A manufacturing device and manufacturing process of circuit network board

Abstract

The present invention discloses a manufacturing device and manufacturing process of a circuit network board, and relates to the field of circuit board production devices, including a welding machine box, wherein an outer tin liquid tank is arranged inside the welding machine box, and an inner tin liquid tank is arranged inside the outer tin liquid tank, and a group of limit guide rails cooperating with the inner tin liquid tank are arranged on the welding machine box. The present invention arranges an inner tin liquid tank inside the outer tin liquid tank, and respectively arranges a wave crest generating slapping plate and a wave crest breaking impeller at both ends of the inner tin liquid tank. When working, the wave crest generating slapping plate and the wave crest breaking impeller are controlled to work by the tooth grooves driving the driving belt to work. The wave crest generating slapping plate slaps the liquid surface of the tin liquid to generate a uniform wave crest for facilitating the welding of the circuit board. When the wave crest moves to the other end of the inner tin liquid tank, the wave crest breaking impeller moves the tin liquid to the outer tin liquid tank to prevent the wave crest from hitting the wall of the inner tin liquid tank to cause the tin liquid to recoil, thereby affecting the wave crest generated by the wave crest generating slapping plate, and the wave crest is more stable, and the probability of welding leakage is low.

Description

Technical Field

[0001] The invention relates to the field of circuit board production devices, in particular to a manufacturing device for a circuit network board. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards can be called printed circuit boards or printed circuit boards. Circuit boards are divided into three major categories according to the number of layers: single-sided boards, double-sided boards, and multi-layer circuit boards: First, single-sided boards. On the most basic PCB, parts are concentrated on one side, and wires are concentrated on the other side. Because the wires only appear on one side, this type of PCB is called a single-sided circuit board. Single-sided boards are usually simple to make and low in cost, but their disadvantage is that they cannot be applied to products that are too complex. Double-sided boards are an extension of single-sided boards. When single-layer wiring cannot meet the needs of electronic products, double-sided boards are used. Both sides have copper cladding and routing, and the lines between the two layers can be connected through vias to form the required network connection. Multi-layer boards refer to printed boards with more than three layers of conductive graphic layers and insulating materials in between, which are laminated and the conductive graphics are interconnected as required. Multi-layer circuit boards are the product of the development of electronic information technology towards high speed, multi-function, large capacity, small size, thinness and lightness. When producing and processing circuit boards, some electronic devices need to be fixed on the circuit boards by welding, which is generally manual welding or machine welding. Machine welding is efficient, and larger components are generally welded by wave soldering.

[0003] Wave soldering is to make the soldering surface of the plug-in board directly contact with high-temperature liquid tin to achieve the purpose of soldering. The high-temperature liquid tin maintains an inclined surface, and a special device is used to make the liquid tin form a wave-like phenomenon, so it is called "wave soldering". Its main material is solder bar.

[0004] Existing wave soldering machines generally form a solder wave crest by spraying molten soft solder (lead-tin alloy) through an electric pump or an electromagnetic pump, or by injecting nitrogen into the solder pool, so that a printed circuit board pre-installed with components passes through the solder wave crest, thereby achieving soft soldering of the mechanical and electrical connections between the component terminals or pins and the printed circuit board pads.

[0005] However, when the melted tin solder is formed into a wave crest by means of an electric pump, an electromagnetic pump jet or by injecting nitrogen, the tin solder will move due to the wave crest and hit the wall of the solder box, which will reflect and rebound on the next wave crest, affecting the formation of the wave crest, resulting in an unstable wave crest and a high probability of soldering leaks. In addition, a higher temperature is required to melt the tin solder, resulting in a higher temperature around the wave soldering machine, making it uncomfortable for workers working around the wave soldering machine. Summary of the invention

