An automated hot-bar soldering apparatus

Abstract

The application relates to the technical field of soldering equipment, and discloses automatic hot-pressure soldering equipment, which comprises a soldering assembly driven by a driving mechanism to move up and down, the soldering assembly comprises a shell connected with the driving mechanism, an abutting pipe protruding from the bottom of the shell is elastically arranged on the shell, the bottom opening of the abutting pipe is abutted and attached to a circuit board and covers a soldering point when the soldering assembly moves downwards; an electric heating sheet for melting solder is fixed on the shell and located in the abutting pipe, and the end of the solder is located below the electric heating sheet. In the application, the electric heating sheet, the end of the solder and the soldering point are all located in the abutting pipe, the melted solder realizes soldering within the range of the bottom opening of the abutting pipe, so that even if the melting amount of the solder is relatively large, the solder can be blocked by the abutting pipe and cannot overflow outward, the melted solder can still be kept beautiful, and the melted solder cannot contact the adjacent soldering point, so that the generation of defective products is avoided.

Description

Technical Field

[0001] This invention relates to the field of soldering equipment technology, and more specifically to an automated hot-press soldering equipment. Background Technology

[0002] When mounting components on a circuit board, the component leads need to be connected to solder joints on the board using solder, thus establishing conductive connections between components based on the conductive lines on the board. Traditional soldering methods involve hand-held soldering irons and solder, which is slow and requires skilled operators to achieve aesthetically pleasing solder joints. Therefore, existing technologies often employ automated hot-press soldering equipment to overcome these shortcomings.

[0003] Automated hot-press soldering equipment frees users from the need to handle handheld soldering irons and solder. It automatically heats the heating element using electric current, with the solder tip positioned between the heating element and the circuit board solder joint. The heated heating element presses the solder down onto the circuit board solder joint and melts it, thus fixing the component leads to the solder joint.

[0004] However, in practice, existing automated hot-press soldering equipment has at least the following drawbacks:

[0005] In existing soldering equipment, the contact points of the heating element used to melt solder are exposed when it comes into contact with the solder. This causes the molten solder to also be exposed after the heating element melts the solder. When a large amount of solder is molten, it will overflow from the solder joint in an irregular manner, which not only affects the appearance of the solder on the circuit board, but also easily causes the solder to come into contact with adjacent solder joints, resulting in defective products. Summary of the Invention

[0006] The purpose of this invention is to provide an automated hot-press soldering device to overcome the above-mentioned shortcomings of the prior art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an automated hot-press soldering device, comprising a soldering assembly that is driven to move up and down reciprocally by a drive mechanism, the soldering assembly comprising a housing connected to the drive mechanism, and an abutment tube protruding from the bottom of the housing being elastically slidably disposed on the housing, wherein when the soldering assembly moves down, the bottom opening of the abutment tube abuts against and covers the solder joint of the circuit board.

[0008] The housing is fixed with a heating element for melting solder in the abutment tube. The end of the solder is located below the heating element. As the solder assembly moves downward based on the contact between the bottom opening of the abutment tube and the circuit board, the abutment tube elastically moves upward so that the solder contacts and melts with the heating element in the abutment tube.

[0009] The automatic hot pressure soldering equipment, a frame body is elastically slidably arranged in the inner cavity of the shell, the abutting pipe is fixedly installed at the bottom of the frame body, an open hole is formed in the bottom of the shell, the bottom of the abutting pipe passes through the open hole, and the bottom of the frame body abuts against the top surface of the open hole.

[0010] The automatic hot pressure soldering equipment, an extrusion plate is further slidably arranged in the inner cavity of the shell, the compression spring is located between the extrusion plate and the frame body, a screw rod is screwed on the shell, the bottom of the screw rod abuts against the top of the extrusion plate, and the height of the extrusion plate can be changed to adjust the sliding resistance of the frame body by rotating the screw rod based on the elastic force of the compression spring.

[0011] The automatic hot pressure soldering equipment, a first through hole is formed in the screw rod, a second through hole is formed in the extrusion plate, a third through hole passes through the top and the bottom of the frame body, a fourth through hole is formed in the electric heating sheet, and the end of the soldering tin sequentially passes through the first through hole, the second through hole, the third through hole and the fourth through hole from above the shell and extends to below the electric heating sheet.

[0012] The automatic hot pressure soldering equipment, a conveying assembly for conveying the soldering tin is arranged between the frame body and the shell, the soldering tin enters the fourth through hole after passing through the conveying assembly, and the conveying assembly drives the soldering tin to move downward in the process of elastic upward movement of the abutting pipe, so that the end of the soldering tin moves downward to below the electric heating sheet.

