Heat dissipation structure and electronic equipment

Abstract

The embodiment of the present application provides a heat dissipation structure and electronic equipment, which relates to the field of heat dissipation technology and can improve the heat dissipation capacity of the heat dissipation structure. The heat dissipation structure includes a shell, a capillary structure, a steam chamber and a liquid; the shell includes an upper wall and a lower wall relative to each other and a side wall connecting the upper wall and the lower wall; the upper wall, the lower wall and the side wall surround and form a closed steam chamber; the liquid is located in the steam chamber; the upper wall includes a plurality of recessed structures, and the capillary structure is attached to the lower wall; wherein the recessed structure is a structure formed by the upper wall being recessed in a first direction, and the first direction is the direction from the upper wall to the lower wall.

Description

[0001] This application is a divisional application. The name of the original application is heat dissipation structure and electronic device, the application number of the original application is 202210342863.1, and the original application date is April 2, 2022. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic equipment. Background Art

[0003] As the functions of electronic devices such as laptops and tablets continue to upgrade, the power of functional components in electronic devices is also increasing, and the heat generated is also increasing.

[0004] In order to prevent functional devices from being damaged due to over-temperature, some heat dissipation structures such as vacuum chambers (VC) and heat pipes (HP) are usually set up in electronic devices.

[0005] However, the existing heat dissipation structure has the problem of weak heat dissipation capability. Summary of the invention

[0006] In order to solve the above technical problems, the present application provides a heat dissipation structure and an electronic device, which can improve the heat dissipation capacity of the heat dissipation structure.

[0007] In a first aspect, an embodiment of the present application provides a heat dissipation structure, which includes: a shell, a capillary structure, a steam chamber and a liquid; the shell includes an upper wall and a lower wall relative to each other and a side wall connecting the upper wall and the lower wall; the upper wall, the lower wall and the side wall surround and form a closed steam chamber; the liquid is located in the steam chamber; the upper wall includes a plurality of recessed structures, and the capillary structure is attached to the lower wall; wherein the recessed structure is a structure formed by the upper wall being recessed in a first direction; the first direction is the direction from the upper wall to the lower wall, which is also the direction perpendicular to the PCB.

[0008] By replacing the capillary structure of the upper wall with a concave structure, on the one hand, the heat exchange area can be increased, and the concave structure protruding toward the steam chamber effectively destroys the flow boundary layer, thinning the boundary layer and enhancing the disturbance of the fluid, thereby achieving the effect of enhancing heat exchange, avoiding wasting the heat dissipation of the auxiliary heat dissipation section and improving the utilization rate of the heat dissipation structure. On the other hand, compared with the capillary structure, when the steam encounters the concave structure, there will be no flow dead zone, and the heat will not accumulate locally, so that no local hot spots will be caused; and the steam can flow at a faster speed to the condensation section with better heat dissipation capacity, that is, the heat transfer efficiency is improved. In summary, the heat dissipation structure provided in the embodiment of the present application has high heat dissipation efficiency and strong heat dissipation capacity. It has been verified that the heat dissipation efficiency can be improved by 15%-20%.

[0009] In some possible implementations, the depression depth of the depression structure and the height of the steam chamber satisfy: h / 3≤z≤h / 2, wherein h is the height of the steam chamber along the first direction, and z is the depression depth of the depression structure along the first direction. This ensures that the steam is turbulent and the heat exchange effect is enhanced while not causing a large obstruction to the steam. The steam can flow more smoothly to the condensation section, and the heat can be dissipated through the condensation section with better heat dissipation capacity, thereby improving the heat dissipation efficiency.

[0010] In some possible implementations, the heat dissipation structure is divided into an evaporation section, an auxiliary heat dissipation section, and a condensation section; the evaporation section, the auxiliary heat dissipation section, and the condensation section are arranged in sequence; the recessed structure located in the evaporation section, the recessed structure located in the auxiliary heat dissipation section, and the recessed structure located in the condensation section are arranged in different ways, wherein the arrangement method includes at least one of size, shape, distance, and arrangement. Targeted arrangement of the recessed structures in different sections can further improve the heat dissipation efficiency and heat dissipation capacity of the heat dissipation structure.

