Temperature-compensated humidity sensor

Abstract

A temperature compensation type humidity sensor comprises a humidity sensitive material, a columnar skeleton disc, a temperature sensor, and a band on-chip ROM type MCU. Multiple deep groove air flow channels are uniformly arranged around the skeleton disc. The skeleton disc is provided with a jack hole for fixing the temperature sensor. The temperature sensor is electrically connected with the micro control unit. The temperature sensor is used for measuring the ambient temperature of the temperature and humidity sensor. The temperature correction of the humidity measurement value is carried out by the MCU. The standard database is stored in the on-chip ROM of the MCU. The standard database comprises multiple humidity sensitive resistance R-humidity H curves of the fast response type temperature and humidity sensor at different temperatures T. The MCU outputs the corresponding humidity value H according to the measured temperature value T and resistance value R.

Description

TECHNICAL FIELD

[0001] The present application relates to a temperature-compensated humidity sensor, which is a further improvement on the prior applications CN2021115047759 and CN2021115398971. BACKGROUND

[0002] Research has found that, in addition to being sensitive to environmental humidity, the humidity-sensitive element is also very sensitive to temperature, with a temperature coefficient generally in the range of 0.2-0.8%RH / ℃, and the temperature coefficient of some humidity-sensitive elements also differs at different relative humidities. The temperature range in which the humidity sensor operates is also an important parameter. The precision of a humidity sensor with high precision and long-term stability should reach ±2%-±5%RH, and it is difficult to be used as a measuring instrument if it does not reach this level. It is relatively difficult for a humidity sensor to achieve a precision of ±2%-±3%RH, and the characteristics given in industry data are usually measured at room temperature (20℃±10℃) and in clean gas. At different temperatures, the humidity sensor often gives different environmental humidity values, and the greater the temperature drift, the greater the deviation of the humidity measurement value.

[0003] In our prior application patent CN2021115398971, the MCU performs temperature correction of the humidity measurement value, which is implemented as follows: the standard database is stored in the on-chip ROM of the MCU, and the standard database includes a plurality of humidity-sensitive resistance R-humidity H curves of the fast-response temperature and humidity sensor at different temperatures T, with a temperature interval of 1℃ or 0.5℃ or 0.2℃ or 0.1℃, and a humidity interval of 1%RH or 0.5%RH or 0.2%RH or 0.1%RH; the MCU looks up the standard database according to the measured temperature value T and resistance value R, and outputs the corresponding humidity value H, which is implemented as follows: the MCU finds the closest numerical point to the measured temperature value T and resistance value R in the standard database, and outputs the humidity value H of the closest numerical point as the environmental humidity measurement value.

[0004] Obviously, in the prior application patent CN2021115398971, if a more accurate environmental humidity value is to be measured, the temperature interval and humidity interval in the standard database must be as small as possible. Assuming that the temperature interval is 0.1℃ and the humidity interval is 0.1%RH, in this case, the humidity sensor needs to adapt to an environment of 0-100℃, and the data volume needs to reach 1000x1000 numerical points, each numerical point including three dimensions of temperature value, humidity value, and resistance value. Undoubtedly, this puts pressure on the memory ROM of the temperature and humidity sensor, and a larger-capacity ROM MCU needs to be purchased, which will significantly increase the manufacturing cost. Moreover, to obtain such a standard database, the amount of work and time required during standard testing is also extremely large. SUMMARY

[0005] To solve the above technical problems, the present application provides a temperature compensation type humidity sensor, which is a further improvement of the prior applications CN2021115047759 and CN2021115398971. The present application aims to provide a humidity sensor with temperature coefficient compensation, high sensitivity, fast response, low storage requirement, and low cost.