[0006] Based on this, the purpose of the present invention is to provide a circuit network board manufacturing device to solve the technical problem that when the melted tin solder forms a wave crest through an electric pump, an electromagnetic pump jet or the injection of nitrogen, the tin solder moves due to the wave crest and hits the solder box wall and reflects, which will recoil on the next wave crest, affecting the formation of the wave crest, resulting in the wave crest being unstable, so that the probability of soldering leaks is high, and a higher temperature is required to melt the tin solder, resulting in a higher temperature around the wave soldering machine, making the workers working around the wave soldering machine more uncomfortable.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a manufacturing device for a circuit network board, comprising a welding machine box, an outer tin liquid tank is arranged inside the welding machine box, and an inner tin liquid tank is arranged inside the outer tin liquid tank, a group of limiting guide rails cooperating with the inner tin liquid tank are arranged on the welding machine box, and a driving belt is slidably connected inside the limiting guide rail, one end of the inner tin liquid tank is rotatably connected to a wave crest generating slapping plate, and a top surface of the inner tin liquid tank is provided at the same end with a slapping plate that generates slapping with the driving belt and the wave crest. The inner tin liquid tank is rotatably connected to a first driving mechanism of the plate, and the other end of the inner tin liquid tank is rotatably connected to a plurality of wave-breaking impellers, and the top surface of the inner tin liquid tank is provided with a second driving mechanism coordinated with the driving belt and the wave-breaking impeller at the same end, the top surface of the welding machine box is provided with a first heat storage plate, and the bottom surface of the first heat storage plate is provided with heat-conducting strips that are in contact with the inner wall of the welding machine box all around, the inner wall of the welding machine box is provided with a second heat storage plate that is located between the heat-conducting strips and is in contact with the heat-conducting strips, and the top surface of the first heat storage plate is installed with a temperature difference power generation plate.

[0008] By adopting the above technical scheme, when the driving belt is working, the wave crest generating slapping plate and the wave crest breaking impeller can be controlled to work. The wave crest generating slapping plate slaps the liquid surface of the tin liquid to generate uniform wave crests to facilitate the welding of the circuit board. When the wave crest moves to the other end of the inner tin liquid tank, the wave crest breaking impeller moves the tin liquid to the outer tin liquid tank to prevent the wave crest from hitting the box wall of the inner tin liquid tank and causing the tin liquid to recoil. The heat emitted by the tin liquid is stored through the first heat storage plate and the second heat storage plate, and finally consumed by the temperature difference power generation plate on the top surface of the first heat storage plate to generate electricity to provide power for the driving belt.

[0009] The present invention is further configured such that a cooling fan whose output end cooperates with the top surface of the thermoelectric power generation board is installed on one side of the welding machine box, and a battery connected to the thermoelectric power generation board is installed on one side of the welding machine box.

[0010] By adopting the above technical solution, the cooling fan can quickly cool the cold end of the thermoelectric power generation panel to improve the power generation efficiency, and the battery can store the electricity generated by the thermoelectric power generation panel.

[0011] The present invention is further configured such that a heat insulation plate is connected between the top surface of the second heat storage plate and the first heat storage plate.

[0012] By adopting the above technical solution, the heat insulation plate can prevent the heat on the first heat storage plate from flowing back to the second heat storage plate.

[0013] The present invention is further configured such that a tooth groove is provided on the inner side surface of the driving belt, driving motors are installed on both sides of the inner wall bottom surface of the welding machine box, and the output ends of the two driving motors are connected to driving gears respectively meshing with the tooth grooves on the two driving belts.

[0014] By adopting the above technical solution, the driving motor can drive the driving gear to rotate, and drive the driving belt to work through the tooth groove.

[0015] The present invention is further configured as follows: the first driving mechanism includes a first driven gear, an eccentric wheel and a transmission connecting rod; both sides of the top end of the inner tin liquid tank close to the wave crest generating striking plate are rotatably connected to the first driven gear meshing with the tooth groove, and the eccentric wheel is connected to the rotating shaft of the first driven gear; the eccentric part of the eccentric wheel is rotatably connected to the transmission connecting rod, and the other end of the transmission connecting rod is rotatably connected to the top surface of the wave crest generating striking plate.

[0016] By adopting the above technical solution, the driving belt can drive the first driven gear to rotate through the tooth groove, drive the eccentric wheel to rotate, and the eccentric wheel can mobilize the wave crest through the transmission connecting rod to generate reciprocating rotation of the flapping plate.

[0017] The present invention is further configured such that the second driving mechanism includes a second driven gear, a bevel gear and a synchronous pulley, one of the wave-breaking impellers is connected to a bevel gear, and one end of the inner tin liquid tank close to the wave-breaking impeller is rotatably connected to a second driven gear that is meshed with the bevel gear and the tooth groove at the same time, and the top of all the wave-breaking impellers is connected to a synchronous pulley.

