Processing method and processing device

Abstract

The application provides a processing method and a processing device for assembling a first workpiece to a second workpiece. The second workpiece has a through hole penetrating the top surface and the bottom surface of the second workpiece. The processing method comprises the following steps: obtaining the thickness of the first workpiece, and obtaining the category and the corresponding processing value of the first workpiece based on the thickness of the first workpiece; obtaining the depth of the through hole of the second workpiece, and obtaining the category of the second workpiece based on the depth of the through hole; processing the side wall of the through hole in the second workpiece of the corresponding category based on the processing value to form a mounting groove, the mounting groove penetrates the top surface of the corresponding second workpiece and communicates with the through hole, and the depth of the mounting groove is equal to the processing value; and assembling the first workpiece into the mounting groove of the second workpiece with the same category. The processing method can eliminate the fluctuation of the inner section difference of the mounting groove after the formation due to the different thicknesses of the second workpieces, improve the processing accuracy, and automatically match the processing value based on the categories of the first workpiece and the second workpiece, so that the operation is simple and the processing efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of component processing and assembly technology, specifically to a processing method and processing apparatus. Background Technology

[0002] Small parts such as product logos (the first workpiece) are generally assembled onto the product body (the second workpiece) by embedding. When assembling the product logo and the product body, through holes on the product body are usually machined according to fixed processing values ​​to form mounting grooves. Then, the product logo is assembled into the mounting groove. To ensure that the distance between the top surface of the product logo and the top surface of the product body meets production requirements after the product logo is assembled into the mounting groove, the distance between the bottom wall of the mounting groove and the bottom surface of the product body (internal step difference) must be within a preset range.

[0003] However, the thickness of different product bodies can fluctuate. Processing the mounting groove according to a fixed processing value results in unstable internal step differences, sometimes exceeding the preset range. This leads to low processing accuracy, causing the distance between the top surface of the product mark and the top surface of the product body to not meet production requirements after the product mark is installed in the mounting groove. Furthermore, the processing value is set based on the thickness of the product mark; different thicknesses require different processing values. Using a fixed processing value requires pausing operations to adjust the values ​​when assembling product marks of different thicknesses, resulting in cumbersome operations and low processing efficiency. Summary of the Invention

[0004] In view of the above, it is necessary to provide a processing method and processing apparatus to improve the accuracy and efficiency of processing.

[0005] This application provides a processing method for assembling a first workpiece onto a second workpiece, wherein the second workpiece has a through hole that penetrates the top and bottom surfaces of the second workpiece. The processing method includes:

[0006] Obtain the thickness of the first workpiece, and based on the thickness of the first workpiece, obtain the category of the first workpiece and the corresponding processing value;

[0007] Obtain the depth of the through hole in the second workpiece, and determine the category of the second workpiece based on the depth of the through hole;

[0008] Based on the machining value, the sidewall of the through hole in the second workpiece of the corresponding category is machined to form a mounting groove, the mounting groove penetrating the top surface of the corresponding second workpiece and communicating with the through hole, and the depth of the mounting groove is equal to the machining value;

[0009] Assemble the first workpiece into the mounting slot of the second workpiece of the same type.

[0010] In some embodiments, obtaining the depth of the through hole in the second workpiece includes:

[0011] Provide a support platform;

[0012] Place the second workpiece onto the support platform, and make the bottom surface of the second workpiece abut against the support platform;

[0013] Select a reference point on the side of the top surface away from the support platform;

[0014] The first distance H1 between the reference point and the support platform was measured.

[0015] The second distance H2 between the reference point and the top surface was measured.

[0016] The depth of the through hole is obtained based on the first distance H1 and the second distance H2.

[0017] In some embodiments, measuring the first distance H1 between the reference point and the support platform includes:

[0018] A ranging sensor is set at the reference point, and a first vertical point is provided on the support platform, such that the line connecting the reference point and the first vertical point is perpendicular to the support platform.

[0019] The distance between the reference point and the first vertical point measured by the distance sensor is the first distance H1 between the reference point and the support platform.

