A dual-channel spray device and thin film deposition equipment

Abstract

The present application relates to the field of thin film deposition, and in particular to a dual-channel spray device and thin film deposition equipment. The dual-channel spray device includes a spray plate, which is provided with a plurality of spray holes; a cover plate, which covers the spray plate and forms a spray chamber between the cover plate and the spray plate; a heating element and a uniform air chamber are also provided in the cover plate, and the uniform air chamber is connected to the spray chamber; a first air inlet pipe is connected to the uniform air chamber; and a second air inlet pipe is connected to the spray chamber. The reaction gas entering from the first air inlet pipe flows to the edge of the spray chamber, and the reaction gas entering from the second air inlet pipe flows to the middle of the spray chamber, so that the gas sprayed from the spray chamber is evenly dispersed on the wafer.

Description

Technical Field

[0001] The present application relates to the field of thin film deposition, and in particular to a dual-channel spray device and thin film deposition equipment. Background Art

[0002] Thin film deposition is an essential step in the integrated circuit manufacturing process. Chemical vapor deposition equipment is used to perform thin film deposition on wafers. The spray device is a component in chemical vapor deposition equipment. Its main function is to spray external reaction gases onto the wafer to deposit thin films on the wafer surface.

[0003] Current spray devices are roughly disc-shaped, with a flat, cylindrical spray chamber inside. Reactive gases enter the chamber along the device's axis and are then ejected. Heating elements within the spray device heat the gases to the desired temperature. However, after entering the chamber, the reactive gases must diffuse outward before being ejected. This results in shorter heating times for the central portion of the chamber and longer heating times for the edges, leading to uneven temperatures in the ejected reactive gases. When these temperatures are applied to the wafer, they affect the deposition thickness, potentially leading to uneven thickness and other defects. Summary of the Invention

[0004] Therefore, in order to solve the problem of uneven temperature of the reaction gas sprayed from the shower plate in the prior art, a dual-channel shower device and a thin film deposition equipment are provided.

[0005] A dual-channel spray device includes a spray plate, which is provided with a plurality of spray holes; a cover plate, which covers the spray plate and forms a spray chamber between the cover plate and the spray plate; a heating element and an air uniforming chamber are also provided in the cover plate, and the air uniforming chamber is communicated with the spray chamber; a first air inlet pipe is communicated with the air uniforming chamber; and a second air inlet pipe is communicated with the spray chamber.

[0006] Furthermore, the cover plate includes a heating plate and an air-distributing plate that are overlapped with each other, the heating element is installed in the heating plate, and the air-distributing chamber is formed between the heating plate and the air-distributing plate.

[0007] Furthermore, the spray chamber is formed between the air-distributing plate and the spray plate, and the heating plate is located on a side of the air-distributing plate facing away from the spray chamber.

[0008] Furthermore, a heating groove is provided on the heating plate, the heating element is installed in the heating groove, and the heating plate is also provided with a sealing strip suitable for sealing the heating groove.

[0009] Furthermore, the air uniformity chamber includes an annular groove and several diversion grooves, one end of several of the diversion grooves is connected to the first air inlet pipe, and the other ends of several of the diversion grooves are radially distributed toward the annular groove; several air uniformity holes are arranged on the outside of the annular groove, and an air uniformity groove is arranged between each of the air uniformity holes and the annular groove.

[0010] Furthermore, the depth of the gas uniforming groove is lower than the depth of the annular groove.

[0011] Furthermore, a first through hole and a second through hole are provided on the heating plate, and the end of the first air inlet pipe passes through the first through hole and is connected to the air uniforming chamber; a third through hole begins to be provided on the air uniforming plate, and the end of the second air inlet pipe passes through the second through hole and the third through hole and is connected to the spray chamber.

[0012] Furthermore, the spray plate includes a spray panel and an annular wall, and the heating plate and the air uniforming plate are welded to the annular wall.

[0013] Furthermore, it also includes a lifting pipe, which passes through the spray plate and the cover plate. The number of the lifting pipes is 3 and they are distributed in a triangular shape.

[0014] The present application also provides a thin film deposition device, including the above-mentioned dual-channel spray device.

