Method for splitting coreless substrate, splitting device and storage medium

Abstract

The present application provides a method and apparatus for dividing a coreless substrate, and a storage medium, including: controlling an adsorption module to adsorb a target plate onto a fixing module, then controlling the fixing module to fix and move the target plate, and stopping the fixing module when a positioning module detects that the top of the target plate reaches a first position; then moving a cutting tool module to a second position, and then moving a first distance in a first direction at a first angle, so that a blade cuts a dividing opening in a carrier plate; then controlling a wire pulling module to move to a fourth position, so that a tangent line of the wire pulling module reaches the dividing opening; and dividing the target plate through the tangent line to separate the carrier plate and a first coreless substrate. Since the embodiments of the present application control the movement of each module with precise stroke calculation during the dividing process, cut a dividing opening with a blade, and then separate the coreless substrate from the carrier plate based on the dividing opening through the tangent line, and the copper surface of the coreless substrate will not be damaged.

Description

Technical Field

[0001] The present application relates to the field of electronic technologies, and particularly relates to a method for splitting a coreless substrate, a splitting device, and a storage medium. Background Art

[0002] The current development trend of electronic packaging technologies is to centrally pursue higher electrical performance and smaller three-dimensional dimensions. The trend of thinning electronic products also requires substrates to be thinner and thinner. Coreless substrates are next-generation packaging substrate technologies with broad application prospects. Coreless substrates, also called coreless substrates, are packaging substrates from which the core board has been removed, and they only retain insulating layers such as resin and prepreg and copper layers, and achieve high-density wiring through semi-additive processes.

[0003] One of the greatest challenges in applying coreless substrates is the warping problem. The magnitudes of warping and residual stress depend on the mechanical property mismatch between materials, the three-dimensional dimensions and structure of the substrate, curing conditions, the asymmetry of the laminate structure, circuit patterns, etc. During the manufacturing process of coreless substrates, it is necessary to separate the coreless substrate from the carrier board. In related technologies, the separation step is mainly carried out manually by technicians, with low work efficiency, and it is difficult to unify the force and balance during each board separation, easily damaging the copper surface of the coreless substrate. Summary of the Invention

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present application provides a method for splitting a coreless substrate, a splitting device, and a storage medium, which can effectively separate the coreless substrate from the carrier board without damaging the copper surface of the coreless substrate.

[0005] In a first aspect, an embodiment of the present application provides a method for splitting a coreless substrate, which is applied to a splitting device. The splitting device includes a positioning module, a fixing module, a suction module, a cutting tool module, and a wire pulling module. The splitting method includes:

[0006] Controlling the suction module to adsorb a target board to the fixing module, where the target board includes a carrier board and a first coreless substrate connected to a first surface of the carrier board;

[0007] Controlling the fixing module to fix the target board and controlling the fixing module to move;

[0008] When the positioning module detects that the top of the target board reaches a first position, controlling the fixing module to stop;

[0009] Move the cutting tool module to the second position so that the front end of the blade of the cutting tool module reaches the third position. The vertical distance from the third position to the first position is the first distance, the horizontal distance between the third position and the carrier plate is 0, the first distance is equal to the sum of the thickness of the first coreless substrate and the first preset length, the first preset length is less than the thickness of the carrier plate, and the difference between the second position and the first position is the second preset length;

[0010] Control the cutting tool module to move a first distance in a first direction at a first angle so that the blade cuts a scoring opening in the carrier plate, and the first distance is obtained according to the first angle and the first preset length;

[0011] Control the wire pulling module to move to the fourth position so that the tangent of the wire pulling module reaches the scoring opening;

[0012] Control the adsorption module to adsorb the first coreless substrate, and control the wire pulling module to move to perform a board splitting process on the target board through the tangent to separate the carrier plate and the first coreless substrate.

[0013] In some embodiments, the board splitting device further includes a brush module. The controlling the cutting tool module to move a first distance in a first direction at a first angle so that the blade cuts a scoring opening in the carrier plate includes:

[0014] Control the cutting tool module to move a first distance in a first direction at a first angle to cut a scoring mark on the carrier plate through the blade;

[0015] Control the cutting tool module to move a second distance in a second direction at the first angle so that the blade leaves the carrier plate, and the second direction is the opposite direction of the first direction;

[0016] Control the brush module to move to the fifth position, and control the brush module to perform a scraping process on the carrier plate along the scoring mark to form a scoring opening on the carrier plate.

[0017] In some embodiments, the board splitting device further includes a blowing module. The controlling the adsorption module to adsorb the first coreless substrate and controlling the wire pulling module to move includes:

[0018] Control the adsorption module to adsorb the first coreless substrate;

[0019] Control the wire pulling module to move so that the tangent moves horizontally from the scoring opening in the direction of the interior of the target board, and at the same time control the blowing module to blow in the moving direction of the tangent to perform a board splitting process on the target board through the tangent.

