PCB board integrated identification processing equipment

Abstract

The application provides a PCB integrated identification processing equipment. The PCB integrated identification processing equipment comprises a conveying line, a feeding module, a golden finger protection module, a laser module, a labeling module, a discharging module, and various processing modules arranged in sequence along the conveying line; the conveying line is used for conveying PCBs to various modules of the equipment for processing; the feeding module is used for storing and supplying materials of a previous station or stacking; the golden finger protection module is used for protecting the golden fingers of the PCBs; the laser module is used for laser-engraving a two-dimensional code on the PCB; the labeling module is used for attaching labels to the PCBs; and the discharging module is used for taking down and storing the processed PCBs. The various identification processing technologies are integrated into one, the equipment size is reduced, the distance between various process links is shortened, the continuity, completeness and production efficiency of the processing process are improved, production information can be immediately integrated and uploaded, the timeliness of production information is ensured, and quality traceability is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB board identification processing equipment, and particularly relates to a PCB board integrated identification processing equipment. BACKGROUND

[0002] PCB (Printed Circuit Board, Chinese name: Printed Circuit Board), as the base plate of integrated circuits, is one of the most important components in the electronic industry. In the production of PCB, quality control is very important, which directly affects the economic benefit and environmental benefit of enterprises. Identifying each PCB on the production line is a means of quality control. The previous PCB identification processing equipment has low integration, low efficiency, and may make mistakes between each processing link. In addition, the existing equipment cannot integrate and upload the information after PCB identification processing, and cannot immediately know and master the production line status. SUMMARY

[0003] The present application is to solve the above-mentioned technical problems, and proposes a PCB integrated identification processing equipment. The PCB integrated identification processing equipment integrates the functions of feeding, gold finger protection, laser, labeling and scanning code uploading database into one, reduces the size of the equipment, shortens the distance between each process link, improves the continuity, completeness and production efficiency of the processing process, and can immediately integrate and upload the production information, ensures the timeliness of the production information, and realizes quality traceability.

[0004] In order to achieve the above purpose, the present application adopts the following technical scheme:

[0005] A PCB integrated identification processing equipment, characterized in that it comprises:

[0006] a conveying line and a processing module,

[0007] The processing module comprises a feeding module, a gold finger protection module, a laser module, a labeling module and a discharging module,

[0008] The conveying line is used to convey the PCB to each module of the equipment for processing;

[0009] The feeding module is used to store and supply the material of the previous station or stack;

[0010] The gold finger protection module is used to protect the gold finger of the PCB;

[0011] The laser module is used to laser engrave a two-dimensional code on the PCB;

[0012] The labeling module is used to attach a label to the PCB;

[0013] The blanking module is used for reading a two-dimensional code engraved on the PCB and uploading the database, and taking and storing the finished PCB.

[0014] Specifically, the conveying line comprises two rows of parallel guide rails, which are divided into a first guide rail and a second guide rail, both sides of the guide rails are provided with a belt pulley, a supporting belt and a motor, the supporting belt is fixed on the belt pulley, the belt pulley is fixed on the guide rail, the motor drives the belt pulley to rotate, thereby driving the supporting belt to convey the PCB to each module of the equipment for processing.

[0015] Specifically, the feeding module comprises a feeding bin, a feeding carrying module,

[0016] The feeding bin comprises:

[0017] A bottom plate is fixed with a support and an XY bin opening assembly on the bottom plate, which is used for opening and closing the feeding bin and fixing the PCB;

[0018] A bin in-place detection sensor is fixed on the bottom plate and is used for detecting the movement of the XY bin opening assembly;

[0019] A Z-axis lifting servo is fixed on the bottom plate, and the Z-axis lifting servo has a lifting tray for lifting and conveying the PCB;

[0020] An in-place detection sensor is arranged on the top of the Z-axis lifting servo and is used for detecting the position of the PCB;

[0021] A tray detection sensor is arranged on the support and is used for detecting whether there is material on the lifting tray;

[0022] A positioning cylinder is arranged on the top of the feeding bin and is used for positioning the PCB to a position to be adsorbed;

[0023] The feeding carrying module comprises:

[0024] An X-axis guide rail is arranged above the conveying line, and a motor is fixed at the end of the X-axis guide rail, which is used for driving the Z-axis lifting servo to move in the X-axis direction;

[0025] The Z-axis lifting servo is arranged on the X-axis guide rail, and a vacuum generator is arranged on the top of the Z-axis lifting servo, and a vacuum chuck assembly is arranged on the bottom of the Z-axis lifting servo, which is used for adsorbing and carrying the stacked PCBs in the feeding bin to the conveying line.

