A radio frequency BGA three-temperature chip detection equipment

Abstract

The present invention provides a radio frequency BGA three-temperature chip detection device, comprising a body component and a three-temperature detection mechanism, wherein the body component comprises a detection chassis, a heat flow meter and a detection table; the present invention forms a sealed space between the clamp sealing plate and the clamp sealing cover by laminating the clamp sealing plate and the clamp sealing cover, and then injects dry low-temperature or high-temperature air into the clamp sealing cover through the heat flow meter, so that the chip in the clamp sealing cover can be tested under low-temperature, normal-temperature and high-temperature environments, and the flowing dry air can effectively dehumidify the space, avoiding the occurrence of frost and dew, ensuring the appearance of the product and the normal use of the equipment, and can introduce the high and low temperature air in the clamp sealing cover after use into a pre-cooling and preheating device, so that the pre-cooling and preheating device can be used to pre-cool or preheat the chip to be tested, so as to improve the efficiency of cooling or heating the chip during the detection process.

Description

Technical Field

[0001] The present invention relates to a detection device, in particular to a radio frequency BGA three-temperature chip detection device, belonging to the technical field of chip detection. Background Art

[0002] Chip, also known as integrated circuit, microcircuit, microchip or wafer, is a way of miniaturizing circuits in electronics and is often manufactured on the surface of semiconductor wafers. Three-temperature chip detection is one of the important processes in the chip production system. It mainly uses detection equipment to test chips at room temperature, low temperature and high temperature to ensure the quality of the products produced. Due to the rapid development of automotive electronics, automotive-grade chips also have mandatory high and low temperature experimental requirements. At the same time, clear requirements are put forward for the three-temperature testing of aerospace and military devices, and companies are required to strictly implement them. However, high and low temperature environment testing has always been a bottleneck in chip production, especially low temperature testing. When the temperature box is opened to replace the device, it is easy to cause frost and dew inside the equipment. When the chip heats up during the test, water will be formed, causing the chip to short-circuit or the water stains left behind will affect the appearance of the product and make it difficult to clean. In addition, frost on the equipment affects cooling and is easy to damage the equipment. However, the device is taken out for testing and meets the test requirements. For this reason, a radio frequency BGA three-temperature chip detection device is proposed. Summary of the Invention

[0003] In view of this, the present invention hopes to provide a radio frequency BGA three-temperature chip detection device to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial choice.

[0004] The technical solution of the embodiment of the present invention is implemented as follows: a radio frequency BGA three-temperature chip detection device includes a body component and a three-temperature detection mechanism, wherein the body component includes a detection chassis, a heat flow meter and a detection platform;

[0005] The three-temperature detection mechanism includes a fixture sealing plate, a fixture sealing cover, a pre-cooling and pre-heating device, a radio frequency control interface, a CCD camera and two absorbers;

[0006] The heat flow meter is arranged on the outside of the detection chassis, the detection platform is installed in the middle of the inner wall of the detection chassis, the fixture sealing plate is arranged above the detection platform, the fixture sealing cover is arranged above the fixture sealing plate, the fixture sealing plate and the fixture sealing cover are adapted to each other, the radio frequency control interface is installed at the bottom of the outer wall of the fixture sealing plate, the pre-cooling and pre-heating device is installed on the side of the upper surface of the detection platform close to the fixture sealing plate, the two absorbers are both arranged on the side of the upper surface of the detection platform away from the fixture sealing plate, and the CCD camera is arranged on the outside of the two absorbers.

[0007] Further preferably, a tray to be tested is installed in the middle of the upper surface of the test table, a good tray is provided on one side of the tray to be tested, and a bad tray is provided on the other side of the tray to be tested, and the bottoms of the good trays are all installed on the upper surface of the test table.

[0008] Further preferably, an X-axis driver is symmetrically mounted on the upper surface of the detection platform, and a Y-axis driver is mounted on the upper surface of the X-axis driver.

