portion to apply force to the element via the deformable portion and the contact rod. In this embodiment, the functions of force application and measurement are combined in the device. In other words, the device serves both as a mold for applying force to the element and as a force measurement device at the die level or element level. To ensure the position of the device relative to the element when the element is bonded to the element carrier or packaged, the deformable portion and the pressing portion can be arranged in the upper mold holder of the device, and the contact rod can be arranged in the lower mold holder of the device. Furthermore, the deformable portion disposed in the upper mold holder can be spaced a predetermined distance from the lower mold holder in a direction parallel to the direction of force application, such that the deformable portion does not contact the lower mold holder during use, thereby accurately measuring the force applied to the element.

[0023] Alternatively, the device can be arranged on the side of the component carrier opposite to the side to which the force is applied to measure the force applied to the component when it is bonded to the component carrier or when it is packaged. In these embodiments, the deformable portion and the contact rod are located on the side of the component carrier opposite to the side to which the force is applied, and the contact rod is positioned to contact the component carrier so that the force is received via the component carrier to the contact rod, thereby deforming the deformable portion. To fix the position of the device relative to the component carrier when a force is applied to the component, the device may also include a device retainer configured to hold at least a portion of the device. The device retainer may be formed in an existing support block of the device. The device retainer may have a guide / container that is shaped and / or sized to slidably receive the means for measuring the force to fix the position of the device relative to the component carrier. For ease of installation, particularly when the sensing cable is connected to a sensor mounted in the deformable portion of the device, the device retainer may include an upper portion and a lower portion, with the upper portion detachably mounted to the lower portion. In addition, to ensure that the force applied to the component is not transmitted to the device holder of the device, a portion of the contact rod can extend upward away from the device holder to avoid contact between the component carrier and the device holder, so that the force applied to the component is transmitted only to the corresponding device.

[0024] In some embodiments of the invention, the device may include a sintering apparatus configured to apply the force to the element when the element is bonded to the element carrier, or an encapsulation apparatus for encapsulating the element when pressure is applied to at least partially cover the surface of the element.

[0025] According to a third aspect of the invention, a method is provided for measuring the force applied to an element when the element is bonded to an element carrier by a sintering apparatus or when the element is packaged by an encapsulation apparatus. The method includes the steps of: providing a force measuring device in the sintering or encapsulation apparatus, the device including a deformable portion and a contact rod connected to the deformable portion; positioning the contact rod of the device to contact the element or element carrier and apply a force to the element; and measuring the force applied to the element by detecting the degree of deformation of the deformable portion caused by the force, using a sensor contained in the deformable portion.

[0026] These and other features, aspects, and advantages will be better understood with reference to the description, appended claims, and drawings. Attached Figure Description

[0027] Embodiments of the invention will now be described by way of example only with reference to the accompanying drawings, wherein:

[0028] Figure 1A and Figure 1B A perspective view and a front view of an apparatus for measuring sintering pressure according to a first embodiment of the present invention are shown respectively. Figure 1C and Figure 1D A perspective view and a front view of a device for measuring sintering pressure, comprising a sensor and an induction cable connected to the sensor, are shown respectively according to a first embodiment of the present invention.

[0029] Figure 2 This is a cross-sectional view of a sintering apparatus for measuring sintering pressure according to a first embodiment of the present invention.

[0030] Figures 3A to 3B A perspective view and a front view of an apparatus for measuring sintering pressure according to a second embodiment of the present invention are shown, respectively.

[0031] Figure 4A A perspective view of an apparatus for measuring sintering pressure according to a third embodiment of the present invention is shown when the end of the contact rod is separated from the fixed portion of the contact rod. Figure 4B and Figure 4C A perspective view and a front view of an apparatus for measuring sintering pressure according to a third embodiment of the present invention are shown respectively. When the end of the contact rod is connected to the fixing part of the contact rod, the apparatus is shown respectively.

[0032] Figure 5 This is a cross-sectional view of a sintering apparatus including two devices for measuring sintering pressure according to a third embodiment of the present invention.

[0033] Figures 6A to 6C A perspective view, a side view, and a front view of an apparatus for measuring sintering pressure according to a fourth embodiment of the present invention are shown.

[0034] Figure 7 This is a cross-sectional view of a sintering apparatus including two devices for measuring sintering pressure according to a fourth embodiment of the present invention.