[0026] Specifically, the golden finger protection module comprises a turnover module and a tape sticking module,

[0027] The tape sticking module is divided into a first tape sticking module and a second tape sticking module, and the turnover module is arranged between the two tape sticking modules, which is used for turning over the PCB after the high-temperature tape is stuck on the front surface, so as to stick the high-temperature tape on the back surface;

[0028] The adhesive tape module comprises a Y-axis guide rail, an X-axis guide rail arranged on the Y-axis guide rail, a Z-axis lifting mechanism arranged on the X-axis guide rail, a high-temperature adhesive tape supply roll fixed on the Z-axis lifting mechanism, and an adhesive tape assembly at the bottom for pasting the high-temperature adhesive tape on the gold fingers of the PCB.

[0029] The turnover module comprises a motor, a turnover mechanism connected to the motor, a PCB grabbing hand fixed at the front end of the turnover mechanism, and the motor drives the turnover mechanism to grab the PCB and turn over the PCB.

[0030] Specifically, the laser module comprises:

[0031] The laser machine is arranged above and below the conveying line for laser engraving a two-dimensional code on the front and back surfaces of the PCB;

[0032] The laser protection cover surrounds the laser machine, the conveying line passes through the laser protection cover, the top has a smoke hole for discharging smoke and dust, and the laser dust generated is prevented from polluting the environment;

[0033] The PCB positioning cylinder is located below the conveying line for positioning the PCB to the laser position;

[0034] The laser dust removal assembly is arranged in the laser protection cover for discharging the smoke and dust generated by the laser.

[0035] Specifically, the labeling module comprises a label feeder and an XYZ labeling module,

[0036] The label feeder comprises a base plate, a label supply roll and a label take-up roll arranged on one side of the base plate, a label peeling knife and a label receiving platform at the top for peeling the label, a lower CCD assembly and a stepper motor arranged on the other side of the base plate, the lower CCD assembly is used to identify the two-dimensional code of the PCB to be attached, and the stepper motor and the label take-up roll are used to recycle the release film of the label;

[0037] The XYZ labeling module comprises an X-axis guide rail arranged above the conveying line, a Y-axis guide rail arranged on the X-axis guide rail, a quick-change label suction assembly and a vacuum generator arranged on the Y-axis guide rail for sucking the label, an upper CCD assembly arranged on one side of the quick-change label suction assembly for identifying the two-dimensional code of the PCB, a Z-axis lifting assembly arranged below the conveying line, a PCB support plate arranged on the Z-axis lifting assembly for supporting and protecting the PCB during labeling, and PCB positioning plates fixed on the guide rails on both sides of the conveying line at this section of the XYZ labeling module for stabilizing and positioning the PCB.

[0038] Specifically, the feeding module comprises a feeding and carrying module and a feeding bin,

[0039] The blanking conveying module comprises: an X-axis guide rail arranged above a conveying line, a Y-axis guide rail arranged on the X-axis guide rail, a vacuum generator and a vacuum chuck assembly arranged on the Y-axis guide rail, and the vacuum generator and the vacuum chuck assembly are used for adsorbing and conveying a PCB board to a blanking bin.

[0040] The blanking bin comprises: a bottom plate, a support and an XY bin opening assembly fixed on the bottom plate, the support and the XY bin opening assembly are used for opening and closing the blanking bin and fixing the PCB board, meanwhile, a bin position detection sensor is also fixed on the bottom plate and used for detecting the movement of the XY bin opening assembly, a Z-axis lifting servo is arranged on the bottom plate, the Z-axis lifting servo has a lifting tray arranged on the Z-axis lifting servo and used for lifting and conveying the PCB board, a position detection sensor is arranged on the top of the Z-axis lifting servo and used for detecting the position of the PCB board, and a tray detection sensor is arranged on the support and used for detecting whether the lifting tray has materials.

[0041] As a preferred solution, the PCB integrated identification processing equipment is characterized in that the blanking module further comprises a code scanning module,

[0042] The code scanning module comprises: an upper code reading module and a lower code reading module, the upper code reading module is arranged on the Y-axis guide rail, and the lower code reading module is arranged below the conveying line, the upper code reading module and the lower code reading module are used for reading two-dimensional codes on two surfaces of the PCB board and uploading the two-dimensional codes to a database.

