High-order high-density interconnection board and preparation method thereof

Abstract

The present application provides a high-order high-density interconnection board and a preparation method thereof. The method comprises obtaining the copper thickness of the connected board of the high-order high-density interconnection board; performing copper average differential processing on the copper thickness of the connected board and the preset copper thickness to obtain the average difference of the copper thickness; and sending a hole alignment signal to the board making monitoring system according to the average difference of the copper thickness to adjust the ratio of the opening and the bottom of the hole of the hole. By obtaining the copper thickness of the connected board, it is convenient to collect the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board, and then the difference between the copper thickness of the connected board and the preset copper thickness is compared to obtain the difference between the copper layer thickness of the current hole-opening board and the standard copper layer thickness. Finally, according to the above copper thickness difference, the ratio of the opening and the bottom of the hole of the high-order high-density interconnection board is adjusted during the hole-opening, so that the ratio of the opening and the bottom of the hole of the hole is within the optimal ratio range, which effectively improves the hole-opening quality, thereby improving the probability of good products of the high-order high-density interconnection board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a high-order high-density interconnection board and a preparation method thereof. Background Art

[0002] In the development of PCB circuit board manufacturing, human beings have higher and higher requirements for the multi-function, small size and lightness of electronic products. There is an increasing demand for printed circuit board products with high density, high integration, lightness and other characteristics, and the quality requirements are also getting higher and higher.

[0003] However, for 10-layer, 3-order, high-frequency, high-speed HDI micro-blind via circuit boards, the traditional drilling method uses high-precision laser drilling technology. This technology relies on the manufacturing experience and expertise accumulated during research and development, resulting in poor quality of the drilled HDI micro-blind vias that cannot meet market quality requirements. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a high-order high-density interconnection board and a preparation method thereof that can effectively improve the quality of openings.

[0005] The objective of the present invention is achieved through the following technical solutions:

[0006] A method for preparing a high-order high-density interconnection board, the method comprising:

[0007] Get the copper thickness of the high-density interconnect board;

[0008] Perform copper average difference processing on the copper thickness of the connected plate and the preset copper thickness to obtain the copper thickness average difference;

[0009] According to the copper thickness average difference, a hole alignment signal is sent to the board making monitoring system to adjust the ratio of the opening of the hole to the hole bottom.

[0010] In one of the embodiments, obtaining the copper thickness of the connected boards of the high-order high-density interconnect board includes: obtaining the copper thickness of a single-layer core board of the high-order high-density interconnect board.

[0011] In one of the embodiments, performing copper average difference processing on the connected board copper thickness and the preset copper thickness to obtain the copper thickness average difference includes: obtaining the single board copper layer thickness difference between the single-layer core board copper thickness and the first preset copper thickness.

[0012] In one of the embodiments, sending a hole alignment signal to the board making monitoring system according to the average copper thickness difference to adjust the opening and hole bottom ratio of the hole, includes: detecting whether the single board copper layer thickness difference matches the preset single board copper thickness difference; when the single board copper layer thickness difference matches the preset single board copper thickness difference, sending a single board hole alignment start signal to the board making monitoring system to make the opening and hole bottom ratio of the hole be a first opening-bottom ratio.

[0013] In one of the embodiments, the detecting whether the single board copper layer thickness difference matches the preset single board copper thickness difference further includes: when the single board copper layer thickness difference does not match the preset single board copper thickness difference, sending a single board opening alarm signal to the board making monitoring system.

[0014] In one of the embodiments, obtaining the copper thickness of the connected boards of the high-order high-density interconnect board includes: obtaining the copper thickness of the laminated core board of the high-order high-density interconnect board.

[0015] In one of the embodiments, performing copper average difference processing on the copper thickness of the connected board and the preset copper thickness to obtain the copper thickness average difference includes: obtaining the difference in the thickness of the laminated copper layer between the copper thickness of the laminated core board and the second preset copper thickness.

[0016] In one of the embodiments, sending a hole alignment signal to the board making monitoring system according to the average copper thickness difference to adjust the opening and hole bottom ratio of the hole includes: detecting whether the stacked copper layer thickness difference matches the preset stacked copper thickness difference; when the stacked copper layer thickness difference matches the preset stacked copper thickness difference, sending a stacked hole alignment start signal to the board making monitoring system to make the opening and hole bottom ratio of the hole be a second opening-bottom ratio.

[0017] In one of the embodiments, the detecting whether the thickness difference of the copper layer of the stacked plate matches the preset copper thickness difference of the stacked plate further includes: when the thickness difference of the copper layer of the stacked plate does not match the preset copper thickness difference of the stacked plate, sending a stacked plate opening alarm signal to the board making monitoring system.

[0018] A high-order high-density interconnection board is manufactured by using the high-order high-density interconnection board manufacturing method described in any of the above embodiments.

[0019] Compared with the prior art, the present invention has at least the following advantages:

[0020] By obtaining the copper thickness of the connected board, the copper layer thickness of the current perforated board of the high-order high-density interconnection board can be collected. Then, the copper thickness of the connected board is compared with the preset copper thickness to obtain the difference between the copper layer thickness of the current perforated board and the standard copper layer thickness. Finally, according to the above copper thickness difference, the opening and hole bottom ratio of the high-order high-density interconnection board is adjusted during the perforation, so that the opening and hole bottom ratio of the perforation is within the optimal ratio range, which effectively improves the perforation quality, thereby improving the probability of good products of the high-order high-density interconnection board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 Flow chart of a method for preparing a high-order high-density interconnect board in one embodiment. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] The present invention relates to a method for preparing a high-order high-density interconnection board. In one embodiment, the method for preparing a high-order high-density interconnection board includes obtaining the copper thickness of the connected board of the high-order high-density interconnection board; performing copper average differential processing on the copper thickness of the connected board and the preset copper thickness to obtain the average difference of the copper thickness; and sending a hole alignment signal to the board making monitoring system according to the average difference of the copper thickness to adjust the ratio of the opening to the bottom of the hole. By obtaining the copper thickness of the connected board, it is convenient to collect the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board, and then the difference between the copper thickness of the connected board and the preset copper thickness is compared to obtain the difference between the copper layer thickness of the current hole-opening board and the standard copper layer thickness. Finally, according to the above copper thickness difference, the ratio of the opening to the bottom of the hole when the high-order high-density interconnection board is opened is adjusted, so that the opening to the bottom of the hole ratio of the opening is within the optimal ratio range, which effectively improves the hole opening quality, thereby improving the probability of good products of the high-order high-density interconnection board.

