A method for quickly feeding a circuit flow line for PCB substrates

Abstract

The application discloses a method for loading circuit pipeline feeding of PCB substrates, and designs a feeding device which can be stacked into a stacked PCB substrate, can automatically remove the release paper between the PCB substrates, and then feeds the PCB substrates to the pipeline. Before the PCB substrates are implemented vacuum packaging, the stacked PCB substrates are stacked into a preset mode according to the working mode of the feeding device, and the stacked mode is kept until the feeding device is used. In this way, compared with the prior art, the PCB substrates do not need to be manually placed on the layer plate of the feeding box one by one, and all release paper boards can be automatically removed. Meanwhile, compared with the prior art, the complicated feeding box circulating rotation track setting is omitted, and the manufacturing and maintenance costs of the whole PCB substrate feeding device are significantly reduced.

Description

Technical Field

[0001] This invention relates to a method for feeding circuitry onto a PCB substrate in a production line, belonging to the technical field of PCB substrate loading circuitry production line feeding. Background Technology

[0002] Modern electronic products cannot function without PCB substrates. Not only can various circuits be directly mounted on them, but also chips containing large-scale integrated circuits can be attached and connected to the corresponding circuits to give them specific functions.

[0003] The PCB substrate is manufactured in a cleanroom and vacuum-packed to ensure a clean environment during storage and transportation. The PCB substrate circuit loading and injection molding processes are also completed in a cleanroom.

[0004] The PCB substrates are packaged in multiple pieces together, with release paper used between adjacent PCB substrates to prevent the pressure generated by vacuum packaging from causing the two PCB substrates to immerse and stick together.

[0005] When PCB substrates are loaded with circuitry onto the production line, one traditional method involves unpacking the vacuum packaging and manually inserting stacks of PCB substrates one by one into a multi-layered loading bin. The loading bin is then placed in a dedicated upper and lower circulation channel, gradually rising in the lower channel. A ejector mechanism then launches one PCB substrate from one of the layers, which is on the same plane as the production line, onto the production line. The production line has two drive chains, left and right. The process edges on both sides of the PCB substrates entering the production line rest on these two drive chains, moving forward with them. As the loading bin rises, the ejector mechanism continuously launches PCB substrates onto the production line. Another traditional method uses a stacking machine, which automatically places the PCB substrates one by one onto the production line. However, this equipment cannot remove the release liner.

[0006] From the completion of PCB substrate fabrication to the loading of circuits onto the PCB substrate and its entry into the production line, the traditional technical solutions used for vacuum packaging, unpacking, boxing, and loading onto the production line have the following drawbacks:

[0007] 1. Manual packing is slow and inefficient. With a large number of PCB substrates, manually loading them one by one into the loading bin is too time-consuming. Fully automated intelligent packing would be too costly and unsuitable for small and medium-sized enterprises.

[0008] Second, the feeding circulation channel has a complex structure and high manufacturing and maintenance costs.

[0009] Third, the single-use of vacuum packaging bags and release paper leads to waste. PCB substrates are widely used products in the electronics industry, with a very large quantity used. From the upstream manufacturer's completion of production to the downstream manufacturer's loading of circuits, vacuum packaging and release paper are used to separate the process. The single-use and discarded vacuum packaging bags and release paper cause serious waste.

[0010] Fourth, the stacking machine cannot remove the release paperboard between the two layers.

[0011] Through searching, a large number of patent documents were found that improved the PCB substrate feeding mechanism, but none of the improvement directions involved the above-mentioned problems. Two of them are selected here for explanation.

[0012] Application number 202211732510.9, entitled "An Automatic PCB Loading and Unloading Machine for Use with Multiple Clip-Type Fixtures," relates to an automatic PCB loading and unloading machine for use with multiple clip-type fixtures. It includes a PCB feeding mechanism and a fixture loading and unloading lifting mechanism. The PCB feeding mechanism controls a push rod to move between different clip-type fixtures, pushing the PCB board into the fixture from the side. The fixture loading and unloading lifting mechanism controls the up-and-down movement of multiple parallel clip-type fixtures, facilitating the PCB feeding mechanism to select different slots within the same fixture. This automatic PCB loading and unloading machine can adapt to multiple clip-type fixtures and provides fully automatic loading and unloading of carriers and fixtures, successfully solving the problems of low efficiency caused by manual loading and applicability to single clip-type fixtures in existing equipment. During PCB feeding, the circuit boards are stored in the PCB carrier. The PCB board is removed from the carrier using a carrier opening and combination mechanism and a suction cup loading and unloading mechanism, and then transferred to the PCB feeding mechanism, ensuring that the circuit boards are not damaged.

[0013] Application number 202310551836.X, entitled "A Lead-Free Soldering System and Equipment for Circuit Boards," relates to the field of circuit board processing technology, specifically a lead-free soldering system and equipment for circuit boards. The system includes a workbench, a fixed frame, a soldering tank on the workbench, a lifting frame, two symmetrically sliding rotating rods on the inner wall of the soldering tank, a rotating plate rotatably mounted on the side of the carrying rack near the lifting frame, and an inclined surface on the workbench. A feeding assembly includes a rotating tube rotatably mounted on one side of the material box, with a first piston tube on the connecting plate. A guiding assembly includes movable plates movably disposed on both sides of the workbench, with guide plates fixedly mounted on the adjacent sides of the two movable plates. This solution features a feeding assembly on one side of the workbench. The rotating tube drives a suction cup to rotate between the material box and the workbench, transferring the circuit board material from the material box to the workbench, replacing manual feeding and improving feeding efficiency. Additionally, the inclined surface on the workbench allows the soldered circuit board material to slide down to the recycling rack under gravity, achieving automatic unloading.

[0014] As with all the patent documents found in the search, the two patents mentioned above both involve PCB substrate loading, but neither of them can solve the three problems mentioned above. Summary of the Invention

[0015] The technical problem to be solved by the present invention is: how to start from packaging after the PCB substrate is processed, and how to simply and quickly put the PCB substrate (33) into the conveyor belt of the loading circuit production line, and at least make the release cardboard reusable.

[0016] To address the above problems, the technical solution proposed by this invention is as follows:

[0017] A method for feeding circuitry onto a PCB substrate in a production line involves designing a feeding device capable of stacking PCB substrates, automatically removing release paper from the PCB substrates, and feeding the substrates into sections on the production line. Before vacuum sealing the PCB substrates, the feeding device stacks the PCB substrates into a preset pattern according to its operating mode and maintains this stacking pattern until the substrates are packaged and used by the feeding device.

