Expansion Retaining Ring Disassembly Fixture and Expansion Retaining Ring Disassembly Method

Abstract

The present invention provides an expanding retaining ring removal jig and an expanding retaining ring removal method capable of removing an expanding retaining ring from a frame without damaging the expanding retaining ring. The expanding retaining ring removal jig includes: a base member (12) having an annular retaining groove (24) for externally fitting and retaining the expanding retaining ring (100), and a sheet support surface (26) provided at a position inside the retaining groove (24) for supporting a cutting tape (4) that is in an expanded state through the expanding retaining ring (100); and a sheet pressing member (14) having a sheet pressing surface (34) provided at a position facing the sheet support surface (26). The base member (12) has an annular avoidance groove (38) for avoiding a tool (16) at a position inside the retaining groove (24) and outside the pressing position where the cutting tape (4) is pressed by the sheet pressing surface (34).

Description

Technical Field

[0001] The present invention relates to an expansion retaining ring removal jig and an expansion retaining ring removal method, and more particularly to an expansion retaining ring removal jig and an expansion retaining ring removal method for removing an expansion retaining ring that holds a cutting tape in an expanded state from a cutting frame. Background Art

[0002] Conventionally, in the manufacture of semiconductor chips (hereinafter referred to as chips), there is known a workpiece dividing apparatus (for example, see Patent Document 1) that divides a semiconductor wafer (hereinafter referred to as a wafer) having dicing lines pre-processed therein into individual chips (also referred to as singulation) by, for example, laser irradiation.

[0003] The wafer is pasted onto a cutting tape, and the outer peripheral portion of the cutting tape is fixed to a cutting frame (hereinafter referred to as a frame). The workpiece dividing apparatus expands the cutting tape using an expansion ring to divide the wafer into individual chips, and then, in order to remove the chips using a chip bonder, an expansion retaining ring is used to hold the cutting tape in an expanded state.

[0004] In addition, the outer diameter of the expansion retaining ring disclosed in Patent Document 2 has: a main body ring whose outer diameter is smaller than the inner diameter of the frame and whose inner diameter is larger than the outer diameter of the expansion ring; and an elastically deformable resin fitting portion that is assembled to the outer peripheral portion of the main body ring and whose outer diameter is larger than the inner diameter of the frame (hereinafter referred to as a lip portion).

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2021-176201

[0008] Patent Document 2: Japanese Unexamined Patent Application Publication No. 2021-64811 Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] However, when the chip removal operation using a chip bonder is completed, in order to reuse the expansion retaining ring, an operation of removing the expansion retaining ring from the frame is performed. This removal operation is performed by an operator using a cutting edge such as a knife to cut the cutting tape located between the frame and the lip portion along the lip portion. However, in such a removal operation, there is a case where the lip portion is damaged by the cutting edge.

[0011] The present invention has been made in view of such problems, and an object thereof is to provide an expansion retaining ring removal jig and an expansion retaining ring removal method capable of removing the expansion retaining ring from the frame without damaging the expansion retaining ring.

[0012] Means for Solving the Problems

[0013] In order to achieve the object of the present invention, the expansion retaining ring removal jig of the present invention is used to remove the expansion retaining ring that is fitted and assembled inside the frame in order to maintain the expanded state of the sheet pasted to the annular frame from the frame. The expansion retaining ring removal jig includes: a base member having an annular retaining groove for externally retaining the expansion retaining ring and a sheet support surface provided at a position inside the retaining groove for supporting the sheet that has become in an expanded state through the expansion retaining ring; and a sheet pressing member having a sheet pressing surface provided at a position facing the sheet support surface. The base member has an annular relief groove for avoiding a cutting edge for cutting the sheet at a position inside the retaining groove and outside the pressing position where the sheet is pressed by the sheet pressing surface.

[0014] In one aspect of the present invention, preferably, the sheet support surface and the sheet pressing surface are formed in an annular shape.

[0015] In one aspect of the present invention, preferably, the sheet pressing member is openably and closably mounted on the base member.