[0020] In some embodiments, there are n first vertical points, where n is a natural number greater than or equal to 2, and the distance between the reference point and the first vertical point measured by the ranging sensor includes:

[0021] The support platform is moved in a direction parallel to the top surface of the second workpiece, such that the line connecting the reference point and a first vertical point is perpendicular to the support platform.

[0022] The distance h11 between the reference point and the corresponding first vertical point is measured by the distance sensor.

[0023] The support platform is moved (n-1) times, and the distances between the reference point and the remaining first vertical points are measured by the distance sensor as h12, h13...h1n.

[0024] Based on the measured values ​​h11, h12, h13...h1n, a first distance H1 is determined between the reference point and the support platform; wherein...

[0025] The first distance H1 satisfies the following relationship: H1=(h11+h12+h13……+h1n) / n.

[0026] In some embodiments, measuring the second distance H2 between the reference point and the top surface includes:

[0027] The support platform is moved in a direction parallel to the top surface of the second workpiece, the top surface of the second workpiece having a second vertical point, such that the line connecting the reference point and the second vertical point is perpendicular to the top surface of the second workpiece.

[0028] The distance between the reference point and the second vertical point, measured by the distance sensor, is the distance H2 between the reference point and the top surface.

[0029] In some embodiments, there are n second vertical points, where n is a natural number greater than or equal to 2, and the distance between the reference point and the second vertical point measured by the ranging sensor includes:

[0030] The support platform is moved in a direction parallel to the top surface of the second workpiece, such that the line connecting the reference point and a second vertical point is perpendicular to the top surface of the second workpiece.

[0031] The distance h21 between the reference point and the corresponding second vertical point is measured by the distance sensor.

[0032] The support platform is moved (n-1) times, and the distances between the reference point and the remaining second vertical points are measured by the distance sensor as h22, h23...h2n.

[0033] Based on the measured values ​​h21, h22, h23...h2n, a second distance H2 from the reference point to the top surface is determined; wherein...

[0034] The second distance H2 satisfies the following relationship: H2=(h21+h22+h23……+h2n) / n.

[0035] In some embodiments, n second vertical points are equally spaced along the periphery of the through hole.

[0036] In some embodiments, assembling the first workpiece into the mounting slot includes:

[0037] An adhesive is applied to the bottom wall of the mounting groove;

[0038] Place the first workpiece onto the adhesive body;

[0039] Press the first workpiece against the adhesive body to fix the first workpiece and the second workpiece.

[0040] This application embodiment also provides a processing apparatus for assembling a first workpiece onto a second workpiece, the second workpiece having a through hole penetrating the top and bottom surfaces of the second workpiece, the processing apparatus comprising:

[0041] An inspection mechanism is used to obtain the thickness of the first workpiece and, based on the thickness of the first workpiece, obtain the category of the first workpiece and the corresponding processing value, and to obtain the depth of the through hole of the second workpiece and, based on the depth of the through hole, obtain the category of the second workpiece.

[0042] A processing mechanism, electrically connected to the detection mechanism, is used to acquire and, based on the processing value, process the sidewall of the through hole in the second workpiece of the corresponding category to form a mounting groove, the mounting groove penetrating the top surface of the corresponding second workpiece and communicating with the through hole, the depth of the mounting groove being equal to the processing value;

[0043] A transfer mechanism for assembling the first workpiece into the mounting slot of the second workpiece of the same type.

[0044] In some embodiments, the processing apparatus further includes:

[0045] A support platform is used to support the second workpiece and abut against the bottom surface of the second workpiece;

[0046] A drive mechanism, connected to the support platform, is used to drive the support platform to move in a direction parallel to the top surface of the second workpiece.

[0047] In the aforementioned processing method and apparatus, the thickness of the first workpiece, the processing value, and the depth of the through hole in the second workpiece form a corresponding relationship. During processing, the first and second workpieces are ensured to belong to the same category. The mounting groove is formed based on the processing value and is machined into the sidewall of the through hole in the corresponding category of the second workpiece. This eliminates fluctuations in the internal step difference after the mounting groove is formed due to differences in the thickness of the second workpiece, ensuring that the internal step difference remains within a preset range, improving processing accuracy, and guaranteeing the assembly quality of the first and second workpieces. Furthermore, the processing value is automatically obtained based on the category matching of the first and second workpieces, allowing for real-time changes in the processing value without interrupting the operation, simplifying the process, and improving processing efficiency. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of the structure of the first workpiece in the embodiment of this application.

