Heat dissipation structure, electronic device, heat sink and processing method

Abstract

The application discloses a heat dissipation structure, electronic equipment, a heat dissipator and a processing method thereof, and comprises a first heat conduction surface, a second heat conduction surface and a plurality of hard heat conduction insulation structures, wherein the first heat conduction surface is arranged on an electronic device; the second heat conduction surface is arranged on a heat dissipator and is matched with the first heat conduction surface; the hard heat conduction insulation structure is arranged between the first heat conduction surface and the second heat conduction surface; in addition, the hard heat conduction insulation structure has a filling gap for filling a soft heat conduction interface material. In the structure, the hard heat conduction insulation structure can play a certain binding role on the soft heat conduction interface material on one hand, and can avoid loss of effective components of the soft heat conduction interface material; on the other hand, by controlling the size of the hard heat conduction insulation structure, the situation that the soft heat conduction interface material is extruded due to deformation of the electronic device or the heat dissipator and causes failure of the heat conduction interface material can be avoided.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more specifically, to a heat dissipation structure, electronic device, heat sink, and processing method thereof. Background Technology

[0002] In electronic devices, heat dissipation structures are often used for heat dissipation. For example, thermal interface materials, such as thermal grease or thermal gel, are filled between the circuit board and the heat sink. These materials have both insulating and thermal conductive functions. However, conventional thermal interface materials have low hardness, which can lead to thermal and insulating failures between the circuit board and the heat sink in the following two situations: First, after long-term use, the thermal interface material may leak oil or become powdery, resulting in low heat dissipation efficiency and overheating or failure of the circuit board. Second, after long-term use, the circuit board may deform under gravity, compressing the thermal interface material and causing insulation and thermal conductivity failure.

[0003] In summary, how to solve the problems of poor insulation and heat dissipation effect of heat dissipation structures has become a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] In view of this, the present invention provides a heat dissipation structure, electronic device, heat sink and its processing method to solve the problems of poor insulation and heat dissipation effect of heat dissipation structure.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A heat dissipation structure, comprising:

[0007] The first heat-conducting surface is located on the electronic device;

[0008] The second heat-conducting surface is disposed on the heat sink and is adapted to the first heat-conducting surface;

[0009] A rigid thermally conductive and insulating structure is disposed between the first thermally conductive surface and the second thermally conductive surface;

[0010] The rigid thermally conductive insulating structure has a filling gap for filling the soft thermally conductive interface material.

[0011] Optionally, the rigid thermally conductive insulating structure is formed on the second thermally conductive surface.

[0012] Optionally, the rigid thermally conductive insulating structure comprises multiple rigid thermally conductive insulating particles;

[0013] The second thermally conductive surface has a plurality of fixing grooves adapted to the plurality of hard thermally conductive insulating particles, and the plurality of hard thermally conductive insulating particles are respectively fixed in the plurality of fixing grooves.

[0014] Optionally, the rigid thermally conductive insulating particles are spherical or square in shape.

[0015] Optionally, each of the rigid thermally conductive insulating particles is fixed in the fixing groove by one or more of the following methods: riveting, welding, bonding, and interference fit.

[0016] Optionally, the rigid thermally conductive insulating structure is a rigid thermally conductive insulating layer, and the rigid thermally conductive insulating layer has multiple protrusions on the side opposite to the second thermally conductive surface.

[0017] Optionally, the rigid thermally conductive insulating structure is formed on the first thermally conductive surface.

[0018] Optionally, the filling gaps of the rigid thermally conductive insulating structure are uniformly distributed between the first thermally conductive surface and the second thermally conductive surface.

[0019] Optionally, the heat sink includes a heat sink substrate and heat sink teeth, the heat sink teeth being disposed on a first surface of the heat sink substrate, and the second heat-conducting surface being disposed on a second surface of the heat sink substrate.

[0020] Optionally, the second heat-conducting surface is configured as a raised or recessed surface on the second surface of the heat dissipation substrate.

[0021] Optionally, the number of the first heat-conducting surfaces is multiple; and / or, the number of the second heat-conducting surfaces is multiple.

[0022] Optionally, the rigid thermally conductive insulating structure is made of silicon carbide, aluminum nitride, or composite plastic.