[0016] In one aspect of the present invention, preferably, the cutting edge is provided on the sheet pressing member.

[0017] In one aspect of the present invention, preferably, the sheet pressing member has a cutting edge moving mechanism for moving the cutting edge along the relief groove.

[0018] In one aspect of the present invention, preferably, the cutting edge moving mechanism has: a rotating plate rotatably provided on the sheet pressing member, and the cutting edge is moved along the relief groove by rotation; and a guiding member in contact with the outer peripheral portion of the rotating plate and guiding the rotating plate in the rotation direction.

[0019] In order to achieve the object of the present invention, the expansion retaining ring removal method of the present invention is used to remove the expansion retaining ring that is fitted and assembled inside the frame in order to maintain the expanded state of the sheet pasted to the annular frame from the frame. The expansion retaining ring removal method includes: a holding step of holding the expansion retaining ring; a fixing step of clamping the sheet located inside the expansion retaining ring to fix the sheet; a cutting step of cutting the sheet located between the fixing position of the expansion retaining ring and the sheet; and a separating step of separating the expansion retaining ring from the frame.

[0020] Advantages of the Invention

[0021] According to the present invention, the expansion retaining ring can be removed from the frame without damaging the expansion retaining ring. Description of the Drawings

[0022] Figure 1It is a perspective view of the disassembly jig of the embodiment observed from the upper side.

[0023] Figure 2 It is observed from the lower side Figure 1 The perspective view of the disassembly jig shown.

[0024] Figure 3 It is Figure 1 The assembled perspective view of the disassembly jig shown.

[0025] Figure 4 It is Figure 1 The enlarged cross-sectional view of the main part of the disassembly jig shown.

[0026] Figure 5 It is the overall perspective view of the expansion retaining ring.

[0027] Figure 6 It is Figure 5 The assembled perspective view of the expansion retaining ring shown.

[0028] Figure 7 It is Figure 5 The cross-sectional view of the expansion retaining ring shown.

[0029] Figure 8 It is the explanatory view of the wafer unit with a cutting tape.

[0030] Figure 9 It is the explanatory view showing the schematic structure of the workpiece dividing device.

[0031] Figure 10 It is the half cross-sectional view of the disassembly jig of the embodiment.

[0032] Figure 11 It is Figure 10 The enlarged cross-sectional view of part A shown.

[0033] Figure 12 It is Figure 10 The enlarged cross-sectional view of part B shown.

[0034] Figure 13 It is the explanatory view showing the state after the expansion retaining ring is disassembled from the frame.

[0035] Figure 14 It is the flow chart showing an example of the expansion retaining ring disassembly method.

[0036] Explanation of reference numerals:

[0037] 1... Wafer, 2... Wafer unit, 3... Film adhesive material, 4... Cutting tape, 5... Frame, 10... Demounting jig, 12... Base member, 14... Sheet pressing member, 16... Tool, 18... Tool moving mechanism, 20... Base, 22... Main body of base portion, 24... Holding groove, 26... Sheet supporting surface, 28... Step surface, 30... Sheet pressing main body, 32... Cover member, 34... Sheet pressing surface, 36... Protrusion, 38... Avoidance groove, 40... Shaft, 42... Rotating plate, 44... Bearing, 46... Guide roller, 48... Shaft, 50... Guide member, 52... Hinge, 54... Foot, 56... Tool supporting portion, 58... Operation knob, 60... Tube, 62... Coil spring, 70... Workpiece dividing device, 72... Frame fixing portion, 74... Expansion ring, 76... Roller, 100... Expansion holding ring, 102... Ring main body, 104... Lip portion. Detailed implementation mode

[0038] Hereinafter, the implementation mode of the expansion holding ring demounting jig and the expansion holding ring demounting method of the present invention will be described with reference to the drawings.

[0039] Figure 1 FIG. 9 is a perspective view of the expansion holding ring demounting jig (hereinafter referred to as "demounting jig") 10 of the implementation mode viewed from the upper side. Figure 2 Viewed from the lower side Figure 1 FIG. 13 is a perspective view of the demounting jig 10 shown. Figure 3 Is Figure 1 FIG. 17 is an assembled perspective view of the demounting jig 10 shown. Figure 4 Is Figure 1 FIG. 21 is an enlarged cross-sectional view of the main part of the demounting jig 10 shown.