[0018] By adopting the above technical solution, when the drive belt is working, the tooth groove drives the second driven gear to rotate, and then drives the meshing bevel gear to rotate, so that the wave-breaking peak impeller connected to the bevel gear rotates, and finally drives all the wave-breaking peak impellers to rotate through the synchronous pulley.

[0019] The present invention is further configured such that a high-temperature liquid pump is installed on the inner bottom surface of the welding machine box, the input end of the high-temperature liquid pump is connected to the bottom surface between the outer tin liquid tank and the inner tin liquid tank, and the output end of the high-temperature liquid pump is connected to the middle of the bottom surface of the inner tin liquid tank.

[0020] By adopting the above technical solution, the high-temperature liquid pump extracts the heated high-temperature tin solder at the bottom of the outer tin liquid tank, and injects it into the inner tin liquid tank through the bottom surface of the inner tin liquid tank, thereby ensuring the temperature and fluidity of the tin solder inside the inner tin liquid tank.

[0021] The present invention is further configured such that a heating plate is installed on the bottom surface of the outer tin liquid box.

[0022] By adopting the above technical solution, the heating plate continuously heats the tin solder, thereby ensuring the fluidity of the tin solder and preventing the tin solder from cooling and solidifying.

[0023] The present invention also provides the following technical solution: a circuit network board manufacturing process, the specific operation steps are as follows:

[0024] Step 1: Start the heating plate, high temperature liquid pump and driving motor. The heating plate cooperates with the high temperature liquid pump to circulate and heat the tin liquid in the outer tin liquid tank and the inner tin liquid tank. At the same time, the driving motor drives the driving belt to work through the driving gear and the tooth groove;

[0025] Step 2: Place the circuit board with components inserted between one end of the top surface of the driving belt, and the driving belt transports the circuit board through the inner tin liquid tank;

[0026] Step 3: When the driving belt is working, the tooth groove drives the meshing first driven gear to rotate, and drives the eccentric wheel to rotate. The eccentric wheel can mobilize the wave crest through the transmission connecting rod to generate a slapping plate to reciprocate and slap the tin liquid surface to generate a wave crest to contact the bottom surface of the circuit board for welding. At the same time, the driving belt drives the second driven gear to rotate through the tooth groove, and then drives the meshing bevel gear to rotate, so that the wave crest breaking impeller connected to the bevel gear rotates, and finally drives all the wave crest breaking impellers to rotate through the synchronous pulley. When the wave crest of the soldering liquid contacts the wave crest breaking impeller, the wave crest breaking impeller rotates to scrape the soldering liquid into the outer tin liquid tank to break the wave crest and prevent the wave crest from recoil and causing wave crest disorder;

[0027] Step 4: The heat emitted by the tin liquid is absorbed by the first heat storage plate and the second heat storage plate. The first heat storage plate contacts the thermoelectric power generation plate, and the heat on it can be transferred to the hot end of the thermoelectric power generation plate. The heat absorbed by the second heat storage plate is finally transferred to the first heat storage plate through the heat conductive strip. The outside cold air contacts the cold end of the thermoelectric power generation plate to generate electricity. The generated current is input into the battery for storage to provide power for the drive belt.

[0028] In summary, the present invention mainly has the following beneficial effects:

[0029] 1. The present invention arranges an inner tin liquid tank inside an outer tin liquid tank, and arranges a wave crest generating slapping plate and a wave crest breaking impeller at both ends of the inner tin liquid tank. When working, the wave crest generating slapping plate and the wave crest breaking impeller are controlled by the tooth grooves driving the driving belt to work. The wave crest generating slapping plate slaps the liquid surface of the tin liquid to generate uniform wave crests for facilitating the welding of the circuit board. When the wave crest moves to the other end of the inner tin liquid tank, the wave crest breaking impeller moves the tin liquid toward the outer tin liquid tank to prevent the wave crest from hitting the wall of the inner tin liquid tank to cause the tin liquid to recoil, thereby affecting the wave crest generated by the wave crest generating slapping plate. The wave crest is more stable and the probability of solder leakage is low.