[0011] In some possible implementations, based on the above-mentioned heat dissipation structure being divided into an evaporation section, an auxiliary heat dissipation section, and a condensation section, the distance between two adjacent recessed structures decreases from the evaporation section to the condensation section. In this way, the number of recessed structures in the evaporation section is small, the disturbance to the steam is weak, and the steam in the evaporation section can flow to the auxiliary heat dissipation section at a faster speed; while the number of recessed structures in the auxiliary heat dissipation section increases, the disturbance to the steam is enhanced, so that the effect of strengthening the heat dissipation can be achieved, the heat dissipation of the auxiliary heat dissipation section is not wasted, and the utilization rate of the heat dissipation structure is improved; the number of recessed structures in the condensation section is the largest, and the disturbance to the steam is the strongest, so the steam is fully in contact with the shell at the condensation section, so that the heat can be quickly dissipated through the condensation section.

[0012] In some possible implementations, on the basis of the reduction in the distance between two adjacent recessed structures, the distance between two adjacent recessed structures gradually decreases from the evaporation section to the condensation section.

[0013] In some possible implementations, on the basis of the reduction in the distance between the above-mentioned two adjacent recessed structures, the distance between two adjacent recessed structures in the same section is the same, and the distance between two adjacent recessed structures in different sections is different; and the distance between two adjacent recessed structures in the evaporation section is greater than the distance between two adjacent recessed structures in the auxiliary heat dissipation section, and the distance between two adjacent recessed structures in the auxiliary heat dissipation section is greater than the distance between two adjacent recessed structures in the condensation section.

[0014] In some possible implementations, based on the above-mentioned heat dissipation structure being divided into an evaporation section, an auxiliary heat dissipation section, and a condensation section, the size of the recessed structure increases from the evaporation section to the condensation section. In this way, the size of the recessed structure located in the evaporation section is smaller, the disturbance to the steam is weaker, and the steam located in the evaporation section can flow to the auxiliary heat dissipation section at a faster speed; while the size of the recessed structure in the auxiliary heat dissipation section increases, the disturbance to the steam is enhanced, so that the effect of strengthening the heat dissipation can be achieved, the heat dissipation of the auxiliary heat dissipation section is not wasted, and the utilization rate of the heat dissipation structure is improved; the size of the recessed structure in the condensation section is the largest, the disturbance to the steam is the strongest, and the steam is fully in contact with the shell at the condensation section, so that the heat is quickly dissipated through the condensation section.

[0015] In some possible implementations, based on the increase in the size of the above-mentioned recessed structure, the size of the recessed structure gradually increases from the evaporation section to the condensation section.

[0016] In some possible implementations, based on the increase in the size of the above-mentioned recessed structures, the sizes of the recessed structures located in the same section are the same, the sizes of the recessed structures located in different sections are different, and the size of the recessed structure located in the evaporation section is smaller than the size of the recessed structure located in the auxiliary heat dissipation section, and the size of the recessed structure located in the auxiliary heat dissipation section is smaller than the size of the recessed structure located in the condensation section.

[0017] In some possible implementations, when W≥3h, multiple recessed structures are arranged in an array; when W≤3h, multiple recessed structures are arranged crosswise; wherein W is the width of the heat dissipation structure along the second direction, and h is the height of the steam chamber along the first direction; the second direction is a direction perpendicular to the first direction and perpendicular to the third direction, and the third direction is the extension direction of the heat dissipation structure, and is also the direction from the evaporation section to the condensation section. In this way, the space of the upper wall can be better utilized, and the number of recessed structures can be increased while avoiding the distance between the centers of two adjacent recessed structures being too close.

[0018] In some possible implementations, the cross-sectional shape of the recessed structure includes a U-shaped ring, a semicircular ring, a semi-elliptical ring or other curved shapes. Such a configuration can make the steam flow smoother, avoid steam accumulation in the recessed structure, and allow it to flow more quickly to the condensation section for heat dissipation.

[0019] In some possible implementations, the material of the shell includes materials with good heat dissipation effect such as copper, which is conducive to the heat dissipation of the heat dissipation structure.

[0020] In a second aspect, an embodiment of the present application provides an electronic device, including the heat dissipation structure of the first aspect, which can achieve all the effects of the above heat dissipation structure.

[0021] In some possible implementations, the electronic device further includes a heating element, the heat dissipation structure is located on the heating element, and the upper wall is located on the side of the lower wall away from the heating element. The heat generated by the heating element in the electronic device is dissipated by the heat dissipation structure.

[0022] In some possible implementations, based on the above-mentioned electronic device including a heating element, the heating element includes a central processing unit, a battery, and the like.