[0009] Further preferably, a Z-axis driver is installed on the upper surface of the Y-axis driver, and the CCD camera and two absorbers are installed on the outside of the Z-axis driver.

[0010] Further preferably, two air inlet pipes and two exhaust pipes are provided above the test bench, one end of one of the air inlet pipes is connected to the exhaust port of the heat flow instrument, the other end of the air inlet pipe is connected to the air inlet of the fixture sealing cover, one end of the other air inlet pipe is connected to the exhaust port of the fixture sealing cover, the other end of the air inlet pipe is connected to the air inlet of the pre-cooling and preheater, one end of one of the exhaust pipes is connected to the exhaust port of the fixture sealing cover, one end of the other exhaust pipe is connected to the exhaust port of the pre-cooling and preheater, and the other ends of the two exhaust pipes are connected to the air inlet of the heat flow instrument, and the middle part of the outer side wall of the two air inlet pipes and the two exhaust pipes is connected to an air inlet and exhaust control valve, the bottom of the air inlet and exhaust control valve is installed on the upper surface of the test bench, and pre-cooling and preheating can be achieved by controlling the solenoid valve, while providing high and low temperature for the test environment.

[0011] Further preferably, a display is installed on the top of the inner wall of the detection chassis.

[0012] Further preferably, a high and low temperature test bench is installed on the upper surface of the test bench, the fixture sealing plate is slidably connected to the upper surface of the high and low temperature test bench, a fixture bracket is installed on the side of the upper surface of the test bench close to the high and low temperature test bench, a fixture cylinder is installed on the inner side wall of the fixture bracket, and the piston rod of the fixture cylinder is fixedly connected to the bottom of the fixture sealing cover.

[0013] Further preferably, a driving cylinder is installed on the side of the upper surface of the test bench close to the high and low temperature test bench, the piston rod of the driving cylinder is fixedly connected to the bottom of the outer wall of the clamp sealing plate, a storage seat is installed in the middle of the upper surface of the clamp sealing plate, and a compressor is installed in the middle of the upper surface of the clamp sealing cover.

[0014] Since the embodiment of the present invention adopts the above technical solution, it has the following advantages: the present invention forms a sealed space between the fixture sealing plate and the fixture sealing cover by fitting them together, and then injects dry low-temperature or high-temperature air into the fixture sealing cover through a heat flow meter, so that the chip in the fixture sealing cover can be tested under low-temperature, normal temperature and high-temperature environments, and the flowing dry air can effectively dehumidify the space, avoiding the occurrence of frost and dew, ensuring the appearance of the product and the normal use of the equipment, and can introduce the high and low temperature air in the fixture sealing cover after use into the pre-cooling and preheating device, so that the pre-cooling and preheating device can be used to pre-cool or preheat the chip to be tested, so as to improve the efficiency of cooling or heating the chip during the detection process.

[0015] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 It is a structural diagram of the present invention;

[0018] Figure 2 It is a schematic diagram of a half-section structure of the present invention;

[0019] Figure 3 This is a schematic diagram of the axial side structure of the detection platform of the present invention;

[0020] Figure 4 This is a schematic diagram of the axial structure of the clamp sealing plate and the clamp sealing cover of the present invention;

[0021] Figure 5 It is a schematic diagram of the side sectional structure of the present invention.

[0022] Figure numerals: 1. Body assembly; 2. Three-temperature detection mechanism; 101. Detection chassis; 102. Heat flow meter; 103. Detection platform; 201. Fixture sealing plate; 202. Fixture sealing cover; 203. Pre-cooling and preheating device; 204. Radio frequency control interface; 205. CCD camera; 206. Absorber; 41. Disk to be tested; 42. Good disk; 43. Bad disk; 44. X-axis drive; 45. Y-axis drive; 46. Z-axis drive; 47. Intake pipe; 48. Exhaust pipe; 49. Intake and exhaust control valve; 50. Display; 51. High and low temperature test platform; 52. Fixture bracket; 53. Fixture cylinder; 54. Drive cylinder; 55. Storage seat; 56. Presser. DETAILED DESCRIPTION

[0023] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be considered as illustrative in nature and not restrictive.

