A myopia-preventing LED packaging structure and process

Abstract

The present invention provides an anti-myopia LED packaging structure, comprising a cup-shaped bracket, a first chip, and a second chip. The inner side wall of the cup-shaped bracket is formed with a boss, and the upper surface of the boss is lower than the upper surface of the cup-shaped bracket; the inner side surface of the first conical cavity is provided with a first reflection surface, the inner side surface of the second conical cavity is provided with a second reflection surface, and the first conical cavity is connected with the second conical cavity; the bottom of the second conical cavity is centrally provided with a second chip, the upper surface of the boss is coated with a silver glue layer, and the first chip is arranged on the silver glue layer; the first reflection surface is provided with a first convex mirror, and the second reflection surface is provided with a second convex mirror; the outer surfaces of the first convex mirror and the second convex mirror are provided with a mirror silver layer; the outer surface of the mirror silver layer is provided with a fluorescent glue layer; the fluorescent glue layer is provided with a solution mixture of glue and infrared fluorescent powder with an emission peak of 730nm and an infrared fluorescent powder with an emission peak of 840nm. Dual color temperature, strong light balance, improved light efficiency, and good anti-myopia function.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and in particular to an anti-myopia LED packaging structure and process. Background Art

[0002] The Chinese authorization announcement number is CN215299288U, and the authorization announcement date is December 24, 2021. It is a UVLED packaging structure, including a substrate, a light-transmitting body located on the substrate, a light-emitting body located on the substrate, the light-emitting body is connected to the substrate, and a support body located on the substrate, the support body is connected to the substrate and the light-transmitting body, and the support body is used to support the light-transmitting body, and the light-transmitting body, the substrate and the support body constitute a confined space; the light-emitting body is located in the confined space, and the support body has a slope structure, and the slope structure is located in the confined space. The defects of this prior art are: 1. Single light-emitting body structure, weak balance of light; 2. The support body is a fixed injection molding form, and the light reflection angle of the slope structure cannot be adjusted. It can only be achieved by forming a slope structure with different inclinations through different injection molds, resulting in high equipment cost; 3. The light efficiency needs to be improved, and it is not suitable for healthy lighting. In view of this situation, improvement is urgently needed. Summary of the invention

[0003] Based on this, the purpose of the present invention is to provide an anti-myopia LED packaging structure and process with dual color temperature, strong light balance, improved light efficiency, good anti-myopia function, and suitable for healthy lighting.

[0004] The present invention provides an anti-myopia LED packaging structure, comprising a cup-shaped bracket, and also comprising a first chip and a second chip, wherein the first chip and the second chip are configured to provide white light chips with different color temperatures; a boss is formed on the inner side wall of the cup-shaped bracket, and the upper surface of the boss is configured to be a horizontal plane, and the upper surface of the boss is lower than the upper surface of the cup-shaped bracket; the inner cavity of the cup-shaped bracket is divided by the boss to form a first tapered cavity that is wide at the top and narrow at the bottom and a second tapered cavity, the inner side surface of the first tapered cavity is provided with a first reflecting surface, the inner side surface of the second tapered cavity is provided with a second reflecting surface, and the first tapered cavity and the second tapered cavity are connected; The second chip is arranged in the center of the bottom of the second conical cavity, the upper surface of the boss is coated with a silver glue layer, and the first chip is arranged on the silver glue layer; the thickness of the silver glue layer is adapted to the light reflection angles required by the first reflecting surface and the second reflecting surface respectively; a first convex mirror is arranged on the first reflecting surface, and a second convex mirror is arranged on the second reflecting surface; the outer surfaces of the first convex mirror and the second convex mirror are provided with a mirror silver layer; the outer surface of the mirror silver layer is provided with a fluorescent glue layer; the fluorescent glue layer is arranged as a solution mixture of glue and infrared fluorescent powder with an emission peak of 730nm and infrared fluorescent powder with an emission peak of 840nm.

[0005] Preferably, the expansion angle of the first reflecting surface is set to 144°; and the expansion angle of the second reflecting surface is set to 100°.

[0006] Preferably, the second chip is configured as a light source with a color temperature of 2600-2800K, and a deep ultraviolet light value of 0.003-0.009nm; the first chip is configured as a light source with a color temperature of 6200-6800K, and a deep ultraviolet light value of 0.003-0.009nm.