[0006] The technical solution is as follows: the humidity sensor comprises a humidity-sensitive winding material and a spoke winding skeleton disc. The spoke winding skeleton disc has a plurality of "T"-shaped winding skeletons uniformly distributed in a radial manner around its circumference. The humidity-sensitive winding material is wound on the plurality of "T"-shaped winding skeletons. The space between every two adjacent "T"-shaped winding skeletons simultaneously forms a winding limiting groove and an air flow channel. After the humidity-sensitive winding material is wound, there is still space, i.e. the air flow channel, for air circulation. The air flow channel is used to shorten the hygroscopic response time and the dehumidification response time of the humidity-sensitive winding material.

[0007] The spoke winding skeleton disc has an upper surface and a lower surface arranged in parallel. The upper surface and the lower surface are respectively provided with an upper electrode and a lower electrode. After the humidity-sensitive winding material is wound, it is connected to the upper electrode and the lower electrode, respectively. The resistivity of the humidity-sensitive winding material is sensitive to the environmental humidity. The humidity-sensitive winding material between the upper electrode and the lower electrode forms a humidity-sensitive resistor.

[0008] As another implementation manner, in order to simplify the manufacturing process, the winding manner can be abandoned, and the humidity-sensitive material can be directly covered on the spoke skeleton disc, i.e.

[0009] The humidity sensor comprises a humidity-sensitive material and a spoke skeleton disc. The spoke skeleton disc has a plurality of "T"-shaped skeletons uniformly distributed in a radial manner around its circumference. The humidity-sensitive material completely covers the plurality of "T"-shaped skeletons. The space between every two adjacent "T"-shaped skeletons forms an air flow channel. The air flow channel is used to shorten the hygroscopic response time and the dehumidification response time of the humidity-sensitive material. The resistivity of the humidity-sensitive material is sensitive to the environmental humidity. The humidity-sensitive material between the upper electrode and the lower electrode forms a humidity-sensitive resistor.

[0010] The temperature sensor is electrically connected with the micro control unit, the temperature sensor is used for measuring the ambient temperature where the temperature and humidity sensor is located, and the temperature correction of the humidity measurement value is performed by the MCU; the relatively parallel upper surface and lower surface of the skeleton disc are provided with metal round plates as the upper electrode and the lower electrode of the temperature and humidity sensor respectively; the humidity sensitive material is electrically connected to the upper electrode and the lower electrode respectively after the covering is completed; the humidity sensitive material between the upper electrode and the lower electrode constitutes a humidity sensitive resistance, the humidity sensitive resistance is electrically connected to the MCU, and the measurement of the resistance is performed by the MCU; the standard database is stored in the on-chip ROM of the MCU, the standard database includes a plurality of humidity sensitive resistance R-humidity H curves of the fast response type temperature and humidity sensor at different temperatures T, that is, R(H) T , each R(H) T curve records the humidity sensitive resistance R corresponding to different humidity values H.

[0011] The MCU outputs the corresponding humidity value H according to the measured temperature value T and resistance value R in the standard database; if the MCU does not find the corresponding value point of the measured temperature value T and resistance value R in the standard database, the MCU finds two temperature values T L , T H adjacent to the measured temperature value T and two resistance values R L , R H adjacent to the measured resistance value R in the standard database, obtains four value points, substitutes the measured temperature value T and resistance value R into the interpolation method, obtains the corresponding humidity value H and outputs.

[0012] As a further improvement, in the above two technical solutions, the humidity sensitive winding material or the humidity sensitive material is a core-shell structure composite nanoparticle or a composite nanowire, and the core-shell structure composite nanoparticle or the composite nanowire is composed of a conductive inner core and a non-conductive shell sensitive to humidity.

[0013] The application is a further improvement of the prior applications CN2021115047759 and CN2021115398971, and naturally has the advantages of the prior applications CN2021115047759 and CN2021115398971: the setting of the deep groove air flow channel can make the humidity-sensitive material more fully contact the air, and accelerate the desorption of the adsorbed water molecules in the humidity-sensitive material through the air flow channel, which can be used to shorten the humidity response time and the dehumidification response time of the humidity-sensitive material, greatly improving the response speed of the humidity sensor. When the composite nanoparticles or composite nanowire shell encounters water, it will swell, increasing the distance between the composite nanoparticles or composite nanowires in contact with each other, thereby reducing the conductivity of the humidity-sensitive material. The use of composite nanoparticles or composite nanowires increases the specific surface area, and the shell is fully exposed to the atmospheric environment, thereby improving the response speed and sensitivity and increasing the desorption speed of water molecules.

