Loadport operation in electronic device manufacturing apparatus, system and method

Abstract

An electronic device manufacturing system may include a factory interface having a controlled environment. The electronic device manufacturing system may also include a loadport coupled to the factory interface. The loadport may be configured to receive a substrate carrier thereon and may include a purge device and a controller. The controller may be configured to operate the loadport such that any air located around and between a substrate carrier door and the loadport is at least partially or completely purged, thereby reducing or preventing contamination of the controlled environment after the substrate carrier door is opened by the loadport. Methods of operating the factory interface loadport and other aspects are also provided.

Description

[0001] This application is a divisional application of the invention patent application with the application date of January 31, 2018, application number 201880017003.2, and name “Loading port operation in electronic device manufacturing equipment, system and method”. Technical Field

[0002] This application claims priority to U.S. non-provisional patent application No. 15 / 458,908, filed on March 14, 2017, and entitled “LOAD PORT OPERATION INELECTRONIC DEVICE MANUFACTURING APPARATUS, SYSTEMS, AND METHODS” (Attorney Docket No. 24698 / USA), the substantial entirety of which is hereby incorporated by reference herein.

[0003] The present disclosure relates to electronic device manufacturing, and more particularly to factory interface loadport operations. Background Art

[0004] The processing of substrates in the manufacture of semiconductor electronic devices is typically performed in multiple processing tools, where substrates are transported between processing tools in substrate carriers. The substrate carrier can be a sealable container that carries from one to, for example, 25 substrates and can be, for example, a Front Opening Unified Pod (FOUP). The substrate carrier can be docked to a load port that can be mounted to a factory interface (e.g., an Equipment Front End Module (EFEM)). The factory interface can be coupled to the processing tools and can include substrate handling robots that can be used to transfer substrates between the substrate carrier and the processing tools.

[0005] An environmentally controlled atmosphere can be provided within and between the substrate carrier, the factory interface, and the processing tools. That is, because exposure to, for example, air (particularly oxygen (a reactive gas)) and moisture can adversely affect the properties of the substrate and the processing of the substrate due to oxidation, the substrate can be maintained in a non-reactive gas environment. The non-reactive gas can be, for example, nitrogen. Any leakage in this environment, for example, during the transfer of substrates from the substrate carrier to the factory interface via the load port, can contaminate the processed substrates and / or adversely affect the processing performed on the substrates. This can result in defective electronic devices being manufactured on those substrates. Existing electronic device manufacturing systems can therefore benefit from improved load port operations that reduce or eliminate such leakage. Summary of the Invention

[0006] According to a first aspect, a loadport of a factory interface for an electronic device manufacturing system is provided. The loadport includes: a purge apparatus; a docking tray; a backplate positioned adjacent the docking tray; a carrier door opener configured to seal an opening in the backplate when the carrier door opener is closed; and a controller coupled to operate the purge apparatus, the docking tray, and the carrier door opener. The controller is configured to: purge a substrate carrier positioned on the docking tray; dock the substrate carrier to the docking tray; initiate a step of purging an area around and between a substrate carrier door and the carrier door opener for a period of time; deactivate the step of purging the area in response to expiration of the period of time; and clamp the substrate carrier to the backplate in response to deactivating the step of purging the area.

[0007] According to a second aspect, an electronic device manufacturing system is provided. The electronic device manufacturing system includes a substrate processing tool and a factory interface. The factory interface includes a housing having a front side and a rear side, the front side having a front opening, and the rear side coupled to the substrate processing tool. The electronic device manufacturing system also includes a load port configured to interface with a substrate carrier. The load port includes a backplate coupled to the front side at the front opening. The backplate has a backplate opening. The load port also includes a docking tray and a carrier door opener. The carrier door opener seals the backplate opening and opens a substrate carrier door of the substrate carrier when the carrier door opener is closed. The electronic device manufacturing system further includes a controller configured to: purge the substrate carrier positioned on the docking tray; dock the substrate carrier to the docking tray; initiate a step of purging the area around and between the substrate carrier door and the carrier door opener for a period of time; deactivate the step of purging the area in response to expiration of the period of time; and clamp the substrate carrier to the backplate in response to deactivating the step of purging the area.