[0030] 2. The present invention arranges a second heat storage plate on the inner wall of the welding machine box, arranges a first heat storage plate on the top surface of the welding machine box, and arranges a heat-conducting strip connected to the first heat storage plate inside the second heat storage plate. The heat emitted by the tin liquid is stored through the first heat storage plate and the second heat storage plate, and finally consumes the electricity through the temperature difference power generation plate on the top surface of the first heat storage plate to provide power for the drive belt, which is more energy-saving, less heat is dissipated outward, and the temperature around the device is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of the present invention;

[0032] Figure 2 It is a front cross-sectional view of the present invention;

[0033] Figure 3 It is a structural schematic diagram of the internal structure of the present invention from a first viewing angle;

[0034] Figure 4 A structural schematic diagram of the internal structure of the present invention from a second viewing angle;

[0035] Figure 5 is a side sectional view of the present invention;

[0036] Figure 6 For the present invention Figure 2 A magnified view of middle;

[0037] Figure 7 For the present invention Figure 3 Enlarged view of middle B;

[0038] Figure 8 For the present invention Figure 3 Enlarged view of middle C;

[0039] Fig. 9 For the present invention Figure 3 Enlarged view of middle D;

[0040] Fig.10 For the present invention Figure 5 Enlarged view of E.

[0041] In the figure: 1. welding machine box; 2. outer tin liquid tank; 3. inner tin liquid tank; 4. heating plate; 5. high temperature liquid pump; 6. limit guide rail; 7. driving belt; 8. driving motor; 9. driving gear; 10. tooth groove; 11. first driven gear; 12. eccentric wheel; 13. transmission connecting rod; 14. wave crest generating slapping plate; 15. second driven gear; 16. wave crest breaking impeller; 17. bevel gear; 18. synchronous pulley; 19. first heat storage plate; 20. second heat storage plate; 21. heat conducting strip; 22. temperature difference power generation plate; 23. cooling fan; 24. battery; 25. heat insulation plate. DETAILED DESCRIPTION

[0042] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0043] The following describes an embodiment of the present invention based on its overall structure.

[0044] A device for manufacturing a circuit network board, such as Figure 1-10 As shown, it includes a welding machine box 1, an outer tin liquid tank 2 is arranged inside the welding machine box 1, and an inner tin liquid tank 3 is arranged inside the outer tin liquid tank 2, a set of limiting guide rails 6 cooperating with the inner tin liquid tank 3 is arranged on the welding machine box 1, and a driving belt 7 is slidably connected inside the limiting guide rail 6, and a tooth groove 10 is opened on the inner side of the driving belt 7, and driving motors 8 are installed on both sides of the bottom surface of the inner wall of the welding machine box 1, and the output ends of the two driving motors 8 are connected to the teeth on the two driving belts 7 respectively. The driving gear 9 meshes with the groove 10, one end of the inner tin liquid tank 3 is rotatably connected with a wave crest generating slapping plate 14, and the top surface of the inner tin liquid tank 3 is provided with a first driving mechanism that cooperates with the driving belt 7 and the wave crest generating slapping plate 14, the other end of the inner tin liquid tank 3 is rotatably connected with a plurality of wave crest breaking impellers 16, and the top surface of the inner tin liquid tank 3 is provided with a second driving mechanism that cooperates with the driving belt 7 and the wave crest breaking impeller 16, and a battery 24 is installed on one side of the welding machine box 1;

[0045] Before use, it is necessary to charge the initial power for the drive motor 8 into the battery 24. When in use, the drive motor 8 drives the drive gear 9 to rotate, and then drives the drive belt 7 to rotate through the tooth groove 10 meshing with the drive gear 9. When the drive belt 7 works, the circuit board to be soldered is placed between one end of the top surface of the drive belt 7, and the circuit board is transported through the inner tin liquid tank 3 through the drive belt 7. At the same time, when the drive belt 7 works, it can drive the wave crest to generate the slapping plate 14 to reciprocate and slap the liquid surface of the soldering liquid through the first driving mechanism, so that the soldering liquid generates fluctuations, forming a wave crest to contact the bottom surface of the circuit board for welding, and when the drive belt 7 works, it can drive the wave crest breaking impeller 16 to rotate through the second driving mechanism. When the wave crest of the soldering liquid contacts the wave crest breaking impeller 16, the wave crest breaking impeller 16 rotates to scrape the soldering liquid into the outer tin liquid tank 2 to break the wave crest and prevent the wave crest from recoil and causing wave crest disorder;