[0035] Figure 8A and Figure 8B A perspective view and a front view of an apparatus for measuring force during the packaging process according to a fifth embodiment of the present invention are shown respectively. Figure 8C This is a cross-sectional view of a packaged device including an apparatus for force measurement according to a fifth embodiment of the present invention.

[0036] Figure 9 This is a flowchart illustrating force measurement methods applicable to various embodiments of the invention described herein.

[0037] In the accompanying drawings, similar parts are indicated by similar reference numerals. Detailed Implementation

[0038] In summary, the present invention provides a mechanism for measuring the force applied to an element when it is bonded to an element carrier by a sintering apparatus or when it is packaged by an encapsulation apparatus. In this mechanism, a sensor (e.g., a high-temperature strain gauge) is incorporated into a suitable compliant or deformable portion of the force measuring device to detect the degree of deformation of the deformable portion due to the application of force.

[0039] In embodiments of the present invention, when force is applied during sintering to bond an element to a component carrier, the element to be bonded to the component carrier may include, but is not limited to, any one or more of the following:

[0040] • Chips, which are bonded to a substrate through sintering;

[0041] • Copper foil, which is bonded to the chip through sintering;

[0042] • Fixtures that are bonded to the substrate by sintering;

[0043] • Flexible printed circuits (FPCs) are bonded to chips or substrates through sintering;

[0044] • Spacers / pillars that are bonded to the substrate or chip by sintering;

[0045] • Terminals / lead frames / busbars, which are bonded to the substrate by sintering;

[0046] • Substrate or metal plate, which is bonded to the substrate or heat sink by sintering;

[0047] • A structure that is sintered into another sinterable structure;

[0048] • Molded package, which is bonded to the substrate or heat sink by sintering.

[0049] Figure 1A and Figure 1B Perspective and front views of an apparatus 100 for measuring the force or sintering pressure applied to an element when it is bonded to an element carrier, according to a first embodiment of the present invention, are shown respectively. According to the first embodiment of the present invention, the apparatus 100 for measuring sintering pressure may further include a sensor and a sensing cable connected to the sensor. Figure 1C and Figure 1D Perspective and front views of the device 100 are shown, respectively, when the sensor 151 and the sensing cable 152 connected to the sensor 151 are installed in the device 100.

[0050] refer to Figures 1A to 1DThe device 100 includes a pressing portion 110, a deformable portion 120, and a contact rod 130 connected to the deformable portion 120. The pressing portion 110 is detachably mounted to the deformable portion 120. The deformable portion 120 includes or defines a cutout or groove 121 configured to hold or mount a sensor 151 and a sensing cable 152. Specifically, the sensor 151 is attached to the inner surface 122 of the groove 121, and the deformable portion 120 also includes at least one opening 123 configured to allow the sensing cable 152 connected to the sensor 151 to pass through. It should be noted that if a wireless sensor is used in this embodiment, the sensing cable 152 may not be required, and accordingly, the deformable portion 120 may not include such an opening 123. In this embodiment, the device 100 also includes a narrowing connecting portion 140 located between the deformable portion 120 and the contact rod 130. The narrowing connecting portion 140 is an arc-shaped notch.

[0051] In use, the device 100 is installed in a sintering apparatus to measure the sintering pressure applied to the element when the element is bonded to the element carrier by the sintering apparatus. Each sintering apparatus may include one or more devices 100, and each device 100 is used to measure the sintering pressure applied to the element being sintered by the contact rod 130. The device 100 may also include a processor or computing system configured to automatically calculate the sintering pressure applied to the element based on the strain experienced by the deformable portion 120, which is detected by the sensor 151 based on a known relationship between the sensor 151 reading and the applied associated sintering force. Before using the device 100 for sintering pressure measurement, a calibration process may be performed in advance to determine the relationship between the strain detected in the deformable portion 120 and the applied sintering pressure.