[0043] As a preferred solution, the PCB integrated identification processing equipment is characterized in that the conveying line is divided into a first conveying line and a second conveying line, the feeding module is divided into a first feeding module and a second feeding module, and the blanking module is divided into a first blanking module and a second blanking module,

[0044] The first conveying line, the first feeding module and the first blanking module cooperate with each other and the golden finger protection module to form a golden finger protection processing module.

[0045] The second conveying line, the second feeding module and the second blanking module cooperate with each other, the laser module and the labeling module to form a laser and labeling processing module.

[0046] As a preferred solution, the PCB integrated identification processing equipment is characterized in that it further comprises: a housing and a human-computer interaction module,

[0047] The housing comprises:

[0048] A feeding door and a blanking door;

[0049] A three-color lamp is used for indicating the running status of the equipment.

[0050] A fan filtering system is used for cooling the equipment and filtering smoke dust generated by the laser.

[0051] The human-computer interaction module comprises: a display, a mouse and a keyboard, and a start-reset and emergency stop switch.

[0052] Advantages

[0053] Compared with the prior art, the PCB integrated identification processing equipment provided by the application integrates the feeding, gold finger protection, laser, labeling and code scanning uploading database functions into one, reduces the equipment volume, shortens the distance between various process links, improves the continuity, completeness and production efficiency of the processing process, can immediately integrate and upload production information, ensures the timeliness of production information, and realizes quality traceability. BRIEF DESCRIPTION OF DRAWINGS

[0054] Figure 1 It is a three-dimensional structure schematic diagram of the device of the embodiment of the application;

[0055] Figure 2 It is a gold finger protection module structure schematic diagram of the device of the embodiment of the application;

[0056] Figure 3 It is a structure schematic diagram of the feeding module, laser module, labeling module, code scanning and discharging module of the device of the embodiment of the application;

[0057] Figure 4 It is a structure schematic diagram of the conveying line of the device of the embodiment of the application;

[0058] Figure 5 It is a structure schematic diagram of the feeding and carrying module of the device of the embodiment of the application;

[0059] Figure 6 It is a structure schematic diagram of the adhesive tape module of the device of the embodiment of the application;

[0060] Figure 7 It is a structure schematic diagram of the turnover module of the device of the embodiment of the application;

[0061] Figure 8 It is a structure schematic diagram of the feeding bin of the device of the embodiment of the application;

[0062] Figure 9 It is a structure schematic diagram of the laser module of the device of the embodiment of the application;

[0063] Figure 10 It is a structure schematic diagram of the XYZ labeling module of the device of the embodiment of the application;

[0064] Figure 11 It is a structure schematic diagram of the label feeder of the device of the embodiment of the application;

[0065] Figure 12 It is a structure schematic diagram of the discharging and carrying module and the code scanning module of the device of the embodiment of the application;

[0066] Figure 13 It is a structure schematic diagram of the discharging bin of the device of the embodiment of the application. DETAILED DESCRIPTION

[0067] The above solutions are further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate but not limit the scope of the present application. The implementation conditions used in the examples can be further adjusted as specified by the manufacturer, and the implementation conditions not specified are usually the conditions in conventional experiments.

[0068] Next, please refer to Figures 1 to 10 to describe the PCB integrated identification processing equipment of the embodiment device of the present application in detail.

[0069] Figure 1 The above solutions are further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate but not limit the scope of the present application. The implementation conditions used in the examples can be further adjusted as specified by the manufacturer, and the implementation conditions not specified are usually the conditions in conventional experiments.

[0070] Figure 2 The above solutions are further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate but not limit the scope of the present application. The implementation conditions used in the examples can be further adjusted as specified by the manufacturer, and the implementation conditions not specified are usually the conditions in conventional experiments.

[0071] Figure 3 The above solutions are further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate but not limit the scope of the present application. The implementation conditions used in the examples can be further adjusted as specified by the manufacturer, and the implementation conditions not specified are usually the conditions in conventional experiments. Figure 3 The above solutions are further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate but not limit the scope of the present application. The implementation conditions used in the examples can be further adjusted as specified by the manufacturer, and the implementation conditions not specified are usually the conditions in conventional experiments.