[0020] In some embodiments, controlling the wire pulling module to move to the fourth position such that the tangent of the wire pulling module reaches the sub-board opening includes:

[0021] Controlling the wire pulling module to move to the fourth position such that the tangent of the wire pulling module reaches the fifth position, where the fifth position is lower than the third position and reaches the sub-board opening.

[0022] In some embodiments, the fixing module includes a lifting unit, a bottom plate connected to the lifting unit, and a step structure disposed around the bottom plate, the height of the step structure being less than the thickness of the carrier plate. Controlling the fixing module to fix the target plate and controlling the fixing module to move includes:

[0023] Controlling the step structure of the fixing module to fixedly clamp the target plate placed on the bottom plate;

[0024] Controlling the lifting unit to move towards the first position.

[0025] In some embodiments, the step structure includes a first step, a second step, a third step, and a fourth step, and pressure detection units are disposed on the first step, the second step, the third step, and the fourth step. The length and width of the rectangle formed by the first step, the second step, the third step, and the fourth step are both greater than the length and width of the target plate. Controlling the step structure of the fixing module to fixedly clamp the target plate placed on the bottom plate includes:

[0026] The first step and the second step remain stationary, and the third step and the fourth step are respectively controlled to move so that the target plate approaches the first step and the second step;

[0027] When the pressures detected by the pressure detection units disposed on the first step, the second step, the third step, and the fourth step reach a preset pressure, controlling the third step and the fourth step to stop moving.

[0028] In some embodiments, the target plate further includes a second coreless substrate fixedly connected to the second surface of the carrier plate, and the sub-board device further includes a turning module. The method further includes:

[0029] Controlling the turning module to turn the target plate separated from the first coreless substrate and placing the turned target plate on the fixing module;

[0030] Control the fixing module to fix and process the target board, and control the fixing module to move;

[0031] When the positioning module detects that the top of the target board reaches the first position, control the fixing module to stop;

[0032] Move the cutting tool module to the second position so that the front end of the blade of the cutting tool module reaches the third position. The vertical distance from the third position to the first position is the first distance, the horizontal distance between the third position and the bearing plate is 0, the first distance is equal to the sum of the thickness of the second coreless substrate and the first preset length, the first preset length is less than the thickness of the bearing plate, and the difference between the second position and the first position is the second preset length;

[0033] Control the cutting tool module to move a first distance in a first direction at a first angle so that the blade cuts a board separation opening in the bearing plate, and the first distance is obtained according to the first angle and the first preset length;

[0034] Control the wire pulling module to move to the fourth position so that the tangent line of the wire pulling module reaches the board separation opening;

[0035] Control the adsorption module to adsorb the second coreless substrate, and control the wire pulling module to move to perform board separation processing on the target board through the tangent line to separate the bearing plate and the second coreless substrate.

[0036] In some embodiments, the board separation device further includes an image sensor. After the adsorption module adsorbs the target board onto the fixing module, the method further includes:

[0037] Control the image sensor to take a photo of the front and side of the target board to obtain a first photo;

[0038] Perform recognition processing on the target board in the first photo to obtain a side view of the target board;

[0039] Compare the side view of the target board with a preset side image template to obtain a comparison result;

[0040] When the comparison result meets the preset conditions, determine that the target board meets the subsequent processing steps.

[0041] In a second aspect, an embodiment of the present application provides a board separation device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor. The processor executes the program to implement the board separation method for the coreless substrate as described in the first aspect above.

[0042] In a third aspect, an embodiment of the present application provides a computer-readable storage medium storing computer-executable instructions for executing the method for splitting a coreless substrate as described in the first aspect above.

[0043] According to the technical solution of the embodiment of the present application, there are at least the following beneficial effects: First, control the adsorption module to adsorb the target board onto the fixing module, where the target board includes a carrier board and a first coreless substrate connected to the first surface of the carrier board; then control the fixing module to fix the target board and control the fixing module to move. When the positioning module detects that the top of the target board reaches the first position, control the fixing module to stop; then, move the cutting tool module to the second position so that the front end of the blade of the cutting tool module reaches the third position; then control the cutting tool module to move a first distance in a first direction at a first angle so that the blade cuts a splitting opening in the carrier board, and the first distance is obtained according to the first angle and a first preset length; then control the wire pulling module to move to the fourth position so that the tangent line of the wire pulling module reaches the splitting opening; finally, control the adsorption module to adsorb the first coreless substrate and control the wire pulling module to move to split the target board through the tangent line to separate the carrier board and the first coreless substrate. Since the embodiment of the present application performs splitting processing on the target board through an automated device, determines the initial position of the target board before processing through the positioning module during the splitting process, and then controls the positions of each module to move through precise stroke calculation, cuts a splitting opening in the carrier board through the blade, and then moves the path between the carrier board and the first coreless substrate in the target board starting from the splitting opening through the tangent line, so that the coreless substrate and the carrier board can be effectively separated through the tangent line, and the copper surface of the coreless substrate will not be damaged during the separation process.