[0052] Figure 2 This is a cross-sectional view of a sintering apparatus 10 according to a first embodiment of the present invention, including a device 100 for measuring sintering pressure. The sintering apparatus 10 is used to bond an element 11 to an element carrier 12. Figure 2As shown, the sintering apparatus 10 also includes a device holder whose shape and size are adapted to hold the device 100. In this embodiment, the device holder includes an upper mold holder 13 and a lower mold holder 14, with the upper mold holder 13 detachably mounted to the lower mold holder 14. The device 100 is mounted in the upper mold holder 13 and the lower mold holder 14. Specifically, the pressing portion 110 and the deformable portion 120 on which the pressing portion 110 is mounted are both arranged in the upper mold holder 13, and the contact rod 130 is arranged in the lower mold holder 14. As for the narrowing connection portion 140, it is partially arranged in the upper mold holder 13 and partially arranged in the lower mold holder 14, such that the deformable portion 120 is spaced a predetermined distance from the lower mold holder 14 to avoid contact between the deformable portion 120 and the lower mold holder 14, so as to accurately measure the sintering pressure applied to the element 11. The predetermined distance between the deformable portion 120 and the lower mold retainer 14 can be determined based on the degree of deformation and mechanical properties of the deformable portion 120. Additionally, for ease of installation, the upper mold retainer 13 may include a first part and a second part, with the first part detachably mounted to the second part. The first part is shaped and sized to hold the pressing portion 110, and the second part is shaped and sized to hold the deformable portion 120 and the sensing cable 152 extending from the deformable portion 120.

[0053] Sensor 151 and sensing cable 152 are incorporated into deformable portion 120 of device 100. Upper mold holder 13 also includes channel 13a configured to allow sensing cable 152 to pass through. Thus, in sintering apparatus 10, device 100 is used both to apply sintering pressure to element 11 and to measure the applied sintering pressure.

[0054] When the element 11 is bonded to the element carrier 12 via the sintering apparatus 10, the device 100, together with the upper and lower mold holders 13 and 14, moves downward toward the element 11 until the contact rod 130 contacts the element 11. Then, the pressing part 110 receives the sintering pressure and applies it to the deformable part 120, so that the sintering pressure is transmitted to the element 11 through the deformable part 120 and the contact rod 130. When the sintering pressure is applied to the element 11, the element 11 exerts a reaction force on the contact rod 130, and the deformable part 120 begins to deform. A sensor 151 attached to the inner surface of the deformable part 120 detects the degree of deformation of the deformable part 120 caused by the sintering pressure applied to the element 11, thereby measuring the sintering pressure.

[0055] like Figure 2As shown, the device 100 has a generally T-shaped cross-section in the YZ plane to facilitate the application of sintering pressure and the detection of deformation of the deformable portion 120. Specifically, the cross-sectional width W1 of the pressing portion 110 and the deformable portion 120 along the Y-axis in the YZ plane is greater than the cross-sectional width W2 of the contact rod 130 along the Y-axis in the YZ plane. The sensor 151 and the sensing cable 152 are placed or arranged along the Y-axis, that is, in a direction parallel to the cross-sectional width W1 of the deformable portion 120.

[0056] To ensure accurate detection of deformation of the inner surface 122 caused by the applied sintering pressure, the shape and size of the deformable portion 120 in this embodiment are designed to hold the sensor 151 and the sensing cable 152 in place, such that when sintering pressure is applied to the element 11, the sensor 151 detects only the degree of deformation of the inner surface 122 of the deformable portion 120 caused by the sintering pressure. Therefore, the height of the deformable portion 120 along the Z-axis should be sufficient to prevent the sensor 151 and the sensing cable 152 from contacting the bottom surface 111 of the pressing portion 110 when sintering pressure is applied to the element 11.

[0057] In this embodiment, the narrowed connecting portion 140 located between the deformable portion 120 and the contact rod 130 is an arc-shaped notch. Alternatively, the narrowed connecting portion 140 can be other forms, such as notches or recesses of any shape, as long as the connecting portion 140 does not contact the lower mold holder 14 of the sintering apparatus 10. Furthermore, the narrowed connecting portion 140 is provided such that the deformable portion 120 can move relative to the contact rod 130 around the narrowed connecting portion 140, which facilitates the deformation of the deformable portion 120.

[0058] In device 100, deformable portion 120 houses sensor 151 and sensing cable 152. Alternatively, deformable portion 120 may be in the form of a flat plate to which sensor 151 is attached, while pressing portion 110 may be in the form of an inverted U-shaped cap detachably mounted to deformable portion 120. The shape and size of pressing portion 110 should be designed for detachable mounting to deformable portion 120 and to avoid contact between sensor 152 and pressing portion 110, such that when sintering pressure is applied to element 11 by pressing portion 110 via deformable portion 120 and contact rod 130, sensor 152 detects the degree of deformation of deformable portion 120 (unimpeded by pressing portion 110 and lower mold retainer 14).

[0059] In this embodiment, different parts of the device 100 may be made of the same material, such as the same type of stainless steel. However, in order to further improve the deformability of the deformable part 120, the device 100 may be made of two different materials. For example, the deformable part 120 and the connecting part 140 may be made of a material whose Young's modulus is less than that of the material used to make the contact rod 130.

