Liquid-cooled housing

Abstract

The application provides a liquid cooling shell. The liquid cooling shell comprises a base plate, a first side plate and a second side plate. The base plate is internally formed with a first flow channel and a second flow channel, and the first flow channel is formed with a total fluid inlet and a total fluid outlet. The first side plate is internally formed with a third flow channel. The first side plate is internally formed with a fourth flow channel. The first side plate and the second side plate are connected with the base plate to form a cooling cavity between the first side plate, the second side plate and the base plate, and the cooling cavity is used for accommodating a to-be-cooled element. The first flow channel, the third flow channel, the fourth flow channel and the second flow channel are communicated, and the third flow channel and the fourth flow channel are connected in parallel. In the liquid cooling shell, the first side plate and the second side plate are communicated through the base plate. The heat dissipation fluid flows in the base plate, so that the base plate, the first side plate and the second side plate can all flow the heat dissipation fluid, so as to cool the to-be-cooled element in the cooling cavity. The heat generated by the to-be-cooled element can be dissipated faster and more uniformly.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of cooling equipment, in particular to a liquid cooling shell. BACKGROUND

[0002] The liquid cooling heat dissipation scheme is generally used for heat dissipation of high-power devices or equipment. Compared with air cooling or natural heat dissipation, the liquid cooling heat dissipation scheme has the advantages of high heat dissipation efficiency and ideal heat dissipation effect. The common liquid cooling plate scheme on the market is to tightly attach a liquid cooling plate to one side of the to-be-cooled element, so as to dissipate heat from one side of the to-be-cooled element. However, the heat generation area of the to-be-cooled element may not be limited to one side. The liquid cooling plate scheme is difficult to meet the heat dissipation requirements of the to-be-cooled element with multiple heat generation areas, resulting in poor heat dissipation effect of the to-be-cooled element. SUMMARY

[0003] The present application provides a liquid cooling shell, which facilitates improving the heat dissipation effect of the to-be-cooled element.

[0004] The present application provides a liquid cooling shell. The liquid cooling shell includes a base plate, a first side plate and a second side plate. The base plate has a first flow channel and a second flow channel formed inside. One end of the first flow channel is exposed from the base plate to form a total fluid inlet. One end of the second flow channel is exposed from the base plate to form a total fluid outlet. The first flow channel further has a first fluid outlet and a second fluid outlet exposed from the base plate. The second flow channel further has a first fluid inlet and a second fluid inlet exposed from the base plate. The first side plate has a third flow channel formed inside. The third flow channel has a first sub-flow inlet and a first sub-flow outlet exposed from the first side plate at two ends, respectively. The second side plate has a fourth flow channel formed inside. The fourth flow channel has a second sub-flow inlet and a second sub-flow outlet exposed from the second side plate at two ends, respectively. The first side plate and the second side plate are connected with the base plate to form a cooling cavity between the first side plate, the second side plate and the base plate, and the cooling cavity is used for accommodating a to-be-cooled element. The first sub-flow inlet is connected with the first fluid outlet in a butt joint manner. The second sub-flow inlet is connected with the second fluid outlet in a butt joint manner. The first sub-flow outlet is connected with the first fluid inlet in a butt joint manner. The second sub-flow outlet is connected with the second fluid inlet in a butt joint manner.

[0005] The first side plate and the second side plate are connected by the base plate. When the heat dissipation fluid flows in the base plate to cool the elements to be cooled in the cooling cavity, the heat dissipation fluid can also flow in the first side plate and the second side plate to cool the elements to be cooled in the cooling cavity through the first side plate and the second side plate. Compared with cooling one side of the elements to be cooled by using only one heat sink, the liquid cooling shell can achieve a more three-dimensional cooling effect on the elements to be cooled, so that the heat emitted by the elements to be cooled can be dissipated faster and more uniformly. The third flow channel of the first side plate and the fourth flow channel of the second side plate are connected in parallel and converge in the base plate to supply liquid. On the one hand, the arrangement difficulty of the liquid cooling shell external pipeline can be reduced, and only one liquid supply pipeline is needed to supply the heat dissipation fluid to the total fluid inlet, and one liquid return pipeline can collect the heat dissipation fluid of the total fluid outlet. On the other hand, compared with the series connection of the first side plate and the second side plate, the heat dissipation effects of the first side plate and the second side plate are roughly the same, and when one of the first side plate and the second side plate is damaged, the influence on the other is smaller.

[0006] In some embodiments of the present application, along the first direction, the base plate has a mounting surface, and the first side plate and the second side plate are connected with the base plate to form the cooling cavity located at the mounting surface. In the projection plane perpendicular to the first direction, the first flow channel and the second flow channel partially overlap, and the projection overlapping parts of the first flow channel and the second flow channel are staggered along the first direction, so that the first flow channel and the second flow channel are not connected in the base plate.

[0007] In the liquid cooling shell, the size of the base plate in the first direction is increased, so that the first flow channel and the second flow channel can be staggered in the first direction. The space of the base plate perpendicular to the first direction is fully utilized to distribute to the first side plate and the second side plate.