[0007] A myopia prevention LED packaging process, comprising step 1, chip fixing; step 2, circuit connection; step 3, preparing fluorescent glue solution; step 4, glue dispensing; step 5, parameter spectroscopy;

[0008] In the step 1, the second chip is configured as a light source with a color temperature of 2700K excited by light with a peak wavelength range of 450nm, and the first chip is configured as a light source with a color temperature of 6500K excited by light with a peak wavelength range of 450nm;

[0009] The peak bands of the first chip are composed of 417-422nm, 440-445nm, 450-455nm, and 462-467nm, and the number of chips with a peak band of 417-422nm: the number of chips with a peak band of 440-445nm: the number of chips with a peak band of 450-455nm: the number of chips with a peak band of 462-467nm = 2:3:3:4;

[0010] The peak bands of the second chip are composed of 417-422nm, 437-442nm, 447-452nm, and 460-465nm; the number of chips with a peak band of 417-422nm: the number of chips with a peak band of 437-442nm: the number of chips with a peak band of 447-452nm: the number of chips with a peak band of 460-465nm = 2:3:3:4;

[0011] The outer surfaces of the first convex mirror and the second convex mirror are both sputtered with mirror silver to form a mirror silver layer;

[0012] In the step three,

[0013] A fluorescent glue solution is prepared for the fluorescent glue layer, wherein the weight ratio of the glue, the infrared fluorescent powder with an emission peak of 730nm, and the infrared fluorescent powder with an emission peak of 840nm is 1g:0.3g:0.5g;

[0014] The 2700K phosphor is mixed in the ratio of glue: 525nm green powder: 540nm green powder: 655nm red powder = 3:0.5:0.8:0.135;

[0015] The 6500K phosphor is mixed in the ratio of glue: 495nm green powder: 540nm green powder: 655nm red powder = 3:0.05:0.4:0.022;

[0016] The outer surface of the mirror silver layer is sputtered with mirror silver to form a fluorescent glue layer;

[0017] In the step 4,

[0018] 2700K ratio dispensing, dispensing to 27G chromaticity coordinates, color temperature is 2350-2550K, and then adopts thermal precipitation process, the chromaticity coordinates after thermal precipitation meet 273 chromaticity coordinates;

[0019] 6500K ratio dispensing, dispensing to 65G chromaticity coordinates, color temperature is 5500-5650K, using thermal precipitation process, the chromaticity coordinates after thermal precipitation meet 653 chromaticity coordinates.

[0020] Preferably, in step 1, both the first chip and the second chip are chips with a model of 22*35mil2.

[0021] Preferably, in step 1, the sputtering thickness of the mirror silver layer is 40 μm.

[0022] Preferably, in step three, the sputtering thickness of the fluorescent glue layer is 2 um.

[0023] Preferably, in step one, the light color quality of the second chip satisfies Ra>95, R9>80; the light color quality of the first chip satisfies Ra>95, R9>80.

[0024] Preferably, in step 4, during the 2700K dispensing, the oven temperature is set at 45±5°C, and the thermal precipitation is performed for 4H±5min.

[0025] Preferably, in step 4, during the 6500K dispensing, the oven temperature is set at 45±5°C, and the thermal precipitation is performed for 4H±5min.

[0026] The beneficial effects of the present invention are:

[0027] 1. A first chip and a second chip are provided, wherein the first chip and the second chip are provided as white light chips providing different color temperatures, and a dual color temperature structure is provided to improve the balance of light;

[0028] 2. The boss divides the inner cavity of the cup-shaped bracket into a first tapered cavity which is wide at the top and narrow at the bottom and a second tapered cavity. The inner side surface of the first tapered cavity is provided with a first reflecting surface, and the inner side surface of the second tapered cavity is provided with a second reflecting surface. The upper surface of the boss is coated with a silver glue layer, and the thickness of the silver glue layer is respectively adapted to the light reflection angles required by the first reflecting surface and the second reflecting surface. During production, the thickness of the silver glue layer is adjusted, so as to change the light reflection angles of the first reflecting surface and the second reflecting surface by changing the relative height of the boss. There is no need to set a cup-shaped bracket injection molding mold with multiple reflection angles, and LED packaging structures with different light reflection angles can also be produced, saving equipment costs;