[0013] The automatic hot pressure soldering equipment, the conveying assembly comprises first and second rollers which are rotatably arranged in the inner cavity of the shell and oppositely arranged, the soldering tin is pressed and passes through the first and second rollers, a first force applying plate is arranged on the left inner wall of the frame body and connected with the first roller, a second force applying plate is arranged on the right inner wall of the frame body and connected with the second roller, and the first and second force applying plates drive the first and second rollers to rotate inwardly to pull the soldering tin to move downward in the process of elastic upward movement of the abutting pipe.

[0014] The automatic hot pressure soldering equipment, a first gear is fixedly arranged on the outer periphery of the first roller, a second gear is fixedly arranged on the outer periphery of the second roller, a first toothed plate is fixedly arranged on the right side of the first force applying plate and engaged with the first gear, and a second toothed plate is fixedly arranged on the left side of the second force applying plate and engaged with the second gear.

[0015] The automatic hot pressure soldering equipment, a one-way limiting piece is arranged in the inner cavity of the shell, the one-way limiting piece comprises a wedge plate which is elastically slidably arranged, and the wedge plate is elastically inserted into the tooth groove of the first gear in a matched mode, so that the first gear can rotate clockwise and cannot rotate counterclockwise.

[0016] The automatic hot pressure soldering equipment has the one-way limiting piece further comprising a guide plate fixedly connected with the inner cavity of the shell, a guide groove penetrating through the top of the guide plate is formed in the guide plate, the wedge plate is slidingly inserted into the guide groove, and a return spring is fixedly connected between the bottom of the guide groove and the bottom of the wedge plate.

[0017] The automatic hot pressure soldering equipment has the inner cavity of the shell fixedly provided with a heat insulation pipe, the electric heating sheet is fixedly installed at the bottom of the heat insulation pipe, the solder passes through the heat insulation pipe, and the heat insulation pipe is provided with an extruding piece linked with the abutting pipe, and the abutting pipe drives the extruding piece to extrude the fixed solder during the upward movement of the abutting pipe.

[0018] Beneficial effects: In the above technical scheme, the automatic hot pressure soldering equipment provided by the application has the electric heating sheet arranged in the abutting pipe, the end of the solder is located below the electric heating sheet, the abutting pipe is elastically slidingly arranged on the shell, the bottom opening of the abutting pipe abuts against the top surface of the circuit board, the bottom opening of the abutting pipe is attached to the top surface of the circuit board when the bottom opening of the abutting pipe abuts against the top surface of the circuit board, and thus the bottom opening of the abutting pipe can be blocked by the circuit board. During the soldering of the spot welding on the circuit board, the driving mechanism drives the solder assembly to move downward, the bottom opening of the abutting pipe gradually approaches the circuit board, the abutting pipe elastically slides upward under the action of the circuit board after the bottom opening of the abutting pipe abuts against and is attached to the top surface of the circuit board, the distance between the electric heating sheet and the end of the solder gradually decreases with the upward sliding of the abutting pipe, the electric heating sheet contacts the end of the solder and extrudes the end of the solder and the welding spot on the circuit board downward until the electric heating sheet, the end of the solder and the welding spot are all located in the abutting pipe, the solder is melted under the heating action of the electric heating sheet, the melted solder is in the range of the bottom opening of the abutting pipe and adheres to the welding spot to realize soldering, even if the melting amount of the solder is large, the solder can also be blocked by the abutting pipe and cannot overflow outward, the bottom opening of the abutting pipe is circular, so that the melted solder can still be beautiful, and since the abutting pipe blocks, the melted solder cannot contact the adjacent welding spot, and the generation of defective products is avoided, and the deficiencies in the prior art can be effectively solved.

[0019] Meanwhile, since the electric heating sheet is always located in the abutting pipe, direct contact with the outside world is greatly reduced, dust in the outside air is not easy to adhere to the electric heating sheet, and the electric heating sheet is prevented from being polluted by dust when melting the solder. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical schemes in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0021] Figure 1 A front view schematic diagram of an automatic hot soldering equipment provided by an embodiment of the present application is shown in FIG. 1.

[0022] Figure 2 An internal structure schematic diagram of a soldering assembly provided by an embodiment of the present application is shown in FIG. 2.

[0023] Figure 3 A three-dimensional cross-sectional schematic diagram of a soldering assembly provided by an embodiment of the present application is shown in FIG. 3.

[0024] Figure 4 An enlarged structure schematic diagram of part A in FIG. 3 provided by an embodiment of the present application is shown in FIG. 4. Figure 3

[0025] Figure 5 A partial cross-sectional schematic diagram of a soldering assembly provided by an embodiment of the present application is shown in FIG. 5.