[0014] Meanwhile, the application also overcomes some shortcomings of the prior application CN2021115047759, i.e., setting a temperature sensor in the fast-response temperature and humidity sensor, the temperature sensor is used to measure the ambient temperature of the temperature and humidity sensor, and the microcontroller unit (MCU) performs temperature compensation of the humidity measurement value, so that the fast-response temperature and humidity sensor has fast response characteristics, and the temperature stability and accuracy of humidity measurement are greatly improved, overcoming the shortcomings of humidity measurement value drifting with temperature.

[0015] The application also overcomes a shortcoming of the prior application CN2021115398971, i.e., the capacity requirement for storing standard databases in CN2021115047759 is large, resulting in rising costs. Since only a small amount of standard data is required in the application, more measurement data is obtained by using a compensation formula or a fitting formula for calculation, so the capacity requirement for the storage is greatly reduced, thereby reducing the cost.

[0016] At this point, the inventor has elaborated the working principle, technical scheme, and technical effects of the application in detail. This specification What is not specifically described is the state of the art known to the person skilled in the art . BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 : spoke winding skeleton disc;

[0018] Figure 2 : humidity-sensitive winding material winding schematic on spoke winding skeleton disc;

[0019] Figure 3 : Figure 2 humidity-sensitive winding lead-out schematic;

[0020] Figure 4 : As Figure 3 shown in a physical diagram of a winding completion;

[0021] In the figure: 1 is a winding skeleton disc, 2 is a "T" shaped winding skeleton, 3 is a humidity sensitive winding material, 4 is a fixing screw hole. DETAILED DESCRIPTION

[0022] The technical scheme of the present application will be described in detail below with examples.

[0023] Referring to Figures 1-3 , a humidity sensor comprises a humidity sensitive winding material and a spoke winding skeleton disc; a plurality of "T" shaped winding skeletons 2 are uniformly distributed in a radial manner on the circumference of the spoke winding skeleton disc 1, the humidity sensitive winding material is wound on the plurality of "T" shaped winding skeletons 2, the space between every two adjacent "T" shaped winding skeletons 2 simultaneously constitutes a winding limiting groove and an air flow channel, and the humidity sensitive winding material 3 still has a space, i.e. the air flow channel, for air circulation after being wound, the air flow channel is used to shorten the hygroscopic response time and the dehumidification response time of the humidity sensitive winding material;

[0024] The spoke winding skeleton disc 1 has an upper surface and a lower surface which are arranged in parallel, the upper surface and the lower surface are respectively provided with an upper electrode and a lower electrode, the humidity sensitive winding material 3 is respectively connected to the upper electrode and the lower electrode after being wound, and the upper electrode and the lower electrode are not marked in the figure; the humidity sensitive winding material 3 has a resistivity sensitive response to the environmental humidity, and the humidity sensitive winding material 3 between the upper electrode and the lower electrode constitutes a humidity sensitive resistor.

[0025] The fast response type temperature and humidity sensor comprises a resistance type humidity sensitive material and a skeleton disc, a temperature sensor, and a band piece with an in-plate ROM type MCU (Micro Controller Unit; MCU). The micro controller unit (Microcontroller Unit; MCU) is also called a single chip microcomputer (Single Chip Microcomputer) or a single chip microcomputer. The frequency and specifications of the central processing unit (Central Process Unit; CPU) are appropriately reduced, and the memory (memory), counter (Timer), USB, A / D conversion, UART, PLC, DMA, and even LCD driving circuit are integrated on a single chip to form a chip-level computer. The MCU can be divided into two types according to the memory type: no in-plate ROM type and with in-plate ROM type. For the chip without in-plate ROM, an EPROM must be externally connected to be applied (the typical chip is 8031).