[0015] This application has the following beneficial effects:

[0016] 1. Compared with the previous single-channel spray device, the dual-channel air inlet device of the present application allows the reaction gas entering from the first air inlet pipe to flow to the edge of the spray chamber, and the reaction gas entering from the second air inlet pipe to flow to the middle of the spray chamber, so that the gas sprayed from the spray chamber is evenly dispersed on the wafer.

[0017] 2. The dual-channel spray device of this solution can also be fed with two different gases. The two different reaction gases enter the spray chamber and are mixed before being sprayed out. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 A cross-sectional view of a spray device in the prior art;

[0020] Figure 2This is an overall schematic diagram of a dual-channel spray device according to an embodiment of the present application;

[0021] Figure 3 This is a cross-sectional view of a dual-channel spray device according to an embodiment of the present application;

[0022] Figure 4 This is an exploded view of a dual-channel spray device according to an embodiment of the present application;

[0023] Figure 5 A schematic diagram of a heating plate according to an embodiment of the present application;

[0024] Figure 6 A schematic diagram of an air distribution plate according to an embodiment of the present application;

[0025] Figure 7 Schematic diagram of a shower plate according to an embodiment of the present application.

[0026] Explanation of the accompanying drawings: 1. Spray plate; 2. Cover plate; 3. Heating plate; 4. Air uniforming plate; 5. Lifting pipe; 11. Spray chamber; 12. Spray hole; 13. Spray panel; 14. Annular wall; 15. Step surface; 21. First air inlet pipe; 22. Second air inlet pipe; 23. Air inlet hole; 31. Heating element; 32. Heating tank; 33. Sealing strip; 34. First through hole; 35. Second through hole; 36. Connecting shaft; 41. Air uniforming chamber; 411. Annular groove; 412. Diverter groove; 413. Air uniforming hole; 414. Air uniforming tank; 42. Third through hole. Implementation Method

[0027] The following describes embodiments of the present disclosure in more detail with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the scope of protection of the present disclosure.

[0028] It should be understood that the various steps described in the method embodiments of the present disclosure may be performed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present disclosure is not limited in this respect.

[0029] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the description below. It should be noted that the concepts of "first", "second", etc. mentioned in this disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0030] It should be noted that the modifications of "one" and "multiple" mentioned in the present disclosure are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, they should be understood as "one or more".

[0031] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0032] Figure 1 It is a cross-sectional view of an existing spray device, which includes a spray plate 1, a spray hole 12 arranged in the spray plate 1, a heating element 31, a spray chamber 11 and an air inlet 23. The air inlet 23 is located in the middle of the spray device. It can be seen that most of the gas entering the spray chamber 11 from the air inlet 23 is concentrated in the middle of the spray chamber 11, resulting in more reaction gas being ejected from the middle of the spray plate 1 and less reaction gas being ejected from the edge of the spray plate 1, and the reaction gas is ejected unevenly.

[0033] This application provides a dual-channel spray device, referring to Figures 2 to 7, comprising a spray plate 1 and a cover plate 2. The cover plate 2 is covered on the spray plate 1, and a spray chamber 11 is formed between the cover plate 2 and the spray plate 1. The spray plate 1 also has a plurality of spray holes 12, and the gas in the spray chamber 11 can be sprayed outward from the spray holes 12. The cover plate 2 has a heating element 31 and an air-uniform chamber 41 inside. The air-uniform chamber 41 is in communication with the spray chamber 11. The cover plate 2 also has a first air inlet pipe 21 in communication with the air-uniform chamber 41, and a second air inlet pipe 22 in communication with the spray chamber 11. The first air inlet pipe 21 and the second air inlet pipe 22 can be fed with different gases or the same gas. The gas entering the air-uniform chamber 41 from the first air inlet pipe 21 is evenly dispersed to the surroundings, then flows into the spray chamber 11, mixes with the gas entering the spray chamber 11 from the second air inlet pipe 22, and is finally sprayed out from the plurality of spray holes 12. That is, the gas from the first air inlet pipe 21 is ejected from the four sides of the spray plate 1, and the gas from the second air inlet pipe 22 is ejected from the middle, so that the gas distribution in the spray chamber 11 tends to be uniform, and the temperature of the gas also tends to be uniform, thereby improving the distribution and temperature uniformity of the ejected reaction gas and making the wafer deposition uniform.

