phase shifter

Abstract

The application provides a phase shifter, which comprises a circuit board, a substrate and a plurality of cables. Each cable of the plurality of cables comprises a first insulation layer, an outer conductor layer and an inner conductor layer. The first insulation layer is sleeved on the outer conductor layer. The outer conductor layer and the inner conductor layer are arranged apart from each other. The circuit board is electrically connected with each inner conductor layer. The substrate comprises a plurality of bushings for grounding, the circuit board is arranged on the substrate, at least a part of each cable is arranged through at least one bushing of the plurality of bushings, and the first insulation layer of each cable is arranged between the outer conductor layer and the corresponding bushing and forms an electrical coupling between the outer conductor layer and the corresponding bushing. The application solves the problem of complex process of the connection between the outer conductor of the cable and the PCB of the existing phase shifter.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and in particular to a phase shifter. Background Technology

[0002] To achieve variable signal coverage distance, adjustable electronic downtilt can be used in base station antennas to radiate signals at different elevation angles. For example, the beam tilt angle of signal radiation can be adjusted by changing the phase of the base station antenna phase shifter, thereby allowing the base station antenna to adjust the radiation coverage area.

[0003] A phase shifter consists of a cable, wire clamps, a PCB, and a backing plate. The outer conductor of the cable is soldered to the wire clamp, the wire clamp is soldered to the ground plane on the PCB, and the ground plane on the PCB is soldered to the backing plate, thus grounding the cable. However, the soldering process between the wire clamp and the outer conductor of the cable is complex and time-consuming, making the connection between the cable and the PCB complicated. Therefore, the connection between the cable outer conductor and the PCB in existing phase shifters suffers from a complex process. Summary of the Invention

[0004] The purpose of this application is to provide a phase shifter that simplifies the connection process between the outer conductor of a cable and a circuit board, comprising: a circuit board, a substrate, and multiple cables. Each of the multiple cables includes: a first insulating layer, an outer conductor layer, and an inner conductor layer. The first insulating layer is sleeved on the outer conductor layer. The outer conductor layer and the inner conductor layer are spaced apart from each other. The circuit board and each of the inner conductor layers are electrically connected. The substrate includes multiple grounding sleeves, the circuit board is disposed on the substrate, at least a portion of each cable passes through at least one of the multiple sleeves, and the first insulating layer of each cable is located between the outer conductor layer and the corresponding sleeve, forming an electrical coupling between the outer conductor layer and the corresponding sleeve.

[0005] Optionally, each of the cables corresponds to two spaced-apart sleeve arrangements.

[0006] Optionally, the fit between each of the bushings and the corresponding first insulating layer is a transition fit.

[0007] Optionally, capacitive coupling is formed between the outer conductor layer of each cable and the corresponding bushing, and the thickness d of the first insulation layer satisfies the following relationship:

[0008]

[0009] Where A = 2πrL, r is the inner diameter of the sleeve, L is the length of the sleeve, f is the operating frequency of the capacitor formed by the outer conductor layer, the first insulating layer and the corresponding sleeve, and εr ε0 is the relative permittivity of the first insulating layer, and ε0 is the absolute permittivity.

[0010] Optionally, the substrate further includes a first liner and a second liner, with each of the sleeves disposed on the first liner, and the first liner and the second liner connected together.

[0011] Optionally, there may be multiple first liners, and each first liner may be provided with multiple cables and multiple sleeves.

[0012] Optionally, the first liner and the second liner are detachably connected.

[0013] Optionally, the sleeve includes an inner tube fitted over a corresponding first insulating layer, a portion of which is configured below the first liner such that the inner conductor layer abuts against the circuit board radially along the inner conductor layer.

[0014] Optionally, the inner tube is a metal layer disposed on the inner side wall of the sleeve; or, the inner tube is the inner side wall of the sleeve, and the sleeve is made entirely of metal material.

[0015] Optionally, the first insulating layer, the inner tube, and the inner conductor layer are arranged coaxially.

[0016] Optionally, the first liner includes a plurality of grooves, each groove corresponding to each cable, the first insulation layer of each cable abutting against the corresponding groove along its radial direction, and the shape of each first insulation layer matching the shape of the corresponding groove.