[0026] The MCU's on-chip ROM stores a standard database, which includes multiple humidity-sensitive resistor R-humidity H curves (R(H)) for fast-response temperature and humidity sensors at different temperatures T. T Curves, each R(H) T The curve records the humidity-sensitive resistor R corresponding to different humidity values ​​H. The MCU looks up the corresponding humidity value H in a standard database based on the measured temperature value T and resistance value R. If the MCU does not find a value point corresponding to the measured temperature value T and resistance value R in the standard database, it searches for the two nearest adjacent temperature values ​​T1 and T2 to the measured temperature value T1 in the standard database. L T H And the two resistance values ​​R that are closest to the measured resistance value R above and below. L R H Four numerical points (T) were obtained. L R L ), (T) L R H ), (T) H R L ), (T) H R H Based on the humidity values ​​H1, H2, H3, and H4 corresponding to the given values, a three-dimensional TRH coordinate system is established, resulting in a TRH three-dimensional coordinate system with four points (T) as the reference points. L R L， H1), (T) L R H， H2), (T) H R L， H3), (T) H R H， The curved quadrilateral formed by H4 is used to calculate the corresponding humidity value H by substituting the measured temperature value T and resistance value R into the interpolation method.

[0027] Interpolation is an approximate calculation method that uses known points to approximate unknown points. It involves constructing a polynomial function that passes through all known points, and then using the obtained function to predict the location point.

[0028] In this invention, the MCU and the temperature sensor can communicate via I... 2 C bus connection. I 2 The C bus occupies two MCU input / output lines, and communication between them is entirely software-based. The temperature sensor's address can be set via two address pins, allowing one I / O pin to be used for... 2Eight such sensors can be connected to the C bus at the same time. In this scheme, the 7-bit address of the sensor is set to 1001000. When the MCU needs to access the sensor, it first sends an 8-bit register pointer, and then sends the address of the sensor (7-bit address, low bit is the WR signal). There are three registers in the sensor that can be used by the MCU, and the 8-bit register pointer is used to determine which register the MCU is using. In this application, the main program will constantly update the configuration register of the sensor, which will make the sensor work in single-step mode, and each update will measure the temperature once.

[0029] As a preferred embodiment, if the MCU does not find the corresponding value point of the measured temperature value T and resistance value R in the standard database, it finds the two temperature values T L1 , H1 , which are the most adjacent to the measured temperature value T L2 , H2 , and the two resistance values R L1 , H1 , which are the most adjacent to the measured resistance value R L2 , H2 , and obtains 16 value points (T L1 , R L1 ), (T L1 , R H1 ), (T H1 , R L1 ), (T H1 , R H1 ), (T L1 , R L2 ), (T L1 , R H2 ), (T H1 , R L2 ), (T H1 , R H2 ), (T L2 , R L1 ), (T L2 , R H1 ), (T H2 , R L1 ), (T H2 , R H1 ), (T L2 , R L2 ), (T L2 , R H2 ), (T H2 , R L2 ), (T H2 , RH2 ) corresponding humidity values H1, H2, H3, H4, H5, H6, H7, H8, H9, H 10 , H 11 , H 12 , H 13 , H 14 , H 15 , H 16 , a T-R-H three-dimensional coordinate system is established, and a curved surface formed by 16 points (T L1 , R L1 , H1), (T L1 , R H1 , H2), (T H1 , R L1 , H3), (T H1 , R H1 , H4), (T L1 , R L2 , H5), (T L1 , R H2 , H6), (T H1 , R L2 , H7), (T H1 , R H2 , H8), (T L2 , R L1 , H9), (T L2 , R H1 , H 10 ), (T H2 , R L1 , H 11 ), (T H2 , R H1 , H 12 ), (T L2 , R L2 , H 13 ), (T L2 , R H2 , H 14 ), (T H2 , R L2 , H 15 ), (T H2 , R H2 , H 16 ) in the T-R-H three-dimensional coordinate system is obtained, and the measured temperature value T and resistance value R are substituted into the curved surface by interpolation to obtain the corresponding humidity value H and output.

