A multi-channel millimeter wave isolation device and a manufacturing method thereof

Abstract

The application provides a multi-channel millimeter wave isolation device, which comprises a shell and a plurality of groups of antenna assemblies; further comprises a shielding baffle, the shielding baffle comprises an isolation layer and an insulating layer, and the opposite sides of the isolation layer are provided with the insulating layer; the plurality of groups of antenna assemblies are distributed at intervals, the shielding baffle is arranged between the adjacent two groups of antenna assemblies, the insulating layer is arranged close to the antenna assembly, and the plurality of groups of antenna assemblies and the shielding baffle are packaged in the shell. The application further provides a manufacturing method of the multi-channel millimeter wave isolation device. The interference problem encountered in the integrated packaging of multi-channel millimeter wave communication can be effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to signal isolation device, especially to a kind of multi-channel millimeter wave isolation device and its manufacturing method. BACKGROUND

[0002] The existing signal isolation mode includes capacitive coupling, magnetic coupling, millimeter wave isolation etc.Capacitive coupling and magnetic coupling isolator due to the interference between adjacent channels is very small, so multiple channel signals can be integrated in a single package device.And for millimeter wave isolator, when multiple groups of antennas meet the distance within the effective communication range, there will be serious mutual interference, so it is difficult to realize the integration package of multi-channel millimeter wave isolation. SUMMARY

[0003] In view of the above deficiencies of the prior art, the technical problems to be solved by the present application are to provide a kind of multi-channel millimeter wave isolation device and its manufacturing method, which can meet the anti-interference requirements of multi-channel millimeter wave communication.

[0004] In order to solve the above technical problems, the technical scheme adopted by the present application is:

[0005] A kind of multi-channel millimeter wave isolation device, including shell and multiple groups of antenna components;It also includes shielding baffle, the shielding baffle includes isolation layer and insulating layer, the opposite sides of the isolation layer are provided with the insulating layer;The multiple groups of antenna components are distributed with interval, the shielding baffle is arranged between adjacent two groups of antenna components, the insulating layer is close to antenna component and is arranged, and the multiple groups of antenna components and shielding baffle are packaged in the shell.

[0006] Another technical scheme adopted by the present application is:

[0007] A kind of manufacturing method of multi-channel millimeter wave isolation device, comprising:

[0008] Manufacturing shielding baffle, specifically including: manufacturing isolation layer, and injection molding insulating layer on the opposite sides of the isolation layer;

[0009] The multiple groups of antenna components are distributed with interval, and the shielding baffle is placed between adjacent two groups of antenna components;

[0010] The multiple groups of antenna components and shielding baffle are packaged in the shell.

[0011] The beneficial effects of the multi-channel millimeter wave isolation device of the present application are that: by setting shielding baffle, mutual interference between channels is eliminated, so as to meet the anti-interference requirements of multi-channel millimeter wave communication, and realize the integration of multiple channels of millimeter wave isolation in a single package.The shielding baffle is a multi-layer structure, the inner layer is an isolation layer, and the outer layer is an insulating layer, so even if the shielding baffle is pasted and the isolation sides are connected, the isolation performance and voltage resistance of the device will not be affected.

[0012] The method for manufacturing the multi-channel millimeter wave isolation device has the advantages that the steps of manufacturing the shielding barrier and setting the shielding barrier are added on the basis of the traditional packaging process, the process is simple, and the isolation device meeting the anti-interference requirements of multi-channel millimeter wave communication can be manufactured. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 Fig. 1 is an exploded view of a multi-channel millimeter wave isolation device according to an embodiment of the present application;

[0014] Figure 2 Fig. 2 is a front view of the multi-channel millimeter wave isolation device according to the embodiment of the present application;

[0015] Figure 3 Fig. 3 is a perspective view of the multi-channel millimeter wave isolation device according to the embodiment of the present application;

[0016] Figure 4 Fig. 4 is a partial schematic view of the multi-channel millimeter wave isolation device according to the embodiment of the present application;

[0017] Figures 5-7 Fig. 5 is a structure schematic view corresponding to the manufacturing method of the shielding barrier of the multi-channel millimeter wave isolation device according to the embodiment of the present application.

[0018] KEY

[0019] 1, housing; 2, antenna assembly; 3, shielding barrier; 31, isolation layer; 32, insulation layer; 4, frame. DETAILED DESCRIPTION

[0020] In order to more clearly understand the technical content, the purposes and effects of the present application, the present application is described in detail below in combination with specific embodiments and the accompanying drawings. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict. In the following description, a large number of specific details are described in order to fully understand the present application, and the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0021] Please refer to Figures 1-4As shown, the application provides a multi-channel millimeter wave isolation device, which comprises a shell 1 and a plurality of antenna assemblies 2; further comprising a shielding barrier 3, the shielding barrier 3 comprises an isolation layer 31 and an insulating layer 32, the opposite sides of the isolation layer 31 are provided with the insulating layer 32; the plurality of antenna assemblies 2 are distributed at intervals, the shielding barrier 3 is arranged between the adjacent two groups of antenna assemblies 2, the insulating layer 32 is arranged close to the antenna assembly 2, and the plurality of antenna assemblies 2 and the shielding barrier 3 are packaged in the shell 1.