[0040] As Figures 1 to 4 shown, the demounting jig 10 of the implementation mode includes a base member 12, a sheet pressing member 14, a tool 16, and a tool moving mechanism 18.

[0041] Here, an example of the expansion holding ring 100 to be the demounting object of the demounting jig 10 shown in Figures 1 to 4 FIG. 31 will be described. Figure 5 FIG. 33 is an overall perspective view of the expansion holding ring 100. Figure 6 Is Figure 5 FIG. 37 is an assembled perspective view of the expansion holding ring 100 shown. In addition, Figure 7 Is Figure 5 FIG. 41 is a cross-sectional view of the expansion holding ring 100 shown.

[0042] As Figures 5 to 7As shown, the expansion retaining ring 100 includes a ring body 102 and an annular lip 104. The ring body 102 is made of, for example, a resin or metal with high rigidity. Further, the lip 104 is assembled to the outer peripheral surface 102A of the ring body 102 and protrudes outward from the outer peripheral surface 102A of the ring body 102.

[0043] The lip 104 is made of, for example, a resin capable of elastic deformation. As an example of the resin material constituting the lip 104, polypropylene can be cited, but it is not limited to polypropylene, and any resin material with flexibility can be applied. It should be noted that, as the expansion retaining ring, in this example, the expansion retaining ring 100 in which the ring body 102 and the lip 104 are separately formed is illustrated, but it is not limited thereto, and the expansion retaining ring in which the ring body 102 and the lip 104 are integrally formed may also be used.

[0044] Next, an example of the wafer unit 2 to which the expansion retaining ring 100 is applied will be described. Figure 8 It is an explanatory diagram showing an example of the wafer unit 2. Figure 8 VIIIA in is a perspective view of the wafer unit 2. Figure 8 VIIIB in is a cross-sectional view of the wafer unit 2. This wafer unit 2 includes a dicing tape 4 held in an expanded state by the above-described expansion retaining ring 100.

[0045] As Figure 8 shown, the wafer unit 2 has a wafer 1, a film-like adhesive material 3, a dicing tape 4, and a frame 5. The wafer 1 is adhered to the dicing tape 4 having an adhesive layer formed on its surface and having a thickness of about 100 μm through the film-like adhesive material 3. The outer peripheral portion of the dicing tape 4 is adhered to a rigid annular frame 5. Further, the dicing tape 4 has a central portion region 4A having a circular shape in plan view to which the wafer 1 is adhered, and an annular portion region 4B having an annular shape in plan view between the outer edge portion of the central portion region 4A (the outer edge portion of the wafer 1) and the inner edge portion of the frame 5. The wafer 1 is carried into a workpiece dividing device 70 (refer to Figure 9 ) in the state of the wafer unit 2 and is divided into individual chips 6 by the workpiece dividing device 70.

[0046] Figure 9 It is an explanatory diagram showing a schematic structure of the workpiece dividing device 70. Hereinafter, a simple description will be given of the chip dividing operation based on the workpiece dividing device 70.

[0047] First, as Figure 9 shown in IXA of, the frame 5 of the wafer unit 2 is fixed to the frame fixing portion 72 of the workpiece dividing device 70. Next, the expansion ring 74 is raised to push up the annular portion region 4B of the dicing tape 4 from the back surface (the surface opposite to the surface to which the wafer 1 is adhered) side of the dicing tape 4. By the raising operation of the expansion ring 74, the dicing tape 4 is expanded, and the wafer 1 is divided into individual chips 6 (refer toFigure 9 IXB). It should be noted that, on the upper surface of the extension ring 74 that jacks up the annular portion area 4B, a roller 76 is rotatably provided to reduce the frictional force with the annular portion area 4B.

