Method and apparatus for removing plated burrs

Abstract

A method for removing burrs on a plated film includes: providing a packaging structure, the packaging structure including a packaging body and a plated film covering at least a side surface of the packaging body; providing a film, the film having an opening, a projection of the opening in a first direction being within a projection of an edge of the packaging structure in the first direction; and driving the packaging structure to move in the first direction so that the packaging structure passes through the opening, a film at the edge of the opening being capable of scraping the plated film of the side surface of the packaging body to remove burrs on the plated film of the side surface of the packaging body. The present application can remove burrs on the plated film, thereby avoiding short circuit of pins when the packaging structure is connected to a circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor packaging, and in particular to a method and device for removing burrs on a plated film. BACKGROUND

[0002] Electromagnetic interference (EMI) is a phenomenon that high frequency noise generated from an electronic circuit or an electronic system affects the performance of other circuits or other systems, and EMI can also adversely affect human beings. Generally, EMI is suppressed to prevent the generation and propagation of high frequency noise. For example, a metal plated film is formed on the surface of a packaging structure as a shielding layer to suppress electromagnetic interference.

[0003] The metal plated film is usually formed by a plating process, but after the packaging structure is plated, it needs to be removed from the adhesive layer that fixes the packaging structure. During the removal process, burrs can be generated on the metal plated film. If the burrs are not removed, they can cause pin short circuit when the packaging structure is connected to a circuit board, affecting the performance of the product.

[0004] Therefore, how to remove the burrs on the plated film has become the focus of current research. SUMMARY

[0005] The technical problem to be solved by the present application is to provide a method and device for removing burrs on a plated film, which can remove the burrs on the plated film of a packaging structure, thereby avoiding pin short circuit when the packaging structure is connected to a circuit board.

[0006] To solve the above problems, the present application provides a method for removing burrs on a plated film, comprising: providing a packaging structure, the packaging structure comprising a packaging body and a plated film covering at least a side surface of the packaging body; providing a film, the film having an opening, a projection of the opening in a first direction being within a projection of an edge of the packaging structure in the first direction; driving the packaging structure to move in the first direction so that the packaging structure passes through the opening, the edge of the opening being able to scrape the plated film of the side surface of the packaging body to remove burrs on the plated film of the side surface of the packaging body.

[0007] In an embodiment, the distance from the edge of the opening to the edge of the packaging structure is greater than or equal to 0.1 mm.

[0008] In an embodiment, in a region corresponding to at least one corner of the packaging structure, the opening has a cut extending away from the opening, the cut dividing the edge of the opening into at least two separate regions.

[0009] In an embodiment, one end of the cut away from the opening protrudes beyond the edge of the packaging structure.

[0010] In one embodiment, the length of the cutout is 0.1-1 mm.

[0011] In one embodiment, the angle between the cutout and the edge of the opening is 90-180 degrees.

[0012] In one embodiment, the method for driving the packaging structure to move in the first direction comprises applying a pulling force on the top surface of the packaging structure and / or applying a pushing force on the bottom surface of the packaging structure.

[0013] In one embodiment, the film is a polyester film.

[0014] In one embodiment, the step of providing a packaging structure further comprises that the at least partially bottom surface of the packaging structure is attached to the surface of an adhesive layer, and the film covers the surface of the adhesive layer which is not covered by the packaging structure; and the step of driving the packaging structure to move in the first direction further comprises that the packaging structure is separated from the adhesive layer and the film on the side surface of the packaging structure is separated from the film on the surface of the adhesive layer as the packaging structure moves.

[0015] The method for removing the burrs of the film of the present application drives the packaging structure to pass through the opening of the film, scrapes the film on the side surface of the packaging body with the film on the edge of the opening, removes the burrs of the film with the film on the edge of the opening, and achieves the purpose of removing the burrs of the film, thereby avoiding the short circuit of the pin when the packaging structure is connected with the circuit board. The method is simple and easy to implement and popularize.

[0016] The present application also provides a device for performing the above method, comprising: a film, the film having an opening, the opening in the first direction being within the range of the edge of the packaging structure in the first direction; and a driving assembly for driving the packaging structure to move in the first direction so that the packaging structure passes through the opening, and the film on the edge of the opening can scrape the film on the side surface of the packaging body to remove the burrs on the film on the side surface of the packaging body.