[0022] As can be known from the above description, the multi-channel millimeter wave isolation device has the beneficial effects that: by arranging the shielding barrier, the mutual interference between channels is eliminated, so that the anti-interference requirement of multi-channel millimeter wave communication can be met, and the isolation of multi-channel millimeter wave in a single package is realized. The shielding barrier is a multi-layer structure, the inner layer is an isolation layer, and the outer layer is an insulating layer, so even if the shielding barrier is pasted and the two isolation sides are connected, the isolation performance and voltage resistance of the chip will not be affected.

[0023] Further, the isolation layer 31 is wrapped by the insulating layer 32.

[0024] As can be known from the above description, the isolation layer can be sandwiched in the middle by the insulating layer, or wrapped by the insulating layer, and the application is preferably wrapped, so that the influence of the shielding barrier connecting the two isolation sides on the isolation performance and voltage resistance of the device can be more effectively avoided.

[0025] Further, the isolation layer 31 is a metal layer.

[0026] Further, the isolation layer 31 is an absorbing layer.

[0027] As can be known from the above description, the isolation layer can be made of metal, absorbing material or other mixed materials with isolation effect.

[0028] Further, a plurality of frames 4 are further included, the plurality of frames 4 are arranged at intervals, each group of antenna assemblies 2 comprises two millimeter wave antenna assemblies, and each millimeter wave antenna assembly is arranged on a different frame 4.

[0029] As can be known from the above description, the antenna assemblies of each channel are designed on independent frame islands, and the millimeter wave transceiver antenna assemblies of the same channel are also designed on independent frame islands, so that the isolation performance of the package itself will not be damaged due to the increase of the shielding layer.

[0030] Further, a plurality of frames 4 are further included, the plurality of frames 4 are arranged at intervals, each group of antenna assemblies 2 comprises two millimeter wave antenna assemblies, and each millimeter wave antenna assembly is arranged on a different frame 4.

[0031] From the above description, by setting the independent soldering pad to connect the shielding baffle, on the one hand, the shielding baffle can be supported, and on the other hand, the independent soldering pad can be suspended during PCB wiring to further improve the voltage resistance of the two sides of the chip.

[0032] Please refer to Figures 5-7 The application further provides a manufacturing method of the multi-channel millimeter wave isolation device, comprising:

[0033] The shielding baffle is manufactured, specifically comprising: manufacturing an isolation layer, and injecting an insulating layer on the opposite sides of the isolation layer;

[0034] The multiple groups of antenna assemblies are spaced apart, and the shielding baffle is arranged between the adjacent two groups of antenna assemblies;

[0035] The multiple groups of antenna assemblies and the shielding baffle are packaged in the shell.

[0036] From the above description, the manufacturing method of the multi-channel millimeter wave isolation device has the beneficial effects that: on the basis of the traditional packaging process, the steps of manufacturing the shielding baffle and setting the shielding baffle are added, the process is simple, and the isolation device meeting the anti-interference requirements of multi-channel millimeter wave communication can be manufactured.

[0037] Further, the shielding baffle is manufactured, and the insulating layer is injected around the isolation layer.

[0038] From the above description, the application sets the insulating layer around the isolation layer by using the injection molding process, and the insulating layer is uniformly wrapped.

[0039] Further, each group of antenna assemblies comprises two millimeter wave antenna assemblies, and the spaced distribution of the multiple groups of antenna assemblies specifically comprises: multiple frames are first manufactured and spaced apart, and then the millimeter wave antenna assemblies are arranged on the different frames.

[0040] From the above description, the antenna assemblies of each channel are designed on the independent frame islands, and the millimeter wave transceiving antenna assemblies of the same channel are also designed on the independent frame islands, so that the isolation performance of the packaging itself is not damaged due to the increase of the shielding layer.

[0041] Please refer to Figures 1-4 The embodiment one of the application is:

[0042] A multi-channel millimeter wave isolation device comprises a shell 1, an antenna assembly 2, a shielding baffle 3 and a frame 4.

[0043] The number of the antenna assemblies 2 is multiple, and each of the antenna assemblies 2 specifically includes two millimeter wave antenna assemblies, and specifically, the millimeter wave antenna assembly includes an antenna and a signal transmitting circuit / signal receiving circuit. The number of the frames 4 is multiple, and each of the frames 4 is arranged at intervals. Specifically, the frames 4 are arranged in two rows and at intervals and in parallel. Each of the millimeter wave antenna assemblies is arranged on a different frame 4, and the millimeter wave antenna assemblies in the same group of the antenna assemblies 2 are arranged in the same row. Thus, the millimeter wave antenna assemblies in each of the groups of the antenna assemblies 2 are independent of each other, and the adjacent groups of the antenna assemblies 2 are arranged at intervals.