[0024] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0025] like Figure 1-5 As shown, an embodiment of the present invention provides a radio frequency BGA three-temperature chip detection device, including a body component 1 and a three-temperature detection mechanism 2. The body component 1 includes a detection chassis 101, a heat flow meter 102 and a detection platform 103;

[0026] The three-temperature detection mechanism 2 includes a fixture sealing plate 201, a fixture sealing cover 202, a pre-cooling and pre-heating device 203, a radio frequency control interface 204, a CCD camera 205 and two absorbers 206;

[0027] The heat flow meter 102 is arranged on the outside of the detection chassis 101, the detection platform 103 is installed in the middle of the inner wall of the detection chassis 101, the fixture sealing plate 201 is arranged above the detection platform 103, the fixture sealing cover 202 is arranged above the fixture sealing plate 201, the fixture sealing plate 201 is adapted to the fixture sealing cover 202, the radio frequency control interface 204 is installed at the bottom of the outer wall of the fixture sealing plate 201, the pre-cooling and pre-heating device 203 is installed on the upper surface of the detection platform 103 close to the side of the fixture sealing plate 201, the two absorbers 206 are both arranged on the upper surface of the detection platform 103 away from the side of the fixture sealing plate 201, and the CCD camera 205 is arranged on the outside of the two absorbers 206.

[0028] In one embodiment, a test tray 41 is installed in the middle of the upper surface of the test table 103, a good tray 42 is provided on one side of the test tray 41, and a bad tray 43 is provided on the other side of the test tray 41, and the bottom of the good tray 42 is installed on the upper surface of the test table 103; good and bad chips are stored respectively by the good tray 42 and the bad tray 43 to distinguish the chips after testing.

[0029] In one embodiment, an X-axis driver 44 is symmetrically installed on the upper surface of the detection table 103, a Y-axis driver 45 is installed on the upper surface of the X-axis driver 44, and a Z-axis driver 46 is installed on the upper surface of the Y-axis driver 45. The CCD camera 205 and two extractors 206 are installed on the outside of the Z-axis driver 46; the Y-axis driver 45 is driven by the X-axis driver 44 to move along the X-axis as a whole, and then the Z-axis driver 46 is driven by the Y-axis driver 45 to move along the Y-axis, so as to move the CCD camera 205 and the extractor 206 to above the disk to be tested 41.

[0030] In one embodiment, two air inlet pipes 47 and two exhaust pipes 48 are provided above the test platform 103, one end of one air inlet pipe 47 is connected to the exhaust port of the heat flow meter 102, the other end of the air inlet pipe 47 is connected to the air inlet of the fixture sealing cover 202, one end of the other air inlet pipe 47 is connected to the exhaust port of the fixture sealing cover 202, the other end of the air inlet pipe 47 is connected to the air inlet of the pre-cooling and preheating device 203, one end of one exhaust pipe 48 is connected to the exhaust port of the fixture sealing cover 202, and the other end of the exhaust pipe 48 is connected to the exhaust port of the fixture sealing cover 202. One end of 48 is connected to the exhaust port of the pre-cooling and pre-heating device 203, and the other ends of the two exhaust pipes 48 are connected to the air inlet of the heat flow meter 102. The middle of the outer wall of the two intake pipes 47 and the two exhaust pipes 48 are connected to the intake and exhaust control valve 49, and the bottom of the intake and exhaust control valve 49 is installed on the upper surface of the detection platform 103; the opening and closing of the intake pipe 47 and the exhaust pipe 48 are controlled by the intake and exhaust control valve 49 to control whether the used air in the clamp sealing cover 202 enters the pre-cooling and pre-heating device 203.

[0031] In one embodiment, a display 50 is installed on the top of the inner wall of the detection chassis 101; the chip test process is displayed via the display 50.