[0017] In one embodiment, the device further comprises a fixing assembly for fixing the film.

[0018] In one embodiment, the driving assembly further comprises: a pulling unit capable of passing through the opening and acting on the top surface of the packaging structure, for applying a pulling force on the top surface of the packaging structure; and / or a pushing unit capable of acting on the bottom surface of the packaging structure, for applying a pushing force on the bottom surface of the packaging structure.

[0019] The device provided by the embodiment of the present application can drive the packaging structure to pass through the opening of the film, scrape the plated film on the side surface of the packaging body by the film at the opening edge, and remove the burrs on the plated film by the film at the opening edge, so as to achieve the purpose of removing the burrs on the plated film, and further avoid the short circuit of the pin when the packaging structure is connected with the circuit board, and the device is simple and low in cost. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0021] Figure 1 is a step schematic diagram of the method for removing plated film burrs provided by an embodiment of the present application;

[0022] Figures 2A-2E is a step schematic diagram of the method for removing plated film burrs provided by an embodiment of the present application;

[0023] Figure 3 is a top view of the film in another embodiment of the method for removing plated film burrs of the present application;

[0024] Figure 4 is a schematic diagram of the device provided by another embodiment of the present application. DETAILED DESCRIPTION

[0025] The specific embodiments of the method and device for removing plated film burrs provided by the present application will be described in detail below with reference to the drawings.

[0026] Figure 1 is a step schematic diagram of the method for removing plated film burrs provided by an embodiment of the present application. Please refer to Figure 1 , the method comprises: step S10, providing a packaging structure, the packaging structure comprising a packaging body and a plated film covering at least the side surface of the packaging body; step S11, providing a film, the film having an opening, the orthographic projection of the opening in a first direction being located in the range of the orthographic projection of the edge of the packaging structure in the first direction; step S12, driving the packaging structure to move along the first direction, so that the packaging structure passes through the opening, and the plated film on the side surface of the packaging body is scraped by the film at the opening edge to remove the burrs on the plated film on the side surface of the packaging body.

[0027] The method for removing the plated film burr drives the packaging structure to pass through the opening of the film, scrapes the plated film of the side surface of the packaging body by the film of the opening edge, and removes the plated film burr by the film of the opening edge, thereby avoiding the short circuit of the pin when the packaging structure is connected with the circuit board.

[0028] Figures 2A-2E Figure 1 is a schematic diagram of the steps of the method for removing the plated film burr provided by an embodiment of the present application.

[0029] Referring to Figure 1 and Figure 2A , step S10 provides a packaging structure 200, which comprises a packaging body 201 and a plated film 202 covering at least the side surface of the packaging body 201.

[0030] In some embodiments, the packaging body 201 comprises a substrate 2011, at least one chip 2012 arranged on the upper surface of the substrate 2011, and a plastic encapsulation 2013 covering the chip 2012 and the upper surface of the substrate 2011, and the plated film 202 covers at least the side surface of the plastic encapsulation 2013. The plated film 202 comprises but is not limited to a metal plated film, which can be used as an electromagnetic shielding layer of the packaging structure 200 to shield electromagnetic interference. For example, in an embodiment, the plated film 202 is a metal copper plated film 202. In other embodiments, a frame can be used to cover the chip 2012 and the substrate 2011, and the plated film covers at least the side surface of the frame.

[0031] In the embodiment, the plated film 202 not only covers the side surface of the packaging body 201, but also covers the top surface of the packaging body 201, so as to form a complete and continuous film layer on the surface of the packaging body 201, and further strengthen the shielding effect on electromagnetic interference.

[0032] In some embodiments, the packaging structure 200 is attached to at least part of the surface of an adhesive layer 210, and the plated film 202 also covers the surface of the adhesive layer 210 which is not covered by the packaging structure 200. For example, in the embodiment, the adhesive layer 210 has a notch 211, the bottom surface of the packaging body 201 in the packaging structure 200 is attached to the adhesive layer 210, the notch 211 exposes part of the bottom surface of the packaging body 201, both ends of the adhesive layer 210 protrude from the side surface of the packaging body 201, and the plated film 202 covers the surface of the protruding part of the adhesive layer 210 and the side surface of the packaging body 201.