[0044] The shielding barrier 3 includes an isolation layer 31 and an insulation layer 32, and the isolation layer 31 is wrapped in the insulation layer 32. The material of the isolation layer 31 can be metal, wave-absorbing material, or other mixed materials. The shielding barrier 3 is arranged between the adjacent groups of the antenna assemblies 2, and the insulation layer 32 is arranged close to the antenna assemblies. The pad is arranged at a distance from the frame 4 between the adjacent groups of the antenna assemblies 2, and the pad is connected with the shielding barrier 3.

[0045] The antenna assembly 2, the shielding barrier 3, the frame 4, and the pad are packaged in the shell 1, as shown in Figure 2 and 3 . Figure 4 The structure diagram for removing part of the shell. The frame 4 and the pad are further connected with the pin, and the pin extends out of the shell 1.

[0046] The embodiment can effectively solve the interference problem encountered in the multi-channel millimeter wave communication integrated package, and can achieve a maximum attenuation effect of 40 dB for the millimeter wave signals of other channels.

[0047] Please refer to Figures 5-7 , and the second embodiment of the present application is:

[0048] A manufacturing method of the multi-channel millimeter wave isolation device of the above-mentioned first embodiment, comprising:

[0049] S1, manufacturing a shielding barrier, and the embodiment takes manufacturing multiple shielding barriers as an example, specifically including: S11, manufacturing an isolation layer frame structure by stamping forming, as shown in Figure 5 ; S12, injecting an insulation layer into the isolation layer frame structure by an injection molding process to wrap the isolation layer, as shown in Figure 6 ; wherein Figure 6 The upper diagram is a top view after injection molding, and the lower diagram is a side view after injection molding; S13, cutting the structure in the foregoing steps into a single shielding barrier by a cutting rib process.

[0050] S2. Fabricate multiple frames and place them separately. Specifically, the frames are arranged in two rows, spaced apart and side-by-side. Multiple sets of antenna assemblies are placed on different frames. Specifically, each set of antenna assemblies includes two millimeter-wave antenna assemblies, each millimeter-wave antenna assembly is placed on a different frame, and the millimeter-wave antenna assemblies in the same set are located in the same row. Pads are also provided between adjacent sets of antenna assemblies at a distance from the frames, and pins are connected between the frames and the pads.

[0051] S3. Place the shielding barrier between two adjacent sets of antenna components; and connect the shielding barrier to the pins between the two adjacent sets of antenna components.

[0052] S4. The frame, pads, antenna assembly and shielding barrier are encapsulated in the housing using injection molding process, with the pins extending out of the housing.

[0053] S5. The pins are cut and shaped.

[0054] In summary, the multi-channel millimeter-wave isolation device provided by this invention can effectively solve the interference problem encountered in the integrated packaging of multi-channel millimeter-wave communication, and realize the isolation of multi-channel millimeter waves in a single package.

[0055] The method for manufacturing a multi-channel millimeter-wave isolation device provided by this invention adds the steps of manufacturing and setting up a shielding barrier compared to the traditional packaging process. The process is simple and can produce an isolation device that meets the anti-interference requirements of multi-channel millimeter-wave communication.

[0056] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, any modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A multi-channel millimeter-wave isolation device, comprising a housing and multiple antenna assemblies; characterized in that, It also includes a shielding wall and multiple frames, which are arranged separately. Each group of antenna components includes two millimeter-wave antenna components, and each millimeter-wave antenna component is set on a different frame. The shielding wall includes an isolation layer and an insulating layer, and the insulating layer is provided on opposite sides of the isolation layer. The multiple groups of antenna components are distributed at intervals, and the shielding wall is set between two adjacent groups of antenna components. The insulating layer is set close to the antenna components. The multiple groups of antenna components and the shielding wall are encapsulated in the housing, and the isolation layer is wrapped by the insulating layer.

2. The multi-channel millimeter-wave isolation device according to claim 1, characterized in that, The isolation layer is a metal layer.

3. The multi-channel millimeter-wave isolation device according to claim 1, characterized in that, The isolation layer is a wave-absorbing layer.

4. The multi-channel millimeter-wave isolation device according to claim 1, characterized in that, A solder pad is provided between two adjacent antenna assemblies at a distance from the frame, and the solder pad is connected to the shielding barrier.

5. A method for manufacturing a multi-channel millimeter-wave isolation device, characterized in that, include: The construction of a shielding barrier specifically includes: constructing an isolation layer and injection molding an insulating layer around the isolation layer to wrap the isolation layer; Multiple sets of antenna components are distributed at intervals. Each set of antenna components includes two millimeter-wave antenna components. Specifically, multiple frames are first made and placed separately, and then each millimeter-wave antenna component is set on a different frame. The shielding barrier is placed between two adjacent sets of antenna assemblies; The multiple antenna assemblies and shielding walls are encapsulated within a housing.

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