[0023] Compared to the background description, the aforementioned heat dissipation structure includes a first thermally conductive surface, a second thermally conductive surface, and multiple rigid thermally conductive insulating structures. The first thermally conductive surface is disposed on the electronic device; the second thermally conductive surface is disposed on the heat sink and is adapted to the first thermally conductive surface; the rigid thermally conductive insulating structures are disposed between the first thermally conductive surface and the second thermally conductive surface; in addition, the rigid thermally conductive insulating structures have filling gaps for filling with soft thermally conductive interface material. By designing the heat dissipation structure as described above, electronic devices can transfer heat to the soft thermally conductive interface material and the hard thermally conductive insulating structure through the first thermally conductive surface, and then the heat is transferred to the second thermally conductive surface through the soft thermally conductive interface material and the hard thermally conductive insulating structure, so that the heat can be dissipated through the heat sink. In this structure, due to the presence of the hard thermally conductive insulating structure, on the one hand, it can play a certain binding role for the soft thermally conductive interface material. The hard thermally conductive insulating structure forms a certain surface tension and blocking effect on the effective components of the soft thermally conductive interface material in its filling gap, avoiding the loss of the effective components of the soft thermally conductive interface material. On the other hand, by controlling the size of the hard thermally conductive insulating structure, the effective distance between the first thermally conductive surface and the second thermally conductive surface can be effectively adjusted, which can better control the thermal resistance and avoid the failure of the thermally conductive interface material due to the deformation of electronic devices or heat sinks squeezing the soft thermally conductive interface material, thus greatly improving the insulation and heat dissipation effect of the heat sink structure.

[0024] In addition, the present invention also provides an electronic device including a heat dissipation structure, wherein the heat dissipation structure is the heat dissipation structure described in any of the above embodiments. Since this heat dissipation structure has the aforementioned technical effects, the electronic device having this heat dissipation structure should also have corresponding technical effects, which will not be elaborated further here.

[0025] This invention also provides a heat sink, including a second thermally conductive surface adapted to a first thermally conductive surface on an electronic device, wherein a rigid thermally conductive insulating structure is disposed on the second thermally conductive surface; wherein the rigid thermally conductive insulating structure has a filling gap for filling a soft thermally conductive interface material. In practical applications, this heat sink achieves heat transfer between the heat sink and the electronic device by filling the filling gap of the rigid thermally conductive insulating structure with a soft thermally conductive interface material and then bonding it to the first thermally conductive surface of the electronic device. Under the action of the rigid thermally conductive insulating structure, on the one hand, it can exert a certain binding effect on the soft thermally conductive interface material, forming a certain surface tension and blocking effect on the effective components of the soft thermally conductive interface material in its filling gap, preventing the loss of the effective components of the soft thermally conductive interface material; on the other hand, by controlling the size of the rigid thermally conductive insulating structure, the effective distance between the first and second thermally conductive surfaces can be effectively adjusted, better controlling thermal resistance and preventing the failure of the thermally conductive interface material due to deformation of the electronic device or heat sink causing compression, thus greatly improving the insulation and heat dissipation effect of the heat sink's heat dissipation structure.

[0026] The present invention also provides a processing method for processing the heat sink described in the above-described scheme, the processing method comprising:

[0027] Form the second heat-conducting surface;

[0028] A rigid thermally conductive insulating structure is formed on the second thermally conductive surface.

[0029] Since the processing method used to process the aforementioned radiator inherits the core idea of ​​the aforementioned radiator and the two have the same inventive concept, the processing method also inherits the technical effect of the aforementioned radiator, which will not be elaborated here.

[0030] Optionally, the rigid thermally conductive insulating structure is formed on the second thermally conductive surface according to the following steps:

[0031] Fabricate multiple rigid thermally conductive insulating particles;

[0032] Multiple fixing grooves adapted to the multiple hard thermally conductive insulating particles are formed on the second thermally conductive surface;

[0033] The multiple rigid thermally conductive insulating particles are respectively fixed in the multiple fixing grooves.