[0008] In some embodiments of the present application, the first side plate and the second side plate are oppositely arranged along the second direction, and the second direction is perpendicular to the first direction.

[0009] In the liquid cooling shell, the first side plate and the second side plate are oppositely arranged, so that the two opposite sides of the elements to be cooled are uniformly cooled, and the cooling effect of the elements to be cooled is improved.

[0010] In some embodiments of the present application, the liquid cooling shell further comprises a third side plate and a fourth side plate. The first flow channel further has a third fluid outlet and a fourth fluid outlet exposed from the base plate, and the second flow channel further has a third fluid inlet and a fourth fluid inlet exposed from the base plate. The third side plate is internally formed with a fifth flow channel, and two ends of the fifth flow channel are respectively formed with a third sub-flow inlet and a third sub-flow outlet exposed from the third side plate. The fourth side plate is internally formed with a sixth flow channel, and two ends of the sixth flow channel are respectively formed with a fourth sub-flow inlet and a fourth sub-flow outlet exposed from the fourth side plate. The third side plate and the fourth side plate are connected with the base plate to form the cooling cavity between the first side plate, the second side plate, the third side plate, the fourth side plate and the base plate. The third sub-flow inlet is in communication with the third fluid outlet in abutment, the fourth sub-flow inlet is in communication with the fourth fluid outlet in abutment, the third sub-flow outlet is in communication with the third fluid inlet in abutment, and the fourth sub-flow outlet is in communication with the fourth fluid inlet in abutment.

[0011] In the liquid cooling shell, the third side plate and the fourth side plate enable at least five surfaces of the to-be-cooled element to be cooled by the heat dissipation fluid, thereby improving the cooling effect of the to-be-cooled element. The third flow channel, the fourth flow channel, the fifth flow channel and the sixth flow channel are all in parallel and converge at the base plate to supply the heat dissipation fluid. On the one hand, the arrangement difficulty of the external pipeline of the liquid cooling shell can be reduced, and only one supply pipeline is needed to supply the heat dissipation fluid to the total fluid inlet, and one return pipeline is needed to collect the heat dissipation fluid of the total fluid outlet. On the other hand, compared with the form in which the first side plate, the second side plate, the third side plate and the fourth side plate are connected in series, the heat dissipation effects of the third side plate and the fourth side plate are substantially the same, and when one of the third side plate and the fourth side plate is damaged, the influence on the other one is smaller.

[0012] In some embodiments of the present application, the first fluid inlet and the first fluid outlet are arranged on the mounting surface. And / or, the second fluid inlet and the second fluid outlet are arranged on the mounting surface.

[0013] In the liquid cooling shell, the first fluid inlet and the first fluid outlet are arranged on the mounting surface, and when the first side plate is mounted to the base plate, the first sub-flow inlet and the first sub-flow outlet are in communication with the base plate in abutment, thereby reducing the assembly difficulty of the first side plate and the base plate. The second fluid inlet and the second fluid outlet are arranged on the mounting surface, and when the second side plate is mounted to the base plate, the second sub-flow inlet and the second sub-flow outlet are in communication with the base plate in abutment, thereby reducing the assembly difficulty of the second side plate and the base plate.

[0014] In some embodiments of the present application, the third fluid inlet and the third fluid outlet are arranged on the mounting surface. And / or, the fourth fluid inlet and the fourth fluid outlet are arranged on the mounting surface.

[0015] The third sub-flow inlet and the third sub-flow outlet are arranged on the mounting surface, and when the third side plate is mounted to the base plate, the third sub-flow inlet and the third sub-flow outlet are in flow communication with the base plate, thereby reducing the assembly difficulty of the third side plate and the base plate. The fourth fluid inlet and the fourth fluid outlet are arranged on the mounting surface, and when the fourth side plate is mounted to the base plate, the fourth sub-flow inlet and the fourth sub-flow outlet are in flow communication with the base plate, thereby reducing the assembly difficulty of the fourth side plate and the base plate.

[0016] In some embodiments of the present application, the liquid cooling shell further comprises a cover plate arranged opposite to the base plate along the first direction. The first side plate, the second side plate, the third side plate, and the fourth side plate are connected to the cover plate. The cooling cavity is sealed between the first side plate, the second side plate, the third side plate, the fourth side plate, the cover plate, and the base plate. The cooling cavity is filled with the insulating fluid.

[0017] In the liquid cooling shell, the cover plate is arranged opposite to the base plate and is the plate structure farthest from the base plate. The cover plate seals the cooling cavity, and the cooling cavity is filled with the insulating fluid. The heat of the to-be-cooled element is carried to the positions of the first side plate, the second side plate, the third side plate, the fourth side plate, and the base plate by the flow of the insulating fluid, so as to remove the heat in the cooling cavity and cool the to-be-cooled element. The cooling cavity is sealed, which can prevent the insulating fluid from overflowing and reduce the temperature rise in the cooling cavity caused by fluid exchange when the temperature in the cooling cavity is lower than the temperature outside the cooling cavity.