[0032] In one embodiment, a high and low temperature test bench 51 is installed on the upper surface of the test bench 103, and a fixture sealing plate 201 is slidably connected to the upper surface of the high and low temperature test bench 51. A fixture bracket 52 is installed on the side of the upper surface of the test bench 103 close to the high and low temperature test bench 51, and a fixture cylinder 53 is installed on the inner side wall of the fixture bracket 52. The piston rod of the fixture cylinder 53 is fixedly connected to the bottom of the fixture sealing cover 202. A driving cylinder 54 is installed on the side of the upper surface of the test bench 103 close to the high and low temperature test bench 51, and the piston rod of the driving cylinder 54 is fixedly connected to the bottom of the outer side wall of the fixture sealing plate 201. A storage seat 55 is installed in the middle of the upper surface of the fixture sealing plate 201, and a compressor 56 is installed in the middle of the upper surface of the fixture sealing cover 202; the piston rod of the driving cylinder 54 drives the fixture sealing plate 201 to move, and the moving fixture sealing plate 201 is fitted with the fixture sealing cover 202, and then the fixture cylinder 53 drives the fixture sealing cover 202 to squeeze the fixture sealing plate 201, so that a sealed space is formed between the fixture sealing plate 201 and the fixture sealing cover 202, and then the chip in the storage seat 55 is squeezed by the compressor 56 to ensure the stability of the chip during the test.

[0033] In one embodiment, the device is a platform design, and the fixture can be quickly replaced to adapt to different products. The device also supports rotating test fixtures, supports three-temperature testing of Hall sensors, and can achieve front and bottom air outlets. It has good adaptability to products that require special auxiliary devices to test.

[0034] In one embodiment, the device is manufactured using conventional accessories, which reduces the cost of equipment manufacturing, maintenance, and use. Conventional accessories are easy to purchase and have a stable supply. Conventional screw modules have high precision, high performance, and are stable and reliable after long-term market testing, thereby enhancing the stability of the equipment.

[0035] In this embodiment, the other Y-axis driver 45 , the suction device 206 , and the CCD camera 205 appearing in the drawings of the specification are all extreme position simulations in the design and do not exist in reality.