[0034] Optionally, the rigid thermally conductive insulating structure is formed on the second thermally conductive surface according to the following steps:

[0035] A rigid thermally conductive insulating layer is fabricated on the second thermally conductive surface;

[0036] Material removal is performed on the rigid thermally conductive insulating layer to form multiple protrusion structures on the side of the rigid thermally conductive insulating layer opposite to the second thermally conductive surface.

[0037] Optionally, the material removal method of the hard thermally conductive insulating layer includes one or more of the three material removal methods: chemical etching, laser etching, and machining. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 A perspective view of the heat dissipation structure provided in an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of a first structure of a heat sink provided in an embodiment of the present invention;

[0041] Figure 3 This is a cross-sectional structural layout diagram of the heat sink provided in an embodiment of the present invention;

[0042] Figure 4 A schematic diagram of a first structure provided by an embodiment of the present invention, in which the second heat-conducting surface is configured as a boss surface on the second surface of a heat sink;

[0043] Figure 5 This is a schematic diagram of a second structure provided by an embodiment of the present invention, in which the second heat-conducting surface is configured as a boss surface on the second surface of a heat sink.

[0044] Figure 6 A schematic diagram of a structure provided in an embodiment of the present invention, showing a recessed surface on the second surface of a heat sink as the second heat-conducting surface;

[0045] Figure 7 This is a schematic diagram of the assembly structure of electronic devices and heat sinks provided in an embodiment of the present invention;

[0046] Figure 8 A flowchart of a processing method provided in an embodiment of the present invention.

[0047] in, Figures 1-8 middle:

[0048] Electrical component 1, first heat-conducting surface 10;

[0049] Heat sink 2, second heat-conducting surface 20, heat dissipation base plate 21, heat dissipation teeth 22;

[0050] 3. Rigid thermally conductive and insulating structure. Detailed Implementation

[0051] The core of this invention lies in providing a heat dissipation structure, electronic device, heat sink, and processing method thereof to solve the problems of poor insulation and heat dissipation effect of heat dissipation structures.

[0052] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0053] Reference Figures 1-7 As shown, the present invention specifically provides a heat dissipation structure, including a first heat-conducting surface 10, a second heat-conducting surface 20, and a rigid thermally conductive insulating structure 3.

[0054] The first thermally conductive surface 10 is disposed on the electronic device 1, which may be a circuit board, an electronic component mounted on the circuit board, or other heat source electronic devices known to those skilled in the art, without further specific limitations. The second thermally conductive surface 20 is disposed on the heat sink 2, and the second thermally conductive surface 20 is adapted to the first thermally conductive surface 10. Here, adaptation means that the second thermally conductive surface 20 and the first thermally conductive surface 10 are arranged opposite to each other, and at least a portion of the projection of one is located in the area of ​​the other. The rigid thermally conductive insulating structure 3 is disposed between the first thermally conductive surface 10 and the second thermally conductive surface 20. In addition, the rigid thermally conductive insulating structure 3 has a filling gap for filling the soft thermally conductive interface material.

[0055] It should be noted that the aforementioned soft thermally conductive interface material can be thermally conductive grease, thermally conductive gel, or thermally conductive silicone, etc. In actual applications, the corresponding insulating and thermally conductive material can be selected according to actual needs, without further specific limitations. Similarly, the material of the hard thermally conductive insulating structure 3 can be silicon carbide, aluminum nitride, or composite plastic, etc. In actual applications, the configuration can be selected according to actual needs.

[0056] By designing the heat dissipation structure into the above-mentioned structural form, refer to Figure 2 Combination Figure 1The electronic device 1 can transfer heat to the soft thermally conductive interface material and the hard thermally conductive insulating structure 3 through the first thermally conductive surface 10, and then the heat can be transferred to the second thermally conductive surface 20 through the soft thermally conductive interface material and the hard thermally conductive insulating structure 3, so that the heat can be dissipated through the heat sink 2. In this structure, due to the presence of the hard thermally conductive insulating structure 3, on the one hand, it can play a certain binding role for the soft thermally conductive interface material. The filling gap of the hard thermally conductive insulating structure 3 forms a certain surface tension and blocking effect on the effective components of the soft thermally conductive interface material, avoiding the loss of the effective components of the soft thermally conductive interface material. On the other hand, by controlling the size of the hard thermally conductive insulating structure 3, the effective distance between the first thermally conductive surface and the second thermally conductive surface can be effectively adjusted, which can better control the thermal resistance and avoid the failure of the thermally conductive interface material due to the deformation of the electronic device or heat sink. This greatly improves the insulation and heat dissipation effect of the heat sink structure.