[0018] In some embodiments of the present application, the liquid cooling shell further comprises a fluid driving member arranged in the cooling cavity to drive the flow of the insulating fluid.

[0019] In the liquid cooling shell, the fluid driving member accelerates the flow speed of the insulating fluid in the cooling cavity, so that the insulating fluid can carry the heat of the to-be-cooled element away from the to-be-cooled element more quickly.

[0020] In some embodiments of the present application, the cover plate is provided with a lead hole for sealingly connecting the lead wire of the to-be-cooled element.

[0021] In the liquid cooling shell, the lead hole can lead the lead wire of the to-be-cooled element out of the cooling cavity, thereby facilitating the wired electrical connection of the to-be-cooled element. It can be understood that when the cover plate does not have the lead hole, the to-be-cooled element can also be powered by wireless electrical connection, for example, a wireless receiving circuit module is arranged in the cooling cavity, and a wireless transmitting circuit module is arranged outside the accommodating cavity, and the wireless transmitting circuit module emits an electromagnetic field to the wireless receiving circuit module.

[0022] In some embodiments of the present application, the total fluid inlet and the total fluid outlet are located on the same side of the substrate.

[0023] In this liquid cooling shell, by setting the total fluid inlet and the total fluid outlet on the same side, the docking of the substrate and the heat dissipation fluid supply is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 The structural schematic diagram of the liquid cooling shell in an embodiment of the present application is shown, in which the flow channel in the liquid cooling shell is also shown by dotted lines.

[0025] Figure 2 The assembly schematic diagram of the liquid cooling shell in an embodiment of the present application is shown.

[0026] Figure 3 The structural schematic diagram of the substrate in an embodiment of the present application is shown from one perspective.

[0027] Figure 4 The structural schematic diagram of the substrate in an embodiment of the present application is shown from another perspective.

[0028] Figure 5 The structural schematic diagram of the first side plate in an embodiment of the present application is shown.

[0029] Figure 6 The structural schematic diagram of the second side plate in an embodiment of the present application is shown.

[0030] Figure 7 The structural schematic diagram of the third side plate in an embodiment of the present application is shown.

[0031] Figure 8 The structural schematic diagram of the fourth side plate in an embodiment of the present application is shown.

[0032] Figure 9 The structural schematic diagram of Figure 4 the section view along A-A direction in FIG. 1.

[0033] Explanation of main element symbols

[0034] Liquid cooling shell 001

[0035] Substrate 100

[0036] First side plate 200

[0037] Second side plate 300

[0038] Third side plate 400

[0039] Fourth side plate 500

[0040] First flow channel 110

[0041] second flow channel 130

[0042] total fluid inlet 111

[0043] total fluid outlet 131

[0044] first fluid outlet 112

[0045] first fluid inlet 113

[0046] second fluid outlet 114

[0047] second fluid inlet 115

[0048] third fluid inlet 116

[0049] third fluid outlet 117

[0050] fourth fluid inlet 118

[0051] fourth fluid outlet 119

[0052] third flow channel 210

[0053] first partial flow inlet 211

[0054] first partial flow outlet 213

[0055] fourth flow channel 310

[0056] second partial flow inlet 311

[0057] second partial flow outlet 313

[0058] fifth flow channel 410

[0059] third partial flow inlet 411

[0060] third partial flow outlet 413

[0061] sixth flow channel 510

[0062] fourth partial flow inlet 511

[0063] fourth partial flow outlet 513

[0064] mounting surface 101

[0065] cover 600

[0066] element to be cooled 002

[0067] cooling chamber 010

[0068] sealing element 700

[0069] annular groove 401

[0070] sealing groove 201

[0071] first direction X

[0072] second direction Y

[0073] third direction Z

[0074] The following detailed description will further describe the present application with reference to the above drawings. DETAILED DESCRIPTION

[0075] The present application is described below by way of specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. Although the description of the present application will be introduced in conjunction with the preferred embodiments, this does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the present application in conjunction with the embodiments is to cover other alternatives or modifications that can be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the present application, some specific details will be omitted in the description. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict.

[0076] Hereinafter, if used, the terms "first", "second", and the like are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more. The orientation terms such as "upper", "lower", "left", "right", and the like are defined with respect to the orientation in which the components are placed in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change in the orientation in which the components are placed in the drawings.

[0077] In the present application, if used, unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through an intermediate medium. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0078] In the following detailed description of the embodiments with reference to the drawings, the drawings show only partial structures of the devices in a local enlarged manner without the general scale for the convenience of illustration, and the drawings are only examples which should not limit the scope of protection of the present application.

[0079] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0080] Figure 1 A structural schematic diagram of a liquid cooling shell 001 in an embodiment of the present application is shown, in which the flow channel in the liquid cooling shell 001 is also shown by dotted lines. Figure 2 An assembly schematic diagram of the liquid cooling shell 001 in an embodiment of the present application is shown.