[0017] Optionally, each groove corresponds to two spaced-apart sleeves, each groove is located between the corresponding two spaced-apart sleeves, and each cable passes through the corresponding groove and the corresponding two spaced-apart sleeves.

[0018] Optionally, the circuit board includes a ground layer and a second insulating layer, wherein the ground layer, the second insulating layer and the second backing plate are sequentially abutted against each other.

[0019] Optionally, the phase shifter further includes a phase shifting component, the circuit board is provided with a plurality of microstrip lines, the phase shifting component is disposed on the circuit board and electrically connected to the plurality of microstrip lines, and each of the plurality of microstrip lines is connected to the inner conductor layer of the corresponding cable.

[0020] Optionally, the cable further includes a third insulation layer located between the outer conductor layer and the inner conductor layer. The inner conductor layer extends outward from the third insulation layer toward the circuit board to form an exposed section, which connects to the microstrip line. The third insulation layer extends outward from the outer conductor layer toward the circuit board to form an exposed section, which abuts against the circuit board.

[0021] Optionally, the outer conductor layer extends outward from the first insulating layer toward the circuit board to form an exposed section of the outer conductor layer, and the exposed section of the outer conductor layer is spaced apart from the circuit board; the first insulating layer extends outward from the corresponding sleeve toward the circuit board to form a first insulating layer exposed section, and the first insulating layer exposed section is spaced apart from the circuit board.

[0022] The beneficial effects of this application are as follows: By assembling a circuit board, a substrate, and multiple cables, each cable includes a first insulating layer, an outer conductor layer, and an inner conductor layer. The first insulating layer is sleeved on the outer conductor layer. The outer conductor layer and the inner conductor layer are spaced apart. The circuit board and each inner conductor layer are electrically connected. The substrate includes multiple grounding bushings. The circuit board is disposed on the substrate. At least a portion of each cable passes through at least one of the bushings. The first insulating layer of each cable is located between the outer conductor layer and the corresponding bushing, forming an electrical coupling between the outer conductor layer and the corresponding bushing. Thus, the outer conductor layer, the first insulating layer, and the substrate can form a capacitor. The outer conductor layer and the substrate can achieve capacitive coupling grounding without requiring soldering to connect to the circuit board, thus simplifying the connection process between the outer conductor layer and the circuit board and reducing the required time.

[0023] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, the following describes the application in detail with reference to the preferred embodiments and accompanying drawings. Attached Figure Description

[0024] Figure 1 This is a perspective view and a partial enlarged view of a phase shifter in one embodiment of this application;

[0025] Figure 2 This is a partially enlarged view of a three-dimensional perspective of a phase shifter in a related technical embodiment;

[0026] Figure 3 This is a partial enlarged view of the cable, sleeve and first liner in one embodiment of this application (the outer conductor layer, inner conductor layer and third insulation layer of the cable are omitted, and the first insulation layer and sleeve are partially cut out).

[0027] Figure 4This is a perspective view of a first liner and a second liner in one embodiment of this application (the first liner and the second liner are in a connected state);

[0028] Figure 5 This is a partially enlarged front view of a cable, sleeve, first liner, second liner, and circuit board in one embodiment of this application (the cable is cut out).

[0029] Figure 6 This is a partially enlarged perspective view of a cable, sleeve, first liner, and circuit board in one embodiment of this application (each cable has been cut off).

[0030] Figure 7 This is a partially enlarged cross-sectional view of the circuit board and the second substrate in one embodiment of this application;

[0031] Figure 8 This is an exploded view of the first and second liner plates in another embodiment of this application.

[0032] In the attached figures, the following labels are used:

[0033] 1 Circuit board

[0034] 10 Microstrip lines

[0035] 11 Grounding layer

[0036] 12 Second Insulation Layer

[0037] 2 substrate

[0038] 13 Phase Shifting Components

[0039] 20 casings

[0040] 200 inner tube

[0041] 21 First Liner

[0042] 210 Groove

[0043] 22 Second Liner

[0044] 3 Cables

[0045] 30 First Insulation Layer

[0046] 301 First Insulation Layer Exposed Section

[0047] 31 outer conductor layer

[0048] 311 Outer Conductor Layer Exposed Section

[0049] 32 inner conductor layer

[0050] 321 Inner Conductor Layer Exposed Section

[0051] 33 Third Insulation Layer

[0052] 331 Third Insulation Layer Exposed Section

[0053] 4 Cable clamps

[0054] 5. Wire clamps

[0055] d Thickness of the first insulating layer

[0056] r is the inner diameter of the sleeve.