[0029] 3. The fluorescent glue layer is set to be a solution mixture of glue and infrared phosphors with emission peaks of 730nm and 840nm, which reduces the absorption of red and green powders, thereby increasing the light efficiency, meeting the 730nm spectrum intensity of 0.9±0.03, the 840nm spectrum intensity of 0.8±0.03, and the 700nm spectrum can be controlled at a minimum of 0.4, which has a protective effect on the human eyes, thereby achieving the anti-myopia function. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a cross-sectional view of the present invention.

[0031] Figure 2 Schematic diagram of relative spectral intensity when excited by light with a peak wavelength range of 450nm.

[0032] Figure 3 It is a schematic diagram of the spectrum intensity of 2700K of the present invention.

[0033] Figure 4 It is a schematic diagram of the relevant test data of 2700K of the present invention.

[0034] Figure 5 It is a schematic diagram of the spectrum intensity of 6500K of the present invention.

[0035] Figure 6 It is a schematic diagram of the relevant test data of 6500K of the present invention.

[0036] Figure 7 This is a schematic diagram of dimming spectrum test data of the present invention.

[0037] Figure 8 This is a schematic diagram of the spectrum intensity of the present invention in which the 700nm spectrum is controlled at a minimum of 0.4.

[0038] Fig. 9 It is a schematic diagram of spectrum comparison of 2700K of the present invention, conventional Ra97 2700K data and 2700K sunlight.

[0039] Fig.10 It is a schematic diagram of spectrum comparison of 4000K of the present invention, conventional Ra97 4000K data and 4000K sunlight.

[0040] Fig.11 It is a schematic diagram of spectrum comparison of the 6000K data of the present invention, conventional Ra97 6000K data and 6000K sunlight.

[0041] Fig.12 This is a combined diagram of 2700K of the present invention.

[0042] Fig.13 This is a color tolerance display diagram of 2700K of the present invention.

[0043] Fig.14 This is a combined diagram of 6500K of the present invention.

[0044] Fig.15 This is a color tolerance display diagram of 6500K of the present invention.

[0045] The figures are marked as: cup-shaped bracket 10, first conical cavity 11, boss 12, first chip 13, expansion angle 14 of first reflection surface, first reflection surface 15, second chip 16, expansion angle 17 of second reflection surface, second reflection surface 18, second conical cavity 19, silver glue layer 20, first convex mirror 21, second convex mirror 22, fluorescent glue layer 23. DETAILED DESCRIPTION

[0046] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with specific implementation methods and drawings.

[0047] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] Please refer to Figure 1 As shown, an anti-myopia LED packaging structure includes a cup-shaped bracket 10, and also includes a first chip 13 and a second chip 16. The first chip 13 and the second chip 16 are configured to provide white light chips with different color temperatures; the inner side wall of the cup-shaped bracket 10 is formed with a boss 12, and the upper surface of the boss 12 is set as a horizontal plane, and the upper surface of the boss 12 is lower than the upper surface of the cup-shaped bracket 10; the inner cavity of the cup-shaped bracket 10 is divided into a first conical cavity 11 and a second conical cavity 19 which are wide at the top and narrow at the bottom by the boss 12, the inner side surface of the first conical cavity 11 is provided with a first reflecting surface 15, and the inner side surface of the second conical cavity 19 is provided with a second reflecting surface 18, and the first conical cavity 11 and the second conical cavity 19 are connected The second chip 16 is arranged at the center of the bottom of the second conical cavity 19, and the upper surface of the boss 12 is coated with a silver glue layer 20, on which the first chip 13 is arranged; the thickness of the silver glue layer 20 is adapted to the light reflection angles required by the first reflection surface 15 and the second reflection surface 18 respectively; the first convex mirror 21 is arranged on the first reflection surface 15, and the second convex mirror 22 is arranged on the second reflection surface 18; the outer surfaces of the first convex mirror 21 and the second convex mirror 22 are provided with a mirror silver layer; the outer surface of the mirror silver layer is provided with a fluorescent glue layer 23; the fluorescent glue layer 23 is set to a solution mixture of glue and infrared fluorescent powder with an emission peak of 730nm and infrared fluorescent powder with an emission peak of 840nm. In this embodiment, the expansion angle 14 of the first reflection surface is set to 144°; the expansion angle 17 of the second reflection surface is set to 100°.