[0027] See also Figure 1 , which is a flow chart of a method for preparing a high-order high-density interconnection board according to an embodiment of the present invention. The method for preparing a high-order high-density interconnection board includes part or all of the following steps.

[0028] S100: Obtain the copper thickness of the high-order high-density interconnect board.

[0029] In this embodiment, the connected copper thickness is the copper coating thickness on the high-order high-density interconnection board, that is, the connected copper thickness is the copper layer thickness of the high-order high-density interconnection board, that is, the connected copper thickness is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the connected copper thickness, it is convenient to determine the distribution of the copper layer on the board that currently needs to be hole-opened on the high-order high-density interconnection board, thereby facilitating the determination of the uniformity of the copper layer of the board that currently needs to be hole-opened on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole-opening alignment of the board that currently needs to be hole-opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board.

[0030] S200: performing copper average difference processing on the copper thickness of the connected plate and the preset copper thickness to obtain the copper thickness average difference.

[0031] In this embodiment, the copper thickness of the connected board is the copper coating thickness on the high-order high-density interconnection board, that is, the copper thickness of the connected board is the copper layer thickness of the high-order high-density interconnection board, that is, the copper thickness of the connected board is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the copper thickness of the connected board, it is convenient to determine the distribution of the copper layer on the board that currently needs to be opened on the high-order high-density interconnection board, so as to facilitate the determination of the uniformity of the copper layer of the board that currently needs to be opened on the high-order high-density interconnection board, and to facilitate the subsequent adjustment of the hole alignment of the board that currently needs to be opened on the high-order high-density interconnection board to improve the finished product quality of the high-order high-density interconnection board. The preset copper thickness is the standard copper coating thickness on the high-order high-density interconnection board, that is, the preset copper thickness is the specified thickness of the copper layer of the high-order high-density interconnection board, that is, the preset copper thickness is the reference copper layer thickness of each hole-opening board of the high-order high-density interconnection board. The copper average differential processing of the connected copper thickness and the preset copper thickness is to perform differential processing on the current copper layer thickness of the high-order high-density interconnection board to obtain the difference between the copper layer thickness on the board of the high-order high-density interconnection board that currently needs to open a hole and the standard copper thickness.

[0032] S300: sending a hole alignment signal to a board making monitoring system according to the copper thickness average difference to adjust the ratio of the opening to the hole bottom of the hole.

[0033] In this embodiment, the copper thickness average difference is obtained based on the copper thickness of the connected board and the preset copper thickness. The copper thickness of the connected board is the copper coating thickness on the high-order high-density interconnection board, that is, the copper thickness of the connected board is the copper layer thickness of the high-order high-density interconnection board, that is, the copper thickness of the connected board is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the copper thickness of the connected board, it is convenient to determine the distribution of the copper layer on the board that currently needs to be opened on the high-order high-density interconnection board, so as to facilitate the determination of the copper layer uniformity of the board that currently needs to be opened on the high-order high-density interconnection board, and to facilitate the subsequent adjustment of the hole alignment of the board that currently needs to be opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The preset copper thickness is the standard copper coating thickness on the high-order high-density interconnection board, that is, the preset copper thickness is the specified copper layer thickness of the high-order high-density interconnection board, that is, the preset copper thickness is the reference copper layer thickness of each hole-opening board of the high-order high-density interconnection board. The copper average differential processing of the connected copper thickness and the preset copper thickness is to perform differential processing on the current copper layer thickness of the high-order high-density interconnection board, so as to obtain the difference between the copper layer thickness of the board of the high-order high-density interconnection board that currently needs to be opened and the standard copper thickness. After obtaining the copper thickness average difference, according to the copper layer thickness difference of the board of the high-order high-density interconnection board that currently needs to be opened as reflected by the copper thickness average difference, the opening parameters of the board of the high-order high-density interconnection board that is currently being opened are adjusted, that is, the ratio of the opening to the bottom of the hole in the opening process is adjusted, that is, the gong cutter diameter, gong cutter process speed and gong cutter feed direction used in the opening process are adjusted, so that the blind holes on each board of the high-order high-density interconnection board are more accurately aligned.

[0034] In this embodiment, the copper thickness of the connected board is obtained so as to collect the copper layer thickness of the current perforated board of the high-order high-density interconnection board, and then the difference between the copper thickness of the connected board and the preset copper thickness is compared to obtain the difference between the copper layer thickness of the current perforated board and the standard copper layer thickness, and finally, according to the above copper thickness difference, the opening to hole bottom ratio of the high-order high-density interconnection board is adjusted when opening the hole, so that the opening to hole bottom ratio of the opening is within the optimal ratio range, which effectively improves the hole opening quality, thereby improving the probability of good products of the high-order high-density interconnection board.