[0049] Figure 2 This is a side view of the second workpiece in an embodiment of this application.

[0050] Figure 3 for Figure 2 A top view of the second workpiece.

[0051] Figure 4 This is a schematic diagram of the composition of the processing apparatus according to an embodiment of this application.

[0052] Figure 5 This is a schematic flowchart of the processing method according to an embodiment of this application.

[0053] Figure 6 for Figure 5 A flowchart of step S20.

[0054] Figure 7 for Figure 6 A flowchart of step S240.

[0055] Figure 8 This is a schematic diagram of the first state of the support platform, the second workpiece, and the test sensor in an embodiment of this application.

[0056] Figure 9 for Figure 7 A flowchart illustrating step S242.

[0057] Figure 10 for Figure 6 A flowchart of step S250.

[0058] Figure 11 This is a schematic diagram of the second state of the support platform, the second workpiece, and the test sensor in an embodiment of this application.

[0059] Figure 12 for Figure 10 A flowchart illustrating step S252.

[0060] Figure 13 for Figure 5 A flowchart of step S40.

[0061] Explanation of main component symbols

[0062] First workpiece 10

[0063] Second workpiece 20

[0064] Top surface 20a

[0065] Bottom 20b

[0066] Through hole 20c

[0067] Mounting slot 20d

[0068] Processing device 100

[0069] Testing agency 110

[0070] Distance sensor 111

[0071] Processor 112

[0072] Scanner 113

[0073] Monitor 114

[0074] Alarm 115

[0075] Machining mechanism 120

[0076] Transfer mechanism 130

[0077] 140 support platform

[0078] Surface 140a Detailed Implementation

[0079] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0080] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0081] The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0082] Please see Figure 1 In this embodiment, the first workpiece 10 is generally cylindrical and can be used as a product identifier. The thickness, corresponding category, and corresponding processing value of the first workpiece 10 can be directly affixed to the surface of the first workpiece 10 as a label, and can be directly obtained by scanning during use. The category of the first workpiece 10 can be classified according to its thickness. The thickness of the first workpiece 10 refers to its length along its axial direction.

[0083] Please see Figure 2 and Figure 3In this embodiment, the second workpiece 20 is generally cuboid, such as the back panel of electronic products like mobile phones and tablets. The second workpiece 20 has a top surface 20a and a bottom surface 20b, and a through hole 20c penetrating both the top and bottom surfaces 20a and 20b. The depth of the through hole 20c is equal to the distance between the top and bottom surfaces 20a and 20b. The type of the second workpiece 20 can be classified according to the depth of the through hole 20c. The corresponding processing value mentioned above refers to the processing value of the second workpiece 20 corresponding to the thickness of the first workpiece 10. In this embodiment, the second workpiece is cuboid, and the depth of the through hole 20c is the same as the thickness of the second workpiece 20. Please refer to... Figure 4 The processing apparatus 100 provided in this application embodiment includes a detection mechanism 110, a processing mechanism 120, and a transfer mechanism 130, used to process the sidewall of the through hole 20c to form a mounting groove 20d, and to assemble the first workpiece 10 into the mounting groove 20d. The distance between the bottom wall of the mounting groove 20d and the bottom surface 20b of the second workpiece 20 is defined as the inner step difference. The relevant parameters and corresponding relationships between the first workpiece 10 and the second workpiece 20 can be found in Table 1.