[0046] A heating plate 4 is installed on the bottom surface of the outer tin liquid tank 2, and a high-temperature liquid pump 5 is installed on the inner bottom surface of the welding machine box 1 inside the outer tin liquid tank 2. The input end of the high-temperature liquid pump 5 is connected to the bottom surface between the outer tin liquid tank 2 and the inner tin liquid tank 3, and the output end of the high-temperature liquid pump 5 is connected to the middle of the bottom surface of the inner tin liquid tank 3;

[0047] The heating plate 4 heats the tin liquid in the outer tin liquid tank 2, and the high-temperature liquid pump 5 extracts the high-temperature tin liquid heated on the inner bottom surface of the outer tin liquid tank 2 and injects it into the inner tin liquid tank 3. The tin liquid scraped by the wave-breaking impeller 16 forms a circulation between the inner tin liquid tank 3 and the outer tin liquid tank 2, thereby preventing the accumulation of the tin liquid in the outer tin liquid tank 2 and preventing the fluidity of the tin liquid in the inner tin liquid tank 3 from decreasing.

[0048] A first heat storage plate 19 is provided on the top surface of the welding machine box 1, and heat conducting strips 21 that are in contact with the inner wall of the welding machine box 1 are provided on the bottom surface of the first heat storage plate 19. A second heat storage plate 20 that is in contact with the heat conducting strips 21 is provided on the inner wall of the welding machine box 1 between the heat conducting strips 21. A thermoelectric power generation plate 22 is installed on the top surface of the first heat storage plate 19. The thermoelectric power generation plate 22 adopts the semiconductor power generation principle and utilizes the characteristics of semiconductor materials to form a temperature difference between two heat sources with different temperatures, thereby generating electric energy. Specifically, a semiconductor thermoelectric power generation device is usually composed of two different semiconductor materials, one material is heated and the other material is cooled. Due to the characteristics of semiconductor materials: a potential difference generated by charge transport will be formed between the two materials, and this potential difference can be connected to an external circuit to form electric energy output. The greater the temperature difference between the two different semiconductor materials, the higher the power generation efficiency, and the thermoelectric power generation plate 22 is connected to a battery 24;

[0049] The heat emitted by the tin liquid is absorbed by the first heat storage plate 19 and the second heat storage plate 20. The first heat storage plate 19 is in contact with the thermoelectric power generation plate 22, and the heat thereon can be transferred to the hot end of the thermoelectric power generation plate 22. The external cold air is in contact with the cold end of the thermoelectric power generation plate 22 to generate electricity. The generated current is input into the battery 24 for storage to provide power for the drive belt 7. The heat absorbed by the second heat storage plate 20 is finally transferred to the first heat storage plate 19 through the heat conductive strip 21 for power generation.

[0050] A heat insulation plate 25 is connected between the top surface of the second heat storage plate 20 and the first heat storage plate 19 to prevent the temperature on the first heat storage plate 19 from flowing back when the temperature on the first heat storage plate 19 is higher than that on the second heat storage plate 20, thereby reducing the power generation efficiency.

[0051] The specific structure of the first driving mechanism is as follows Figure 7 As shown, both sides of the top end of the inner tin liquid box 3 close to the wave crest generating slapping plate 14 are rotatably connected with the first driven gear 11 meshing with the tooth groove 10, and the eccentric wheel 12 is connected to the rotating shaft of the first driven gear 11, and the eccentric part of the eccentric wheel 12 is rotatably connected with the transmission connecting rod 13, and the other end of the transmission connecting rod 13 is rotatably connected to the top surface of the wave crest generating slapping plate 14. When the driving belt 7 rotates and moves, the tooth groove 10 can drive the meshing first driven gear 11 to rotate, and drive the eccentric wheel 12 to rotate, and the eccentric wheel 12 can mobilize the wave crest generating slapping plate 14 through the transmission connecting rod 13 to rotate back and forth to beat the tin liquid surface to generate a wave crest.

[0052] The specific structure of the second driving mechanism is as follows Figure 6 and Figure 8 As shown, a wave-breaking impeller 16 is connected to a bevel gear 17, and one end of the inner tin liquid tank 3 close to the wave-breaking impeller 16 is rotatably connected to a second driven gear 15 that meshes with the bevel gear 17 and the tooth groove 10 at the same time. The second driven gear 15 consists of two coaxial bevel gears and a spur gear. The bevel gear meshes with the bevel gear 17, and the spur gear meshes with the tooth groove 10. The tops of all wave-breaking impellers 16 are connected to a synchronous pulley 18. When the driving belt 7 is working, the tooth groove 10 can drive the second driven gear 15 to rotate, and then drive the meshing bevel gear 17 to rotate, so that the wave-breaking impeller 16 connected to the bevel gear 17 rotates, and finally drives all wave-breaking impellers 16 to rotate through the synchronous pulley 18.