[0081] Please refer to Figure 1 and Figure 2 The liquid cooling shell 001 includes a base plate 100, a first side plate 200, a second side plate 300, a third side plate 400, a fourth side plate 500 and a cover plate 600. The base plate 100, the first side plate 200, the second side plate 300, the third side plate 400, the fourth side plate 500 and the cover plate 600 enclose to form a liquid cooling shell 001 in a substantially cuboid shape. A cooling cavity 010 in a substantially cuboid shape is also formed in the liquid cooling shell 001. A to-be-cooled element 002 is arranged in the cooling cavity 010. When the to-be-cooled element 002 generates heat, the heat can be brought to the liquid cooling shell 001, and the whole of the to-be-cooled element 002 and the liquid cooling shell 001 can be cooled by refrigeration of the liquid cooling shell 001.

[0082] Figure 3 A structural schematic diagram of the base plate 100 in an embodiment of the present application is shown from one perspective. Figure 4 A structural schematic diagram of the base plate 100 in an embodiment of the present application is shown from another perspective.

[0083] Please refer to Figure 2 , Figure 3 and Figure 4A first flow channel 110 and a second flow channel 130 are formed in the substrate 100. The first flow channel 110 and the second flow channel 130 are both formed in the substrate 100. The first flow channel 110 and the second flow channel 130 can be formed by providing two sub-plates, forming grooves on the surfaces of the two sub-plates, and then connecting the two sub-plates to form the substrate 100, and combining the grooves on the two sub-plates to form the first flow channel 110 and the second flow channel 130. One end of the first flow channel 110 is exposed from the substrate 100 to form a total fluid inlet 111. One end of the second flow channel 130 is exposed from the substrate 100 to form a total fluid outlet 131. The heat dissipation fluid enters the substrate 100 through the total fluid inlet 111 and flows out of the substrate 100 through the total fluid outlet 131. The total fluid inlet 111 and the total fluid outlet 131 are arranged on the same side of the substrate 100, so that when the fluid supply device is connected to the substrate 100, the interface of the fluid supply device can be easily connected to the total fluid inlet 111 and the total fluid outlet 131.

[0084] In the first direction X, i.e. the thickness direction of the substrate 100, the substrate 100 has a mounting surface 101. The first flow channel 110 is bifurcated in the substrate 100, one end of one branch of the first flow channel 110 is arranged on the mounting surface 101 of the substrate 100 to form a first fluid outlet 112, and the other end of the other branch of the first flow channel 110 is arranged on the mounting surface 101 of the substrate 100 to form a second fluid outlet 114. The heat dissipation fluid flowing into the first fluid outlet 112 and the second fluid outlet 114 can flow out of the substrate 100.

[0085] The second flow channel 130 is also bifurcated in the substrate 100, one end of one branch of the second flow channel 130 is arranged on the mounting surface 101 of the substrate 100 to form a first fluid inlet 113, and the other end of the other branch of the second flow channel 130 is arranged on the mounting surface 101 of the substrate 100 to form a second fluid inlet 115. The heat dissipation fluid flowing into the first fluid inlet 113 and the second fluid inlet 115 can flow out of the substrate 100 through the total fluid outlet 131.

[0086] Figure 5 A structure diagram of the first side plate 200 in an embodiment of the present application is shown.

[0087] Please refer to Figure 1 and Figure 5The third flow channel 210 is formed inside the first side plate 200. The third flow channel 210 is formed in the first side plate 200. The third flow channel 210 can be formed by setting two sub-plates, setting grooves on the surface of each sub-plate, and then fixing and connecting the two sub-plates to form the first side plate 200, and combining the grooves on the two sub-plates to form the third flow channel 210. The two ends of the third flow channel 210 form a first sub-flow inlet 211 and a first sub-flow outlet 213, respectively. The first sub-flow inlet 211 and the first sub-flow outlet 213 are exposed from the side surface of one end of the first side plate 200 along the first direction X. When the first side plate 200 is docked with the base plate 100 parallel to the first direction X, the first sub-flow inlet 211 is in communication with the first fluid outlet 112, and the first sub-flow outlet 213 is in communication with the first fluid inlet 113. The first side plate 200 and the base plate 100 can be fixed relative to each other by welding. The heat dissipation fluid entering the first flow channel 110 through the total fluid inlet 111 can enter the third flow channel 210 through the first sub-flow inlet 211, flow through the third flow channel 210, and then enter the second flow channel 130 through the first sub-flow outlet 213, and finally flow out of the second flow channel 130 through the total fluid outlet 131. The third flow channel 210 is an S-shaped flow channel, which can increase the flow area of the heat dissipation fluid on the first side plate 200.

[0088] Figure 6 A structure diagram of the second side plate 300 in an embodiment of the present application is shown.