[0057] L-length of the sleeve

[0058] h1 Thickness of the circuit board

[0059] r1 is the radius of the inner conductor layer.

[0060] The height of the lowest point of the h2 inner tube from the upper surface of the second liner plate Detailed Implementation

[0061] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0062] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present application will now be described in detail with reference to the accompanying drawings and embodiments. To enable those skilled in the art to better understand the solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0063] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices.

[0064] It should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0065] like Figure 1 As shown, in one embodiment, a phase shifter is provided, comprising: a circuit board 1, a substrate 2, and multiple cables 3. Each cable 3 includes a first insulating layer 30, an outer conductor layer 31, and an inner conductor layer 32. The first insulating layer 30 is sleeved on the outer conductor layer 31, and the outer conductor layer 31 and the inner conductor layer 32 are spaced apart. The circuit board 1 and each inner conductor layer 32 are electrically connected. (Substrate 2, please refer to...) Figure 1 The system includes multiple grounding sleeves 20, a circuit board 1 disposed on a substrate 2, and at least a portion of each cable 3 passing through at least one of the multiple sleeves 20. In some embodiments, a portion or all of the sleeves 20 are made of metal and can be electrically connected to the outside for grounding. A first insulation layer 30 of each cable 3 is located between an outer conductor layer 31 and a corresponding sleeve 20, forming an electrical coupling (e.g., a capacitive coupling) between the outer conductor layer 31 and the corresponding sleeve 20. In some embodiments, a portion or all of the sleeves 20 are made of metal, a portion or all of the substrate 2 is made of metal, and the sleeves 20 can be electrically connected to the outside for grounding through the substrate 2.

[0066] like Figure 1 As shown, circuit board 1 can be a PCB (printed circuit board). The substrate 2 can be further described in the subsequent content of this embodiment. Cable 3 can be a coaxial cable. The first insulation layer 30 can be the sheath of cable 3, and its material can be PVC. The outer conductor layer 31 can be a mesh conductive layer, which can be formed from copper mesh and aluminum foil. The inner conductor layer 32 can be copper wire. Each first insulation layer 30 can cover and abut against the corresponding outer conductor layer 31. The first insulation layer 30 of each cable 3 is sleeved on the outer conductor layer 31 of that cable 3, and the outer conductor layer 31 and the inner conductor layer 32 of each cable 3 are spaced apart.

[0067] like Figure 1 As shown, the outer conductor layer 31 and the corresponding inner conductor layer 32 can be arranged parallel to each other and coaxially. Each first insulating layer 30 and each outer conductor layer 31 can be disposed separately from the circuit board 1. The first insulating layer 30, the outer conductor layer 31 and the inner conductor layer 32 can be columnar.

[0068] like Figure 1 As shown, the outer conductor layer 31 extends outward from the first insulating layer 30 toward the circuit board 1 to form an exposed section 311, which is spaced apart from the circuit board 1. The exposed section 311 can be cylindrical. The end face of the exposed section 311 can be parallel to the side of the circuit board 1. The first insulating layer 30 extends outward from the corresponding sleeve 20 toward the circuit board 1 to form a first insulating layer exposed section 301, which is spaced apart from the circuit board 1. The exposed section 301 can be cylindrical, and its end face can be parallel to the side of the circuit board 1. The length of the exposed section 301 is less than the length of the exposed section 311.