[0023] In some possible implementations, the electronic device includes a laptop or a tablet computer, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a structural schematic diagram of a heat dissipation structure;

[0025] Figure 2 for Figure 1 Cross-section along AA' direction;

[0026] Figure 3 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0027] Figure 4 A schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application;

[0028] Figure 5 for Figure 4 A magnified view of the heat dissipation structure;

[0029] Figure 6 for Figure 5 Section along BB' direction;

[0030] Figure 7 for Figure 5 A cross-section along the CC' direction;

[0031] Figure 8 for Figure 5 Another cross-sectional view along CC' direction;

[0032] Fig. 9 for Figure 5 Another cross-sectional view along CC' direction;

[0033] Fig.10 is a structural schematic diagram of an upper wall;

[0034] Fig.11 A schematic diagram of a top view of a heat dissipation structure provided in an embodiment of the present application;

[0035] Fig.12 A schematic diagram of a top view of another heat dissipation structure provided in an embodiment of the present application;

[0036] Fig.13 A schematic diagram of a top view of another heat dissipation structure provided in an embodiment of the present application;

[0037] Fig.14 A schematic diagram of a top view of another heat dissipation structure provided in an embodiment of the present application;

[0038] Fig.15 A schematic diagram of a top view of another heat dissipation structure provided in an embodiment of the present application;

[0039] Fig.16 A schematic top view of another heat dissipation structure provided in an embodiment of the present application.

[0040] Reference numerals:

[0041] 10-heat dissipation structure; 20-display unit; 30-main unit; 40-PCB; 50-heat dissipation assembly; 60-heating element; 100-laptop computer;

[0042] 11-housing; 12-capillary structure; 13-steam chamber; 14-evaporation section; 15-auxiliary heat dissipation section; 16-condensation section; 111-upper wall; 112-lower wall; 113-side wall; 114-recessed structure;

[0043] 31-main body shell; 32-keyboard; 33-touch pad;

[0044] 51-Fan. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0046] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0047] The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects rather than to describe a specific order of target objects.

[0048] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0049] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more than two. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

[0050] Figure 1 It is a schematic diagram of a heat dissipation structure. Figure 2 for Figure 1 The cross-section along the AA' direction is as follows: Figure 1 and Figure 2 As shown, the heat dissipation structure 10 includes a shell 11, a capillary structure 12 and a steam chamber 13. Liquid is arranged in the steam chamber 13. The heat dissipation structure 10 is functionally divided into an evaporation section 14, an auxiliary heat dissipation section 15 and a condensation section 16. Its working principle is: when the evaporation section 14 is heated, the liquid in the capillary structure 12 in this area evaporates and vaporizes, and at the same time takes away a large amount of heat. Due to the effect of the pressure difference, the steam (with a lower density) moves to the condensation section 16 through the auxiliary heat dissipation section 15 in the upper layer of the steam chamber 13. After the condensation section 16 releases heat, it condenses into liquid, and the liquid returns to the evaporation section 14 with the help of the capillary force generated by the capillary structure 12, thereby completing a heat conduction cycle. Among them, the main purpose of setting the capillary structure 12 is to provide a certain barrier to the steam during the movement of the steam, so that the heat can be exchanged with the heat of the shell 11 to achieve the purpose of heat dissipation.

[0051] The applicant has discovered through research that when steam flows through the upper capillary structure 12, there will be a large number of dead zones, that is, the steam will accumulate in a certain area and cannot flow smoothly to the condensation section 16. This will not only cause local hot spots, but also increase the time it takes for the steam to flow to the condensation section 16, thereby reducing the heat dissipation efficiency, and the heat dissipation capacity of the heat dissipation structure 10 is relatively weak.

[0052] Based on this, the embodiment of the present application provides a heat dissipation structure. The heat dissipation structure provided in the embodiment of the present application forms a concave structure on the surface of the side away from the heating element, that is, the concave structure replaces the capillary structure. In the process of steam flowing from the evaporation section to the condensation section, the airflow passes through the turbulence of the concave structure, which enhances the heat exchange effect while eliminating the flow dead zone. Compared with the capillary structure, the steam can flow more smoothly, the heat will not accumulate locally, the heat dissipation efficiency is improved, and the heat dissipation capacity of the heat dissipation structure is strong.

[0053] The heat dissipation structure provided in the embodiment of the present application can be applied to electronic devices such as laptop computers, tablet computers, personal digital assistants (PDAs), car computers, televisions, mobile phones, smart home devices, etc. The heat dissipation structure can be used to disperse the heat generated by the heating elements in the electronic devices. Among them, the heating elements may include, for example, system on chip (SOC), power management IC (PMIC), central processing unit (CPU), battery and other functional devices that need heat dissipation.