[0060] In this embodiment, the deformable portion 120 may be integrally formed with the contact rod 130 and the narrowing connecting portion 140. Alternatively, the device 100 may be formed of separate portions that are connected to each other with or without a connecting mechanism or structure. For example, the deformable portion 120 may be integrally formed with the connecting portion 140, but the contact rod 130 may be a separate portion connected to the connecting portion 140 by a connecting mechanism or structure formed on the connecting portion 140 and the contact rod 130 respectively.

[0061] It should be noted that in other embodiments, the device 100 may not include the narrowing connection portion 140. In other words, the contact rod 130 may be directly connected to the deformable portion 120.

[0062] In such Figures 1A to 1D In the illustrated device 100, the pressing portion 110 is directly mounted on the deformable portion 120 without any connecting device or connecting structure. However, in other embodiments, to further prevent relative movement between the pressing portion 110 and the deformable portion 120 when sintering pressure is applied to the element 11, the device 100 may also include a connecting mechanism for securing the pressing portion 110 to the deformable portion 120. The connecting mechanism may include connecting structures formed on the pressing portion 110 and the deformable portion 120, respectively. Figures 3A to 3B A perspective view and a front view of the device 300 according to a second embodiment of the present invention are shown respectively. (Reference) Figure 3A and Figure 3B Compared to device 100, device 300 further includes a first connecting structure 313 formed on the pressing portion 310 and a second connecting structure 323 formed on the deformable portion 320. The first connecting structure 313 and the second connecting structure 323 are configured to engage with each other to fix the pressing portion 310 to the deformable portion 320, which is also connected to the contact rod 330 to contact element 11.

[0063] Figures 4A to 4C Different views of an apparatus 400 for measuring sintering pressure according to a third embodiment of the present invention are shown. (Reference) Figures 4A to 4C The main difference between device 100 and device 400 is that the contact rod 430 includes a detachable end 434. Figure 4A A perspective view of the device 400 is shown when the end 434 is separated from the fixing part 433 of the contact rod 430. Figure 4B and Figure 4CPerspective and front views of the device 400 are shown, respectively, when the end portion 434 is attached to the fixing portion 433 of the contact rod 430. The end portion 434 includes a contact portion 434a and a mating rod 434b. The contact portion 434a has a quadrilateral cross-section in the XY plane, and its cross-sectional area is larger than that of the fixing portion 433 in the XY plane. The fixing portion 433 of the contact rod 430 also includes a connecting structure (e.g., a hole) designed to receive the mating rod 343b, such that the end portion 434 can be attached to the fixing portion 433 of the contact rod 430. The end portion 434 in the third embodiment is for illustrative purposes only. In other embodiments, the end portion may have different shapes and / or sizes suitable for contacting different elements. Thus, by simply replacing the appropriate end portion without changing the entire device 400, the device 400 can be used to measure sintering pressure applied to different types of elements with different sizes and / or shapes.

[0064] Figure 5 This is a cross-sectional view of a sintering apparatus 50 according to a third embodiment of the present invention, comprising two devices 400 for measuring sintering pressure. Compared to sintering apparatus 10, the sintering apparatus 50 comprises two devices 400, each device 400 configured to measure the sintering pressure applied to a corresponding element 51 when each element 51 is bonded to a common element carrier 52. Because the contact rod 430 of each device 400 has a detachable end 434, the shape and size of the lower die retainer 54 of the sintering apparatus 50 are designed to retain the contact rod 430 of each device 400. Specifically, the lower die retainer 54 comprises two guides configured to slidably receive or retain the two devices 400. The upper die retainer 53 of the sintering apparatus 50 comprises two channels 53a, each channel 53a being configured to allow a sensing cable 152 connected to a sensor 151 mounted in a deformable portion of the corresponding device 400 to pass through the channel 53a.

[0065] In the two sintering apparatuses 10 and 50, devices 100 and 400 are mounted above elements 11 and 51, such that devices 100 and 400 are used both to apply sintering pressure to elements 11 and 51 and to measure the sintering pressure applied to elements 11 and 51. Alternatively, in some other embodiments, the device for measuring the sintering pressure may be mounted below the element carrier.