[0018] Furthermore, a feeding device is designed, which includes a frame with a platform and a material box on the frame. A cardboard drop opening with vertical communication is provided on the frame under the material box, and a substrate sliding opening is provided at the front end of the cardboard drop opening.

[0019] The material box is set as a rectangular frame with open top and bottom, the cardboard drop opening is set as a rectangle, and process edge side facades for side-standing the process edges of the two ends of the PCB substrate are symmetrically set on the upper surface of both sides of the cardboard drop opening; several vertical substrate partition slots with facing slots are symmetrically set on both sides of the material box for inserting the process edges of the two ends of the PCB substrate to the process edge side facades from top to bottom, so that all substrate partition slots have equal width, and there is a partition plate between two adjacent substrate partition slots, so that the substrate partition slots can have two states of width and narrowness.

[0020] Position the cardboard drop outlet directly below the partition plates on both sides of the hopper;

[0021] This allows the hopper to move continuously forward and pass directly above the substrate drop opening.

[0022] Furthermore, the substrate partition groove is configured to have two variable states, wide and narrow, by setting an end plate at the rear end of the material box, fixing sliding shaft plates extending forward at both ends of the front side of the end plate, the plate surface of which is perpendicular to both the end plate and the table surface, and setting a sliding shaft hole in the center of the partition plate for the sliding shaft plate to pass through and slide. Several partition plates are threaded onto the sliding shaft plate through the sliding shaft hole, and elastic elements are interspersed in the middle area between two adjacent partition plates, so that the outer area between two adjacent partition plates forms the substrate partition groove. The elastic element can be a spring or a rubber block with a sliding shaft hole in the middle. By compressing and releasing the elastic element, the substrate partition groove can be configured to have two states, wide and narrow.

[0023] Furthermore, to accommodate the pre-set stacking pattern of the PCB substrates in the feeding device, the release paper between two adjacent PCB substrates is made into a recyclable and reusable release paperboard with a fixed shape; the release paperboard is only pressed onto the circuit loading surface between the process edges at both ends of the PCB substrate, so that an alternating groove is formed between the adjacent process edges at both ends of the two adjacent PCB substrates. When the substrate partition groove is in a narrow state, the width of the substrate partition groove plus the thickness of the partition plate is equal to the thickness of the PCB substrate plus the thickness of the release paperboard in the stacked state; the PCB substrates and release paperboard are stacked into a rectangular stack.

[0024] Furthermore, a stacking device is designed according to the stacking style of the PCB substrate. The stacking device includes a designed retainer, which includes clamping members at both ends and clamping members on both sides. The clamping members at both ends include a rectangular fixed end plate and a movable end plate located at both ends of the retainer. The clamping members on both sides are four parallel clamps, including an upper left clamp, a lower left clamp, an upper right clamp, and a lower right clamp. One end of each of the four clamps is fixed to the four corners of the fixed end plate. The four corners of the movable end plate have sliding holes that can pass through the four clamps, including an upper left sliding hole, a lower left sliding hole, an upper right sliding hole, and a lower right sliding hole. The movable end plate can slide at the other end of the four clamps through the four sliding holes and can be releasably locked at a set position.

[0025] Furthermore, the above method includes the following steps:

[0026] Step 1: Stacking PCB substrates: Stack the PCB substrates in the holder with one release cardboard piece between each substrate. The upper left clamp, lower left clamp, upper right clamp, and lower right clamp hold the two sides of the circuit loading surface of the PCB substrates respectively, so that the process edges at the top and bottom are exposed. Then, use the movable end plate to press the stacked PCB substrates against the fixed end plate and lock the movable end plate in a releasable manner to keep the stacked PCB substrates in the stacked style.

[0027] Step 2, Vacuum Packaging: Vacuum pack the stacked PCB substrates in packaging bags;

[0028] Step 3: Loading materials into the hopper, including the following sub-steps:

[0029] 1) The substrate partition groove is narrowed by compressing the elastic element;

[0030] 2) Remove the vacuum packaging bag;

[0031] 3) Place the stacked PCB substrates into the material box while maintaining the stacked arrangement. Before placing them, rotate the stacked PCB substrates so that the upper left clamp and lower left clamp are at the bottom, and the upper right clamp and lower right clamp are at the top. When placing them, insert the process edges at both ends of each PCB substrate into the corresponding substrate partition slots on both sides of the material box from top to bottom until they fall on the process edge side surface below the substrate partition slot. The edge of the partition plate is inserted into the alternating slot between adjacent process edges.

[0032] 4) Loosen the movable end plate of the cage and remove the cage;

[0033] Step 4: Remove the release liner: Release the elastic element to widen the substrate partition groove, and the release liner between the PCB substrates will lose its clamping constraint and fall naturally under the action of gravity.

[0034] Step 5: Feed the PCBs in sections and push the hopper forward at a constant speed so that the PCBs at the front end that reach the substrate drop port slide down onto the conveyor belt under the action of gravity.

[0035] Furthermore, the releasable locking of the movable end plate described in step one is designed so that the movable end plate is formed by a mechanism setting plate and a cover plate. On the lower side of the upper left sliding hole and the upper right sliding hole of the mechanism setting plate, and on the upper side of the lower left sliding hole and the upper right sliding hole, respectively, there are upper locking block grooves and lower locking block grooves perpendicular to the sliding holes. The upper locking block groove and the lower locking block groove have slot openings on the same side of the mechanism setting plate. The upper locking block groove and the lower locking block groove have elongated upper locking blocks and lower locking blocks, respectively. The upper side of the upper locking block and the lower side of the lower locking block have locking protrusions. The lower side of the upper left clamp and the upper right clamp, and the upper side of the lower left clamp and the lower right clamp all have locking notches that allow the locking protrusions to be inserted.

[0036] Furthermore, the upper and lower locking blocks have push-pull ends that can expose the slot opening, and exposed soft rope tripping is provided at the end of the push-pull end.

[0037] Furthermore, the compression and release elastic elements are implemented, including the following settings:

[0038] A rectangular frame is provided that surrounds the material box from the outside and has an opening at the front end. The rectangular frame consists of a push plate at the rear end, side plates fixed to the push plate at right angles at both ends, and a scaling plate that is folded back at the front ends of the two side plates to press the frontmost partition plate of the material box backward. The opening is located between the two scaling plates and is used to place and remove the retainer.

[0039] A baffle is fixedly installed on the table behind the cardboard drop outlet to prevent the material box from moving backward. The baffle is a hollow rectangular frame, with the upper and lower frame edges of the baffle pressing against the end plate of the material box.