[0089] Please refer to Figure 1 and Figure 6The fourth flow channel 310 is formed inside the second side plate 300. The fourth flow channel 310 is formed in the second side plate 300. The fourth flow channel 310 can be formed by setting two sub-plates, setting grooves on the surface of each sub-plate, and then fixing and connecting the two sub-plates to form the second side plate 300, and combining the grooves on the two sub-plates to form the fourth flow channel 310. The two ends of the fourth flow channel 310 form a second sub-flow inlet 311 and a second sub-flow outlet 313, respectively. The second sub-flow inlet 311 and the second sub-flow outlet 313 are exposed from the side surface of one end of the second side plate 300 along the first direction X. When the second side plate 300 is docked with the base plate 100 parallel to the first direction X, the second sub-flow inlet 311 is in communication with the second fluid outlet 114, and the second sub-flow outlet 313 is in communication with the second fluid inlet 115. The second side plate 300 and the base plate 100 can be fixed relative to each other by welding. The heat dissipation fluid entering the first flow channel 110 through the total fluid inlet 111 can enter the fourth flow channel 310 through the second sub-flow inlet 311, flow through the fourth flow channel 310, and then enter the second flow channel 130 through the second sub-flow outlet 313, and finally flow out of the second flow channel 130 through the total fluid outlet 131. The fourth flow channel 310 is an S-shaped flow channel, which can increase the flow area of the heat dissipation fluid on the second side plate 300.

[0090] The heat dissipation fluid can carry away the heat of the first side plate 200, the second side plate 300, and the base plate 100 because the first side plate 200, the second side plate 300, and the base plate 100 can flow through the heat dissipation fluid. Compared with cooling only one side of the to-be-cooled element 002 with a single heat sink, the liquid cooling shell 001 can achieve a more three-dimensional refrigeration effect on the to-be-cooled element 002, so that the heat emitted by the to-be-cooled element 002 can be dissipated faster and more evenly.

[0091] The first side plate 200 and the second side plate 300 are oppositely arranged along a second direction Y. Two branches of the first flow channel 110 extend away from each other along the second direction Y. Two branches of the second flow channel 130 also extend away from each other along the second direction Y. The second direction Y is perpendicular to the first direction X. The first flow channel 110 and the second flow channel 130 also need to extend along the first direction X. In a projection plane perpendicular to the first direction X, the first flow channel 110 and the second flow channel 130 partially overlap. In order to make the first flow channel 110 and the second flow channel 130 not communicate in the substrate 100, the first flow channel 110 and the second flow channel 130 are staggered along the first direction X. Specifically, the projection overlapping part of the first flow channel 110 and the second flow channel 130 can be arranged as follows: along the first direction X, the first flow channel 110 is located on the side of the second flow channel 130 close to the mounting surface 101. It can also be arranged as follows: along the first direction X, the first flow channel 110 is located on the side of the second flow channel 130 away from the mounting surface 101.

[0092] The third side plate 400 and the fourth side plate 500 are oppositely arranged along a third direction Z. The third direction Z is perpendicular to the first direction X and the second direction Y. The fourth side plate 500 is arranged on the side of the substrate 100 having the total fluid inlet and the total fluid outlet. The first flow channel 110 further has a third fluid outlet 117 and a fourth fluid outlet 119 exposed from the substrate 100. The second flow channel 130 further has a third fluid inlet 116 and a fourth fluid inlet 118 exposed from the substrate 100.

[0093] Figure 7 A structural schematic diagram of the third side plate 400 in an embodiment of the present application is shown.

[0094] Please refer to Figure 1 and Figure 7The fifth flow channel 410 is formed inside the third side plate 400. The fifth flow channel 410 is formed in the third side plate 400. The fifth flow channel 410 can be formed by setting two sub-plates, setting grooves on the surface of each sub-plate, and then fixing and connecting the two sub-plates to form the third side plate 400, and combining the grooves on the two sub-plates to form the fifth flow channel 410. The fifth flow channel 410 has a third sub-flow inlet 411 and a third sub-flow outlet 413 at two ends thereof. The third sub-flow inlet 411 and the third sub-flow outlet 413 are exposed from the side surface of the third side plate 400 at one end thereof along the first direction X. When the third side plate 400 is docked with the base plate 100 in parallel to the first direction X, the third sub-flow inlet 411 is in communication with the third fluid outlet 117, and the third sub-flow outlet 413 is in communication with the third fluid inlet 116. The third side plate 400 and the base plate 100 can be fixed relative to each other by welding. The heat dissipation fluid entering the first flow channel 110 through the total fluid inlet 111 can enter the fifth flow channel 410 through the third sub-flow inlet 411, flow through the fifth flow channel 410, and then enter the second flow channel 130 through the third sub-flow outlet 413, and finally flow out of the fourth flow channel 310 through the total fluid outlet 131. The fifth flow channel 410 is an S-shaped flow channel, which can increase the flow area of the heat dissipation fluid on the third side plate 400.

[0095] When the third side plate 400 and the fourth side plate 500 are connected with the base plate 100, the first side plate 200, the third side plate 400, the second side plate 300, and the fourth side plate 500 are connected in sequence. The strength of the liquid cooling shell 001 can be increased by welding the first side plate 200, the third side plate 400, the second side plate 300, and the fourth side plate 500.

[0096] Figure 8 A structure diagram of the fourth side plate 500 in an embodiment of the present application is shown.