[0026] Figure 6 A three-dimensional cross-sectional schematic diagram of a one-way limiting member provided by an embodiment of the present application is shown in FIG. 6.

[0027] Figure 7 A connection structure schematic diagram between a heat insulation pipe, an extrusion member and an electric heating sheet provided by an embodiment of the present application is shown in FIG. 7.

[0028] Figure 8 A three-dimensional cross-sectional schematic diagram between a heat insulation pipe, an extrusion member and an electric heating sheet provided by an embodiment of the present application is shown in FIG. 8.

[0029] Figure 9 An enlarged structure schematic diagram of part B in FIG. 8 provided by an embodiment of the present application is shown in FIG. 9. Figure 8

[0030] Legend of reference signs:

[0031] 1, support frame; 2, drive box; 201, drive motor; 3, winding roller; 4, directional wheel; 5, soldering; 6, soldering assembly; 7, shell; 8, abutting pipe; 801, conical pipe; 802, cylindrical pipe; 9, frame; 901, third through hole; 902, first groove; 903, second groove; 10, first roller; 1001, first gear; 11, second roller; 1101, second gear; 12, first force applying plate; 1201, first toothed plate; 13, second force applying plate; 1301, second toothed plate; 14, heat insulation pipe; 1401, fixed block; 15, screw rod; 1501, first through hole; 16, extrusion plate; 1601, second through hole; 17, compression spring; 18, support spring; 19, electric heating sheet; 1901, fourth through hole; 20, clamping plate; 21, extension plate; 22, acting spring; 23, baffle; 24, one-way limiting member; 2401, guide plate; 2402, wedge plate; 2403, reset spring. DETAILED DESCRIPTION ​​

[0032] In order to make the technical personnel in the art better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the drawings.

[0033] As shown in Figures 1-9 The present application provides a kind of automatic hot pressure soldering equipment, including by driving mechanism driving reciprocating movement of soldering component 6, soldering component 6 includes the shell 7 connected with driving mechanism, the abutment pipe 8 of shell 7 bottom is protruding is elastically arranged on shell 7, when soldering component 6 moves down, the bottom of abutment pipe 8 and circuit board abutment fit and cover solder joint;

[0034] The shell 7 is fixed with the electric heating sheet 19 in the abutment pipe 8 for melting soldering 5, the end of soldering 5 is located below the electric heating sheet 19, based on the abutment of the bottom of abutment pipe 8 and the abutment pipe 8 elastically moves up to make soldering 5 in abutment pipe 8 and electric heating sheet 19 abutment and melt during the process of driving soldering component 6 to move down.