[0054] The specific structure of the heat dissipation structure provided in the embodiment of the present application and the principle of achieving heat dissipation are described below in conjunction with an electronic device (taking a laptop computer as an example).

[0055] See also Figure 3 The laptop computer 100 includes a display unit 20 and a main body 30. The display unit 20 and the main body 30 are connected, for example, by a rotating shaft (not shown in the figure). The display unit 20 includes a display screen, which is used to convert a video signal output by the main body 30 into an image for display. The main body 30 is used to process information and data. The main body 30 includes a main body shell 31, a keyboard 32 and a touch pad 33. The main body shell 31, the keyboard 32 and the touch screen 33 can surround a housing cavity.

[0056] See also Figure 4 The receiving cavity is provided with a printed circuit board (PCB) 40, a heat dissipation assembly 50 and a heating element 60 (not shown in the figure). Figure 4 The description is made by taking the CPU as an example of the heat generating element 60. The CPU is arranged on the PCB 40. The heat generated by the CPU can be dissipated through the heat dissipation assembly 50.

[0057] The heat dissipation assembly 50 includes a fan 51 and a heat dissipation structure 10. The fan 51 and the heat dissipation structure 10 are fixed on a bracket (not shown in the figure). The bracket is fixed on the PCB 40 by a fixing structure such as screws. The heat dissipation structure 10 is located on the side of the CPU away from the PCB 40.

[0058] The heat dissipation structure 10 is divided into an evaporation section 14, an auxiliary heat dissipation section 15, and a condensation section 16. In a direction perpendicular to the PCB 40, the evaporation section 14 overlaps with the CPU, that is, the orthographic projection of the evaporation section 14 on the plane where the PCB 40 is located overlaps with the orthographic projection of the CPU on the plane where the PCB 40 is located. The condensation section 16 is adjacent to the fan 51.

[0059] It should be noted that the embodiment of the present application does not specifically limit the number of fans 51 and the shape of the heat dissipation structure 10. Figure 4 The description is made by taking the example that the number of the fan 51 is one and the shape of the heat dissipation structure 10 is "U".

[0060] See also Figure 5 and Figure 6 The cross-sectional shape of the heat dissipation structure 10 is flat. The flat shape includes, for example, a racetrack shape or a rounded rectangle. It is understandable that the racetrack shape can be a shape of two arcs and a rectangle on opposite sides, wherein the two arcs are arranged oppositely and the two arcs are adjacent to the opposite sides respectively.

[0061] See also Figure 6 and Figure 7 , the heat dissipation structure 10 includes a shell 11, a capillary structure 12 and a steam chamber 13. The shell 11 is a shell with a hollow structure. In a direction perpendicular to the PCB 40, the shell 11 includes an upper wall 111 and a lower wall 112 relative to each other, and also includes a side wall 113 connecting the upper wall 111 and the lower wall 112. The upper wall 111, the lower wall 112 and the side wall 113 surround and form a closed steam chamber 13. The upper wall 111 is located on the side of the lower wall 112 away from the CPU. The upper wall 111 includes a plurality of recessed structures 114, wherein the recessed structure 114 is a structure formed by the upper wall 111 being recessed in a direction from the upper wall 111 to the lower wall 112, that is, a structure formed by a partial area of ​​the upper wall 111 being recessed in a direction toward the steam chamber 13 is the recessed structure 114. The capillary structure 12 is attached to the lower wall 112. The capillary structure 12 is, for example, a structure formed by sintering copper powder or copper scraps. The process of forming the capillary structure 12 can refer to the existing technology, and the present embodiment will not be repeated. A liquid (not shown in the figure) is arranged in the steam chamber 13, wherein the liquid can be, for example, water. As for the volume of the liquid, the present embodiment does not limit the volume of the liquid, and those skilled in the art can set it according to the actual situation.

[0062] Specifically, the CPU generates heat when it is working, and the heat generated by the CPU heats the evaporation section 14 adjacent to the CPU. When the evaporation section 14 is heated, the liquid in the capillary structure 12 in this area evaporates and vaporizes, taking away a large amount of heat at the same time. Due to the effect of the pressure difference, the steam (with a lower density) flows in the upper layer of the steam chamber 13. The setting of the recessed structure 114 blocks the steam when it flows in the upper layer, so that the steam can exchange heat with the shell 11, thereby enhancing the heat exchange effect. Compared with the capillary structure provided on the upper wall 111 of the shell 11, the recessed structure 114 can make the steam flow more smoothly to the condensation section 16, and there is no dead zone for flow. In addition, since the condensation section 16 is adjacent to the fan 51. The rotation of the fan 51 can quickly dissipate the heat in the condensation section 16, so that the steam flowing to the condensation section 16 condenses into liquid after the condensation section releases heat, and the liquid then returns to the evaporation section with the help of the capillary force generated by the capillary structure 12, thereby completing a heat conduction cycle.