[0049] In this embodiment, the second chip 16 is configured as a light source with a color temperature of 2600-2800K and a deep ultraviolet light value of 0.003-0.009nm; the first chip 13 is configured as a light source with a color temperature of 6200-6800K and a deep ultraviolet light value of 0.003-0.009nm.

[0050] Please refer to Figure 2-15 As shown, a myopia prevention LED packaging process includes step one, chip fixing; step two, circuit connection; step three, preparing fluorescent glue solution; step four, glue dispensing; step five, parameter spectroscopy;

[0051] In step 1, the second chip 16 is set as a light source with a color temperature of 2700K excited by light with a peak wavelength range of 450nm, and the first chip 13 is set as a light source with a color temperature of 6500K excited by light with a peak wavelength range of 450nm;

[0052] The peak wavelength bands of the first chip 13 are composed of 417-422nm, 440-445nm, 450-455nm, and 462-467nm. The number of chips with a peak wavelength band of 417-422nm: the number of chips with a peak wavelength band of 440-445nm: the number of chips with a peak wavelength band of 450-455nm: the number of chips with a peak wavelength band of 462-467nm = 2:3:3:4;

[0053] The peak wavelength bands of the second chip 16 are composed of 417-422nm, 437-442nm, 447-452nm, and 460-465nm; the number of chips with a peak wavelength band of 417-422nm: the number of chips with a peak wavelength band of 437-442nm: the number of chips with a peak wavelength band of 447-452nm: the number of chips with a peak wavelength band of 460-465nm = 2:3:3:4;

[0054] The outer surfaces of the first convex mirror 21 and the second convex mirror 22 are both sputtered with mirror silver to form a mirror silver layer;

[0055] The first chip 13 and the second chip 16 are both 22*35mil2 chips.

[0056] The sputtered thickness of the mirror silver layer is 40 μm.

[0057] The light color quality of the second chip 16 satisfies Ra>95, R9>80; the light color quality of the first chip 13 satisfies Ra>95, R9>80.

[0058] In step three,

[0059] The fluorescent glue solution for preparing the fluorescent glue layer 23 has a weight ratio of 1 g:0.3 g:0.5 g of glue, infrared fluorescent powder with an emission peak of 730 nm, and infrared fluorescent powder with an emission peak of 840 nm.

[0060] The 2700K phosphor is mixed in the ratio of glue: 525nm green powder: 540nm green powder: 655nm red powder = 3:0.5:0.8:0.135;

[0061] The 6500K phosphor is mixed in the ratio of glue: 495nm green powder: 540nm green powder: 655nm red powder = 3:0.05:0.4:0.022;

[0062] The outer surface of the mirror silver layer is sputtered with mirror silver to form a fluorescent glue layer 23;

[0063] The sputtering thickness of the fluorescent glue layer 23 is 2 um.

[0064] In step four,

[0065] 2700K ratio dispensing, dispensing to 27G chromaticity coordinates, color temperature is 2350-2550K, and then adopts thermal precipitation process, the chromaticity coordinates after thermal precipitation meet 273 chromaticity coordinates; in 2700K ratio dispensing, the oven temperature is set at 45±5℃, and thermal precipitation is 4H±5min.

[0066] 6500K ratio dispensing, dispensing to 65G chromaticity coordinates, color temperature is 5500-5650K, using thermal precipitation process, the chromaticity coordinates after thermal precipitation meet 653 chromaticity coordinates. In 6500K ratio dispensing, the oven temperature is set at 45±5℃, thermal precipitation 4H±5min.