[0033] In some embodiments, the method of forming the plated film 202 on the package body 201 comprises: attaching the package body 201 on the adhesive layer 210, the adhesive layer 210 being used to fix the package structure 200; and forming the plated film 202 by using a plating process, the plated film 202 covering the surface of the adhesive layer 210 not covered by the package body 201 and the surface of the package body 201.

[0034] In some embodiments, the surface of the adhesive layer 210 away from the package body 201 can be attached on a support substrate 220, and the support substrate 220 has an opening corresponding to the gap 211, the support substrate 220 being used to support the adhesive layer 210 and the package body 201.

[0035] Please refer to Figure 1 , Figure 2B and Figure 2C , wherein Figure 2C is a top view of Figure 2B , step S11, a film 230 is provided, the film 230 has an opening 231, and the orthogonal projection of the opening 231 in a first direction is within the range of the orthogonal projection of the edge of the package structure 200 in the first direction. In Figure 2C , the edge of the package structure 200 is shown by a dashed line.

[0036] The orthogonal projection of the opening 231 in a first direction is within the range of the orthogonal projection of the edge of the package structure 200 in the first direction, so that the size of the first opening 231 is smaller than the size of the edge of the package structure 200.

[0037] In some embodiments, the film 230 is a polyester film (Polyethylene Terephthalate, PET), which has good flexibility and can deform when subjected to external force. For example, in the present embodiment, the film 230 is a Mylar polyester film.

[0038] In some embodiments, the edge of the packaging structure 200 refers to the edge of the region in the packaging structure 200 where the film 202 has the burr 203, so that the edge of the opening 231 can scratch the film 202 of the side surface of the packaging body 201 in the subsequent step. Further, in some embodiments, in order to further increase the scratching effect of the edge of the opening 231, the edge of the packaging structure 200 refers to the edge of the region with the smallest width in the packaging structure 200, for example, in the present embodiment, the width of the packaging structure 200 at the top surface is the smallest, so the edge of the packaging structure 200 refers to the edge of the top surface of the packaging structure 200, and the orthographic projection of the opening 231 in the first direction (such as the Z direction in the figure) is within the orthographic projection of the edge of the top surface of the packaging structure 200 in the first direction.

[0039] In some embodiments, in order to further increase the scratching effect of the edge of the opening 231 and avoid the packaging structure 200 failing to pass through the opening 231 smoothly, the distance H from the edge of the opening 231 to the edge of the packaging structure 200 is greater than or equal to 0.1 mm. If the distance H from the edge of the opening 231 to the edge of the packaging structure 200 is too large, the packaging structure 200 is blocked by the film 230 and fails to pass through the opening 231 smoothly, and if the distance H from the edge of the opening 231 to the edge of the packaging structure 200 is too small, the opening 231 fails to have a good scratching effect and cannot effectively remove the burr 203.

[0040] In some embodiments, the thickness of the film 230 is 0.01-1 mm, so as to provide sufficient flexibility and toughness, and the film 230 can deform and apply sufficient friction to the surface of the film 202 when subjected to the pressure of the packaging structure 200.

[0041] In some embodiments, the step of providing the film 230 includes: providing a complete film; and cutting the film at a preset region to form the film 230 with the opening 231.

[0042] Please refer to Figure 1 , Figure 2D and Figure 2E , in step S12, the packaging structure 200 is driven to move in the first direction, so that the packaging structure 200 passes through the opening 231, and the edge of the opening 231 scratches the film 202 of the side surface of the packaging body 201 to remove the burr 203 on the film 202 of the side surface of the packaging body 201.