[0097] Please refer to Figure 1 and Figure 8The sixth flow channel 510 is formed inside the fourth side plate 500. The sixth flow channel 510 is formed in the fourth side plate 500. The sixth flow channel 510 can be formed by setting two sub-plates, setting grooves on the surface of each sub-plate, and then fixing and connecting the two sub-plates to form the fourth side plate 500, and the grooves on the two sub-plates combine to form the sixth flow channel 510. The two ends of the sixth flow channel 510 form a fourth sub-flow inlet 511 and a fourth sub-flow outlet 513, respectively. The fourth sub-flow inlet 511 and the fourth sub-flow outlet 513 are exposed from the side surface of one end of the fourth side plate 500 along the first direction X. When the fourth side plate 500 is docked with the base plate 100 parallel to the first direction X, the fourth sub-flow inlet 511 is in communication with the fourth fluid outlet 119, and the fourth sub-flow outlet 513 is in communication with the fourth fluid inlet 118. The fourth side plate 500 and the base plate 100 can be fixed relative to each other by welding. The heat dissipation fluid entering the first flow channel 110 through the total fluid inlet 111 can enter the sixth flow channel 510 through the fourth sub-flow inlet 511, and then enter the second flow channel 130 through the fourth sub-flow outlet 513 after flowing through the sixth flow channel 510, and finally flow out of the fourth flow channel 310 through the total fluid outlet 131. The sixth flow channel 510 is an S-shaped flow channel, which can increase the flow area of the heat dissipation fluid on the fourth side plate 500.

[0098] The heat of the to-be-cooled element 002 is transferred to the first side plate 200, the second side plate 300, the third side plate 400, the fourth side plate 500, and the base plate 100 in the cooling cavity 010. Since the first side plate 200, the second side plate 300, the third side plate 400, the fourth side plate 500, and the base plate 100 can flow through the heat dissipation fluid, the heat dissipation fluid can take away the heat of the first side plate 200, the second side plate 300, the third side plate 400, the fourth side plate 500, and the base plate 100. Compared with cooling only one side of the to-be-cooled element 002 with one heat sink, the liquid cooling shell 001 can achieve a more three-dimensional refrigeration effect on the to-be-cooled element 002, so that the heat emitted by the to-be-cooled element 002 can be dissipated faster and more evenly.

[0099] The third flow channel 210, the fourth flow channel 310, the fifth flow channel 410, and the sixth flow channel 510 are connected in parallel and converge at the base plate 100 to supply liquid. On the one hand, the arrangement difficulty of the outer pipeline of the liquid cooling shell 001 can be reduced, and only one liquid supply pipeline is needed to supply the heat dissipation fluid to the total fluid inlet 111, and one liquid return pipeline can collect the heat dissipation fluid of the total fluid outlet 131. On the other hand, compared with the series connection of the first side plate 200, the second side plate 300, the third side plate 400, and the fourth side plate 500, the heat dissipation effects of the third side plate 400 and the fourth side plate 500 are approximately the same, and when one of the third side plate 400 and the fourth side plate 500 is damaged, the influence on the other is smaller.

[0100] Understandably, the assembly of the liquid-cooled housing 001 can also be achieved through the following steps: First, pre-assemble the first side plate 200, the third side plate 400, the second side plate 300, and the fourth side plate 500, such that the first fluid inlet 113, the first fluid outlet 112, the second fluid inlet 115, the second fluid outlet 114, the third fluid inlet 116, the third fluid outlet 117, the fourth fluid inlet 118, and the fourth fluid outlet 119 are located on the same side along the first direction X. Then, mate the pre-assembled first side plate 200, the third side plate 400, the second side plate 300, and the fourth side plate 500 with the substrate 100.

[0101] On one side of the substrate 100, the total fluid inlet 111 and the total fluid outlet 131 can be staggered along the first direction X, reducing the amount by which the first flow channel 110 and the second flow channel 130 extend along the first direction X within the substrate 100.

[0102] Optionally, the first flow channel 110 may extend at an angle within the substrate 100 along the first direction X, and the second flow channel 130 may extend at an angle within the substrate 100 along the first direction X. For example, the branch of the first flow channel 110 connecting to the fourth flow channel 310 may be angled in the first direction X, and the branch of the second flow channel 130 connecting to the third flow channel 210 may be angled in the first direction X.

[0103] Figure 9 It shows Figure 4 Sectional view along the AA direction.

[0104] Optionally, the first flow channel 110 may extend vertically within the substrate 100 along the first direction X, and the second flow channel 130 may extend vertically within the substrate 100 along the first direction X. For example, as Figure 9 As shown, the main fluid inlet 111 extends upward parallel to the first direction X from a position before branching, and then extends perpendicular to the first direction X within the substrate 100 to form a branch. The main fluid outlet 131 extends downward parallel to the first direction X from a position before branching, and then extends perpendicular to the first direction X within the substrate 100 to form a branch. For example, the branch of the first flow channel 110 connecting to the fourth flow channel 310 first extends parallel to the first direction X to the lower side of the second flow channel 130, and then extends towards the second side plate 300. The branch of the second flow channel 130 connecting to the third flow channel 210 first extends parallel to the first direction X to the upper side of the first flow channel 110, and then extends towards the first side plate 200. Here, the upper side refers to the side closer to the mounting surface 101, the lower side, and the side farther from the mounting surface 101.