[0040] An electric cylinder is installed at the rear end of the platform plate, and its electric push rod is fixedly connected to the push plate.

[0041] When the electric actuator pulls the rectangular frame backward, its rear end can pass through the hollow space of the retaining frame, and its two front-end scaling plates can simultaneously compress the elastic elements between all the partition plates; conversely, the elastic elements are released.

[0042] Furthermore, the step of compressing the elastic element to make the substrate partition groove narrow is achieved by providing a limiting block on one side of the partition plate, the thickness of which is equal to the width of the substrate partition groove when it is narrow.

[0043] Furthermore, the stacked PCB substrate described in step one is stacked by further setting up a clamping device in the stacking device and using a clamping device that cooperates with the retainer. The clamping device includes a platform and a stacking sub-frame set on the platform that cooperates with the retainer. The stacking sub-frame includes a fixed upright plate and four sub-clamps. The four sub-clamps include an upper left sub-clamp, a lower left sub-clamp, an upper right sub-clamp, and a lower right sub-clamp. The rear ends of the four sub-clamps are fixed to the fixed upright plate on the platform, and the front ends are respectively connected to the four clamps, so that the movable end plate can slide from the four clamps through the four sub-clamps to be in contact with the fixed upright plate. Guide holes are provided at the ends of the four clamps facing the sub-clamps, and cone tips that can be inserted into the guide holes to achieve connection with the clamps are provided at the ends of the sub-clamps facing the clamps.

[0044] Furthermore, a rectangular recessed substrate side support pool is provided on the platform, such that the depth of the substrate side support pool is equal to the width of the PCB substrate process edge, and the width of the substrate side support pool is equal to the width between the lower left clamp and the lower right clamp.

[0045] Furthermore, the four corners of the release liner are cut into right-angle notches that can be inserted into the four clamps respectively, so that the release liner can be restricted between the four clamps through the right-angle notches at the four corners and can slide on the clamps and the auxiliary clamps.

[0046] Furthermore, the stacked PCB substrate described in step one includes the following steps:

[0047] S1. Connect the retainer to the stacking sub-frame so that the substrate side stand pool is located directly below the lower left clamp and the lower right clamp;

[0048] S2. Slide the movable end plate from the four clamps through the four auxiliary clamps until it is in contact with the fixed upright plate;

[0049] S3. Insert all the release paperboards into the four clamps according to the quantity, and push all the release paperboards towards the movable end plate, leaving stacking operation space between the four clamps at the fixed end plate.

[0050] S4. Insert a PCB substrate downwards from between the upper left and upper right clamps to the bottom of the substrate side stand pool, so that the lower edge of the PCB substrate is in the substrate side stand pool and the upper edge of the PCB substrate is above the upper left and upper right clamps; slide a release cardboard to be in contact with the PCB substrate, and then insert another PCB substrate. Repeat this process until the required number of PCB substrates are installed.

[0051] S5. Push the movable end plate to the ends of the four clamps, press the stacked PCB substrates together, and lock the movable end plate by using the upper and lower locking blocks.

[0052] Furthermore, step S5, which involves pushing the movable end plate to the ends of the four clamping bars to press the stacked PCB substrates together, is achieved through the following settings:

[0053] A movable upright plate and its push cylinder are set on the platform, which are corresponding to the fixed upright plate. The movable upright plate is connected to the push rod of the push cylinder, so that the push cylinder can push or retract the movable upright plate relative to the fixed upright plate.

[0054] A push plate and its electric propulsion cylinder are installed on the platform behind the fixed upright plate. The push plate is connected to the electric propulsion rod of the electric propulsion cylinder. A window is provided on the fixed upright plate for the push plate to pass through. The push plate can push the movable end plate to slide towards the fixed end plate through the window. Beneficial effects

[0055] 1. It can directly put a stack of PCB substrates (more than 100 pieces) into the material box at one time, unlike existing technologies that require manual placement of PCB substrates one by one on the shelves of the material box. It can also automatically remove all release paper, while existing automatic feeding devices (such as automatic stacking machines) cannot automatically remove release paper.

[0056] 2. The structure of the feeding device is greatly simplified. Compared with the existing technology, the complex material box circulation and rotation track setting is eliminated, which significantly reduces the manufacturing and maintenance cost of the entire PCB substrate 33 feeding device;

[0057] 3. Release paperboard can be reused multiple times, which is more in line with the requirements of energy conservation and environmental protection compared to the single-use release paper of existing technologies;

[0058] 4. The installation of the stacking device does not increase the workload or labor intensity compared to the existing stacking method. Attached Figure Description

[0059] Figure 1 This is a three-dimensional schematic diagram of the feeding device, with arrow F1 pointing in the direction of forward.

[0060] Figure 2 This is a three-dimensional schematic diagram of a partial structure of the feeding device, mainly showing the end plate and sliding shaft plate in the material box;

[0061] Figure 3 This is a three-dimensional schematic diagram of a partial structure of the feeding device, mainly showing the baffle and other components.

[0062] Figure 4 This is a three-dimensional schematic diagram of the rectangular frame;

[0063] Figure 5 for Figure 1 A partial schematic diagram;

[0064] Figure 6 This is a three-dimensional schematic diagram of the partition plate and the elastic element;

[0065] Figure 7 This is a three-dimensional schematic diagram of the feeding device, showing the rectangular frame being pulled back and the substrate partition groove being in a narrow state.

[0066] Figure 8 This is a top view of the material bin;

[0067] Figure 9 This is a top view of the stacked PCB substrates placed into the material box when the substrate partition slots of the material box are in a narrow state.

[0068] Figure 10 for Figure 9 A partial schematic diagram;

[0069] Figure 11 This is a three-dimensional schematic diagram of the PCB substrate stacking device, with arrow F2 pointing to the left;

[0070] Figure 12 This is a three-dimensional schematic diagram of the cage;

[0071] Figure 13 A three-dimensional schematic diagram of the unconnected retainer of the PCB substrate stacking device;

[0072] Figure 14 for Figure 11 A partial schematic diagram;

[0073] Figure 15 This is a three-dimensional schematic diagram of the movable end plate (502);

[0074] Figure 16 A three-dimensional schematic diagram of the plate structure provided for the mechanism;

[0075] Figure 17 A three-dimensional schematic diagram of a portion of the structure of the plate for the mechanism;

[0076] Figure 18 for Figure 17 A partial schematic diagram;

[0077] Figure 19 A three-dimensional schematic diagram showing how a PCB substrate is held in a pre-defined stacked shape by a retainer;

[0078] Figure 20 for Figure 19 A partial schematic diagram;

[0079] Figure 21 This is a three-dimensional schematic diagram of the PCB substrate;

[0080] Figure 22 This is a three-dimensional schematic diagram of the release linerboard.