[0036] When the present invention is working: the chip to be tested is placed in the test tray 41. When the chip needs to be tested, the X-axis driver 44 drives the Y-axis driver 45 to move along the X-axis as a whole, and then the Y-axis driver 45 drives the Z-axis driver 46 to move along the Y-axis, so that the CCD camera 205 and the sucker 206 are moved above the test tray 41. Then, the CCD camera 205 is used to capture images of the chip in the test tray 41, so that the control system can fine-tune the positions of the CCD camera 205 and the sucker 206 according to the visual feature coordinates to ensure that the sucker 206 can accurately suck in the chip. When the position adjustment of the sucker 206 is completed, the Z-axis driver 46 drives the sucker 206 to move the CCD camera 205 and the sucker 206. The absorber 206 moves along the Y-axis so that the bottom of the absorber 206 is fitted with the chip, and then the chip is absorbed by the absorber 206, and then the absorber 206 is driven to reset by the Z-axis driver 46, and then the Z-axis driver 46 is driven to move as a whole by the Y-axis driver 45, and then the Y-axis driver 45 is driven to move as a whole by the X-axis driver 44, so as to move the chip absorbed by the absorber 206 to the pre-cooling preheater 203, and then the tray at the pre-cooling preheater 203 is imaged by the CCD camera 205, and the position of the absorber 206 is fine-tuned using the image features, and then the absorber 206 is driven by the Z-axis driver 46 to accurately place the chip into the tray at the pre-cooling preheater 203, and then the chip is moved to the pre-cooling preheater 203 by the Z-axis driver 46. The low-temperature or high-temperature air after use in the fixture sealing cover 202 is introduced into the pre-cooling and preheating device 203 through the air inlet pipe 47, and then the chip is pre-cooled or preheated by the pre-cooling and preheating device 203 using the low-temperature or high-temperature air to improve the efficiency of cooling or heating the chip during the detection process. After the detection of the chips in the fixture sealing plate 201 and the fixture sealing cover 202 is completed, the Z-axis driver 46 drives the absorber 206 to suck out the pre-cooled or preheated chips and the chips after the detection is completed, and then the Y-axis driver 45 drives the Z-axis driver 46 to move. The chip after the detection of the moving Z-axis driver 46 is moved out of the storage seat 55 and reset, and then the moving Z-axis driver 46 moves the pre-cooled and preheated chip to The chip is placed on the object holder 55 and then captured by the CCD camera 205 again so as to fine-tune the position of the extractor 206 using the image features. The Z-axis driver 46 drives the extractor 206 to place the chip into the object holder 55. The piston rod of the driving cylinder 54 drives the clamp sealing plate 201 to move. The moving clamp sealing plate 201 fits the clamp sealing cover 202. The clamp sealing plate 201 is squeezed by the clamp cylinder 53 to form a sealed space between the clamp sealing plate 201 and the clamp sealing cover 202. The chip in the object holder 55 is squeezed by the pressing device 56 to ensure the stability of the chip during the test.Then, the low-temperature or high-temperature air dried by the air inlet pipe 47 is injected into the fixture sealing cover 202 through the heat flow meter 102 to perform high-temperature or low-temperature testing on the chip. Then, the other air inlet pipe 47 is closed and an exhaust pipe 48 is opened through the air inlet and exhaust control valve 49, so that the air used in the fixture sealing cover 202 is guided back to the air inlet of the heat flow meter 102 through the exhaust pipe 48. Then, the ATE software is driven by the instrument through the radio frequency control interface 204 to perform high-temperature or low-temperature testing on the chip. During the test, the dry air always flows rapidly in the space between the fixture sealing plate 201 and the fixture sealing cover 202, which can effectively dehumidify the space and avoid frost and dew, thereby ensuring the appearance of the product and the normal use of the equipment. When the low-temperature or high-temperature test is completed, the high-temperature or low-temperature air opposite to the previous test is injected into the fixture sealing cover 202 again through the air inlet pipe 47 through the heat flow meter 102, so that the temperature in the space between the fixture sealing plate 201 and the fixture sealing cover 202 quickly returns to normal temperature, so as to test the chip. The chip is tested at room temperature. After the normal temperature test is completed, the high-temperature or low-temperature air is continuously injected into the fixture sealing cover 202 through the heat flow meter 102 using the air inlet pipe 47 to continuously heat or cool the chip, so as to complete the low-temperature, normal-temperature and high-temperature tests on the chip. At the same time, one exhaust pipe 48 is closed through the air inlet and exhaust control valve 49, and the other air inlet pipe 47 is opened, so that the air exhausted from the fixture sealing cover 202 is introduced into the pre-cooling preheater 203 through the other air inlet pipe 47, and then the pre-cooling preheater is used. 203 preheats or precools the chips that need to be tested later. At the same time, during the chip testing process, the X-axis driver 44, Y-axis driver 45, and Z-axis driver 46 place the tested chips on the good product tray 42 or in the good product tray 42 according to the test results to distinguish the defective chips. At the same time, the X-axis driver 44, Y-axis driver 45, and Z-axis driver 46 move the chips to be tested in the test tray 41 to the precooling and preheating device 203 so that the chips can be tested continuously.