[0105] A sealing member 700 is arranged between any two of the first side plate 200, the third side plate 400, the second side plate 300, the fourth side plate 500 and the base plate 100, so that fluid in the cooling cavity 010 is not easily leaked from the joint gaps of the first side plate 200, the third side plate 400, the second side plate 300, the fourth side plate 500 and the base plate 100.

[0106] The cover plate 600 is arranged opposite to the base plate 100 along the first direction X. The cover plate 600 is arranged on the side of the first side plate 200, the third side plate 400, the second side plate 300 and the fourth side plate 500 away from the base plate 100. No flow channel is arranged in the cover plate 600, and the cooling cavity 010 is sealed by the cover plate 600. The cover plate 600 is sealingly connected with any one of the first side plate 200, the third side plate 400, the second side plate 300 and the fourth side plate 500. Specifically, the third side plate 400 and the fourth side plate 500 each have an annular groove 401 on the outer periphery, and a sealing ring is sleeved on the outer periphery of the third side plate 400 and the fourth side plate 500. The sealing member 700 is embedded in the annular groove 401, and the sealing ring forms a four-sided sealing member 700 on the third side plate 400 and the fourth side plate 500. The third side plate 400 can be sealingly connected with the base plate 100, the cover plate 600, the first side plate 200 and the second side plate 300. The fourth side plate 500 can be sealingly connected with the base plate 100, the cover plate 600, the first side plate 200 and the second side plate 300. The first side plate 200 is provided with a sealing groove 201 at both ends along the first direction X, and a sealing strip is arranged in the sealing groove 201. The sealing strip forms the sealing member 700, so that the first side plate 200 is sealingly connected with the cover plate 600 and the base plate 100 at both ends along the first direction X, respectively. The first side plate 200 is provided with a sealing strip at both ends along the first direction X, and the sealing strip forms the sealing member 700, so that the first side plate 200 is sealingly connected with the cover plate 600 and the base plate 100 at both ends along the first direction X, respectively.

[0107] The cooling cavity 010 is filled with insulating fluid, and the heat transfer efficiency of the to-be-cooled element 002 and the liquid cooling shell 001 can be improved by the convection of the insulating fluid. The insulating fluid can be a gas or a liquid. When the insulating fluid flows, the high-temperature insulating fluid near the to-be-cooled element 002 and the low-temperature insulating fluid in other areas can be mixed, so as to realize the circulation of heat.

[0108] Optionally, the liquid cooling shell 001 further comprises a fluid driving member (not shown in the figure), which is arranged in the cooling cavity 010 to drive the insulating fluid to flow.

[0109] Optionally, the cover plate 600 is provided with a lead hole (not shown in the figure) for sealingly connecting the lead wire of the to-be-cooled element 002. The lead hole is designed by using a rubber plug or structure to achieve the sealing of the lead wire.

[0110] The lead hole can lead the lead of the element to be cooled 002 out of the cooling cavity 010, and facilitate the wired electrical connection of the element to be cooled 002. It can be understood that when the cover plate 600 is not provided with the lead hole, the power supply of the element to be cooled 002 can also be realized through the wireless electrical connection of the element to be cooled 002, for example, a wireless receiving circuit module is arranged in the cooling cavity 010, and a wireless transmitting circuit module is arranged outside the accommodating cavity, and the wireless transmitting circuit module emits electromagnetic field to the wireless receiving circuit module.

[0111] It can be understood that the liquid cooling shell 001 can also be in other shapes, such as a three-prism, a six-prism, an octahedron, etc. In the liquid cooling shell 001, not all side plates are provided with flow channels, and only the first side plate 200 and the second side plate 300 are needed to improve the cooling efficiency of the element to be cooled 002. When all the side plates in the liquid cooling shell 001 are provided with flow channels, the cooling efficiency of the element to be cooled 002 can be improved. The side plate is a plate-shaped structure directly connected to the base plate 100.

[0112] It can be understood that the heat dissipation fluid can be water, ethylene glycol, alcohol, etc.

[0113] In such a liquid cooling shell 001, the first side plate 200 and the second side plate 300 are connected by the base plate 100. When the heat dissipation fluid flows in the base plate 100 to cool the element to be cooled 002 in the cooling cavity 010, the heat dissipation fluid can also flow in the first side plate 200 and the second side plate 300 to cool the element to be cooled 002 in the cooling cavity 010 through the first side plate 200 and the second side plate 300. Compared with cooling only one side of the element to be cooled 002 with a heat sink, such a liquid cooling shell 001 can achieve more three-dimensional cooling effect on the element to be cooled 002, so that the heat emitted by the element to be cooled 002 can be dissipated faster and more evenly. The third flow channel 210 of the first side plate 200 and the fourth flow channel 310 of the second side plate 300 are connected in parallel and converge in the base plate 100, and the heat dissipation fluid is supplied to the total fluid inlet 111 through the base plate 100. On the one hand, the arrangement difficulty of the pipeline outside the liquid cooling shell 001 can be reduced, and only one liquid supply pipeline is needed to supply the heat dissipation fluid to the total fluid inlet 111, and one liquid return pipeline can collect the heat dissipation fluid of the total fluid outlet 131. On the other hand, compared with the series connection of the first side plate 200 and the second side plate 300, the heat dissipation effects of the first side plate 200 and the second side plate 300 are substantially the same, and when one of the first side plate 200 and the second side plate 300 is damaged, the influence on the other is smaller.