[0057] In some specific implementations, the aforementioned rigid thermally conductive insulating structure 3 can be formed on the first thermally conductive surface 10, i.e., designed onto the electronic device 1. The advantage of this approach is that the supplier of the electronic device 1 can directly process and form the rigid thermally conductive insulating structure 3. For example, if the electronic device 1 has a unique form required for a specific product and is not a general standard device, this approach can be used. In this case, the heat sink 2 itself has no special requirements, and the heat sink 2 has greater selectivity. Alternatively, the rigid thermally conductive insulating structure 3 can also be formed on the second thermally conductive surface 20, i.e., designed onto the heat sink 2. The advantage of this approach is that it has no special requirements for the electronic device 1 and can better adapt to standard electronic devices 1. Furthermore, the rigid thermally conductive insulating structure 3 can also be formed within a soft thermally conductive interface material, such as rigid thermally conductive insulating particles filled within a soft thermally conductive interface material. The advantage of this approach is that both the electronic device 1 and the heat sink 2 can use standard devices. The disadvantage is that the uniformity of the distribution of the rigid thermally conductive insulating particles is not easily guaranteed. In practical applications, the arrangement can be selected according to actual needs.

[0058] In a further embodiment, the rigid thermally conductive insulating structure 3 can be specifically designed as a structure of multiple rigid thermally conductive insulating particles. Specifically, refer to... Figure 3When the rigid thermally conductive insulating structure 3 is formed on the second thermally conductive surface 20, the rigid thermally conductive insulating structure 3 is configured to have multiple fixing grooves adapted to multiple rigid thermally conductive insulating particles formed on the second thermally conductive surface 20, and the multiple rigid thermally conductive insulating particles are respectively fixed in the multiple fixing grooves. By designing the rigid thermally conductive insulating structure 3 as multiple rigid thermally conductive insulating particles and fixing them with fixing grooves, the arrangement position of the filling gaps of the rigid thermally conductive insulating structure 3 is more controllable, and it is easier to achieve the uniformity of the filling gap arrangement position of the rigid thermally conductive insulating structure 3. The forming method of the rigid thermally conductive insulating particles can be, but is not limited to, molding or cutting.

[0059] It should be noted that the specific shape of the aforementioned rigid thermally conductive insulating particles can be spherical. The advantage of a spherical design is that it facilitates processing and fits into the fixing groove. Alternatively, it can be designed as a cube. The advantage of a cube structure is that it increases the surface area of ​​the rigid thermally conductive insulating particles, thereby helping to improve the binding ability of the rigid thermally conductive insulating structure on the soft thermally conductive interface material. It is understood that the above-mentioned spherical or cube structure is merely an example of an embodiment of the present invention. In actual applications, other structural shapes can also be designed, such as cuboids, cylinders, etc., without further specific limitations.

[0060] It should also be noted that the aforementioned rigid thermally conductive insulating particles can be fixed in the fixing groove using one or more of the following methods: riveting, welding, bonding, and interference fit. Among these methods, the choice between riveting, welding, bonding, and interference fit depends primarily on whether the material of the second thermally conductive surface 20 meets the required process specifications. Once these requirements are met, the appropriate fixing method can be selected based on ease of manufacturing. Generally, bonding has the lowest process requirements and is simpler to operate. Furthermore, in practical applications, positioning fixtures can be used for positioning and bonding to ensure bonding efficiency and accuracy. In contrast, interference fit requires that the fixing groove on the second thermally conductive surface 20 and the rigid thermally conductive insulating particles meet the structural and material performance requirements for interference fit. Under these conditions, interference fit offers higher stability and avoids the problem of failure due to prolonged use compared to bonding. Moreover, using only one fixing method simplifies operation, while using a combination of at least two methods results in more stable and reliable fixing. You can choose the corresponding fixed form according to your actual needs; no further specific restrictions will be made here.