[0035] The improved automatic hot pressure soldering device is used for soldering the soldering points on the circuit board. The relative position and direction are relative to the drawings. Specifically, the fixed support frame 1 is provided with a driving mechanism. The driving mechanism includes a driving motor 201 and a driving box 2. A screw rod (not shown in the figure) is rotatably arranged in the driving box 2. The screw rod is coaxially connected with the output shaft of the driving motor 201. The soldering assembly 6 is screwed with the screw rod through a connecting block. The connecting block is fixedly connected with the soldering assembly 6 and slidably connected with the driving box 2. An avoiding hole (not shown in the figure) is formed in the driving box 2. The connecting block is screwed with the screw rod after penetrating through the avoiding hole. The driving motor 201 can be forward rotated and reverse rotated. The forward rotation of the driving motor 201 drives the screw rod to forward rotate, thereby driving the connecting block to move downward. The downward movement of the connecting block drives the soldering assembly 6 to move downward synchronously. When the driving motor 201 is reverse rotated, the screw rod is reverse rotated, thereby driving the connecting block to move upward. The upward movement of the connecting block drives the soldering assembly 6 to move upward. Of course, the driving mechanism can also be a pneumatic cylinder. The output end of the pneumatic cylinder is fixedly connected with the connecting block, thereby driving the connecting block to move upward and downward, thereby realizing the upward and downward reciprocating movement of the soldering assembly 6. The soldering assembly 6 includes a shell 7. The shell 7 is fixedly connected with the connecting block. The bottom opening of an abutting pipe 8 protrudes from the bottom of the shell 7 and is used for abutting with the circuit board. The abutting pipe 8 is elastically and slidably connected with the shell 7, so that the abutting pipe 8 has a space for moving upward when subjected to an upward force. When the abutting pipe 8 moves upward to the limit position, the bottom of the shell 7 does not abut with the circuit board. The outer diameter of the bottom opening of the abutting pipe 8 is smaller than the distance between two adjacent soldering points, so that the abutting pipe 8 can only cover one soldering point and does not contact the adjacent soldering point when covering one soldering point. The bottom opening surface of the abutting pipe 8 is parallel to the top surface of the circuit board. When the bottom opening of the abutting pipe 8 abuts with the circuit board, the bottom opening of the abutting pipe 8 is attached with the top surface of the circuit board, so that the bottom opening of the abutting pipe 8 is blocked by the circuit board, so that the melted solder 5 cannot leak out of the abutting pipe 8. The end of the solder 5 and the electric heating piece 19 are located in the abutting pipe 8, so that when the electric heating piece 19 melts the solder 5, the melted solder 5 is also in the abutting pipe 8. Because the bottom opening of the abutting pipe 8 is blocked by the circuit board, the melted solder 5 is limited in the abutting pipe 8 and cannot overflow.In the soldering of the soldering points on the circuit board, first, the driving mechanism is started to drive the shell 7 to move downward (i.e. towards the circuit board), the downward movement of the shell 7 drives the electric heating sheet 19 and the abutting pipe 8 to move downward synchronously, the downward movement of the electric heating sheet 19 makes it gradually close to the end of the soldering 5, the downward movement of the abutting pipe 8 makes its bottom gradually close to the circuit board, and the bottom of the abutting pipe 8 corresponds to one of the soldering points, the bottom of the abutting pipe 8 first abuts against the top surface of the circuit board, the circuit board is limited and cannot move downward, so that the circuit board drives the abutting pipe 8 to slide upward elastically, the continuous upward sliding of the abutting pipe 8 makes the end of the soldering 5 continuously close to the soldering point on the circuit board, until the end of the soldering 5 abuts against the soldering point, then the bottom of the electric heating sheet 19 also abuts against the end of the soldering 5, under the heating action of the electric heating sheet 19, the end of the soldering 5 is continuously melted, the melted soldering 5 is located in the abutting pipe 8 and contacts the soldering point to wrap the soldering point, after cooling and solidification, the soldering is realized, since the melted soldering 5 is located in the abutting pipe 8, even if the melting amount of the soldering 5 is relatively large, it will not flow to the outside beyond the abutting pipe 8, the bottom of the abutting pipe 8 is circular, under the limiting action of the circular shape, more soldering 5 can automatically form a circular wrapping of the soldering point, so as to ensure the aesthetic degree of the soldering 5 on the soldering point, and the abutting pipe 8 does not contact the adjacent other soldering points, so the melted soldering 5 will not contact the adjacent soldering points, thereby not easy to produce defective products.

[0036] In the embodiment, the end of the solder 5 is located below the electric heating sheet 19 by arranging the electric heating sheet 19 in the abutting pipe 8, and the abutting pipe 8 is elastically and slidably arranged on the shell 7. The bottom opening of the abutting pipe 8 abuts against the top surface of the circuit board. When the bottom opening of the abutting pipe 8 abuts against the top surface of the circuit board, the bottom opening of the abutting pipe 8 is attached to the top surface of the circuit board, so that the bottom opening of the abutting pipe 8 can be blocked by the circuit board. When the soldering tin is welded on the spot welding on the circuit board, the driving mechanism drives the soldering tin assembly 6 to move downward, so that the bottom opening of the abutting pipe 8 gradually approaches the circuit board. When the bottom opening of the abutting pipe 8 abuts against and is attached to the top surface of the circuit board, the abutting pipe 8 can elastically slide upward under the action of the circuit board. With the upward sliding of the abutting pipe 8, the distance between the electric heating sheet 19 and the end of the solder 5 gradually decreases, until the electric heating sheet 19 contacts and presses downward the end of the solder 5 and the welding spot on the circuit board. At this time, the electric heating sheet 19, the end of the solder 5 and the welding spot are all located in the abutting pipe 8. Under the heating action of the electric heating sheet 19, the solder 5 is melted. The melted solder 5 is in the range of the bottom opening of the abutting pipe 8 and adheres to the welding spot to realize soldering. Even if the melting amount of the solder 5 is large, it will be blocked by the abutting pipe 8 and cannot overflow outward. The bottom opening of the abutting pipe 8 is circular, so that the melted solder 5 can still maintain the appearance. Because of the blocking of the abutting pipe 8, the melted solder 5 will not contact the adjacent welding spot, avoiding the generation of defective products, and effectively solving the defects in the prior art.

[0037] At the same time, since the electric heating sheet 19 is always located in the abutting pipe 8, the direct contact with the outside is greatly reduced, so that the dust in the outside air is not easy to adhere to the electric heating sheet 19, preventing the electric heating sheet 19 from polluting the solder when melting the solder.