[0066] Figures 6A to 6C Perspective view, side view, and front view of a device 600 for measuring sintering pressure according to a fourth embodiment of the present invention are shown respectively. (Reference) Figures 6A to 6CThe device 600 includes a deformable portion 620 and a contact rod 630. The deformable portion 620 is configured to include a sensor 151 for detecting the degree of deformation of the deformable portion 620 due to applied sintering pressure, in order to measure the sintering pressure. The sensor 151 is attached to the inner surface 622 of a groove 621 in the deformable portion 620. An inductive cable 152 passes through an opening 623 in the deformable portion 620 and is connected to the sensor 151. Unlike device 100, device 600 does not include a pressing portion 110, and when device 600 is used to measure the sintering pressure applied to an element bonded to an element carrier, device 600 is located below the element carrier. Therefore, the contact rod 630 is positioned to contact the element carrier to receive the sintering pressure applied to the element, thereby causing deformation of the deformable portion 620. The contact rod 630 has a similar structure to the contact rod 130 in device 100. In other embodiments, the contact rod 630 may have a similar structure to the contact rod 430 of the device 400, that is, the contact rod 630 may include a detachable end that is shaped and sized to contact an element to be bonded to a component carrier.

[0067] Figure 7 This is a cross-sectional view of a sintering apparatus 70 including two devices 600 for measuring sintering pressure according to a fourth embodiment of the present invention. In each device 600, a sensor 151 and an induction cable 152 connected to the sensor 151 are mounted. (See reference...) Figure 7 The sintering apparatus 70 includes two devices 600, each device 600 configured to measure the sintering pressure applied to a respective element 61 when the element 61 is bonded to a separate element carrier 62. Unlike the previously described sintering apparatuses 10, 50, each device 600 is arranged below its respective element carrier 62. The sintering apparatus 70 also includes a device holder 71 configured to retain at least a portion of each device 600 to fix the position of each device 600 relative to the respective element carrier 62. The device holder 71 may be defined / formed in an existing support block of the sintering apparatus 70. Figure 7 As shown, the device holder 71 includes two inverted T-shaped guides or containers, each guide being shaped and sized to slidably receive a corresponding device 600 to secure the device 600 relative to a corresponding element carrier 62. The device holder 71 also includes a channel 71a configured to allow a sensing cable 152 connected to a sensor 151 mounted in each device 600 to pass through the channel 71a. For ease of installation, the device holder 71 may include an upper portion 71A and a lower portion 71B, with the upper portion 71A detachably mounted to the lower portion 71B.

[0068] When sintering pressure is applied to element 61 via die 66 to bond element 61 to element carrier 62, the sintering pressure applied to element 61 is transmitted to device 600 located below element carrier 62 and in contact with the bottom surface of element carrier 62. Contact rod 630 of device 600 receives the force transmitted through element carrier 62, and deformable portion 620 deforms due to the force received by contact rod 630. Sensor 151 attached to the inner surface 622 of deformable portion 620 detects the degree of deformation of inner surface 622 to measure the sintering pressure applied to element 61.

[0069] like Figure 7 As shown, a portion of the contact rod 630 extends upward away from the device holder 71 to avoid contact between the component carrier 62 and the device holder 71, so that the sintering pressure applied to the component 61 is transmitted only to the corresponding device 600.

[0070] To ensure accurate detection of deformation of the inner surface 622 caused by applied sintering pressure, in this embodiment, the shape and size of the deformable portion 620 are designed to hold the sensor 151 and the sensing cable 152 such that when sintering pressure is applied to the element 61, the sensor 151 detects only the degree of deformation of the inner surface 622 of the deformable portion 620. For example, the height of the deformable portion 620 along the Z-axis should be sufficient to avoid contact between the sensor 151 and the lower surface 71b of the device holder 71, and between the sensing cable 152 and the lower surface 71b, when sintering pressure is applied to the element 61.

[0071] Figure 8A and Figure 8B Perspective and front views of a force measuring device 800 according to a fifth embodiment of the present invention are shown respectively. (Reference) Figure 8A and 8B The device 800 includes a pressing portion 810, a deformable portion 820, and a contact rod 830 connected to the deformable portion 820. The pressing portion 810 is detachably mounted to the deformable portion 820 to apply pressing force to the element to be packaged via the deformable portion 820 and the contact rod 830. The deformable portion 820 defines a notch, groove, or space 821, which is configured to hold or mount a sensor 851 and a sensing cable 852 to measure the pressing force applied during the packaging process. Figure 8A As shown, sensor 851 is attached to the inner surface 822 of deformable portion 820, which also includes at least one opening 823 for the passage of sensing cable 852 connected to sensor 851. In this embodiment, device 800 further includes a narrowed connecting portion 840 located between deformable portion 820 and contact rod 830.