[0069] like Figure 1 As shown, circuit board 1 has a plurality of microstrip lines 10 disposed on the upper surface of circuit board 1, and each microstrip line 10 is connected to the inner conductor layer 32 of the corresponding cable 3 (e.g., each microstrip line 10 and each inner conductor layer 32 are arranged in a one-to-one correspondence and electrically connected to each other). In some embodiments, each inner conductor layer 32 can be fixed to the corresponding microstrip line 10 by soldering or crimping. The phase shifter also includes a phase shifting assembly 13, which is disposed on circuit board 1 and electrically connected to the plurality of microstrip lines 10. The phase shifting assembly 13 is used to adjust the phase of the signal.

[0070] like Figure 1 As shown, cable 3 also includes a third insulation layer 33, which is located between the outer conductor layer 31 and the inner conductor layer 32. The inner conductor layer 32 extends outward from the third insulation layer 33 toward the circuit board 1 to form an exposed section 321. The exposed section 321 connects to the microstrip line 10 (for example, the exposed section 321 can be fixed to the corresponding microstrip line 10 by welding or crimping). The third insulation layer 33 extends outward from the outer conductor layer 31 toward the circuit board 1 to form an exposed section 331, which abuts against the circuit board 1. The top of the exposed section 331 can abut against the side of the circuit board 1. The third insulation layer 33 can be made of Teflon. The third insulation layer 33 can be cylindrical. The exposed section 331 can be cylindrical. The length of the exposed section 311 of the outer conductor layer is less than the length of the exposed section 331 of the third insulation layer. The exposed portion 331 of the third insulating layer 33 abuts against the circuit board 1, enabling positioning of the cable 3 when connecting to the circuit board 1, eliminating the need for the wire bonding clamp 5 (please refer to the wire bonding clamp 5 for details). Figure 2 This allows for positioning, making the connection between cable 3 and circuit board 1 more cost-effective and convenient. For example, when cable 3 is being installed, the exposed portion 331 of the third insulation layer 33 of cable 3 abuts against circuit board 1, indicating that cable 3 has been installed in place.

[0071] The circuit consists of a circuit board 1, a substrate 2, and multiple cables 3. Each cable 3 includes a first insulating layer 30, an outer conductor layer 31, and an inner conductor layer 32. The first insulating layer 30 is sleeved on the outer conductor layer 31. The outer conductor layer 31 and the inner conductor layer 32 are spaced apart. The circuit board 1 and each inner conductor layer 32 are electrically connected. The substrate 2 includes multiple grounding sleeves 20. The circuit board 1 is disposed on the substrate 2. At least a portion of each cable 3 passes through at least one of the multiple sleeves 20. The first insulating layer 30 of each cable 3 is located between the outer conductor layer 31 and the corresponding sleeve 20, forming an electrical coupling between the outer conductor layer 31 and the corresponding sleeve 20. Thus, the outer conductor layer 31, the first insulating layer 30, and the substrate 2 can form a capacitor. The outer conductor layer 31 and the substrate 2 can achieve capacitive coupling grounding without needing to be connected to the circuit board 1 by soldering. Therefore, the connection process between the outer conductor layer 31 and the circuit board 1 is simpler and requires less time. Moreover, the first insulation layer 30 is a structure that the cable 3 itself has, so there is no need to set an insulation sheet between the outer conductor layer 31 and the substrate 2 to form a capacitor, which makes the structure of the formed capacitor simpler.

[0072] like Figure 2 As shown, in embodiments of the related technology, cable 3 (see cable 3 for reference) Figure 1 The cable 3 (hereinafter the same) is clamped in cable clamp 4. The outer conductor layer 31 of the cable 3 is soldered to the bonding clamp 5, and the inner conductor layer 32 of the cable 3 is soldered to the microstrip line 10 on the front side of the circuit board 1. The bonding clamp 5 is connected to the ground on the back side of the circuit board 1 by soldering, thereby grounding the outer conductor layer 31. In this grounding method, the outer conductor layer 31 of the cable 3 needs to be connected to the ground on the back side of the circuit board 1 by means of the bonding clamp 5, that is, the outer conductor layer 31 needs to be soldered to the bonding clamp 5 to achieve the connection between the outer conductor layer 31 and the ground of the circuit board 1. Therefore, the connection between the outer conductor layer 31 and the circuit board 1 requires a lot of soldering work.