[0084] Table 1. Statistical Table of First Workpiece, Second Workpiece and Corresponding Relationships

[0085] category Thickness of the first workpiece / mm Machining value of the second workpiece / mm Depth of through hole / mm Inner step difference / mm A 0.360～0.380 0.360 0.470～0.499 0.110～0.139 B 0.380～0.400 0.390 0.500～0.550 0.110～0.160 C 0.340～0.360 0.350 0.450～0.469 0.100～0.119

[0086] In some embodiments, the detection mechanism 110 is used to obtain the thickness of the first workpiece 10 and obtain the category and corresponding processing value of the first workpiece 10 based on the thickness of the first workpiece 10, and to obtain the depth of the through hole 20c of the second workpiece 20 and obtain the category of the second workpiece 20 based on the depth of the through hole 20c.

[0087] Please see Figure 4 In some embodiments, the detection mechanism 110 includes a ranging sensor 111, a processor 112, and a scanner 113. The scanner 113 is used to obtain the thickness of the first workpiece 10, which can be obtained by directly scanning the QR code on the surface of the first workpiece 10. The ranging sensor 111 is used to obtain the depth of the through hole 20c of the second workpiece 20. The processor 112 is electrically connected to the scanner 113 and the ranging sensor 111, and is used to obtain the data measured by the ranging sensor 111 and the data scanned by the scanner 113, and can match the category of the first workpiece 10 and the category of the second workpiece 20 based on the obtained data.

[0088] For example, the ranging sensor 111 can be one of a laser sensor, an ultrasonic sensor, or an infrared sensor. The processor 112 can be a computer with analysis and calculation functions.

[0089] Please see Figure 4In some embodiments, the detection mechanism 110 may also include a display 114 or an alarm 115, which is electrically connected to the processor 112 to display whether the assembled first workpiece 10 and second workpiece 20 meet the standards, or to issue an alarm if the assembled first workpiece 10 and second workpiece 20 do not meet the standards.

[0090] In other embodiments, processor 112 may not be required. After the ranging sensor 111 and scanner 113 obtain relevant data, the categories of the first workpiece 10 and the second workpiece 20 may be manually matched.

[0091] Please see Figure 2 and Figure 4 The machining mechanism 120 is electrically connected to the detection mechanism 110, and is used to acquire and, based on the machining value, machine the sidewall of the through hole 20c in the second workpiece 20 of the corresponding category to form a mounting groove 20d. The mounting groove 20d penetrates the top surface 20a of the corresponding second workpiece 20 and connects to the through hole 20c. The depth of the mounting groove 20d is equal to the machining value.

[0092] For example, the processing mechanism 120 can be a machine tool. Specifically, the machine tool includes a machine base and a processing component. The machine base is used to carry the second workpiece 20. The processing component is electrically connected to the processor 112 in the transmission and detection mechanism 110 and is used to obtain the corresponding processing value based on the category of the first workpiece 10 and the second workpiece 20.

[0093] It should be noted that the machining component moves based on the three-dimensional coordinate system set in the machine tool, thereby realizing the machining of the side wall of the through hole 20c in the second workpiece 20. When machining the side wall of the through hole 20c of the second workpiece 20 using a machine tool, the second workpiece 20 is placed on the machine table. There are two ways to determine the machining value of the second workpiece 20. One way is to adjust the origin, X-axis and Y-axis of the three-dimensional coordinate system in the machine tool to be located on the top surface 20a of the second workpiece 20, and the direction from the top surface 20a to the bottom surface 20b is the positive direction of the Z-axis. The machining component moves in the Z-axis direction to machine the side wall of the through hole 20c of the second workpiece 20. In this case, the machining value is equal to the coordinate value in the Z-axis direction after the machining component has machined the mounting groove 20d. The other way is to adjust the origin, X-axis and Y-axis of the three-dimensional coordinate system in the machine tool to be located on the bottom surface 20b of the second workpiece 20, and the direction from the bottom surface 20b to the top surface 20a is the positive direction of the Z-axis. The machining component moves in the Z-axis direction. In this case, the machining value is equal to the depth of the through hole 20c minus the coordinate value in the Z-axis direction after the machining component has machined the mounting groove 20d.

[0094] Please see Figure 4 The transfer mechanism 130 is used to assemble the first workpiece 10 into the mounting slot 20d of the same type as the second workpiece 20. Specifically, the transfer mechanism 130 can be a robot or a motor.