[0081] In the diagram: 1. Stand; 101. Stand plate; 2. Material box; 201. End plate; 202. Sliding plate; 203. Divider plate; 204. Limiting block; 205. Elastic element; 206. Base plate dividing groove; 3. Rectangular frame; 301. Push plate; 302. Side plate; 303. Scaling plate; 304. Opening; 4. Bracket; 401. Hollow space; 5. Holder; 501. Fixed end plate; 502. Movable end plate End plate; 6. Clamps; 601. Upper left clamp; 602. Lower left clamp; 603. Upper right clamp; 604. Lower right clamp; 7. Sliding holes; 701. Upper left sliding hole; 702. Lower left sliding hole; 703. Upper right sliding hole; 704. Lower right sliding hole; 8. Sub-clamps; 801. Upper left sub-clamp; 802. Lower left sub-clamp; 803. Upper right sub-clamp; 804. Lower right sub-clamp; 9. Mechanism Setting plate; 901, upper locking block groove; 902, lower locking block groove; 903, groove opening; 10, cover plate; 11, upper locking block; 12, lower locking block; 13, locking protrusion; 14, locking notch; 15, push-pull end; 16, soft rope trip; 17, platform; 18, stacked sub-frame; 19, fixed upright plate; 191, window; 20, movable upright plate; 21, base plate side upright pool; 22, push plate; 23, guide hole; 24, cone 25. Electric propulsion cylinder; 251. Electric propulsion rod; 26. Propulsion cylinder; 261. Propulsion rod; 27. Cardboard drop port; 28. Substrate drop port; 29. ​​Process edge side elevation; 30. Sliding shaft hole; 31. Electric cylinder; 32. Electric push rod; 33. PCB substrate; 331. Circuit loading surface; 332. Process edge; 34. Interphase groove; 35. Release cardboard; 351. Right angle notch; 100. Conveyor belt. Detailed Implementation

[0082] like Figure 21 As shown, the PCB substrate described in this application is rectangular and has process edges 332 at at least at both ends for clamping during processing. The width of the process edges 332 is generally 4-6mm. Between the process edges at both ends is the circuit loading surface 331 for loading ordinary circuits and large-scale integrated circuits.

[0083] This application uses the terms "front," "back," "left," and "right" in many places to describe the orientation, which all refer to the orientation of the view and not the actual orientation of the object.

[0084] The present invention will now be further described with reference to the accompanying drawings:

[0085] like Figure 1 , 9 As shown, a method for feeding circuit boards onto a PCB substrate production line involves designing a feeding device capable of stacking PCB substrates 33, automatically removing the release paper between the layers of the PCB substrates 33, and feeding them piece by piece onto the production line. Before vacuum sealing, the feeding device stacks the PCB substrates 33 into a preset pattern and maintains this stacking pattern until they are packaged for use. This eliminates the need for manual placement of each PCB substrate 33 onto the shelves of the material bin, and automatically removes all release paper 35. More importantly, compared to existing technologies, it eliminates the need for complex material bin circulation and rotation track settings, significantly reducing the manufacturing and maintenance costs of the entire PCB substrate feeding device.

[0086] The above design provides a feeding device, which includes a frame 1 with a frame plate 101 and a material box 2 on the frame 1. A cardboard drop port 27 with vertical communication is provided on the frame plate 101 below the material box 2, and a substrate sliding port 28 is provided at the front end of the cardboard drop port 27.

[0087] like Figure 1 , 2 As shown in Figures 5, 7, 9, and 10, the material box is set as a rectangular frame with open top and bottom. The cardboard drop opening 27 is set as a rectangle, and process edge side facades 29 for side-standing the process edges 332 at both ends of the PCB substrate 33 are symmetrically set on the upper surface of both sides of the cardboard drop opening 27. Several vertical substrate partition slots 206 with facing slots are symmetrically set on both sides of the material box 2 for inserting the process edges 332 at both ends of the PCB substrate 33 to the process edge side facades 29 from top to bottom. All substrate partition slots 206 are of equal width, and a partition plate 203 is placed between two adjacent substrate partition slots 206, so that the substrate partition slots 206 can have two states of width and narrowness, the function of which will be further described later.

[0088] Position the cardboard drop opening 27 directly below the partition plates 203 on both sides of the material box 2;

[0089] This allows the material bin 2 to move forward continuously and pass directly above the substrate drop opening 28.

[0090] To enable the substrate partition groove 206 to have two variable widths, an end plate 201 is provided at the rear end of the material box 2. Sliding shaft plates 202, which extend forward and whose surfaces are perpendicular to both the end plate 201 and the table surface, are fixed at both ends of the front side of the end plate 201. A sliding shaft hole 30 is provided in the center of the partition plate 203 for the sliding shaft plate 202 to pass through and slide. Several partition plates 203 are threaded onto the sliding shaft plate 202 through the sliding shaft hole 30. Elastic members 205 are interspersed in the middle area between two adjacent partition plates 203, so that the outer area between two adjacent partition plates 203 forms the substrate partition groove 206. The elastic member can be a spring or a rubber block with a sliding shaft hole 30 in the middle. By compressing and releasing the elastic member 205, the substrate partition groove 206 can be changed to either a wide or narrow state.

[0091] like Figure 5 , 10 As shown in Figures 19, 20, 21, and 22, to accommodate the pre-set stacking pattern of the PCB substrates 33 in the feeding device, the release paper between two adjacent PCB substrates 33 is made into a recyclable and reusable release paperboard 35 with a fixed shape; the release paperboard 35 is only pressed onto the circuit loading surface 331 between the process edges 332 at both ends of the PCB substrates 33, so that an alternating groove 34 is formed between the adjacent process edges 332 at both ends of the two adjacent PCB substrates 33. When the substrate partition groove 206 is in a narrow state, the width of the substrate partition groove 206 plus the thickness of the partition plate 203 is equal to the thickness of the PCB substrate 33 plus the thickness of the paperboard in the stacked state; the PCB substrates 33 and the release paperboard 35 are stacked into a rectangular block. When the substrate partition groove 206 is in a narrow state, the width of the substrate partition groove 206 plus the thickness of the partition plate 203 is equal to the thickness of the PCB substrate 33 plus the thickness of the release cardboard 35 in the stacked state. The purpose is to ensure that the process edge 332 of each PCB substrate 33 stacked into a cuboid can be inserted into the substrate partition groove 206 during packaging. This will be further explained later.