[0053] The liquid outlet where the wave crest breaking impeller 16 is located and one end of the inner tin liquid tank 3 where the wave crest generating striking plate 14 is located are on the same horizontal line, the liquid level in the inner tin liquid tank 3 is higher than the liquid level in the outer tin liquid tank 2, and the height of one side of the outer tin liquid tank 2 close to the liquid outlet of the inner tin liquid tank 3 is higher than the liquid outlet of the inner tin liquid tank 3, so as to ensure that the tin liquid discharged by breaking the wave crest will not splash out of the outer tin liquid tank 2, and the tin liquid will not flow back into the inner tin liquid tank 3 and affect the wave crest due to the excessively high liquid level in the outer tin liquid tank 2.

[0054] In order to improve the power generation efficiency of the temperature difference power generation board 22, a cooling fan 23 whose output end cooperates with the cold end of the top surface of the temperature difference power generation board 22 is installed on one side of the welding machine box 1 to drive the flow of air so that the cold end of the temperature difference power generation board 22 is always in contact with the cold air. When the power generation efficiency of the temperature difference power generation board 22 reaches a certain level, low-energy consumption components such as the drive motor 8, the high-temperature liquid pump 5 and the cooling fan 23 can be powered by the temperature difference power generation board 22.

[0055] The wave crest generating striking plate 14 for generating the wave crest may also be replaced by an electric pump or an electromagnetic pump in the prior art, etc., as long as it can generate a stable wave crest moving from one side to the other side.

[0056] A preheating mechanism cooperating with the driving belt 7 is arranged at the lower end of the internal driving belt 7 of the welding machine box 1. The circuit board is preheated by the preheating mechanism before soldering to prevent the low-temperature circuit board from suddenly contacting the high-temperature tin liquid and causing damage to the circuit board. At the same time, the heat leaked by the preheating mechanism can also further improve the power generation efficiency of the temperature difference power generation plate 22.

[0057] The preheating mechanism can adopt common heating methods such as hot air heating, electric heating wire convection heating, etc. There is no restriction on the preheating method, as long as it can reach the temperature required for preheating the circuit board wave soldering.

[0058] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A device for manufacturing a circuit network board, comprising a welding box (1), characterized in that: The welding machine box (1) is provided with an outer tin liquid tank (2) inside, and an inner tin liquid tank (3) is provided inside the outer tin liquid tank (2), the welding machine box (1) is provided with a set of limit guide rails (6) cooperating with the inner tin liquid tank (3), and the limit guide rails (6) are slidably connected with a driving belt (7), one end of the inner tin liquid tank (3) is rotatably connected with a wave crest generating clapping plate (14), and a first driving mechanism cooperating with the driving belt (7) and the wave crest generating clapping plate (14) is provided at the same end of the top surface of the inner tin liquid tank (3), and the other end of the inner tin liquid tank (3) is rotatably connected with a wave crest generating clapping plate (14). A plurality of wave-breaking impellers (16) are connected, and a second driving mechanism cooperating with the driving belt (7) and the wave-breaking impeller (16) is arranged at the same end of the top surface of the inner tin liquid tank (3); a first heat storage plate (19) is arranged on the top surface of the welding machine box (1), and heat-conducting strips (21) in contact with the inner wall of the welding machine box (1) are arranged around the bottom surface of the first heat storage plate (19); a second heat storage plate (20) in contact with the heat-conducting strips (21) is arranged on the inner wall of the welding machine box (1) between the heat-conducting strips (21), and a temperature difference power generation plate (22) is installed on the top surface of the first heat storage plate (19).

2. The device for manufacturing a circuit network board according to claim 1, characterized in that: A cooling fan (23) whose output end matches the top surface of the thermoelectric power generation board (22) is installed on one side of the welding machine box (1), and a storage battery (24) connected to the thermoelectric power generation board (22) is installed on one side of the welding machine box (1).

3. The device for manufacturing a circuit network board according to claim 1, characterized in that: A heat insulation plate (25) is connected between the top surface of the second heat storage plate (20) and the first heat storage plate (19).