[0030] In the above embodiments, the interpolation method adopts a conventional algorithm in existing numerical calculation theory, such as linear interpolation or two-point interpolation.

[0031] Optionally, the interpolation method adopts a conventional algorithm in existing numerical calculation theory, such as a cubic interpolation method, or a Lagrange interpolation polynomial, or a Newton interpolation polynomial, or an Hermite interpolation formula.

[0032] In the prior invention patent application CN2021115398971, if a more accurate environmental humidity value is to be measured, it is necessary to require the temperature interval and humidity interval in the standard database to be as small as possible. Assuming that the temperature interval is 0.1℃ and the humidity interval is 0.1%RH, in this case, if the humidity sensor is to adapt to an environment of 0~100℃, the data quantity will reach 1000×1000 numerical points, each numerical point including three dimensions of temperature value, humidity value and resistance value, and a total of 3000000 physical quantities need to be recorded, which brings great cost pressure to the storage ROM.

[0033] By using the interpolation method or the curved surface fitting method of the present application, the data quantity can be greatly reduced. For example, the temperature interval can be set to 1℃ and the humidity interval can be set to 1%RH, in this case, if the humidity sensor is to adapt to an environment of 0~100℃, the data quantity will be 100×100 numerical points, each numerical point including three dimensions of temperature value, humidity value and resistance value, and a total of 30000 physical quantities need to be recorded. Compared with the embodiment in the prior invention patent application CN2021115398971, the storage data quantity is only 1% of that, which is reduced by two orders of magnitude.

[0034] In the present application, the temperature interval can also be set to 5℃ and the humidity interval can be set to 5%RH, in this case, if the humidity sensor is to adapt to an environment of 0~100℃, the data quantity will be only 20×20 numerical points, each numerical point including three dimensions of temperature value, humidity value and resistance value, and a total of 1200 physical quantities need to be recorded. Compared with the embodiment in the prior invention patent application CN2021115398971, the storage data quantity is reduced by three orders of magnitude, and the requirement for the storage ROM is greatly reduced.

[0035] As a preferred embodiment, when the humidity-sensitive winding material 3 is respectively led out and connected to the upper electrode and the lower electrode, it includes a plurality of leading-out taps, such as Figure 3 as shown; Figure 4 A physical diagram after winding is shown.

[0036] Preferably, the humidity-sensitive winding material is coated with conductive paste near the upper surface and the lower surface of the adjacent spoke winding skeleton disc 1, and is respectively led out and connected to the upper electrode and the lower electrode through the conductive paste.

[0037] After the conductive paste is coated, a low-temperature drying and curing step should be performed.

[0038] It is worth noting that the spoke winding skeleton disc is a non-humidity-sensitive insulating material.

[0039] In addition to the interpolation method described above, the following specific implementation can also be used:

[0040] If the MCU does not find the corresponding value point in the standard database for the measured temperature value T and resistance value R, the MCU finds three temperature values T1, T2, T3 adjacent to the measured temperature value T and two resistance values R1, R2, R3 adjacent to the measured resistance value R in the standard database, obtains the humidity values H1, H2, H3, H4, H5, H6, H7, H8, H9 corresponding to the nine value points (T1, R1), (T1, R2), (T1, R3), (T2, R1), (T2, R2), (T2, R3), (T3, R1), (T3, R2), (T3, R3), establishes a T-R-H three-dimensional coordinate system, obtains a curved surface formed by the nine points (T1, R1, H1), (T1, R2, H2), (T1, R3, H3), (T2, R1, H4), (T2, R2, H5), (T2, R3, H6), (T3, R1, H7), (T3, R2, H8), (T3, R3, H9) in the T-R-H three-dimensional coordinate system, constructs a parabolic surface with the above nine points, and fits to obtain a curved surface equation. The measured temperature value T and resistance value R are substituted into the curved surface equation to obtain the corresponding humidity value H and output.