[0073] like Figure 3 As shown, optionally, each cable 3 is provided with two spaced-apart sleeves 20, and the first insulation layer 30 of each cable 3 passes through the corresponding sleeve 20. For example, each first insulation layer 30 can pass through the corresponding sleeve 20 along the axial direction, that is, each first insulation layer 30 can be coaxially arranged with the corresponding sleeve 20. The inner wall of each sleeve 20 can cover and abut against a section of the corresponding first insulation layer 30 that is the same length as the sleeve 20. The sleeve 20 can be cylindrical. The fit between each sleeve 20 and the corresponding first insulation layer 30 is a transition fit. A transition fit means that the inner wall of each sleeve 20 and the outer surface of the corresponding first insulation layer 30 can be either an interference fit or a clearance fit.

[0074] like Figure 3 As shown, optionally, capacitive coupling is formed between the outer conductor layer 31 of each cable 3 and the corresponding sleeve 20, and the thickness d of the first insulation layer 30 satisfies the following relationship:

[0075]

[0076] Where A = 2πrL, r is the inner diameter of the sleeve 20, and L is the length of the sleeve 20, that is, A is the outer conductor layer 31 (please refer to the outer conductor layer 31). Figure 1 (The same below), the coupling area of ​​the capacitor formed by the first insulating layer 30 and the sleeve 20, f is the operating frequency of the capacitor formed by the outer conductor layer 31, the first insulating layer 30 and the corresponding sleeve 20, ε r ε0 is the relative permittivity of the first insulating layer 30, and ε0 is the absolute permittivity. ε0 = 8.85 × 103 -12 F / m (farads per meter), when the first insulation layer 30 is made of PVC, ε r =4.0F / m. Reactance of the capacitor formed by the outer conductor layer 31, the first insulating layer 30, and the bushing 20. When the capacitance C is infinite, X = 0, and the capacitor can be considered completely short-circuited. In practical applications, a better short-circuit effect can be achieved when X ≤ 1. Since the capacitance C = ε... r ε0A / d, therefore, to obtain a better short-circuit effect and thus a better coupled grounding effect, the following relationship must be satisfied:

[0077]

[0078] like Figure 4 As shown, optionally, substrate 2 (substrate 2 please refer to) Figure 1 The system also includes a first liner 21 and a second liner 22. Each sleeve 20 is disposed on the first liner 21, and the first liner 21 and the second liner 22 are connected. The first liner 21 and the second liner 22 can be in the shape of a rectangular parallelepiped. There can be four first liners 21 and one second liner 22. The four first liners 21 can be respectively disposed at the four corners of the second liner 22, and the first liners 21 can be arranged parallel to each other. Each sleeve 20 can be fixed to the first liner 21 by welding or integral molding. Each sleeve 20, the first liner 21, and the second liner 22 can be made of a conductive metal material (e.g., aluminum alloy). The first liner 21 and the second liner 22 can be connected by welding or integral molding.

[0079] like Figure 4 As shown, optionally, there are multiple first liner plates 21, and each first liner plate 21 is provided with multiple cables 3 (see cable 3 for reference). Figure 1(hereinafter the same) and multiple sleeves 20. The number of first liner plates 21 is two sets, circuit board 1 (for circuit board 1, please refer to) Figure 1 The number of circuit boards 1 (hereinafter the same) is two, and each circuit board 1 corresponds to a set of first backing plates 21. Each set of first backing plates 21 includes two first backing plates 21, and each circuit board 1 is located between the two first backing plates 21 of its corresponding set. The number of first backing plates 21 can be four. Each first backing plate 21 can be provided with four cables 3 and eight sleeves 20. Each cable 3 passes through two sleeves 20, and the two sleeves 20 passing through each cable 3 can be coaxially arranged. The cables 3 and the sleeves 20 can be arranged parallel to each other.

[0080] Since there are a large number of cables 3, after the outer conductor layer 31 of the cables 3 is grounded using capacitive coupling in this embodiment, each outer conductor layer 31 no longer needs to be soldered to the bonding clamp 5. Therefore, a large amount of soldering work required to connect the outer conductor layer 31 and the bonding clamp 5 can be saved. The more cables 3 there are, the more obvious the advantage of saving soldering work by using capacitive coupling grounding in this embodiment becomes.