[0044] The additional aspects and advantages of the present application will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present application. Description of the Drawings

[0045] The drawings are used to provide a further understanding of the technical solution of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation to the technical solution of the present application.

[0046] Figure 1 is a schematic diagram of a splitting device provided by an embodiment of the present application;

[0047] Figure 2 is a flowchart of the steps of a method for splitting a coreless substrate provided by an embodiment of the present application;

[0048] Figure 3It is a flowchart of the steps of the method for dividing a coreless substrate provided by another embodiment of the present application;

[0049] Figure 4 It is a flowchart of the steps of the method for dividing a coreless substrate provided by another embodiment of the present application;

[0050] Figure 5 It is a flowchart of the steps of the method for dividing a coreless substrate provided by another embodiment of the present application;

[0051] Figure 6 It is a schematic structural diagram of a controller for performing the method for dividing a coreless substrate provided by an embodiment of the present application. Detailed implementation manners

[0052] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application.

[0053] In the description of the present application, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0054] In the description of the present application, the meaning of several is one or more, the meaning of multiple is more than two, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If the first and second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence of the indicated technical features.

[0055] In the description of the present application, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present application in combination with the specific content of the technical solution.

[0056] The current development trend of electronic packaging technology is to pursue higher electrical performance and smaller three-dimensional dimensions. The trend of thinning of electronic products also requires the substrate to be thinner and thinner. The coreless substrate is a next-generation packaging substrate technology with broad application prospects. The coreless substrate is also called the coreless substrate, which is a packaging substrate without a core board. It only retains insulating layers such as resin and prepreg and copper layers, and realizes high-density wiring through a semi-additive process.

[0057] One of the biggest challenges in applying coreless substrates is the warping problem. The numerical values of warping and residual stress depend on the mechanical property mismatch between materials, the three-dimensional size and structure of the substrate, the curing conditions, the asymmetry of the laminated structure, the circuit pattern, etc. During the production process of coreless substrates, it is necessary to separate the coreless substrate from the carrier plate. In related technologies, the separation step is mainly carried out manually by technicians, with low work efficiency, and it is difficult to unify the force and balance during each separation, which is likely to damage the copper surface of the coreless substrate.

[0058] Based on the above situation, the embodiments of the present application propose a method for splitting a coreless substrate, a splitting device, and a storage medium, aiming to optimize drilling and improve drilling quality.

[0059] The following further elaborates on the method for splitting a coreless substrate according to the embodiments of the present application with reference to the accompanying drawings.

[0060] As Figure 1 shown, Figure 1 is a schematic diagram of a splitting device provided by an embodiment of the present application. The splitting device may include a positioning module 110, a fixing module 120, a suction module 130, a cutter module 140, and a wire-pulling module 150. Among them, the positioning module 110 is set at a preset position as required, and is used to position the initial position of the target board 160 before splitting, so as to serve as a reference for the movement control of other subsequent modules; the fixing module 120 is used to place the target board 160 and has the functions of fixing and moving the target board 160; the suction module 130 is used to perform a suction process on the target board 160 or the separated coreless substrate 162, and can move the target board 160 or the separated coreless substrate 162 to the target position; the cutter module 140 is used to cut the carrier board 161 to cut a splitting opening on the carrier board 161; the wire-pulling module 150 is used to split the target board 160.

[0061] In addition, in one embodiment, the fixing module 120 includes a lifting unit, a bottom plate 122 connected to the lifting unit, and a step structure 121 provided around the bottom plate 122. The height of the step structure 121 is less than the thickness of the carrier board 161, so that the step structure 121 can not only fix the target board 160, but also not block the connection position between the carrier board 161 and the coreless substrate 162.

[0062] It should be noted that the step structure 121 provided around the bottom plate 122 may include a first step, a second step, a third step, and a fourth step. The first step, the second step, the third step, and the fourth step may all be movable step structures 121, or the first step and the second step may be immovable, while the third step and the fourth step may be movable. The first step and the second step are vertically arranged. In this embodiment, the movement setting functions of the first step, the second step, the third step, and the fourth step are not specifically limited and can be set according to actual situations.

[0063] It should be noted that the lengths of the first step, the second step, the third step, and the fourth step may be set equal to the length and width of the plate that the board splitting device can process. The length of the first step and the third step parallel to the first step may be equal to the length of the long side of the target board 160 with the smallest size among the plates that can be processed, and the length of the second step and the fourth step parallel to the second step may be equal to the length of the short side of the target board 160 with the smallest size among the plates that can be processed. This embodiment does not specifically limit it.

[0064] In addition, in one embodiment, the board splitting device further includes a brush module. The brush module is used to perform a removal process on the carrier board 161 along the position where the knife marks have been cut on the carrier board 161 to form a board splitting opening on the carrier board 161. Using the brush module for the removal process will not damage the thin copper surface of the coreless substrate 162.