[0072] Figure 4 The above solutions are further described below in conjunction with specific examples. It should be understood that these examples are used to illustrate but not limit the scope of the present application. The implementation conditions used in the examples can be further adjusted as specified by the manufacturer, and the implementation conditions not specified are usually the conditions in conventional experiments.

[0073] Figure 5The structure schematic diagram of the feeding and carrying module of the device of the embodiment of the application comprises an X-axis guide rail 311 arranged above a conveying line 230, an electric motor 312 fixed at the end of the X-axis guide rail for driving a Z-axis lifting servo 313 to move in the X-axis direction, the Z-axis lifting servo 313 arranged on the X-axis guide rail 311, a vacuum generator 314 at the top, and a vacuum suction disc assembly 315 at the bottom, for sucking and carrying the stacked PCBs in the feeding bin 240 to the conveying line 230.

[0074] Figure 6 The structure schematic diagram of the adhesive tape sticking module of the device of the embodiment of the application comprises a Y-axis guide rail 211, an X-axis guide rail 212 arranged on the Y-axis guide rail 211, a Z-axis lifting mechanism 213 arranged on the X-axis guide rail 212, a high-temperature adhesive tape feeding roll 214 fixed on the Z-axis lifting mechanism, an adhesive tape sticking assembly 215 at the bottom, for sticking the high-temperature adhesive tape on the gold fingers of the PCB.

[0075] Figure 7 The structure schematic diagram of the turnover module of the device of the embodiment of the application comprises an electric motor 221, a turnover mechanism 222 connected to the electric motor, a PCB grabbing hand 223 fixed at the front end of the turnover mechanism, the electric motor drives the turnover mechanism to grab the PCB and turn over the PCB.

[0076] Figure 8 The structure schematic diagram of the feeding bin of the device of the embodiment of the application comprises a bottom plate 242, a support and an XY bin opening assembly 243 fixed on the bottom plate 242, for opening and closing the feeding bin 240 and fixing the PCB; a bin in-place detection sensor 244 fixed on the bottom plate 242, for detecting the movement of the XY bin opening assembly 243; a Z-axis lifting servo 241 fixed on the bottom plate 242, the Z-axis lifting servo having a lifting tray 245 for lifting and transporting the PCB; an in-place detection sensor 248 arranged at the top of the Z-axis lifting servo 241, for detecting the position of the PCB; a tray detection sensor 246 arranged on the support, for detecting whether there is material on the lifting tray; and a positioning air cylinder 247 arranged at the top of the feeding bin, for positioning the PCB to the position to be sucked.

[0077] Figure 9 The structure schematic diagram of the laser module of the device of the embodiment of the application comprises a laser machine 322 arranged on the conveying line 230, for laser engraving a two-dimensional code on the PCB; a laser protective cover 321 surrounding the laser machine, the conveying line 230 passing through the laser protective cover 231, the top having a smoke vent hole for discharging smoke and dust, for preventing pollution caused by laser dust; a PCB positioning air cylinder located below the conveying line, for positioning the PCB to the laser position; and a laser dust removal assembly 323 in the laser protective cover, for discharging the smoke and dust generated by the laser.

[0078] Figure 10 The structure diagram of the label pasting module of the embodiment device of the present application is shown in the figure. An X-axis guide rail 331 is arranged above a conveying line 230. A Y-axis guide rail 332 is arranged on the X-axis guide rail 331. A quick-change label suction assembly 335 and a vacuum generator 334 are arranged on the Y-axis guide rail 332, which are used for sucking labels. An upper CCD assembly 333 is arranged on one side of the label suction assembly, which is used for identifying the two-dimensional code of the PCB board. A Z-axis lifting assembly 338 is arranged below the conveying line 230. The Z-axis lifting assembly 338 has a PCB support plate, which is used for supporting and protecting the PCB board during label pasting. PCB positioning plates 336 are fixed on the guide rails on both sides of the conveying line at this section of the XYZ label pasting module, which are used for stabilizing and positioning the PCB board.