[0092] like Figure 11 , 12As shown, a stacking device is designed according to the stacking style of PCB substrate 33, including a designed retainer 5. The retainer 5 includes clamping members at both ends and clamping members on both sides. The clamping members at both ends include a rectangular fixed end plate 501 and a movable end plate 502 located at both ends of the retainer 5. The clamping members on both sides are four parallel clamping bars 6, including an upper left clamping bar 601, a lower left clamping bar 602, an upper right clamping bar 603, and a lower right clamping bar 604. One end of each of the four clamping bars 6 is fixed to the four corners of the fixed end plate 501. The four corners of the movable end plate 502 have sliding holes 7 that can pass through the four clamping bars 6, including an upper left sliding hole 701, a lower left sliding hole 702, an upper right sliding hole 703, and a lower right sliding hole 704. The movable end plate 502 can slide through the four sliding holes 7 to the other end of the four clamping bars 6 and can be locked in a set position.

[0093] The above is a method for feeding circuitry onto a PCB substrate in a production line, including the following steps:

[0094] Step 1: Stacking PCB substrates 33: As shown Figure 11 , 12 As shown in 19, 20, 21, and 22, PCB substrates 33 are stacked in the holder 5 with a release cardboard piece spaced apart. The upper left clamp 601, lower left clamp 602, upper right clamp 603, and lower right clamp 604 clamp the two sides of the circuit loading surface 331 of the PCB substrates 33 respectively, so that the process edges 332 at the top and bottom ends are exposed. Then, the movable end plate 502 is used to press the stacked PCB substrates 33 against the fixed end plate 501 and the movable end plate 502 is locked in a releasable manner so that the stacked PCB substrates 33 maintain the stacked style.

[0095] Step 2, Vacuum Packaging: Vacuum pack the PCB substrate 33, which is stacked, in a packaging bag;

[0096] Step 3: Load material into material bin 2, including the following sub-steps:

[0097] 1. The substrate partition groove 206 is narrowed by compressing the elastic element 205, such as... Figure 7 , 9 As shown in Figure 10;

[0098] 2. Remove the vacuum packaging bag;

[0099] 3. For example Figure 1 , 9As shown in Figure 10, the stacked PCB substrates 33 are placed into the material box 2. Before placing them in, the stacked PCB substrates 33 are rotated so that the upper left clamp 601 and the lower left clamp 602 are at the bottom, and the upper right clamp 603 and the lower right clamp 604 are at the top. When placing them in, the process edges 332 at both ends of each PCB substrate 33 are inserted from top to bottom into the corresponding substrate partition grooves 206 on both sides of the material box 2 until they fall on the process edge side surface 29 below the substrate partition grooves 206. The edge of the partition plate 203 is inserted into the inter-slot 34 between adjacent process edges 332.

[0100] 4. Loosen the movable end plate 502 of the retainer 5 and remove the retainer 5;

[0101] Step 4: Remove the release liner 35: Release the elastic element 205 so that the substrate partition groove 206 is in a wide state, and the release liner 35 between the PCB substrates 33 loses its clamping constraint and falls naturally under the action of gravity.

[0102] Step 5: Feed the material in sections and push the material box 2 forward at a uniform speed so that the PCB substrate 33 at the front end reaches the substrate drop port 28 and slides down onto the conveyor belt 100 under the action of gravity.

[0103] The attached diagram does not show the operation process for steps four and five.

[0104] like Figure 15As shown in Figure 20, the step one of making the movable end plate 502 releasably locked is designed so that the movable end plate 502 is formed by the mechanism setting plate 9 and the cover plate 10. On the lower side of the upper left sliding hole 701 and the upper right sliding hole 703, and on the upper side of the lower left sliding hole 702 and the upper right sliding hole 704, respectively, there are upper locking block grooves 901 and lower locking block grooves 902 perpendicular to the sliding holes 704. The locking block groove 902 has a slot opening 903 on the same side of the mechanism mounting plate 9. The upper locking block groove 901 and the lower locking block groove 902 each have an elongated upper locking block 11 and a lower locking block 12. The upper side of the upper locking block 11 and the lower side of the lower locking block 12 have locking protrusions 13. The lower sides of the upper left clamping bar 601 and the upper right clamping bar 603, and the upper sides of the lower left clamping bar 602 and the lower right clamping bar 604 all have locking notches 14 that allow the locking protrusions 13 to be inserted. The upper locking block 11 and the lower locking block 12 have push-pull ends 15 that can protrude from the slot opening 903. An exposed soft rope catch 16 is provided at the end of the push-pull end 15. When the push-pull ends 15 of the upper locking block 11 and lower locking block 12 exposed in the slot 903 are pushed into the upper locking block slot 901, the two locking protrusions 13 of the upper locking block 11 are respectively inserted into the locking notches 14 of the upper left clamping bar 601 and the upper right clamping bar 603, and the two locking protrusions 13 of the lower locking block 12 are respectively inserted into the locking notches 14 of the lower left clamping bar 602 and the lower right clamping bar 604, thereby locking the movable end plate 502 on the clamping bar 6. When the push-pull ends 15 of the upper locking block 11 and lower locking block 12 are pulled outward by pulling the soft rope trip 16, the locking of the movable end plate 502 on the clamping bar 6 can be released.

[0105] The compression elastic element 205 and the release elastic element 205 are configured as follows:

[0106] like Figure 1 , 4 As shown, a rectangular frame 3 is provided that surrounds the material box 2 from the outside and has an opening 304 at the front end. The rectangular frame 3 is composed of a push plate 301 at the rear end, side plates 302 fixed to the push plate 301 at right angles at both ends of the push plate 301, and a scaling plate 303 that is folded back at the front ends of the two side plates 302 to press the frontmost partition plate 203 of the material box 2 backward. The opening 304 is located between the two scaling plates 303 and is used to place and remove the retainer 5.

[0107] like Figure 1 , 3 As shown in Figure 5, a baffle 4 is fixedly installed on the platform behind the cardboard drop port 27 to prevent the material box 2 from moving backward. The baffle 4 is a hollow rectangular frame, and the upper and lower frame edges of the baffle 4 abut against the end plate 201 of the material box 2.

[0108] like Figure 1 , 4As shown in Figure 5, an electric cylinder 31 is installed at the rear end of the platform plate 101, and its electric push rod 32 is fixedly connected to the push plate 301.