[0065] In addition, in one embodiment, the board splitting device further includes a blowing module. The blowing module is used to blow air in the direction of the cut during the wire cutting of the target board 160 by the wire pulling module 150 to disperse the particles generated during the wire cutting process and prevent the particles from remaining on the thin copper surface of the coreless substrate 162.

[0066] In addition, in one embodiment, the board splitting device further includes an image sensor for taking a picture of the target board 160 to obtain a side image of the target board 160. Specifically, it can be a charge-coupled device image sensor CCD (Charge Coupled Device), which is made of a high-sensitivity semiconductor material, can convert light into electric charges, convert them into digital signals through an analog-to-digital converter chip, and the digital signals are saved by the flash memory or the built-in hard disk card inside the camera after compression. Therefore, it can easily transmit the data to a computer and, with the help of the computer's processing means, modify the image according to needs and imagination.

[0067] In addition, in one embodiment, the board splitting device further includes a board turning module. The board turning module is used to perform a board turning process on the target board 160, mainly for the board with the coreless substrate 162 provided on both sides of the carrier board 161.

[0068] Such asFigure 2 As shown in Figure 2 FIG. 1 is a flowchart of steps of a method for dividing a coreless substrate provided by an embodiment of the present application. The method for dividing a coreless substrate in the embodiment of the present application is applied to the dividing device in the above embodiment. The dividing device includes a positioning module, a fixing module, an adsorption module, a cutting tool module, and a wire pulling module. The method for dividing a coreless substrate may include, but is not limited to, step S110, step S120, step S130, step S140, step S150, step S160, and step S170.

[0069] Step S110: Control the adsorption module to adsorb the target board onto the fixing module. The target board includes a carrier board and a first coreless substrate connected to the first surface of the carrier board.

[0070] Step S120: Control the fixing module to fix the target board and control the fixing module to move.

[0071] Step S130: When the positioning module detects that the top of the target board reaches the first position, control the fixing module to stop.

[0072] Step S140: Move the cutting tool module to the second position so that the front end of the blade of the cutting tool module reaches the third position. The vertical distance from the third position to the first position is the first distance, the horizontal distance between the third position and the carrier board is 0, the first distance is equal to the sum of the thickness of the first coreless substrate and the first preset length, the first preset length is less than the thickness of the carrier board, and the difference between the second position and the first position is the second preset length.

[0073] Step S150: Control the cutting tool module to move a first distance in a first direction at a first angle so that the blade cuts a dividing opening in the carrier board. The first distance is obtained according to the first angle and the first preset length.

[0074] Step S160: Control the wire pulling module to move to the fourth position so that the tangent of the wire pulling module reaches the dividing opening.

[0075] Step S170: Control the adsorption module to adsorb the first coreless substrate and control the wire pulling module to move to divide the target board through the tangent to separate the carrier board and the first coreless substrate.

[0076] According to the technical solution of the embodiment of the present application, first, control the adsorption module to adsorb the target board onto the fixing module, where the target board includes a carrier board and a first coreless substrate connected to the first surface of the carrier board; then control the fixing module to fix the target board and control the fixing module to move. When the positioning module detects that the top of the target board (i.e., the surface of the first coreless substrate) reaches the first position, control the fixing module to stop. The first position is the initial position for the board splitting process, and subsequent other steps are precisely calculated based on the initial position; then, move the cutting tool module to the second position so that the front end of the blade of the cutting tool module reaches the third position. The vertical distance from the third position to the first position is the first distance, and the horizontal distance between the third position and the carrier board is 0 (or the horizontal distance between the third position and the carrier board is 0.5 length units). The first distance is equal to the sum of the thickness of the first coreless substrate and the first preset length, and the first preset length is less than the thickness of the carrier board. The difference between the second position and the first position is the second preset length, that is, to make the front end of the blade close to the cutting position point of the carrier board, and then control the cutting tool module to move a first distance in the first direction at a first angle so that the blade cuts a splitting opening on the carrier board. The first distance is obtained according to the first angle and the first preset length, that is, to make the blade obliquely cut the carrier board from the cutting position point. By controlling the moved first distance, the blade just cuts to the connection position between the carrier board and the first coreless substrate; then control the wire pulling module to move to the fourth position so that the tangent of the wire pulling module reaches the splitting opening; finally, control the adsorption module to adsorb the first coreless substrate and control the wire pulling module to move to split the target board through the tangent, so as to separate the carrier board and the first coreless substrate, that is, the tangent starts the wire pulling operation from the splitting opening, and can perform wire cutting at the connection position between the carrier board and the first coreless substrate. When the tangent leaves the target board, the board splitting process is completed, so that the carrier board and the first coreless substrate are separated. Since the embodiment of the present application performs board splitting on the target board through an automated device, during the board splitting process, the initial position before processing the target board is determined by the positioning module, and then the positions of each module are controlled to move through precise stroke calculation, so as to cut a splitting opening on the carrier board with the blade, and then move the path between the carrier board and the first coreless substrate in the target board starting from the splitting opening through the tangent, so that the coreless substrate and the carrier board can be effectively separated by the tangent, and the copper surface of the coreless substrate will not be damaged during the separation process.