[0038] In the embodiment, the frame 9 is elastically and slidably arranged in the inner cavity of the shell 7 by the compression spring 17. The end of the compression spring 17 is fixedly connected to the top of the frame 9, and the outer side surface of the frame 9 is slidably attached to the inner wall of the compression spring 17. The abutting pipe 8 is fixedly installed at the bottom of the frame 9, so that the abutting pipe 8 moves with the frame 9. At the same time, the frame 9 also moves with the abutting pipe 8. The elastic sliding of the abutting pipe 8 is realized under the elastic force of the compression spring 17 and the sliding connection of the frame 9 and the inner cavity of the shell 7. The bottom of the shell 7 is provided with an open opening, and the bottom of the abutting pipe 8 passes through the open opening. The bottom of the frame 9 abuts against the top surface of the open opening, so that the frame 9 will not be separated from the shell 7, and the lowest position of the abutting pipe 8 on the shell 7 is locked. When the circuit board pushes the abutting pipe 8 to move upward with the downward movement of the shell 7, the frame 9 is synchronously moved upward to compress the compression spring 17, so as to realize the elastic upward movement of the abutting pipe 8. At the same time, when the driving mechanism drives the shell 7 to move upward, the bottom of the frame 9 is pushed to abut against the top surface of the open opening again under the elastic force of the compression spring 17, so as to reset the abutting pipe 8.

[0039] Further, the inner cavity of the shell 7 is also slidably provided with an extrusion plate 16, a compression spring 17 is located between the extrusion plate 16 and the frame 9, a screw rod 15 is screwed on the shell 7, and the screw rod 15 can be moved up and down by rotating the screw rod 15. The bottom of the screw rod 15 abuts against the top of the extrusion plate 16. When the screw rod 15 moves up, the compression spring 17 releases the elastic force, thereby reducing the elastic extrusion force on the frame 9. When the screw rod 15 moves down, the compression spring 17 is compressed to increase the elastic extrusion force on the frame 9. That is, based on the elastic force of the compression spring 17, the height of the extrusion plate 16 can be changed by rotating the screw rod 15 to adjust the sliding resistance of the frame 9. When the sliding resistance of the frame 9 changes, the size of the force driving the abutting pipe 8 to move up when the abutting pipe 8 abuts against the circuit board is changed. In this way, the elastic extrusion force of the compression spring 17 on the frame 9 can be set as needed.

[0040] The first through hole 1501 is formed in the screw rod 15, the second through hole 1601 is formed in the extrusion plate 16, the third through hole 901 passes through the top and bottom of the frame 9, and the fourth through hole 1901 is formed in the electric heating sheet 19. The end of the solder 5 extends to the lower side of the electric heating sheet 19 from above the shell 7 through the first through hole 1501, the second through hole 1601, the third through hole 901, and the fourth through hole 1901 in sequence. Preferably, the first through hole 1501, the second through hole 1601, the third through hole 901, and the fourth through hole 1901 are coaxially arranged.

[0041] Further, a conveying assembly for conveying the solder 5 is arranged between the frame 9 and the shell 7. After passing through the conveying assembly, the solder 5 enters the fourth through hole 1901. During the elastic upward movement of the abutting pipe 8, the conveying assembly drives the solder 5 to move downward, so that the end of the solder 5 moves to the lower side of the electric heating sheet 19. Thus, each time the solder joint is soldered, a solder 5 with a specific length is automatically extended to the lower side of the electric heating sheet 19 to contact the electric heating sheet 19, realizing automatic delivery of the solder 5, that is, fully automatic hot pressure soldering. The delivery length is the same each time to ensure that the length of the molten solder 5 is the same each time, thereby improving the appearance of the soldering.

[0042] Specifically, the conveying assembly comprises the first roller 10 and the second roller 11 which are arranged in the left-right direction and are rotatably arranged in the inner cavity of the shell 7, the first roller 10 and the second roller 11 move up and down following the up-down movement of the shell 7, the solder 5 is pressed through the first roller 10 and the second roller 11, under the action of the friction between the solder 5 and the first roller 10 and the second roller 11, when the first roller 10 and the second roller 11 are both rotated to the inside (the position between the first roller 10 and the second roller 11), the solder 5 can be pulled down, or when the first roller 10 and the second roller 11 are synchronously moved down, the solder 5 can also be pulled down, the left inner wall of the frame body 9 is provided with the first force plate 12 which is linked with the first roller 10, the right inner wall of the frame body 9 is provided with the second force plate 13 which is linked with the second roller 11, the first force plate 12 and the second force plate 13 move up and down synchronously following the up-down movement of the frame body 9, that is, the first force plate 12 and the second force plate 13 can move up and down synchronously following the up-down movement of the abutting pipe 8, therefore, during the elastic up movement of the abutting pipe 8, the first force plate 12 and the second force plate 13 drive the first roller 10 and the second roller 11 to rotate to the inside to pull the solder 5 to move down, the height of the elastic up movement of the abutting pipe 8 is the same each time, so that the angle of the first roller 10 and the second roller 11 rotating to the inside is the same each time, and then the length of the solder 5 pulled down by the first roller 10 and the second roller 11 is the same each time, the length of the solder 5 moving down is the length of the end of the solder 5 extending below the electric heating sheet 19, that is, the length of the solder 5 melted by the electric heating sheet 19 each time, so that the length of the solder 5 melted each time is the same.