[0081] like Figure 5 As shown, optionally, the sleeve 20 includes an inner tube 200, which is sleeved on a corresponding first insulating layer 30. A portion of the inner tube 200 is configured to be lower than the first liner 21 such that the inner conductor layer 32 abuts against the circuit board 1 radially along the inner conductor layer 32. The first insulating layer 30, the inner tube 200, and the inner conductor layer 32 are coaxially arranged. Each inner tube 200 may cover and abut against a section of the corresponding first insulating layer 30 of equal length to the inner tube 200. The inner tube 200 may be cylindrical, and its bottom may be lower than the upper surface of the first liner 21. In some embodiments, the inner tube 200 is a metal layer disposed on the inner sidewall of the sleeve 20; in some embodiments, the inner tube 200 is the inner sidewall of the sleeve 20, and the sleeve 20 is made entirely of metal material.

[0082] like Figure 5 As shown, for example, let the thickness of circuit board 1 be h1, the bottom surface of circuit board 1 abuts against the upper surface of the second liner 22, and the upper surfaces of each first liner 21 and the upper surfaces of the second liner 22 are coplanar. The radius of the first insulating layer 30 is r (i.e., the radius of the first insulating layer 30 is the same as the inner diameter of the sleeve 20), and the radius of the inner conductor layer 32 is r1. Let the height of the lowest point of the inner tube 200 from the upper surface of the second liner 22 be h2, then when h2 = r - h1 - r1, the inner conductor layer 32 can be made to abut against the upper surface of circuit board 1 along the radial direction of the inner conductor layer 32. Figure 5 The dotted line in the diagram represents the upper surface of circuit board 1.

[0083] like Figure 5As shown, a portion of the inner tube 200 is configured below the first liner 21 such that the inner conductor layer 32 abuts against the circuit board 1 radially, allowing the cable 3 (see cable 3 for reference) to pass through. Figure 1 (The same applies below) After passing through the inner tube 200 and reaching the circuit board 1, the inner conductor layer 32 just abuts against the circuit board 1 radially. This eliminates the need for further adjustments to the inner conductor layer 32 (e.g., no bending of the inner conductor layer 32) during subsequent connection between the inner conductor layer 32 and the circuit board 1, making the connection between the inner conductor layer 32 of the cable 3 and the circuit board 1 more convenient. For example, if the inner conductor layer 32 reaches the circuit board 1 and just abuts against the microstrip line 10 of the circuit board 1 radially (see microstrip line 10 for reference)... Figure 1 (The same applies below), so there is no need to bend the inner conductor layer 32 to make it contact the microstrip line 10 first. Since the inner conductor layer 32 is already in contact with the microstrip line 10, the inner conductor layer 32 can be directly soldered to the microstrip line 10, saving the process of adjusting the shape or position of the inner conductor layer 32 to make it contact the circuit board 1.

[0084] like Figure 6 As shown, optionally, the first liner 21 includes multiple grooves 210, each groove 210 corresponding to one of the cables 3. The first insulation layer 30 of each cable 3 abuts against the corresponding groove 210 radially, and the shape of each first insulation layer 30 matches the shape of the corresponding groove 210. The first insulation layer 30 can abut against the corresponding groove 210 radially. Matching the shape of each first insulation layer 30 with the shape of the corresponding groove 210 can mean that the circumferential shape of the first insulation layer 30 is the same as the circumferential shape of the groove 210. For example, if the circumferential surface of the first insulation layer 30 is a cylinder, and the circumferential surface of the groove 210 can be a partial cylinder, then when the circumferential radius of the first insulation layer 30 and the circumferential radius of the groove 210 are the same, the circumferential surface of the first insulation layer 30 can match the circumferential surface of the groove 210. Matching the shape of each first insulation layer 30 with the shape of the corresponding groove 210 allows for more area on the first insulation layer 30 and the substrate 2 (substrate 2 is referenced). Figure 1 (The same below) Contact, compared to the first insulating layer 30 being placed directly on the flat substrate, the former can increase the coupling area.