[0048] Next, as shown in Figure 9 IXB, the expansion retaining ring 100 is raised, and the lip 104 is engaged with the surface 5A of the frame 5 via the annular portion area 4B (see Figure 9 IXC). Through the upward movement of the expansion retaining ring 100, the cutting tape 4 is held in an expanded state. Next, as shown in Figure 9 IXC, the extension ring 74 is lowered. At this time, the expansion of the cutting tape 4 by the extension ring 74 is released. Since the expansion retaining ring 100 is engaged and fitted inside the frame 5, it is held in an expanded state without slackening.

[0049] The wafer unit 2 with the cutting tape 4 held in an expanded state by the expansion retaining ring 100 is detached from the frame fixing portion 72, carried into a die bonder (not shown) from the workpiece dividing device 70, and the chip 6 is detached from the cutting tape 4 by the die bonder. It should be noted that, in Figure 3 , the wafer unit 2 from which the chip 6 has been detached is shown. In the wafer unit 2 shown in Figure 3 , the expansion retaining ring 100 (see Figure 9 IXC) is arranged on the back side of the cutting tape 4. This expansion retaining ring 100 is detached from the frame 5 by the detachment jig 10 of the embodiment (see Figure 1 etc.).

[0050] Return Figures 1 to 4 , and continue to describe the detachment jig 10 of the embodiment. The detachment jig 10 has a base member 12, a sheet pressing member 14, a cutter 16, and a cutter moving mechanism 18 as described above.

[0051] The base member 12 is an example of the base member of the present invention. In this example, it has a base 20 and a base portion main body 22 fixed to the base 20. The base 20 is a plate-like body having a rectangular shape in plan view, and a plurality of openings 20A for weight reduction are formed on its surface. The base portion main body 22 is configured in a ring shape and is fixed to the base 20 at a position where the central axis P of the base portion main body 22 coincides with the center of the base 20.

[0052] As shown in Figure 4 , the wafer unit 2 shown in Figure 3 is assembled to the base portion main body 22. It should be noted that, in Figure 4 , a state is shown in which the cutting tape 4 of the wafer unit 2 is pressed against the base portion main body 22 by the sheet pressing member 14 described later and the cutting tape 4 is cut by the cutter 16 for sheet cutting described later.

[0053] As Figure 4 shown, the base portion main body 22 is configured such that the outer diameter of the base portion main body 22 is smaller than the inner diameter of the frame 5 of the wafer unit 2. Further, on the upper surface side of the base portion main body 22, the base portion main body 22 includes: a holding groove 24 that externally fits and holds the expansion holding ring 100; and a sheet support surface 26 that is provided at a position closer to the inside than the holding groove 24 and supports the cutting tape 4 that has been expanded by the expansion holding ring 100. The holding groove 24 and the sheet support surface 26 are each formed in a ring shape centered on the central axis P (see Figure 1 ). Therefore, when the expansion holding ring 100 is externally fitted and held in the holding groove 24, the expansion holding ring 100 is externally fitted and held in the holding groove 24 in a state where the central axis of the expansion holding ring 100 coincides with the central axis P. The holding groove 24 is an example of the holding groove of the present invention, and the sheet support surface 26 is an example of the sheet support surface of the present invention.

[0054] As Figure 4 shown, the holding groove 24 is formed in the outer peripheral portion of the base portion main body 22 and is formed at a position that has been lowered downward by an amount corresponding to the thickness T of the expansion holding ring 100 (ring main body 102) with respect to the above-described sheet support surface 26. Thus, when the expansion holding ring 100 is externally fitted and held in the holding groove 24 in a state where the cutting tape 4 is located above the expansion holding ring 100, the upper surface of the ring main body 102 of the expansion holding ring 100 is coplanar with the sheet support surface 26, and thus the cutting tape 4 is supported on the sheet support surface 26 in a flat state. Further, a stepped surface 28 formed as the inner wall surface of the holding groove 24 is configured as a tapered surface that expands in diameter downward, and the tapered surface of the inner peripheral surface 103 of the ring main body 102 is fitted to this tapered surface. With such a structure, the expansion holding ring 100 is externally fitted and held in the holding groove 24, and the wafer unit 2 is assembled to the base portion main body 22.