[0043] The outer periphery of the first roller 10 is fixedly provided with a first gear 1001, the outer periphery of the second roller 11 is fixedly provided with a second gear 1101, the first gear 1001 is engaged with the second gear 1101, the right side surface of the first force plate 12 is fixedly provided with a first toothed plate 1201 engaged with the first gear 1001, the left side surface of the second force plate 13 is fixedly provided with a second toothed plate 1301 engaged with the second gear 1101, the engagement of the first toothed plate 1201 with the first gear 1001 and the engagement of the second toothed plate 1301 with the second gear 1101 enable the first roller 10 and the second roller 11 to rotate inward when the first force plate 12 and the second force plate 13 move upward, a one-way limiting piece 24 is arranged in the inner cavity of the shell 7, the one-way limiting piece 24 comprises an elastically sliding wedge plate 2402, the wedge plate 2402 can elastically slide in the vertical direction, the upper half of the right side surface of the wedge plate 2402 is an inclined surface and the left side surface is a vertical plane, the wedge plate 2402 is elastically inserted and matched with the tooth groove of the first gear 1001, the bottom height of the inclined surface is lower than the lowest height of the tooth peak of the first gear 1001, under the action of the inclined surface, the first gear 1001 can push the wedge plate 2402 to elastically slide downward when it rotates towards the inclined surface (i.e. clockwise), until the wedge plate 2402 is disengaged from the current tooth groove, and so on, so that the first gear 1001 can rotate clockwise, on the contrary, when the first gear 1001 rotates towards the left side surface of the wedge plate 2402 (i.e. counterclockwise), the first gear 1001 cannot push the wedge plate 2402 to slide downward, at this time, the wedge plate 2402 can limit the first gear 1001, so that the first gear 1001 cannot rotate counterclockwise, that is, the wedge plate 2402 is elastically inserted and matched with the tooth groove of the first gear 1001 to enable the first gear 1001 to rotate clockwise and cannot rotate counterclockwise, that is, the first gear 1001 can only rotate inward and cannot rotate outward, so that the second gear 1101 can also only rotate inward and cannot rotate outward, that is, the first roller 10 and the second roller 11 can only rotate inward and cannot rotate outward, so that the solder 5 can only be pulled downward by the first roller 10 and the second roller 11 and cannot be pushed upward by the first roller 10 and the second roller 11, so as to ensure that the first roller 10 and the second roller 11 can pull the solder 5 downward each time they rotate inward.

[0044] Meanwhile, in order to enable the frame 9 and the abutting pipe 8 to be automatically reset under the elastic force of the compression spring 17 when the shell 7 is moved, further, a first recess 902 is formed in the left inner wall of the frame 9, a second recess 903 is formed in the right inner wall of the frame 9, the first force plate 12 is slidingly arranged in the first recess 902 (the top surface and the bottom surface of the first force plate 12 slidingly abut the top surface and the bottom surface of the first recess 902 respectively), the second force plate 13 is slidingly arranged in the second recess 903 (the top surface and the bottom surface of the second force plate 13 slidingly abut the top surface and the bottom surface of the second recess 903 respectively), a plurality of supporting springs 18 are fixedly connected between the first force plate 12 and the first recess 902 and between the second force plate 13 and the second recess 903 respectively, so that the first force plate 12 and the second force plate 13 have a space for sliding away from each other, wherein the elastic force of the compression spring 17 is much greater than the elastic force of the supporting spring 18, and the elastic force of the supporting spring 18 is greater than the sliding resistance of the wedge plate 2402, the first toothed plate 1201 protrudes from the first recess 902, the second toothed plate 1301 protrudes from the second recess 903, each tooth surface on the first toothed plate 1201 and each tooth surface on the second toothed plate 1301 are inclined surfaces, based on the above structure design, when the shell 7 moves downward to enable the circuit board to push the abutting pipe 8 and the frame 9 to move upward, the first force plate 12 and the second force plate 13 can be simultaneously moved upward, and under the elastic force of the supporting spring 18, the first force plate 12 can drive the first gear 1001 to rotate counterclockwise against the resistance of the wedge plate 2402, that is, at this time, the first force plate 12 and the second force plate 13 can drive the first roller 10 and the second roller 11 to rotate inward to pull the solder 5 to move downward; when the shell 7 moves upward, the abutting pipe 8 gradually loses the pushing force of the circuit board, at this time, under the elastic force of the compression spring 17, the frame 9 is driven to exert a downward force, because the wedge plate 2402 limits the clockwise rotation of the first gear 1001, at this time, under the elastic force of the compression spring 17, the first gear 1001 and the second gear 1101 push the first force plate 12 and the second force plate 13 to slide away from each other, so that the first force plate 12 can slide downward without being limited by the first gear 1001, and at the same time, the second force plate 13 can slide downward without being limited by the second gear 1101, until the frame 9 and the abutting pipe 8 are reset.