[0035] In one of the embodiments, the obtaining of the copper thickness of the connected boards of the high-order high-density interconnection board includes: obtaining the copper thickness of the single-layer core board of the high-order high-density interconnection board. In this embodiment, the copper thickness of the connected boards is the copper cladding thickness on the high-order high-density interconnection board, that is, the copper thickness of the connected boards is the copper layer thickness of the high-order high-density interconnection board, that is, the copper thickness of the connected boards is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the copper thickness of the connected boards, it is convenient to determine the distribution of the copper layer on the board that currently needs to be holed on the high-order high-density interconnection board, thereby facilitating the determination of the uniformity of the copper layer of the board that currently needs to be holed on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole-opening alignment of the board that currently needs to be holed on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The connected board copper thickness is the copper thickness of the single-layer core board of the high-order high-density interconnect board, and the single-layer core board copper thickness is the copper layer thickness on the current single-layer core board of the high-order high-density interconnect board, that is, the single-layer core board copper thickness is the copper cladding thickness of the current single-layer core board that needs to be opened in the high-order high-density interconnect board, and the single-layer core board copper thickness is used to reflect the copper layer distribution corresponding to the single-layer core board that needs to be opened, so as to facilitate the determination of the copper layer thickness of the single-layer core board of the high-order high-density interconnect board when opening a hole, thereby facilitating the adjustment of the opening process parameters according to the copper thickness.

[0036] Furthermore, the copper thickness of the connected board is subjected to copper average difference processing with the preset copper thickness to obtain the copper thickness average difference, including: obtaining the difference in the thickness of the single-board copper layer between the copper thickness of the single-layer core board and the first preset copper thickness. In this embodiment, the copper thickness of the connected board is the copper cladding thickness on the high-order high-density interconnection board, that is, the copper thickness of the connected board is the copper layer thickness of the high-order high-density interconnection board, that is, the copper thickness of the connected board is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the copper thickness of the connected board, it is convenient to determine the distribution of the copper layer on the board that currently needs to be opened on the high-order high-density interconnection board, thereby facilitating the determination of the uniformity of the copper layer of the board that currently needs to be opened on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole-opening alignment of the board that currently needs to be opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The copper thickness of the connecting board is the copper thickness of the single-layer core board of the high-order high-density interconnection board, and the copper thickness of the single-layer core board is the copper layer thickness on the current single-layer core board of the high-order high-density interconnection board, that is, the copper thickness of the single-layer core board is the copper cladding thickness of the current single-layer core board that needs to be opened in the high-order high-density interconnection board, and the copper thickness of the single-layer core board is used to reflect the distribution of the copper layer corresponding to the single-layer core board that needs to be opened, so as to facilitate the determination of the copper layer thickness of the single-layer core board of the high-order high-density interconnection board when opening the hole, so as to facilitate the adjustment of the hole opening process parameters according to the copper thickness. The first preset copper thickness is the standard copper layer thickness on each single-layer core board of the high-order high-density interconnection board, that is, the first preset copper thickness is the specified copper cladding thickness of each single-layer core board that needs to be opened in the high-order high-density interconnection board, and the first preset copper thickness is used to reflect the reference distribution of the copper layer corresponding to each single-layer core board that needs to be opened. The difference between the copper thickness of the single-layer core board and the first preset copper thickness, i.e., the single-board copper layer thickness difference, is used to reflect the degree of difference in copper layer thickness on the single-layer core board of the high-order high-density interconnect board that currently needs to be opened, so as to facilitate determination of whether the copper layer thickness of the single-layer core board of the high-order high-density interconnect board that currently needs to be opened reaches the specified copper layer thickness, thereby facilitating subsequent opening operations on single-layer core boards with different copper layer thicknesses, so as to improve the alignment accuracy of blind hole stacking between each single-layer core board.

[0037] Furthermore, the method of sending a hole alignment signal to the board making monitoring system based on the average copper thickness difference to adjust the opening and hole bottom ratio of the hole includes: detecting whether the single board copper layer thickness difference matches the preset single board copper thickness difference; when the single board copper layer thickness difference matches the preset single board copper thickness difference, sending a single board hole alignment start signal to the board making monitoring system to make the opening and hole bottom ratio of the hole be a first opening-bottom ratio. In this embodiment, the connected copper thickness is the copper coating thickness on the high-order high-density interconnection board, that is, the connected copper thickness is the copper layer thickness of the high-order high-density interconnection board, that is, the connected copper thickness is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the connected copper thickness, it is convenient to determine the distribution of the copper layer on the board that currently needs to be hole-opened on the high-order high-density interconnection board, thereby facilitating the determination of the uniformity of the copper layer of the board that currently needs to be hole-opened on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole-opening alignment of the board that currently needs to be hole-opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The copper thickness of the connecting board is the copper thickness of the single-layer core board of the high-order high-density interconnection board, and the copper thickness of the single-layer core board is the copper layer thickness on the current single-layer core board of the high-order high-density interconnection board, that is, the copper thickness of the single-layer core board is the copper cladding thickness of the current single-layer core board that needs to be opened in the high-order high-density interconnection board, and the copper thickness of the single-layer core board is used to reflect the distribution of the copper layer corresponding to the single-layer core board that needs to be opened, so as to facilitate the determination of the copper layer thickness of the single-layer core board of the high-order high-density interconnection board when opening the hole, so as to facilitate the adjustment of the hole opening process parameters according to the copper thickness. The first preset copper thickness is the standard copper layer thickness on each single-layer core board of the high-order high-density interconnection board, that is, the first preset copper thickness is the specified copper cladding thickness of each single-layer core board that needs to be opened in the high-order high-density interconnection board, and the first preset copper thickness is used to reflect the reference distribution of the copper layer corresponding to each single-layer core board that needs to be opened. The difference between the copper thickness of the single-layer core board and the first preset copper thickness, i.e., the single-board copper layer thickness difference, is used to reflect the difference in copper layer thickness on the single-layer core board of the high-order high-density interconnection board that currently needs to be opened, so as to facilitate the determination of whether the copper layer thickness of the single-layer core board of the high-order high-density interconnection board that currently needs to be opened has reached the specified copper layer thickness, thereby facilitating the subsequent opening operation of the single-layer core boards with different copper layer thicknesses, so as to improve the alignment accuracy of the blind hole stacking between the single-layer core boards. The preset single-board copper thickness difference is the standard copper layer thickness difference on the single-layer core board that needs to be opened of the high-order high-density interconnection board. The single-board copper layer thickness difference matches the preset single-board copper thickness difference, indicating that the copper thickness of the single-layer core board of the high-order high-density interconnection board that is currently opening has reached the specified copper thickness, that is, indicating that the copper thickness of the current single-layer core board of the high-order high-density interconnection board is equivalent to the copper thickness corresponding to the current opening process, wherein the opening process at this time is used to produce high-order blind hole stacking.At this time, a single board hole opening alignment start signal is sent to the board making monitoring system to facilitate the specified hole opening operation on the current single-layer core board of the high-order high-density interconnection board, so that the opening to hole bottom ratio of the opening is the first opening to hole bottom ratio, specifically, the opening to hole bottom ratio is 85% to 92%.