[0055] As Figures 1 to 4 shown, the sheet pressing member 14 of this example includes a sheet pressing main body 30 and a cover member 32 that supports the sheet pressing main body 30. The sheet pressing main body 30 is configured in a disc shape. Further, the cover member 32 is configured in a rectangular shape, and an opening 32A is formed in the central portion of the cover member 32, and the later-described tool moving mechanism 18 is disposed so as to be exposed from the opening 32A.

[0056] As Figure 4As shown, the sheet pressing body 30 has an annular sheet pressing surface 34 at a position facing the sheet supporting surface 26. This sheet pressing surface 34 is formed on the lower surface of a convex portion 36 that protrudes annularly at the outer peripheral portion of the lower surface of the sheet pressing body 30. The cutting tape 4 supported by the sheet supporting surface 26 abuts against the cutting tape 4 from above (the side of the cutting tape 4 opposite to the sheet supporting surface 26) through the sheet pressing surface 34, and thus is in a state where the cutting tape 4 is pressed by the sheet pressing surface 34 against the sheet supporting surface 26. The sheet pressing surface 34 is an example of the sheet pressing surface of the present invention.

[0057] As Figure 4 shown, the upper surface of the base body 22 has an annular relief groove 38 for avoiding the tool 16. This relief groove 38 is formed at a position closer to the inside than the holding groove 24 and at a position closer to the outside than the pressing position where the cutting tape 4 is pressed by the sheet pressing surface 34. In addition, the relief groove 38 is formed in an annular shape centered on the central axis P. The relief groove 38 is an example of the relief groove of the present invention.

[0058] Figure 10 is a half-sectional view of the disassembling jig 10. Figure 11 is Figure 10 an enlarged sectional view of part A shown in Figure 12 is Figure 10 an enlarged sectional view of part B shown in. Hereinafter, with reference to Figures 10 to 12 , the structures of the sheet pressing member 14, the tool 16, and the tool moving mechanism 18 will be described in detail.

[0059] As Figure 10 and Figure 11 shown, a shaft 40 protrudes upward at the central portion of the upper surface of the sheet pressing body 30. A rotary plate 42 constituting the tool moving mechanism 18 is mounted on this shaft 40 via a bearing 44. Thus, the sheet pressing body 30 and the rotary plate 42 are connected so as to be relatively rotatable about the shaft 40.

[0060] As Figure 10 and Figure 12As shown, in the rotating plate 42, the outer peripheral portion of the rotating plate 42 is slidably engaged with the guide roller 46. The guide roller 46 is pivotally supported by a shaft 48 protruding downward from the lower surface of the cover member 32. In addition, the guide members 50 having the guide rollers 46 and the shafts 48 are arranged at three locations at equal intervals, for example, at positions on concentric circles centered on the shaft 40. According to such a structure, the sheet pressing body 30 is supported by the cover member 32 via the bearing 44, the rotating plate 42, and the respective guide members 50. In addition, the rotating plate 42 is supported so as to be relatively rotatable about the shaft 40 with respect to the cover member 32. The tool moving mechanism 18 is an example of the cutting edge moving mechanism of the present invention. The rotating plate 42 is an example of the rotating plate of the present invention. The guide member 50 is an example of the guide member of the present invention.

[0061] As Figure 1 and Figure 2 shown, the cover member 32 is pivotally attached to the base 20 via a pair of hinges 52. Thereby, the sheet pressing member 14 is configured to be pivotally opened and closed with respect to the base member 12. In Figure 1 and Figure 2 is shown the state when the sheet pressing member 14 is opened (hereinafter referred to as the open state), and in Figures 10 to 12 is shown the state when the sheet pressing member 14 is closed (hereinafter referred to as the closed state).