[0041] In the above embodiments, the humidity-sensitive winding material is formed by covering a humidity-sensitive material on the outer surface of a non-humidity-sensitive inner core.

[0042] The material of the inner core of the humidity-sensitive winding material is selected from any one of cotton yarn, wool, rabbit hair, silk, glass fiber, nylon fiber, polyester fiber, acrylic fiber, spandex fiber, vinylon fiber, propylene fiber, chlorofiber, asbestos fiber, acetate fiber, and polypropylene fiber.

[0043] The outer surface of the humidity-sensitive winding material is covered with a humidity-sensitive material.

[0044] In a specific implementation, the above various inner cores can be immersed in a suspension configured by the humidity-sensitive material, and then taken out and dried. The humidity-sensitive material is attached to the surface of the inner core to form the humidity-sensitive winding material.

[0045] Preferably, the upper electrode and the lower electrode are two metal discs, and a fixed screw hole 4 is arranged at the center of the disc, which is used to tighten and fix the lead wire.

[0046] As another implementation, in order to simplify the manufacturing process, the winding method can also be abandoned, and the humidity-sensitive material can be directly covered on the spoke skeleton disc, that is:

[0047] The humidity sensor comprises a humidity sensitive material and a spoke skeleton disc; a plurality of "T" shaped skeletons are uniformly distributed in a radial manner on the circumference of the spoke skeleton disc, and the humidity sensitive material completely covers the plurality of "T" shaped skeletons; and a space between every two adjacent "T" shaped skeletons forms an air flow channel, which is used to shorten the hygroscopic response time and the dehumidification response time of the humidity sensitive material.

[0048] The spoke skeleton disc has an upper surface and a lower surface arranged in parallel; the upper surface and the lower surface of the spoke skeleton disc are both made of conductive material and are used as an upper electrode and a lower electrode of the spoke type high sensitive humidity sensor respectively; and the part of the spoke skeleton disc other than the upper surface and the lower surface is made of non-humidity sensitive insulating material; after the humidity sensitive material is completely covered, the upper electrode and the lower electrode are respectively connected; the humidity sensitive material has a resistivity sensitive response to the ambient humidity, and the humidity sensitive material between the upper electrode and the lower electrode forms a humidity sensitive resistor.

[0049] In the implementation, the spoke skeleton disc is completely immersed in a suspension configured by the humidity sensitive material, and then is taken out and dried; the humidity sensitive material is attached to the surface of the spoke skeleton disc to form the humidity sensitive material.

[0050] As a more preferred embodiment, in the above various embodiments, the humidity sensitive material is:

[0051] The humidity sensitive wire winding material or the humidity sensitive material is a core-shell structure composite nanoparticle or a core-shell structure composite nanowire, which is composed of a conductive inner core and a non-conductive humidity sensitive outer shell.

[0052] Preferably, the conductive inner core of the composite nanoparticle or the composite nanowire is any one of poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid), polyaniline, polypyrrole, polythiophene with a diameter of tens of nanometers to hundreds of nanometers, and the non-conductive outer shell of the composite nanoparticle or the composite nanowire is humidity sensitive polystyrene sulfonic acid; when the polystyrene sulfonic acid of the outer shell of the composite nanoparticle or the composite nanowire is exposed to water, it will swell, so that the distance between the composite nanoparticles or the composite nanowires in contact with each other increases, thereby reducing the conductivity of the humidity sensitive material. The use of the composite nanoparticle or the composite nanowire increases its specific surface area, and the outer shell is fully exposed to the atmospheric environment, thereby improving its response speed and sensitivity and increasing the desorption speed of water molecules.