[0045] In the embodiment, the one-way limiting piece 24 further comprises a guide plate 2401 fixedly connected with the inner cavity of the shell 7, the guide plate 2401 is internally provided with a guide groove penetrating through the top thereof, the wedge plate 2402 is slidingly inserted into the guide groove, and a reset spring 2403 is fixedly connected between the bottom of the guide groove and the bottom of the wedge plate 2402, that is, one end of the reset spring 2403 is fixedly connected with the bottom of the guide groove, and the other end is fixedly connected with the bottom of the wedge plate 2402, and under the action of the reset spring 2403 and the guiding action of the guide groove, the wedge plate 2402 is elastically slid.

[0046] Further, the inner cavity of the shell 7 is fixed with a heat insulation pipe 14, the heat insulation pipe 14 is fixedly installed with a fixed block 1401, the fixed block 1401 is fixedly connected with the inner cavity of the shell 7, the bottom of the heat insulation pipe 14 extends to the lower side of the frame 9 after passing through the fourth through hole 1901, the electric heating sheet 19 is fixedly installed at the bottom of the heat insulation pipe 14, the solder 5 enters the heat insulation pipe 14 after passing through the first roller 10 and the second roller 11, the solder 5 passes through the heat insulation pipe 14 and then passes through the fourth through hole 1901, the heat insulation pipe 14 is provided with a pressing piece linked with the abutting pipe 8, the abutting pipe 8 drives the pressing piece to press the fixed solder 5 during the upward movement of the abutting pipe 8, then the end of the solder 5 abuts against the soldering point, under the fixing action of the pressing piece, the end of the solder 5 abuts against the soldering point, the solder 5 cannot move upward, so that the solder 5 has a stable and specific length to be melted by the electric heating sheet 19.

[0047] The specific implementation mode that the pressing piece is linked with the abutting pipe 8 is that the abutting pipe 8 includes an integrally formed conical pipe 801 and a cylindrical pipe 802, the conical pipe 801 is located above the cylindrical pipe 802, the top opening diameter of the conical pipe 801 is larger than the bottom opening diameter, the pressing piece includes two extension plates 21 fixedly connected with the heat insulation pipe 14 and oppositely arranged, a clamping plate 20 is slidingly inserted into each of the two extension plates 21, one end of each of the two clamping plates 20 extending into the inner cavity of the heat insulation pipe 14, the solder 5 is located between the two clamping plates 20, one end of each of the two clamping plates 20 extending to the outside of the corresponding extension plate 21, a baffle 23 is fixedly installed on each of the two clamping plates 20 and located outside the extension plate 21, an acting spring 22 is installed between each of the two clamping plates 20 and the heat insulation pipe 14, the acting spring 22 provides an outward force to each of the two clamping plates 20 to make one end of each of the two clamping plates 20 slidingly pressed against the inner wall of the conical pipe 801. Based on the above design structure, when the solder is performed, the shell 7 moves downward to drive the abutting pipe 8 to move upward under the action of the circuit board, at the same time, the two clamping plates 20 move downward under the action of the shell 7, at this time, the two clamping plates 20 and the inner wall of the conical pipe 801 relatively slide, that is, the two clamping plates 20 continuously move to the bottom opening direction of the conical pipe 801, under the pressing action of the inner wall of the conical pipe 801, the two clamping plates 20 are continuously driven to move to the inner cavity of the heat insulation pipe 14, when the two clamping plates 20 move to the cylindrical pipe 802, the solder 5 is clamped to be fixed by the two clamping plates 20, then the end of the solder 5 abuts against the soldering point, and the solder 5 remains in the state of being fixed by the two clamping plates 20, finally, the electric heating sheet 19 contacts the solder 5 to melt the solder 5 to realize soldering.

[0048] The foregoing merely illustrates some exemplary embodiments of the application, and it will be appreciated that those skilled in the art will be able to devise various modifications without departing from the spirit and scope of the application. The appended drawings and description are illustrative only, and are not intended to be limiting.