[0079] Figure 11 The structure diagram of the label feeding device of the embodiment device of the present application is shown in the figure. A base plate 361 is provided. A label feeding roll 367 and a label collecting roll 366 are arranged on one side of the base plate 361. A label peeling knife 362 and a label receiving platform 363 are arranged on the top of the base plate 361, which are used for peeling labels. A lower CCD assembly 364 and a stepping motor 365 are arranged on the other side of the base plate. The lower CCD assembly 364 is used for identifying the two-dimensional code of the PCB board to be pasted. The stepping motor 365 and the label collecting roll 366 are used for recycling the release film of the label.

[0080] Figure 12 The structure diagram of the unloading and carrying module and the code scanning module of the embodiment device of the present application is shown in the figure. An X-axis guide rail 342 is arranged above a conveying line 230. A Y-axis guide rail 341 is arranged on the X-axis guide rail 342. A vacuum generator 346 and a vacuum suction cup assembly 345 are arranged on the Y-axis guide rail 342, which are used for sucking and carrying the PCB board to a unloading bin 350. A code reading module includes an upper code reading module 343 and a lower code reading module 344. The upper code reading module 343 is arranged on the Y-axis guide rail 341. The lower code reading module 344 is arranged below the conveying line 230, which is used for reading the two-dimensional codes on both sides of the PCB board and uploading them to the database.

[0081] Figure 13 The structure diagram of the unloading bin of the embodiment device of the present application is shown in the figure. A base plate 351 is provided. A support and an XY bin opening assembly 352 are fixed on the base plate 351, which are used for opening and closing the unloading bin and fixing the PCB board. A bin position detection sensor 356 is also fixed on the base plate 351, which is used for detecting the movement of the XY bin opening assembly 352. A Z-axis lifting servo 353 is also arranged on the base plate 351. The Z-axis lifting servo 353 has a lifting tray 355, which is used for lifting and transporting the PCB board. A position detection sensor 354 is arranged on the top of the Z-axis lifting servo 353, which is used for detecting the position of the PCB board. A tray detection sensor is arranged on the support, which is used for detecting whether there is material on the lifting tray.

[0082] As a preferred solution, the conveying line 230 is divided into a first conveying line 230(a) and a second conveying line 230(b), the feeding module 310 is divided into a first feeding module 310(a) and a second feeding module 310(b), and the discharging module 350 is divided into a first discharging module 350(a) and a second discharging module 350(b),

[0083] The first conveying line 230(a), the first feeding module 310(a) and the first discharging module 350(a) cooperate to form a gold finger protection processing module 200 together with the gold finger protection module.

[0084] The second conveying line 230(b), the second feeding module 310(b) and the second discharging module 350(b) cooperate to form a laser and labeling processing module 300 together with the laser module and the labeling module.

[0085] The following will be described taking the gold finger protection, laser and labeling processing of the PCB board as an example.

[0086] The PCB board stack is placed in the feeding bin 240, the Z-axis lifting servo of the feeding bin lifts the PCB board to the top of the feeding bin, the positioning cylinder positions the PCB board to the feeding and carrying module 310, the vacuum chuck assembly 315 of the feeding and carrying module 310 adsorbs the PCB board, the Z-axis lifting servo 313 is lifted, moves to the above of the conveying line 230 along the X-axis guide rail 311, and then the PCB board is placed, the supporting belt 231 of the conveying line drives the PCB board to move to the finger protection module 200, the adhesive tape module 210 is lowered, the high-temperature adhesive tape is attached on the finger of the PCB board, the conveying line 230 continues to drive the PCB board to the turnover module 220, the PCB board is turned over, and then the PCB board is conveyed to the second adhesive tape module, the high-temperature adhesive tape is attached on the finger of the back of the PCB, and then the PCB board is conveyed to the laser module 320, the PCB positioning cylinder positions the PCB board to the laser area, the laser machine 322 engraves the two-dimensional code on the front and back of the PCB board, the smoke and dust generated are sucked out of the laser module by the laser dust removal assembly 323, then the PCB board is conveyed to the XYZ label sticking module 330, the label unwinding reel 367 of the label feeder 360 sends the label reel to the label peeling knife 362, the XYZ label sticking module 330 takes the label to be attached from the label receiving platform 363 of the label feeder 360, moves to the PCB board to stick the label, and the lower CCD assembly 364 identifies and reads the two-dimensional code of the PCB board, then the stepping motor 365 and the label receiving reel 366 cooperate to recycle the release film of the label, and then the PCB board moves to the unloading and carrying module and the code scanning module 340, the X-axis guide rail 342 and the Y-axis guide rail combination move the vacuum generator 346 and the vacuum chuck assembly 345 arranged on the Y-axis guide rail 341 to adsorb the PCB board, and the upper code reading module 343 on the Y-axis guide rail and the lower code reading module 344 below the conveying line 230 read and identify the two-dimensional codes on the front and back of the PCB and upload them to the system database, and the PCB board is adsorbed to the unloading bin 350, and the Z-axis lifting servo 353 of the unloading bin 350 is lowered to stack and collect the processed PCB board.