[0034] During use, the dual-channel spray device is used to carry wafers. The spray plate 1 containing the spray holes 12 is located above the cover plate 2, and the heating element 31 is arranged below the spray chamber 11. The reaction gas is sprayed from bottom to top on the back of the wafer.

[0035] The spray plate 1 includes a spray panel 13 and an annular wall 14 . The annular wall 14 and the spray panel 13 are integrally formed. The spray panel 13 is disc-shaped, and a plurality of spray holes 12 are distributed on the spray panel 13 .

[0036] The cover plate 2 includes a heater plate 3 and a gas distribution plate 4. Both plates are disc-shaped and overlap each other, mounted within the shower plate 1. Both plates are connected to the shower plate 1 via welding. Specifically, the periphery of the heater plate 3 and gas distribution plate 4 are electron beam welded to the inner wall of the annular wall 14. The gas distribution plate 4 is positioned near the shower panel 13, with the shower panel 13, gas distribution plate 4, and heater plate 3 positioned in descending order.

[0037] The spray plate 1 has a stepped surface 15, and the air-distributing plate 4 abuts against the stepped surface 15. An air-distributing chamber 41 is formed between the air-distributing plate 4 and the heating plate 3. Specifically, the air-distributing chamber 41 is provided on the side close to the heating plate 3. The air-distributing chamber 41 includes an annular groove 411 and a plurality of diverter grooves 412. A third through hole 42 is provided in the middle of the air-distributing plate 4, and the annular groove 411 is provided around the third through hole 42. One end of the plurality of diverter grooves 412 converges at one point and communicates with the first air inlet pipe 21, and the position where they communicate with the first air inlet pipe 21 deviates from the third through hole 42. The plurality of diverter grooves 412 are radially distributed outward and communicate with the annular groove 411, and the depth of the plurality of diverter grooves 412 is lower than the depth of the annular groove 411. A plurality of air-distributing holes 413 are also evenly provided on the outside of the annular groove 411, and the air-distributing holes 413 communicate with the spray chamber 11. A gas-leveling groove 414 is provided between each gas-leveling hole 413 and the annular groove 411. The depth of the gas-leveling groove 414 is lower than that of the annular groove 411. During gas circulation, external reactant gas enters through the first gas inlet pipe 21 and is evenly dispersed into the annular groove 411 through the diverter groove 412. The reactant gas in the annular groove 411 is then dispersed into the gas-leveling holes 413 through the gas-leveling groove 414. The gas then flows into the spray chamber 11 through the gas-leveling holes 413, and flows into the peripheral area of ​​the spray chamber 11.

[0038] A heating groove 32 is provided on the heating plate 3, and a heating element 31 is installed in the heating groove 32. The heating element 31 is a thermocouple. The heating groove 32 is opened on the side of the heating plate 3 facing away from the air distribution plate 4. A sealing strip 33 is also provided on the heating plate 3. When the heating element 31 is buried in the heating groove 32, the sealing strip 33 is used to seal the heating element 31 in the heating groove 32. The material of the sealing strip 33 is consistent with the material of the heating plate 3, that is, aluminum. A first through hole 34 and a second through hole 35 are provided on the heating plate 3. The first through hole 34 and the second through hole 35 are arranged side by side. The second through hole 35 is connected in series with the third through hole 42. The first through hole 34 is connected to one end where several diversion grooves 412 converge. The end of the first air inlet pipe 21 passes through the first through hole 34 and is connected to the air distribution chamber 41. The end of the second air inlet pipe 22 passes through the second through hole 35 and the third through hole 42 and is connected to the spray chamber 11. In this way, the reaction gas entering from the first air inlet pipe 21 is finally transported to the periphery of the spray chamber 11, and the reaction gas entering from the second air inlet pipe 22 is directly transported to the middle of the spray chamber 11. The reaction gas can be evenly dispersed in the spray chamber 11 and flow out evenly from the spray chamber 11.