[0077] It should be noted that the first preset length can be set according to actual needs, and the present embodiment does not specifically limit it.

[0078] In addition, in one embodiment, when the target board includes a carrier board, a first coreless substrate fixedly connected to the first surface of the carrier board, and a second coreless substrate fixedly connected to the second surface, after completing the board separation process of the first coreless substrate and the carrier board based on the above embodiment, the turning module can be controlled to turn the target board separated from the first coreless substrate, and place the turned target board on the fixing module; then control the fixing module to fix the target board, and control the fixing module to move. When the positioning module detects that the top of the target board (i.e., the surface of the second coreless substrate) reaches the first position, control the fixing module to stop; then move the cutting tool module to the second position so that the front end of the blade of the cutting tool module reaches the third position. The vertical distance from the third position to the first position is the first distance, the horizontal distance between the third position and the carrier board is 0, the first distance is equal to the sum of the thickness of the second coreless substrate and the first preset length, the first preset length is less than the thickness of the carrier board, and the difference between the second position and the first position is the second preset length; then control the cutting tool module to move a first distance in the first direction at a first angle so that the blade cuts a board separation opening in the carrier board, and the first distance is obtained according to the first angle and the first preset length; then control the wire pulling module to move to the fourth position so that the tangent of the wire pulling module reaches the board separation opening; finally, control the adsorption module to adsorb the second coreless substrate, and control the wire pulling module to move to perform board separation processing on the target board through the tangent to separate the carrier board and the second coreless substrate. Since the embodiment of the present application performs board separation processing on the target board through an automated device, determines the initial position of the target board before processing through the positioning module during the board separation process, and then controls the positions of each module to move through precise stroke calculation, cuts a board separation opening in the carrier board through the blade, and then moves along the path between the carrier board and the first coreless substrate in the target board starting from the board separation opening through the tangent, so that the coreless substrate and the carrier board can be effectively separated through the tangent, and the copper surface of the coreless substrate will not be damaged during the separation process.

[0079] In addition, in one embodiment, the fixing module includes a lifting unit, a bottom plate connected to the lifting unit, and a step structure provided around the bottom plate. The height of the step structure is less than the thickness of the carrier board. The steps of controlling the fixing module to fix the target board and controlling the fixing module to move may include: controlling the step structure of the fixing module to fixedly clamp the target board placed on the bottom plate; controlling the lifting unit to move to the first position.

[0080] In addition, in one embodiment, the stepped structure includes a first step, a second step, a third step, and a fourth step. Pressure detection units are provided on the first step, the second step, the third step, and the fourth step. The length and width of the rectangle formed by the first step, the second step, the third step, and the fourth step are both greater than the length and width of the target board. The steps of controlling the stepped structure of the fixing module to fixedly clamp the target board placed on the bottom plate may include: the first step and the second step remain stationary, and the third step and the fourth step are respectively controlled to move so that the target board approaches the first step and the second step; when the pressure detected by the pressure detection units provided on the first step, the second step, the third step, and the fourth step reaches a preset pressure, control the third step and the fourth step to stop moving. It can automatically clamp the target board without deforming the target board.

[0081] It should be noted that the preset pressure can be set according to different target boards, as long as it can clamp the target board without deforming the target board. This embodiment does not make specific limitations on it.

[0082] In addition, as Figure 3 shown, Figure 3 is a flowchart of the steps of the board splitting method for a coreless substrate provided in another embodiment of the present application. The board splitting device further includes a brush module; the step S150 of the drilling optimization method in the embodiment of the present application may include but is not limited to step S310, step S320, and step S330.

[0083] Step S310: Control the cutter module to move a second distance in a first direction at a first angle to cut a knife mark on the carrier plate through the blade;

[0084] Step S320: Control the cutter module to move a third distance in a second direction at the first angle so that the blade leaves the carrier plate. The second direction is the opposite direction of the first direction, and the third distance is greater than the second distance;

[0085] Step S330: Control the brush module to move to a fifth position, and control the brush module to perform a removal process on the carrier plate along the knife mark to form a board splitting opening on the carrier plate.

[0086] In one embodiment, first, the included angle formed by the blade and the side surface of the carrier plate is the first angle. Then, the cutter module is controlled to move a second distance in the first direction. Since the positional relationship between the cutter module and the cutter is determined, the cutter also moves a second distance in the first direction, thereby cutting a knife mark on the carrier plate. Since the second distance is obtained by performing a cosine function calculation based on the first angle and the first preset length, the depth of the modified knife mark just reaches the connection between the carrier plate and the first coreless substrate. Then, the cutter module is controlled to move a third distance in the second direction at the first angle to make the blade leave the carrier plate. The second direction is the opposite direction of the first direction, and the third distance being greater than the second distance can ensure that the blade completely leaves the carrier plate. Then, the brush module is controlled to move to the fifth position, and the brush module is controlled to perform a removal process on the carrier plate along the knife mark to form a board separation opening on the carrier plate, that is, to remove the ineffective part on the carrier plate, obtaining a triangular board separation opening, so that the subsequent wire cutting process can be better completed.