[0087] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application. Any equivalent transformation or modification made in the spirit and essence of the present application should be covered within the protection scope of the present application.

Claims

1. A PCB integrated marking processing device, characterized in that, The application relates to a PCB processing device. The device comprises a conveying line and a processing module, wherein the processing module comprises a feeding module, a golden finger protection module, a laser module, a label sticking module and a discharging module; the conveying line is used for conveying the PCB to each module of the device for processing; the feeding module is used for storing and supplying the materials of the previous station or stack; the feeding module comprises a feeding bin and a feeding conveying module; the feeding bin comprises a bottom plate, a support and an XY opening bin assembly fixed on the bottom plate, a bin in-place detection sensor fixed on the bottom plate, a Z-axis lifting servo fixed on the bottom plate, a lifting tray on the Z-axis lifting servo, a position detection sensor on the top of the Z-axis lifting servo, a tray detection sensor on the support, a positioning cylinder on the top of the feeding bin, an X-axis guide rail above the conveying line, a motor fixed on the end of the X-axis guide rail, a vacuum generator on the top of the Z-axis lifting servo, a vacuum suction disc assembly on the bottom of the Z-axis lifting servo, a Y-axis guide rail, an X-axis guide rail on the Y-axis guide rail, a Z-axis lifting mechanism on the X-axis guide rail, a high-temperature adhesive tape feeding roll fixed on the Z-axis lifting mechanism, a high-temperature adhesive tape assembly on the bottom of the Z-axis lifting mechanism, a motor connected with a turnover mechanism, a PCB grabbing hand fixed on the front end of the turnover mechanism, a motor driving the turnover mechanism, the turnover mechanism grabbing the PCB and turning over the PCB, a laser machine arranged above and below the conveying line, a label sticking module and a discharging module. The golden finger protection module is used for protecting the golden fingers of the PCB; the golden finger protection module comprises a turnover module and a high-temperature adhesive tape sticking module; the high-temperature adhesive tape sticking module is divided into a first high-temperature adhesive tape sticking module and a second high-temperature adhesive tape sticking module; the turnover module is arranged between the two high-temperature adhesive tape sticking modules and used for turning over the PCB after the high-temperature adhesive tape is stuck on the front surface of the PCB so as to stick the high-temperature adhesive tape on the back surface of the PCB; the high-temperature adhesive tape sticking module comprises a Y-axis guide rail, an X-axis guide rail arranged on the Y-axis guide rail, a Z-axis lifting mechanism arranged on the X-axis guide rail, a high-temperature adhesive tape feeding roll fixed on the Z-axis lifting mechanism and a high-temperature adhesive tape assembly on the bottom of the Z-axis lifting mechanism; the high-temperature adhesive tape assembly is used for sticking the high-temperature adhesive tape on the golden fingers of the PCB. The turnover module comprises a motor, a turnover mechanism connected with the motor, a PCB grabbing hand fixed on the front end of the turnover mechanism, a motor driving the turnover mechanism, the turnover mechanism grabbing the PCB and turning over the PCB. The laser module is used for laser engraving a two-dimensional code on the PCB. The label sticking module is used for sticking a label on the PCB. The discharging module is used for reading the two-dimensional code engraved on the PCB and uploading the two-dimensional code to a database, taking down the processed PCB and storing the processed PCB. The conveying line comprises two rows of parallel guide rails, a first guide rail and a second guide rail, belt pulleys arranged on the two sides of the guide rails, supporting belts and motors; the supporting belts are fixed on the belt pulleys, the belt pulleys are fixed on the guide rails, the motors drive the belt pulleys to rotate, the belt pulleys drive the supporting belts to convey the PCB to each module of the device for processing.

2. The PCB integrated marking processing apparatus according to claim 1, wherein The laser module comprises a laser machine arranged above and below the conveying line and used for laser engraving a two-dimensional code on the front surface and the back surface of the PCB.