[0008] According to a third aspect, a method for operating a factory interface loadport in an electronic device manufacturing system is provided. The method includes the steps of: purging a substrate carrier positioned on a loadport docking tray; docking the substrate carrier to the loadport docking tray; activating a step of purging an area around and between a substrate carrier door of the substrate carrier and a carrier door opener of the loadport for a period of time; deactivating the step of purging the area between the substrate carrier door and the carrier door opener in response to expiration of the period of time; and clamping the substrate carrier against a backplate of the loadport in response to the deactivating step.

[0009] Other aspects, features and advantages of these and other embodiments according to the present disclosure will be readily apparent from the following detailed description, the appended claims and the accompanying drawings, which are therefore to be regarded as illustrative in nature and not restrictive. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings described below are for illustration purposes only and are not necessarily drawn to scale. The drawings are not intended to limit the scope of the present disclosure in any way.

[0011] Figure 1 A side schematic diagram illustrates an electronic device manufacturing system according to an embodiment of the present disclosure.

[0012] Figure 1A yes Figure 1 , illustrating a simplified version of a substrate carrier door and a carrier door opener in an open position according to an embodiment of the present disclosure.

[0013] Figure 2 Illustrated is a front perspective view of a loadport according to an embodiment of the present disclosure.

[0014] Figure 3 Illustrated is a simplified rear perspective view of a loadport according to an embodiment of the present disclosure.

[0015] Figure 4A Illustrated is a simplified side schematic diagram of a substrate carrier docked to, but not clamped to, a loadport with a carrier door opener relative to the loadport in accordance with an embodiment of the present disclosure.

[0016] Figure 4B A simplified side schematic diagram illustrates a substrate carrier docked to and clamped to a loadport with a carrier door opener relative to the loadport in accordance with an embodiment of the present disclosure.

[0017] Figure 5 A method for operating a factory interface loadport in an electronic device manufacturing system according to an embodiment of the present disclosure is illustrated. DETAILED DESCRIPTION

[0018] Reference will now be made in detail to example embodiments of the present disclosure, which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.

[0019] Electronic device manufacturing systems can provide a controlled environment between various components (e.g., substrate carriers, load ports, factory interfaces, and processing tools) to reduce or eliminate, for example, undesirable oxygen, moisture, and / or particles that may adversely affect substrate properties and / or substrate processing. The controlled environment can, for example, be a positive pressure non-reactive gas environment, where, for example, nitrogen can be used as the non-reactive gas.

[0020] A loadport operation may be performed to allow one or more substrates to be transferred from a substrate carrier into a factory interface. The loadport operation may include the following steps: receiving a substrate carrier on a loadport docking tray; purging the substrate carrier from air (i.e., oxygen) and moisture by flowing a non-reactive gas (e.g., nitrogen) into the substrate carrier; docking the substrate carrier to the docking tray; clamping the substrate carrier to a backplate of the loadport to press the substrate carrier against the backplate; attaching a loadport carrier door opener positioned at the backplate to the substrate carrier door; purging a space between the carrier door opener and the substrate carrier door by, for example, flowing nitrogen into the space (this purge step may be referred to hereinafter as a "door purge"); and opening the substrate carrier door with the carrier door opener to allow one or more substrates to be transferred from the substrate carrier into the factory interface and subsequently into the processing tool.

[0021] However, in some electronic device manufacturing systems, such load port operations may cause contamination of the controlled factory interface environment. Contamination may be caused by air (i.e., oxygen), moisture, and / or particles contained therein, which may be trapped in the space around the substrate carrier door that is inaccessible during door purge. This trapped air may then be released after the substrate carrier door is opened, thereby contaminating the factory interface environment.

[0022] In certain electronic device manufacturing systems, the aforementioned changes in loadport operation may also contribute to airborne and / or particle contamination of the factory interface environment for the same reasons as described above. For example, performing a door purge prior to docking a substrate carrier may cause an increase in pressure between the substrate carrier door and the carrier door opener, which may push open the carrier door opener and allow air (i.e., oxygen), moisture, and / or particles to contaminate the factory interface environment. Similarly, attaching the loadport carrier door opener to the substrate carrier door after docking and then performing a door purge prior to clamping the substrate carrier to the loadport's backplane may also contribute to airborne and / or particle contamination of the factory interface environment for the same reasons as described above.