4. The device for manufacturing a circuit network board according to claim 1, characterized in that: The inner side surface of the driving belt (7) is provided with a tooth groove (10), and driving motors (8) are installed on both sides of the inner wall bottom surface of the welding machine box (1), and the output ends of the two driving motors (8) are connected to driving gears (9) respectively meshing with the tooth grooves (10) on the two driving belts (7).

5. The device for manufacturing a circuit network board according to claim 4, characterized in that: The first driving mechanism comprises a first driven gear (11), an eccentric wheel (12) and a transmission connecting rod (13); both sides of the top end of the inner tin liquid tank (3) close to the wave crest generating striking plate (14) are rotatably connected to the first driven gear (11) meshing with the tooth groove (10); the eccentric wheel (12) is connected to the rotating shaft of the first driven gear (11); the eccentric part of the eccentric wheel (12) is rotatably connected to the transmission connecting rod (13), and the other end of the transmission connecting rod (13) is rotatably connected to the top surface of the wave crest generating striking plate (14).

6. The device for manufacturing a circuit network board according to claim 4, characterized in that: The second driving mechanism comprises a second driven gear (15), a bevel gear (17) and a synchronous pulley (18); one of the wave-breaking impellers (16) is connected to the bevel gear (17); and one end of the inner tin liquid tank (3) close to the wave-breaking impeller (16) is rotatably connected to the second driven gear (15) which is meshed with the bevel gear (17) and the tooth groove (10); and the top ends of all the wave-breaking impellers (16) are connected to the synchronous pulley (18).

7. The device for manufacturing a circuit network board according to claim 1, characterized in that: A high-temperature liquid pump (5) is installed on the inner bottom surface of the welding machine box (1); the input end of the high-temperature liquid pump (5) is connected to the bottom surface between the outer tin liquid tank (2) and the inner tin liquid tank (3); and the output end of the high-temperature liquid pump (5) is connected to the middle of the bottom surface of the inner tin liquid tank (3).

8. The device for manufacturing a circuit network board according to claim 1, characterized in that: A heating plate (4) is installed on the bottom surface of the outer tin liquid box (2).

9. A process for manufacturing a circuit network board, using a circuit network board manufacturing device as claimed in any one of claims 1 to 8, characterized in that: The specific steps are as follows: Step 1: Start the heating plate (4), the high temperature liquid pump (5) and the driving motor (8), the heating plate (4) cooperates with the high temperature liquid pump (5) to circulate and heat the tin liquid in the outer tin liquid tank (2) and the inner tin liquid tank (3), and at the same time the driving motor (8) drives the driving belt (7) to work through the driving gear (9) and the tooth groove (10); Step 2: placing the circuit board with the components inserted between the top ends of the driving belt (7), and the driving belt (7) transports the circuit board through the inner tin liquid tank (3); Step 3: When the driving belt (7) is working, the tooth groove (10) drives the meshing first driven gear (11) to rotate, and drives the eccentric wheel (12) to rotate. The eccentric wheel (12) can mobilize the wave crest through the transmission connecting rod (13) to generate a slapping plate (14) to reciprocate and slap the tin liquid surface to generate a wave crest to contact the bottom surface of the circuit board for welding. At the same time, the driving belt (7) drives the second driven gear (15) to rotate through the tooth groove (10), and then drives the meshing bevel gear (17) to rotate, so that the wave crest breaking impeller (16) connected to the bevel gear (17) rotates, and finally drives all the wave crest breaking impellers (16) to rotate through the synchronous pulley (18). When the wave crest of the soldering liquid contacts the wave crest breaking impeller (16), the wave crest breaking impeller (16) rotates to scrape the soldering liquid into the outer layer of the tin liquid tank (2), break the wave crest, and prevent the wave crest from recoil and cause wave crest disorder; Step 4: The heat emitted by the tin liquid is absorbed by the first heat storage plate (19) and the second heat storage plate (20). The first heat storage plate (19) contacts the thermoelectric power generation plate (22), and the heat thereon can be transferred to the hot end of the thermoelectric power generation plate (22). The heat absorbed by the second heat storage plate (20) is finally transferred to the first heat storage plate (19) through the heat conducting strip (21). The external cold air contacts the cold end of the thermoelectric power generation plate (22), and electricity can be generated. The generated current is input into the storage battery (24) for storage, and provides power for the drive belt (7).

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