[0061] In some specific implementations, the aforementioned rigid thermally conductive insulating structure 3 on the second thermally conductive surface 20 can also be configured as a rigid thermally conductive insulating layer, and the side of the rigid thermally conductive insulating layer facing away from the second thermally conductive surface 20 has multiple protrusion structures. Specifically, a layer of rigid thermally conductive insulating material can be laminated onto the second thermally conductive surface 20, and the lamination method is not limited to plating, spraying, etc., and then multiple rigid thermally conductive insulating protrusions (i.e., the aforementioned multiple protrusion structures) are obtained by chemical etching, laser etching, or machining. Taking chemical etching as an example: First, a layer of hard interface material is covered on the second heat-conducting surface 20. Then, a chemical reagent (which only reacts with the hard interface material (i.e., the hard thermally conductive insulating layer) and does not contaminate the second heat-conducting surface 20) is used to etch away the excess hard interface material, leaving only the required effective protrusion. The cross-section of the effective protrusion reaches the effective cross-section of the required protrusion structure. Taking laser etching as an example: First, a layer of hard interface material is covered on the heat dissipation surface. Then, a laser is used to etch away the excess material, leaving only the required effective protrusion. When using the above two forming methods, a masking fixture can be used to etch away the unmasked parts. Taking machining as an example: First, a layer of hard interface material is covered on the second heat-conducting surface 20. Then, a CNC machining center can be used to mill away the excess hard material, leaving the required effective protrusion. The effective cross-section of the required protrusion structure can also be achieved.

[0062] It should be noted that, regardless of whether the rigid thermally conductive insulating structure 3 is designed as the aforementioned rigid thermally conductive insulating particles or as a raised structure, the corresponding rigid thermally conductive insulating particles or raised structure, except for the contact surface that needs to contact the electronic device 1 which is preferably configured as a smooth surface, can be designed as a rough surface, which can reduce the processing difficulty. Of course, it can also be designed as a smooth surface throughout. In practical applications, the corresponding structural form can be selected according to actual needs, and no further specific limitations are made here.

[0063] In some specific implementations, the thickness of the aforementioned flexible thermally conductive interface material is preferably designed to be no less than the thickness occupied by the rigid thermally conductive insulating structure 3 in the gap between the first thermally conductive surface 10 and the second thermally conductive surface 20. Preferably, the thickness of the flexible thermally conductive interface material is designed to be slightly greater than the thickness occupied by the rigid thermally conductive insulating structure 3 in the gap between the first thermally conductive surface 10 and the second thermally conductive surface 20, that is, the flexible thermally conductive interface material completely covers or just covers the rigid thermally conductive insulating structure 3. By designing this structure, the thermal resistance and insulation between the first thermally conductive surface 10 and the second thermally conductive surface 20 can be effectively guaranteed, and it is also helpful to fill the gap between the first thermally conductive surface 10 and the second thermally conductive surface 20 with thermally conductive interface material, which helps to improve the heat conduction effect. Furthermore, by adjusting the relevant dimensions of the rigid thermally conductive insulating structure 3, the gap between the first thermally conductive surface 10 of the electronic device 1 and the second thermally conductive surface 20 of the heat sink 2 can be adjusted to the required control gap.

[0064] It should be noted that, referring to Figure 1 and Figure 2 The filling gaps of the aforementioned rigid thermally conductive insulating structure 3 are preferably arranged in a uniform distribution between the first thermally conductive surface 10 and the second thermally conductive surface 20, such as in an array distribution. By designing the filling gaps to be uniformly distributed, the control gap between the first thermally conductive surface 10 and the second thermally conductive surface 20 becomes more uniform, which is beneficial for achieving stable heat transfer and insulation. Of course, it is understood that in practical applications, other non-uniform distribution methods can also be selected according to actual needs, and can be configured according to specific requirements; no further specific limitations are made here.