[0023] To address these contamination issues, electronic device manufacturing systems according to one or more embodiments of the present disclosure may include an improved factory interface loadport and / or improved loadport operation. The improved loadport may include a controller configured to perform loadport operation such that some or all of any air that may have been trapped in the space surrounding the substrate carrier door (and some or all of any undesirable particles contained therein) may be purged prior to opening the substrate carrier door. This may allow the controlled factory interface environment to be maintained at an acceptable level during loadport operation.

[0024] In the following, Figure 1-5Further details of example embodiments of an improved factory interface loadport in an electronic device manufacturing system and other aspects including methods of operating a factory interface loadport in an electronic device manufacturing system are explained and described in greater detail in conjunction with the present disclosure.

[0025] Figure 1 A side schematic diagram of an electronic device manufacturing system 100 is illustrated according to one or more embodiments. The electronic device manufacturing system 100 may include a substrate carrier 102, a load port 104, a factory interface 106, and a substrate processing tool 108. The load port 104 may be coupled to the factory interface 106, which may be coupled to the substrate processing tool 108. The electronic device manufacturing system 100 may also include other components.

[0026] The substrate carrier 102 can be a sealable container configured to hold one or more substrates. The substrate can be any suitable article used to fabricate electronic devices or circuit components, such as silicon-containing disks or wafers, patterned wafers, glass plates, and the like. In certain embodiments, the substrate carrier 102 can be, for example, a front-opening unmanned unit (FOUP) and can include a substrate carrier door 110. In certain embodiments, the substrate carrier door 110 can be a FOUP door.

[0027] The load port 104 may include a docking tray 111 and a backing plate 112 positioned adjacent the docking tray 111. The docking tray 111 may be configured to receive the substrate carrier 102 thereon, and the backing plate 112 may have a backing plate opening 113 configured to receive the substrate carrier 102 and the substrate carrier door 110 therein.

[0028] The load port 104 may also have a carrier door opener 114 configured to attach to, unlatch, and open the substrate carrier door 110 to allow substrates to be transferred into and out of the substrate carrier 102. More specifically, the carrier door opener 114 may open the substrate carrier door 110 by attaching to and unlatching the substrate carrier door 110, moving the substrate carrier door 110 inward (i.e., to the right as indicated by arrow A1) until the backing plate 112 is clear, and then moving the substrate carrier door 110 downward (as indicated by arrow A2) to an open position via a lift mechanism 115 that may move along a track or similar structure (not shown). Figure 1A An electronic device manufacturing system 100 is illustrated according to one or more embodiments (although not all features are shown and / or labeled herein). Figure 1A ), the electronic device manufacturing system has a substrate carrier door 110 and a carrier door opener 114 in an open position 116. The open position 116 allows one or more substrates to be transferred into and out of the substrate carrier 102, as indicated by double-headed arrow A3.

[0029] The load port 104 may also include a purge apparatus 105, a first inlet gas flow line 107a, a first outlet gas flow line 107b, a second inlet gas flow line 109a, and a second outlet gas flow line 109b. The purge apparatus 105 may be configured to provide an environmentally controlled atmosphere, such as, for example, a positive pressure non-reactive and / or inert gas environment. The purge apparatus 105 may include one or more valves, gas flow lines, pumps, flow controllers, flow meters, connections to external equipment and / or gas supplies / sources, and the like (all not shown). In certain embodiments, the purge apparatus 105 may include additional or alternative equipment. The first inlet gas flow line 107a and the first outlet gas flow line 107b may each be connected to the purge apparatus 105 and may each extend from the purge apparatus 105 through a docking tray 111 for connection to the substrate carrier 102 to allow for purge of the substrate carrier 102 (e.g., to allow non-reactive gas to fill the substrate carrier 102). The second inlet airflow line 109a and the second outlet airflow line 109b can each be connected to the purge apparatus 105 and can each extend from the purge apparatus 105 through the carrier door opener 114 to allow door purges to be performed (e.g., to allow non-reactive gas to fill the space around and between the substrate carrier door 110 and the carrier door opener 114). In certain embodiments, the first inlet airflow line 107a, the first outlet airflow line 107a, the second inlet airflow line 109a, and / or the second outlet airflow line 109b can each be made of a flexible material (e.g., to allow the carrier door opener 114 to be opened while maintaining airflow line connections to the purge apparatus 105 and / or the carrier door opener 114).