[0087] In addition, as Figure 4 shown, Figure 4 FIG. is a flowchart of the steps of a method for separating a coreless substrate provided in another embodiment of the present application. The board separation device further includes a blowing module, which may include but is not limited to step S410 and step S420.

[0088] Step S410: Control the adsorption module to adsorb the first coreless substrate;

[0089] Step S420: Control the wire pulling module to move so that the cutting line starts from the board separation opening and moves horizontally in the inner direction of the target board, and at the same time control the blowing module to blow air in the moving direction of the cutting line to perform a board separation process on the target board through the cutting line.

[0090] In one embodiment, controlling the adsorption module to adsorb the first coreless substrate so that the first coreless substrate has an upward force, and controlling the wire pulling module to move so that the cutting line starts from the board separation opening and moves horizontally in the inner direction of the target board can smoothly cut the connection position between the first coreless substrate and the carrier plate through the cutting line. At the same time, controlling the blowing module to blow air in the moving direction of the cutting line can blow away the fine particles generated during the cutting process to prevent the fine particles from sticking to the thin copper surface of the first coreless substrate and affecting the yield of subsequent processes.

[0091] In addition, based on the above embodiments, step S160 may include: controlling the wire pulling module to move to the fourth position so that the cutting line of the wire pulling module reaches the fifth position, and the fifth position is lower than the third position and reaches the board separation opening.

[0092] Since the height of the fifth position is lower than that of the third position in the vertical direction, the position of the tangent line is slightly lower than the connection position between the carrier plate and the first coreless substrate. Then, during the process of the tangent line moving horizontally from the board-splitting opening towards the interior of the target board, a downward force will be exerted on the carrier plate, while the adsorption module exerts an upward adsorption force on the first coreless substrate. As a result, during the process of the tangent line cutting the target board, the carrier plate and the first coreless substrate are respectively subjected to two forces in opposite directions, which can make it easier for the tangent line to perform the board-splitting process on the target board. Moreover, since the tangent line exerts a force on the thick copper surface of the carrier plate, it can prevent the tangent line from damaging the copper surface of the first coreless substrate during the board-splitting process.

[0093] In addition, as Figure 5 shown, Figure 5 FIG. is a step flowchart of a method for splitting a coreless substrate provided by another embodiment of the present application. The method for splitting a coreless substrate may include but is not limited to step S510, step S520, and step S530.

[0094] Step S510: Control an image sensor to take a photo of the front and side of the target board to obtain a first photo;

[0095] Step S520: Perform recognition processing on the target board in the first photo to obtain a side view of the target board;

[0096] Step S530: Determine the board-splitting processing steps of the target board when the comparison result meets the preset conditions.

[0097] In one embodiment, in order to ensure that the position parameters in the board-splitting processing steps of the target board meet the requirements of the target board, before the board-splitting processing, first control an image sensor to take a photo of the front and side of the target board to obtain a first photo, and then perform recognition processing on the target board in the first photo to obtain a side view of the target board. Then, through the side view of the target board, a layered schematic diagram of the carrier plate and the coreless substrate may be recognized and generated. Then, the side view of the target board can be compared with a preset side image template, mainly comparing the thickness ratio relationship between the carrier plate and the coreless substrate, to obtain a comparison result. Then, when the comparison result meets the preset conditions, the board-splitting processing steps of the target board can be determined, so as to further effectively separate the coreless substrate from the carrier plate, and the copper surface of the coreless substrate will not be damaged during the separation process.

[0098] It should be noted that the preset conditions may be that the thickness ratio relationship between the carrier plate and the coreless substrate of the target board is the same as the thickness ratio relationship between the carrier plate and the coreless substrate of the preset side image template, or the ratio relationship is greater than 99.5%. This embodiment does not make specific limitations on it.

[0099] Based on the methods for dividing a coreless substrate according to the above various embodiments, the following will separately present various embodiments of the controller, the dividing device, and the computer-readable storage medium of the present application.

[0100] As Figure 6 shown, Figure 6 FIG. 7 is a schematic structural diagram of a controller for executing the method for dividing a coreless substrate according to an embodiment of the present application. The controller 600 implemented in the present application includes: a processor 610, a memory 620, and a computer program stored on the memory 620 and executable on the processor 610. Among them, Figure 6 in this example, one processor 610 and one memory 620 are taken as examples.

[0101] The processor 610 and the memory 620 can be connected through a bus or other means, Figure 6 in this example, connection through a bus is taken as an example.