[0039] A connecting shaft 36 is also provided in the middle of the heating plate 3 , through which the first air inlet pipe 21 and the second air inlet pipe 22 are passed and fixed, and the connecting end of the heating element 31 is fixed in the connecting shaft 36 and led out from the connecting shaft 36 .

[0040] To facilitate wafer positioning, the dual-channel spray system also features a lifting mechanism consisting of lifting tubes 5, which penetrate the spray plate 1 and cover plate 2. Preferably, there are three lifting tubes 5, arranged in a triangular pattern. The wafer is placed on the spray panel 13. Pins at the bottom extend from the lifting tubes 5, lifting the wafer and ensuring a clear gap between the wafer and the spray panel 13 during thin film deposition.

[0041] This application also discloses a thin film deposition apparatus including the aforementioned dual-channel spray device. Obviously, the aforementioned embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. A person skilled in the art would be able to make other variations or modifications based on the aforementioned description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present disclosure.

Claims

1. A dual-channel spray device, characterized in that: include: A spray plate (1), wherein the spray plate (1) is provided with a plurality of spray holes (12); A cover plate (2) covers the spray plate (1) and forms a spray chamber (11) between the cover plate (2) and the spray plate (1); a heating element (31) and an air-uniform chamber (41) are further provided in the cover plate (2), and the air-uniform chamber (41) is communicated with the spray chamber (11); The cover plate (2) comprises a heating plate (3) and an air-distributing plate (4) stacked on each other, the heating element (31) is installed in the heating plate (3), and the air-distributing chamber (41) is formed between the heating plate (3) and the air-distributing plate (4); A first air inlet pipe (21), a first through hole (34) and a second through hole (35) are provided on the heating plate (3), and an end portion of the first air inlet pipe (21) passes through the first through hole (34) and communicates with the uniform air chamber (41); A second air inlet pipe (22), a third through hole (42) is provided in the middle of the air homogenizing plate (4), the second through hole (35) and the third through hole (42) are connected in series, and an end of the second air inlet pipe (22) passes through the second through hole (35) and the third through hole (42) and is connected to the middle of the spray chamber (11); The air-leveling plate (4) is further provided with an air-leveling hole (413), the air-leveling hole (413) is located outside the third through hole (42), and the air-leveling hole (413) is communicated with the spray chamber (11).

2. The dual-channel spraying device according to claim 1, characterized in that: The spray chamber (11) is formed between the air-distributing plate (4) and the spray plate (1), and the heating plate (3) is located on the side of the air-distributing plate (4) facing away from the spray chamber (11).

3. The dual-channel spraying device according to claim 1, characterized in that: The heating plate (3) is provided with a heating groove (32), the heating element (31) is installed in the heating groove (32), and the heating plate (3) is also provided with a sealing strip (33) suitable for sealing the heating groove (32).

4. The dual-channel spraying device according to claim 2, characterized in that: The gas homogenizing chamber (41) comprises an annular groove (411) and a plurality of diverter grooves (412), one end of the plurality of diverter grooves (412) is in communication with the first air inlet pipe (21), and the other ends of the plurality of diverter grooves (412) are radially distributed toward the annular groove (411); A plurality of air-uniform holes (413) are provided on the outer side of the annular groove (411), and an air-uniform groove (414) is provided between each of the air-uniform holes (413) and the annular groove (411).

5. The dual-channel spraying device according to claim 4, characterized in that: The depth of the gas-uniform groove (414) is lower than the depth of the annular groove (411).

6. The dual-channel spraying device according to claim 1, characterized in that: The spray plate (1) comprises a spray panel (13) and an annular wall (14); the heating plate (3) and the air-distributing plate (4) are welded to the annular wall (14).

7. The dual-channel spraying device according to claim 1, characterized in that: It also includes a lifting pipe (5), which passes through the spray plate (1) and the cover plate (2). The number of the lifting pipes (5) is three and they are distributed in a triangular shape.

8. A thin film deposition device, characterized in that: The invention comprises the dual-channel spraying device according to any one of claims 1 to 7.

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