[0095] In the aforementioned processing apparatus 100, the thickness and processing value of the first workpiece 10 and the depth of the through hole 20c of the second workpiece 20 form a corresponding relationship. During processing, the first workpiece 10 and the second workpiece 20 belong to the same category. The mounting groove 20d is formed based on the processing value and is machined on the sidewall of the through hole 20c in the second workpiece 20 of the corresponding category. This eliminates fluctuations in the internal step difference after the mounting groove 20d is formed due to the different thicknesses of the second workpiece 20, ensuring that the internal step difference remains within a preset range, improving processing accuracy, and ensuring the quality of the first workpiece 10 and the second workpiece 20 after assembly. Furthermore, the processing value is automatically obtained based on the category matching of the first workpiece 10 and the second workpiece 20, allowing for real-time changes in the processing value without interrupting the operation, simplifying the operation process and improving processing efficiency.

[0096] Please see Figure 5 This application provides a processing method for assembling a first workpiece 10 to a second workpiece 20 into a mounting groove 20d.

[0097] In some embodiments, the processing method includes:

[0098] S10, obtain the thickness of the first workpiece 10, and obtain the category of the first workpiece 10 and the corresponding processing value based on the thickness of the first workpiece 10.

[0099] Specifically, step S10 can be implemented using the detection mechanism 110 in the processing apparatus 100 described above. The category of the first workpiece 10 and its corresponding processing value can be found in Table 1 above.

[0100] S20, obtain the depth of the through hole 20c of the second workpiece 20, and obtain the category of the second workpiece 20 based on the depth of the through hole 20c.

[0101] Specifically, step S20 can be implemented using the detection mechanism 110 in the processing apparatus 100 described above. The type of the second workpiece 20 and the depth of the corresponding through hole 20c can be found in Table 1 above.

[0102] S30, based on the machining value, the sidewall of the through hole 20c in the second workpiece 20 of the corresponding category is machined to form a mounting groove 20d. The mounting groove 20d penetrates the top surface 20a of the corresponding second workpiece 20 and connects to the through hole 20c. The depth of the mounting groove 20d is equal to the machining value.

[0103] Specifically, step S30 can be achieved using the machining mechanism 120 in the aforementioned machining apparatus 100. The finishing mechanism 120 can machine the sidewall of the through hole 20c to form the mounting groove 20d by milling or chemical etching.

[0104] S40, assemble the first workpiece 10 into the mounting slot 20d of the second workpiece 20 of the same type.

[0105] Specifically, step S40 can be achieved using the transfer mechanism 130 in the processing apparatus 100 described above.

[0106] Please see Figure 2 For ease of description, the machining value, the depth of the through hole 20c of the second workpiece 20, and the inner step difference are denoted as J, H, and D, respectively. Then H = J + D.

[0107] In the above processing method, the thickness and processing value of the first workpiece 10 and the depth of the through hole 20c of the second workpiece 20 form a corresponding relationship. During processing, the first workpiece 10 and the second workpiece 20 belong to the same category. The mounting groove 20d is formed based on the processing value and is machined on the side wall of the through hole 20c in the second workpiece 20 of the corresponding category. This eliminates the fluctuation of the internal step difference after the mounting groove 20d is formed due to the different thicknesses of the second workpiece 20, ensuring that the internal step difference is always kept within a preset range, improving the processing accuracy, and ensuring the quality of the first workpiece 10 and the second workpiece 20 after assembly. In addition, the processing value is automatically obtained based on the category matching of the first workpiece 10 and the second workpiece 20, which can realize the real-time change of the processing value without interrupting the operation, simplifying the operation process and improving processing efficiency.

[0108] Please see Figure 6 S20 obtains the depth of the through hole 20c of the second workpiece 20, including:

[0109] S210, provides a support platform 140 (see...) Figure 8 ).

[0110] Specifically, the surface 140a of the support platform 140 is a planar structure used to support the second workpiece 20.

[0111] S220, place the second workpiece 20 onto the support platform 140, and make the bottom surface 20b of the second workpiece 20 abut against the support platform 140.