[0030] The load port 104 may further include a controller 118 that can be coupled to each of the active components of the load port 104 to control their operation. In certain embodiments, the active components may include the decontamination device 105, the docking tray 111, and the carrier door opener 114 (as well as the lift mechanism 115). The controller 118 may include a programmed processor and a memory storing instructions executable by the processor.

[0031] The factory interface 106 can be any suitable enclosure having a housing 120 with a front side 120F, a rear side 120R, a top 120T, a bottom 120B, and two sidewalls (not separately shown). The front side 120F can have one or more front openings 122 configured to receive and couple to respective load ports 104. The factory interface 106 can include a substrate handling robot (not shown) configured to transfer substrates from the substrate carrier 102 through the factory interface 106 to the substrate processing tool 108. The factory interface 106 can be maintained under a positive pressure, non-reactive gas environment (e.g., using nitrogen as the non-reactive gas) using equipment located within or coupled to the electronic device manufacturing system 100 (e.g., gas supply lines, one or more gas suppliers or sources, vacuum pumps, valves, etc.; not shown). In other embodiments, the factory interface 106 can be maintained under other non-reactive and / or inert gas environments, under vacuum, etc.

[0032] The substrate processing tool 108 can perform one or more processes (for example, physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, pre-cleaning, metal or metal oxide removal, etc.) on one or more substrates. Other processes can be implemented on the substrates therein. The substrate processing tool 108 may include one or more load lock chambers, a transfer chamber, and one or more processing chambers (all not shown). The one or more load lock chambers can be coupled to the factory interface 106, and the transfer chamber can be coupled to the one or more load lock chambers and the one or more processing chambers. The substrate handling robot of the factory interface 106 can transfer substrates into and out of the one or more load lock chambers. The substrate processing tool 108 may include a transfer robot (not shown) at least partially housed in the transfer chamber. The transfer robot can be configured to transfer substrates to and from the one or more load lock chambers and the one or more processing chambers. While in the factory interface 106, the substrate processing tool 108 may be maintained under an environmentally controlled atmosphere (e.g., a positive pressure non-reactive and / or inert gas environment, under vacuum, etc.) using equipment (e.g., gas supply lines, one or more gas suppliers or sources, vacuum pumps, valves, etc.; not shown) positioned within and / or coupled to the electronic device manufacturing system 100.

[0033] Figure 2 A front perspective view of a load port 204 is illustrated according to one or more embodiments. In some embodiments, the load port 204 can be the same or similar to the load port 104. The load port 204 can include a docking tray 211, a back plate 212 having a back plate opening 213, and a carrier door opener 214 that seals the back plate opening 213 when the carrier door opener 214 is closed against the back plate 212, as shown in FIG. Figure 2In some embodiments, the docking tray 211 can be connected to the docking tray 111 ( Figure 1 ) is the same or similar, the back plate 212 can be the same as the back plate 112 ( Figure 1 ) is the same or similar, and the carrier door opener 214 can be the same as the carrier door opener 114 ( Figure 1 ) are the same or similar.

[0034] The docking tray 211 may be configured to receive a substrate carrier thereon, such as, for example, the substrate carrier 102. The docking tray 211 may have one or more locating pins 224 extending upwardly from the docking tray 211, which may be configured to cooperate with holes in the bottom of the substrate carrier to guide the substrate carrier into the correct position on the docking tray 211. Figure 2 Two locating pins 224 are shown in the figure, but other embodiments may have more or fewer locating pins 224. The docking tray 211 may also have a bottom clamp 225, which may be, for example, a hook or claw-like device, which is configured to securely attach the substrate carrier to the docking tray 211 via corresponding features positioned on the bottom of the substrate carrier. The docking tray 211 may further have a first purge inlet 207a and a first purge outlet 207b. In some embodiments, the first purge inlet 207a and the first purge outlet 207b may each include a properly oriented one-way valve. The first purge inlet 207a may be configured to be connected to the purge device 105 ( Figure 1 ), and the first purge outlet 207b can be configured to be connected to the purge device 105 via the first outlet airflow line 107b. Other embodiments can have more than one first purge inlet 207a and / or more than one first purge outlet 207b. In some embodiments, the docking tray 211 can be configured to move from the substrate carrier placement / docking position toward the backing plate 212 to a clamping position, as described below with reference to Figure 4A and 4B In conjunction with the more detailed description.