[0065] In some other specific implementation schemes, refer to Figure 2 and Figures 4-6 As shown, the aforementioned heat sink 2 may specifically include a heat dissipation substrate 21 and heat dissipation fins 22. The heat dissipation fins 22 are disposed on the first surface of the heat dissipation substrate 21, and the second heat-conducting surface 20 is disposed on the second surface of the heat dissipation substrate 21. The heat dissipation fins 22 are mainly used to dissipate heat; therefore, they are generally arranged in a certain order at intervals, primarily to increase the contact area with the heat dissipation environment and improve heat dissipation efficiency. It is understood that the aforementioned heat dissipation fins 22 are not essential; their presence simply improves the heat dissipation effect. Furthermore, the main forming materials of the heat sink include, but are not limited to, metals such as copper, aluminum, copper alloys, and aluminum alloys, and the forming methods include, but are not limited to, machining and mold forming.

[0066] It should be noted that the present invention does not specifically limit the structural form of the heat dissipation substrate 1; it can be a flat plate structure, as detailed in the references provided. Figure 4 and Figure 6 It can also be a box-shaped or shell-shaped structure, wherein the box-shaped and shell-shaped structures have at least one opening, as detailed in the reference. Figure 5 .

[0067] In a further implementation, the second heat-conducting surface 20 can be specifically configured as follows: Figure 4 and Figure 5 The boss surface on the second surface of the heat sink substrate 21 shown can also be configured as follows: Figure 6 The recessed surface on the second side of the heat dissipation substrate 21 shown. In practical applications, the configuration can be selected according to actual needs, and no further specific limitations are made here. By designing the structure of the above-mentioned raised or recessed surface, it is easier to position and operate the electronic device 1 when it is installed.

[0068] In some other specific implementations, the number of the first heat-conducting surfaces 10 can be one or more; similarly, the number of the second heat-conducting surfaces 20 can also be one or more. In practical applications, the configuration can be selected according to actual needs, and no further specific limitations are made here.

[0069] Additionally, refer to Figure 1 and Figure 7 The present invention also provides an electronic device, including a heat dissipation structure, wherein the heat dissipation structure is the heat dissipation structure described in any of the above embodiments. Since this heat dissipation structure has the aforementioned technical effects, the electronic device having this heat dissipation structure should also have corresponding technical effects, which will not be elaborated further here.

[0070] In addition, the present invention also provides a heat sink 2, including a second thermally conductive surface 20 adapted to a first thermally conductive surface 10 on an electronic device 1, wherein a rigid thermally conductive insulating structure 3 is provided on the second thermally conductive surface 20; wherein the rigid thermally conductive insulating structure 3 has a filling gap for filling a soft thermally conductive interface material.

[0071] In practical applications, the heat sink 2 achieves heat transfer between the heat sink and the electronic device 1 by filling the gaps in the rigid thermally conductive insulating structure 3 with a soft thermally conductive interface material and then attaching it to the first thermally conductive surface 10 of the electronic device 1. Under the action of the rigid thermally conductive insulating structure 3, on the one hand, it can restrain the soft thermally conductive interface material to a certain extent. The gaps in the rigid thermally conductive insulating structure 3 form a certain surface tension and blocking effect on the effective components of the soft thermally conductive interface material, preventing the loss of the effective components of the soft thermally conductive interface material. On the other hand, by controlling the size of the rigid thermally conductive insulating structure 3, the effective distance between the first thermally conductive surface 10 and the second thermally conductive surface 20 can be effectively adjusted, which can better control the thermal resistance and prevent the thermally conductive interface material from failing due to the deformation of the electronic device or heat sink and the squeezing of the soft thermally conductive interface material. This greatly improves the insulation and heat dissipation effect of the heat sink 2's heat dissipation structure.

[0072] To help those skilled in the art better understand the radiator 2 provided by the present invention, the present invention also provides a processing method for processing the radiator 2, referring to... Figure 8 Combination Figures 1-7 The processing method specifically includes:

[0073] Step S1: Process and form a second heat-conducting surface 20 on the heat sink 2. The heat sink 2 generally includes a heat sink substrate 21 and heat sink fins, such as heat sink teeth 22, disposed on the heat sink substrate 21. Of course, it is understood that the heat sink fins are not necessary. The second heat-conducting surface 20 can be disposed on the side of the heat sink substrate 21 that is away from the heat sink fins.

[0074] Step S2: Fabricate a rigid thermally conductive insulating structure 3 on the second thermally conductive surface 20.