[0102] The memory 620, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory 620 may include a high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory 620 may optionally include a memory 620 remotely disposed relative to the processor 610, and these remote memories 620 can be connected to the controller 600 through a network. Examples of the above network include but are not limited to the Internet, an enterprise intranet, a local area network, a mobile communication network, and combinations thereof.

[0103] Those skilled in the art can understand that Figure 6 the device structure shown in FIG. 7 does not limit the controller 600, and it may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0104] In Figure 6 the controller 600 shown in FIG. 7, the processor 610 can be used to call the program for dividing the coreless substrate stored in the memory 620, so as to implement the above method for dividing the coreless substrate. Specifically, the non-transitory software program and instructions required to implement the method for dividing the coreless substrate in the above embodiments are stored in the memory 620, and when executed by the processor 610, the method for dividing the coreless substrate in the above embodiments is executed.

[0105] It should be noted that since the controller 600 in the embodiments of the present application can execute the method for dividing the coreless substrate in any of the above embodiments, therefore, the specific implementation manners and technical effects of the controller 600 in the embodiments of the present application can refer to the specific implementation manners and technical effects of the method for dividing the coreless substrate in any of the above embodiments.

[0106] In addition, the board splitting device provided by an embodiment of the present application includes, but is not limited to, the above-mentioned controller.

[0107] It should be noted that since the board splitting device of the embodiment of the present application includes the controller of the above-mentioned embodiment, and the controller of the above-mentioned embodiment can execute the board splitting method of the coreless substrate in any of the above-mentioned embodiments, therefore, the specific implementation manners and technical effects of the board splitting device of the embodiment of the present application can refer to the specific implementation manners and technical effects of the board splitting method of the coreless substrate in any of the above-mentioned embodiments.

[0108] The device embodiments described above are merely illustrative. The modules described as separate components may or may not be physically separated, that is, they may be located in one place, or may be distributed to multiple network modules. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0109] In several embodiments provided by the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the above-mentioned module division is only a logical function division. In actual implementation, there may be other division methods. For example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point, the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces. The indirect coupling or communication connection of devices or modules can be in electrical, mechanical or other forms.

[0110] The modules described as separate components above may or may not be physically separated. The components shown as modules may or may not be physical modules, that is, they may be located in one place, or may be distributed to multiple network modules. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0111] In addition, each functional module in various embodiments of the present application can be integrated in a processing module, or each module can exist physically alone, or two or more modules can be integrated in one module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software functional modules.

[0112] In addition, an embodiment of the present application also provides a computer-readable storage medium, which stores computer-executable instructions for executing the above-mentioned board splitting method of the coreless substrate. Exemplarily, execute the Figures 2 to 5 method steps described above.

[0113] It should be noted that since the computer-readable storage medium of the embodiments of the present application can execute the panel splitting method of the coreless substrate in any of the above embodiments, therefore, for the specific implementation manners and technical effects of the computer-readable storage medium of the embodiments of the present application, reference can be made to the specific implementation manners and technical effects of the panel splitting method of the coreless substrate in any of the above embodiments.

[0114] Those of ordinary skill in the art can understand that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and their appropriate combinations. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or can be implemented as hardware, or can be implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium). As is well known to those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassette, tape, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, as is well known to those of ordinary skill in the art, a communication medium generally includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism, and can include any information delivery medium.

[0115] The present application provides a panel splitting method, a controller, a panel splitting device, and a storage medium for a coreless substrate.

[0116] The embodiments described in the embodiments of the present application are for more clearly illustrating the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art know that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0117] Those skilled in the art can understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than those shown, or combine some steps, or different steps.

[0118] Those of ordinary skill in the art will understand that all or some of the steps in the methods disclosed above, and the functional modules / units in systems and devices, can be implemented as software, firmware, hardware, and appropriate combinations thereof.

[0119] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of this application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products, or devices.

[0120] The above is a specific description of the preferred embodiments of this application, but this application is not limited to the above-mentioned embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of this application. These equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A method for dividing a coreless substrate, characterized in that Applied to a board-splitting device, the board-splitting device includes a positioning module, a fixing module, a suction module, a cutting tool module, and a wire-pulling module. The board-splitting method includes: Controlling the suction module to adsorb a target board onto the fixing module, where the target board includes a carrier board and a first coreless substrate connected to the first surface of the carrier board; Controlling the fixing module to fix the target board and controlling the fixing module to move; When the positioning module detects that the top of the target board reaches a first position, controlling the fixing module to stop; Moving the cutting tool module to a second position so that the front end of the blade of the cutting tool module reaches a third position. The vertical distance between the third position and the first position is a first distance, and the first distance is equal to the sum of the thickness of the first coreless substrate and a first preset length. The first preset length is less than the thickness of the carrier board, and the difference between the second position and the first position is a second preset length; Controlling the cutting tool module to move a second distance in a first direction at a first angle so that the blade cuts a board-splitting opening in the carrier board, and the second distance is obtained based on the first angle and the first preset length; Controlling the wire-pulling module to move to a fourth position so that the tangent line of the wire-pulling module reaches the board-splitting opening; Controlling the suction module to adsorb the first coreless substrate and controlling the wire-pulling module to move to split the target board through the tangent line to separate the carrier board and the first coreless substrate.