[0038] Furthermore, the detection of whether the single board copper layer thickness difference matches the preset single board copper thickness difference also includes: when the single board copper layer thickness difference does not match the preset single board copper thickness difference, sending a single board hole opening alarm signal to the board making monitoring system. In this embodiment, the continuous board copper thickness is the copper coating thickness on the high-order high-density interconnection board, that is, the continuous board copper thickness is the copper layer thickness of the high-order high-density interconnection board, that is, the continuous board copper thickness is the copper layer thickness of the current hole opening board of the high-order high-density interconnection board. By obtaining the continuous board copper thickness, it is convenient to determine the copper layer distribution on the board that currently needs to be opened on the high-order high-density interconnection board, thereby facilitating the determination of the copper layer uniformity of the board that currently needs to be opened on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole opening alignment of the board that currently needs to be opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The copper thickness of the connecting board is the copper thickness of the single-layer core board of the high-order high-density interconnection board, and the copper thickness of the single-layer core board is the copper layer thickness on the current single-layer core board of the high-order high-density interconnection board, that is, the copper thickness of the single-layer core board is the copper cladding thickness of the current single-layer core board that needs to be opened in the high-order high-density interconnection board, and the copper thickness of the single-layer core board is used to reflect the distribution of the copper layer corresponding to the single-layer core board that needs to be opened, so as to facilitate the determination of the copper layer thickness of the single-layer core board of the high-order high-density interconnection board when opening the hole, so as to facilitate the adjustment of the hole opening process parameters according to the copper thickness. The first preset copper thickness is the standard copper layer thickness on each single-layer core board of the high-order high-density interconnection board, that is, the first preset copper thickness is the specified copper cladding thickness of each single-layer core board that needs to be opened in the high-order high-density interconnection board, and the first preset copper thickness is used to reflect the reference distribution of the copper layer corresponding to each single-layer core board that needs to be opened. The difference between the copper thickness of the single-layer core board and the first preset copper thickness, i.e., the single-board copper layer thickness difference, is used to reflect the difference in copper layer thickness on the single-layer core board of the high-order high-density interconnection board that currently needs to be opened, so as to facilitate the determination of whether the copper layer thickness of the single-layer core board of the high-order high-density interconnection board that currently needs to be opened reaches the specified copper layer thickness, thereby facilitating the subsequent opening operation of the single-layer core boards with different copper layer thicknesses, so as to improve the alignment accuracy of the blind hole stacking between the single-layer core boards. The preset single-board copper thickness difference is the standard copper layer thickness difference on the single-layer core board that needs to be opened of the high-order high-density interconnection board. The single-board copper layer thickness difference does not match the preset single-board copper thickness difference, indicating that the copper thickness of the single-layer core board of the high-order high-density interconnection board that is currently opened is outside the specified copper thickness, that is, indicating that the copper thickness of the current single-layer core board of the high-order high-density interconnection board is not equal to the copper thickness corresponding to the current opening process, wherein the opening process at this time cannot be used to produce high-order blind hole stacking. At this time, the board production monitoring system sends a single board opening alarm signal to facilitate single board early warning operation on the current single-layer core board of the high-order high-density interconnection board, so as to avoid opening holes on unqualified circuit boards and effectively reduce production costs.

[0039] In one of the embodiments, the obtaining of the copper thickness of the connected boards of the high-order high-density interconnection board includes: obtaining the copper thickness of the laminated core board of the high-order high-density interconnection board. In this embodiment, the copper thickness of the connected boards is the copper cladding thickness on the high-order high-density interconnection board, that is, the copper thickness of the connected boards is the copper layer thickness of the high-order high-density interconnection board, that is, the copper thickness of the connected boards is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the copper thickness of the connected boards, it is convenient to determine the distribution of the copper layer on the board that currently needs to be opened on the high-order high-density interconnection board, thereby facilitating the determination of the uniformity of the copper layer of the board that currently needs to be opened on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole-opening alignment of the board that currently needs to be opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The copper thickness of the connecting board is the copper thickness of the laminated core board of the high-order high-density interconnect board, and the copper thickness of the laminated core board is the copper layer thickness on the current laminated core board of the high-order high-density interconnect board, that is, the copper thickness of the laminated core board is the copper cladding thickness of the current laminated core board that needs to be opened in the high-order high-density interconnect board, and the copper thickness of the laminated core board is used to reflect the distribution of the copper layer corresponding to the laminated core board that needs to be opened, so as to facilitate the determination of the copper layer thickness of the laminated core board of the high-order high-density interconnect board when opening a hole, so as to facilitate the adjustment of the hole opening process parameters according to the copper thickness. Among them, the laminated core board is a combined core board formed by the multi-layer board in the high-order high-density interconnect board, specifically, the laminated core board includes a plurality of copper clad boards and a plurality of PP adhesive layers stacked in sequence, and a copper clad board is arranged between two adjacent PP adhesive layers.