[0063] That is to say, by replacing the capillary structure with the recessed structure 114, on the one hand, the heat exchange area can be increased, and the recessed structure 114 protruding toward the steam chamber 13 effectively destroys the flow boundary layer, thinning the boundary layer and enhancing the disturbance of the fluid, thereby achieving the effect of enhancing heat exchange, so as not to waste the heat dissipation of the auxiliary heat dissipation section 15, and improving the utilization rate of the heat dissipation structure 10. On the other hand, compared with the capillary structure, when the steam encounters the recessed structure 114, there will be no flow dead zone, and the heat will not accumulate locally, so that no local hot spots will be caused; and the steam can flow at a faster speed to the condensation section 16 with better heat dissipation capacity, that is, the heat transfer efficiency is improved. In summary, the heat dissipation structure 10 provided in the embodiment of the present application has high heat dissipation efficiency and strong heat dissipation capacity. It has been verified that the heat dissipation efficiency can be improved by 15%-20%.

[0064] Regarding the formation process of the recessed structure 114 , the embodiment of the present application does not limit the formation process of the recessed structure 114 .

[0065] In a possible implementation, the flat upper wall 111 of the housing 11 is extruded by a pressing head, wherein the shape of the pressing head is, for example, spherical or elliptical.

[0066] When the shape of the pressure head is circular, the diameter of the pressure head and the height of the steam chamber 13 satisfy: h / 2≤D≤h, where D is the diameter of the pressure head and h is the height of the steam chamber 13. In this way, the depression depth of the depression structure 114 formed by extrusion is moderate, that is, the disturbance of the fluid is enhanced, the heat exchange effect is enhanced, and no significant obstruction is caused to the steam, that is, the steam can flow faster to the condensation section 16 with better heat dissipation capacity.

[0067] Exemplarily, in the direction perpendicular to the PCB 40, the depression depth of the depression structure 114 and the height of the steam chamber 13 satisfy: h / 3≤z≤h / 2, where z is the depression depth of the depression structure 114. In this way, the depression depth of the depression structure 114 will not be too small to cause disturbance, nor will the depression depth of the depression structure 114 be too large to cause a large obstruction to the steam. Therefore, in this embodiment, the depression depth of the depression structure 114 and the height of the steam chamber 13 satisfy: h / 3≤z≤h / 2, so as to ensure that the steam is disturbed and the heat exchange effect is enhanced, and at the same time, the steam will not be greatly obstructed, so that the steam can flow to the condensation section 16 more smoothly, and the heat can be dissipated through the condensation section 16 with better heat dissipation capacity, thereby improving the heat dissipation efficiency.

[0068] Regarding the shape of the recessed structure 114 , the embodiment of the present application does not limit the shape of the recessed structure 114 , and those skilled in the art may configure the shape according to actual conditions.

[0069] For example, the cross-sectional shape of the recessed structure 114 may include a semi-elliptical ring (eg Figure 7 As shown), semicircular ring (as Figure 8 As shown), U-shaped ring (as Fig. 9 Such an arrangement can make the steam flow smoother, avoid the accumulation of steam in the recessed structure 114, and allow the steam to flow to the condensation section 16 more quickly for heat dissipation.

[0070] The material of the housing 11 is not limited in the present embodiment, as long as it has a good heat dissipation effect, such as copper, aluminum, steel, etc.

[0071] It is understandable that when the material of the shell 11 is different, the size of the concave structure 114 formed by extrusion is different. Exemplarily, when the material of the shell 11 is copper, the size of the concave structure 114 is larger, but when the material of the shell 11 is steel (the elastic module is larger than copper), the size of the concave structure 114 is smaller, that is, if the same pressing head is used to extrude the flat upper wall 111 to form the concave structure 114, as the elastic module of the material of the shell 11 increases, the size of the concave structure 114 decreases. The so-called size of the concave structure 114 is the size of the orthographic projection of the concave structure 114 on the plane where the PCB 40 is located. If the shape of the orthographic projection of the concave structure 114 on the plane where the PCB 40 is located is circular, the size of the orthographic projection of the concave structure 114 on the plane where the PCB 40 is located is the diameter; if the shape of the orthographic projection of the concave structure 114 on the plane where the PCB 40 is located is elliptical, the size of the orthographic projection of the concave structure 114 on the plane where the PCB 40 is located is the major axis and the minor axis of the ellipse.