[0035] The backing plate 212 may include two or more side clamps 226 configured to clamp the substrate carrier to the backing plate 212. Figure 2 In the embodiment shown in FIG, four side clamps 226 may be provided on the backing plate 212, with two side clamps positioned on the left vertical side of the backing plate opening 213 (as shown) and two side clamps 226 positioned on the opposite right vertical side (not shown). After the substrate carrier has been placed on and docked to the docking tray 211 and moved by the docking tray 211 into a clamping position, each side clamp 226 may be configured to engage the substrate carrier and press the substrate carrier against the backing plate 212.

[0036] The carrier door opener 214 may have one or more connectors 227 configured to contact and attach to the substrate carrier door 110 of the substrate carrier 102. The connector 227 may be, for example, a suction pad or cup-type device that is coupled to a vacuum pump of the load port 204 to generate sufficient suction to securely attach the carrier door opener 214 to the substrate carrier door 110. Other suitable types of connection devices capable of attaching to the carrier door 110 may be used.

[0037] The carrier door opener 214 may also have a second purge inlet 209a and a second purge outlet 209b. In certain embodiments, the second purge inlet 209a and the second purge outlet 209b may each include a properly oriented one-way valve. The second purge inlet 209a may be configured to connect to the purge device 105 ( Figure 1 ), and the second purification outlet 209b can be configured to be connected to the purification device 105 via the second outlet airflow line 109b.

[0038] In certain embodiments, the substrate carrier 102 ( Figure 1 ) may have a method of securing the substrate carrier door 110 to the substrate carrier housing 102H ( Figure 1 In one or more embodiments, the carrier door opener 214 may have one or more latch keys or latch mechanisms 228 that are configured to extend from the carrier door opener 214 and connect to corresponding features in the substrate carrier door 110 to unlatch or unlock (e.g., via clockwise or counterclockwise rotation) or otherwise allow opening of the substrate carrier door 110.

[0039] The loadport 204 may further include an enclosure 204H that may enclose a purge apparatus (eg, the purge apparatus 105 ), a controller (eg, the controller 118 ), a substrate carrier door opening / closing mechanism (eg, the elevator mechanism 115 and associated components), and / or other equipment.

[0040] Figure 3 A simplified rear view of a load port 304 is illustrated, according to one or more embodiments. In certain embodiments, the load port 304 may be the same or similar to the load ports 104 and / or 204. The load port 304 may include a back plate 312 and a carrier door opener 314 that seals the back plate opening (not shown) when the carrier door opener 314 is closed as shown. Figure 3 The carrier door opener 314 may be slightly larger than the back panel opening so that the carrier door opener 314 can seal the back panel opening. The load port 304 may further include a lift arm 329 coupled to a lift mechanism (e.g., lift mechanism 115 ( Figure 1 and 1A )). In order to open the substrate carrier door (e.g. Figure 1 The substrate carrier door 110), the carrier door opener 314 can be, for example, as described above with Figure 2 The connector 227 and latch mechanism 228 are combined as described to attach to and unlatch the substrate carrier door and move the substrate carrier door through and out of the backplate opening in the direction of arrow A4 and then move the substrate carrier door down below the backplate opening in the direction of arrow A5.

[0041] Figure 4A and 4B The substrate carrier 402 is shown relative to the load port 404 during load port operation according to one or more embodiments. Figure 1 )) to implement load port operation. The substrate carrier 402 may include a substrate carrier door 410, wherein in some embodiments, the substrate carrier 402 may be connected to the substrate carrier 102 ( Figure 1 and 1A ) is the same or similar, and the substrate carrier door 410 may be the same as the substrate carrier door 110 ( Figure 1 and 1A An annular space 432 may exist around the substrate carrier door 410 and between the substrate carrier door 410 and the housing 402H of the substrate carrier 402 .

[0042] The load port 404 may include a docking tray 411, a back plate 412, and a carrier door opener 414. In certain embodiments, the load port 404 may be the same as or similar to the load ports 104, 204, and / or 304; the docking tray 411 may be the same as or similar to the docking trays 111 and / or 211; the back plate 412 may be the same as or similar to the back plates 112, 212, and / or 312; and the carrier door opener 414 may be the same as or similar to the carrier door openers 114, 214, and / or 314.