[0040] Furthermore, the copper thickness of the connected board is subjected to copper average difference processing with the preset copper thickness to obtain the copper thickness average difference, including: obtaining the difference in the thickness of the copper layer of the stacked board between the copper thickness of the stacked core board and the second preset copper thickness. In this embodiment, the copper thickness of the connected board is the copper cladding thickness on the high-order high-density interconnection board, that is, the copper thickness of the connected board is the copper layer thickness of the high-order high-density interconnection board, that is, the copper thickness of the connected board is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the copper thickness of the connected board, it is convenient to determine the distribution of the copper layer on the board that currently needs to be opened on the high-order high-density interconnection board, thereby facilitating the determination of the uniformity of the copper layer of the board that currently needs to be opened on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole-opening alignment of the board that currently needs to be opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The copper thickness of the connecting board is the copper thickness of the laminated core board of the high-order high-density interconnection board, and the copper thickness of the laminated core board is the total copper layer thickness on the current laminated core board of the high-order high-density interconnection board, that is, the copper thickness of the laminated core board is the total copper cladding thickness of the current laminated core board that needs to be opened in the high-order high-density interconnection board, and the copper thickness of the laminated core board is used to reflect the distribution of the copper layer corresponding to the laminated core board that needs to be opened, so as to facilitate the determination of the total copper layer thickness of the laminated core board of the high-order high-density interconnection board when opening the hole, so as to facilitate the adjustment of the hole opening process parameters according to the copper thickness. The second preset copper thickness is the standard total copper layer thickness of each laminated core board of the high-order high-density interconnection board, that is, the second preset copper thickness is the specified total copper cladding thickness of each laminated core board that needs to be opened in the high-order high-density interconnection board, and the second preset copper thickness is used to reflect the reference distribution of the copper layer corresponding to each laminated core board that needs to be opened. The difference between the copper thickness of the laminated core board and the second preset copper thickness, i.e., the thickness difference of the laminated copper layer, is used to reflect the degree of difference in the total copper layer thickness on the laminated core board of the high-order high-density interconnect board that currently needs to be opened, so as to facilitate determination of whether the total copper layer thickness of the laminated core board of the high-order high-density interconnect board that currently needs to be opened has reached the specified total copper layer thickness, thereby facilitating subsequent opening operations on laminated core boards with different total copper layer thicknesses, so as to improve the blind hole stacking alignment accuracy of the laminated core board.

[0041] Furthermore, the method of sending a hole alignment signal to the board making monitoring system based on the average copper thickness difference to adjust the opening and hole bottom ratio of the hole includes: detecting whether the thickness difference of the copper layer of the stacked plates matches the preset copper thickness difference of the stacked plates; when the thickness difference of the copper layer of the stacked plates matches the preset copper thickness difference of the stacked plates, sending a stacked plate hole alignment start signal to the board making monitoring system to make the opening and hole bottom ratio of the hole be a second opening-bottom ratio. In this embodiment, the connected copper thickness is the copper coating thickness on the high-order high-density interconnection board, that is, the connected copper thickness is the copper layer thickness of the high-order high-density interconnection board, that is, the connected copper thickness is the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board. By obtaining the connected copper thickness, it is convenient to determine the distribution of the copper layer on the board that currently needs to be hole-opened on the high-order high-density interconnection board, thereby facilitating the determination of the uniformity of the copper layer of the board that currently needs to be hole-opened on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole-opening alignment of the board that currently needs to be hole-opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The copper thickness of the connecting board is the copper thickness of the laminated core board of the high-order high-density interconnection board, and the copper thickness of the laminated core board is the total copper layer thickness on the current laminated core board of the high-order high-density interconnection board, that is, the copper thickness of the laminated core board is the total copper cladding thickness of the current laminated core board that needs to be opened in the high-order high-density interconnection board, and the copper thickness of the laminated core board is used to reflect the distribution of the copper layer corresponding to the laminated core board that needs to be opened, so as to facilitate the determination of the total copper layer thickness of the laminated core board of the high-order high-density interconnection board when opening the hole, so as to facilitate the adjustment of the hole opening process parameters according to the copper thickness. The second preset copper thickness is the standard total copper layer thickness of each laminated core board of the high-order high-density interconnection board, that is, the second preset copper thickness is the specified total copper cladding thickness of each laminated core board that needs to be opened in the high-order high-density interconnection board, and the second preset copper thickness is used to reflect the reference distribution of the copper layer corresponding to each laminated core board that needs to be opened. The difference between the copper thickness of the laminated core board and the second preset copper thickness, i.e., the copper layer thickness difference of the laminated board, is used to reflect the difference degree of the total copper layer thickness on the laminated core board of the high-order high-density interconnection board that currently needs to be opened, so as to facilitate the determination of whether the total copper layer thickness of the laminated core board of the high-order high-density interconnection board that currently needs to be opened has reached the specified total copper layer thickness, thereby facilitating the subsequent opening operation of the laminated core board with different total copper layer thicknesses, so as to improve the alignment accuracy of the blind hole stacking of the laminated core board. The preset laminated copper thickness difference is the difference degree of the standard copper layer total thickness on the laminated core board that needs to be opened of the high-order high-density interconnection board, and the laminated copper layer thickness difference matches the preset laminated copper thickness difference, indicating that the total copper thickness of the laminated core board of the current opening of the high-order high-density interconnection board has reached the specified copper thickness, that is, indicating that the total copper thickness of the current laminated core board of the high-order high-density interconnection board is equivalent to the total copper thickness corresponding to the current opening process, wherein the opening process at this time is used to produce high-order blind hole stacking.At this time, a stacking plate opening alignment start signal is sent to the board making monitoring system to facilitate the specified opening operation on the current stacked core board of the high-order high-density interconnect board, so that the opening and hole bottom ratio of the opening is the second opening and bottom ratio, specifically, the opening and hole bottom ratio is 92% to 95%.