[0112] Specifically, the second workpiece 20 can be driven onto the support platform 140 manually or by automated equipment (e.g., motors, robotic arms, etc.).

[0113] S230, select a reference point on the side of the top surface 20a away from the support platform 140.

[0114] Specifically, the reference point is projected onto the surface 140a of the support stage 140 along the extension direction of the through hole 20c.

[0115] S240, the first distance H1 between the reference point and the bearing platform 140 is measured.

[0116] Specifically, the first distance H1 is the distance from the reference point to the surface 140a of the support platform 140.

[0117] S250, the second distance H2 from the reference point to the top surface 20a was measured.

[0118] S260, based on the first distance H1 and the second distance H2, obtain the depth of the through hole 20c.

[0119] Specifically, the depth H of the through hole 20c satisfies the relationship: H = H1 - H2.

[0120] Please see Figure 7 The first distance H1 between the reference point and the bearing platform measured by S240 includes:

[0121] S241, a ranging sensor 111 is set at a reference point, and a first vertical point is on the surface 140a of the support platform 140, such that the line connecting the reference point and the first vertical point is perpendicular to the surface 140a of the support platform 140.

[0122] In this embodiment, the ranging sensor 111 can be one of a laser sensor, an ultrasonic sensor, or an infrared sensor.

[0123] S242, the distance between the reference point and the first vertical point measured by the distance sensor 111 is the first distance H1 between the reference point and the support platform 140.

[0124] In this embodiment, the ranging sensor 111 in the processing apparatus 100 described above can be used to perform step S242. The detection state formed by the ranging sensor 111 performing step S242 is as follows: Figure 8 As shown.

[0125] Please see Figure 9 In some embodiments, there are n first vertical points, where n is a natural number greater than or equal to 2. S242 measures the distance between the reference point and the first vertical point using a ranging sensor, including:

[0126] S242a, the support platform 140 is moved in a direction parallel to the top surface 20a of the second workpiece 20, such that the line connecting the reference point and a first vertical point is perpendicular to the support platform 140.

[0127] Specifically, the transfer mechanism 130 in the aforementioned processing apparatus 100 can be used to move the support platform 140. The line connecting the reference point and a first vertical point is perpendicular to the surface 140a of the support platform 140.

[0128] S242b, the distance h11 between the reference point and the corresponding first vertical point is measured by the distance sensor 111.

[0129] S242c, the carrier platform 140 is moved (n-1) times, and the distances between the reference point and the remaining first vertical points are measured by the distance sensor 111 as h12, h13...h1n.

[0130] S242d, based on the measured h11, h12, h13...h1n, determines the first distance H1 between the reference point and the bearing platform.

[0131] Specifically, the first distance H1 satisfies the following relationship: H1=(h11+h12+h13……+h1n) / n.

[0132] To facilitate understanding, an example is given below. If n is 2, the support platform 140 needs to be moved once. The distance measured by the distance sensor 111 between the reference point and the remaining first vertical point is h12. The first distance H1 satisfies the relationship: H1 = (h11 + h12) / 2. If n is 3, the support platform 140 needs to be moved twice. The distance measured by the distance sensor 111 between the reference point and the remaining first vertical point is h12 and h13. The first distance H1 satisfies the relationship: H1 = (h11 + h12 + h13) / 3.

[0133] Therefore, by averaging multiple distances, the accuracy of the first distance H1 can be improved.

[0134] Please see Figure 10 In some embodiments, S250 measures a second distance H2 from the reference point to the top surface, including:

[0135] S251, the support platform 140 is moved in a direction parallel to the top surface 20a of the second workpiece 20. The top surface 20a of the second workpiece 20 has a second vertical point, such that the line connecting the reference point and the second vertical point is perpendicular to the top surface 20a of the second workpiece 20.

[0136] S252, the distance between the reference point and the second vertical point measured by the distance sensor is the distance H2 from the reference point to the top surface.

[0137] In this embodiment, the ranging sensor 111 in the processing apparatus 100 described above can be used to perform step S252. The detection state formed by the ranging sensor 111 performing step S252 is as follows: Figure 11 As shown.