[0067] The present invention is provided with a first chip and a second chip, and the first chip and the second chip are provided as white light chips providing different color temperatures, and the dual color temperature structure improves the balance of light; the boss divides the inner cavity of the cup-shaped bracket into a first conical cavity which is wide at the top and narrow at the bottom and a second conical cavity, the inner side surface of the first conical cavity is provided with a first reflection surface, and the inner side surface of the second conical cavity is provided with a second reflection surface, and the upper surface of the boss is coated with a silver glue layer, and the thickness of the silver glue layer is respectively adapted to the light reflection angles required by the first reflection surface and the second reflection surface. During production, the thickness of the silver glue layer is adjusted, so as to change the first reflection surface by changing the relative height of the boss. The light reflection angle of the second reflection surface does not need to be set up with a cup-shaped bracket injection molding mold with multiple reflection angles, and LED packaging structures with different light reflection angles can also be produced, saving equipment costs; the fluorescent glue layer is set to be a solution mixture of glue and infrared phosphors with an emission peak of 730nm and 840nm, which reduces the absorption of red powder and green powder, thereby increasing the light efficiency, meeting the 730nm spectrum intensity of 0.9±0.03, the 840nm spectrum intensity of 0.8±0.03, and the 700nm spectrum can be controlled at a minimum of 0.4, which has a protective effect on the human eye, thereby achieving the anti-myopia function.

[0068] Please refer to Fig. 9 As shown, a summary table of comparative values ​​of the spectrum of 2700K of the present invention and conventional Ra97 2700K data and 2700K sunlight is provided below.

[0069] project S / P ratio S / P Ratio M / P ratio M / P Ratio The present invention 2700K 1.31 100.00％ 0.4833 100.00％ Conventional Ra97 2700K 1.25 95.42％ 0.4561 94.37％ 2700K sunlight 1.34 102.29％ 0.4861 100.58％

[0070] Please refer to Fig.10As shown, a numerical summary table comparing the spectrum of 4000K of the present invention with conventional Ra97 4000K data and 4000K sunlight is provided below.

[0071] project S / P ratio S / P Ratio M / P ratio M / P Ratio The present invention 4000K 1.89 100.00％ 0.7933 100.00％ Conventional Ra97 4000K 1.8 95.24％ 0.7409 93.39％ 4000K sunlight 1.88 99.47％ 0.7927 99.92％

[0072] Please refer to Fig.11 As shown, a numerical summary table of spectrum comparison of 6000K data of the present invention and conventional Ra97 6000K data and 6000K sunlight is provided below.

[0073] project S / P ratio S / P Ratio M / P ratio M / P Ratio The present invention 6000K 2.42 100.00％ 1.0723 100.00％ Conventional Ra97 6000K 2.34 96.69％ 1.0357 96.59％ 6000K sunlight 2.37 97.93％ 1.0709 99.87％

[0074] The above-mentioned embodiment only expresses one implementation mode of the present invention, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. An anti-myopia LED packaging structure, comprising a cup-shaped bracket (10), characterized in that: The invention also comprises a first chip (13) and a second chip (16), wherein the first chip (13) and the second chip (16) are configured to provide white light chips with different color temperatures; a boss (12) is formed on the inner side wall of the cup-shaped support (10), the upper surface of the boss (12) is configured to be a horizontal plane, and the upper surface of the boss (12) is lower than the upper surface of the cup-shaped support (10); the inner cavity of the cup-shaped support (10) is divided by the boss (12) to form a first conical cavity (11) and a second conical cavity (19) which are wide at the top and narrow at the bottom; the inner side surface of the first conical cavity (11) is provided with a first reflection surface (15), and the inner side surface of the second conical cavity (19) is provided with a second reflection surface (18); the first conical cavity (11) and the second conical cavity (19) are connected; the second conical cavity (11) and the second conical cavity (19) are connected; The second chip (16) is arranged in the center of the bottom of (19); the upper surface of the boss (12) is coated with a silver glue layer (20), and the first chip (13) is arranged on the silver glue layer (20); the thickness of the silver glue layer (20) is respectively adapted to the light reflection angles required by the first reflection surface (15) and the second reflection surface (18); the first reflection surface (15) is provided with a first convex mirror (21), and the second reflection surface (18) is provided with a second convex mirror (22); the outer surfaces of the first convex mirror (21) and the second convex mirror (22) are provided with a mirror silver layer; the outer surface of the mirror silver layer is provided with a fluorescent glue layer (23); the fluorescent glue layer (23) is set to be a solution mixture of glue and infrared fluorescent powder with an emission peak of 730nm and infrared fluorescent powder with an emission peak of 840nm.