[0042] Furthermore, the detection of whether the difference in the thickness of the copper layer of the stacked board matches the preset difference in the copper thickness of the stacked board also includes: when the difference in the thickness of the copper layer of the stacked board does not match the preset difference in the copper thickness of the stacked board, sending a stacked board hole opening alarm signal to the board making monitoring system. In this embodiment, the continuous board copper thickness is the copper coating thickness on the high-order high-density interconnection board, that is, the continuous board copper thickness is the copper layer thickness of the high-order high-density interconnection board, that is, the continuous board copper thickness is the copper layer thickness of the current hole opening board of the high-order high-density interconnection board. By obtaining the continuous board copper thickness, it is convenient to determine the distribution of the copper layer on the board that currently needs to be opened on the high-order high-density interconnection board, thereby facilitating the determination of the uniformity of the copper layer of the board that currently needs to be opened on the high-order high-density interconnection board, and facilitating the subsequent adjustment of the hole opening alignment of the board that currently needs to be opened on the high-order high-density interconnection board, so as to improve the finished product quality of the high-order high-density interconnection board. The copper thickness of the connecting board is the copper thickness of the laminated core board of the high-order high-density interconnection board, and the copper thickness of the laminated core board is the copper layer thickness on the current laminated core board of the high-order high-density interconnection board, that is, the copper thickness of the laminated core board is the copper cladding thickness of the current laminated core board that needs to be opened in the high-order high-density interconnection board, and the copper thickness of the laminated core board is used to reflect the distribution of the copper layer corresponding to the laminated core board that needs to be opened, so as to facilitate the determination of the copper layer thickness of the laminated core board of the high-order high-density interconnection board when opening the hole, so as to facilitate the adjustment of the hole opening process parameters according to the copper thickness. The second preset copper thickness is the standard copper layer thickness on each laminated core board of the high-order high-density interconnection board, that is, the second preset copper thickness is the specified copper cladding thickness of each laminated core board that needs to be opened in the high-order high-density interconnection board, and the second preset copper thickness is used to reflect the reference distribution of the copper layer corresponding to each laminated core board that needs to be opened. The difference between the copper thickness of the laminated core board and the second preset copper thickness, i.e., the copper layer thickness difference of the laminated board, is used to reflect the difference in copper layer thickness on the laminated core board of the high-order high-density interconnection board that currently needs to be opened, so as to facilitate the determination of whether the copper layer thickness of the laminated core board of the high-order high-density interconnection board that currently needs to be opened reaches the specified copper layer thickness, thereby facilitating the subsequent opening operation of the laminated core boards with different copper layer thicknesses, so as to improve the alignment accuracy of the blind hole stacking between the laminated core boards. The preset laminated copper thickness difference is the difference in standard copper layer thickness on the laminated core board that needs to be opened of the high-order high-density interconnection board. The laminated copper layer thickness difference does not match the preset laminated copper thickness difference, indicating that the copper thickness of the laminated core board of the high-order high-density interconnection board that is currently opened is outside the specified copper thickness, that is, indicating that the copper thickness of the current laminated core board of the high-order high-density interconnection board is not equal to the copper thickness corresponding to the current opening process, wherein the opening process at this time cannot be used to produce high-order blind hole stacking. At this time, the board production monitoring system sends a stacking board opening alarm signal to facilitate stacking board early warning operations on the current stacked core board of the high-order high-density interconnect board, so as to avoid opening holes on unqualified circuit boards and effectively reduce production costs.

[0043] When the actual drilling operation is performed on the high-order high-density interconnection board, the high-order high-density interconnection board is positioned for drilling by laser, so as to find the starting position of the high-order high-density interconnection board during the drilling operation, thereby facilitating the target position calibration of the drilling of the high-order high-density interconnection board, so as to improve the drilling alignment accuracy of the high-order high-density interconnection board.

[0044] However, after the target position is calibrated on the board currently requiring drilling, there will be a placement deviation between the current board and the previous board, which is likely to affect the overall alignment accuracy of the high-order high-density interconnect board.

[0045] In order to improve the drilling positioning accuracy of the high-order high-density interconnection board, the step of obtaining the copper thickness of the high-order high-density interconnection board further includes the following steps:

[0046] Acquire a front panel window image of the high-order high-density interconnection board;

[0047] Acquire the front panel window opening area according to the front panel window opening image;

[0048] Detecting whether the window opening area of ​​the front plate target is greater than or equal to a preset window opening area;

[0049] When the front panel target window area is greater than or equal to the preset window area, a target positioning signal is sent to the panel production monitoring system to obtain the drilling start target coordinates of the high-order high-density interconnection board.

[0050] In this embodiment, the front panel window image is a panel surface image of a previous panel of the high-order high-density interconnection panel that needs to be opened, that is, the front panel window image is a panel window image before the high-order high-density interconnection panel needs to be opened, that is, the front panel window image corresponds to the window opening situation on the front panel of the high-order high-density interconnection panel. By analyzing the image of the front panel window image, it is easy to obtain the window opening situation on the front panel of the high-order high-density interconnection panel, so as to facilitate the determination of the window size on the front panel of the high-order high-density interconnection panel, that is, the front panel window area. Specifically, the window opening corresponding to the preset window opening area is 8×8 mm. The preset window opening area is the standard window opening size on the front plate of the high-order high-density interconnection board, and the front plate target window opening area is greater than or equal to the preset window opening area, indicating that the window opening size on the front plate of the high-order high-density interconnection board has reached the standard window opening size, that is, indicating that the area corresponding to the front plate window opening image is the target area, and a target positioning signal is sent to the board making monitoring system to obtain the drilling starting target coordinates of the high-order high-density interconnection board, so as to facilitate the positioning of the drilling target of the current plate of the high-order high-density interconnection board, thereby facilitating the determination of the starting target position of laser drilling, thereby improving the blind hole alignment accuracy on the high-order high-density interconnection board.

[0051] In another embodiment, when the window opening area of ​​the front plate target is smaller than the preset window opening area, a drilling withdrawal signal is sent to the plate making monitoring system to exit the current drilling process.