[0072] In use, the device 800 is installed in a packaging apparatus to measure the force applied to the component when it is packaged by the packaging apparatus. Each packaging apparatus may include one or more devices 800, and each device 800 may be used to measure the force applied to one or more components.

[0073] Figure 8C This is a cross-sectional view of a packaging apparatus 80 including a force measuring device 800 according to a fifth embodiment of the present invention. The packaging apparatus 80 is used to package a component 81 that has been bonded to a component carrier 82 (e.g., a substrate). Figure 8C As shown, the packaging device 80 also includes a device holder whose shape and size are adapted to hold the device 800. In this embodiment, the device holder includes an upper mold holder 83 and a lower mold holder 84, with the upper mold holder 83 detachably mounted to the lower mold holder 84. The device 800 is mounted in the upper and lower mold holders 83 and 84. Specifically, the pressing portion 810 and the deformable portion 820 on which the pressing portion 810 is mounted are both arranged in the upper mold holder 83, and the contact rod 830 is arranged in the lower mold holder 84. As for the narrowed connecting portion 840, it is partially disposed in the upper mold holder 83 and partially disposed in the lower mold holder 84, such that the deformable portion 820 is spaced apart from the lower mold holder 84 by a predetermined distance to avoid contact between the deformable portion 820 and the lower mold holder 84, thereby accurately measuring the force applied to the element 81. The upper mold retainer 83 also includes a channel 83a configured to allow the sensing cable 852 to pass through it. Furthermore, for ease of installation, the upper mold retainer 83 may also include a first portion and a second portion, the first portion being detachably mounted to the second portion. The first portion is shaped and sized to retain the pressing portion 810, and the second portion is shaped and sized to retain the deformable portion 820 and the sensing cable 852 extending from the deformable portion 820.

[0074] When component 81 is packaged by packaging device 80, the force applied to the pressing portion 810 of device 800 is transmitted to component 81 via the deformable portion 820 and contact rod 830 of device 800. This is to prevent molding compound from covering the top surface of each component 81. When force is applied to component 81 during the packaging process, component 81 exerts a reaction force on contact rod 830, and deformable portion 820 of device 800 begins to deform. Sensor 851 attached to the inner surface of deformable portion 820 detects the degree of deformation of deformable portion 820 due to the application of pressing force, thereby measuring the pressing force.

[0075] In a fifth embodiment, device 800 is used to measure the pressing force applied to one or more elements. However, in other embodiments, device 800 can be used to measure the pressing force applied to a single element (e.g., a die) that has been bonded to a component carrier (e.g., a substrate). Further, in other embodiments of the invention, the packaging apparatus may include more than one force measuring device (e.g., device 800), each of which may be used to measure the pressing force applied to one or more elements.

[0076] Additionally, similar to Figure 7 In the sintering apparatus shown, at least one force measuring device may also be located on the side of the element carrier opposite to the side to which the pressing force is applied, in order to measure the pressing force, and the contact rod is positioned to contact the element carrier to receive the pressing force applied to the contact rod via the element carrier, thereby deforming the deformable portion.

[0077] The sintering apparatus 10, 50, 70 or packaging apparatus 80 disclosed in the embodiments of the present invention may further include: a human-machine interface (HMI) operatively communicatively communicating with the sensors 151 / 851 to receive and display measurement results from the sensors 151 / 851; a database or memory for receiving and storing the measurement results from the sensors 151 / 851; a manufacturing execution system (MES) operatively communicatively communicating with the sensors 151 / 851 for force tracking based on the measurement results from the sensors 151 / 851; and / or an adaptive system configured and operated to determine compensation factors for the sintering or packaging apparatus to improve subsequent sintering or packaging processes based on the measurement results from the sensors 151 / 851. Force tracking may be element-level or die-level force tracking.

[0078] Figure 9 This is a flowchart illustrating a method 900 for force measurement applicable to various embodiments of the invention described herein.

[0079] In step 901, a force measuring device is provided in the sintering equipment or encapsulation equipment. The device includes a deformable part and a contact rod connected to the deformable part.

[0080] The step of setting up the device in a sintering or encapsulation apparatus may include installing a sensor within the device. Specifically, the sensor is attached to the inner surface of the deformable portion. If the sensor is not a wireless sensor, the step of setting up the device may further include connecting a sensing cable to the sensor. Furthermore, the sensing cable passes through an opening in the deformable portion of the device.