[0072] When the material of the housing 11 is fixed, the size of the recessed structure 114 formed by the pressing head is fixed. Considering that if the distance between the centers of two adjacent recessed structures 114 is too close, Fig.10 , the intersection of the two recessed structures 114 will form a sharp angle, which is not conducive to the flow of steam. Therefore, it is necessary to increase the distance between the centers of the two adjacent recessed structures 114. However, since the width of the heat dissipation structure 10 is fixed and narrow, and the size of the recessed structures 114 is also fixed, if they are arranged along the width direction of the heat dissipation structure 10, there may be a problem of a sharp angle at the intersection of the two adjacent recessed structures 114. However, if they are only arranged along the extension direction of the heat dissipation structure 10, the number of recessed structures 114 is small and the heat exchange effect is weak.

[0073] Based on this, the arrangement of the recessed structures 114 can be set according to the width of the heat dissipation structure 10 .

[0074] In a possible implementation, when the width W of the heat dissipation structure 10 is large, see Fig.11 , the recessed structures 114 can be arranged in an array. When the width W of the heat dissipation structure 10 is small, see Fig.12 , the recessed structures 114 can be arranged crosswise. Exemplarily, when the width W of the heat dissipation structure 10 and the steam cavity h satisfy: W ≥ 3h, the recessed structures 114 are arranged in an array; when W ≤ 3h, the recessed structures 114 are arranged crosswise. It has been verified that such a setting can better utilize the space of the upper wall 111, and while avoiding the distance between the centers of two adjacent recessed structures 114 being too close, the number of recessed structures 114 can also be increased.

[0075] In addition, considering that the evaporation section 14 is mainly for liquid evaporation and vaporization to take away heat, the liquid needs to flow quickly to the auxiliary heat dissipation section 15 after evaporation. The auxiliary heat dissipation section 15 is mainly for enhanced heat dissipation. When the steam is in the auxiliary heat dissipation section 15, its flow speed can be slightly slowed down to achieve the effect of enhanced heat exchange and not to waste the heat dissipation of the auxiliary heat dissipation section 15. The condensation section 16 is mainly for heat dissipation, so the steam flowing to the condensation section 16 can be slower, so that the steam can fully exchange heat with the condensation section 16, thereby dissipating the heat. In other words, from the evaporation section 14 to the condensation section 16, the flow speed of the steam gradually decreases.

[0076] There are many ways to gradually reduce the flow rate of steam from the evaporation section 14 to the condensation section 16. Two methods are introduced below. The following examples do not constitute a limitation of the present application.

[0077] For a possible implementation, see Fig.13 From the evaporation section 14 to the condensation section 16 , the distance between two adjacent recessed structures 114 decreases.

[0078] From the evaporation section 14 to the condensation section 16, the distance between two adjacent recessed structures 114 can be reduced as follows: Fig.13 The distance between two adjacent recessed structures 114 in the same section is the same, the distance between two adjacent recessed structures 114 in different sections is different, and the distance between two adjacent recessed structures 114 in the evaporation section 14 is greater than the distance between two adjacent recessed structures 114 in the auxiliary heat dissipation section 15, and the distance between two adjacent recessed structures 114 in the auxiliary heat dissipation section 15 is greater than the distance between two adjacent recessed structures 114 in the condensation section 16.

[0079] Also available: See Fig.14 , from the evaporation section 14 to the condensation section 16, the distance between two adjacent recessed structures 114 gradually decreases. That is, along the direction from the evaporation section 14 to the condensation section 16 (i.e., the extension direction of the heat dissipation structure 10), the distance between two adjacent recessed structures 114 in the same section gradually decreases, and the distance between two adjacent recessed structures 114 in the evaporation section 14 is greater than the distance between two adjacent recessed structures 114 in the auxiliary heat dissipation section 15, and the distance between two adjacent recessed structures 114 in the auxiliary heat dissipation section 15 is greater than the distance between two adjacent recessed structures 114 in the condensation section 16.