[0053] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present disclosure, and it should be understood that the above description is only a specific embodiment of the present disclosure and is not used to limit the present disclosure, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A temperature-compensated humidity sensor, characterized by: The sensor comprises a resistance type humidity sensitive material, a skeleton disc, a temperature sensor and a ROM type MCU (Micro Controller Unit, MCU) in a strip; a plurality of deep groove air flow channels are uniformly arranged around the skeleton disc, and the air flow channels are used for shortening the hygroscopic response time and the dehumidification response time of the humidity sensitive material; the temperature sensor is electrically connected with the MCU, the temperature sensor is used for measuring the ambient temperature of the temperature and humidity sensor, and the temperature of the humidity measurement value is corrected by the MCU; the opposite parallel upper surface and the lower surface of the skeleton disc are both provided with metal round plates, which are used as the upper electrode and the lower electrode of the temperature and humidity sensor respectively; after the humidity sensitive material is covered, the humidity sensitive material is electrically connected to the upper electrode and the lower electrode respectively; the humidity sensitive material between the upper electrode and the lower electrode forms a humidity sensitive resistance, and the humidity sensitive resistance is electrically connected to the MCU, and the resistance is measured by the MCU; a standard database is stored in the ROM of the MCU, the standard database comprises a plurality of humidity sensitive resistance R-humidity H curves of the fast response type temperature and humidity sensor at different temperatures T, that is, R(H) T , and each R(H) T curve records the humidity sensitive resistance R corresponding to different humidity values H; the MCU outputs the corresponding humidity value H according to the measured temperature value T and the resistance value R, and looks up the standard database; if the MCU does not find the corresponding value point of the measured temperature value T and the resistance value R in the standard database, the MCU finds the two temperature values T L , T H , which are the most adjacent to the measured temperature value T, and the two resistance values R L , R H , which are the most adjacent to the measured resistance value R, to obtain four value points (T L , R L ), (T L , R H ), (T H , R L ) and (T H , R H ) corresponding to the humidity values H1, H2, H3 and H4, establishes a T-R-H three-dimensional coordinate system, obtains a curved quadrilateral formed by four points (T L , R L， H1), (T L , R H， H2), (T H , R L， H3) and (T H , R H， H4) in the T-R-H three-dimensional coordinate system, substitutes the measured temperature value T and the resistance value R into the interpolation method, obtains the corresponding humidity value H and outputs the humidity value H.

2. The temperature-compensated humidity sensor of claim 1, wherein: If the MCU does not find a value point in the standard database corresponding to the measured temperature value T and resistance value R, it will search the standard database for the two nearest temperature values ​​T1 and T2 that are adjacent to the measured temperature value T1. L1 T H1 The two next nearest temperature values ​​T after the measured temperature value T. L2 T H2 And the two resistance values ​​R that are closest to the measured resistance value R above and below. L1 R H1 The two next nearest resistance values ​​R above the measured resistance value R. L2 R H2 16 numerical points (T) were obtained. L1 R L1 ), (T) L1 R H1 ), (T) H1 R L1 ), (T) H1 R H1 ), (T) L1 R L2 ), (T) L1 R H2 ), (T) H1 R L2 ), (T) H1 R H2 ), (T) L2 R L1 ), (T) L2 R H1 ), (T) H2 R L1 ), (T) H2 R H1 ), (T) L2 R L2 ), (T) L2 R H2 ), (T) H2 R L2 ), (T) H2 R H2 The corresponding humidity values ​​H1, H2, H3, H4, H5, H6, H7, H8, H9, H 10 H 11 H 12 H 13 H 14 H 15 H 16 Establish a TRH three-dimensional coordinate system and obtain 16 points (T) in the TRH three-dimensional coordinate system. L1 R L1 H1), (T L1 R H1 , H2), (T H1 , R L1 , H3), (T H1 , R H1 , H4), (T L1 , R L2 , H5), (T L1 , R H2 , H6), (T H1 , R L2 , H7), (T H1 , R H2 , H8), (T L2 , R L1 , H9), (T L2 , R H1 , H 10 ), (T H2 , R L1 , H 11 ), (T H2 , R H1 , H 12 ), (T L2 , R L2 , H 13 ), (T L2 , R H2 , H 14 ), (T H2 , R L2 , H 15 ), (T H2 , R H2 , H 16 ) are formed, the measured temperature value T, resistance value R are substituted into the curved surface by interpolation method, the corresponding humidity value H is obtained and output.