[0138] Please see Figure 12 In some embodiments, there are n second vertical points, where n is a natural number greater than or equal to 2. S252 measures the distance between the reference point and the second vertical points using a ranging sensor, including:

[0139] S252a, the support platform 140 is moved in a direction parallel to the top surface 20a of the second workpiece 20, so that the line connecting the reference point and a second vertical point is perpendicular to the top surface 20a of the second workpiece 20.

[0140] Specifically, the transfer mechanism 130 in the above-mentioned processing device 100 can be used to move the support platform 140.

[0141] S252b, the distance h21 between the reference point and the corresponding second vertical point is measured by the distance sensor 111.

[0142] S252c, the carrier platform 140 is moved (n-1) times, and the distances between the reference point and the remaining second vertical points are measured by the distance sensor 111 as h22, h23...h2n.

[0143] S252d, based on the measured h21, h22, h23...h2n, determines the second distance H2 from the reference point to the top surface 20a.

[0144] Specifically, the second distance H2 satisfies the following relationship: H2=(h21+h22+h23……+h2n) / n.

[0145] To facilitate understanding, an example is given below. If n is 2, the support platform 140 needs to be moved once. The distance measured by the distance sensor 111 between the reference point and the remaining second vertical point is h22. The second distance H2 satisfies the relationship: H2 = (h21 + h22) / 2. If n is 3, the support platform 140 needs to be moved twice. The distance measured by the distance sensor 111 between the reference point and the remaining second vertical point is h22 and h23. The second distance H2 satisfies the relationship: H2 = (h21 + h22 + h23) / 3.

[0146] Therefore, by averaging multiple distances, the accuracy of the measured second distance H2 can be improved.

[0147] In some embodiments, a plurality of second vertical points are equally spaced along the periphery of the through hole 20c to further improve the accuracy of the measured second distance H2.

[0148] Please see Figure 13 In some embodiments, S40 assembling the first workpiece 10 into the mounting groove 20d includes:

[0149] S410, apply adhesive to the bottom wall of mounting groove 20d.

[0150] Specifically, the adhesive can be glue, bonding layer, etc.

[0151] S420, place the first workpiece 10 onto the adhesive.

[0152] Specifically, the transfer mechanism 130 in the above-mentioned processing device 100 can be used to transfer the first workpiece 10 onto the adhesive.

[0153] S430, press the first workpiece 10 against the adhesive to fix the first workpiece 10 and the second workpiece 20.

[0154] Specifically, the transfer mechanism 130 in the above-mentioned processing device 100 can be used to press the first workpiece 10 against it.

[0155] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.

[0156] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A processing method for assembling a first workpiece onto a second workpiece, the second workpiece having a through hole penetrating the top and bottom surfaces of the second workpiece, characterized in that, The processing method includes: Obtain the thickness of the first workpiece, and based on the thickness of the first workpiece, obtain the category of the first workpiece and the corresponding processing value; Obtain the depth of the through hole in the second workpiece, and determine the category of the second workpiece based on the depth of the through hole; Based on the machining value, the sidewall of the through hole in the second workpiece of the corresponding category is machined to form a mounting groove, the mounting groove penetrating the top surface of the corresponding second workpiece and communicating with the through hole, and the depth of the mounting groove is equal to the machining value; Assemble the first workpiece into the mounting slot of the second workpiece of the same type; There is a preset correspondence between the category of the first workpiece, the category of the second workpiece, and the processing value, and the processing value corresponding to the first workpiece and the second workpiece of the same category is a certain value.

2. The processing method as described in claim 1, characterized in that, The process of obtaining the depth of the through hole in the second workpiece includes: Provide a support platform; Place the second workpiece onto the support platform, and make the bottom surface of the second workpiece abut against the support platform; Select a reference point on the side of the top surface away from the support platform; The first distance H1 between the reference point and the support platform was measured. The second distance H2 between the reference point and the top surface was measured. The depth of the through hole is obtained based on the first distance H1 and the second distance H2.