[0062] In Figures 10 to 12 the shown closed state, the sheet pressing member 14 is attached to the base 20 at a position where the axis of the shaft 40 coincides with the central axis P of the base body 22. Thereby, in the closed state, the rotating plate 42 rotates about the central axis P. Therefore, the rotating plate 42 in the closed state rotates about the central axis of the expansion retaining ring 100 with respect to the wafer unit 2 assembled to the base body 22. It should be noted that, as Figure 2 shown, feet 54 protrude downward from the lower surface of the cover member 32. The feet 54 are arranged at four locations at equal intervals at positions on concentric circles centered on the shaft 40. Each foot 54 abuts against the upper surface of the base 20 in the above-described closed state. Thereby, the closed state of the sheet pressing member 14 is stably maintained.

[0063] As Figure 10 and Figure 12As shown, a tool 16, which is an example of a cutting edge of the present invention, is mounted on the outer peripheral portion of a rotating plate 42. Further, the tool 16 is mounted on the rotating plate 42 at a position where the lower end 16A of the tool 16 can be inserted into the relief groove 38 of the base portion main body 22 in the closed state. Specifically, the distance from the axis 40 in the radial direction of the rotating plate 42 to the tool 16 is set to the distance from the central axis P in the radial direction of the base portion main body 22 to the relief groove 38 (for example, the central position of the relief groove 38). According to such a structure, the tool 16 moves toward the relief groove 38 as the sheet pressing member 14 moves from the open state to the closed state, and the lower end 16A is inserted into the relief groove 38 in the closed state. That is, as Figure 4 shown, when the expansion retaining ring 100 is externally fitted and held in the holding groove 24 of the base portion main body 22, the cutting tape 4 on the relief groove 38 located inside the expansion retaining ring 100 is punctured by the lower end 16A of the tool 16.

[0064] As Figure 12 shown, the tool 16 is connected to an operation knob 58 via a tool support portion 56. The tool support portion 56 is inserted and disposed in a tube 60 that penetrates and is disposed in the opening 42A of the rotating plate 42, and is mounted so as to be movable along the axial direction of the tube 60. It should be noted that the axial direction of the tube 60 is parallel to the central axis P (refer to Figure 1 ). Further, the tool support portion 56 is supported by the tube 60 via a coil spring 62 disposed in the tube 60. Figure 12 The tool 16 shown in

[0065] shows a state in which the lower end 16A protrudes downward from the lower opening of the tube 60 by a pressing operation indicated by an arrow C of the operation knob 58. However, in a state where the operation knob 58 is not pressed, the entire tool 16 is housed in the tube 60 due to the force of the coil spring 62. Therefore, the tool 16 of this example is inserted into the relief groove 38 by pressing the operation knob 58 after the sheet pressing member 14 is brought into the closed state. Figure 14 Next, an example of a method for disassembling the expansion retaining ring based on the disassembly jig 10 configured as described above will be described with reference to the flowchart shown in

[0066] First, as Figure 1 and Figure 2 shown, the sheet pressing member 14 is brought into the open state, and the wafer unit 2 shown in Figure 3 is assembled to the base portion main body 22. That is, as Figure 4 shown, the expansion retaining ring 100 is externally fitted and held in the holding groove 24 (holding step: S10).

[0067] Next, the sheet pressing member 14 is closed (changed from the open state to the closed state) using the hinge member 52. By this operation, the cutting tape 4 located inside the expansion retaining ring 100 is clamped and fixed between the sheet support surface 26 and the sheet pressing surface 34 (fixing step: S20). As a result, the expansion retaining ring 100 is fixed to the base member 12. It should be noted that in this state, since the operation knob 58 is in the state before the pressing operation, the entire cutter 16 is housed in the tube 60. Then, when the operation knob 58 is pressed, the cutter 16 protrudes downward from the lower opening of the tube 60 against the force of the coil spring 62. Thereby, the cutting tape 4 on the avoidance groove 38 is punctured by the lower end 16A of the cutter 16 (refer to Figure 4 and Figure 12 ).