3. The PCB integrated marking processing apparatus according to claim 1, wherein ​ ​ A laser protection cover surrounds the laser machine, the conveying line passes through the laser protection cover, and a smoke exhaust hole is arranged at the top of the laser protection cover for exhausting smoke and dust, so as to prevent laser dust from polluting the environment; A PCB positioning air cylinder is arranged below the conveying line and is used for positioning the PCB to the laser position; A laser dust removal assembly is arranged in the laser protection cover and is used for exhausting the smoke and dust generated by the laser.

4. The PCB integrated marking processing apparatus according to claim 1, wherein The labeling module comprises a label feeder and an XYZ labeling module, The label feeder comprises a base plate, a label feeding roll and a label receiving roll arranged on one side of the base plate, a label peeling knife and a label receiving platform arranged at the top of the base plate, a lower CCD assembly and a stepping motor arranged on the other side of the base plate, the lower CCD assembly is used for identifying the two-dimensional code of the PCB to be attached, and the stepping motor and the label receiving roll are used for recycling the release film of the label; The XYZ labeling module comprises an X-axis guide rail arranged above the conveying line, a Y-axis guide rail arranged on the X-axis guide rail, a quick-change label suction assembly and a vacuum generator arranged on the Y-axis guide rail, and an upper CCD assembly arranged on one side of the quick-change label suction assembly, the upper CCD assembly is used for identifying the two-dimensional code of the PCB; a Z-axis lifting assembly is arranged below the conveying line, the Z-axis lifting assembly comprises a PCB support plate arranged on the Z-axis lifting assembly, and the PCB support plate is used for supporting and protecting the PCB during labeling; PCB positioning pressing plates are fixed on the guide rails on both sides of the XYZ labeling module, and the PCB positioning pressing plates are used for stabilizing and positioning the PCB.

5. The PCB integrated marking processing apparatus according to claim 1, wherein The feeding module comprises a feeding carrying module and a feeding bin, The feeding carrying module comprises an X-axis guide rail arranged above the conveying line, a Y-axis guide rail arranged on the X-axis guide rail, a vacuum generator and a vacuum suction disc assembly arranged on the Y-axis guide rail, and the vacuum generator and the vacuum suction disc assembly are used for sucking and carrying the PCB to the feeding bin; The feeding bin comprises a bottom plate, a support and an XY bin opening assembly fixed on the bottom plate, the support and the XY bin opening assembly are used for opening and closing the feeding bin and fixing the PCB, and a bin position detection sensor is also fixed on the bottom plate, the bin position detection sensor is used for detecting the movement of the XY bin opening assembly, a Z-axis lifting servo is also arranged on the bottom plate, the Z-axis lifting servo comprises a lifting tray arranged on the Z-axis lifting servo, the lifting tray is used for lifting and conveying the PCB, a position detection sensor is arranged on the top of the Z-axis lifting servo, the position detection sensor is used for detecting the position of the PCB, and a tray detection sensor is arranged on the support, the tray detection sensor is used for detecting whether there is material on the lifting tray.

6. The PCB integrated marking processing apparatus according to claim 5, wherein The feeding module further comprises a code scanning module, The code scanning module comprises an upper code reading module and a lower code reading module, the upper code reading module is arranged on the Y-axis guide rail, and the lower code reading module is arranged below the conveying line, the upper code reading module and the lower code reading module are used for reading the two-dimensional codes on both sides of the PCB and uploading the two-dimensional codes to a database.

7. The PCB integrated marking processing apparatus according to claim 1, wherein The conveying line is divided into a first conveying line and a second conveying line, the feeding module is divided into a first feeding module and a second feeding module, and the feeding module is divided into a first feeding module and a second feeding module, The first conveying line, the first feeding module and the first feeding module cooperate with each other, and together with the gold finger protection module, form a gold finger protection processing module. The second conveying line, the second feeding module and the second discharging module cooperate with the laser module and the labeling module to form a laser and labeling processing module.

8. The PCB integrated marking processing apparatus according to claim 1, wherein Further comprising: A housing and a human-computer interaction module, The housing comprises: A feeding door and a discharging door; A three-color lamp for indicating the running status of the equipment; A fan filtering system for cooling the equipment and filtering the smoke generated by the laser; The human-computer interaction module comprises: a display, a mouse and a keyboard, a start reset and emergency stop switch.

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