[0109] like Figure 7 , 9 As shown, when the electric actuator 32 pulls the rectangular frame 3 backward, its rear end can pass through the hollow space 401 of the baffle 4 backward, and the two scaling plates 303 at its front end can simultaneously compress the elastic elements 205 between all the partition plates 203; conversely, the elastic elements 205 are released.

[0110] like Figure 6 As shown, the narrowing of the substrate partition groove 206 by compressing the elastic member 205 is achieved by providing a limiting block 204 on one side of the partition plate 203. The thickness of the limiting block 204 is equal to the width of the substrate partition groove 206 in the narrow state. When the electric push rod 32 can no longer be pulled backward, it proves that the two adjacent partition plates 203 are blocked by the limiting block 204, and the substrate partition groove 206 has reached the standard width.

[0111] like Figure 11 , 12 As shown in Figures 13 and 14, the stacked PCB substrate 33 in step one is further configured in the stacking device and stacked using a clamping device that cooperates with the retainer 5. The clamping device includes a platform 17 and a stacking sub-frame 18 disposed on the platform 17 and cooperating with the retainer 5. The stacking sub-frame 18 includes a fixed upright plate 19 and four sub-clamps 8. The four sub-clamps 8 include an upper left sub-clamp 801, a lower left sub-clamp 802, an upper right sub-clamp 803, and a right sub-clamp 804. The lower auxiliary clamps 804 have their rear ends fixed to the fixed upright plate 19 on the platform 17, and their front ends respectively connected to the four clamps 6, allowing the movable end plate 502 to slide from the four clamps 6 through the four auxiliary clamps 8 to be in contact with the fixed upright plate 19. Guide holes 23 are provided at the ends of the four clamps 6 facing the auxiliary clamps 8, and conical tips 24 are provided at the ends of the auxiliary clamps 8 facing the clamps 6, which can be inserted into the guide holes 23 to connect with the clamps 6. This design serves two purposes:

[0112] Function 1: Since the stacking operation starts from the fixed end plate 501 and proceeds from the movable end plate 502, the operating space for placing the release liner 35 and PCB substrate 33 becomes increasingly smaller as the stacking approaches the rear end of the retainer 5. This is not conducive to the stacking operation of the last part of the release liner 35 and PCB substrate 33. The above-mentioned arrangement connects the four auxiliary clamps 8 with the four clamps 6, allowing the movable end plate 502 to slide from the four clamps 6 through the four auxiliary clamps 8 to be in contact with the fixed upright plate 19. This greatly extends the operating space for placing the release liner 35 and PCB substrate 33. After the PCB substrate 33 fills the retainer 5, the movable end plate 502 is slid forward to press and lock the stacked PCB substrate 33.

[0113] Function 2: Due to the relatively long length of clamp 6, its rear end is far from the fixed end fixed by the front fixed end plate 501. This makes the rear section of clamp 6, which lacks fixed constraint, prone to wobbling under force, which is not conducive to standard stacking and clamping of the PCB substrate 33. The four secondary clamps 8 of the stacking sub-frame 18 are shorter and have strong stability. When the four secondary clamps 8 of the stacking sub-frame 18 are aligned with the four clamps 6 of the retainer, the front ends of the four clamps 6 are constrained and stabilized. Of course, the front ends of the four clamps 6 can also be constrained by adjusting the stopping position of the sliding movable end plate 502 on the four clamps 6 or the four secondary clamps 8.

[0114] like Figure 11 , 13 As shown, a rectangular recessed substrate side stand pool 21 is provided on the platform 17, such that the depth of the substrate side stand pool 21 is equal to the width of the process edge 332 of the PCB substrate 33, and the width of the substrate side stand pool 21 is equal to the width between the lower left clamp 602 and the lower right clamp 604.

[0115] like Figure 19 , 20 As shown in Figure 22, the method above also includes: cutting the four corners of the release cardboard 35 into right-angled notches 351 that can be inserted into the four clamps 6 respectively, so that the release cardboard 35 can be restricted between the four clamps 6 through the right-angled notches 351 at the four corners and can slide on the clamps 6 and the secondary clamps 8.

[0116] like Figure 11 , 12 As shown in 13, 14, 19, and 20, the stacked PCB substrate 33 described in step one above includes the following steps:

[0117] S1. Connect the retainer 5 to the stacked sub-frame 18 so that the substrate side stand pool 21 is located directly below the lower left clamp 602 and the lower right clamp 604.

[0118] S2. Slide the movable end plate 502 from the four clamping bars 6 through the four auxiliary clamping bars 8 until it is in contact with the fixed upright plate 19.

[0119] S3. Insert all the release cardboard 35 into the four clamps 6 according to the quantity, and push all the release cardboard 35 towards the movable end plate 502, leaving stacking operation space between the four clamps 6 at the end where the fixed end plate 501 is located.

[0120] S4. Insert a PCB substrate 33 downwards from between the upper left clamp 601 and the upper right clamp 603 to the bottom of the substrate side stand pool 21, so that the lower process edge 332 of the PCB substrate 33 is located inside the substrate side stand pool 21, and the upper process edge 332 of the PCB substrate 33 is located above the upper left clamp 601 and the upper right clamp 603; slide a release cardboard 35 to be in contact with the PCB substrate 33, and then insert another PCB substrate 33, repeating this process until the required number of PCB substrates 33 are installed.

[0121] S5. Push the movable end plate 502 to the ends of the four clamping bars 6, press the stacked PCB substrate 33 tightly, and lock the movable end plate 502 by the upper locking block 11 and the lower locking block 12.

[0122] Step S5, which involves pushing the movable end plate 502 to the ends of the four clamping bars 6 to press the stacked PCB substrate 33 together, is achieved through the following settings:

[0123] A movable upright plate 20 corresponding to the fixed upright plate 19 and its push cylinder 26 are provided on the platform 17. The movable upright plate 20 is connected to the push rod 261 of the push cylinder 26, so that the push cylinder 26 can push or retract the movable upright plate relative to the fixed upright plate 19.

[0124] like Figure 11 , 13 As shown, a push plate 22 and its electric propulsion cylinder 25 are provided on the platform 17, located behind the fixed upright plate 19. The push plate 22 is connected to the electric propulsion rod 251 of the electric propulsion cylinder 25. A window 191 is provided on the fixed upright plate 19 for the push plate 22 to pass through. The push plate 22 can push the movable end plate 502 to slide towards the fixed end plate 501 through the window 191.

[0125] The above embodiments are only used to describe the present invention more clearly, and should not be regarded as limiting the scope of protection covered by the present invention. Any equivalent modifications should be regarded as falling within the scope of protection covered by the present invention.