[0068] Next, in the state where the operation knob 58 has been pressed, the operation knob 58 is rotated about the shaft 40 (central axis P) using the cutter moving mechanism 18. At this time, the sheet pressing body 30 that presses the cutting tape 4 against the sheet support surface 26 does not rotate, while the rotating plate 42 rotates about the shaft 40 (central axis P). Thereby, the cutter 16 moves along the avoidance groove 38 in the state of being inserted into the avoidance groove 38. By this moving operation of the cutter 16, the cutting tape 4 between the fixed position of the expansion retaining ring 100 and the cutting tape 4 (the position of the sheet support surface 26) is cut into a circle along the avoidance groove 38. Then, after the operation knob 58 is rotated one full turn, the rotation operation of the operation knob 58 is stopped. As a result, the cutting tape 4C (refer to Figure 4 ) located inside the avoidance groove 38 is cut off from the cutting tape 4D (refer to Figure 4 ) located at a position outside the avoidance groove 38 (cutting step: S30).

[0069] Next, the pressing operation of the operation knob 58 is released, and the entire cutter 16 is housed in the tube 60. Then, the sheet pressing member 14 is opened (changed from the closed state to the open state). At this time, since the cutting tape 4C located inside the avoidance groove 38 adheres to the sheet pressing surface 34, by the operation of opening the sheet pressing member 14, the cutting tape 4C is cut off upward relative to the cutting tape 4D. Thereby, a circular opening corresponding to the size of the cutting tape 4C is formed in the cutting tape 4.

[0070] Next, the frame 5 at the position of Figure 4 is pressed downward from the position of Figure 4 . Then, as shown in Figure 13As shown in the enlarged cross-sectional view of the main part, the cutting tape 4D is pressed together with the frame 5, and the cutting tape 4D and the frame 5 are separated from the expansion retaining ring 100. That is, the expansion retaining ring 100 is separated from the frame 5 (separation step: S40). Then, the expansion retaining ring 100 externally fitted in the retaining groove 24 is removed from the retaining groove 24 (removal step: S50). Through this series of operations, the expansion retaining ring 100 can be removed from the frame 5. In addition, since the structure of using the cutter 16 to cut the cutting tape 4C located inside the expansion retaining ring 100 is adopted, the expansion retaining ring 100 can be removed from the frame 5 without damaging the expansion retaining ring 100 (especially the lip 104).

[0071] As described above, according to the disassembly jig 10 of the embodiment, since the following structure is adopted, that is, it includes a base member 12 and a sheet pressing member 14, and in the base member 12, a ring-shaped avoidance groove 38 for the cutter 16 to avoid is provided at a position inside the retaining groove 24 and outside the pressing position where the cutting tape 4 is pressed by the sheet pressing surface 34, the expansion retaining ring 100 can be removed from the frame 5 without being damaged by the cutter 16. In addition, the expansion retaining ring 100 can be removed from the frame 5 without damaging the frame 5 by the cutter 16.

[0072] Hereinafter, several modification examples of the disassembly jig 10 of the embodiment will be described.

[0073] <First modification example>

[0074] In the disassembly jig 10 of the embodiment, the sheet support surface and the sheet pressing surface are described by taking the ring-shaped sheet support surface 26 and the sheet pressing surface 34 as examples, but it is not limited thereto. For example, they may be formed in an arc shape or a straight shape in plan view. However, from the viewpoint of reliably pressing the cutting tape 4 between the sheet support surface 26 and the sheet pressing surface 34, it is preferable that the shapes of the sheet support surface 26 and the sheet pressing surface 34 are ring-shaped respectively.

[0075] 〈Second modification example>

[0076] In the disassembly jig 10 of the embodiment, the avoidance groove is described by taking the ring-shaped avoidance groove 38 as an example, but it is not limited thereto. For example, it may also be formed in a polygonal ring shape. In addition, it is not limited to a ring shape (a circular ring shape and a polygonal ring shape), and it may also be a shape in which a part (one or more places) of the ring shape is not connected, such as a C-shaped avoidance groove.

[0077] 〈Third modification example>

[0078] In the disassembly jig 10 of the embodiment, the structure in which the sheet pressing member 14 is pivotally attached to the base member 12 has been described as an example, but it is not limited thereto, and the sheet pressing member 14 and the base member 12 may be separated. However, by adopting the structure in which the sheet pressing member 14 is pivotally attached to the base member 12, the pressing operation of the sheet pressing member 14 on the cutting tape 4 becomes easy.