[0075] Specifically, the rigid thermally conductive insulating structure 3 can be formed on the second thermally conductive surface 20 according to the following steps:

[0076] Step S21: Fabricate multiple hard thermally conductive and insulating particles, which can be formed by, but is not limited to, mold pressing or cutting.

[0077] Step S22: On the second heat-conducting surface 20 of the heat sink 2, multiple fixing grooves adapted to multiple hard thermally conductive insulating particles are made. The fixing grooves can be made by, but are not limited to, machining, stamping, etc.

[0078] Step S23: Fix multiple rigid thermally conductive insulating particles into multiple fixing grooves respectively. The fixing method can be, but is not limited to, one or at least a combination of two of the following methods: riveting, welding, bonding, interference fit, etc.

[0079] Among the various fixing methods—riveting, welding, bonding, and interference fit—the selection primarily depends on whether the material of the second heat-conducting surface 20 meets the required process specifications. Once these requirements are met, the appropriate fixing method can be chosen based on ease of fabrication. Generally, bonding has the lowest process requirements and is simplest to operate. Furthermore, in practical applications, positioning fixtures can be used to ensure bonding efficiency and accuracy. In contrast, interference fits require that the fixing groove on the second heat-conducting surface 20 and the rigid thermally conductive insulating particles meet the structural and material performance requirements for interference fits. Under these conditions, interference fits offer higher stability and do not fail over time compared to bonding. Additionally, using only one fixing method simplifies operation, while combining at least two methods results in more stable and reliable fixing. The appropriate fixing method can be selected based on actual needs; no further specific limitations are imposed here.

[0080] In addition, the aforementioned rigid thermally conductive insulating structure 3 can also be formed on the second thermally conductive surface 20 according to the following steps:

[0081] Step S21': A rigid thermally conductive insulating layer is formed on the second thermally conductive surface 20. The forming method can be, but is not limited to, composite, spraying, etc.

[0082] Step S22': Remove material from the hard thermally conductive insulating layer, for example, by one or more of chemical etching, laser etching and machining, so that multiple protrusion structures are formed on the side of the hard thermally conductive insulating layer away from the second thermally conductive surface 20.

[0083] Specifically, taking chemical etching as an example: first, a layer of hard interface material (i.e., the aforementioned hard thermally conductive insulating layer) is covered on the second thermally conductive surface 20. Then, a chemical reagent (which only reacts with the hard interface material and will not contaminate the second thermally conductive surface 20) is used to etch away the excess hard interface material, leaving only the required effective protrusion (i.e., the aforementioned protrusion structure). The cross-section of the effective protrusion reaches the effective cross-section of the required protrusion structure.

[0084] Taking laser etching as an example: First, a layer of hard interface material is covered on the heat dissipation surface, and the excess material is etched away using a laser, leaving only the required effective protrusions; when using the above two forming methods, a masking fixture can be used to etch away the unmasked parts.

[0085] Taking machining as an example: First, cover the second heat-conducting surface 20 with a layer of hard interface material. The excess hard material can be milled away by a CNC machining center, leaving the required effective protrusion. The effective cross section of the required protrusion structure can be achieved in the same way.

[0086] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0087] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0088] In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more.

[0089] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0090] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A heat dissipation structure, characterized in that, include: The first heat-conducting surface (10) is disposed on the electronic device (1); The second heat-conducting surface (20) is disposed on the heat sink (2) and is adapted to the first heat-conducting surface (10); A rigid thermally conductive insulating structure (3) is disposed between the first thermally conductive surface (10) and the second thermally conductive surface (20); The rigid thermally conductive insulating structure (3) has a filling gap for filling the soft thermally conductive interface material; The rigid thermally conductive insulating structure (3) is formed on the second thermally conductive surface (20); The rigid thermally conductive insulating structure (3) consists of multiple rigid thermally conductive insulating particles. Multiple fixing grooves adapted to the multiple rigid thermally conductive insulating particles are formed on the second thermally conductive surface (20). The multiple rigid thermally conductive insulating particles are respectively fixed in the multiple fixing grooves; or, the rigid thermally conductive insulating structure (3) consists of a rigid thermally conductive insulating layer. The side of the rigid thermally conductive insulating layer away from the second thermally conductive surface (20) has multiple protrusion structures. The electronic device (1) transfers heat to the soft thermal interface material and the hard thermal insulation structure (3) through the first thermally conductive surface (10), and then the heat is transferred to the second thermally conductive surface (20) by the soft thermal interface material and the hard thermal insulation structure (3). The hard thermal insulation structure (3) is formed on the second thermally conductive surface (20).