[0080] Specifically, the distance between two adjacent recessed structures 114 located in the evaporation section 14 is large, and the number of recessed structures 114 is small, so the disturbance of the steam by the recessed structures 114 is weak, so that the steam can flow to the auxiliary heat dissipation section 15 faster. The distance between two adjacent recessed structures 114 located in the auxiliary heat dissipation section 15 is between the distance between the two recessed structures 114 located in the evaporation section 14 and the distance between the two recessed structures 114 located in the condensation section 16, and the number of recessed structures 114 located in the auxiliary heat dissipation section 15 is between the number of recessed structures 114 located in the evaporation section 14 and the number of recessed structures 114 located in the condensation section 16, so the disturbance of the steam is enhanced, so that the effect of strengthening the heat dissipation can be achieved, the heat dissipation of the auxiliary heat dissipation section 15 is not wasted, and the utilization rate of the heat dissipation structure 10 is improved. The distance between two adjacent recessed structures 114 located in the evaporation section 14 is small, and the number of recessed structures 114 located in the condensation section 16 is the largest, which causes the strongest disturbance to the steam. The steam is in full contact with the outer shell 11 at the condensation section 16 to quickly dissipate the heat through the condensation section 16.

[0081] In another possible implementation, see Fig.15 , from the evaporation section 14 to the condensation section 16 , the size of the recessed structure 114 increases.

[0082] From the evaporation section 14 to the condensation section 16, the size of the recessed structure 114 may increase as follows: Fig.15 The sizes of the recessed structures 114 located in the same section are the same, and the sizes of the recessed structures 114 located in different sections are different. The size of the recessed structure 114 located in the evaporation section 14 is smaller than the size of the recessed structure 114 located in the auxiliary heat dissipation section 15, and the size of the recessed structure 114 located in the auxiliary heat dissipation section 15 is smaller than the size of the recessed structure 114 located in the condensation section 16.

[0083] Exemplarily, the shape of the orthographic projection of the recessed structure 114 on the plane where the PCB 40 is located is a circle, the diameters of the multiple recessed structures 114 located in the evaporation section 14 are the same, the diameters of the multiple recessed structures 114 located in the auxiliary heat dissipation section 15 are the same, and the diameters of the multiple recessed structures 114 located in the condensation section 16 are the same; the diameter of the recessed structure 114 located in the evaporation section 14 is smaller than the diameter of the recessed structure 114 located in the auxiliary heat dissipation section 15, and the diameter of the recessed structure 114 located in the auxiliary heat dissipation section 15 is smaller than the diameter of the recessed structure 114 located in the condensation section 16.

[0084] Also available: See Fig.16 , the size of the recessed structure 114 gradually increases from the evaporation section 14 to the condensation section 16. That is, along the direction from the evaporation section 14 to the condensation section 16 (i.e., the extension direction of the heat dissipation structure 10), the size of the recessed structure 114 in the same section gradually increases, and the size of the recessed structure 114 in the evaporation section 14 is smaller than the size of the recessed structure 114 in the auxiliary heat dissipation section 15, and the size of the recessed structure 114 in the auxiliary heat dissipation section 15 is smaller than the size of the recessed structure 114 in the condensation section 16.

[0085] Exemplarily, the shape of the orthographic projection of the recessed structure 114 on the plane where the PCB 40 is located is a circle, the diameters of the multiple recessed structures 114 located in the evaporation section 14 gradually increase, the diameters of the multiple recessed structures 114 located in the auxiliary heat dissipation section 15 gradually increase, and the diameters of the multiple recessed structures 114 located in the condensation section 16 gradually increase; the diameter of the recessed structure 114 located in the evaporation section 14 is smaller than the diameter of the recessed structure 114 located in the auxiliary heat dissipation section 15, and the diameter of the recessed structure 114 located in the auxiliary heat dissipation section 15 is smaller than the diameter of the recessed structure 114 located in the condensation section 16.

[0086] Specifically, if the diameter of the recessed structure 114 located in the evaporation section 14 is small, the disturbance of the steam by the recessed structure 114 is weak, so that the steam can flow to the auxiliary heat dissipation section 15 faster. If the diameter of the recessed structure 114 located in the auxiliary heat dissipation section 15 is between the diameter of the recessed structure 114 located in the evaporation section 14 and the diameter of the recessed structure 114 located in the condensation section 16, the disturbance of the steam is enhanced, so that the effect of strengthening the heat dissipation can be achieved, the heat dissipation of the auxiliary heat dissipation section 15 is not wasted, and the utilization rate of the heat dissipation structure 10 is improved. The diameter of the recessed structure 114 located in the condensation section 16 is the largest, and the disturbance of the steam is the strongest, so the steam is fully in contact with the shell 11 at the condensation section 16, so that the heat is quickly dissipated through the condensation section 16.