[0081] When devices 100, 300, 400, or 800 are installed in sintering or encapsulation equipment, they are arranged in the upper and lower mold holders of the sintering or encapsulation equipment such that the contact rods of the devices are positioned to contact the element when the element is bonded to the element carrier by the sintering equipment or when the element is encapsulated by the encapsulation equipment. When device 600 is installed in sintering equipment, it is arranged in a device holder of the sintering equipment below the element carrier to fix the position of the device relative to the element carrier.

[0082] In step 902, the contact rod of the device is positioned to contact the element or element carrier and applies force to the element.

[0083] When the device 100, 300 or 400 is installed in the sintering equipment, the step includes: moving the device downward toward the element such that the contact rod of the device contacts the element, and applying sintering pressure to the element through the deformable part of the device and the contact rod via the pressing part of the device.

[0084] When the device 600 is installed in the sintering equipment, the contact rod of the device is positioned to contact the element carrier and operates the die in the sintering equipment to apply sintering pressure to the element.

[0085] When the device 800 is installed in the packaging equipment, the contact rod of the device is positioned to contact the component to be packaged, and a pressing force is applied to the component via the pressing part of the device through the deformable part of the device and the contact rod.

[0086] In step 903, the force applied to the element is measured by detecting the degree of deformation of the deformable part of the device caused by the force applied to the element using a sensor included in the deformable part.

[0087] The force applied to the element can be determined based on strain measured by a sensor. In this embodiment, the force measuring device may also include a processor or computing system configured to automatically calculate the force applied to the element based on sensor readings and a predetermined variation between the strain detected by the sensor and the force applied to the element. This predetermined variation can be determined through a calibration process performed before using the device to measure the force.

[0088] As can be understood from the above description, various devices for die-level or component-level force measurement in sintering or packaging equipment are provided in the embodiments described in this invention. In the proposed devices, sensors such as high-temperature strain gauges are incorporated into the deformable portion of the device to detect the degree of deformation of the deformable portion caused by sintering pressure or pressing force applied to the component (e.g., die). When multiple devices proposed in the embodiments of this invention are installed in a sintering equipment for bonding multiple components to one or more component carriers, the sintering pressure applied to each component can be accurately measured by the corresponding device. Therefore, the devices and sintering equipment proposed in the embodiments of this invention enable die-level or component-level sintering force tracking. Similarly, the devices and packaging equipment according to embodiments of this invention will enable die-level or component-level force tracking. Further, since the sensor is held in the space defined by the deformable portion and only in contact with the inner surface of the deformable portion, introducing the sensor into the force measuring device will not affect the force applied to the component. If a polyimide film is present in the sintering equipment, the function of the polyimide film for uniformly distributing the sintering pressure onto the mold of the sintering equipment is also unaffected. Therefore, the proposed device for sintering pressure measurement can have a simple and compact structure, making it easy to install in a sintering apparatus. Furthermore, compared to conventional sintering apparatus, by incorporating a high-temperature strain gauge into the force measurement device, neither a cooling system to provide a suitable operating environment for the sensor nor additional heat diffusion elements for accelerating the heating of the substrate support are required in the sintering apparatus.

[0089] Although the invention has been described in considerable detail with reference to certain embodiments, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the embodiments described herein.

Claims

1. A device for measuring the force applied to a component when the component is bonded to a component carrier or when the component is packaged, wherein, The device includes: A deformable portion, configured to form a container with an inner surface, on which a sensor is attached for detecting the degree of deformation of the inner surface caused by the force applied to the element in order to measure the force. A contact rod, connected to the deformable portion, is used to transmit force to or receive force from a component carrier. The contact rod is positioned to contact the component or the component carrier during use, such that the deformable portion deforms when the force is applied to the component. The inner surface is opposite to the surface of the deformable part to which the contact rod is connected.

2. The apparatus according to claim 1, wherein, The container formed by the deformable portion includes a groove or cut defined by the deformable portion, wherein the sensor is attached to the inner surface of the groove to detect the degree of deformation of the inner surface caused by the application of the force.

3. The apparatus according to claim 1, wherein, The deformable portion also includes an opening configured to allow a sensing cable connected to the sensor to pass through.

4. The apparatus according to claim 1, wherein, The cross-sectional width of the deformable portion along a direction substantially perpendicular to the direction of force application is greater than the corresponding cross-sectional width of the contact rod, thereby forming a T-shaped structure.