[0085] like Figure 6 As shown, optionally, the grooves 210 are partially cylindrical, and the radius of each groove 210 is approximately the same as the outer diameter of the corresponding first insulating layer 30. The partially cylindrical grooves 210 can be formed parallel to the inner tube 200 (see inner tube 200 for reference). Figure 5The groove 210 is formed by cutting a cylindrical surface through the plane of the axis of the first insulating layer 30. The groove 210 is partially cylindrical, and the radius of each groove 210 is approximately the same as the outer diameter of the corresponding first insulating layer 30, so that the first insulating layer 30 can fully contact the groove 210. The grooves 210 can be arranged parallel to each other.

[0086] like Figure 6 As shown, optionally, each groove 210 corresponds to two spaced-apart sleeves 20, with each groove 210 located between the corresponding two spaced-apart sleeves 20. Each cable 3 passes through the corresponding groove 210 and the corresponding two spaced-apart sleeves 20. Passing each cable 3 through the corresponding groove 210 and the corresponding two spaced-apart sleeves 20 allows the cable end to exit more easily compared to the cable 3 passing through a single, longer sleeve. Specifically, when the first insulation layer 30 of the cable 3 and the sleeve 20 are an interference fit, the cable 3 is not easily able to pass through the sleeve 20. Using two short sleeves 20 spaced apart instead of a longer single sleeve allows the cable end to exit more easily from the sleeve 20 because the mating length between the cable 3 and the first insulation layer 30 of the short sleeve 20 is shorter. Furthermore, when the end of the cable 3 passes through one of the two spaced sleeves 20, force can be applied to pull the cable 3 in the space between the two spaced sleeves 20 to assist in the cable 3 being threaded (for example, the end of the cable 3 can be pinched with fingers in the space between the two spaced sleeves 20 to pull the cable 3).

[0087] like Figure 6 As shown, optionally, each groove 210 and the corresponding two spaced-apart sleeves 20 are coaxially arranged, each groove 210 connects to the corresponding two spaced-apart sleeves 20, and the radius of each groove 210 is approximately the same as the inner diameter of the corresponding sleeve 20. The radius of each groove 210 can be the same as the radius of the corresponding two coaxially arranged spaced-apart sleeves 20. The fact that each groove 210 connects to the corresponding two spaced-apart sleeves 20 and the radius of each groove 210 are approximately the same as the inner diameter of the corresponding sleeve 20 allows each groove 210 to guide the cable 3 passing through the two spaced-apart sleeves 20, facilitating the cable 3 to pass through the two spaced-apart sleeves 20 sequentially without deviation. That is, after the cable 3 passes through one of the two spaced-apart sleeves 20, it can continue along the groove 210 between the two sleeves 20 to the remaining spaced-apart sleeve 20.

[0088] like Figure 7As shown, optionally, the circuit board 1 includes a ground layer 11 and a second insulating layer 12, with the ground layer 11, the second insulating layer 12, and the second substrate 22 sequentially abutting each other. The second insulating layer 12 may be an insulating solder mask layer disposed at the bottom of the circuit board 1. The ground layer 11 may be a metallic ground, for example, the ground layer 11 may be made of copper. The sequential abutting arrangement of the ground layer 11, the second insulating layer 12, and the second substrate 22 may also form a capacitor, allowing electromagnetic waves on the circuit board 1 to be transmitted to the second substrate 22 through the capacitive effect.

[0089] like Figure 8 As shown, optionally, in another embodiment, the first liner 21 and the second liner 22 are detachably connected. For example, the first liner 21 and the second liner 22 can be detachably connected by screwing or snap-fitting. The detachable connection of the first liner 21 and the second liner 22, compared to multiple cables 3 (see cable 3 for reference...), provides a more convenient alternative. Figure 1 (The same applies below) When the number of cables 3 changes (for example, when the number of cables 3 needs to be changed when the phase shifter equipment is upgraded), only the corresponding first liner 21 with a smaller area needs to be replaced, instead of replacing the entire liner with a larger area, thereby reducing the replacement cost of the liner.