[0052] Further, when the target window opening area of ​​the front plate is greater than or equal to the preset window opening area, a target positioning signal is sent to the board making monitoring system to obtain the drilling starting target coordinates of the high-order high-density interconnection board, and then it also includes:

[0053] Acquiring the target window aperture according to the front plate window image;

[0054] Detecting whether the target window aperture matches the preset window aperture;

[0055] When the target window aperture matches the preset window aperture, an inner layer burning signal is sent to the board making monitoring system to perform inner layer hollow copper processing in an area corresponding to the drilling start target coordinates.

[0056] In this embodiment, the target window aperture is the size of the window hole in the target window region of the high-order high-density interconnection board, that is, the target window aperture corresponds to the target window hole of the high-order high-density interconnection board, which is convenient for determining the aperture of the window hole in the target window region of the high-order high-density interconnection board, thereby facilitating the determination of the target starting position of the high-order high-density interconnection board, so as to improve the drilling accuracy of the high-order high-density interconnection board. The preset window aperture corresponds to the preset window area one by one, and the target window aperture matches the preset window aperture. Specifically, the preset window aperture is 2 mm, indicating that the window hole in the target window area of ​​the high-order high-density interconnection board is the same as the standard window hole, that is, the window size in the target window area of ​​the high-order high-density interconnection board is consistent with the window size corresponding to the standard target, and an inner layer burning signal is sent to the board making monitoring system to perform inner layer empty copper processing in the area corresponding to the drilling start target coordinates, so as to facilitate inner layer burning on the previous board that needs to be drilled in the high-order high-density interconnection board, so that the inner layer copper layer in the target area of ​​the previous board that needs to be drilled in the high-order high-density interconnection board is hollowed out, further improving the drilling alignment accuracy, so that the alignment accuracy between the previous board that needs to be drilled in the high-order high-density interconnection board and the current board reaches ±10μm.

[0057] In another embodiment, when the target window aperture does not match the preset window aperture, a non-target signal is sent to the board monitoring system to stop processing the inner layer empty copper in the area corresponding to the drilling start target coordinates, thereby effectively avoiding damage to the high-order high-density interconnect board.

[0058] In order to improve the product quality rate of the high-order high-density interconnection board, the method sends a hole alignment signal to the board manufacturing monitoring system according to the copper thickness average difference to adjust the ratio of the opening to the bottom of the hole, and then further includes:

[0059] Acquire a true point hole image of the high-order high-density interconnection board;

[0060] Acquire the true point depth-to-diameter ratio according to the true point aperture image;

[0061] Detecting whether the true point aspect ratio is greater than or equal to a preset aspect ratio;

[0062] When the true point depth-to-diameter ratio is greater than or equal to the preset depth-to-diameter ratio, a true point hole wall intact signal is sent to the plate making monitoring system.

[0063] In this embodiment, the true point hole photography image is an image of the true point of the window drilling hole on the high-order high-density interconnection board, that is, the true point hole photography image is a light collection image inside the window hole corresponding to the true point on the high-order high-density interconnection board, that is, the true point hole photography image corresponds to the situation inside the hole of the true point on the high-order high-density interconnection board, and the true point hole photography image is used to display the surface structure of each position inside the hole of the true point on the high-order high-density interconnection board. According to the inner surface condition of the hole reflected by the true point hole photo image, the inner wall condition of the true point of the drilling on the high-order high-density interconnection board is analyzed to facilitate the collection of the inner wall surface condition of the true point of the drilling on the high-order high-density interconnection board. The true point depth-to-diameter ratio is obtained based on the true point hole photo image. The true point depth-to-diameter ratio is the ratio between the drilling depth and the drilling diameter of the true point of the drilling on the high-order high-density interconnection board. The true point depth-to-diameter ratio is used to reflect the drilling completeness of the true point of the drilling on the high-order high-density interconnection board. The preset depth-to-diameter ratio is the ratio between the drilling depth and the drilling diameter of the true point of the drilling on the high-order high-density interconnection board. The standard ratio between the diameters, the true point depth-to-diameter ratio is greater than or equal to the preset depth-to-diameter ratio, indicating that the ratio of the depth to the diameter of the current drilling true point on the high-order high-density interconnection board reaches the specified ratio, that is, it indicates that the drilling parameters of the current drilling true point on the high-order high-density interconnection board reach the preset standard, that is, it indicates that the internal hole wall of the current drilling true point on the high-order high-density interconnection board is intact. At this time, a true point hole wall intact signal is sent to the board making monitoring system to facilitate the detection of the hole wall condition of the current drilling true point on the high-order high-density interconnection board, so as to improve the product quality rate of the high-order high-density interconnection board.

[0064] Furthermore, the detecting whether the true point aspect ratio is greater than or equal to a preset aspect ratio further includes:

[0065] When the true point aspect ratio is less than a preset aspect ratio, obtaining a hole illumination tilt angle of the high-order high-density interconnection board;

[0066] Detecting whether the aperture illumination inclination angle is greater than or equal to a preset inclination angle;

[0067] When the aperture illumination inclination angle is greater than or equal to a preset inclination angle, an aperture illumination difference reduction signal is sent to the board production monitoring system to reduce the aperture illumination incident angle to the high-order high-density interconnection board.