[0043] Since the size of the opening 231 is smaller than the size of the edge of the packaging structure 200, in the initial stage of the packaging structure 200 passing through the opening 231, the edge of the opening 231 is bent and deformed in the direction of the movement of the packaging structure 200 under the pressure of the packaging structure 200. With the continuous movement of the packaging structure 200, the film 230 at the edge of the opening 231 contacts and exerts pressure on the side surface of the packaging structure 200, thereby being able to scrape the side surface of the packaging structure 200, i.e., the surface of the coating film 202 on the side surface of the packaging body 201, so as to remove the burrs 203 on the coating film 202.

[0044] In some embodiments, when the packaging structure 200 is driven to move in the first direction, the coating film 202 is separated from the adhesive layer 210, and the coating film 202 on the side surface of the packaging structure 200 is separated from the coating film 202 on the surface of the adhesive layer 210. Since the coating film 202 is thin and is pulled by the adhesive layer 210, burrs 203 are generated at the bottom of the coating film 202. When the bottom of the coating film 202 passes through the opening 231, the edge of the opening 231 is able to scrape the bottom of the coating film 202 and cut off the burrs 203 under the pressure of the film 230 at the edge of the opening 231 and the blocking of the side wall of the packaging body 201, thereby being able to remove the burrs 203 of the coating film 202.

[0045] In some other embodiments, the burrs generated or adsorbed on the surface of the coating film 202 during the manufacturing process can also be removed.

[0046] In some embodiments, the method for driving the packaging structure 200 to move in the first direction includes applying a pulling force F1 on the top surface of the packaging structure 200 and / or applying a pushing force F2 on the bottom surface of the packaging structure 200, so as to drive the packaging structure 200 to move in the first direction. For example, in some embodiments, only the pulling force F1 is applied on the top surface of the packaging structure 200, or only the pushing force F2 is applied on the packaging structure 200, so as to drive the packaging structure 200 to move in the first direction. In the present embodiment, the pulling force F1 is applied on the top surface of the packaging structure 200, and the pushing force F2 is applied on the packaging structure 200 at the notch 211 of the adhesive layer 210, so as to further ensure the reliability of the movement of the packaging structure 200, and also to reduce the size of the pulling force F1 or the pushing force F2, thereby avoiding the damage of the packaging structure 200 caused by the excessively large pulling force F1 or the pushing force F2.

[0047] In some embodiments, after the packaging structure 200 passes through the opening 231, the film at the edge of the opening 231 resets without the pressure of the packaging structure 200.

[0048] In the above embodiment, the edge of the opening 231 is a complete integral structure, while in another embodiment of the present application, the edge of the opening 231 has a cutout 300.

[0049] Specifically, refer to Figure 3 which is a top view of the film 230 in another embodiment of the method for removing the plated burr 203 of the present application, in order to clearly illustrate the scheme of the present embodiment, the edge of the packaging structure 200 is drawn with a dashed line. Figure 3 In this embodiment, in the region corresponding to at least one corner of the packaging structure 200, the opening 231 has a cutout 300 extending towards the direction away from the opening 231, which divides the edge of the opening 231 into at least two regions independent of each other.

[0050] In some embodiments, if the edge of the opening 231 is an integral structure, the overlapping area of the film 230 at the edge of the opening 231 and the packaging structure 200 cannot be too large, otherwise it will cause the packaging structure 200 to be blocked by the film 230 and unable to pass through the opening 231, while in this embodiment, the film 230 corresponding to different sides of the packaging structure 200 is divided by the cutout 300, so that the packaging structure 200 can pass through the opening 231 smoothly, and the overlapping area of the film 230 at the edge of the opening 231 and the packaging structure 200 can be increased, thereby the contact area of the film 230 at the edge of the opening 231 and the side surface of the packaging structure 200 can be increased, and the scraping force of the film 230 can be improved.

[0051] For example, in the present embodiment, the packaging structure 200 is in a rectangular configuration, which has four corners, so in the regions corresponding to the four corners of the packaging structure 200, the opening 231 all has a cutout 300 extending towards the direction away from the opening 231, which divides the edge of the opening 231 into at least four regions separated from each other, and one region corresponds to one side of the packaging structure 200.

[0052] In some embodiments, the end of the cutout 300 away from the opening 231 protrudes from the edge of the packaging structure 200, so as to further ensure that the packaging structure 200 can pass through the opening 231 smoothly.