[0087] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation structure, characterized in that: The heat dissipation structure is divided into an evaporation section, an auxiliary heat dissipation section and a condensation section; the evaporation section, the auxiliary heat dissipation section and the condensation section are arranged in sequence; The heat dissipation structure comprises: a shell, a capillary structure, a steam chamber and a liquid; The housing includes an upper wall and a lower wall opposite to each other and a side wall connecting the upper wall and the lower wall; The upper wall, the lower wall and the side wall surround and form a closed steam chamber; the liquid is located in the steam chamber; The upper wall includes a plurality of concave structures, and the capillary structure is attached to the lower wall; Wherein, the concave structure is a structure formed by the upper wall being concave in a first direction; the first direction is the direction from the upper wall to the lower wall; The recess depth of the recess structure and the height of the steam chamber satisfy: h / 3≤z≤h / 2, wherein h is the height of the steam chamber along the first direction, and z is the recess depth of the recess structure along the first direction.

2. The heat dissipation structure according to claim 1, characterized in that: The recessed structure located in the evaporation section, the recessed structure located in the auxiliary heat dissipation section and the recessed structure located in the condensation section are arranged in different ways, wherein the arrangement includes at least one of size, shape, distance and arrangement.

3. The heat dissipation structure according to claim 2, characterized in that: From the evaporation section to the condensation section, the distance between two adjacent recessed structures decreases.

4. The heat dissipation structure according to claim 3, characterized in that: From the evaporation section to the condensation section, the distance between two adjacent recessed structures gradually decreases.

5. The heat dissipation structure according to claim 3, characterized in that: The distance between two adjacent recessed structures in the same section is the same, and the distance between two adjacent recessed structures in different sections is different; and the distance between two adjacent recessed structures in the evaporation section is greater than the distance between two adjacent recessed structures in the auxiliary heat dissipation section, and the distance between two adjacent recessed structures in the auxiliary heat dissipation section is greater than the distance between two adjacent recessed structures in the condensation section.

6. The heat dissipation structure according to claim 2, characterized in that: The size of the recessed structure increases from the evaporation section to the condensation section.

7. The heat dissipation structure according to claim 6, characterized in that: From the evaporation section to the condensation section, the size of the recessed structure gradually increases.

8. The heat dissipation structure according to claim 6, characterized in that: The sizes of the recessed structures in the same section are the same, and the sizes of the recessed structures in different sections are different. The size of the recessed structure in the evaporation section is smaller than the size of the recessed structure in the auxiliary heat dissipation section, and the size of the recessed structure in the auxiliary heat dissipation section is smaller than the size of the recessed structure in the condensation section.

9. The heat dissipation structure according to claim 1, characterized in that: When W≥3h, a plurality of the recessed structures are arranged in an array; When W≤3h, a plurality of the recessed structures are cross-arranged; Wherein, W is the width of the heat dissipation structure along the second direction, h is the height of the steam chamber along the first direction; the second direction is a direction perpendicular to the first direction and perpendicular to a third direction, and the third direction is an extension direction of the heat dissipation structure.

10. The heat dissipation structure according to any one of claims 1 to 9, characterized in that: The cross-sectional shape of the concave structure includes a U-shaped ring, a semicircular ring or a semi-elliptical ring.

11. The heat dissipation structure according to any one of claims 1 to 9, characterized in that: The material of the housing includes copper.

12. An electronic device, characterized in that: It comprises the heat dissipation structure described in any one of claims 1 to 11.

13. The electronic device according to claim 12, characterized in that: It also includes a heating element, the heat dissipation structure is located on the heating element, and the upper wall is located on the side of the lower wall away from the heating element.

14. The electronic device according to claim 13, characterized in that: The heating element includes a central processing unit.

15. The electronic device according to any one of claims 12 to 14, characterized in that: The electronic device includes a mobile phone, a laptop or a tablet computer.

16. The electronic device according to claim 15, characterized in that: When the electronic device includes a laptop computer, the laptop computer further includes a heating element; The projection of the heating element on the reference plane overlaps with the heat dissipation structure on the reference plane; The reference plane is perpendicular to the first direction.

17. The electronic device according to claim 16, characterized in that: The laptop computer also includes a fan; The heat dissipation structure is divided into an evaporation section, an auxiliary heat dissipation section and a condensation section; The projection of the heating element on the reference plane overlaps with the evaporation section on the reference plane, and the fan is adjacent to the condensation section.

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