[0043] Figure 4A The substrate carrier 402 is shown in a seating / docking position 400A according to one or more embodiments. That is, the substrate carrier 402 can be positioned, for example, on one or more locating pins (e.g., locating pins 224 ( Figure 2 )) is placed on the docking tray 411. In some embodiments, the bottom fixture (not shown) (for example, such as the bottom fixture 225 ( Figure 2The substrate carrier 402 is docked to the docking tray 411 by clamping the bottom of the substrate carrier 402 to corresponding features in or on the bottom of the substrate carrier 402. In this manner, the annular space 432 can be in fluid communication with a gap 434 between the substrate carrier housing 402H and the backplate 412 / carrier door opener 414. The annular space 432 can also be in fluid communication with a space 436 between the substrate carrier door 410 and the carrier door opener 414.

[0044] Figure 4B The substrate carrier 402 is shown in a clamping position 400B according to one or more embodiments. That is, the docking tray 411 can move the docked substrate carrier 402 toward the backing plate 412 (in the direction of arrow A6) to allow two or more side clamps (not shown) (e.g., side clamps 226 ( Figure 2 )) engages the substrate carrier 402 and presses the substrate carrier 402 against the backing plate 412 of the load port 404. As a result, most or all of the gap 434 no longer exists. Although the portion of the gap 434 between the substrate carrier housing 402H and the backing plate 412 may no longer exist after clamping, in some embodiments, a small gap (not shown) may still exist between the substrate carrier door 410 and the carrier door opener 414. This small gap may be closed after attaching the carrier door opener 414 to the substrate carrier door 410, as described below. Figure 5 As described in greater detail in conjunction with the above, as a result of the clamping, annular space 432 may no longer be in fluid communication with gap 434 and space 436, or may be in negligible fluid communication with gap 434 and the remainder of space 436. Accordingly, any air or other gas (and particles contained therein) that may have been present in annular space 432 may now be trapped therein.

[0045] Figure 5 A method 500 of operating a factory interface loadport in an electronic device manufacturing system according to one or more embodiments is illustrated. The method 500 may be executed by a controller (e.g., controller 118) executing programmed instructions. Figure 1 In some embodiments, method 500 may alternatively be performed by a system controller of an electronic device manufacturing system and / or by such a system controller in conjunction with a loadport controller (eg, controller 118).

[0046] At process block 502, the method 500 may include the step of purging a substrate carrier positioned on a load port docking tray. The substrate carrier that has undergone such purging may be positioned under the positioning / docking position 400A, such as Figure 4A More specifically, and for example with reference to Figure 1 and 2The substrate carrier 102 can be positioned and correctly positioned on the docking tray 111 of the load port 104 using positioning pins (e.g., positioning pins 224). Correct positioning of the substrate carrier 102 on the docking tray 111 can align the gas input and output ports located in the bottom of the substrate carrier 102 with the first purge inlet (e.g., Figure 2 The first purification inlet 207a) and the first purification outlet (eg Figure 2 The purge apparatus 105 may then be aligned with the first purge outlet 207b of the purge apparatus 105. The purge apparatus 105 may then purge the substrate carrier, for example, with a non-reactive gas (e.g., nitrogen) via the first inlet gas flow line 107a and the second outlet gas flow line 107b, coupled to the first purge inlet and the first purge outlet, respectively. In some embodiments, a purge flow rate ranging from about 50 lpm (liters per minute) to about 95 lpm may be used.

[0047] At process block 504, method 500 may include the step of docking the substrate carrier to the load port docking plate. For example, while still in the placement / docking position 400A ( Figure 4A ) while the bottom fixture (for example, the bottom fixture 225 ( Figure 2 )) can be actuated to securely attach the substrate carrier to the docking tray via corresponding features located on the bottom of the substrate carrier.

[0048] At process block 506, the method 500 may include the step of initiating a step of purging the area around and between the substrate carrier door of the substrate carrier and the carrier door opener of the load port for a period of time. The substrate carrier undergoing this purge advantageously remains in the docking / docking position 400A ( Figure 4A ) as described in more detail below. For example, refer to Figure 1 、 2 4A, the purge apparatus 105 can purge the area around and between the substrate carrier door 410 and the carrier door opener 414, which can include an annular space 432, a gap 434, and a space 436, all of which are in fluid communication with each other. Figure 2 ) and a second inlet gas line 109a and a second outlet gas line 109b, for example, using a non-reactive gas (e.g., nitrogen) to purge the area. In certain embodiments, a purge flow rate ranging from about 20 lpm (liters per minute) to about 65 lpm may be used.