[0053] The length H1 of the cutout 300 refers to the size of the cutout 300 along the extension direction of the cutout 300. In some embodiments, the length H1 of the cutout 300 is 0.1-1 mm. If the length H1 is too large, the film 230 at the edge of the opening 231 cannot exert sufficient pressure on the packaging structure 200, and thus cannot effectively remove the burr 203 of the plated film 202. If the length H1 is too small, the cutout 300 cannot achieve the desired effect. In some embodiments, the angle between the cutout 300 and the edge of the opening 231 is 90-180 degrees, so as to adapt to the corner of the packaging structure 200. For example, in the present embodiment, the angle between the cutout 300 and the edge of the opening 231 is 135 degrees.

[0054] The method for removing the burr 203 of the plated film 202 drives the packaging structure 200 to pass through the opening 231 of the film 230, and uses the film 230 at the edge of the opening 231 to scrape the plated film 202 on the side surface of the packaging body 201. The burr 203 of the plated film 202 is scraped off by the film 230 at the edge of the opening 231, thereby achieving the purpose of removing the burr 203 of the plated film 202, and avoiding the short circuit of the pin when the packaging structure 200 is connected to the circuit board.

[0055] The present application also provides a device for executing the above method. Please refer to Figure 4 which is a schematic diagram of the device provided by another embodiment of the present application. Please refer to Figures 2A-2E The device comprises a film 230 and a driving assembly.

[0056] The film 230 has an opening 231, and the orthogonal projection of the opening 231 in a first direction is within the range of the orthogonal projection of the edge of the packaging structure 200 in the first direction. In some embodiments, please refer to Figure 3 In the region corresponding to at least one corner of the packaging structure 200, the opening 231 has a cutout 300 extending away from the opening 231, and the cutout 300 divides the edge of the opening 231 into at least two independent regions.

[0057] In an embodiment, the device further comprises a fixing assembly 410 for fixing the film 230, so that the film 230 does not move when the packaging structure 200 passes through the film 230, and thus the film 230 at the edge of the opening 231 can scrape the surface of the plated film 202. The fixing assembly 410 can be a fixing clamp for pulling two opposite edges of the film 230, or a fixing clamp for pulling four edges of the film 230, and the present application does not limit the same.

[0058] The driving assembly is used to drive the packaging structure 200 to move along the first direction (e.g.Figure 4 The film 230 at the edge of the opening 231 can scrape the plated film 202 on the side surface of the packaging body 201 to remove burrs 203 on the plated film 202 on the side surface of the packaging body 201.

[0059] In some embodiments, the driving assembly comprises at least one of a pulling unit 401 and a pushing unit 402. The pulling unit 401 can pass through the opening 231 and act on the top surface of the packaging structure 200 to exert a pulling force on the top surface of the packaging structure 200; the pushing unit 402 can act on the bottom surface of the packaging structure 200 to exert a pushing force on the bottom surface of the packaging structure 200. For example, in some embodiments, the pulling unit 401 comprises a suction nozzle which is in contact with and adsorbs the top surface of the packaging structure 200, and the suction nozzle is pulled to pull the packaging structure 200 upward. The pushing unit 402 comprises a thimble which acts on the bottom surface of the packaging structure 200, and the thimble is pushed upward to push the packaging structure 200 upward.

[0060] The device provided by the embodiments of the present application can drive the packaging structure 200 to pass through the opening 231 of the film 230, and the film 230 at the edge of the opening 231 can scrape the plated film 202 on the side surface of the packaging body 201 to remove the burrs 203 on the plated film 202, thereby achieving the purpose of removing the burrs 203 on the plated film 202, and further avoiding the short circuit of the pins when the packaging structure 200 is connected to the circuit board, and the device is simple and low in cost.