3. The processing method as described in claim 2, characterized in that, The measured first distance H1 between the reference point and the support platform includes: A ranging sensor is set at the reference point, and a first vertical point is provided on the support platform, such that the line connecting the reference point and the first vertical point is perpendicular to the support platform. The distance between the reference point and the first vertical point measured by the distance sensor is the first distance H1 between the reference point and the support platform.

4. The processing method as described in claim 3, characterized in that, The first vertical point has n points, where n is a natural number greater than or equal to 2. The distance between the reference point and the first vertical point measured by the ranging sensor includes: The support platform is moved in a direction parallel to the top surface of the second workpiece, such that the line connecting the reference point and a first vertical point is perpendicular to the support platform. The distance h11 between the reference point and the corresponding first vertical point is measured by the distance sensor. The support platform is moved (n-1) times, and the distances between the reference point and the remaining first vertical points are measured by the distance sensor as h12, h13...h1n. Based on the measured values ​​h11, h12, h13...h1n, a first distance H1 is determined between the reference point and the support platform; wherein... The first distance H1 satisfies the following relationship: H1 = (h11 + h12 + h13 ... + h1n) / n.

5. The processing method as described in claim 3, characterized in that, The measured second distance H2 from the reference point to the top surface includes: The support platform is moved in a direction parallel to the top surface of the second workpiece, the top surface of the second workpiece having a second vertical point, such that the line connecting the reference point and the second vertical point is perpendicular to the top surface of the second workpiece. The distance between the reference point and the second vertical point, measured by the distance sensor, is the distance H2 between the reference point and the top surface.

6. The processing method as described in claim 5, characterized in that, The second vertical point has n points, where n is a natural number greater than or equal to 2. The distance between the reference point and the second vertical point measured by the ranging sensor includes: The support platform is moved in a direction parallel to the top surface of the second workpiece, such that the line connecting the reference point and a second vertical point is perpendicular to the top surface of the second workpiece. The distance h21 between the reference point and the corresponding second vertical point is measured by the distance sensor. The support platform is moved (n-1) times, and the distances between the reference point and the remaining second vertical points are measured by the distance sensor as h22, h23...h2n. Based on the measured values ​​h21, h22, h23...h2n, a second distance H2 from the reference point to the top surface is determined; wherein... The second distance H2 satisfies the following relationship: H2 = (h21 + h22 + h23 ... + h2n) / n.

7. The processing method as described in claim 6, characterized in that, The n second vertical points are evenly spaced along the periphery of the through hole.

8. The processing method as described in claim 1, characterized in that, The process of assembling the first workpiece into the mounting slot includes: An adhesive is applied to the bottom wall of the mounting groove; Place the first workpiece onto the adhesive body; Press the first workpiece against the adhesive body to fix the first workpiece and the second workpiece.

9. A processing apparatus for assembling a first workpiece onto a second workpiece, the second workpiece having a through hole penetrating its top and bottom surfaces, characterized in that, The processing apparatus includes: An inspection mechanism is used to obtain the thickness of the first workpiece and, based on the thickness of the first workpiece, obtain the category of the first workpiece and the corresponding processing value, and to obtain the depth of the through hole of the second workpiece and, based on the depth of the through hole, obtain the category of the second workpiece. A processing mechanism, electrically connected to the detection mechanism, is used to acquire and, based on the processing value, process the sidewall of the through hole in the second workpiece of the corresponding category to form a mounting groove, the mounting groove penetrating the top surface of the corresponding second workpiece and communicating with the through hole, the depth of the mounting groove being equal to the processing value; A transfer mechanism for assembling the first workpiece into the mounting slot of the second workpiece of the same type; There is a preset correspondence between the category of the first workpiece, the category of the second workpiece, and the processing value, and the processing value corresponding to the first workpiece and the second workpiece of the same category is a certain value.

10. The processing apparatus as described in claim 9, characterized in that, Also includes: A support platform is used to support the second workpiece and abut against the bottom surface of the second workpiece; A drive mechanism, connected to the support platform, is used to drive the support platform to move in a direction parallel to the top surface of the second workpiece.

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