2. The method for dividing a coreless substrate according to claim 1, wherein The board-splitting device further includes a brush module. The controlling the cutting tool module to move a second distance in a first direction at a first angle so that the blade cuts a board-splitting opening in the carrier board includes: Controlling the cutting tool module to move a second distance in a first direction at a first angle to cut a knife mark in the carrier board through the blade; Controlling the cutting tool module to move a third distance in a second direction at a first angle so that the blade leaves the carrier board. The second direction is the opposite direction of the first direction, and the third distance is greater than the second distance; Controlling the brush module to move to a fifth position and controlling the brush module to perform a removing process along the knife mark on the carrier board to form a board-splitting opening on the carrier board.

3. The method for dividing a coreless substrate according to claim 1, wherein The board-splitting device further includes a blowing module. The controlling the suction module to adsorb the first coreless substrate and controlling the wire-pulling module to move includes: Controlling the suction module to adsorb the first coreless substrate; Controlling the wire-pulling module to move so that the tangent line moves horizontally from the board-splitting opening towards the inner direction of the target board, and at the same time controlling the blowing module to blow in the moving direction of the tangent line to split the target board through the tangent line.

4. The method for dividing a coreless substrate according to claim 3, wherein The controlling the wire-pulling module to move to a fourth position so that the tangent line of the wire-pulling module reaches the board-splitting opening includes: Controlling the wire-pulling module to move to a fourth position so that the tangent line of the wire-pulling module reaches a fifth position, and the fifth position is lower than the third position and reaches the board-splitting opening.

5. The method for dividing a coreless substrate according to claim 1, wherein The fixing module includes a lifting unit, a bottom plate connected to the lifting unit, and a step structure provided around the bottom plate. The height of the step structure is less than the thickness of the bearing plate. Controlling the fixing module to fix and process the target plate and controlling the fixing module to move includes: Controlling the step structure of the fixing module to fixedly clamp the target plate placed on the bottom plate; Controlling the lifting unit to move to the first position.

6. The method for dividing a coreless substrate according to claim 5, characterized in that, The step structure includes a first step, a second step, a third step, and a fourth step. Pressure detection units are provided on the first step, the second step, the third step, and the fourth step. The length and width of the rectangle formed by the first step, the second step, the third step, and the fourth step are both greater than the length and width of the target plate. Controlling the step structure of the fixing module to fixedly clamp the target plate placed on the bottom plate includes: The first step and the second step remain stationary, and the third step and the fourth step are respectively controlled to move so that the target plate approaches the first step and the second step; When the pressure detected by the pressure detection units provided on the first step, the second step, the third step, and the fourth step reaches a preset pressure, controlling the third step and the fourth step to stop moving.

7. The method for dividing a coreless substrate according to claim 1, wherein The target plate further includes a second coreless substrate fixedly connected to the second surface of the bearing plate. The board splitting device further includes a turning plate module. The method further includes: Controlling the turning plate module to turn over the target plate separated from the first coreless substrate and placing the turned-over target plate on the fixing module; Controlling the fixing module to fix the target plate and controlling the fixing module to move; When the positioning module detects that the top of the target plate reaches the first position, controlling the fixing module to stop; Moving the cutting tool module to the second position so that the front end of the blade of the cutting tool module reaches the third position. The vertical distance from the third position to the first position is the first distance, the horizontal distance between the third position and the bearing plate is 0, the first distance is equal to the sum of the thickness of the second coreless substrate and the first preset length, the first preset length is less than the thickness of the bearing plate, and the difference between the second position and the first position is the second preset length; Controlling the cutting tool module to move a first distance in a first direction at a first angle so that the blade cuts a board splitting opening in the bearing plate. The first distance is obtained according to the first angle and the first preset length; Controlling the wire pulling module to move to the fourth position so that the tangent of the wire pulling module reaches the board splitting opening; Controlling the adsorption module to adsorb the second coreless substrate and controlling the wire pulling module to move to split the target plate through the tangent to separate the bearing plate and the second coreless substrate.

8. The method for dividing a coreless substrate according to claim 1, wherein, The board splitting device further includes an image sensor. The method further includes: Control the image sensor to take a photo of the front and side of the target board to obtain a first photo; Perform recognition processing on the target board in the first photo to obtain a side view of the target board; Compare the side view of the target board with a preset side image template to obtain a comparison result; When the comparison result meets the preset conditions, determine the board splitting processing steps of the target board.

9. A board splitting device, characterized in that, It includes: A memory, a processor, and a computer program stored on the memory and executable on the processor. The processor executes the program to implement the board splitting method of the coreless substrate according to any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that, Stored with computer-executable instructions for executing the board splitting method of the coreless substrate according to any one of claims 1 to 8.

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