Claims

1. A method of feeding a circuit flow line with PCB substrates, characterized by: The application relates to a feeding device capable of stacking PCB substrates (33) and feeding the substrates to a subsequent process in a pipeline mode after the release paper between the substrates is removed, and capable of stacking the substrates into a preset mode and keeping the stacking mode until the substrates are used in the feeding device after the substrates are vacuum packaged; the feeding device comprises a rack (1) provided with a rack plate (101) and a feeding box (2) on the rack (1), and a paperboard falling port (27) is arranged on the rack plate (101) below the feeding box (2) and communicates with the upper portion of the paperboard falling port (27); a substrate sliding port (28) is arranged at the front end of the paperboard falling port (27). The feeding box is a rectangular frame with open upper and lower portions, the paperboard falling port (27) is rectangular, and process edge vertical faces (29) for vertically arranging the process edges (332) of the two ends of the PCB substrates (33) are symmetrically arranged on the upper surfaces of the two sides of the paperboard falling port (27); a plurality of vertical substrate separation grooves (206) for inserting the process edges (332) of the two ends of the PCB substrates (33) into the process edge vertical faces (29) from the upper portion to the lower portion are symmetrically arranged on the two sides of the feeding box (2) and face each other, the widths of all the substrate separation grooves (206) are equal, and a separation plate (203) is arranged between the two substrate separation grooves (206), so that the substrate separation grooves (206) have two states of being wide and narrow. The paperboard falling port (27) is located directly below the separation plates (203) between the two sides of the feeding box (2). The feeding box (2) can continuously move forward and pass above the substrate sliding port (28). The substrate separation grooves (206) have two states of being wide and narrow by arranging end plates (201) at the rear ends of the feeding box (2), fixing sliding shaft plates (202) extending forward on the front sides of the end plates (201) and perpendicular to the end plates (201) and the rack plate (101), arranging sliding shaft holes (30) through which the sliding shaft plates (202) pass and slide in the central portions of the separation plates (203), sleeving a plurality of separation plates (203) on the sliding shaft plates (202) through the sliding shaft holes (30), arranging elastic members (205) between the central portions of the adjacent two separation plates (203), forming the substrate separation grooves (206) in the outer portions between the adjacent two separation plates (203), and changing the substrate separation grooves (206) into the two states of being wide and narrow by compressing and releasing the elastic members (205).

2. The method of feeding a circuit flow line with PCB substrates of claim 1, wherein, To adapt to the preset PCB substrate (33) of the feeding device stacking style: the adjacent two PCB substrates (33) between the release paper is made into a fixed shape of recyclable release paper board (35); the release paper board (35) is only attached to the circuit loading surface (331) between the two ends of the PCB substrate (33) process edge (332), so that the adjacent process edge (332) between the two ends of the adjacent two PCB substrates (33) forms an inter-slot (34), when the substrate separation slot (206) is in a narrow state, the width of the substrate separation slot (206) plus the thickness of the separation plate (203) is equal to the thickness of the PCB substrate (33) plus the thickness of the release paper board (35) in the stacking state; the PCB substrate (33) and the release paper board (35) are stacked into a long rectangular cuboid.

3. The method of feeding a circuit flow line with PCB substrates of claim 2, wherein, According to the stacking style of the PCB substrate (33), a stacking device is designed, which includes a designed holder (5), the holder (5) includes two end clamping members and two side clamping members, the two end clamping members include rectangular fixed end plates (501) and movable end plates (502) at both ends of the holder (5), the two side clamping members are four mutually parallel clamping rods (6), including left upper clamping rod (601), left lower clamping rod (602) and right upper clamping rod (603), right lower clamping rod (604), one end of the four clamping rods (6) is fixed with the four corners of the fixed end plate (501), the movable end plate (502) has four sliding holes (7) capable of passing through the four clamping rods (6), including left upper sliding hole (701), left lower sliding hole (702) and right upper sliding hole (703), right lower sliding hole (704), the movable end plate (502) can slide at the other end of the four clamping rods (6) through the four sliding holes (7) and can be releasably locked at the set position.

4. The method of feeding a circuit flow line with PCB substrates of claim 3, wherein, It includes the following steps: Step one, stack the PCB substrate (33): stack the PCB substrate (33) in the holder (5) with a piece of release paper board between each piece of PCB substrate (33) to form a stack, the left upper clamping rod (601), the left lower clamping rod (602) and the right upper clamping rod (603), the right lower clamping rod (604) clamps the circuit loading surface (331) of the PCB substrate (33) on both sides, so that the upper and lower end process edges (332) are exposed, then the stacked PCB substrate (33) is pressed tightly by the movable end plate (502) to the fixed end plate (501), and the movable end plate (502) is releasably locked, so that the stacked PCB substrate (33) maintains the stacking style; Step two, vacuum packaging: vacuum packaging the PCB substrate (33) maintaining the stacking style with a packaging bag; Step three, feeding into the hopper (2), including the following steps: 1) make the substrate separation slot (206) in a narrow state by the compression elastic member (205); 2) remove the vacuum packaging bag; 3) Put the whole stack of PCB substrates (33) in the stack mode into the magazine (2), before putting in, rotate the stack of PCB substrates (33) so that the upper left clamping lever (601) and the lower left clamping lever (602) are below, and the upper right clamping lever (603) and the lower right clamping lever (604) are above; when putting in, let the process edges (332) at both ends of each PCB substrate (33) be inserted into the corresponding substrate separation groove (206) on both sides of the magazine (2) from top to bottom, and the edge of the separation plate (203) is inserted into the inter-slot (34) between the adjacent process edges (332); 4) Loosen the movable end plate (502) of the retainer (5) and remove the retainer (5); Step four, remove the release paper board (35): release the elastic member (205) to make the substrate separation groove (206) in a wide state, and the release paper board (35) between the PCB substrates (33) loses the clamping constraint and naturally falls under the action of gravity; Step five, piece feeding, uniformly push the magazine (2) forward, so that the PCB substrate (33) at the front end reaching the substrate sliding port (28) falls onto the assembly line conveyor (100) under the action of gravity.