5. The apparatus of claim 1 further includes a narrowed connecting portion located between the deformable portion and the contact rod, whereby the deformable portion is movable relative to the contact rod about the connecting portion when the force is applied to the element.

6. The apparatus according to claim 1, wherein, The contact rod includes a detachable end that is shaped and / or sized to contact the element in order to measure the force applied to the element.

7. The apparatus according to claim 1, wherein, The sensor includes a high-temperature strain gauge configured to operate at process temperatures between 150°C and 500°C.

8. The apparatus according to claim 1, wherein, The deformable part is integrally formed with at least a portion of the contact rod.

9. The apparatus according to claim 1, wherein, The deformable part is made of a material whose Young's modulus is less than that of the material used to manufacture at least a portion of the contact rod.

10. The apparatus according to claim 1, wherein, When the device is in use, the contact rod can be positioned to contact the element, and the device also includes a pressing part that is detachably mounted to the deformable part to apply force to the element through the deformable part and the contact rod.

11. The apparatus of claim 10, further comprising a connecting member for securing the pressing portion to the deformable portion to prevent relative movement between them.

12. The apparatus according to claim 11, wherein, The connecting member includes a first connecting structure located on the pressing portion and a second connecting structure located on the deformable portion, and the first connecting structure and the second connecting structure are configured to detachably engage with each other.

13. The apparatus according to claim 1, wherein, In use, the deformable part and the contact rod are located on the side of the element carrier opposite to the side on which the force is applied, and the contact rod is positioned to contact the element carrier so as to receive the force applied to the contact rod via the element carrier, thereby deforming the deformable part.

14. A sintering or encapsulation apparatus, comprising: A means for measuring the force applied to a component when the component is bonded to a component carrier by the device, or when the component is packaged by the device, wherein the means includes: A deformable portion, configured to form a container with an inner surface, on which a sensor is attached for detecting the degree of deformation of the inner surface caused by the force applied to the element in order to measure the force. A contact rod, connected to the deformable portion, is used to transmit force to or receive force from a component carrier. The contact rod is positioned to contact the component or the component carrier during use, such that the deformable portion deforms when the force is applied to the component. The inner surface is opposite to the surface of the deformable part to which the contact rod is connected.

15. The device according to claim 14, wherein, The contact rod is positioned to contact the element, and the device further includes a pressing part detachably mounted to the deformable part to apply force to the element through the deformable part and the contact rod, wherein the deformable part and the pressing part are disposed in the upper mold retainer of the device, the contact rod is disposed in the lower mold retainer of the device, and wherein the upper mold retainer is detachably mounted to the lower mold retainer.

16. The device according to claim 15, wherein, The deformable portion disposed in the upper mold retainer is spaced a predetermined distance from the lower mold retainer in a direction parallel to the direction of force application, such that the deformable portion does not contact the lower mold retainer during use.

17. The device according to claim 14, wherein, The deformable portion and the contact rod are located on the side of the element carrier opposite to the side to which the force is applied, and the contact rod is positioned to contact the element carrier in order to receive the force applied to the contact rod via the element carrier, thereby deforming the deformable portion.

18. The device of claim 17, further comprising a device holder having a guide, the guide being shaped and / or sized to slidably receive the device to fix the position of the device relative to the element carrier.

19. The apparatus of claim 14, further comprising: A human-machine interface (HMI) that is operable and communicative with the sensor to receive and display force measurement results from the sensor; A database for receiving and storing force measurement results from the sensor; A manufacturing execution system (MES) that is operatively communicable with the sensor to perform force tracking based on force measurements from the sensor; and / or an adaptive system configured and operated to determine a compensation factor for the device based on force measurements from the sensor for subsequent sintering or encapsulation processes.

20. A method for measuring the force applied to a component when the component is bonded to a component carrier by a sintering apparatus or when the component is packaged by an encapsulation apparatus, the method comprising: A force measuring device is provided for use in a sintering or encapsulation apparatus, wherein the device includes a deformable portion and a contact rod, the deformable portion forming a container having an inner surface on which a sensor is attached, and the contact rod being connected to the deformable portion for transmitting force to an element or receiving force from an element carrier, wherein the inner surface is opposite to the surface of the deformable portion to which the contact rod is connected. Position the contact rod of the device to contact the element or the element carrier, and apply a force to the element. A sensor attached to the inner surface of the deformable part measures the force applied to the element by detecting the degree of deformation of the inner surface caused by the force.

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