Claims

1. An automated hot-press soldering device, comprising a soldering assembly (6) that is driven to move up and down reciprocally by a drive mechanism, characterized in that: The soldering assembly (6) includes a housing (7) connected to a drive mechanism. An abutment tube (8) protruding from the bottom of the housing (7) is elastically slidably provided on the housing (7). When the soldering assembly (6) moves down, the bottom opening of the abutment tube (8) abuts against the circuit board and covers the solder joint. The housing (7) is fixed with a heating element (19) located in the abutment tube (8) for melting solder (5). The end of the solder (5) is located below the heating element (19). As the solder assembly (6) moves downward based on the contact between the bottom opening of the abutment tube (8) and the circuit board, the abutment tube (8) elastically moves upward so that the solder (5) contacts and melts with the heating element (19) in the abutment tube (8). A frame (9) is elastically slidably disposed in the inner cavity of the housing (7) by means of a compression spring (17). The abutment pipe (8) is fixedly installed at the bottom of the frame (9). An open opening is provided at the bottom of the housing (7). The bottom of the abutment pipe (8) passes through the open opening. The bottom of the frame (9) abuts against the top surface of the open opening. An extrusion plate (16) is slidably disposed in the inner cavity of the housing (7). A compression spring (17) is located between the extrusion plate (16) and the frame (9). A screw (15) is screwed onto the housing (7). The bottom of the screw (15) abuts against the top of the extrusion plate (16). Based on the elastic force of the compression spring (17), the height of the extrusion plate (16) can be changed when the screw (15) is rotated to adjust the sliding resistance of the frame (9).

2. The automated hot-press soldering equipment according to claim 1, characterized in that: The screw (15) has a first through hole (1501), the extrusion plate (16) has a second through hole (1601), the frame (9) has a third through hole (901) that penetrates its top and bottom, the heating element (19) has a fourth through hole (1901), and the end of the solder (5) extends from the top of the housing (7) through the first through hole (1501), the second through hole (1601), the third through hole (901) and the fourth through hole (1901) in sequence to the bottom of the heating element (19).

3. The automated hot-press soldering equipment according to claim 2, characterized in that: A conveying assembly for conveying solder (5) is provided between the frame (9) and the housing (7). After passing through the conveying assembly, the solder (5) enters the fourth through hole (1901). During the elastic upward movement of the abutment pipe (8), the conveying assembly drives the solder (5) to move downward so that the end of the solder (5) moves down below the heating element (19). The conveying assembly includes a first roller (10) and a second roller (11) rotatably disposed in the inner cavity of the housing (7) and arranged opposite to each other. The first force plate (12) is provided on the left inner wall of the frame (9) and is linked to the first force plate (10). The second force plate (13) is provided on the right inner wall of the frame (9) and is linked to the second force plate (11). During the elastic upward movement of the abutment pipe (8), the first force plate (12) and the second force plate (13) respectively drive the first force plate (10) and the second force plate (11) to rotate inward to pull the solder (5) downward.

4. The automated hot-press soldering equipment according to claim 3, characterized in that: A first gear (1001) is fixed on the outer peripheral surface of the first roller (10), a second gear (1101) is fixed on the outer peripheral surface of the second roller (11), a first toothed plate (1201) meshing with the first gear (1001) is fixed on the right side of the first force-applying plate (12), and a second toothed plate (1301) meshing with the second gear (1101) is fixed on the left side of the second force-applying plate (13).

5. The automated hot-press soldering equipment according to claim 4, characterized in that: The inner cavity of the housing (7) is provided with a one-way limiting member (24), which includes a wedge plate (2402) that is elastically slidably disposed. The wedge plate (2402) is elastically inserted into the tooth groove of the first gear (1001) so that the first gear (1001) can rotate clockwise but cannot rotate counterclockwise.

6. The automated hot-press soldering equipment according to claim 5, characterized in that: The one-way limiting member (24) also includes a guide plate (2401) fixedly connected to the inner cavity of the housing (7). The guide plate (2401) has a guide groove that extends through its top. The wedge plate (2402) is slidably inserted into the guide groove. A reset spring (2403) is fixedly connected between the bottom of the guide groove and the bottom of the wedge plate (2402).

7. The automated hot-press soldering equipment according to claim 1, characterized in that: A heat insulation tube (14) is fixed in the inner cavity of the housing (7). The heating element (19) is fixedly installed at the bottom of the heat insulation tube (14). The solder (5) passes through the heat insulation tube (14). The heat insulation tube (14) is provided with an extrusion member that is linked to the abutment tube (8). During the upward movement of the abutment tube (8), the extrusion member is driven to extrude and fix the solder (5).

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