[0037] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various modifications and substitutions within the technical scope disclosed in the present invention, and such modifications and substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A radio frequency BGA three-temperature chip detection device, comprising a body component (1) and a three-temperature detection mechanism (2), characterized in that: The body assembly (1) includes a detection chassis (101), a heat flow meter (102) and a detection platform (103); The three-temperature detection mechanism (2) includes a fixture sealing plate (201), a fixture sealing cover (202), a pre-cooling and pre-heating device (203), a radio frequency control interface (204), a CCD camera (205) and two absorbers (206); The heat flow meter (102) is arranged on the outside of the detection box (101), the detection platform (103) is installed in the middle of the inner wall of the detection box (101), the fixture sealing plate (201) is arranged above the detection platform (103), the fixture sealing cover (202) is arranged above the fixture sealing plate (201), the fixture sealing plate (201) is adapted to the fixture sealing cover (202), the radio frequency control interface (204) is installed at the bottom of the outer wall of the fixture sealing plate (201), the pre-cooling and pre-heating device (203) is installed on the upper surface of the detection platform (103) close to the side of the fixture sealing plate (201), and the two said absorption The devices (206) are all arranged on the upper surface of the detection platform (103) away from the side of the fixture sealing plate (201), the CCD camera (205) is arranged on the outside of the two suckers (206), a disk to be tested (41) is installed in the middle of the upper surface of the detection platform (103), a good disk (42) is provided on one side of the disk to be tested (41), and a bad disk (43) is provided on the other side of the disk to be tested (41), and the bottom of the good disk (42) is installed on the upper surface of the detection platform (103); an X-axis driver (44) is symmetrically installed on the upper surface of the detection platform (103), and a Y-axis driver (45) is installed on the upper surface of the X-axis driver (44); Two air inlet pipes (47) and two air exhaust pipes (48) are provided above the test bench (103), one end of one of the air inlet pipes (47) is connected to the air exhaust port of the heat flow meter (102), the other end of the air inlet pipe (47) is connected to the air inlet of the clamp sealing cover (202), and one end of the other air inlet pipe (47) is connected to the air exhaust port of the clamp sealing cover (202); the other end of the air inlet pipe (47) is connected to the air inlet of the pre-cooling and preheating device (203), and one end of the air exhaust pipe (48) is connected to the air inlet of the pre-cooling and preheating device (203). One end of the pipe (48) is connected to the exhaust port of the clamp sealing cover (202), one end of the other exhaust pipe (48) is connected to the exhaust port of the pre-cooling and preheating device (203), and the other ends of the two exhaust pipes (48) are connected to the air inlet of the heat flow meter (102). The middle part of the outer wall of the two intake pipes (47) and the two exhaust pipes (48) are connected to the intake and exhaust control valve (49), and the bottom of the intake and exhaust control valve (49) is installed on the upper surface of the detection table (103).

2. The radio frequency BGA three-temperature chip detection equipment according to claim 1, characterized in that: The upper surface of the Y-axis driver (45) is respectively installed with a Z-axis driver (46), and the CCD camera (205) and two absorbers (206) are installed on the outside of the Z-axis driver (46).

3. The RF BGA three-temperature chip detection equipment according to claim 1, characterized in that: A display (50) is installed on the top of the inner side wall of the detection chassis (101).

4. The radio frequency BGA three-temperature chip detection equipment according to claim 1, characterized in that: A high and low temperature test bench (51) is installed on the upper surface of the test bench (103), the fixture sealing plate (201) is slidably connected to the upper surface of the high and low temperature test bench (51), a fixture bracket (52) is installed on the side of the upper surface of the test bench (103) close to the high and low temperature test bench (51), a fixture cylinder (53) is installed on the inner side wall of the fixture bracket (52), and the piston rod of the fixture cylinder (53) is fixedly connected to the bottom of the fixture sealing cover (202).

5. The radio frequency BGA three-temperature chip detection equipment according to claim 4, characterized in that: A driving cylinder (54) is installed on the upper surface of the test bench (103) near the high and low temperature test bench (51), and the piston rod of the driving cylinder (54) is fixedly connected to the bottom of the outer wall of the clamp sealing plate (201). A storage seat (55) is installed in the middle of the upper surface of the clamp sealing plate (201), and a pressing device (56) is installed in the middle of the upper surface of the clamp sealing cover (202).

Images