[0061] It should be noted that the terms "comprise" and "have" and their conjugates, as used in the specification and claims of the present application, are intended to encompass the presence of stated features, structures, components, elements, or objects, but do not preclude the presence or addition of one or more other features, structures, components, elements, or objects. The terms "first," "second," and the like, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another, unless otherwise indicated by context. The use of the terms "a" and "an" and "the" and "said" and "at least one" and "one or more" to refer to an element or object also is taken to cover "one or more" unless otherwise indicated by context. The term "based on" can be taken to mean "based at least in part on," that is, not necessarily based exclusively on the matter following the term. In addition, the embodiments and features of the application can be combined with each other as much as is possible, without departing from the scope of the application. Furthermore, in the above specification, descriptions of well-known components and techniques may have been omitted so as not to unnecessarily obscure the disclosure of the application. In the various embodiments described above, each embodiment can be focused on a difference from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0062] The above description is merely that of preferred embodiments of the application, and it is to be understood that many modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit of the application. Such modifications and improvements are also to be considered as within the scope of the application.

Claims

1. A method for removing burrs from a coating, characterized in that, include: A packaging structure is provided, the packaging structure including a packaging body and a coating covering at least one side surface of the packaging body; A thin film is provided, the thin film having an opening, the orthographic projection of the opening in a first direction being located within the range of the orthographic projection of the edge of the encapsulation structure in the first direction, wherein the first direction is the direction of movement of the encapsulation structure; The packaging structure is driven to move along the first direction so that it passes through the opening, and the thin film at the edge of the opening can scrape the coating on the side surface of the packaging body to remove burrs from the coating; wherein, The edge of the opening is bent and deformed in the first direction under the pressure of the packaging structure, and then contacts the side surface of the packaging structure and applies pressure to scrape the coating on the side surface of the packaging body and remove burrs from the coating on the side surface of the packaging body. When the bottom of the coating passes through the opening, the opening edge can scrape the bottom of the coating and cut off the burrs on the bottom of the coating under the pressure of the film at the edge of the opening and the blocking effect of the side wall of the packaging body.

2. The method for removing coating burrs according to claim 1, characterized in that, The distance from the edge of the opening to the edge of the packaging structure is greater than or equal to 0.1 mm.

3. The method for removing coating burrs according to claim 1 or 2, characterized in that, In the region corresponding to at least one corner of the encapsulation structure, the opening has a cut extending in a direction away from the opening, the cut dividing the edge of the opening into at least two separate regions.

4. The method for removing coating burrs according to claim 3, characterized in that, The end of the cut away from the opening protrudes from the edge of the encapsulation structure.

5. The method for removing coating burrs according to claim 3, characterized in that, The length of the incision is 0.1 to 1 mm.

6. The method for removing coating burrs according to claim 3, characterized in that, The angle between the cut and one edge of the opening is 90 to 180 degrees.

7. The method for removing coating burrs according to claim 1, characterized in that, The method of driving the package structure to move along the first direction includes: applying a tensile force to the top surface of the package structure and / or applying a thrust force to the bottom surface of the package structure.

8. The method for removing coating burrs according to claim 1, characterized in that, The film is a polyester film.

9. The method for removing coating burrs according to claim 1, characterized in that, The step of providing a packaging structure further includes: at least a portion of the bottom surface of the packaging structure is attached to the surface of an adhesive layer, and the coating further covers the surface of the adhesive layer not covered by the packaging structure; The step of driving the packaging structure to move along the first direction further includes: as the packaging structure moves, the packaging structure detaches from the adhesive layer, and the coating on the side surface of the packaging structure separates from the coating on the surface of the adhesive layer.

10. An apparatus for performing the method according to any one of claims 1 to 9, characterized in that, include: A thin film having an opening, the orthographic projection of the opening in a first direction being located within the range of the orthographic projection of the edge of the encapsulation structure in the first direction; A driving component is used to drive the packaging structure to move along the first direction so that the packaging structure passes through the opening, wherein the thin film at the edge of the opening can scrape the coating on the side surface of the packaging body to remove burrs on the coating on the side surface of the packaging body.

11. The apparatus according to claim 10, characterized in that, The device also includes a fixing component for fixing the film.

12. The apparatus according to claim 10, characterized in that, The driving component also includes: A pull-up unit, capable of passing through the opening and acting on the top surface of the encapsulation structure, is used to apply a pulling force to the top surface of the encapsulation structure; and / or The push-up unit can act on the bottom surface of the packaging structure to apply a pushing force to the bottom surface of the packaging structure.

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