[0068] In this embodiment, the true point depth-to-diameter ratio is less than the preset depth-to-diameter ratio, indicating that the ratio of the depth to the diameter of the current drilling true point on the high-order high-density interconnect board does not reach the specified ratio, that is, it indicates that the drilling parameters of the current drilling true point on the high-order high-density interconnect board are lower than the predetermined standard, that is, it indicates that the internal hole wall illumination of the current drilling true point on the high-order high-density interconnect board is incomplete, and there are areas of the hole wall that lack light illumination, which easily leads to defects in the hole wall. In order to reduce the occurrence of such a situation, the aperture illumination tilt angle of the high-order high-density interconnection board is obtained, and the aperture illumination tilt angle is the aperture illumination incident angle of the high-order high-density interconnection board. Specifically, the aperture illumination tilt angle is the angle between the illumination light toward the high-order high-density interconnection board and the normal perpendicular to the surface of the high-order high-density interconnection board. The aperture illumination tilt angle is used to reflect the inclination of the light irradiating the real point hole wall on the high-order high-density interconnection board. The aperture illumination tilt angle is greater than or equal to the preset inclination angle, indicating that the light irradiating the real point hole wall on the high-order high-density interconnection board is tilted too much, that is, it indicates that the real point on the high-order high-density interconnection board is tilted too much. The corresponding illumination light in the hole does not illuminate the bottom of the hole. At this time, there is a part of the hole wall corresponding to the true point on the high-order high-density interconnection board that is not illuminated. A hole illumination difference reduction signal is sent to the board making monitoring system to reduce the hole illumination incident angle of the high-order high-density interconnection board. For example, the hole illumination inclination angle is gradually reduced in an arithmetic difference manner so that all the hole walls corresponding to the true point on the high-order high-density interconnection board are illuminated, so that the hole walls corresponding to the true point on the high-order high-density interconnection board are illuminated in all directions without dead angles, so that the hole walls corresponding to the true point on the high-order high-density interconnection board can be illuminated in all directions without dead angles, so as to facilitate the hole wall defects corresponding to the true point on the high-order high-density interconnection board to be displayed in all directions without dead angles through images.

[0069] In another embodiment, when the hole imaging inclination angle is less than a preset inclination angle, a true point full imaging signal is sent to the board making monitoring system to determine that the hole wall corresponding to the true point on the high-order high-density interconnect board is displayed as a complete image, which is regarded as a drilled hole without defects in the hole wall required on the high-order high-density interconnect board, that is, a qualified drilled hole.

[0070] In one of the embodiments, the present application also provides a high-order high-density interconnection board, which is prepared by the high-order high-density interconnection board preparation method described in any of the above embodiments. In this embodiment, the high-order high-density interconnection board preparation method includes obtaining the copper thickness of the connected board of the high-order high-density interconnection board; performing copper average differential processing on the copper thickness of the connected board and the preset copper thickness to obtain the average difference of the copper thickness; and sending a hole alignment signal to the board making monitoring system according to the average difference of the copper thickness to adjust the opening and bottom ratio of the hole. By obtaining the copper thickness of the connected board, it is convenient to collect the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board, and then the difference between the copper thickness of the connected board and the preset copper thickness is compared to obtain the difference between the copper layer thickness of the current hole-opening board and the standard copper layer thickness. Finally, according to the above copper thickness difference, the opening and bottom ratio of the hole of the high-order high-density interconnection board is adjusted, so that the opening and bottom ratio of the hole is within the optimal ratio range, which effectively improves the hole quality, thereby improving the probability of good products of the high-order high-density interconnection board.

[0071] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a high-order high-density interconnection board, characterized in that: include: Get the copper thickness of the high-density interconnect board; Perform copper average difference processing on the copper thickness of the connected plate and the preset copper thickness to obtain the copper thickness average difference; Sending a hole alignment signal to a board-making monitoring system according to the copper thickness average difference to adjust the ratio of the opening to the hole bottom of the hole; Wherein, obtaining the copper thickness of the high-order high-density interconnection board includes: Obtaining the single-layer core board copper thickness of the high-order high-density interconnect board; The step of performing copper average difference processing on the copper thickness of the connected plate and the preset copper thickness to obtain the copper thickness average difference comprises: Obtaining a difference in single-board copper layer thickness between the single-layer core board copper thickness and a first preset copper thickness; The method of sending a hole alignment signal to a board making monitoring system according to the copper thickness average difference to adjust the ratio of the opening to the hole bottom of the hole comprises: Detecting whether the single board copper layer thickness difference matches a preset single board copper layer thickness difference; When the single board copper layer thickness difference matches the preset single board copper thickness difference, a single board opening alignment start signal is sent to the board making monitoring system so that the opening and bottom ratio of the opening is a first opening-to-bottom ratio.

2. The method for preparing a high-order high-density interconnection board according to claim 1, characterized in that: The step of detecting whether the single board copper layer thickness difference matches the preset single board copper layer thickness difference further includes: When the single board copper layer thickness difference does not match the preset single board copper thickness difference, a single board hole opening alarm signal is sent to the board production monitoring system.

3. A method for preparing a high-order high-density interconnection board, characterized in that: include: Get the copper thickness of the high-density interconnect board; Perform copper average difference processing on the copper thickness of the connected plate and the preset copper thickness to obtain the copper thickness average difference; Sending a hole alignment signal to a board-making monitoring system according to the copper thickness average difference to adjust the ratio of the opening to the hole bottom of the hole; Wherein, obtaining the copper thickness of the high-order high-density interconnection board includes: Obtaining the copper thickness of the laminated core board of the high-order high-density interconnect board; performing copper average difference processing on the copper thickness of the connected board and the preset copper thickness to obtain the copper thickness average difference, including: Obtaining a difference in the thickness of the laminated copper layer between the laminated core copper thickness and a second preset copper thickness; sending a hole alignment signal to a board manufacturing monitoring system according to the average difference in copper thickness to adjust the ratio of the opening to the bottom of the hole, including: Detecting whether the copper thickness difference of the laminated plates matches a preset copper thickness difference of the laminated plates; When the thickness difference of the copper layer of the stacked plates matches the preset copper thickness difference of the stacked plates, a stacked plate opening alignment start signal is sent to the plate making monitoring system so that the opening and bottom ratio of the opening is a second opening-to-bottom ratio.

4. The method for preparing a high-order high-density interconnection board according to claim 3, characterized in that: The step of detecting whether the copper thickness difference of the laminated plate matches the preset copper thickness difference of the laminated plate further comprises: When the thickness difference of the copper layer of the laminated plates does not match the preset copper thickness difference of the laminated plates, a laminated plate opening alarm signal is sent to the plate making monitoring system.

5. A high-order high-density interconnection board, characterized in that: The high-order high-density interconnection board is prepared by the method for preparing the high-order high-density interconnection board as described in any one of claims 1 to 4.

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