[0049] At process block 508, method 500 may include disabling the step of purging the area between the substrate carrier door and the carrier door opener in response to expiration of the period of time. In some embodiments, the period of time may range from about 20 seconds to about 120 seconds.

[0050] At process block 510, the method 500 may include the step of clamping the substrate carrier against the backplate of the load port after deactivating the step of purging the area between the substrate carrier door and the carrier door opener. Figure 2 and 4B , can be directed toward the back plate 412 ( Figure 4B ) moves the substrate carrier to allow the side clamps (eg, side clamps 226 ( Figure 2 )) engages the substrate carrier 402 and presses the substrate carrier 402 against the backing plate 412 of the load port 404 .

[0051] After clamping the substrate carrier at process block 510, the method 500 may further include the steps of attaching a carrier door opener to the substrate carrier door (e.g., by activating a door opener coupled to connector 227 ( Figure 2 ) of a vacuum pump, the connector may be a suction pad type device); for example by using a latch mechanism 228 ( Figure 2 ) to unlatch the substrate carrier door; and to open the substrate carrier door with a carrier door opener, such as Figure 1A As shown in .

[0052] Referring back to process block 506, after the substrate carrier is positioned at the placement / docking position 400A ( Figure 4A ) can significantly improve the effectiveness of the purge (i.e., the effectiveness of the purge in removing any oxygen, moisture, and / or particles that may be in the annular space 432, the gap 434, and the space 436). Because the second purge outlet and the second outlet airflow line (e.g., the second purge outlet 209b and the second outlet airflow line 109b) may in some embodiments not be able to fully handle the resulting outflow during this purge, the fluid communication with the gap 434 allows at least some portion of the air (oxygen), moisture, and / or particles occupying the annular space 432 to be purged therefrom by exhausting air through the gap 434. The purge at processing block 506 may be even less effective if performed after processing block 510 (i.e., clamping the substrate carrier against the backplate of the load port), where most, if not all, of the gap 434 no longer exists (e.g., see FIG. 2 ). Figure 4B The purge at process block 506 may also be less effective if performed after the carrier door opener is attached to the substrate carrier door. Any air (oxygen), moisture, and / or particles trapped in the annular space 432 may then contaminate the factory interface after the substrate carrier door is opened with the carrier door opener.

[0053] The above description discloses only example embodiments of the present disclosure. Modifications of the devices, systems, and methods disclosed above may fall within the scope of the present disclosure. Accordingly, although example embodiments of the present disclosure have been disclosed, it should be understood that other embodiments may fall within the scope of the present disclosure as defined by the following claims.

Claims

1. A load port of a factory interface of an electronic device manufacturing system, the load port comprising: purification equipment; a docking tray configured to receive a substrate carrier, the substrate carrier comprising a substrate carrier door and a substrate carrier housing; a back panel positioned adjacent to the docking tray; a carrier door opener configured to seal the opening in the backing plate when the carrier door opener is closed, the carrier door opener including an inlet airflow line passing therethrough, the inlet airflow line coupled to the purge device; and A controller configured to: docking the substrate carrier to the docking pan such that the annular space is in fluid communication with a gap between the substrate carrier housing and the backplate / carrier door opener; initiating a purge of an area around and between the substrate carrier door of the substrate carrier and the carrier door opener of the loadport via the inlet airflow line for a period of time, wherein the area includes the annular space, the gap, and a space between the substrate carrier door and the carrier door opener; responsive to expiration of the period of time, disabling purging of the area between the substrate carrier door and the carrier door opener; and The substrate carrier is moved toward the backplate via the docking tray to allow side clamps to engage the substrate carrier and press the substrate carrier against the backplate of the loadport.

2. The loadport of claim 1, wherein the backplate comprises two or more side clamps configured to clamp the substrate carrier to the backplate. 3 . The loadport of claim 1 , wherein the space between the substrate carrier door and the substrate carrier housing is an annular space.

4. The loadport of claim 1 , wherein the controller is further configured to attach the carrier door opener to the substrate carrier door by activating a vacuum to one or more suction pad devices positioned on the carrier door opener.

5. The load port of claim 1 , wherein the purge equipment is enclosed in a load port housing supporting the docking tray, the purge equipment comprising at least one of a valve, a pump, an air flow line, a flow controller, or a flow meter.