2. The heat dissipation structure as described in claim 1, characterized in that, The rigid thermally conductive insulating particles are spherical or square in shape.

3. The heat dissipation structure as described in claim 1, characterized in that, Each of the aforementioned rigid thermally conductive insulating particles is fixed in the fixing groove by one or more of the following methods: riveting, welding, bonding, and interference fit.

4. The heat dissipation structure as described in claim 1, characterized in that, The filling gap of the rigid thermally conductive insulating structure (3) is uniformly distributed between the first thermally conductive surface (10) and the second thermally conductive surface (20).

5. The heat dissipation structure as described in claim 1, characterized in that, The heat sink (2) includes a heat sink substrate (21) and heat sink teeth (22). The heat sink teeth (22) are disposed on the first side of the heat sink substrate (21), and the second heat-conducting surface (20) is disposed on the second side of the heat sink substrate (21).

6. The heat dissipation structure as described in claim 5, characterized in that, The second heat-conducting surface (20) is configured as a protruding or recessed surface on the second surface of the heat dissipation substrate (21).

7. The heat dissipation structure as described in claim 1, characterized in that, The number of the first heat-conducting surfaces (10) is multiple; and / or, the number of the second heat-conducting surfaces (20) is multiple.

8. The heat dissipation structure as described in claim 1, characterized in that, The rigid thermally conductive insulating structure is made of silicon carbide, aluminum nitride, or composite plastic.

9. An electronic device, comprising a heat dissipation structure, characterized in that, The heat dissipation structure is the heat dissipation structure as described in any one of claims 1-8.

10. A heat sink, comprising a second heat-conducting surface (20) adapted to mate with a first heat-conducting surface (10) on an electronic device (1), characterized in that, A rigid thermally conductive insulating structure (3) is provided on the second thermally conductive surface (20); wherein the rigid thermally conductive insulating structure (3) has a filling gap for filling a soft thermally conductive interface material; Wherein, the rigid thermally conductive insulating structure (3) is a plurality of rigid thermally conductive insulating particles, and a plurality of fixing grooves adapted to the plurality of rigid thermally conductive insulating particles are formed on the second thermally conductive surface (20), and the plurality of rigid thermally conductive insulating particles are respectively fixed in the plurality of fixing grooves; or, the rigid thermally conductive insulating structure (3) is a rigid thermally conductive insulating layer, and the side of the rigid thermally conductive insulating layer away from the second thermally conductive surface (20) has a plurality of protrusion structures; The electronic device (1) transfers heat to the soft thermal interface material and the hard thermal insulation structure (3) through the first thermally conductive surface (10), and then the heat is transferred to the second thermally conductive surface (20) by the soft thermal interface material and the hard thermal insulation structure (3). The hard thermal insulation structure (3) is formed on the second thermally conductive surface (20).

11. A processing method for processing the radiator as described in claim 10, characterized in that, The processing method includes: Form the second heat-conducting surface (20); A rigid thermally conductive insulating structure (3) is formed on the second thermally conductive surface (20); The rigid thermally conductive insulating structure (3) is formed on the second thermally conductive surface (20) according to the following steps: Fabricate multiple rigid thermally conductive insulating particles; Multiple fixing grooves adapted to the multiple hard thermally conductive insulating particles are formed on the second thermally conductive surface (20); The multiple rigid thermally conductive insulating particles are respectively fixed in the multiple fixing grooves; or, The rigid thermally conductive insulating structure (3) is formed on the second thermally conductive surface (20) according to the following steps: A rigid thermally conductive insulating layer is fabricated on the second thermally conductive surface (20); Material removal is performed on the rigid thermally conductive insulating layer to form multiple protrusion structures on the side of the rigid thermally conductive insulating layer away from the second thermally conductive surface (20).

12. The processing method as described in claim 11, characterized in that, The material removal methods for the hard thermally conductive insulating layer include one or more of the following three methods: chemical etching, laser etching, and machining.

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