[0079] <Fourth Modification Example>

[0080] In the disassembly jig 10 of the embodiment, the structure in which the cutting tool 16 is provided on the sheet pressing member 14 has been described as an example, but it is not limited thereto, and the sheet pressing member 14 and the cutting tool 16 may be separated. However, by adopting the structure in which the cutting tool 16 is provided on the sheet pressing member 14, the cutting tool 16 can be treated as a part of the sheet pressing member 14, and thus the treatment of the cutting tool 16 becomes easy.

[0081] <Fifth Modification Example>

[0082] In the disassembly jig 10 of the embodiment, the structure in which the cutting tool moving mechanism 18 is provided on the sheet pressing member 14 has been described as an example, but it is not limited thereto, and the cutting tool moving mechanism may not be provided, and the cutting tool 16 may be operated independently to cut the cutting tape 4. However, by adopting the structure in which the cutting tool moving mechanism 18 is provided on the sheet pressing member 14, the cutting of the cutting tape 4 becomes easy.

[0083] <Sixth Modification Example>

[0084] In the disassembly jig 10 of the embodiment, an annular relief groove 38 for avoiding the cutting tool 16 is provided on the upper surface of the base portion main body 22, but an exchangeable annular cutting tool pad may be provided instead of the relief groove 38. In the sixth modification example, even for the soft cutting tape 4 that retreats into the relief groove 38 when the cutting tool 16 is to be used to form a cut, the retreat of the cutting tape 4 can be suppressed by the cutting tool pad, and thus the cutting can be easily performed by the cutting tool 16.

[0085] As described above, an example of the disassembly jig for the expansion retaining ring of the present invention has been described, but the technology of the present invention is not limited to the embodiment, and several improvements or modifications may be made without departing from the gist of the present invention.

Claims

1. An expansion retaining ring removal jig for removing an expansion retaining ring fitted and assembled inside a frame in a state of holding a sheet in an expanded state for retaining the sheet adhered to the ring-shaped frame, wherein the expansion retaining ring removal jig includes: a base member having an annular retaining groove for externally retaining the expansion retaining ring and a sheet support surface provided at a position inside the retaining groove for supporting the sheet that is in an expanded state through the expansion retaining ring; and a sheet pressing member having a sheet pressing surface provided at a position opposed to the sheet support surface, wherein the base member has an avoidance groove for avoiding a cutting edge for cutting the sheet at a position inside the retaining groove and outside a pressing position where the sheet is pressed by the sheet pressing surface.

2. The expansion retaining ring removal jig according to claim 1, wherein the sheet support surface, the sheet pressing surface, and the avoidance groove are formed in an annular shape.

3. The expansion retaining ring removal jig according to claim 1 or 2, wherein the sheet pressing member is openably and closably mounted on the base member.

4. The expansion retaining ring removal jig according to claim 1 or 2, wherein the cutting edge is provided on the sheet pressing member.

5. The expansion retaining ring removal jig according to claim 4, wherein the sheet pressing member has a cutting edge moving mechanism for moving the cutting edge along the avoidance groove.

6. The expansion retaining ring removal jig according to claim 5, wherein the cutting edge moving mechanism includes: a rotating plate rotatably provided on the sheet pressing member and moving the cutting edge along the avoidance groove by rotation; and a guiding member in contact with an outer peripheral portion of the rotating plate and guiding the rotating plate in a rotating direction.

7. An expansion retaining ring removal method for removing an expansion retaining ring fitted and assembled inside a frame in a state of holding a sheet in an expanded state for retaining the sheet adhered to the ring-shaped frame, wherein the expansion retaining ring removal method includes: a holding step of holding the expansion retaining ring; a fixing step of clamping the sheet located inside the expansion retaining ring to fix the sheet; a cutting step of cutting the sheet located between the expansion retaining ring and the fixing position of the sheet; and a separating step of separating the expansion retaining ring from the frame.

Images