6. The loadport of claim 1 , wherein the docking tray has a first purge inlet and a first purge outlet coupled to the purge apparatus, wherein the first purge inlet is aligned with a gas input port in a bottom portion of the substrate carrier, and the first purge outlet is aligned with a gas output port in the bottom portion of the substrate carrier, and wherein the controller is further configured to: The purge apparatus is caused to purge the substrate carrier positioned on the docking tray aligned with one or more locating pins of the docking tray.

7. The loadport of claim 1 , wherein the inlet airflow line comprises a one-way valve.

8. The loadport of claim 1 wherein the carrier door opener further comprises an outlet airflow line passing therethrough.

9. An electronic device manufacturing system comprising: Factory interface, including: a housing having a front side and a rear side, the front side having a front opening; A load port configured to interface with a substrate carrier, the load port comprising: purification equipment; a docking tray configured to receive a substrate carrier, the substrate carrier comprising a substrate carrier door and a substrate carrier housing; a back panel coupled to the front side at the front side opening and including a back panel opening; and a carrier door opener configured to seal the backplane opening and open a substrate carrier door of a substrate carrier when the carrier door opener is closed, wherein the carrier door opener includes an inlet airflow line passing therethrough, the inlet airflow line coupled to the purge apparatus; and The controller is configured as: docking the substrate carrier to the docking pan such that the annular space is in fluid communication with a gap between the substrate carrier housing and the backplate / carrier door opener; initiating a purge of an area around and between the substrate carrier door of the substrate carrier and the carrier door opener of the loadport via the inlet airflow line for a period of time, wherein the area includes the annular space, the gap, and a space between the substrate carrier door and the carrier door opener; responsive to expiration of the period of time, disabling purging of the area between the substrate carrier door and the carrier door opener; and The substrate carrier is moved toward the backplate via the docking tray to allow side clamps to engage the substrate carrier and press the substrate carrier against the backplate of the loadport. 10 . The electronic device manufacturing system of claim 9 , wherein the controller is further configured to activate the purge apparatus to purge the substrate carrier positioned on the docking tray aligned with one or more locating pins of the docking tray.

11. A method of operating a factory interface loadport in an electronic device manufacturing system, the method comprising the steps of: positioning a substrate carrier on a load port docking tray aligned with locating pins of the load port docking tray, the substrate carrier comprising a substrate carrier housing and a substrate carrier door, wherein the substrate carrier positioned on the load port docking tray forms a gap between the substrate carrier housing and a backplate of the load port; securely attaching the substrate carrier to the loadport docking tray; docking the substrate carrier to the docking pan such that the annular space is in fluid communication with a gap between the substrate carrier housing and the backplate / carrier door opener; initiating a purge of an area around and between the substrate carrier door of the substrate carrier and the carrier door opener of the loadport via an inlet airflow line for a period of time, wherein the area includes the annular space, the gap, and a space between the substrate carrier door and the carrier door opener; responsive to expiration of the period of time, disabling purging of the area between the substrate carrier door and the carrier door opener; and The substrate carrier is moved toward the backplate via the docking tray to allow side clamps to engage the substrate carrier and press the substrate carrier against the backplate of the loadport.

12. The method of claim 11, further comprising the steps of: attaching the carrier door opener to the substrate carrier door; unlatching the substrate carrier door using a latch mechanism extending from the carrier door opener; and The substrate carrier door is opened using the carrier door opener.

13. The method of claim 12, wherein the step of attaching the carrier door opener to the substrate carrier door comprises activating a vacuum to one or more suction pad arrangements to attach the carrier door opener to the substrate carrier door.

14. The method of claim 11, further comprising the steps of: After positioning the substrate carrier on the loadport, purging the substrate carrier positioned on the loadport docking tray comprises flowing an inert gas into the substrate carrier.

15. The method of claim 11, wherein securely attaching the substrate carrier to the loadport docking pan comprises clamping the substrate carrier bottom to the loadport docking pan.

16. The method of claim 11, wherein initiating a purge of an area between the substrate carrier door and the carrier door opener comprises flowing an inert gas into the area.

17. The method of claim 16, wherein the step of flowing comprises flowing the inert gas into the zone via an inlet in the carrier door opener.

18. The method of claim 11 , wherein closing the gap between the substrate carrier housing and the backing plate comprises: Two or more side grippers of the loadport are engaged with the substrate carrier to press the substrate carrier against the backplate of the loadport.

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