[0114] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any change or replacement within the technical scope disclosed in the present application should be covered in the disclosure range of the present application.

Claims

1. A liquid-cooled enclosure, characterized by, The liquid cooling shell comprises: a substrate, a first flow channel and a second flow channel are formed inside the substrate, one end of the first flow channel is exposed from the substrate to form a total fluid inlet, one end of the second flow channel is exposed from the substrate to form a total fluid outlet, the first flow channel further has a first fluid outlet and a second fluid outlet exposed from the substrate, and the second flow channel further has a first fluid inlet and a second fluid inlet exposed from the substrate; a first side plate, a third flow channel is formed inside the first side plate, and two ends of the third flow channel form a first sub-inlet and a first sub-outlet exposed from the first side plate, respectively; a second side plate, a fourth flow channel is formed inside the second side plate, and two ends of the fourth flow channel form a second sub-inlet and a second sub-outlet exposed from the second side plate, respectively; the first side plate and the second side plate are connected with the substrate to form a cooling cavity between the first side plate, the second side plate and the substrate, and the cooling cavity is used for accommodating a component to be cooled; the first sub-inlet is in butt joint communication with the first fluid outlet, the second sub-inlet is in butt joint communication with the second fluid outlet, the first sub-outlet is in butt joint communication with the first fluid inlet, and the second sub-outlet is in butt joint communication with the second fluid inlet; the substrate comprises two sub-plates, a groove is arranged on the surface of each sub-plate, and the grooves on the two sub-plates are combined to form the first flow channel and the second flow channel; the substrate has a mounting surface, and the first side plate and the second side plate are connected with the substrate to form the cooling cavity located on the mounting surface; in a projection plane perpendicular to the first direction, the first flow channel and the second flow channel partially overlap, and the projection overlapping parts of the first flow channel and the second flow channel are staggered along the first direction, so that the first flow channel and the second flow channel are not communicated in the substrate; the first side plate and the second side plate are oppositely arranged along a second direction, and the second direction is perpendicular to the first direction; the liquid cooling shell further comprises a third side plate and a fourth side plate; the first flow channel further has a third fluid outlet and a fourth fluid outlet exposed from the substrate, and the second flow channel further has a third fluid inlet and a fourth fluid inlet exposed from the substrate; a fifth flow channel is formed inside the third side plate, and two ends of the fifth flow channel form a third sub-inlet and a third sub-outlet exposed from the third side plate, respectively; a sixth flow channel is formed inside the fourth side plate, and two ends of the sixth flow channel form a fourth sub-inlet and a fourth sub-outlet exposed from the fourth side plate, respectively; the third side plate and the fourth side plate are connected with the substrate to form the cooling cavity between the first side plate, the second side plate, the third side plate, the fourth side plate and the substrate; the third sub-inlet is in butt joint communication with the third fluid outlet, the fourth sub-inlet is in butt joint communication with the fourth fluid outlet, the third sub-outlet is in butt joint communication with the third fluid inlet, and the fourth sub-outlet is in butt joint communication with the fourth fluid inlet.

2. The liquid-cooled enclosure of claim 1, wherein, the first fluid inlet and the first fluid outlet are arranged on the mounting surface; and / or, The second fluid inlet and the second fluid outlet are arranged on the mounting surface.

3. The liquid-cooled enclosure of claim 1, wherein, The third fluid inlet and the third fluid outlet are arranged on the mounting surface; and / or, The fourth fluid inlet and the fourth fluid outlet are arranged on the mounting surface.

4. The liquid-cooled enclosure of claim 1, wherein, The liquid cooling shell further comprises a cover plate arranged opposite to the base plate along the first direction; The first side plate, the second side plate, the third side plate and the fourth side plate are connected with the cover plate; A sealed cooling cavity is formed between the first side plate, the second side plate, the third side plate, the fourth side plate, the cover plate and the base plate; The cooling cavity is filled with an insulating fluid.

5. The liquid-cooled enclosure of claim 4, wherein, The liquid cooling shell further comprises a fluid driving member arranged in the cooling cavity to drive the insulating fluid to flow.

6. The liquid-cooled enclosure of claim 5, wherein, The cover plate is provided with a lead hole for sealingly connecting a lead wire of the element to be cooled.

7. The liquid-cooled enclosure of claim 1, wherein, The total fluid inlet and the total fluid outlet are located on the same side of the base plate.

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