5. The method of feeding a circuit flow line with PCB substrates of claim 4, wherein: The movable end plate (502) is locked and can be loosened, which is designed to be covered by the mechanism setting plate (9) and the cover plate (10), the upper lock block groove (901) and the lower lock block groove (902) are arranged below the left upper sliding hole (701) and the right upper sliding hole (703) and above the left lower sliding hole (702) and the right lower sliding hole (704) of the mechanism setting plate (9), the upper lock block groove (901) and the lower lock block groove (902) have groove through openings (903) on the same side of the mechanism setting plate (9), the upper lock block groove (901) and the lower lock block groove (902) have an upper lock block (11) and a lower lock block (12) respectively, the upper side of the upper lock block (11) and the lower side of the lower lock block (12) have lock protrusions (13), the lower side of the upper left clamping lever (601) and the upper right clamping lever (603) and the upper side of the lower left clamping lever (602) and the lower right clamping lever (604) have lock notches (14) into which the lock protrusions (13) can be inserted.

6. The method of feeding a circuit flow line with PCB substrates of claim 5, wherein: The upper lock block (11) and the lower lock block (12) have a push-pull end (15) that can expose the groove through opening (903), and a soft rope pull (16) is exposed at the end of the push-pull end (15).

7. The method of feeding a circuit flow line with PCB substrates of claim 4, wherein: The compression elastic member (205) and the release elastic member (205) are realized, including the following settings: A rectangular frame (3) is arranged outside the magazine (2) and surrounds the magazine (2), and an opening (304) is left at the front end, the rectangular frame (3) is composed of a push plate (301) at the rear end, a side plate (302) fixed at right angles at both ends of the push plate (301), and a folding plate (303) folded back at the front end of the two side plates (302) for pressing the front end separation plate (203) of the magazine (2) backward, and the opening (304) is located between the two folding plates (303) for placing and withdrawing the holder (5); A stop rack (4) is fixedly arranged on the table top behind the paperboard drop port (27) to prevent the magazine (2) from moving backward, the stop rack (4) is a hollow rectangular frame, and the upper frame edge and the lower frame edge of the stop rack (4) resist the end plate (201) of the magazine (2) forwardly; An electric cylinder (31) is arranged at the rear end of the rack plate (101), and the electric push rod (32) is fixedly connected with the push plate (301); When the electric push rod (32) pulls the rectangular frame (3) backward, the rear end can pass through the hollow space (401) of the stop rack (4) backward, and the two folding plates (303) at the front end can synchronously compress all the elastic members (205) between the adjacent separation plates (203); conversely, the elastic members (205) are released.

8. The method for feeding a circuit flow line with PCB substrates of claim 4, wherein: The stacked PCB substrate (33) in step one is further stacked in a stacking device by using a clamping device matched with the holder (5), the clamping device is arranged including a table plate (17) and a stacking vice rack (18) arranged on the table plate (17) and matched with the holder (5), the stacking vice rack (18) includes a fixed vertical plate (19) and four vice clamping rods (8), the four vice clamping rods (8) include a left upper vice clamping rod (801), a left lower vice clamping rod (802), a right upper vice clamping rod (803) and a right lower vice clamping rod (804), the rear ends of the four vice clamping rods (8) are fixed with the fixed vertical plate (19) fixed on the table plate (17), and the front ends are respectively butted with the four clamping rods (6), so that the movable end plate (502) can slide from the four clamping rods (6) to the fixed vertical plate (19) through the four vice clamping rods (8); a guide hole (23) is arranged at the end of the four clamping rods (6) towards the vice clamping rod (8), and a spine tip (24) capable of being inserted into the guide hole (23) to realize butt joint with the clamping rod (6) is arranged at the end of the vice clamping rod (8) towards the clamping rod (6).

9. The method of feeding a circuit flow line with PCB substrates of claim 8, wherein: A rectangular recessed substrate side vertical pool (21) is arranged on the table plate (17), the depth of the substrate side vertical pool (21) is equal to the width of the process edge (332) of the PCB substrate (33), and the width of the substrate side vertical pool (21) is equal to the width between the left lower clamping rod (602) and the right lower clamping rod (604).

10. The method of feeding a circuit flow line with PCB substrates of claim 8, wherein, The four corners of the release paper board (35) are all cut into right angle notches (351) capable of being respectively clamped into the four clamping rods (6), so that the release paper board (35) can be limited between the four clamping rods (6) through the right angle notches (351) at the four corners and can slide on the clamping rod (6) and the vice clamping rod (8).

11. The method of feeding a circuit flow line with PCB substrates of claim 10, wherein, The stacked PCB substrate (33) in step one includes the following steps: S1, the holder (5) and the stack vice (18) butt joint, the substrate side vertical pool (21) is located directly below the left lower clamp lever (602) and the right lower clamp lever (604) between; S2, the movable end plate (502) is slid from four clamping levers (6) through four vice clamping levers (8) to be attached to the fixed vertical plate (19); S3, the release paper board (35) is all inserted into four clamping levers (6) according to the amount, and all the release paper board (35) is pushed to the movable end plate (502), and the space for stacking operation is left between the four clamping levers (6) at the end of the fixed end plate (501); S4, a piece of PCB substrate (33) is inserted downward from the left upper clamp lever (601) and the right upper clamp lever (603) to the bottom of the substrate side vertical pool (21), so that the process edge (332) at the lower end of the PCB substrate (33) is located in the substrate side vertical pool (21), and the process edge (332) at the upper end of the PCB substrate (33) is located above the left upper clamp lever (601) and the right upper clamp lever (603); a piece of release paper board (35) is slid to be attached to the PCB substrate (33), and another piece of PCB substrate (33) is inserted, and the operation is repeated until the number of PCB substrates (33) to be stacked is stacked; S5, the movable end plate (502) is pushed to the end of the four clamping levers (6), and the stacked PCB substrate (33) is compressed and locked by the upper lock block (11) and the lower lock block (12).

12. The method of feeding a circuit flow line with PCB substrates of claim 11, wherein: The step S5 described that the movable end plate (502) is pushed to the end of the four clamping levers (6), and the stacked PCB substrate (33) is compressed, which is realized by the following setting: The movable vertical plate (20) and its advance cylinder (26) corresponding to the fixed vertical plate (19) are arranged on the table plate (17), the movable vertical plate (20) is connected with the advance rod (261) of the advance cylinder (26), and the movable vertical plate can be advanced or retreated relative to the fixed vertical plate (19) by the advance cylinder (26); The push plate (22) and its electric advance cylinder (25) are arranged on the table plate (17) at the rear side of the fixed vertical plate (19), the push plate (22) is connected with the electric advance rod (251) of the electric advance cylinder (25), a window (191) is arranged on the fixed vertical plate (19) for the push plate (22) to pass through, and the push plate (22) can push the movable end plate (502) to slide to the fixed end plate (501) through the window (191).

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