3. The temperature-compensated humidity sensor of claim 1, wherein: The interpolation method adopts linear interpolation method or two-point interpolation method.

4. The temperature-compensated humidity sensor of claim 2, wherein: The interpolation method adopts cubic interpolation method, Lagrange interpolation polynomial, Newton interpolation polynomial or Hermite interpolation formula.

5. The temperature-compensated humidity sensor of claim 1, wherein: If the MCU does not find the value point corresponding to the measured temperature value T and resistance value R in the standard database, three temperature values T1, T2 and T3 adjacent to the measured temperature value T and two resistance values R1, R2 and R3 adjacent to the measured resistance value R are found in the standard database, nine value points (T1, R1), (T1, R2), (T1, R3), (T2, R1), (T2, R2), (T2, R3), (T3, R1), (T3, R2) and (T3, R3) are obtained, humidity values H1, H2, H3, H4, H5, H6, H7, H8 and H9 corresponding to the nine points are obtained, a T-R-H three-dimensional coordinate system is established, a curved surface formed by nine points (T1, R1, H1), (T1, R2, H2), (T1, R3, H3), (T2, R1, H4), (T2, R2, H5), (T2, R3, H6), (T3, R1, H7), (T3, R2, H8) and (T3, R3, H9) in the T-R-H three-dimensional coordinate system is obtained, a parabolic surface is constructed by the nine points, a curved surface equation is fitted, the measured temperature value T and resistance value R are substituted into the curved surface equation, the corresponding humidity value H is obtained and output.

6. The temperature-compensated humidity sensor of claim 1, wherein: The skeleton disc is made of non-humidity-sensitive insulating material.

7. The temperature-compensated humidity sensor of claim 6, wherein: The in-chip ROM MCU is selected from any one of the following: an in-chip one-time programmable ROM MCU, an in-chip EPROM MCU, an in-chip EEPROM MCU, an in-chip mask ROM MCU, an in-chip FLASH MCU and an MCU integrated with both FLASH and EEPROM.

8. The temperature-compensated humidity sensor of claim 1, wherein: The humidity-sensitive winding material includes a plurality of lead-out taps when connected to the upper electrode and the lower electrode.

9. The temperature-compensated humidity sensor of claim 1 or 5, wherein: The humidity-sensitive material is humidity-sensitive winding material, which is wound on a plurality of "T" shaped winding skeletons of the cylindrical skeleton disc, and the space between every two adjacent "T" shaped winding skeletons simultaneously forms a winding limiting groove and an air flow channel of the humidity-sensitive winding material. The humidity-sensitive material is humidity-sensitive winding material, which is wound on a plurality of "T" shaped winding skeletons of the cylindrical skeleton disc, and the space between every two adjacent "T" shaped winding skeletons simultaneously forms a winding limiting groove and an air flow channel of the humidity-sensitive winding material.

10. The temperature-compensated humidity sensor of claim 1, wherein: The humidity-sensitive wire material or humidity-sensitive material is a core-shell composite nanoparticle or composite nanowire, which is composed of a conductive inner core and a humidity-sensitive non-conductive shell; the conductive inner core of the composite nanoparticle or composite nanowire is any one of poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid), polyaniline, polypyrrole, polythiophene with a diameter of tens of nanometers to hundreds of nanometers, and the non-conductive shell of the composite nanoparticle or composite nanowire is humidity-sensitive polystyrene sulfonic acid; when the polystyrene sulfonic acid of the shell of the composite nanoparticle or composite nanowire is exposed to water, it will swell, so that the distance between the composite nanoparticles or composite nanowires in contact with each other increases, thereby reducing the conductivity of the humidity-sensitive material.

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