2. The anti-myopia LED packaging structure according to claim 1, characterized in that: The expansion angle (14) of the first reflection surface is set to 144°; the expansion angle (17) of the second reflection surface is set to 100°.

3. The anti-myopia LED packaging structure according to claim 1, characterized in that: The second chip (16) is configured as a light source with a color temperature of 2600-2800K, and a deep ultraviolet light value of 0.003-0.009nm; the first chip (13) is configured as a light source with a color temperature of 6200-6800K, and a deep ultraviolet light value of 0.003-0.009nm.

4. A myopia prevention LED packaging process, comprising step 1, chip fixing; step 2, circuit connection; step 3, preparing fluorescent glue solution; step 4, glue dispensing; step 5, parameter spectroscopy; Features: Used to encapsulate an anti-myopia LED packaging structure according to any one of claims 1 to 3; In the step 1, the second chip (16) is configured as a light source with a color temperature of 2700K excited by light with a peak wavelength range of 450nm, and the first chip (13) is configured as a light source with a color temperature of 6500K excited by light with a peak wavelength range of 450nm; The peak wavelength bands of the first chip (13) are composed of 417-422nm, 440-445nm, 450-455nm, and 462-467nm, and the number of chips with a peak wavelength band of 417-422nm: the number of chips with a peak wavelength band of 440-445nm: the number of chips with a peak wavelength band of 450-455nm: the number of chips with a peak wavelength band of 462-467nm = 2:3:3:4; The peak wavelength bands of the second chip (16) are composed of 417-422nm, 437-442nm, 447-452nm, and 460-465nm; the number of chips with a peak wavelength band of 417-422nm: the number of chips with a peak wavelength band of 437-442nm: the number of chips with a peak wavelength band of 447-452nm: the number of chips with a peak wavelength band of 460-465nm = 2:3:3:4; The outer surfaces of the first convex mirror (21) and the second convex mirror (22) are both sputtered with mirror silver to form a mirror silver layer; In the step three, A fluorescent glue solution is prepared for the fluorescent glue layer (23), wherein the weight ratio of the glue, the infrared fluorescent powder with an emission peak of 730 nm, and the infrared fluorescent powder with an emission peak of 840 nm is 1 g: 0.3 g: 0.5 g; The 2700K phosphor is mixed in the ratio of glue: 525nm green powder: 540nm green powder: 655nm red powder = 3:0.5:0.8:0.135; The 6500K phosphor is mixed in the ratio of glue: 495nm green powder: 540nm green powder: 655nm red powder = 3: 0.05: 0.4: 0.022; The outer surface of the mirror silver layer is sputtered to form a fluorescent glue layer (23); In the step 4, 2700K ratio dispensing, dispensing to 27G chromaticity coordinates, color temperature is 2350-2550K, and then adopts thermal precipitation process, the chromaticity coordinates after thermal precipitation meet 273 chromaticity coordinates; 6500K ratio dispensing, dispensing to 65G chromaticity coordinates, color temperature is 5500-5650K, using thermal precipitation process, the chromaticity coordinates after thermal precipitation meet 653 chromaticity coordinates.

5. The anti-myopia LED packaging process according to claim 4, characterized in that: In the step 1, the first chip (13) and the second chip (16) are both 22*35mil2 chips.

6. The anti-myopia LED packaging process according to claim 4, characterized in that: In the step 1, the sputtering thickness of the mirror silver layer is 40 μm.

7. The anti-myopia LED packaging process according to claim 4, characterized in that: In the step three, the sputtering thickness of the fluorescent glue layer (23) is 2 um.

8. The anti-myopia LED packaging process according to claim 4, characterized in that: In the step 1, the light color quality of the second chip (16) satisfies Ra>95, R9>80; the light color quality of the first chip (13) satisfies Ra>95, R9>80.

9. The anti-myopia LED packaging process according to claim 4, characterized in that: In the step 4, during the dispensing at 2700K, the oven temperature is set at 45±5°C and the thermal precipitation is performed for 4H±5min.

10. The anti-myopia LED packaging process according to claim 4, characterized in that: In the step 4, during the 6500K dispensing, the oven temperature is set at 45±5°C and the thermal precipitation is performed for 4H±5min.

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