[0090] The phase shifter provided in the embodiments of this application has been described in detail above. For those skilled in the art, based on the ideas of the embodiments of this application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be construed as a limitation of this application. All equivalent modifications or changes made in accordance with the spirit and technical concept of this application should still be covered by the claims of this application.

Claims

1. A phase shifter, characterized in that, include: Multiple cables, each of the multiple cables comprising: First insulating layer; Outer conductor layer, the first insulating layer is sleeved on the outer conductor layer; and An inner conductor layer, wherein the outer conductor layer and the inner conductor layer are disposed alternately; Circuit board, which is electrically connected to each of the inner conductor layers; and The substrate includes a plurality of grounding sleeves, a first liner and a second liner, the circuit board is disposed on the substrate, each of the sleeves is disposed on the first liner, the first liner and the second liner are detachably connected, at least a portion of each cable passes through at least one of the plurality of sleeves, and the first insulation layer of each cable is located between the outer conductor layer and the corresponding sleeve and forms an electrical coupling between the outer conductor layer and the corresponding sleeve.

2. The phase shifter according to claim 1, characterized in that, Each of the cables corresponds to two spaced bushing arrangements.

3. The phase shifter according to claim 1, characterized in that, The fit between each of the bushings and the corresponding first insulating layer is a transition fit.

4. The phase shifter according to claim 1, characterized in that, The outer conductor layer of each cable forms a capacitive coupling with the corresponding bushing, and the thickness d of the first insulation layer satisfies the following relationship: ， Where A = 2πrL, r is the inner diameter of the sleeve, L is the length of the sleeve, f is the operating frequency of the capacitor formed by the outer conductor layer, the first insulating layer, and the corresponding sleeve, and ε r ε0 is the relative permittivity of the first insulating layer, and ε0 is the absolute permittivity.

5. The phase shifter according to claim 1, characterized in that, There are multiple first liners, and each first liner is provided with multiple cables and multiple sleeves.

6. The phase shifter according to claim 1, characterized in that, The sleeve includes an inner tube sleeved over a corresponding first insulating layer, a portion of which is configured below the first liner such that the inner conductor layer abuts against the circuit board radially along the inner conductor layer.

7. The phase shifter according to claim 6, characterized in that, The inner tube is a metal layer disposed on the inner side wall of the sleeve; or, the inner tube is the inner side wall of the sleeve, and the sleeve is made entirely of metal material.

8. The phase shifter according to claim 6, characterized in that, The first insulating layer, the inner tube, and the inner conductor layer are arranged coaxially.

9. The phase shifter according to claim 1, characterized in that, The first liner includes a plurality of grooves, each groove corresponding to each cable. The first insulation layer of each cable abuts against the corresponding groove along its radial direction, and the shape of each first insulation layer is adapted to the shape of the corresponding groove.

10. The phase shifter according to claim 9, characterized in that, Each groove corresponds to two spaced sleeves, each groove is located between the corresponding two spaced sleeves, and each cable passes through the corresponding groove and the corresponding two spaced sleeves.

11. The phase shifter according to claim 1, characterized in that, The circuit board includes a ground layer and a second insulating layer, which are sequentially abutted against each other.

12. The phase shifter according to claim 1, characterized in that, The phase shifter further includes a phase shifting component. The circuit board is provided with a plurality of microstrip lines. The phase shifting component is disposed on the circuit board and electrically connected to the plurality of microstrip lines. Each of the plurality of microstrip lines is connected to the inner conductor layer of the corresponding cable.

13. The phase shifter according to claim 12, characterized in that, The cable further includes a third insulation layer located between the outer conductor layer and the inner conductor layer. The inner conductor layer extends outward from the third insulation layer toward the circuit board to form an exposed section, which connects to the microstrip line. The third insulation layer extends outward from the outer conductor layer toward the circuit board to form an exposed section, which abuts against the circuit board.

14. The phase shifter according to claim 13, characterized in that, The outer conductor layer extends outward from the first insulating layer toward the circuit board to form an exposed section of the outer conductor layer, and the exposed section of the outer conductor layer is spaced apart from the circuit board; the first insulating layer extends outward from the corresponding sleeve toward the circuit board to form a first insulating layer exposed section, and the first insulating layer exposed section is spaced apart from the circuit board.

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